AT318048B - Verfahren zur Herstellung von elektrischen Leiterplatten - Google Patents

Verfahren zur Herstellung von elektrischen Leiterplatten

Info

Publication number
AT318048B
AT318048B AT703371A AT703371A AT318048B AT 318048 B AT318048 B AT 318048B AT 703371 A AT703371 A AT 703371A AT 703371 A AT703371 A AT 703371A AT 318048 B AT318048 B AT 318048B
Authority
AT
Austria
Prior art keywords
production
circuit boards
electrical circuit
boards
electrical
Prior art date
Application number
AT703371A
Other languages
German (de)
English (en)
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Application granted granted Critical
Publication of AT318048B publication Critical patent/AT318048B/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
AT703371A 1968-02-09 1969-02-06 Verfahren zur Herstellung von elektrischen Leiterplatten AT318048B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70438368A 1968-02-09 1968-02-09

Publications (1)

Publication Number Publication Date
AT318048B true AT318048B (de) 1974-09-25

Family

ID=24829249

Family Applications (3)

Application Number Title Priority Date Filing Date
AT122769A AT301665B (de) 1968-02-09 1969-02-06 Verfahren zur Herstellung elektrischer Leiterplatten
AT703371A AT318048B (de) 1968-02-09 1969-02-06 Verfahren zur Herstellung von elektrischen Leiterplatten
AT703471A AT326204B (de) 1968-02-09 1971-08-11 Verfahren zur herstellung elektrischer leiterplatten

Family Applications Before (1)

Application Number Title Priority Date Filing Date
AT122769A AT301665B (de) 1968-02-09 1969-02-06 Verfahren zur Herstellung elektrischer Leiterplatten

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT703471A AT326204B (de) 1968-02-09 1971-08-11 Verfahren zur herstellung elektrischer leiterplatten

Country Status (5)

Country Link
AT (3) AT301665B (nl)
CH (1) CH495683A (nl)
DK (1) DK128260B (nl)
ES (1) ES363391A1 (nl)
NL (1) NL162537C (nl)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9002920B2 (en) 1998-09-11 2015-04-07 Genesys Telecommunications Laboratories, Inc. Method and apparatus for extended management of state and interaction of a remote knowledge worker from a contact center

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9002920B2 (en) 1998-09-11 2015-04-07 Genesys Telecommunications Laboratories, Inc. Method and apparatus for extended management of state and interaction of a remote knowledge worker from a contact center
USRE46387E1 (en) 1998-09-11 2017-05-02 Genesys Telecommunications Laboratories, Inc. Method and apparatus for extended management of state and interaction of a remote knowledge worker from a contact center

Also Published As

Publication number Publication date
CH495683A (de) 1970-08-31
AT326204B (de) 1975-11-25
ATA703471A (de) 1975-02-15
ES363391A1 (es) 1970-12-16
NL162537B (nl) 1979-12-17
DE1906967A1 (de) 1970-08-20
AT301665B (de) 1972-09-11
NL162537C (nl) 1980-05-16
DE1906967B2 (de) 1971-05-19
DK128260B (da) 1974-03-25
NL6902088A (nl) 1969-08-12

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee