AR020604A1 - Sistema y procedimiento adhesivo para la formacion de uniones pegadas reversibles, y utilizacion para el uso de dicho sistema - Google Patents

Sistema y procedimiento adhesivo para la formacion de uniones pegadas reversibles, y utilizacion para el uso de dicho sistema

Info

Publication number
AR020604A1
AR020604A1 ARP990103512A ARP990103512A AR020604A1 AR 020604 A1 AR020604 A1 AR 020604A1 AR P990103512 A ARP990103512 A AR P990103512A AR P990103512 A ARP990103512 A AR P990103512A AR 020604 A1 AR020604 A1 AR 020604A1
Authority
AR
Argentina
Prior art keywords
reversible
adhesive
formation
component
procedure
Prior art date
Application number
ARP990103512A
Other languages
English (en)
Original Assignee
Daimler Chrysler Ag
Fraunhofer Wolfgang
Henkel Teroson Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daimler Chrysler Ag, Fraunhofer Wolfgang, Henkel Teroson Gmbh filed Critical Daimler Chrysler Ag
Publication of AR020604A1 publication Critical patent/AR020604A1/es

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0033Additives activating the degradation of the macromolecular compound
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08Processes
    • C08G18/10Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08Processes
    • C08G18/16Catalysts
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5046Amines heterocyclic
    • C08G59/5053Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C08G59/5086Triazines; Melamines; Guanamines
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/02Polyureas
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • C09J175/08Polyurethanes from polyethers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28Non-macromolecular organic substances
    • C08L2666/36Nitrogen-containing compounds
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1153Temperature change for delamination [e.g., heating during delaminating, etc.]
    • Y10T156/1158Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

Un sistema adhesivo para la formacion de uniones pegadas reversibles comprende a menos una componente adhesiva polimérica a base de poliuretanos y/opoliureas y/o resinas epoxi y al menos una componente adicional. Dicha componente adicional tiene al menos un grupo funcional activable por aporte de energía,de manera que se produce una reaccion química con la componente adhesiva, con degradacion al menos parcial de la componente adhesiva. La invencion tambiéncomprende un procedimiento para el pegado reversible de objetos y la separacion controlada de la union pegada entre estos objetos, utilizando un sistemaadhesivo segun la invencion.
ARP990103512A 1998-07-21 1999-07-16 Sistema y procedimiento adhesivo para la formacion de uniones pegadas reversibles, y utilizacion para el uso de dicho sistema AR020604A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19832629A DE19832629A1 (de) 1998-07-21 1998-07-21 Klebstoffsystem zur Bildung reversibler Klebeverbindungen

Publications (1)

Publication Number Publication Date
AR020604A1 true AR020604A1 (es) 2002-05-22

Family

ID=7874712

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP990103512A AR020604A1 (es) 1998-07-21 1999-07-16 Sistema y procedimiento adhesivo para la formacion de uniones pegadas reversibles, y utilizacion para el uso de dicho sistema

Country Status (10)

Country Link
US (1) US6764569B1 (es)
EP (1) EP1115770B1 (es)
JP (1) JP2002521512A (es)
KR (1) KR20010071006A (es)
AR (1) AR020604A1 (es)
AT (1) ATE282054T1 (es)
AU (1) AU4906399A (es)
DE (2) DE19832629A1 (es)
ES (1) ES2230867T3 (es)
WO (1) WO2000005288A1 (es)

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DE19924138A1 (de) 1999-05-26 2000-11-30 Henkel Kgaa Lösbare Klebeverbindungen
DE19951599A1 (de) 1999-10-27 2001-05-23 Henkel Kgaa Verfahren zur adhesiven Trennung von Klebeverbunden
DE10037884A1 (de) 2000-08-03 2002-02-21 Henkel Kgaa Verfahren zur beschleunigten Klebstoffaushärtung
DE10037883A1 (de) 2000-08-03 2002-02-14 Henkel Kgaa Ferromagnetische Resonanzanregung und ihre Verwendung zur Erwärmung teilchengefüllter Substrate
DE10163399A1 (de) 2001-12-21 2003-07-10 Sustech Gmbh & Co Kg Nanopartikuläre Zubereitung
FR2837114A1 (fr) * 2002-03-13 2003-09-19 Rescoll Soc Procede de separation commandee des assemblages et revetements colles et produits associes
US20040249042A1 (en) * 2003-06-09 2004-12-09 Motorola, Inc. Microwave removable coating
GB0406015D0 (en) * 2004-03-17 2004-04-21 Dynal Biotech Asa Improvements in magnetic polymer particles
US8070994B2 (en) 2004-06-18 2011-12-06 Zephyros, Inc. Panel structure
JP5173166B2 (ja) * 2006-08-14 2013-03-27 スリーエム イノベイティブ プロパティズ カンパニー 粘着性フィルム剥離方法
US7878494B1 (en) 2007-05-29 2011-02-01 Volkert John K Making magazine pop-up formats
EP2062926A1 (de) * 2007-11-21 2009-05-27 Sika Technology AG Polyurethanpolymer für reversible Klebeverbindungen
JP2009216208A (ja) * 2008-03-12 2009-09-24 Jtekt Corp 軸受装置及びその製造方法
GB0806434D0 (en) 2008-04-09 2008-05-14 Zephyros Inc Improvements in or relating to structural adhesives
DE102008036713A1 (de) 2008-08-07 2010-02-11 Technische Universität Carolo-Wilhelmina Zu Braunschweig Verfahren zum Trennen zweier über zumindest eine Klebschicht miteinander verklebter Objekte
DE102009019484B4 (de) 2009-05-04 2015-12-17 Airbus Defence and Space GmbH Kombination der Effekte von Expansionsstoffen und chemischen Abbaureagenzien für lösbare Klebeverbindungen
GB0916205D0 (en) 2009-09-15 2009-10-28 Zephyros Inc Improvements in or relating to cavity filling
DE102010001987A1 (de) 2010-02-16 2011-08-18 Evonik Röhm GmbH, 64293 Funktionsmaterialien mit reversibler Vernetzung
DE102010001992A1 (de) 2010-02-16 2011-08-18 Evonik Röhm GmbH, 64293 Funktionsmaterialien mit steuerbarer Viskosität
BR112012022319B1 (pt) 2010-03-04 2020-01-28 Zephyros Inc laminado estrutural compósito
DE102010040282A1 (de) 2010-09-06 2012-03-08 Evonik Röhm Gmbh Funktionsmaterialien mit steuerbarer Viskosität bzw. reversibler Vernetzung über Aza-Diels-Alder-Reaktionen mit Bishydrazonen oder konjugierten Bis-Schiff'schen Basen
DE102010044025A1 (de) 2010-11-17 2012-05-24 Evonik Röhm Gmbh Materialien mit steuerbarem Vernetzungsgrad
WO2013034777A2 (de) 2011-09-08 2013-03-14 Ivoclar Vivadent Ag Dentalmaterialien auf basis von monomeren mit debonding-on-demand eigenschaften
DE102012222742A1 (de) 2012-12-11 2014-03-27 Evonik Industries Ag Funktionsmaterialien mit reversibler Vernetzung
EP3024871B1 (en) 2013-07-26 2022-12-07 Zephyros Inc. Thermosetting adhesive films including a fibrous carrier
JP6346770B2 (ja) * 2014-04-02 2018-06-20 旭化成株式会社 解体性接着剤組成物
EP2965740A1 (de) 2014-07-11 2016-01-13 Ivoclar Vivadent AG Dentalmaterialien mit Debonding-on-Demand-Eigenschaften
GB201417985D0 (en) 2014-10-10 2014-11-26 Zephyros Inc Improvements in or relating to structural adhesives
DE102015007470A1 (de) 2015-06-10 2015-12-10 Daimler Ag Verfahren zum Herstellen einer Welle-Nabe-Verbindung
ES2759899T3 (es) 2015-10-13 2020-05-12 Ivoclar Vivadent Ag Composiciones polimerizables a base de compuestos térmicamente escindibles
EP3199575A1 (de) 2016-01-29 2017-08-02 Evonik Degussa GmbH Neuartiger hetero-diels-alder-vernetzer und deren verwendung in reversibel vernetzenden polymersystemen
EP3296347A1 (de) 2016-09-20 2018-03-21 Evonik Degussa GmbH Neuartiger dien-baustein für die verwendung in reversibel vernetzenden (hetero-)diels-alder-polymersystemen
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Also Published As

Publication number Publication date
US6764569B1 (en) 2004-07-20
ES2230867T3 (es) 2005-05-01
ATE282054T1 (de) 2004-11-15
WO2000005288A1 (de) 2000-02-03
KR20010071006A (ko) 2001-07-28
DE19832629A1 (de) 2000-02-03
EP1115770B1 (de) 2004-11-10
EP1115770A1 (de) 2001-07-18
AU4906399A (en) 2000-02-14
DE59911057D1 (de) 2004-12-16
JP2002521512A (ja) 2002-07-16

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