AT522524A3 - Replikationsvorrichtung und Verfahren zum Abbilden einer Struktur auf einem Substrat - Google Patents

Replikationsvorrichtung und Verfahren zum Abbilden einer Struktur auf einem Substrat Download PDF

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Publication number
AT522524A3
AT522524A3 ATA50366/2020A AT503662020A AT522524A3 AT 522524 A3 AT522524 A3 AT 522524A3 AT 503662020 A AT503662020 A AT 503662020A AT 522524 A3 AT522524 A3 AT 522524A3
Authority
AT
Austria
Prior art keywords
assemblies
substrate
imaging
replication device
chuck
Prior art date
Application number
ATA50366/2020A
Other languages
English (en)
Other versions
AT522524B1 (de
AT522524A2 (de
Original Assignee
Suss Microtec Lithography Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suss Microtec Lithography Gmbh filed Critical Suss Microtec Lithography Gmbh
Publication of AT522524A2 publication Critical patent/AT522524A2/de
Publication of AT522524A3 publication Critical patent/AT522524A3/de
Application granted granted Critical
Publication of AT522524B1 publication Critical patent/AT522524B1/de

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2012—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image using liquid photohardening compositions, e.g. for the production of reliefs such as flexographic plates or stamps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

Eine Replikationsvorrichtung (10) zur Herstellung von nano- und/oder mikrostrukturierten Bauteilen hat zwei zueinander bewegbaren Baugruppen (12, 14), wobei eine erste Baugruppe (12) einen Chuck (18) zur Aufnahme eines Substrats (16) und eine zweite Baugruppe (14) eine Aufnahme (20) für eine Prägestruktur (22) aufweist, wobei die Baugruppen (12, 14) relativ zueinander zwischen einer Prägeposition und einer Beladeposition bewegbar sind, und wobei an einer der beiden Baugruppen (12, 14) mindestens eine Dichtlippe (34, 38) angeordnet ist, die der anderen der beiden Baugruppen (12, 14) zugewandt ist und die die andere der beiden Baugruppen (12, 14) in der Prägeposition berührt und den Chuck (18) und/oder die Aufnahme (20) radial umgibt, wobei durch die Dichtlippe (34, 38) in der Prägeposition eine abgedichtete Überdruckkammer (36) zwischen den beiden Baugruppen (12, 14) begrenzt ist. Des Weiteren wird ein Verfahren zum Abbilden einer Struktur auf einem Substrat (16) angegeben.
ATA50366/2020A 2019-04-29 2020-04-29 Replikationsvorrichtung und Verfahren zum Abbilden einer Struktur auf einem Substrat AT522524B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2023022A NL2023022B1 (en) 2019-04-29 2019-04-29 Replication device and method for reproducing a structure on a substrate

Publications (3)

Publication Number Publication Date
AT522524A2 AT522524A2 (de) 2020-11-15
AT522524A3 true AT522524A3 (de) 2021-05-15
AT522524B1 AT522524B1 (de) 2022-04-15

Family

ID=67660427

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA50366/2020A AT522524B1 (de) 2019-04-29 2020-04-29 Replikationsvorrichtung und Verfahren zum Abbilden einer Struktur auf einem Substrat

Country Status (9)

Country Link
US (1) US20200341372A1 (de)
JP (1) JP2020184628A (de)
KR (1) KR20200126931A (de)
CN (1) CN111856875A (de)
AT (1) AT522524B1 (de)
DE (1) DE102020111711A1 (de)
NL (1) NL2023022B1 (de)
SG (1) SG10202003961YA (de)
TW (1) TW202046023A (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117761967A (zh) * 2024-01-23 2024-03-26 璞璘科技(杭州)有限公司 一种纳米压印平压设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050145119A1 (en) * 2000-07-18 2005-07-07 Hua Tan Apparatus for fluid pressure imprint lithography
KR20080046476A (ko) * 2006-11-22 2008-05-27 주식회사 에이디피엔지니어링 미세패턴 형성장치 및 이를 이용한 미세패턴 형성방법
US20080213418A1 (en) * 2000-07-18 2008-09-04 Hua Tan Align-transfer-imprint system for imprint lithogrphy
KR20100022820A (ko) * 2008-08-20 2010-03-03 주식회사 에이디피엔지니어링 밀폐 챔버용 실링장치 및 이를 구비한 밀폐 챔버 조립체와 임프린트용 챔버 조립체, 그리고 이를 이용한 임프린트 방법
WO2015070054A1 (en) * 2013-11-08 2015-05-14 Canon Nanotechnologies, Inc. Low contact imprint lithography template chuck system for improved overlay correction

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006245072A (ja) * 2005-02-28 2006-09-14 Canon Inc パターン転写用モールドおよび転写装置
KR101371093B1 (ko) * 2006-11-03 2014-03-10 엘아이지에이디피 주식회사 미세패턴 형성장치 및 이를 이용한 미세패턴 형성방법
JP4578517B2 (ja) * 2007-12-26 2010-11-10 Ｓｃｉｖａｘ株式会社 インプリント装置およびインプリント方法
DE102010007970A1 (de) * 2010-02-15 2011-08-18 Suss MicroTec Lithography GmbH, 85748 Verfahren und Vorrichtung zum aktiven Keilfehlerausgleich zwischen zwei im wesentlichen zueinander parallel positionierbaren Gegenständen
WO2014145360A1 (en) * 2013-03-15 2014-09-18 Nanonex Corporation Imprint lithography system and method for manufacturing
NL2017773B1 (en) * 2016-11-11 2018-05-24 Suss Microtec Lithography Gmbh Positioning device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050145119A1 (en) * 2000-07-18 2005-07-07 Hua Tan Apparatus for fluid pressure imprint lithography
US20080213418A1 (en) * 2000-07-18 2008-09-04 Hua Tan Align-transfer-imprint system for imprint lithogrphy
KR20080046476A (ko) * 2006-11-22 2008-05-27 주식회사 에이디피엔지니어링 미세패턴 형성장치 및 이를 이용한 미세패턴 형성방법
KR20100022820A (ko) * 2008-08-20 2010-03-03 주식회사 에이디피엔지니어링 밀폐 챔버용 실링장치 및 이를 구비한 밀폐 챔버 조립체와 임프린트용 챔버 조립체, 그리고 이를 이용한 임프린트 방법
WO2015070054A1 (en) * 2013-11-08 2015-05-14 Canon Nanotechnologies, Inc. Low contact imprint lithography template chuck system for improved overlay correction

Also Published As

Publication number Publication date
TW202046023A (zh) 2020-12-16
SG10202003961YA (en) 2020-11-27
KR20200126931A (ko) 2020-11-09
JP2020184628A (ja) 2020-11-12
DE102020111711A1 (de) 2020-10-29
US20200341372A1 (en) 2020-10-29
CN111856875A (zh) 2020-10-30
AT522524B1 (de) 2022-04-15
NL2023022B1 (en) 2020-11-05
AT522524A2 (de) 2020-11-15

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