ATA9832001A - POSITIONING DEVICE - Google Patents

POSITIONING DEVICE

Info

Publication number
ATA9832001A
ATA9832001A AT9832001A AT9832001A ATA9832001A AT A9832001 A ATA9832001 A AT A9832001A AT 9832001 A AT9832001 A AT 9832001A AT 9832001 A AT9832001 A AT 9832001A AT A9832001 A ATA9832001 A AT A9832001A
Authority
AT
Austria
Prior art keywords
positioning device
positioning
Prior art date
Application number
AT9832001A
Other languages
German (de)
Other versions
AT411855B (en
Inventor
Andreas Dipl Ing Mayr
Original Assignee
Datacon Semiconductor Equip
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Datacon Semiconductor Equip filed Critical Datacon Semiconductor Equip
Priority to AT9832001A priority Critical patent/AT411855B/en
Priority to PCT/AT2002/000183 priority patent/WO2003001572A2/en
Publication of ATA9832001A publication Critical patent/ATA9832001A/en
Application granted granted Critical
Publication of AT411855B publication Critical patent/AT411855B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Jigs For Machine Tools (AREA)
AT9832001A 2001-06-26 2001-06-26 POSITIONING DEVICE AT411855B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AT9832001A AT411855B (en) 2001-06-26 2001-06-26 POSITIONING DEVICE
PCT/AT2002/000183 WO2003001572A2 (en) 2001-06-26 2002-06-25 Positioning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT9832001A AT411855B (en) 2001-06-26 2001-06-26 POSITIONING DEVICE

Publications (2)

Publication Number Publication Date
ATA9832001A true ATA9832001A (en) 2003-11-15
AT411855B AT411855B (en) 2004-06-25

Family

ID=3683811

Family Applications (1)

Application Number Title Priority Date Filing Date
AT9832001A AT411855B (en) 2001-06-26 2001-06-26 POSITIONING DEVICE

Country Status (2)

Country Link
AT (1) AT411855B (en)
WO (1) WO2003001572A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006514444A (en) * 2003-09-05 2006-04-27 シーメンス　アクチエンゲゼルシヤフト Gripper unit for mounting electrical components on the board
DE10345538A1 (en) * 2003-09-30 2005-05-12 Siemens Ag Placement head with a gripper unit for equipping substrates with electrical components
FR2905883B1 (en) * 2006-09-14 2008-12-05 Valeo Electronique Sys Liaison METHOD FOR WELDING AN ORGAN ON A SUPPORT BY DELIVERING MATERIAL AND DEVICE FOR ARRANGING TWO ELEMENTS ON ONE ANOTHER
CN111987055B (en) * 2020-07-16 2022-06-07 大同新成新材料股份有限公司 Semiconductor refrigeration graphene chip

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3697837A (en) * 1970-10-05 1972-10-10 Gen Electric Electromagnetic force system for integrated circuit fabrication
JPS5898937A (en) * 1981-12-09 1983-06-13 Fujitsu Ltd Wire bonding device
JP2590252B2 (en) * 1989-02-22 1997-03-12 株式会社東芝 Die bonding equipment
JP3369877B2 (en) * 1996-10-31 2003-01-20 三洋電機株式会社 Bonding unit

Also Published As

Publication number Publication date
WO2003001572A3 (en) 2003-09-12
AT411855B (en) 2004-06-25
WO2003001572A2 (en) 2003-01-03

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee