AR023501A1 - UNA PLACA DE ACCESO CON CONECTORES HEMBRA, MODULO DE INTERFASE POSTERIOR UTIL CON DICHA PLACA Y DISPOSICIoN DE CONEXIoN DE ALTA DENSIDAD - Google Patents

UNA PLACA DE ACCESO CON CONECTORES HEMBRA, MODULO DE INTERFASE POSTERIOR UTIL CON DICHA PLACA Y DISPOSICIoN DE CONEXIoN DE ALTA DENSIDAD

Info

Publication number
AR023501A1
AR023501A1 ARP000101744A ARP000101744A AR023501A1 AR 023501 A1 AR023501 A1 AR 023501A1 AR P000101744 A ARP000101744 A AR P000101744A AR P000101744 A ARP000101744 A AR P000101744A AR 023501 A1 AR023501 A1 AR 023501A1
Authority
AR
Argentina
Prior art keywords
plate
connection
interface module
access plates
female connectors
Prior art date
Application number
ARP000101744A
Other languages
English (en)
Original Assignee
Adc Telecommunications Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adc Telecommunications Inc filed Critical Adc Telecommunications Inc
Publication of AR023501A1 publication Critical patent/AR023501A1/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/516—Means for holding or embracing insulating body, e.g. casing, hoods
    • H01R13/518—Means for holding or embracing insulating body, e.g. casing, hoods for holding or embracing several coupling parts, e.g. frames
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q1/00—Details of selecting apparatus or arrangements
    • H04Q1/02—Constructional details
    • H04Q1/023—Constructional details using sliding mechanisms for accessing the interior of the apparatus
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q1/00—Details of selecting apparatus or arrangements
    • H04Q1/02—Constructional details
    • H04Q1/09—Frames or mounting racks not otherwise provided for
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q2201/00—Constructional details of selecting arrangements
    • H04Q2201/12—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Structure Of Telephone Exchanges (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

La presente descripcion se refiere a sistemas de conexion de alta densidad. El sistema incluye un alojamiento de placa que tiene un extremo frontalposicionado en forma opuesta de un extremo posterior. El alojamiento de placa incluye paredes superiore inferior que se extienden entre los extremos frontal yposterior. Las paredes superior e inferior definen juegos opuestos de ranuras superior e inferior. El sistema de conexion también incluye una pluralidad decables de conexion que incluyen fichasde conexion que tienen cada una un ancho W1 y una altura H1. El sistema de conexion además incluye una pluralidad deplacas de acceso con conectores hembra adaptadas para ser montadas en un alojamiento de placas y un modulo de interfase posteriorpos icionado en el extremoposterior del alojamiento de placa. Las placas de acceso son conectores hembra también incluyen placas de circuito que tienen bordes superior e inferioradaptados para calzar dentro de los juegos de ranuras superior einferior de finidas por el alojamiento de placa. Las placas de acceso con conectores hembratambién incluyen una pluralidad de contactos de borde de placa posicionados en la parte posterior de cada placa de circuito. Las placas de accesosonconectores hembra incl uyen además piezas de interfase frontal que tienen alturas H2 que son mayores que dos veces la altura H1 y anchos W2 que son cada unomenores que dos veces el ancho W1. Las piezas de interfase frontales definen cada unapuertos de ficha de conexion su perior e inferior que están verticalmenteespaciados a lo largo de la altura H2 de cada pieza de interfase frontal. Los puertos de ficha de conexion superior e inferior están dimensionados yconformados para recibirsolamente una unica ficha de conexio n a la vez. El modulo de interfase posterior incluye una unica fila de conectores de borde deplaca adaptados para proveer conexiones eléctricas con los contactos de borde de placa de las placas de acceso conconectores hembra. El modulo de interfasep osterior también incluye una disposicion de conectores posteriores que incluyen filas de conectores superiores e inferiores posteriores. La disposicion de
ARP000101744A 1999-04-16 2000-04-14 UNA PLACA DE ACCESO CON CONECTORES HEMBRA, MODULO DE INTERFASE POSTERIOR UTIL CON DICHA PLACA Y DISPOSICIoN DE CONEXIoN DE ALTA DENSIDAD AR023501A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/293,026 US6186798B1 (en) 1999-04-16 1999-04-16 High density patching system

Publications (1)

Publication Number Publication Date
AR023501A1 true AR023501A1 (es) 2002-09-04

Family

ID=23127312

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP000101744A AR023501A1 (es) 1999-04-16 2000-04-14 UNA PLACA DE ACCESO CON CONECTORES HEMBRA, MODULO DE INTERFASE POSTERIOR UTIL CON DICHA PLACA Y DISPOSICIoN DE CONEXIoN DE ALTA DENSIDAD

Country Status (14)

Country Link
US (3) US6186798B1 (es)
EP (1) EP1173981B1 (es)
JP (1) JP4511054B2 (es)
AR (1) AR023501A1 (es)
AT (1) ATE413775T1 (es)
AU (1) AU770621B2 (es)
BR (1) BR0009777A (es)
CA (1) CA2370263C (es)
DE (1) DE60040731D1 (es)
HK (1) HK1042006B (es)
MX (1) MXPA01010471A (es)
TW (1) TW463419B (es)
WO (1) WO2000064194A1 (es)
ZA (1) ZA200108799B (es)

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US6186798B1 (en) 1999-04-16 2001-02-13 Adc Telecommunications, Inc. High density patching system
US7047553B1 (en) * 2000-10-05 2006-05-16 Arris International, Inc. Method and apparatus for decreasing cable installation time and cable installation faults
US7010232B1 (en) * 2000-12-20 2006-03-07 Cisco Technology, Inc. Removable optical interface modules
US6597256B2 (en) 2001-01-23 2003-07-22 Adc Telecommunications, Inc. Multi-circuit signal transformer
US6907230B2 (en) * 2001-03-19 2005-06-14 Adc Telecommunications, Inc. Telecommunications chassis, module, and bridging repeater circuitry
US6992257B2 (en) * 2001-04-06 2006-01-31 Adc Telecommunications, Inc. Electronic signal transmission and switching jack
US6632106B2 (en) * 2001-07-24 2003-10-14 Adc Telecommunications, Inc. Jack; jack assembly; and methods
US6554652B1 (en) 2002-02-15 2003-04-29 Adc Telecommunications, Inc. Jack assembly including baluns interface; and methods
US6842348B2 (en) * 2002-05-31 2005-01-11 Pci Technologies, Inc. RF circuit modules and integrated chassis with power interface for RF circuit modules
US6875060B2 (en) * 2002-10-21 2005-04-05 Adc Telecommunications, Inc. High density patching system
US6822874B1 (en) 2002-11-12 2004-11-23 Wooshcom Corporation Modular high availability electronic product architecture with flexible I/O
US6752665B2 (en) * 2002-11-18 2004-06-22 Trompeter Electronics, Inc. Modular cross-connect with removable switch assembly
US20050026506A1 (en) * 2002-11-18 2005-02-03 Trompeter Electronics, Inc. Modular cross-connect with hot-swappable modules
US7054163B2 (en) * 2003-11-13 2006-05-30 Adc Telecommunications, Inc. Multi-interface patch panel system
US7180751B1 (en) 2004-02-19 2007-02-20 Isothermal Systems Research, Inc. Input/output transition board system
US7362590B2 (en) * 2004-03-31 2008-04-22 Adc Telecommunications, Inc. Patch panel with modules
US7200929B2 (en) * 2004-03-31 2007-04-10 Adc Telecommunications, Inc. Patch panel with modules
US7220145B2 (en) * 2004-04-14 2007-05-22 Tyco Electronics Corporation Patch panel system
CN2760820Y (zh) * 2004-12-01 2006-02-22 富士康(昆山)电脑接插件有限公司 电子卡连接器固持结构
TWI256990B (en) * 2005-04-13 2006-06-21 Coretronic Corp Light bulb module
US7393249B2 (en) * 2006-04-21 2008-07-01 Trompeter Electronics, Inc. Interconnection and monitoring module
CN1988681B (zh) * 2006-12-04 2010-05-19 烽火通信科技股份有限公司 一种前后错层的双面插板背板
DE102007003250B3 (de) 2007-01-23 2008-06-26 Adc Gmbh Leiterplattensteckverbinder und Anschlussmodul mit Leiterplattensteckverbinder
TWI373706B (en) * 2008-06-27 2012-10-01 Delta Electronics Inc Power supply and module power connection interface thereof
US7876995B2 (en) * 2008-10-29 2011-01-25 Commscope, Inc. Of North Carolina Telecommunications patching systems with obliquely-angled patching modules
AU2009200824A1 (en) * 2009-03-03 2010-09-23 Tyco Electronics Services Gmbh Consolidation point enclosure
US8315059B2 (en) * 2010-06-03 2012-11-20 Super Micro Computer Inc. Screw less fixing assembly for interface card
US9274548B2 (en) * 2013-03-01 2016-03-01 Seagate Technology Llc Electronic apparatus comprising backplane and methods of assembling and disassembling
US9606317B2 (en) * 2014-06-17 2017-03-28 Ortronics, Inc. Media patching system
US9257788B1 (en) * 2015-01-23 2016-02-09 Oracle International Corporation Connector retention and alignment assembly for use in computer and data storage mounting racks
ES2583636B1 (es) 2015-03-20 2017-06-29 Te Connectivity Amp España, S.L.U. Conector con caja de enlace separable
ES2584540B1 (es) 2015-03-27 2017-07-05 Te Connectivity Amp España, S.L.U. Pestillo para conector de telecomunicaciones
US10777953B2 (en) 2016-08-15 2020-09-15 Commscope Technologies Llc Connector assembly with grounding
CN110771176B (zh) 2017-06-19 2023-01-13 康普技术有限责任公司 用于接插面板的高密度边框
US11356752B2 (en) 2017-11-10 2022-06-07 Commscope Technologies Llc Telecommunications panel with grounding wire
WO2019094558A1 (en) * 2017-11-10 2019-05-16 Commscope Technologies Llc Telecommunications panel with patching device installation features
CN115023032B (zh) * 2022-08-09 2022-10-21 江苏泽宇智能电力股份有限公司 一种智慧变电站用全封闭式高带宽通信板卡

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Also Published As

Publication number Publication date
DE60040731D1 (de) 2008-12-18
ZA200108799B (en) 2003-02-12
JP4511054B2 (ja) 2010-07-28
AU4081200A (en) 2000-11-02
US20020119681A1 (en) 2002-08-29
JP2002542600A (ja) 2002-12-10
CA2370263C (en) 2009-12-22
ATE413775T1 (de) 2008-11-15
US6345986B1 (en) 2002-02-12
TW463419B (en) 2001-11-11
HK1042006B (zh) 2009-02-27
HK1042006A1 (en) 2002-07-26
BR0009777A (pt) 2002-01-08
MXPA01010471A (es) 2002-05-06
WO2000064194A1 (en) 2000-10-26
CA2370263A1 (en) 2000-10-26
US6186798B1 (en) 2001-02-13
EP1173981A1 (en) 2002-01-23
AU770621B2 (en) 2004-02-26
US6623278B2 (en) 2003-09-23
EP1173981B1 (en) 2008-11-05

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Legal Events

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FG Grant, registration