ATA7702001A - Einrichtung zum benetzen einer oberfläche - Google Patents

Einrichtung zum benetzen einer oberfläche

Info

Publication number
ATA7702001A
ATA7702001A AT0077001A AT7702001A ATA7702001A AT A7702001 A ATA7702001 A AT A7702001A AT 0077001 A AT0077001 A AT 0077001A AT 7702001 A AT7702001 A AT 7702001A AT A7702001 A ATA7702001 A AT A7702001A
Authority
AT
Austria
Prior art keywords
weting
Prior art date
Application number
AT0077001A
Other languages
English (en)
Other versions
AT412761B (de
Inventor
Gerhard Dipl Ing Hillmann
Original Assignee
Datacon Semiconductor Equip
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Datacon Semiconductor Equip filed Critical Datacon Semiconductor Equip
Priority to AT0077001A priority Critical patent/AT412761B/de
Priority to PCT/AT2002/000146 priority patent/WO2002093620A2/de
Publication of ATA7702001A publication Critical patent/ATA7702001A/de
Application granted granted Critical
Publication of AT412761B publication Critical patent/AT412761B/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Jigging Conveyors (AREA)
  • Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)
AT0077001A 2001-05-15 2001-05-15 Einrichtung zum benetzen einer oberfläche AT412761B (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AT0077001A AT412761B (de) 2001-05-15 2001-05-15 Einrichtung zum benetzen einer oberfläche
PCT/AT2002/000146 WO2002093620A2 (de) 2001-05-15 2002-05-15 Einrichtung zum benetzen einer oberfläche

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT0077001A AT412761B (de) 2001-05-15 2001-05-15 Einrichtung zum benetzen einer oberfläche

Publications (2)

Publication Number Publication Date
ATA7702001A true ATA7702001A (de) 2004-12-15
AT412761B AT412761B (de) 2005-07-25

Family

ID=3680673

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0077001A AT412761B (de) 2001-05-15 2001-05-15 Einrichtung zum benetzen einer oberfläche

Country Status (2)

Country Link
AT (1) AT412761B (de)
WO (1) WO2002093620A2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005012396B3 (de) * 2005-03-17 2006-06-14 Datacon Technology Ag Verfahren zum Montieren eines Chips, insbesondere Flipchips, auf einem Substrat

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4346124A (en) * 1981-05-04 1982-08-24 Laurier Associates, Inc. Method of applying an adhesive to a circuit chip
DE19908625A1 (de) * 1999-02-27 2000-08-31 Hubert Knor Vorrichtung und Verfahren zum Aufbringen von Klebermaterial auf flächige Bauteile sowie dessen Verwendung
JP2001102398A (ja) * 1999-09-27 2001-04-13 Matsushita Electric Works Ltd 半導体圧力センサのダイボンド方法

Also Published As

Publication number Publication date
WO2002093620A2 (de) 2002-11-21
AT412761B (de) 2005-07-25
WO2002093620A3 (de) 2002-12-27

Similar Documents

Publication Publication Date Title
DE60239188D1 (de) System zum einsetzen einer schlinge
ATE398957T1 (de) Vorrichtung zum erhitzen einer flüssigkeit
DE60330748D1 (de) System zum behandeln einer vorhofarrythmie
DE60017962D1 (de) Klemmvorrichtung zum Festklemmen einer Leitung
DE602004026955D1 (de) Vorrichtung zum Ändern einer gelernten Position
DE60126120D1 (de) Positionierungsvorrichtung zum einsetzen von implantatgetragene zahnprothesen
DE60036654D1 (de) Gerät zum Aufsetzen einer Prothese
DE60123163D1 (de) Auftragen einer klaren Deckflüssigkeit
DE60223775D1 (de) Vorrichtung zum Konvertieren einer elliptischen Kurve
DE10149794B4 (de) Vorrichtung zum Erfassen einer Bewegung
DE50115496D1 (de) Vorrichtung zum betätigen einer kupplung
DE50113453D1 (de) Handwerkzeugmaschine mit einer schwenkbaren werkzeugabdeckung
DE60132524D1 (de) Gerät zum Wiederherstellen einer Sehne
ATA160899A (de) Vorrichtung zum nadeln einer gemusterten filzbahn
DE50208452D1 (de) Vorrichtung zum Heben einer Last
DE50212009D1 (de) Vorrichtung zum Erhitzen einer Flüssigkeit
DE60327977D1 (de) Vorrichtung zum Auftragen einer Flüssigkeit
DE50012165D1 (de) Vorrichtung zum steuern einer einrichtung
DE50308331D1 (de) Vorrichtung zum Öffnen einer schlauchförmigen Warenbahn
DE50203346D1 (de) Vorrichtung zum beschichten einer laufenden materialbahn
ATA6482003A (de) Vorrichtung zum trocknen einer papierbahn
DE50001925D1 (de) Vorrichtung zum Glätten einer Betonbelagoberfläche
ATE368603T1 (de) Einrichtung zum umstellen von weichen
DE50114217D1 (de) Vorrichtung zum betrieb einer linearen lambdasonde
DE50209340D1 (de) Vorrichtung zum Erhöhen einer Wählkraft

Legal Events

Date Code Title Description
MM01 Lapse because of not paying annual fees

Effective date: 20131215