ATE287127T1 - STRUCTURE FOR INCREASE MAXIMUM VOLTAGE OF SILICON CARBIDE POWER TRANSISTORS - Google Patents

STRUCTURE FOR INCREASE MAXIMUM VOLTAGE OF SILICON CARBIDE POWER TRANSISTORS

Info

Publication number
ATE287127T1
ATE287127T1 AT98904992T AT98904992T ATE287127T1 AT E287127 T1 ATE287127 T1 AT E287127T1 AT 98904992 T AT98904992 T AT 98904992T AT 98904992 T AT98904992 T AT 98904992T AT E287127 T1 ATE287127 T1 AT E287127T1
Authority
AT
Austria
Prior art keywords
silicon carbide
maximum voltage
transistor
power transistors
insulated gate
Prior art date
Application number
AT98904992T
Other languages
German (de)
Inventor
James Albert Cooper Jr
Jian Tan
Original Assignee
James Albert Cooper Jr
Jian Tan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/795,135 external-priority patent/US6570185B1/en
Priority claimed from US08/797,535 external-priority patent/US6180958B1/en
Application filed by James Albert Cooper Jr, Jian Tan filed Critical James Albert Cooper Jr
Application granted granted Critical
Publication of ATE287127T1 publication Critical patent/ATE287127T1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
    • H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
    • H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
    • H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
    • H01L29/0623—Buried supplementary region, e.g. buried guard ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
    • H01L29/1608—Silicon carbide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
    • H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
    • H01L29/7395—Vertical transistors, e.g. vertical IGBT
    • H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
    • H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT

Landscapes

  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Formation Of Insulating Films (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)

Abstract

A silicon carbide insulated gate power transistor is disclosed that demonstrates increased maximum voltage. The transistor comprises a field effect or insulated gate transistor with a protective region (23, 43) adjacent the insulated gate that has the opposite conductivity type from the source (14, 34) for protecting the gate insulator material (17, 37) from the degrading or breakdown effect of a large voltage applied across the device. The device optionally includes a current-enhancing layer (67, 83) having the opposite conductivity type from the protective region and positioned between the protective region and another first conductivity-type region of the transistor.
AT98904992T 1997-02-07 1998-02-06 STRUCTURE FOR INCREASE MAXIMUM VOLTAGE OF SILICON CARBIDE POWER TRANSISTORS ATE287127T1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/795,135 US6570185B1 (en) 1997-02-07 1997-02-07 Structure to reduce the on-resistance of power transistors
US08/797,535 US6180958B1 (en) 1997-02-07 1997-02-07 Structure for increasing the maximum voltage of silicon carbide power transistors
PCT/US1998/002384 WO1998035390A1 (en) 1997-02-07 1998-02-06 Structure for increasing the maximum voltage of silicon carbide power transistors

Publications (1)

Publication Number Publication Date
ATE287127T1 true ATE287127T1 (en) 2005-01-15

Family

ID=27121597

Family Applications (1)

Application Number Title Priority Date Filing Date
AT98904992T ATE287127T1 (en) 1997-02-07 1998-02-06 STRUCTURE FOR INCREASE MAXIMUM VOLTAGE OF SILICON CARBIDE POWER TRANSISTORS

Country Status (7)

Country Link
EP (1) EP0966763B1 (en)
JP (1) JP5054255B2 (en)
AT (1) ATE287127T1 (en)
AU (1) AU6272798A (en)
DE (1) DE69828588T2 (en)
ES (1) ES2236887T3 (en)
WO (1) WO1998035390A1 (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3716490B2 (en) 1996-04-05 2005-11-16 トヨタ自動車株式会社 Braking force control device
DE69836319T2 (en) 1997-03-06 2007-06-21 Toyota Jidosha Kabushiki Kaisha, Toyota BRAKE UNIT
US6313482B1 (en) * 1999-05-17 2001-11-06 North Carolina State University Silicon carbide power devices having trench-based silicon carbide charge coupling regions therein
US6392273B1 (en) * 2000-01-14 2002-05-21 Rockwell Science Center, Llc Trench insulated-gate bipolar transistor with improved safe-operating-area
JP4738562B2 (en) * 2000-03-15 2011-08-03 三菱電機株式会社 Manufacturing method of semiconductor device
JP4865166B2 (en) * 2001-08-30 2012-02-01 新電元工業株式会社 Transistor manufacturing method, diode manufacturing method
SE525574C2 (en) * 2002-08-30 2005-03-15 Okmetic Oyj Low-doped silicon carbide substrate and its use in high-voltage components
JP4564362B2 (en) * 2004-01-23 2010-10-20 株式会社東芝 Semiconductor device
GB0417749D0 (en) * 2004-08-10 2004-09-08 Eco Semiconductors Ltd Improved bipolar MOSFET devices and methods for their use
JP4802542B2 (en) * 2005-04-19 2011-10-26 株式会社デンソー Silicon carbide semiconductor device
JP2008016747A (en) * 2006-07-10 2008-01-24 Fuji Electric Holdings Co Ltd Trench-mos silicon carbide semiconductor device and method for manufacturing the same
JP5444608B2 (en) * 2007-11-07 2014-03-19 富士電機株式会社 Semiconductor device
JP4640436B2 (en) * 2008-04-14 2011-03-02 株式会社デンソー Method for manufacturing silicon carbide semiconductor device
US9224860B2 (en) * 2010-12-10 2015-12-29 Mitsubishi Electric Corporation Trench-gate type semiconductor device and manufacturing method therefor
JP6197995B2 (en) 2013-08-23 2017-09-20 富士電機株式会社 Wide band gap insulated gate semiconductor device
DE112015004374B4 (en) 2014-09-26 2019-02-14 Mitsubishi Electric Corporation SEMICONDUCTOR DEVICE
CN107251198B (en) * 2015-01-27 2020-08-14 Abb电网瑞士股份公司 Insulated gate power semiconductor device and method for manufacturing such a device
CN107683530B (en) 2015-06-09 2020-08-18 三菱电机株式会社 Power semiconductor device
US10468487B2 (en) 2015-10-16 2019-11-05 Mitsubishi Electric Corporation Semiconductor device
CN108604598B (en) 2016-02-09 2021-04-09 三菱电机株式会社 Semiconductor device with a plurality of semiconductor chips
US9728599B1 (en) 2016-05-10 2017-08-08 Fuji Electric Co., Ltd. Semiconductor device
JP6855793B2 (en) 2016-12-28 2021-04-07 富士電機株式会社 Semiconductor device
JP7067021B2 (en) 2017-11-07 2022-05-16 富士電機株式会社 Insulated gate type semiconductor device and its manufacturing method
GB2572442A (en) * 2018-03-29 2019-10-02 Cambridge Entpr Ltd Power semiconductor device with a double gate structure

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4941026A (en) * 1986-12-05 1990-07-10 General Electric Company Semiconductor devices exhibiting minimum on-resistance
JPH0783118B2 (en) * 1988-06-08 1995-09-06 三菱電機株式会社 Semiconductor device and manufacturing method thereof
US5168331A (en) * 1991-01-31 1992-12-01 Siliconix Incorporated Power metal-oxide-semiconductor field effect transistor
JP2682272B2 (en) * 1991-06-27 1997-11-26 三菱電機株式会社 Insulated gate transistor
US5233215A (en) * 1992-06-08 1993-08-03 North Carolina State University At Raleigh Silicon carbide power MOSFET with floating field ring and floating field plate
JP2883501B2 (en) * 1992-09-09 1999-04-19 三菱電機株式会社 Trench insulated gate bipolar transistor and method of manufacturing the same
US5506421A (en) * 1992-11-24 1996-04-09 Cree Research, Inc. Power MOSFET in silicon carbide
US5488236A (en) * 1994-05-26 1996-01-30 North Carolina State University Latch-up resistant bipolar transistor with trench IGFET and buried collector
US5688725A (en) * 1994-12-30 1997-11-18 Siliconix Incorporated Method of making a trench mosfet with heavily doped delta layer to provide low on-resistance

Also Published As

Publication number Publication date
DE69828588D1 (en) 2005-02-17
JP2001511315A (en) 2001-08-07
WO1998035390A1 (en) 1998-08-13
ES2236887T3 (en) 2005-07-16
EP0966763A1 (en) 1999-12-29
EP0966763B1 (en) 2005-01-12
AU6272798A (en) 1998-08-26
DE69828588T2 (en) 2006-02-09
JP5054255B2 (en) 2012-10-24

Similar Documents

Publication Publication Date Title
ATE287127T1 (en) STRUCTURE FOR INCREASE MAXIMUM VOLTAGE OF SILICON CARBIDE POWER TRANSISTORS
ATE225568T1 (en) POWER MOSFET MADE OF SILICON CARBIDE
CA2336933A1 (en) Silicon carbide horizontal channel buffered gate semiconductor devices
DE69329242T2 (en) SILICON CARBIDE POWER MOSFET WITH FLOATING FIELD RING AND FLOATING FIELD PLATE.
SE9704149D0 (en) A semiconductor device of SiC and a transistor of SiC having an insulated gate
TW344141B (en) An insulated gate field effect transistor having a crystalline channel region
EP0671769A3 (en) Insulated gate field effect transistor
KR860002153A (en) Semiconductor devices
ATE501526T1 (en) BIPOLAR TRANSISTOR
KR880700466A (en) Static protection integrated circuit
TW373315B (en) Efficient npn turn-on in a high voltage DENMOS transistor of ESD protection
EP0893830A4 (en)
SE9900358D0 (en) A lateral field effect transistor of SiC, a method of production thereof and a use of such a transistor
KR960002880A (en) Silicon on Insulator (SOI) Transistors
DE69841384D1 (en) Power semiconductor device with semi-insulating substrate
ES2076468T3 (en) SEMICONDUCTOR DEVICE THAT HAS AN IMPROVED TRANSISTOR WITH ISOLATED DOOR.
ATE371955T1 (en) IGBT WITH PN ISOLATION
TW366597B (en) Semiconductor device
DE60044776D1 (en) LATERAL SiC-BASED FIELD EFFECT TRANSITOR, THE METHOD OF MANUFACTURING THE SAME AND THE USE OF SUCH A TRANSISTOR
RU94037403A (en) Field-effect mis transistor
KR970008561A (en) Transistor of input protection circuit of semiconductor device
SE9904710L (en) semiconductor device
ES2033241T5 (en) FIELD EFFECT TRANSISTORS.
UA9823A (en) Distortion factor metal-insulator-semiconductor field-effect transistor
SU1828339A1 (en) Field-effect transistor with controlling p-n junction

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties