ATA128097A - Verfahren zur metallisierung durch sputtern von bauelementekörpern elektro-keramischer bauelemente - Google Patents

Verfahren zur metallisierung durch sputtern von bauelementekörpern elektro-keramischer bauelemente

Info

Publication number
ATA128097A
ATA128097A AT128097A AT128097A ATA128097A AT A128097 A ATA128097 A AT A128097A AT 128097 A AT128097 A AT 128097A AT 128097 A AT128097 A AT 128097A AT A128097 A ATA128097 A AT A128097A
Authority
AT
Austria
Prior art keywords
metalizing
electro
ceramic components
component bodies
sputtering component
Prior art date
Application number
AT128097A
Other languages
English (en)
Original Assignee
Siemens Matsushita Components
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Matsushita Components filed Critical Siemens Matsushita Components
Publication of ATA128097A publication Critical patent/ATA128097A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/288—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thin film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/042—Printed circuit coils by thin film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/006—Apparatus or processes for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0086—Printed inductances on semiconductor substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
AT128097A 1996-08-26 1997-07-28 Verfahren zur metallisierung durch sputtern von bauelementekörpern elektro-keramischer bauelemente ATA128097A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1996134495 DE19634495C2 (de) 1996-08-26 1996-08-26 Verfahren zur Metallisierung von Bauelementekörpern elektrokeramischer Bauelemente

Publications (1)

Publication Number Publication Date
ATA128097A true ATA128097A (de) 2003-04-15

Family

ID=7803745

Family Applications (1)

Application Number Title Priority Date Filing Date
AT128097A ATA128097A (de) 1996-08-26 1997-07-28 Verfahren zur metallisierung durch sputtern von bauelementekörpern elektro-keramischer bauelemente

Country Status (2)

Country Link
AT (1) ATA128097A (de)
DE (1) DE19634495C2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6541302B2 (en) * 2001-01-11 2003-04-01 Vishay Sprague, Inc. Method of forming termination on chip components
DE102005040685A1 (de) * 2005-08-26 2007-03-01 Epcos Ag Elektrisches Bauelement und Verfahren zur Herstellung von elektrischen Bauelementen
CN112071542B (zh) * 2020-08-20 2022-03-29 苏州达晶半导体有限公司 一种pptc表面电极制作方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4604676A (en) * 1984-10-02 1986-08-05 Murata Manufacturing Co., Ltd. Ceramic capacitor
US4741077A (en) * 1987-05-15 1988-05-03 Sfe Technologies End terminations for capacitors

Also Published As

Publication number Publication date
DE19634495C2 (de) 2003-04-03
DE19634495A1 (de) 1998-03-12

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Legal Events

Date Code Title Description
A1J Withdrawal paragraph 166 lit. 6