AT322059B - STACKED ARRANGEMENT OF SEMICONDUCTOR CHIPS - Google Patents
STACKED ARRANGEMENT OF SEMICONDUCTOR CHIPSInfo
- Publication number
- AT322059B AT322059B AT361971A AT361971A AT322059B AT 322059 B AT322059 B AT 322059B AT 361971 A AT361971 A AT 361971A AT 361971 A AT361971 A AT 361971A AT 322059 B AT322059 B AT 322059B
- Authority
- AT
- Austria
- Prior art keywords
- semiconductor chips
- stacked arrangement
- stacked
- arrangement
- chips
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5385—Assembly of a plurality of insulating substrates
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06579—TAB carriers; beam leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19702022895 DE2022895B2 (en) | 1970-05-11 | 1970-05-11 | STACKED ARRANGEMENT OF SEMICONDUCTOR BODIES AND PROCESS FOR THEIR PRODUCTION |
Publications (1)
Publication Number | Publication Date |
---|---|
AT322059B true AT322059B (en) | 1975-05-12 |
Family
ID=5770762
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT361971A AT322059B (en) | 1970-05-11 | 1971-04-27 | STACKED ARRANGEMENT OF SEMICONDUCTOR CHIPS |
Country Status (8)
Country | Link |
---|---|
AT (1) | AT322059B (en) |
CA (1) | CA922818A (en) |
CH (1) | CH519247A (en) |
DE (1) | DE2022895B2 (en) |
FR (1) | FR2088490A1 (en) |
GB (1) | GB1300881A (en) |
NL (1) | NL7106459A (en) |
SE (1) | SE369028B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2806685A1 (en) * | 1978-02-16 | 1979-08-23 | Siemens Ag | Stacked semiconductor structure using film mounting - comprises stack of substrates holding semiconductor chips connected to main substrate or circuit board with terminals |
JPS5837948A (en) * | 1981-08-31 | 1983-03-05 | Toshiba Corp | Laminated semiconductor memory device |
GB2150749B (en) * | 1983-12-03 | 1987-09-23 | Standard Telephones Cables Ltd | Integrated circuits |
US4982264A (en) * | 1985-02-27 | 1991-01-01 | Texas Instruments Incorporated | High density integrated circuit package |
DE3640072A1 (en) * | 1986-11-24 | 1988-06-01 | Rolf Tiedeken | Electronic data storage unit with a number of static RAM chips |
FR2645681B1 (en) * | 1989-04-07 | 1994-04-08 | Thomson Csf | DEVICE FOR VERTICALLY INTERCONNECTING PADS OF INTEGRATED CIRCUITS AND ITS MANUFACTURING METHOD |
US5059557A (en) * | 1989-08-08 | 1991-10-22 | Texas Instruments Incorporated | Method of electrically connecting integrated circuits by edge-insertion in grooved support members |
US5696030A (en) * | 1994-09-30 | 1997-12-09 | International Business Machines Corporation | Integrated circuit contacts having improved electromigration characteristics and fabrication methods therefor |
-
1970
- 1970-05-11 DE DE19702022895 patent/DE2022895B2/en active Granted
-
1971
- 1971-04-07 CH CH510271A patent/CH519247A/en not_active IP Right Cessation
- 1971-04-27 AT AT361971A patent/AT322059B/en not_active IP Right Cessation
- 1971-05-10 GB GB1398871A patent/GB1300881A/en not_active Expired
- 1971-05-11 SE SE611671A patent/SE369028B/xx unknown
- 1971-05-11 NL NL7106459A patent/NL7106459A/xx unknown
- 1971-05-11 CA CA112685A patent/CA922818A/en not_active Expired
- 1971-05-11 FR FR7116896A patent/FR2088490A1/fr not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
FR2088490A1 (en) | 1972-01-07 |
CA922818A (en) | 1973-03-13 |
CH519247A (en) | 1972-02-15 |
DE2022895B2 (en) | 1976-12-02 |
NL7106459A (en) | 1971-11-15 |
GB1300881A (en) | 1972-12-20 |
DE2022895A1 (en) | 1971-12-30 |
SE369028B (en) | 1974-07-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ELJ | Ceased due to non-payment of the annual fee |