ATA19132002A - Einrichtung zum positionieren - Google Patents

Einrichtung zum positionieren

Info

Publication number
ATA19132002A
ATA19132002A AT19132002A AT19132002A ATA19132002A AT A19132002 A ATA19132002 A AT A19132002A AT 19132002 A AT19132002 A AT 19132002A AT 19132002 A AT19132002 A AT 19132002A AT A19132002 A ATA19132002 A AT A19132002A
Authority
AT
Austria
Prior art keywords
positioning
Prior art date
Application number
AT19132002A
Other languages
English (en)
Other versions
AT414079B (de
Original Assignee
Datacon Semiconductor Equip
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Datacon Semiconductor Equip filed Critical Datacon Semiconductor Equip
Priority to AT19132002A priority Critical patent/AT414079B/de
Publication of ATA19132002A publication Critical patent/ATA19132002A/de
Application granted granted Critical
Publication of AT414079B publication Critical patent/AT414079B/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
AT19132002A 2002-12-20 2002-12-20 Einrichtung zum positionieren AT414079B (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT19132002A AT414079B (de) 2002-12-20 2002-12-20 Einrichtung zum positionieren

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT19132002A AT414079B (de) 2002-12-20 2002-12-20 Einrichtung zum positionieren

Publications (2)

Publication Number Publication Date
ATA19132002A true ATA19132002A (de) 2005-11-15
AT414079B AT414079B (de) 2006-08-15

Family

ID=35406016

Family Applications (1)

Application Number Title Priority Date Filing Date
AT19132002A AT414079B (de) 2002-12-20 2002-12-20 Einrichtung zum positionieren

Country Status (1)

Country Link
AT (1) AT414079B (de)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2590252B2 (ja) * 1989-02-22 1997-03-12 株式会社東芝 ダイボンデイング装置
JP2754884B2 (ja) * 1990-08-10 1998-05-20 松下電器産業株式会社 ボンディング装置およびボンディング方法
JP3635650B2 (ja) * 1994-09-21 2005-04-06 ソニー株式会社 電子部品用実装機における熱圧着ツール交換構造
JP3369877B2 (ja) * 1996-10-31 2003-01-20 三洋電機株式会社 ボンディングユニット
JPH10340931A (ja) * 1997-06-05 1998-12-22 Toray Eng Co Ltd チップボンディングツール
JP3400299B2 (ja) * 1997-06-26 2003-04-28 株式会社新川 ボンディング装置用ツール保持構造
JP3483443B2 (ja) * 1997-11-20 2004-01-06 株式会社日立ハイテクインスツルメンツ エアシリンダおよびこれを備えたボンディングヘッドユニット
JP3475776B2 (ja) * 1998-04-07 2003-12-08 三菱電機株式会社 フリップチップボンディング装置及びフリップチップボンディング方法
JP3916366B2 (ja) * 1999-03-16 2007-05-16 東レエンジニアリング株式会社 チップ熱圧着ツール及びそれを備えたチップ実装装置
JP4577941B2 (ja) * 1999-04-05 2010-11-10 東レエンジニアリング株式会社 チップ実装方法及びその装置

Also Published As

Publication number Publication date
AT414079B (de) 2006-08-15

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Legal Events

Date Code Title Description
PC Change of the owner

Owner name: BESI SWITZERLAND AG, CH

Effective date: 20140430

MM01 Lapse because of not paying annual fees

Effective date: 20141115