AT123828B - Method and solder for soldering tungsten and molybdenum. - Google Patents
Method and solder for soldering tungsten and molybdenum.Info
- Publication number
- AT123828B AT123828B AT123828DA AT123828B AT 123828 B AT123828 B AT 123828B AT 123828D A AT123828D A AT 123828DA AT 123828 B AT123828 B AT 123828B
- Authority
- AT
- Austria
- Prior art keywords
- solder
- molybdenum
- soldering
- tungsten
- soldering tungsten
- Prior art date
Links
Landscapes
- Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
Description
<Desc/Clms Page number 1>
Verfahren und Lot zum Löten von Wolfram und Molybdän.
EMI1.1
der Fall.
Die Erfindung hat zum Zweck, ein Mittel zum Löten solcher Metalle anzugeben.
Gemäss der Erfindung wird zum Löten eines solchen Metalls oder einer Metallegierung ein Lot benutzt, das aus Kupfer und Silizium oder Aluminium als desoxydierende Beimischung besteht. Ferner ist es vorteilhaft, dem Lot no eh pin Flussmittel, wie Borax oder Glas, mit niedrigem Schmelzpunkt beizufügen, weil dadurch das Verfahren sehr erleichtert wird. Das erwähnte Lot bietet die Vorteile, dass es nicht nur selbst keinen Sauerstoff abgibt, sondern überdies das auf der Metalloberfläche schon gebildete Oxydhäutehen völlig auflöst, so dass die zu lötende Metalloberfläche zuvor nicht desoxydiert zu werden braucht..
Ein Lötverfahren gemäss der Erfindung kann beispielsweise beim Befestigen von Wolframkontaktplättchen oder von Wolframstäbchen an den Durchführungsdrähten in Senderöhren mit Vorteil angewendet werden.
PATENT-ANSPRÜCHE :
1. Verfahren zum Löten von Wolfram und Molybdän, dadurch gekennzeichnet, dass ein aus Kupfer mit einer desoyxdierenden Beimischung, wir z. B. Silizium oder Aluminium, bestehendes Lot benutzt wird.
**WARNUNG** Ende DESC Feld kannt Anfang CLMS uberlappen**.
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Method and solder for soldering tungsten and molybdenum.
EMI1.1
the case.
The purpose of the invention is to provide a means for soldering such metals.
According to the invention, a solder consisting of copper and silicon or aluminum as a deoxidizing admixture is used for soldering such a metal or a metal alloy. Furthermore, it is advantageous to add flux, such as borax or glass, with a low melting point to the solder no eh pin, because this makes the process much easier. The aforementioned solder offers the advantage that it not only does not release any oxygen itself, but also completely dissolves the oxide layer that has already formed on the metal surface, so that the metal surface to be soldered does not need to be deoxidized beforehand.
A soldering method according to the invention can be used with advantage, for example, when fastening tungsten contact plates or tungsten rods to the lead-through wires in transmission tubes.
PATENT CLAIMS:
1. A method for soldering tungsten and molybdenum, characterized in that a copper with a desoyxdating admixture, we z. B. silicon or aluminum, existing solder is used.
** WARNING ** End of DESC field may overlap beginning of CLMS **.
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL123828X | 1926-12-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AT123828B true AT123828B (en) | 1931-07-25 |
Family
ID=19775550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT123828D AT123828B (en) | 1926-12-23 | 1927-11-08 | Method and solder for soldering tungsten and molybdenum. |
Country Status (1)
| Country | Link |
|---|---|
| AT (1) | AT123828B (en) |
-
1927
- 1927-11-08 AT AT123828D patent/AT123828B/en active
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