AT10554U8 - Verbindungskörper - Google Patents

Verbindungskörper Download PDF

Info

Publication number
AT10554U8
AT10554U8 AT10030908U AT3092008U AT10554U8 AT 10554 U8 AT10554 U8 AT 10554U8 AT 10030908 U AT10030908 U AT 10030908U AT 3092008 U AT3092008 U AT 3092008U AT 10554 U8 AT10554 U8 AT 10554U8
Authority
AT
Austria
Prior art keywords
connection body
connection
Prior art date
Application number
AT10030908U
Other languages
English (en)
Other versions
AT10554U1 (de
Original Assignee
Austria Tech & System Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Austria Tech & System Tech filed Critical Austria Tech & System Tech
Priority to AT10030908U priority Critical patent/AT10554U8/de
Publication of AT10554U1 publication Critical patent/AT10554U1/de
Application granted granted Critical
Publication of AT10554U8 publication Critical patent/AT10554U8/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
AT10030908U 2008-05-29 2008-05-29 Verbindungskörper AT10554U8 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT10030908U AT10554U8 (de) 2008-05-29 2008-05-29 Verbindungskörper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT10030908U AT10554U8 (de) 2008-05-29 2008-05-29 Verbindungskörper

Publications (2)

Publication Number Publication Date
AT10554U1 AT10554U1 (de) 2009-05-15
AT10554U8 true AT10554U8 (de) 2009-06-15

Family

ID=40427728

Family Applications (1)

Application Number Title Priority Date Filing Date
AT10030908U AT10554U8 (de) 2008-05-29 2008-05-29 Verbindungskörper

Country Status (1)

Country Link
AT (1) AT10554U8 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012224376A1 (de) * 2012-12-27 2014-07-03 Robert Bosch Gmbh Leiterbahnanordnung und Verfahren zu deren Herstellung

Also Published As

Publication number Publication date
AT10554U1 (de) 2009-05-15

Similar Documents

Publication Publication Date Title
EP2351549A4 (de) Verbinder
EP2296593A4 (de) Medizinische kopfbedeckung
PT2813570T (pt) Resumo
DE602009000234D1 (de) msignals
PT3045471T (pt) Resumo
BRPI0914649A2 (pt) Piprazolo-quinazolinas
DE602008003972D1 (de) Sitzrücklehnungsmechanismus
DE602008003521D1 (de) Sitzrücklehnungsmechanismus
DK2837348T3 (da) Kryokirurgiske fremgangsmåder
DE502008001632D1 (de) Karosserieaufbau
DE602008003970D1 (de) Strahlstromkalibriersystem
EP2337157A4 (de) Verbinder
BRPI0907522A2 (pt) biarlamidas
DE112009000183A5 (de) Sicherheitsvorreiber
BRPI0909634A2 (pt) 2-aminoquinolinas
DE602009000862D1 (de) Gehwagenbremse
DE602009000488D1 (de) Obstvereinzelvorrichtung
BRPI0907863A2 (pt) pirrolopirimidinacarboxamidas
BRPI0909637A2 (pt) 2-aminoquinolinas
EP2397246A4 (de) Verbundener körper
DK2406337T3 (da) Fastgørelsesorgan
BRPI0921582A2 (pt) carroceria basculante
AT507449A3 (de) Dämmstoffbefestiger
DE502007004713D1 (de) Karosserie-Anbauteil
DE602009001190D1 (de) Gleichstromumrichtervorrichtung

Legal Events

Date Code Title Description
MM9K Lapse due to non-payment of renewal fee