AT288809B - Verfahren zur elektrolytischen Abscheidung einer Nickel-Silber-Legierung - Google Patents
Verfahren zur elektrolytischen Abscheidung einer Nickel-Silber-LegierungInfo
- Publication number
- AT288809B AT288809B AT431069A AT431069A AT288809B AT 288809 B AT288809 B AT 288809B AT 431069 A AT431069 A AT 431069A AT 431069 A AT431069 A AT 431069A AT 288809 B AT288809 B AT 288809B
- Authority
- AT
- Austria
- Prior art keywords
- electrodeposition
- nickel
- silver alloy
- silver
- alloy
- Prior art date
Links
Classifications
-
- H10W70/481—
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
-
- H10W76/132—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
- Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
- Electroplating Methods And Accessories (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Joining Of Glass To Other Materials (AREA)
- Die Bonding (AREA)
- Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB22421/66A GB1142868A (en) | 1966-05-19 | 1966-05-19 | Improvements in and relating to semiconductor device headers |
| NL6707869A NL6707869A (de) | 1966-05-19 | 1967-06-06 | |
| FR150864 | 1968-05-07 | ||
| US85031069A | 1969-07-29 | 1969-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AT288809B true AT288809B (de) | 1971-03-25 |
Family
ID=27444983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT431069A AT288809B (de) | 1966-05-19 | 1969-05-05 | Verfahren zur elektrolytischen Abscheidung einer Nickel-Silber-Legierung |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US3689996A (de) |
| JP (2) | JPS4930317B1 (de) |
| AT (1) | AT288809B (de) |
| BE (1) | BE698726A (de) |
| CH (1) | CH465062A (de) |
| DE (2) | DE1614249A1 (de) |
| FR (1) | FR1594553A (de) |
| GB (2) | GB1142868A (de) |
| NL (3) | NL6706869A (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3007141A1 (de) * | 1979-03-02 | 1980-09-11 | Texas Instruments Inc | Gehaeuse fuer eine halbleitervorrichtung |
| JPS55132444U (de) * | 1979-03-12 | 1980-09-19 | ||
| DE4126524A1 (de) * | 1991-08-10 | 1993-02-11 | Teves Gmbh Alfred | Vorrichtung zur fuehrung und isolation mehrerer elektrischer leitungen |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3325881A (en) * | 1963-01-08 | 1967-06-20 | Sperry Rand Corp | Electrical circuit board fabrication |
| US3375576A (en) * | 1963-11-29 | 1968-04-02 | Itt | Method of and tools for making printed circuit boards |
| US3426426A (en) * | 1967-02-27 | 1969-02-11 | David E Born | Sliced circuitry |
-
1966
- 1966-05-19 GB GB22421/66A patent/GB1142868A/en not_active Expired
-
1967
- 1967-05-16 CH CH686767A patent/CH465062A/de unknown
- 1967-05-17 JP JP3114267A patent/JPS4930317B1/ja active Pending
- 1967-05-17 DE DE19671614249 patent/DE1614249A1/de active Pending
- 1967-05-18 NL NL6706869A patent/NL6706869A/xx unknown
- 1967-05-19 BE BE698726D patent/BE698726A/xx unknown
- 1967-06-06 NL NL6707869A patent/NL6707869A/xx unknown
-
1968
- 1968-05-07 FR FR150864A patent/FR1594553A/fr not_active Expired
-
1969
- 1969-04-17 DE DE19691919544 patent/DE1919544A1/de active Pending
- 1969-05-02 GB GB1226228D patent/GB1226228A/en not_active Expired
- 1969-05-02 JP JP44033934A patent/JPS4923461B1/ja active Pending
- 1969-05-05 AT AT431069A patent/AT288809B/de not_active IP Right Cessation
- 1969-05-06 NL NL6906869A patent/NL6906869A/xx unknown
- 1969-07-29 US US850310A patent/US3689996A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| GB1142868A (en) | 1969-02-12 |
| CH465062A (de) | 1968-11-15 |
| GB1226228A (de) | 1971-03-24 |
| US3689996A (en) | 1972-09-12 |
| DE1614249A1 (de) | 1970-06-25 |
| NL6706869A (de) | 1967-11-20 |
| FR1594553A (de) | 1970-06-08 |
| NL6707869A (de) | 1968-12-09 |
| JPS4923461B1 (de) | 1974-06-15 |
| BE698726A (de) | 1967-11-20 |
| JPS4930317B1 (de) | 1974-08-12 |
| DE1919544A1 (de) | 1969-11-13 |
| NL6906869A (de) | 1969-11-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ELJ | Ceased due to non-payment of the annual fee |