AT318042B - Verfahren zum Herstellen von Zuleitungsrahmen - Google Patents
Verfahren zum Herstellen von ZuleitungsrahmenInfo
- Publication number
- AT318042B AT318042B AT773771A AT773771A AT318042B AT 318042 B AT318042 B AT 318042B AT 773771 A AT773771 A AT 773771A AT 773771 A AT773771 A AT 773771A AT 318042 B AT318042 B AT 318042B
- Authority
- AT
- Austria
- Prior art keywords
- lead frames
- manufacturing lead
- manufacturing
- frames
- lead
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7003470A | 1970-09-08 | 1970-09-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AT318042B true AT318042B (de) | 1974-09-25 |
Family
ID=22092718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT773771A AT318042B (de) | 1970-09-08 | 1971-09-06 | Verfahren zum Herstellen von Zuleitungsrahmen |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US3650232A (fr) |
| AT (1) | AT318042B (fr) |
| AU (1) | AU450494B2 (fr) |
| BE (1) | BE772314A (fr) |
| CA (1) | CA966986A (fr) |
| DE (1) | DE2143809A1 (fr) |
| ES (1) | ES394780A1 (fr) |
| FR (1) | FR2106369B1 (fr) |
| GB (1) | GB1305337A (fr) |
| NL (1) | NL7112352A (fr) |
| SE (1) | SE360216B (fr) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3815205A (en) * | 1973-03-02 | 1974-06-11 | Nasa | Device for configuring multiple leads |
| US4158745A (en) * | 1977-10-27 | 1979-06-19 | Amp Incorporated | Lead frame having integral terminal tabs |
| US4214120A (en) * | 1978-10-27 | 1980-07-22 | Western Electric Company, Inc. | Electronic device package having solder leads and methods of assembling the package |
| US4439918A (en) * | 1979-03-12 | 1984-04-03 | Western Electric Co., Inc. | Methods of packaging an electronic device |
| US4252864A (en) * | 1979-11-05 | 1981-02-24 | Amp Incorporated | Lead frame having integral terminal tabs |
| FR2538961B1 (fr) * | 1982-12-30 | 1985-07-12 | Europ Composants Electron | Embase pour circuit integre |
| KR910001118B1 (ko) * | 1985-11-13 | 1991-02-23 | 후지쓰 가부시끼가이샤 | Ic 시이트 절단 프레스 및 이를 이용한 ic 시이트 가공장치 |
| US4819476A (en) * | 1987-07-17 | 1989-04-11 | Amp Incorporated | Tooling for forming machines having improved guidance, tool mounting, and pilot pin systems |
| NL9100470A (nl) * | 1991-03-15 | 1992-10-01 | Asm Fico Tooling | Werkwijze en inrichting voor het uit op een leadframe opgenomen geintegreerde schakelingen vervaardigen van een enkelvoudig produkt. |
| US5557504A (en) * | 1993-08-31 | 1996-09-17 | Sgs-Thomson Microelectronics, Inc. | Surface mountable integrated circuit package with detachable module |
| US5570273A (en) * | 1993-08-31 | 1996-10-29 | Sgs-Thomson Microelectronics, Inc. | Surface mountable integrated circuit package with low-profile detachable module |
| DE69712999T2 (de) * | 1996-07-26 | 2003-01-23 | Nec Corp., Tokio/Tokyo | Festelektrolytkondensator mit vorplattierten Leiteranschlüssen und dessen Herstellungsverfahren |
| JP2000243889A (ja) * | 1999-02-22 | 2000-09-08 | Sony Corp | 半導体装置用リードフレームの形状加工装置及び形状加工方法並びに半導体装置用リードフレーム |
| JP6748303B2 (ja) * | 2016-11-11 | 2020-08-26 | ルミレッズ ホールディング ベーフェー | リードフレーム製造方法 |
| CN117644134B (zh) * | 2024-01-23 | 2024-05-14 | 佛山市阿玛达机械科技有限公司 | 一种金属板材加工用冷弯成型装置及其操作方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3571920A (en) * | 1965-12-16 | 1971-03-23 | Berg Electronics Inc | Method for transistor manufacture |
| US3440027A (en) * | 1966-06-22 | 1969-04-22 | Frances Hugle | Automated packaging of semiconductors |
| US3524249A (en) * | 1966-10-08 | 1970-08-18 | Nippon Electric Co | Method of manufacturing a semiconductor container |
| US3559285A (en) * | 1968-01-08 | 1971-02-02 | Jade Corp | Method of forming leads for attachment to semi-conductor devices |
-
1970
- 1970-09-08 US US70034A patent/US3650232A/en not_active Expired - Lifetime
-
1971
- 1971-08-10 CA CA120,222A patent/CA966986A/en not_active Expired
- 1971-08-13 AU AU32355/71A patent/AU450494B2/en not_active Expired
- 1971-08-24 GB GB3975471A patent/GB1305337A/en not_active Expired
- 1971-09-01 SE SE11099/71A patent/SE360216B/xx unknown
- 1971-09-01 DE DE19712143809 patent/DE2143809A1/de active Pending
- 1971-09-03 ES ES394780A patent/ES394780A1/es not_active Expired
- 1971-09-06 AT AT773771A patent/AT318042B/de not_active IP Right Cessation
- 1971-09-07 FR FR7132253A patent/FR2106369B1/fr not_active Expired
- 1971-09-07 BE BE772314A patent/BE772314A/fr unknown
- 1971-09-08 NL NL7112352A patent/NL7112352A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB1305337A (fr) | 1973-01-31 |
| AU450494B2 (en) | 1974-07-11 |
| FR2106369B1 (fr) | 1977-04-22 |
| US3650232A (en) | 1972-03-21 |
| DE2143809A1 (de) | 1972-03-09 |
| NL7112352A (fr) | 1972-03-10 |
| ES394780A1 (es) | 1974-03-01 |
| SE360216B (fr) | 1973-09-17 |
| AU3235571A (en) | 1973-02-15 |
| FR2106369A1 (fr) | 1972-05-05 |
| BE772314A (fr) | 1972-03-07 |
| CA966986A (en) | 1975-05-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ELJ | Ceased due to non-payment of the annual fee |