WO2023135624A1

WO2023135624A1 - Semiconductor-component-separating device and semiconductor component separation and attachment method using same

Info

Publication number: WO2023135624A1
Application number: PCT/JP2022/000461
Authority: WO
Inventors: 藤田隆雄; 久保剛志; 鈴木智明; 敬太竹山; 田中健之; 和田重雄
Original assignee: デンオン機器株式会社
Priority date: 2022-01-11
Filing date: 2022-01-11
Publication date: 2023-07-20
Also published as: JP7451001B2; JPWO2023135624A1

Abstract

Provided is a semiconductor-component-separating device in which a semiconductor component mounted on an electronic circuit board can be automatically removed from the electronic circuit board in a reusable form without destruction. Provided are a method for separating the semiconductor component from the electronic circuit board and a method for attaching the semiconductor component to the electronic circuit board using the semiconductor separating device. The semiconductor-component-separating device comprises: a heating mechanism that performs heating of the semiconductor component mounted on the electronic circuit board from the upper side of the semiconductor component; a removal jig; a jig insertion mechanism that inserts the removal jig between the electronic circuit board and the semiconductor component; and a jig lifting mechanism that performs a lifting operation of the removal jig inserted between the electronic circuit board and the semiconductor component in the upward direction of the electronic circuit board in a state with the semiconductor component supported on the upper side. Provided are a method for separating the semiconductor component from the electronic circuit board and a method for attaching the semiconductor component to the electronic circuit board using the semiconductor-component-separating device.

Description

Semiconductor component separation device and semiconductor component separation and mounting method using the same

The present invention relates to a semiconductor component separating device and a semiconductor component separating and mounting method using the same.

Various proposals have been made for semiconductor component separation equipment.

For example, in Patent Document 1, a semiconductor component having a package structure of Ball Grid Array (BGA) mounted on a printed wiring board substrate, for example, an IC such as a semiconductor integrated circuit or a semiconductor device, has an adverse effect on surrounding electronic components. A method for repairing a semiconductor device has been proposed, which eliminates the risk of causing damage to the semiconductor device and enables efficient removal from the printed wiring board substrate.

A heat transfer plate having good heat conductivity and having a larger area than the upper surface of the semiconductor component to be peeled off is adhered to the entire upper surface of the semiconductor component using a thermosetting resin, and the heater tool is pressed against the heat transfer plate. This heats the heat transfer plate and the semiconductor component, softens the underfill, melts the solder, and cures the thermosetting resin. With the thermosetting resin cured in this way, a stripping tool is engaged with the protruding portion of the heat transfer plate that protrudes outward from the upper surface of the semiconductor component, and the heat transfer plate is integrated with the semiconductor component and removed from the printed wiring board. It is peel off.

In addition, in Patent Document 2, IC chips (semiconductor parts) such as a BGA structure CPU (Central Processing Unit) and MCP (Multi Chip Package) mounted on a printed wiring board are printed without damaging them. A semiconductor component separating method has been proposed for separating from a wiring board substrate.

A linear member having a diameter of 50% to 90% of the distance between the semiconductor component to be separated and the substrate is brought into contact with the end of the resin material placed between the substrate and the semiconductor component and the substrate. The solder and the resin material arranged between are softened. The linear member is moved along the surface of the substrate while being in contact with the end of the resin material. When the linear member is moved along the surface of the substrate, the linear member in contact with the end of the resin material is pressed against the substrate.

JP 2006-303266 A JP 2016-119336 A

When semiconductor components such as semiconductor integrated circuits are mounted on substrates such as printed wiring board substrates, a Ball Grid Array (BGA) structure may be adopted. When mounted in a BGA structure, the board and the semiconductor component are generally connected and fixed by solder balls and resin (underfill).

In addition, in integrated circuits that include a two-tiered structure such as a surface-mounted Package On Package (POP) structure soldered to an electronic circuit board, electrodes are arranged on the bottom surface of the semiconductor component. FIG. 1 shows an example of a state in which a plurality of electrodes 6 are arranged on the bottom surface of a semiconductor component 2. As shown in FIG.

As described above, various proposals have been made for methods of separating a semiconductor component such as a semiconductor integrated circuit mounted on a board such as a printed wiring board from the board.

However, even today, it is not easy to separate semiconductor components mounted on a board from the board.

For example, in the case of the POP structure described above, it is difficult to directly approach the bumps, which are the solder joints, from the outside with a soldering iron or the like.

When a shock or the like is applied from the outside to the solder joints 3 between the substrate 1 such as a printed wiring board substrate and the semiconductor component 2 such as a semiconductor integrated circuit, the solder joints 3 are damaged as shown in FIG. There is a possibility that a crack 4 or the like will occur in the connection, resulting in poor connection.

Therefore, in the BGA structure, an underfill (sealing material) 5 is filled in the gap between the soldered semiconductor component 2 and the substrate 1, as shown in FIG.

The underfill 5 protects the connection of the semiconductor component 2 and makes it resistant to impact. However, if the semiconductor component 2 needs to be replaced due to a defect in the semiconductor component 2 or the like, the presence of the underfill 5 makes replacement work unnecessary. it won't be easy.

For example, when heat is applied, the solder becomes liquid due to thermal melting, but the underfill softens slightly even when heated, but does not soften to the point where the semiconductor component can be easily peeled off.

For this reason, in addition to heating, it is necessary to destroy the underfill by a mechanical method when replacing semiconductor parts as described above.

As described above, various proposals have been made in the past, but at present, after heating, as shown in FIG. This is a realistic removal method.

However, such manual removal requires a sensory sense and advanced skill acquisition by the operator. For this reason, it has become necessary to select a person who can do the work.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a semiconductor component separating apparatus capable of automatically removing semiconductor components mounted on an electronic circuit board from the electronic circuit board in a reusable manner without destroying them. ing. Another object of the present invention is to propose a semiconductor component separating method and a semiconductor component mounting method using the semiconductor component separating apparatus described above.

The present invention includes aspects exemplified below.
[1]
a heating mechanism for heating a semiconductor component mounted on an electronic circuit board from above the semiconductor component;
a removal jig;
a jig insertion mechanism for inserting the removal jig between the electronic circuit board and the semiconductor component;
The removal jig inserted between the electronic circuit board and the semiconductor component is a jig for moving the electronic circuit board upward while supporting the semiconductor component upward. A semiconductor component separating apparatus comprising: a tool lifting mechanism;
[2]
The semiconductor component separating apparatus according to [1], further comprising an angle adjusting mechanism for adjusting an angle at which the removing jig is inclined with respect to the semiconductor component.
[3]
When the removal jig is inserted between the electronic circuit board and the semiconductor component by the jig insertion mechanism, the semiconductor component is mounted on the side facing the semiconductor component into which the removal jig is inserted. The semiconductor component separating apparatus according to [1] or [2], further comprising a semiconductor component supporting mechanism for supporting the semiconductor component so that the component does not move.
[4]
The semiconductor component separation according to any one of [1] to [3], wherein a first heating mechanism for heating the removal jig and adjusting the heating state of the removal jig is attached to the removal jig. Device.
[5]
In a state in which the removal jig supports the semiconductor component on the upper side, the semiconductor component is moved with the removal jig in cooperation with the removal jig when the lifting operation is performed by the jig elevating mechanism. The semiconductor component separating apparatus according to any one of [1] to [4], further comprising a semiconductor component holding mechanism that performs the lifting operation while holding the semiconductor component between the two.
[6]
The semiconductor component separating apparatus according to [5], wherein the semiconductor component holding mechanism is a vacuum suction holding mechanism.
[7]
The semiconductor component separating apparatus according to [5], wherein the semiconductor component holding mechanism is a plate-shaped holding mechanism that holds the semiconductor component together with the removal jig.
[8]
The semiconductor component separating apparatus according to [7], wherein the plate-like holding mechanism is provided with a second heating mechanism for heating the plate-like holding mechanism and adjusting the heating state of the plate-like holding mechanism.
[9]
The plate-shaped holding mechanism faces the upper side surface of the semiconductor component with a slight clearance therebetween, and cooperates with the removal jig to hold the semiconductor component by the removal jig. The semiconductor component separation device of [7] held between.
[10]
The semiconductor component separating apparatus according to any one of [1] to [9], wherein the heating of the semiconductor component by the heating mechanism is local heating in a range equivalent to the size of the semiconductor component.
[11]
The temperature state of the electronic circuit board at the position where the semiconductor component being heated is mounted is adjusted from the lower surface side of the electronic circuit board at the position where the semiconductor component being heated is mounted. The semiconductor component separating apparatus according to any one of [1] to [10], further comprising a temperature adjusting mechanism for controlling the temperature.
[12]
The semiconductor component separating apparatus according to [11], wherein the temperature adjusting mechanism is a second heating mechanism that heats the electronic circuit board from below at a position where the heated semiconductor component is mounted.
[13]
The semiconductor component separating apparatus according to [11], wherein the temperature adjusting mechanism is a cooling mechanism that provides a cooling effect to the electronic circuit board at a position where the heated semiconductor component is mounted.
[14]
The semiconductor component separating apparatus according to [13], wherein the cooling mechanism is an air cooling mechanism that blows air from below to the electronic circuit board at the position where the heated semiconductor component is mounted.
[15]
The semiconductor component separation apparatus of [13], wherein the cooling mechanism is a heat radiation cooling mechanism that is attached from below to the electronic circuit board at the position where the semiconductor component being heated is mounted and performs cooling by heat radiation. .
[16]
The semiconductor component separating apparatus according to any one of [1] to [15], further comprising a third heating mechanism for heating the lower surface side of the electronic circuit board.
[17]
Using the semiconductor component separation apparatus according to any one of [1] to [16], while heating the semiconductor component to be removed mounted on the electronic circuit board from above, the removal jig is moved to the object to be removed. and the electronic circuit board, and removing the semiconductor component to be removed from the electronic circuit board by lifting the removing jig.
[18]
a step of removing solder and underfill residue on the board-side pattern surface after removal of the semiconductor component in the electronic circuit board after removal of the semiconductor component;
a step of performing solder printing or solder transfer onto a new semiconductor component newly attached to the board-side pattern surface of the electronic circuit board in place of the semiconductor component removed from the electronic circuit board; and/or
a step of performing solder printing or dispensing supply on the board-side pattern surface of the electronic circuit board;
a step of aligning the board-side pattern of the electronic circuit board with the electrode of the new semiconductor component;
A method of attaching a semiconductor component to an electronic circuit board, comprising the step of heating the new semiconductor component after alignment using the semiconductor component separating apparatus according to any one of [1] to [16].

According to the present invention, it is possible to provide a semiconductor component separating apparatus capable of automatically removing a semiconductor component mounted on an electronic circuit board from the electronic circuit board in a reusable form without destroying it. Further, according to the present invention, it is possible to provide a semiconductor component separating method and a semiconductor component mounting method using the above-described semiconductor component separating apparatus.

FIG. 2 is a diagram showing an example of a state in which a plurality of electrodes are arranged on the lower surface of a semiconductor component in a surface-mount package-on-package (POP) structure soldered to an electronic circuit board; FIG. 4 is a partially omitted cross-sectional view illustrating a state in which a crack is generated in a soldered joint between a substrate and a semiconductor component due to external impact or the like being applied to the soldered joint; FIG. 10 is a view for explaining how a semiconductor component is manually removed from a substrate using a thin hard metal with a thin tip such as tweezers; 1 is a partially omitted side view showing an example of the overall configuration of a semiconductor component separating apparatus according to an embodiment of the present invention; FIG. FIG. 4 is a partially omitted front view for explaining an example of each operation of a jig insertion mechanism, a semiconductor component holding mechanism, and a semiconductor component support mechanism in the semiconductor component separating apparatus according to the embodiment of the present invention; FIG. 4 is a partially omitted front view for explaining another example of each operation of the jig insertion mechanism, the jig lifting mechanism, the semiconductor component holding mechanism, and the semiconductor component support mechanism in the semiconductor component separating apparatus according to the embodiment of the present invention; In the semiconductor component separating apparatus according to the embodiment of the present invention, the removal jig moves to be inserted between the substrate and the semiconductor component to be removed mounted on the substrate. The top view which abbreviate|omitted one part to demonstrate. 1 is a partially omitted side view for explaining an example of a structure in which a first heating mechanism is attached to a removal jig in a semiconductor component separating apparatus according to an embodiment of the present invention; FIG. FIG. 4 is a conceptual diagram explaining the mechanism of occurrence of solder flash or the like that may occur when removing a semiconductor component from a substrate;

The semiconductor component separating apparatus of this embodiment includes a heating mechanism 7 and a semiconductor component removing mechanism 9 having a removing jig 8 .

The heating mechanism 7 heats the semiconductor component 2 to be removed mounted on the electronic circuit board 1 from above the semiconductor component 2 and is present between the electronic circuit board 1 and the semiconductor component 2. A heating means that heats the solder until it exceeds its melting point. The heating of the semiconductor component 2 to be removed by the heating mechanism 7 is local heating in a range equivalent to the size of the semiconductor component 2 . 4 to 6 exemplify a semiconductor component having a surface-mounted POP structure soldered to the electronic circuit board 1. As shown in FIG. Therefore, in FIGS. 4 to 6, each semiconductor component is represented by

reference numerals

2a, 2b, and 2c, respectively. They may be collectively indicated as "semiconductor component 2".

The above-described local heating of the semiconductor component 2 to be removed by the heating mechanism 7 heats the semiconductor component 2 to be removed from above, and the semiconductor component 2 to be removed and the electronic circuit board 1 are heated. The solder is heated to a temperature above its melting point.

The underfill existing between the semiconductor component 2 to be removed and the electronic circuit board 1 is heated to a predetermined temperature by the above-described heating by the heating mechanism 7, depending on the type of the underfill. soften to some extent.

Heat sources such as hot air, infrared rays, and lasers can be used as the heating mechanism 7 described above. Regardless of which heat source is used as the heating mechanism 7, local heating is performed from above within a range equivalent to the size of the semiconductor component 2 to be removed for a predetermined heating time. As a result, the semiconductor component 2 to be removed is heated while minimizing the heat transfer to other components existing around the semiconductor component 2 .

The temperature profile conditions necessary for performing the above-described local heating are the electronic circuit board 1, the semiconductor component 2 to be removed, the solder existing between the electronic circuit board 1 and the semiconductor component 2 to be removed, and the underlayer. It is possible to set in advance based on the properties of the fill and cause the heating mechanism 7 consisting of a heat source such as hot air, infrared rays, or laser to perform the above-described local heating under the control of a control means (not shown).

As described above, when the semiconductor component 2 to be removed is locally heated from above using the heating mechanism 7 composed of various heat sources such as hot air, infrared rays, and laser, as described later, In addition, a mechanism for temperature control (heating or cooling) from the lower surface of the electronic circuit board 1 can be combined.

The thickness of the tip of the removal jig 8 (the vertical size of the tip of the removal jig 8 in FIGS. 4 and 8) is thin enough to be inserted between the electronic circuit board 1 and the semiconductor component 2. It is a thin plate-like or needle-like jig. As shown in FIGS. 4 to 6, at least the thickness in the vertical direction in the drawing at the tip of the thin plate-like or needle-like removal jig 8 is equal to that of the semiconductor component 2 mounted on the electronic circuit board 1. It is thin enough to be inserted into the vertical gap formed between the lower side surface of the electronic circuit board 1 and the upper side surface of the electronic circuit board 1 .

A thin plate-like or needle-like removal jig 8 is inserted between the electronic circuit board 1 and the semiconductor component 2 in the direction indicated by the arrow 30 in FIGS. The width of the removal jig 8, which is the size in the direction perpendicular to the insertion direction, is determined by the size of the components arranged on the electronic circuit board 1 around the semiconductor component 2 to be removed and the semiconductor component 2 to be removed. On the other hand, it is determined according to the size of the gap to be approached in the direction indicated by the arrow 30 .

As shown in FIG. 7, minute chip parts 10 such as 0402 parts (0.4 mm×0.2 mm) are often mounted without gaps around the semiconductor parts 2 to be removed. Therefore, when the removal jig 8 passes between the vertically mounted 0402 components adjacent to each other and accesses the semiconductor component 2 to be removed in the direction indicated by the arrow 30, the removal jig 8 The width is less than 0.2 mm because it corresponds to 0.2 mm when the 0402 component (0.4 mm x 0.2 mm) is vertically mounted + mounting clearance width (gap between adjacent chip components 10). Something becomes desirable. However, if the environment of peripheral components permits, a wider width than this may be used.

In this way, the thin plate-like or needle-like removal jig 8 with a thin tip and a small width is inserted between the electronic circuit board 1 and the semiconductor component 2 to be removed, as will be described later. When removing the semiconductor component 2 from the electronic circuit board 1, a large force is applied. Therefore, it is desirable to use a hard metal that can withstand this.

The above-described heating by the heating mechanism 7 can raise the temperature of the solder existing between the semiconductor component 2 to be removed and the electronic circuit board 1 to a temperature exceeding the melting point. On the other hand, similarly, it is conceivable that the underfill existing between the semiconductor component 2 to be removed and the electronic circuit board 1 is only softened to some extent. For this reason, an operation of inserting a removal jig 8, which will be described later, between the electronic circuit board 1 and the semiconductor component 2 to be removed, and an operation of lifting the semiconductor component 2 while supporting it on the removal jig 8, which will be described later. Thus, the underfill is completely destroyed in order to remove the semiconductor component 2 to be removed from the electronic circuit board 1 .

In consideration of these points, the removal jig 8 is inserted between the electronic circuit board 1 and the semiconductor component 2 to be removed, and is used when removing the semiconductor component 2 to be removed from the electronic circuit board 1. It is desirable to use a hard metal that can withstand the large force to which it is subjected.

The semiconductor component removal mechanism 9 includes a jig insertion mechanism and a jig elevating mechanism.

The jig insertion mechanism is a mechanism that moves the removal jig 8 in the direction indicated by the arrow 30 (FIG. 5) and inserts the removal jig 8 between the electronic circuit board 1 and the semiconductor component 2b.

The jig elevating mechanism moves the removal jig 8 inserted between the electronic circuit board 1 and the semiconductor component 2b as shown in FIG. is a mechanism for causing the electronic circuit board 1 to move upward. After the lifting operation, the removal jig 8 is moved in the direction indicated by the arrow 30 by the jig insertion mechanism and removed to the position where the operation of inserting it between the electronic circuit board 1 and the semiconductor component 2b is performed. It is a mechanism that causes the jig 8 to move downward.

A linear drive type jig insertion mechanism and jig lifting mechanism can be used as the jig insertion mechanism and jig lifting mechanism. If it is a linear drive system, precision and high rigidity can be exhibited.

Therefore, even if the removing jig 8 receives a large force when it is inserted between the electronic circuit board 1 and the semiconductor component 2b, it is possible to prevent problems such as deformation of the semiconductor component removing mechanism 9 from occurring. .

Further, by adopting a precise and highly rigid linear drive type jig insertion mechanism and jig elevating mechanism, the removal jig 8 is inserted in the direction of arrow 30 and lifted in the direction of arrow 31. At the time, it can be performed while maintaining the insertion angle and height of the removal jig 8 . Since the removal jig 8 can be inserted in the direction of arrow 30 and raised in the direction of arrow 31 while maintaining the insertion angle and height of the removal jig 8, the tip side of the removal jig 8 tilts toward the electronic circuit board 1 side. It is also possible to prevent the possibility of damaging the electronic circuit board 1 due to deformation or the like.

A jig elevating mechanism based on a linear driving method can be one that performs the lifting and lowering operations of the removal jig 8 described above by a sliding method.

The semiconductor component removal mechanism 9 may further include an angle adjustment mechanism that adjusts the angle at which the removal jig 8 is inclined with respect to the semiconductor component 2 to be removed.

In the embodiment shown in FIG. 6, the base end of the removal jig 8 is rotatably supported by a rotation support shaft 11 extending parallel to the upper plane of the electronic circuit board 1. In the embodiment shown in FIG. 6, a linear drive mechanism (not shown) allows the removal jig 8 to rotate around the rotation support shaft 11 as indicated by

arrows

32a and 32b in FIG. there is This provides an angle adjustment mechanism for adjusting the angle at which the removal jig 8 is inclined with respect to the semiconductor component 2 to be removed. Since the angle at which the removal jig 8 is inclined with respect to the semiconductor component 2 to be removed is adjusted, the angle adjustment mechanism described above is used to adjust the angle between the electronic circuit board 1 and the semiconductor component 2 to be removed. It also adjusts the insertion angle of the removal jig 8 for inserting the tip into the gap.

When the mounting density of peripheral components such as fine chip components 10 around the semiconductor component 2 to be removed is high, the height of the peripheral components may interfere with the removal jig 8 .

By providing the above-described angle adjustment mechanism, in such a case, the angle at which the removal jig 8 is inclined with respect to the semiconductor component 2 to be removed is adjusted so as to avoid interference due to the height of the peripheral components. It can be adjusted and work according to the implementation environment.

Also, with this angle adjustment mechanism, the insertion angle for inserting the tip of the removal jig 8 into the gap between the electronic circuit board 1 and the semiconductor component 2 to be removed can be adjusted to an appropriate insertion angle. As the insertion angle becomes closer to horizontal with respect to the electronic circuit board 1 as shown in FIG. Easier to get in.

If there is no problem with interference of peripheral parts or workability, the semiconductor component removal mechanism 9 can be configured without an angle adjustment mechanism.

The angle adjustment mechanism is not limited to the one described above, and various mechanisms and configurations can be used as long as the angle at which the removal jig 8 is inclined with respect to the semiconductor component 2 to be removed can be adjusted as described above. can be adopted.

The semiconductor component separation apparatus of this embodiment can be configured to further include a semiconductor component support mechanism 12 .

As shown in FIGS. 4 and 5, the semiconductor component support mechanism 12 is configured so that the removal jig 8 is inserted between the electronic circuit board 1 and the semiconductor component 2 by the jig insertion mechanism. supports the semiconductor component 2 so that the semiconductor component 2 does not move on the side opposite to the side of the semiconductor component 2 into which is inserted.

When the removal jig 8 is inserted between the electronic circuit board 1 and the semiconductor component 2 by the jig insertion mechanism, if the pushing force escapes, the tip of the removal jig 8 smoothly inserts the electronic circuit board 1 and the semiconductor component. Sometimes you can't get in between 2.

In order to prevent such a phenomenon from occurring, when the removal jig 8 is inserted between the electronic circuit board 1 and the semiconductor component 2 by the jig insertion mechanism, a As shown, the semiconductor component support mechanism 12 is arranged on the opposite side of the semiconductor component 2 to be removed.

By further providing such a semiconductor component support mechanism 12, when the removal jig 8 is pushed in the direction indicated by the arrow 30, the electronic circuit board 1 is simultaneously displaced in the direction indicated by the arrow 30. can be prevented.

Further, since the removing jig 8 is pushed between the electronic circuit board 1 and the semiconductor component 2 , even after the semiconductor component 2 has been removed from the electronic circuit board 1 , the removed semiconductor component 2 is shown by the arrow 30 . Moving together can be reliably prevented by the removal jig 8 that continues to move in the direction. Therefore, the removed semiconductor component 2 is moved together with the removal jig 8 that continues to move in the direction of the arrow 30, thereby preventing contact with peripheral components located on the opposite side of the semiconductor component 2 to be removed. However, it is possible to prevent secondary misalignment of peripheral parts.

It should be noted that at least the portion of the semiconductor component support mechanism 12 that contacts the semiconductor component 2 is desirably made of a material with a low specific heat.

As described above, the heating mechanism 7 locally heats the semiconductor component 2 to be removed. If heat is taken away from the semiconductor component 2, a temperature difference will occur in the heat distribution of the semiconductor component 2, which may affect removal.

Such a possibility can be prevented by forming at least the portion of the semiconductor component support mechanism 12 that contacts the semiconductor component 2 with a material having a small specific heat.

In the semiconductor component separating apparatus of this embodiment described above, the first heating mechanism 13 can be attached to the removing jig 8 as shown in FIG.

The first heating mechanism 13 heats the removal jig 8 and adjusts the heating state of the removal jig 8 .

As described above, even if the semiconductor component 2 to be removed is locally heated from above by the heating mechanism 7, the softened state of the underfill may be uncertain. For example, there is a difference in the softening temperature depending on the type of underfill material, and slight individual differences in the case of performing a plurality of amounts of work make the softening state of the underfill uncertain.

If the softening of the underfill is insufficient, it may be difficult to push the tip of the removal jig 8 between the electronic circuit board 1 and the semiconductor component 2 and insert it.

As described above, the removal jig 8 is provided with the first heating mechanism 13 for heating the removal jig 8 and adjusting the heating state of the removal jig 8 . It is heated and its heating state is adjusted. As a result, the solder and underfill in the semiconductor component 2 to be removed are also heated via the removal jig 8, and their heating states are adjusted. Therefore, it becomes possible to easily insert the tip of the removing jig 8 by pushing it between the electronic circuit board 1 and the semiconductor component 2 while destroying the underfill.

As a result, the semiconductor component 2 to be removed can be more reliably and efficiently removed from the electronic circuit board 1, and work efficiency can be improved.

The first heating mechanism 13 heats the removing jig 8 and adjusts the heating state of the removing jig 8 under the control of a control means (not shown) provided in the semiconductor component separating apparatus. .

The position where the first heating mechanism 13 is attached to the removal jig 8 is not limited to the position illustrated in FIG. It can be attached to the removal jig 8 at various possible positions.

As described above, the heating mechanism 7 locally heats the semiconductor component 2 to be removed from above, so that the solder melts and the underfill softens in the semiconductor component 2 to be removed. If it is sufficiently observed, the semiconductor component 2 can be removed without performing the above-described heating adjustment by the first heating mechanism 13 . Therefore, a semiconductor component separating apparatus in which the removal jig 8 is not provided with the first heating mechanism 13 can also be used.

The semiconductor component separating apparatus of this embodiment described above can be configured to further include a semiconductor component holding mechanism.

As shown in FIG. 6, the semiconductor component holding mechanism lifts the semiconductor component 2b to be removed by the jig lifting mechanism described above in the direction indicated by the arrow 31 while the removal jig 8 is supporting the semiconductor component 2b to be removed from above as shown in FIG. 2, the semiconductor component 2 to be removed is held between the removal jig 8 and the removal jig 8, and is lifted in the direction indicated by the arrow 31. As shown in FIG.

This semiconductor component holding mechanism can be the vacuum suction holding mechanism 14 shown in FIG. In a state where the removal jig 8 supports the semiconductor component 2b to be removed upward as shown in FIG. The semiconductor component 2 is vacuum-sucked by the vacuum suction holding mechanism 14, and while holding the semiconductor component 2 to be removed between the removal jig 8 in cooperation with the removal jig 8, the upward movement in the direction indicated by the arrow 31 is performed. It is something to do.

As shown in FIG. 6, the above-described semiconductor component holding mechanism is a flat plate that holds the semiconductor component 2 to be removed between itself and the removal jig 8 in cooperation with the removal jig 8. It can also be a shape-retaining mechanism. The flat plate-shaped holding mechanism can be made of metal or synthetic resin.

6, the plate-like plate-like holding mechanism 15 shown in FIG. It faces and holds the semiconductor component 2 between itself and the removal jig 8 in cooperation with the removal jig 8 .

The lower surface of the flat plate-like holding mechanism 15 and the upper surface of the semiconductor component 2 to be removed are opposed to each other with a small clearance 16 interposed therebetween, so that the removal jig 8 can hold the semiconductor component to be removed. As shown in FIG. 6, in a state where the semiconductor component 2b is supported upward, the removal jig 8 cooperates with the removal jig 8 to remove the semiconductor component 2 to be removed when performing the upward movement in the direction indicated by the arrow 31. While being held between , the upward movement in the direction indicated by the arrow 31 can be performed. The size of the clearance 16 is set within a range that allows such operation.

Although not shown, the lower surface of the plate-like holding mechanism 15 directly contacts the upper surface of the semiconductor component 2 to be removed without the clearance 16 as shown in FIG. It is also possible to use a plate-like plate-like holding mechanism as described above.

In addition, in this manner, the lower surface of the plate-like plate-like holding mechanism directly abuts the upper surface of the semiconductor component 2 to be removed, and the semiconductor component 2 to be removed is held in cooperation with the removal jig 8 . In the case of a plate-shaped holding mechanism that holds between the removal jig 2, the plate-shaped holding mechanism is heated and a second heating mechanism (non ) can be provided in the plate-shaped holding mechanism.

A second heating mechanism (not shown) heats the plate-like plate-like holding mechanism described above and heats the plate-like plate-like holding mechanism under the control of a control means (not shown) provided in the semiconductor component separating apparatus. adjust the state.

When the lower side surface of the flat plate-shaped holding mechanism directly abuts the upper side surface of the semiconductor component 2 to be removed, heat is taken from the semiconductor component 2 to be removed, and the heating mechanism 7 heats the removal. If the solder or underfill existing between the target semiconductor component 2 and the electronic circuit board 1 hardens, it may become difficult to remove.

As shown in FIG. 6, if there is a slight clearance 16, this problem does not occur, but the lower surface of the plate-like plate-like holding mechanism does not allow the semiconductor component 2 to be removed to be removed. When the plate-like holding mechanism is provided with the above-described second heating mechanism (not shown) in the case of direct contact with the upper surface, such a problem can be prevented.

When the semiconductor component separating apparatus removes the semiconductor component 2 to be removed from the electronic circuit board 1 and raises it, the semiconductor component 2 tilts to the left and right or to the front with respect to the insertion direction of the removal jig 8 indicated by the arrow 30. , there is a risk of contact with peripheral components of the semiconductor component 2 to be removed. In such a case, the semiconductor component 2 to be removed is locally heated from above by the heating means 7, and the heat is transferred to the peripheral components, sometimes resulting in melting of the solder. Therefore, if the semiconductor component 2 moving upward tilts as described above and comes into contact with peripheral components, the peripheral components will be displaced.

By having the semiconductor component holding mechanism described above in the semiconductor component separating apparatus, the possibility of such a problem occurring can be prevented.

As described above, since the semiconductor component separating apparatus is provided with the semiconductor component support mechanism 12, the displacement of the semiconductor component 2 in the direction indicated by the arrow 30 in which the removing jig 8 faces the semiconductor component 2 is suppressed. can do.

When the semiconductor component holding mechanism moves upward in the direction indicated by an arrow 31 with the removal jig 8 supporting the semiconductor component 2b to be removed upward as shown in FIG. While holding the semiconductor component 2 to be removed between the removal jig 8 and the removal jig 8 in cooperation with the removal jig 8 , the lifting operation is performed in the direction indicated by the arrow 31 . As a result, when the semiconductor component 2 to be removed is removed from the electronic circuit board 1 and lifted while being supported by the removal jig 8, the direction of insertion of the removal jig 8 indicated by the above-described arrow 30 can be shifted leftward or rightward with respect to the insertion direction. It is possible to prevent the semiconductor component 2 from tilting forward.

When the semiconductor component holding mechanism is the above-described vacuum suction holding mechanism 14 (FIG. 5), the semiconductor component 2 to be removed is lowered from above, and lifted together with the removal jig 8 while sucking and holding the semiconductor component 2. It can be in the form of

It is sucked and held by the vacuum suction holding mechanism 14. Therefore, by inserting the removal jig 8 between the electronic circuit board 1 and the semiconductor component 2 to be removed, or by lifting the semiconductor component 2 while supporting it on the removal jig 8, the object to be removed can be removed. The suction force from the vacuum suction holding mechanism 14 also acts on the complete destruction of the underfill for removing the semiconductor component 2 from the electronic circuit board 1 .

The vacuum suction holding mechanism 14 (FIG. 5) waits at a position that does not interfere with the local heating of the semiconductor component 2 to be removed by the heating mechanism 7, and the heating from the heating mechanism 7 reaches the solder melting temperature. The vacuum suction holding mechanism 14 may be lowered from above the semiconductor component 2 before or after the solder is melted.

When the semiconductor component holding mechanism is the plate-shaped holding mechanism described above, the plate-shaped holding mechanism is made to stand by at a position that does not interfere with the local heating of the semiconductor component 2 to be removed by the heating mechanism 7, and the heating is performed. Before reaching the melting temperature of the solder by heating from the mechanism 7 or after the solder has melted, the plate-shaped holding mechanism 15 is lowered from above the semiconductor component 2 to the state shown in FIG. The plate-shaped holding mechanism 15 is lowered until the lower side surface of the semiconductor component 2 abuts against the upper side surface. 6, the removal jig 8 supports the semiconductor component 2b to be removed by the jig elevating mechanism. While holding the semiconductor component 2 to be removed between the removal jig 8 in cooperation with the jig 8 , the semiconductor component 2 to be removed is lifted in the direction indicated by the arrow 31 so that the semiconductor component 2 to be removed is mounted on the electronic circuit board 1 . It is possible to prevent the semiconductor component 2 from tilting leftward, rightward, or frontward with respect to the insertion direction of the removal jig 8 indicated by the above-described arrow 30 when the semiconductor component 2 is lifted while being supported by the removal jig 8 .

In the semiconductor component separating apparatus of this embodiment described above, the heated semiconductor component 2 is mounted from the lower surface side of the electronic circuit board 1 at the position where the heated semiconductor component 2 is mounted. It is possible to adopt a configuration having a temperature adjustment mechanism that adjusts the temperature state of the electronic circuit board 1 at the position where it is located.

The semiconductor components to be removed from the electronic circuit board 1 by using the semiconductor component separating apparatus of this embodiment are mainly integrated circuit components. Integrated circuit components are often filled with underfill in the same manner as the semiconductor components from which they are removed.

When the semiconductor component 2 is removed from the electronic circuit board 1 using the semiconductor component separating apparatus of this embodiment, as described above, the semiconductor component 2 to be removed is locally heated from above by the heating mechanism 7. However, when the solder existing between the semiconductor component 2 to be removed and the electronic circuit board 1 melts due to this heating, problems such as solder flash may occur.

This mechanism will be explained using FIG. Since the underfill does not fluidize due to the thermal expansion of the solder, the expanded solder loses its place to go and breaks the interface between the underfill material and the semiconductor component 2 or the electronic circuit board 1. This causes a bridge (short) or an open (unsoldered connection) indicated by reference numeral 18 to cause secondary problems.

Therefore, it is desirable to perform temperature control so that the solder existing between the part and the electronic circuit board 1 does not reach the melting temperature for parts that are not to be removed.

As described above, the heating by the heating mechanism 7 performs local heating from above in a range equivalent to the size of the semiconductor component 2 to be removed for a predetermined heating time. Since the heat transfer to other parts existing in the surrounding area is suppressed to a minimum value, it is not necessary to provide the above-mentioned temperature control mechanism if no thermal effect on the surrounding area is confirmed in this state. .

However, if there is concern about thermal effects on peripheral components, the above-mentioned secondary problems may occur. desirable.

By providing the temperature control mechanism described above, it is possible to prevent the temperature rise of the electronic circuit board 1 and the peripheral components, suppress the heat propagation, and secure the temperature difference between the semiconductor component 2 to be removed and the peripheral components. can.

The temperature state of the electronic circuit board 1 at the position where the heated semiconductor component 2 is mounted is adjusted from the lower surface side of the electronic circuit board 1 at the position where the heated semiconductor component 2 is mounted. As the above-described temperature adjusting mechanism, a second heating mechanism 19 (FIG. 4) is adopted that heats the electronic circuit board 1 from below at the position where the heated semiconductor component 2 is mounted. be able to.

The temperature control mechanism described above prevents the temperature rise of the electronic circuit board 1 and peripheral components, suppresses heat propagation, and secures the temperature difference between the semiconductor component 2 to be removed and the peripheral components. will be cooled. As described above, the use of the second heating mechanism 19 (FIG. 9) for heating the electronic circuit board 1 from below is only for the complete cooling effect. This is because the temperature of the component 2 may not reach the temperature required to melt the solder as described above.

This can be prevented by using the second heating mechanism 19 (FIG. 4) that heats the electronic circuit board 1 from below.

As described above, when heating is performed by the heating mechanism 7, the necessary temperature profile conditions are set in advance, and the heating mechanism 7 is controlled by the control means (not shown) to perform local heating. there is Also when the electronic circuit board 1 is heated from below by the second heating mechanism 19, the necessary temperature profile conditions are set in advance, and the second heating mechanism 19 is controlled by control means (not shown). The above-described warming can be performed by

Further, the temperature state of the electronic circuit board 1 at the position where the heated semiconductor component 2 is mounted is measured from the lower surface side of the electronic circuit board 1 at the position where the heated semiconductor component 2 is mounted. As the above-described temperature adjustment mechanism for adjusting , a cooling mechanism may be adopted that gives a cooling effect from below to the electronic circuit board 1 at the position where the heated semiconductor component 2 is mounted.

If the electronic circuit board 1 is a board with a large specific heat, it is desirable to employ a cooling mechanism that provides a cooling effect.

As this cooling mechanism, an air cooling mechanism (not shown) that blows air against the lower surface of the electronic circuit board 1 at the position where the heated semiconductor component 2 is mounted can be employed. For cooling by the air cooling mechanism, the necessary temperature profile conditions are set in advance, and the control means (not shown) controls the air cooling mechanism (not shown) to the lower surface of the electronic circuit board 1 at a desired air flow rate and air velocity. It can be configured to blow air.

Further, a heat radiation cooling mechanism (not shown) that is attached to the lower surface of the electronic circuit board 1 at the position where the heated semiconductor component 2 is mounted as a cooling mechanism and performs cooling by heat radiation can also be adopted. . A heat sink, a thermally conductive material, or the like can be employed as the heat dissipation cooling mechanism, and these are attached to the lower surface of the electronic circuit board 1 at the position where the semiconductor component 2 being heated is mounted, or the like. can be employed.

It should be noted that an air cooling mechanism (not shown) and a heat radiation cooling mechanism (not shown) can be used together.

Also, the above-described second heating mechanism 19 and the cooling mechanism (air cooling mechanism, radiation cooling mechanism, or both) can be used together.

The semiconductor component separating apparatus of this embodiment can be configured to further include a third heating mechanism for heating the lower surface side of the electronic circuit board 1 .

As described above, even if local heating from above by the heating mechanism 7 and temperature adjustment from below the electronic circuit board 1 by the temperature adjustment mechanism described above are performed, temperature variations within the semiconductor component 2 to be removed may occur. This is because the ground line of the semiconductor component 2 to be removed is connected to the internal ground layer (solid layer) of the electronic circuit board 1, so that the semiconductor component 2 to be removed is locally heated. Also, heat escapes to the inner layer, and the temperature of the ground line electrode of the semiconductor component 2 does not rise, resulting in cold soldering.

This cold solder causes peel-off of the board pattern when removing the semiconductor component 2 to be removed. Therefore, it is desirable to take this countermeasure. As a countermeasure against this, the preheating effect of the entire electronic circuit board 1 is effective.

The above-described third heating mechanism for heating the lower surface side of the electronic circuit board 1 is employed to exhibit the preheating effect of the entire electronic circuit board 1 .

In the embodiment shown in FIG. 4, an infrared heater 20 is arranged below the electronic circuit board 1 as a third heating mechanism. A heat source other than an infrared heater can be used, but it is desirable to use a heat source with high heat permeability, such as an infrared heater.

While the temperature of the entire electronic circuit board 1 is maintained at, for example, 150° C. or higher by the infrared heater 20, the semiconductor component 2 is removed as described above by the semiconductor component separating device. By doing so, the heat locally given to the semiconductor component 2 to be removed does not escape from the semiconductor component 2, and the Δt in the electronic circuit board 1 can be collectively removed without cold soldering.

With the semiconductor component separating apparatus of this embodiment described above, the semiconductor component mounted on the electronic circuit board can be automatically removed from the electronic circuit board in a reusable form without being destroyed. In addition, a new semiconductor component can be attached to the board-side pattern surface after removal of the semiconductor component in the electronic circuit board from which the semiconductor component has been removed. Examples of these are introduced below.

<Method for Separating Semiconductor Parts>
A semiconductor component separating method using the semiconductor component separating apparatus of the embodiment described above is carried out as follows.

(Local heating process for semiconductor components to be removed)
With the heating mechanism 7 in the semiconductor component separating apparatus of the above-described embodiments, peripheral components existing around the semiconductor component 2 to be removed in the various embodiments described above are heated. Provides localized heating with minimal heat transfer to

As a result, the solder existing between the semiconductor component 2 to be removed and the electronic circuit board 1 is heated until it exceeds its melting point.

This heating also softens the underfill existing between the semiconductor component 2 to be removed and the electronic circuit board 1 .

(Inserting removal jig)
Subsequently, the removal jig 8 is inserted between the semiconductor component 2 to be removed and the electronic circuit board 1 by the above-described operations of the jig insertion mechanism and the jig elevating mechanism provided in the semiconductor component removal mechanism 9 . .

At this time, if necessary, the angle adjustment mechanism described above is used to appropriately adjust the insertion angle of the removal jig 8 whose tip is inserted into the gap between the electronic circuit board 1 and the semiconductor component 2 to be removed.

Also, the semiconductor component support mechanism 12 is operated as described above so that the semiconductor component 2 to be removed does not move.

The heating and temperature control of the removal jig 8, the solder, and the underfill by the first heating mechanism 13 are appropriately performed as necessary.

(Separation of semiconductor component 2 to be removed)
Subsequently, the removal jig 8 supporting the semiconductor component 2 to be removed from the electronic circuit board 1 is separated from the electronic circuit board 1 by the lifting operation described above by the jig elevating mechanism provided in the semiconductor component removal mechanism 9 . .

If the underfill is only partially destroyed when the removal jig 8 is inserted between the semiconductor component 2 to be removed and the electronic circuit board 1, the underfill is completely destroyed by this upward movement. Become.

The semiconductor component holding mechanism described above is used, and the semiconductor component holding mechanism and the removing jig 8 work together to raise the semiconductor component 2 while holding it between the semiconductor component holding mechanism and the removing jig 8. By doing so, the semiconductor component 2 can also be separated from the electronic circuit board 1 .

In addition, the temperature control mechanism described above performs temperature control so that the temperature is suitable for removing the semiconductor component 2 while inserting the removal jig and separating the semiconductor component 2 to be removed. That is, the electronic circuit board by the above-described temperature control mechanism for suppressing the local heating from the upper side by the heating mechanism 7 to the semiconductor component 2 to be removed and the thermal effect on the peripheral parts of the semiconductor component 2 to be removed While performing temperature control by heating or cooling from the lower side of the electronic circuit board 1 as described above, and further heating the entire lower surface side of the electronic circuit board 1 by the third heating mechanism described above, the removal jig described above The semiconductor component 2 to be inserted and removed is separated.

<Method for mounting semiconductor parts>
The semiconductor component mounting method using the semiconductor component separating apparatus of the above-described embodiment is performed as follows. Remove solder and underfill residue.

In place of the semiconductor component 2 removed from the electronic circuit board 1, solder printing or solder transfer is performed on a new semiconductor component to be newly attached to the board-side pattern surface of the electronic circuit board 1.

or,
Solder is printed or dispensed onto the board-side pattern surface of the electronic circuit board 1 .

It should be noted that both solder printing or solder transfer to the new semiconductor component and solder printing or dispensing supply to the board-side pattern surface of the electronic circuit board 1 may be performed.

Next, the board-side pattern on the electronic circuit board 1 and the electrodes of the new semiconductor component are aligned.

After that, the new semiconductor component after alignment is locally heated by the heating mechanism 7 in the semiconductor component separating apparatus of the above-described embodiment, and the new semiconductor component is attached to the electronic circuit board 1 .

The problem with heating is that it causes problems due to the thermal effects on peripheral components, so the temperature adjustment mechanism described above makes the temperature suitable for attaching semiconductor components, just as when removing them. Adjust the temperature as follows. That is, the new semiconductor component aligned with the mounting position as described above is locally heated from the upper side by the heating mechanism 7, and the above-described temperature control mechanism for suppressing the thermal effect on peripheral components. While controlling the temperature by heating or cooling from the lower side of the circuit board 1 and further heating the entire lower surface side of the electronic circuit board 1 by the above-described third heating mechanism, the new semiconductor component is attached to the electronic circuit board 1.

Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments, and can be variously modified within the technical scope grasped from the description of the claims. is.

Claims

a heating mechanism for heating a semiconductor component mounted on an electronic circuit board from above the semiconductor component;
a removal jig;
a jig insertion mechanism for inserting the removal jig between the electronic circuit board and the semiconductor component;
The removal jig inserted between the electronic circuit board and the semiconductor component is a jig for moving the electronic circuit board upward while supporting the semiconductor component upward. A semiconductor component separating apparatus comprising: a tool lifting mechanism;
The semiconductor component separating apparatus according to claim 1, further comprising an angle adjusting mechanism for adjusting an angle at which the removing jig is inclined with respect to the semiconductor component.
When the removal jig is inserted between the electronic circuit board and the semiconductor component by the jig insertion mechanism, the semiconductor component is mounted on the side facing the semiconductor component into which the removal jig is inserted. 3. The semiconductor component separating apparatus according to claim 1, further comprising a semiconductor component supporting mechanism for supporting said semiconductor component so that said component does not move.
4. The semiconductor according to any one of claims 1 to 3, wherein a first heating mechanism for heating said removal jig and adjusting a heating state of said removal jig is attached to said removal jig. Parts separation device.
In a state in which the removal jig supports the semiconductor component on the upper side, the semiconductor component is moved with the removal jig in cooperation with the removal jig when the lifting operation is performed by the jig elevating mechanism. 5. The semiconductor component separating apparatus according to claim 1, further comprising a semiconductor component holding mechanism that performs the lifting operation while holding the semiconductor component between the two.
The semiconductor component separating apparatus according to claim 5, wherein the semiconductor component holding mechanism is a vacuum suction holding mechanism.
6. The semiconductor component separating apparatus according to claim 5, wherein the semiconductor component holding mechanism is a plate-shaped holding mechanism that holds the semiconductor component together with the removal jig between itself and the removal jig.
The semiconductor component separating apparatus according to claim 7, wherein the plate-like holding mechanism is provided with a second heating mechanism for heating the plate-like holding mechanism and adjusting the heating state of the plate-like holding mechanism.
The plate-shaped holding mechanism faces the upper side surface of the semiconductor component with a slight clearance therebetween, and cooperates with the removal jig to hold the semiconductor component by the removal jig. 8. The semiconductor component separating apparatus according to claim 7, wherein the semiconductor component is held between
The semiconductor component separating apparatus according to any one of claims 1 to 9, wherein the heating of the semiconductor component by the heating mechanism is local heating in a range equivalent to the size of the semiconductor component.
The temperature state of the electronic circuit board at the position where the heated electrical semiconductor component is mounted is measured from the lower surface side of the electronic circuit board at the position where the heated semiconductor component is mounted. The semiconductor component separating apparatus according to any one of claims 1 to 10, further comprising a temperature adjusting mechanism for adjusting.
12. The semiconductor component separating apparatus according to claim 11, wherein the temperature adjusting mechanism is a second heating mechanism that heats the electronic circuit board from below at a position where the heated semiconductor component is mounted. .
12. The semiconductor component separating apparatus according to claim 11, wherein the temperature adjusting mechanism is a cooling mechanism that provides a cooling effect to the electronic circuit board at a position where the heated semiconductor component is mounted.
14. The semiconductor component separating apparatus according to claim 13, wherein the cooling mechanism is an air cooling mechanism that blows air from below to the electronic circuit board at the position where the heated semiconductor component is mounted.
14. The semiconductor component separation according to claim 13, wherein said cooling mechanism is a heat radiation cooling mechanism that is attached from below to said electronic circuit board at a position where said semiconductor component being heated is mounted and performs cooling by heat radiation. Device.
The semiconductor component separating apparatus according to any one of claims 1 to 15, further comprising a third heating mechanism for heating the lower surface side of the electronic circuit board.
Using the semiconductor component separation apparatus according to any one of claims 1 to 16, while heating the semiconductor component to be removed mounted on the electronic circuit board from above, the removal A semiconductor component separating method comprising inserting a jig between the semiconductor component to be removed and the electronic circuit board, and lifting the removal jig to remove the semiconductor component to be removed from the electronic circuit board.
a step of removing solder and underfill residue on the board-side pattern surface after removal of the semiconductor component in the electronic circuit board after removal of the semiconductor component;
a step of performing solder printing or solder transfer onto a new semiconductor component newly attached to the board-side pattern surface of the electronic circuit board in place of the semiconductor component removed from the electronic circuit board; and/or
a step of performing solder printing or dispensing supply on the board-side pattern surface of the electronic circuit board;
a step of aligning the board-side pattern of the electronic circuit board with the electrode of the new semiconductor component;
and a step of heating the new semiconductor component after alignment using the semiconductor component separating apparatus according to any one of claims 1 to 16. Semiconductor component mounting method.