AT334150B - METHOD OF ELECTROPLATING NON-CONDUCTIVE MATERIAL - Google Patents

METHOD OF ELECTROPLATING NON-CONDUCTIVE MATERIAL

Info

Publication number
AT334150B
AT334150B AT853474A AT853474A AT334150B AT 334150 B AT334150 B AT 334150B AT 853474 A AT853474 A AT 853474A AT 853474 A AT853474 A AT 853474A AT 334150 B AT334150 B AT 334150B
Authority
AT
Austria
Prior art keywords
conductive material
electroplating non
electroplating
conductive
Prior art date
Application number
AT853474A
Other languages
German (de)
Other versions
ATA853474A (en
Original Assignee
Int Nickel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Int Nickel Ltd filed Critical Int Nickel Ltd
Publication of ATA853474A publication Critical patent/ATA853474A/en
Application granted granted Critical
Publication of AT334150B publication Critical patent/AT334150B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
AT853474A 1973-10-23 1974-10-23 METHOD OF ELECTROPLATING NON-CONDUCTIVE MATERIAL AT334150B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US408410A US3865699A (en) 1973-10-23 1973-10-23 Electrodeposition on non-conductive surfaces

Publications (2)

Publication Number Publication Date
ATA853474A ATA853474A (en) 1976-04-15
AT334150B true AT334150B (en) 1976-12-27

Family

ID=23616178

Family Applications (1)

Application Number Title Priority Date Filing Date
AT853474A AT334150B (en) 1973-10-23 1974-10-23 METHOD OF ELECTROPLATING NON-CONDUCTIVE MATERIAL

Country Status (15)

Country Link
US (1) US3865699A (en)
JP (2) JPS5067731A (en)
AT (1) AT334150B (en)
BE (1) BE821382A (en)
CA (1) CA1037896A (en)
CH (1) CH592503A5 (en)
DE (1) DE2450069A1 (en)
ES (1) ES431240A1 (en)
FR (1) FR2248339B1 (en)
GB (1) GB1480522A (en)
IN (1) IN142485B (en)
IT (1) IT1032105B (en)
NL (1) NL7413806A (en)
SE (1) SE410627B (en)
ZA (1) ZA746656B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2825735A1 (en) * 1977-06-10 1978-12-21 Sumitomo Naugatuck PROCESS FOR MANUFACTURING GALVANIC COATED PRODUCTS

Families Citing this family (70)

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US4101385A (en) * 1977-03-21 1978-07-18 International Nickel Company Process for making a metal plastic structure
US4158612A (en) * 1977-12-27 1979-06-19 The International Nickel Company, Inc. Polymeric mandrel for electroforming and method of electroforming
JPS5514804A (en) * 1978-07-13 1980-02-01 Toyo Terumii Kk Method of applying partial plating to rubber or plastic
JPS5536270A (en) * 1978-09-08 1980-03-13 Toyo Terumii Kk Partial plating of resin molding
US4191617A (en) * 1979-03-30 1980-03-04 The International Nickel Company, Inc. Process for electroplating directly plateable plastic with cobalt alloy strike and article thereof
EP0015765A3 (en) * 1979-03-09 1981-04-08 MPD Technology Limited An electroplated plastics object and a process for the manufacture thereof
US4195117A (en) * 1979-03-09 1980-03-25 The International Nickel Company, Inc. Process for electroplating directly plateable plastic with nickel-iron alloy strike and article thereof
JPS6123876Y2 (en) * 1980-03-14 1986-07-17
US4278510A (en) * 1980-03-31 1981-07-14 Gulf Oil Corporation Platable propylene polymer compositions
US4429020A (en) 1980-05-22 1984-01-31 Daniel Luch Metal-polymer composite and method of making said composite
FR2518126B1 (en) * 1981-12-14 1986-01-17 Rhone Poulenc Spec Chim PROCESS FOR THE METALLIZATION OF ELECTRICALLY INSULATING ARTICLES OF PLASTIC MATERIAL AND THE INTERMEDIATE AND FINISHED ARTICLES OBTAINED ACCORDING TO THIS PROCESS
US4463054A (en) * 1982-09-17 1984-07-31 A. Schulman, Inc. Plastic-metal laminate, process, and composition
FR2554303B1 (en) * 1983-10-28 1986-04-18 Rhone Poulenc Rech METALLIZABLE SUBSTRATES FOR PRINTED CIRCUITS AND THEIR PREPARATION METHOD
DE3529302A1 (en) * 1985-08-16 1987-02-19 Volker Betz Process for producing electrically conductive surfaces on dielectrics
US5476580A (en) * 1993-05-17 1995-12-19 Electrochemicals Inc. Processes for preparing a non-conductive substrate for electroplating
US6171468B1 (en) 1993-05-17 2001-01-09 Electrochemicals Inc. Direct metallization process
US5690805A (en) * 1993-05-17 1997-11-25 Electrochemicals Inc. Direct metallization process
US6303181B1 (en) 1993-05-17 2001-10-16 Electrochemicals Inc. Direct metallization process employing a cationic conditioner and a binder
US5725807A (en) * 1993-05-17 1998-03-10 Electrochemicals Inc. Carbon containing composition for electroplating
US6710259B2 (en) * 1993-05-17 2004-03-23 Electrochemicals, Inc. Printed wiring boards and methods for making them
JP2833421B2 (en) * 1993-05-24 1998-12-09 ユケン工業株式会社 Method for forming double-layer tin or tin-lead alloy coating
US5545429A (en) * 1994-07-01 1996-08-13 International Business Machines Corporation Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess
US5709586A (en) * 1995-05-08 1998-01-20 Xerox Corporation Honed mandrel
US5547516A (en) * 1995-05-15 1996-08-20 Luch; Daniel Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
US6459032B1 (en) 1995-05-15 2002-10-01 Daniel Luch Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
US7732243B2 (en) * 1995-05-15 2010-06-08 Daniel Luch Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
US20080314433A1 (en) * 1995-05-15 2008-12-25 Daniel Luch Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
WO1998059096A1 (en) * 1997-06-20 1998-12-30 Handelman, Joseph, H. Tool for working a substance
JP2000177053A (en) * 1998-12-17 2000-06-27 Kansai Paint Co Ltd Coated metallic plate
US20090111206A1 (en) 1999-03-30 2009-04-30 Daniel Luch Collector grid, electrode structures and interrconnect structures for photovoltaic arrays and methods of manufacture
US7507903B2 (en) * 1999-03-30 2009-03-24 Daniel Luch Substrate and collector grid structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
US8138413B2 (en) * 2006-04-13 2012-03-20 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US8076568B2 (en) * 2006-04-13 2011-12-13 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US7635810B2 (en) * 1999-03-30 2009-12-22 Daniel Luch Substrate and collector grid structures for integrated photovoltaic arrays and process of manufacture of such arrays
US8664030B2 (en) 1999-03-30 2014-03-04 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US6239352B1 (en) * 1999-03-30 2001-05-29 Daniel Luch Substrate and collector grid structures for electrically interconnecting photovoltaic arrays and process of manufacture of such arrays
US20090107538A1 (en) * 2007-10-29 2009-04-30 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US20080011350A1 (en) * 1999-03-30 2008-01-17 Daniel Luch Collector grid, electrode structures and interconnect structures for photovoltaic arrays and other optoelectric devices
US8222513B2 (en) 2006-04-13 2012-07-17 Daniel Luch Collector grid, electrode structures and interconnect structures for photovoltaic arrays and methods of manufacture
US7898054B2 (en) * 2000-02-04 2011-03-01 Daniel Luch Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
US8198696B2 (en) 2000-02-04 2012-06-12 Daniel Luch Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
US20110067754A1 (en) * 2000-02-04 2011-03-24 Daniel Luch Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
US7898053B2 (en) * 2000-02-04 2011-03-01 Daniel Luch Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
US6468672B1 (en) 2000-06-29 2002-10-22 Lacks Enterprises, Inc. Decorative chrome electroplate on plastics
JP4051900B2 (en) * 2000-12-20 2008-02-27 富士ゼロックス株式会社 Heat resistant resin film having metal thin film and method for producing the same, endless belt, method for producing the same and image forming apparatus
US6697248B1 (en) 2001-02-06 2004-02-24 Daniel Luch Electromagnetic interference shields and methods of manufacture
GB0106131D0 (en) * 2001-03-13 2001-05-02 Macdermid Plc Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys
US6582887B2 (en) * 2001-03-26 2003-06-24 Daniel Luch Electrically conductive patterns, antennas and methods of manufacture
US7394425B2 (en) * 2001-03-26 2008-07-01 Daniel Luch Electrically conductive patterns, antennas and methods of manufacture
US7564409B2 (en) * 2001-03-26 2009-07-21 Ertek Inc. Antennas and electrical connections of electrical devices
US7452656B2 (en) 2001-03-26 2008-11-18 Ertek Inc. Electrically conductive patterns, antennas and methods of manufacture
US6861105B2 (en) * 2002-06-18 2005-03-01 Guardian Industries Corp. Method of making automotive trim with chromium inclusive coating thereon, and corresponding automotive trim product
US6974531B2 (en) * 2002-10-15 2005-12-13 International Business Machines Corporation Method for electroplating on resistive substrates
US20100193367A1 (en) * 2004-02-11 2010-08-05 Daniel Luch Methods and structures for the production of electrically treated items and electrical connections
US20050176270A1 (en) * 2004-02-11 2005-08-11 Daniel Luch Methods and structures for the production of electrically treated items and electrical connections
US20060275553A1 (en) * 2005-06-03 2006-12-07 Siemens Westinghouse Power Corporation Electrically conductive thermal barrier coatings capable for use in electrode discharge machining
US20070040688A1 (en) * 2005-08-16 2007-02-22 X-Cyte, Inc., A California Corporation RFID inlays and methods of their manufacture
US20070040686A1 (en) * 2005-08-16 2007-02-22 X-Cyte, Inc., A California Corporation RFID inlays and methods of their manufacture
CA2558561A1 (en) 2005-09-06 2007-03-06 X-Cyte, Inc. Battery housing and method of manufacturing the same
US8729385B2 (en) 2006-04-13 2014-05-20 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US8822810B2 (en) 2006-04-13 2014-09-02 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US9865758B2 (en) 2006-04-13 2018-01-09 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US9006563B2 (en) 2006-04-13 2015-04-14 Solannex, Inc. Collector grid and interconnect structures for photovoltaic arrays and modules
US9236512B2 (en) 2006-04-13 2016-01-12 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US8884155B2 (en) 2006-04-13 2014-11-11 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
BRPI0714608A2 (en) * 2006-08-03 2013-06-18 Basf Se process for applying a metal layer to a substrate, using carbon nanotubes, substrate surface, and using a substrate surface
EP2499176B2 (en) * 2009-11-11 2022-08-10 Borealis AG Power cable comprising a polymer composition comprising a polyolefin produced in a high pressure process
US9852826B2 (en) * 2010-06-10 2017-12-26 Borealis Ag Cable with semiconductive layer made of polypropylene composition and improved long term thermal stability
CN106525536A (en) * 2016-11-30 2017-03-22 江西洪都航空工业集团有限责任公司 Preparation method of fungiform samples for testing tensile strength of thermally-bonded metal rubber-coated parts
WO2020160531A1 (en) * 2019-02-01 2020-08-06 Lumishield Technologies Incorporated Methods and compositions for improved adherence of organic coatings to materials

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2732020A (en) * 1956-01-24 Electroplated structure adapted for -
US1624575A (en) * 1926-07-03 1927-04-12 United Products Corp Of Americ Art of galvanoplasty
US2551342A (en) * 1946-10-19 1951-05-01 Us Rubber Co Method of electrodepositing a metal layer on rubber
US2551344A (en) * 1946-10-19 1951-05-01 Us Rubber Co Method of electrodepositing a metal layer on rubber
US2551343A (en) * 1946-10-19 1951-05-01 Us Rubber Co Method of electrodepositing a metal layer on rubber
US2776253A (en) * 1950-05-04 1957-01-01 Siegfried G Bart Method of making airfoil sections
US3523875A (en) * 1967-03-15 1970-08-11 Hooker Chemical Corp Process for metal coating substrate pretreated with alkali metal sulfide and resultant product
US3619382A (en) * 1970-01-27 1971-11-09 Gen Electric Process of reducing metal compounds to metal in a matrix

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2825735A1 (en) * 1977-06-10 1978-12-21 Sumitomo Naugatuck PROCESS FOR MANUFACTURING GALVANIC COATED PRODUCTS

Also Published As

Publication number Publication date
IN142485B (en) 1977-07-16
BE821382A (en) 1975-04-23
CH592503A5 (en) 1977-10-31
AU7438774A (en) 1976-04-29
JPS585378A (en) 1983-01-12
JPS5067731A (en) 1975-06-06
GB1480522A (en) 1977-07-20
NL7413806A (en) 1975-04-25
SE7413267L (en) 1975-04-24
ES431240A1 (en) 1976-10-16
CA1037896A (en) 1978-09-05
US3865699A (en) 1975-02-11
FR2248339B1 (en) 1978-06-09
SE410627B (en) 1979-10-22
IT1032105B (en) 1979-05-30
ATA853474A (en) 1976-04-15
ZA746656B (en) 1976-06-30
FR2248339A1 (en) 1975-05-16
DE2450069A1 (en) 1975-04-24

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Legal Events

Date Code Title Description
EFA Change in the company name
ELJ Ceased due to non-payment of the annual fee