AT286416B - Carrier with one or more microcircuits and process for their manufacture - Google Patents
Carrier with one or more microcircuits and process for their manufactureInfo
- Publication number
- AT286416B AT286416B AT71268A AT71268A AT286416B AT 286416 B AT286416 B AT 286416B AT 71268 A AT71268 A AT 71268A AT 71268 A AT71268 A AT 71268A AT 286416 B AT286416 B AT 286416B
- Authority
- AT
- Austria
- Prior art keywords
- microcircuits
- manufacture
- carrier
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01—ELECTRIC ELEMENTS
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/097—Glass-ceramics, e.g. devitrified glass
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- H01L2924/12—Passive devices, e.g. 2 terminal devices
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- H01L2924/12041—LED
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Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL6701294A NL6701294A (en) | 1967-01-27 | 1967-01-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
AT286416B true AT286416B (en) | 1970-12-10 |
Family
ID=19799151
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT71268A AT286416B (en) | 1967-01-27 | 1968-01-24 | Carrier with one or more microcircuits and process for their manufacture |
Country Status (7)
Country | Link |
---|---|
AT (1) | AT286416B (en) |
BE (1) | BE709891A (en) |
CH (1) | CH483774A (en) |
DE (1) | DE1285581C2 (en) |
FR (1) | FR1553301A (en) |
GB (1) | GB1211412A (en) |
NL (1) | NL6701294A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE68921115T2 (en) * | 1988-07-25 | 1995-10-12 | Asahi Glass Co Ltd | Window antenna for a motor vehicle. |
US4933812A (en) * | 1989-10-11 | 1990-06-12 | Hewlett-Packard Company | Package and circuit arrangement for housing and connecting polarized electrical components and method of manufacture |
-
1967
- 1967-01-27 NL NL6701294A patent/NL6701294A/xx unknown
-
1968
- 1968-01-18 DE DE1968N0031981 patent/DE1285581C2/en not_active Expired
- 1968-01-24 CH CH115068A patent/CH483774A/en not_active IP Right Cessation
- 1968-01-24 AT AT71268A patent/AT286416B/en not_active IP Right Cessation
- 1968-01-24 GB GB3678/68A patent/GB1211412A/en not_active Expired
- 1968-01-25 BE BE709891D patent/BE709891A/xx unknown
- 1968-01-26 FR FR1553301D patent/FR1553301A/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
NL6701294A (en) | 1968-07-29 |
DE1285581C2 (en) | 1973-08-23 |
CH483774A (en) | 1969-12-31 |
BE709891A (en) | 1968-07-25 |
GB1211412A (en) | 1970-11-04 |
DE1285581B (en) | 1968-12-19 |
FR1553301A (en) | 1969-01-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ELJ | Ceased due to non-payment of the annual fee |