JPWO2023135624A5 - - Google Patents

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JPWO2023135624A5
JPWO2023135624A5 JP2023553949A JP2023553949A JPWO2023135624A5 JP WO2023135624 A5 JPWO2023135624 A5 JP WO2023135624A5 JP 2023553949 A JP2023553949 A JP 2023553949A JP 2023553949 A JP2023553949 A JP 2023553949A JP WO2023135624 A5 JPWO2023135624 A5 JP WO2023135624A5
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semiconductor component
circuit board
electronic circuit
removal jig
heating
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JP2023553949A
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JPWO2023135624A1 (en
JP7451001B2 (en
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Priority claimed from PCT/JP2022/000461 external-priority patent/WO2023135624A1/en
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Claims (21)

電子回路基板に実装されている半導体部品に対して前記半導体部品の上側から加熱を行い、前記電子回路基板と前記半導体部品との間に存在しているはんだが少なくともその融点を超えるまで加熱する加熱機構と、
取り外し治具と、
前記加熱機構による前記加熱によって軟化しているアンダーフィルが存在している、前記電子回路基板と、前記半導体部品との間に、前記取り外し治具を挿入させて前記アンダーフィルを破壊する治具挿入機構と、
前記電子回路基板と前記半導体部品との間に挿入されている前記取り外し治具を、前記半導体部品を上側に支持している状態で、前記電子回路基板の上方向への上昇動作を行わせる治具昇降機構と
を備えている半導体部品分離装置。 Heating the semiconductor component mounted on the electronic circuit board from above the semiconductor component until the solder present between the electronic circuit board and the semiconductor component exceeds at least its melting point. a heating mechanism;
A removal jig,
inserting a jig for destroying the underfill by inserting the removal jig between the electronic circuit board and the semiconductor component in which the underfill is softened by the heating by the heating mechanism; mechanism and
The removal jig inserted between the electronic circuit board and the semiconductor component is configured to move the electronic circuit board upward while supporting the semiconductor component upward. A semiconductor component separation device equipped with a tool lifting mechanism. 前記半導体部品に対して前記取り外し治具が傾斜している角度を調整する角度調整機構を更に備えている請求項１記載の半導体部品分離装置。 2. The semiconductor component separation apparatus according to claim 1, further comprising an angle adjustment mechanism that adjusts an angle at which the removal jig is inclined with respect to the semiconductor component. 前記取り外し治具が、前記治具挿入機構によって前記電子回路基板と前記半導体部品との間に挿入される際に、前記取り外し治具が挿入される前記半導体部品の側に対向する側において前記半導体部品が移動しないように前記半導体部品を支持する半導体部品支持機構を更に備えている請求項１又は２記載の半導体部品分離装置。 When the removal jig is inserted between the electronic circuit board and the semiconductor component by the jig insertion mechanism, the semiconductor component is removed on the side opposite to the side of the semiconductor component into which the removal jig is inserted. 3. The semiconductor component separation apparatus according to claim 1, further comprising a semiconductor component support mechanism that supports the semiconductor component so that the component does not move. 前記取り外し治具を加温すると共に前記取り外し治具の加温状態を調整する第一の加温機構が前記取り外し治具に付帯されている請求項１～３のいずれか一項に記載の半導体部品分離装置。 4. The semiconductor according to claim 1, wherein the removal jig includes a first heating mechanism that heats the removal jig and adjusts the heating state of the removal jig. Parts separation equipment. 前記取り外し治具が、前記半導体部品を上側に支持している状態で、前記治具昇降機構によって前記上昇動作を行う際に、前記取り外し治具と共同して前記半導体部品を前記取り外し治具との間で保持しつつ前記上昇動作を行う半導体部品保持機構を更に備えている請求項１～４のいずれか一項に記載の半導体部品分離装置。 When the removal jig is supporting the semiconductor component upwardly and the jig lifting mechanism performs the lifting operation, the removal jig cooperates with the removal jig to remove the semiconductor component from the removal jig. 5. The semiconductor component separating apparatus according to claim 1, further comprising a semiconductor component holding mechanism that performs the lifting operation while holding the semiconductor component between the semiconductor components. 前記半導体部品保持機構は、バキューム吸着保持機構である請求項５記載の半導体部品分離装置。 6. The semiconductor component separation apparatus according to claim 5, wherein the semiconductor component holding mechanism is a vacuum suction holding mechanism. 前記半導体部品保持機構は、前記取り外し治具と共同して前記半導体部品を前記取り外し治具との間で保持する平板状の板状保持機構である請求項５記載の半導体部品分離装置。 6. The semiconductor component separation apparatus according to claim 5, wherein the semiconductor component holding mechanism is a flat plate-like holding mechanism that cooperates with the removal jig to hold the semiconductor component between the removal jig and the semiconductor component holding mechanism. 前記板状保持機構を加温すると共に前記板状保持機構の加温状態を調整する第二の加温機構が前記板状保持機構に備えられている請求項７記載の半導体部品分離装置。 8. The semiconductor component separation apparatus according to claim 7, wherein the plate-shaped holding mechanism is provided with a second heating mechanism that heats the plate-shaped holding mechanism and adjusts the heating state of the plate-shaped holding mechanism. 前記板状保持機構は、前記半導体部品の上側面との間にわずかなクリアランスを存在させて前記半導体部品の上側面と対向し、前記取り外し治具と共同して前記半導体部品を前記取り外し治具との間で保持する請求項７記載の半導体部品分離装置。 The plate-like holding mechanism faces the upper side of the semiconductor component with a slight clearance between the plate-shaped holding mechanism and the upper side of the semiconductor component, and works with the removal jig to remove the semiconductor component. 8. The semiconductor component separating apparatus according to claim 7, wherein the semiconductor component separating apparatus is held between the semiconductor component separating apparatus and the semiconductor component separating apparatus. 前記加熱機構による前記半導体部品に対する加熱は、前記半導体部品のサイズと同等の範囲での局所的な加熱である請求項１～９のいずれか一項に記載の半導体部品分離装置。 10. The semiconductor component separation apparatus according to claim 1, wherein heating of the semiconductor component by the heating mechanism is local heating in a range equivalent to the size of the semiconductor component. 加熱が行われている前記半導体部品が実装されている位置の前記電子回路基板の下面側から、加熱が行われている前記電気半導体部品が実装されている位置における前記電子回路基板の温度状態を調整する温度調整機構を更に備えている請求項１～１０のいずれか一項に記載の半導体部品分離装置。 The temperature state of the electronic circuit board at the position where the heated electric semiconductor component is mounted is measured from the bottom surface side of the electronic circuit board at the position where the heated semiconductor component is mounted. The semiconductor component separation apparatus according to any one of claims 1 to 10, further comprising a temperature adjustment mechanism. 前記温度調整機構は、加熱が行われている前記半導体部品が実装されている位置における前記電子回路基板を下側から加温する第三の加温機構である請求項１１記載の半導体部品分離装置。 12. The semiconductor component separation apparatus according to claim 11, wherein the temperature adjustment mechanism is a third heating mechanism that heats the electronic circuit board from below at a position where the semiconductor component being heated is mounted. . 前記温度調整機構は、加熱が行われている前記半導体部品が実装されている位置における前記電子回路基板に対して冷却効果を与える冷却機構である請求項１１記載の半導体部品分離装置。 12. The semiconductor component separation apparatus according to claim 11, wherein the temperature adjustment mechanism is a cooling mechanism that provides a cooling effect to the electronic circuit board at a position where the heated semiconductor component is mounted. 前記冷却機構は、加熱が行われている前記半導体部品が実装されている位置における前記電子回路基板に対して下側から風を吹き付ける空冷機構である請求項１３記載の半導体部品分離装置。 14. The semiconductor component separation apparatus according to claim 13, wherein the cooling mechanism is an air cooling mechanism that blows air from below onto the electronic circuit board at a position where the heated semiconductor component is mounted. 前記冷却機構は、加熱が行われている前記半導体部品が実装されている位置における前記電子回路基板に下側から取り付けられて放熱による冷却を行う放熱冷却機構である請求項１３記載の半導体部品分離装置。 14. The semiconductor component separation according to claim 13, wherein the cooling mechanism is a heat radiation cooling mechanism that is attached from below to the electronic circuit board at a position where the semiconductor component being heated is mounted and performs cooling by heat radiation. Device. 前記電子回路基板の下面側を加温する第四の加温機構を更に備えている請求項１～１５のいずれか一項に記載の半導体部品分離装置。 16. The semiconductor component separating apparatus according to claim 1, further comprising a fourth heating mechanism that heats the lower surface side of the electronic circuit board. 電子回路基板に実装されている半導体部品を前記電子回路基板から取り外す方法及び、半導体部品の取り外しが行われた後の前記電子回路基板における半導体部品取り外し後の基板側パターン面に新しい半導体部品を取り付ける方法との双方に使用できる請求項１～請求項１６のいずれか一項に記載の半導体部品分離装置。A method for removing a semiconductor component mounted on an electronic circuit board from the electronic circuit board, and a method for attaching a new semiconductor component to a pattern surface on the board side of the electronic circuit board after the semiconductor component has been removed after the semiconductor component has been removed. The semiconductor component separation apparatus according to any one of claims 1 to 16, which can be used for both methods. 電子回路基板に実装されている半導体部品に対して前記半導体部品の上側から加熱を行い、少なくとも前記電子回路基板と前記半導体部品との間に存在しているはんだがその融点を超えるまで加熱する加熱機構と、
取り外し治具と、
前記加熱機構による前記加熱によって軟化しているアンダーフィルが存在している、前記電子回路基板と、前記半導体部品との間に、前記取り外し治具を挿入させて前記アンダーフィルの少なくとも一部を破壊する治具挿入機構と、
前記電子回路基板と前記半導体部品との間に挿入されている前記取り外し治具を、前記半導体部品を上側に支持している状態で、前記電子回路基板の上方向への上昇動作を行わせて前記アンダーフィルを全壊する治具昇降機構と
を備えている半導体部品分離装置。 heating a semiconductor component mounted on an electronic circuit board from above the semiconductor component until at least the solder present between the electronic circuit board and the semiconductor component exceeds its melting point; mechanism and
A removal jig,
Destroying at least a portion of the underfill by inserting the removal jig between the electronic circuit board and the semiconductor component, in which the underfill that has been softened by the heating by the heating mechanism is present. a jig insertion mechanism,
The removal jig inserted between the electronic circuit board and the semiconductor component is caused to perform an upward movement of the electronic circuit board while supporting the semiconductor component upwardly. A semiconductor component separation device comprising a jig elevating mechanism that completely destroys the underfill . 電子回路基板に実装されている半導体部品に対して前記半導体部品の上側から加熱を行う加熱機構と、a heating mechanism that heats a semiconductor component mounted on an electronic circuit board from above the semiconductor component;
取り外し治具と、A removal jig,
前記電子回路基板と、前記半導体部品との間に、前記取り外し治具の先端を挿入させる治具挿入機構と、a jig insertion mechanism for inserting a tip of the removal jig between the electronic circuit board and the semiconductor component;
前記電子回路基板と前記半導体部品との間に挿入されている前記取り外し治具を、前記半導体部品を上側に支持している状態で、前記電子回路基板の上方向への上昇動作を行わせる治具昇降機構と、The removal jig inserted between the electronic circuit board and the semiconductor component is configured to move the electronic circuit board upward while supporting the semiconductor component upward. A tool lifting mechanism;
前記取り外し治具に付帯されている、前記取り外し治具を加温すると共に前記取り外し治具の加温状態を調整することで、前記電子回路基板と前記半導体部品との間に存在しているはんだ、アンダーフィルを、前記取り外し治具を介して加温する第一の加温機構とBy heating the removal jig attached to the removal jig and adjusting the heating state of the removal jig, the solder existing between the electronic circuit board and the semiconductor component can be removed. , a first heating mechanism that heats the underfill via the removal jig;
を備えている半導体部品分離装置。Semiconductor component separation equipment equipped with 請求項１～請求項１６のいずれか一項に記載されている半導体部品分離装置を用いて、前記加熱機構によって、電子回路基板に実装されている取り外し対象の半導体部品に対して上側から加熱を行って前記電子回路基板と前記半導体部品との間に存在しているはんだを少なくともその融点を超えるまで加熱すると共に前記電子回路基板と前記半導体部品との間に存在しているアンダーフィルを軟化させつつ、前記取り外し治具を、取り外し対象の前記半導体部品と、前記電子回路基板との間に挿入させ、前記取り外し治具を上昇させることで軟化している前記アンダーフィルを破壊して、取り外し対象の前記半導体部品を前記電子回路基板から取り外す半導体部品分離方法。Using the semiconductor component separation apparatus according to any one of claims 1 to 16, the heating mechanism heats a semiconductor component to be removed mounted on an electronic circuit board from above. heating the solder present between the electronic circuit board and the semiconductor component at least to a point exceeding its melting point, and softening the underfill present between the electronic circuit board and the semiconductor component. At the same time, the removal jig is inserted between the semiconductor component to be removed and the electronic circuit board, and the softened underfill is destroyed by raising the removal jig to remove the semiconductor component to be removed. A semiconductor component separation method for removing the semiconductor component from the electronic circuit board. 請求項１～請求項１６のいずれか一項に記載されている半導体部品分離装置を用いて、前記加熱機構によって、電子回路基板に実装されている取り外し対象の半導体部品に対して上側から加熱を行って前記電子回路基板と前記半導体部品との間に存在しているはんだを少なくともその融点を超えるまで加熱すると共に前記電子回路基板と前記半導体部品との間に存在しているアンダーフィルを軟化させつつ、前記取り外し治具を、取り外し対象の前記半導体部品と、前記電子回路基板との間に挿入させて前記アンダーフィルの少なくとも一部を破壊し、前記取り外し治具を上昇させることで前記アンダーフィルを全壊して、取り外し対象の前記半導体部品を前記電子回路基板から取り外す半導体部品分離方法。Using the semiconductor component separation apparatus according to any one of claims 1 to 16, the heating mechanism heats a semiconductor component to be removed mounted on an electronic circuit board from above. heating the solder present between the electronic circuit board and the semiconductor component at least to a point exceeding its melting point, and softening the underfill present between the electronic circuit board and the semiconductor component. At the same time, the removal jig is inserted between the semiconductor component to be removed and the electronic circuit board to destroy at least a portion of the underfill, and the removal jig is raised to remove the underfill. A method for separating semiconductor components, in which the semiconductor component to be removed is removed from the electronic circuit board by completely destroying the semiconductor component.
JP2023553949A 2022-01-11 2022-01-11 Semiconductor component separation device and semiconductor component separation and attachment method using the same Active JP7451001B2 (en)

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PCT/JP2022/000461 WO2023135624A1 (en) 2022-01-11 2022-01-11 Semiconductor-component-separating device and semiconductor component separation and attachment method using same

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JPWO2023135624A1 JPWO2023135624A1 (en) 2023-07-20
JPWO2023135624A5 true JPWO2023135624A5 (en) 2023-12-13
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JP4989528B2 (en) * 2008-03-11 2012-08-01 パナソニック株式会社 Surface mount device mounting structure, repair method thereof, and printed circuit board
JP2011211073A (en) * 2010-03-30 2011-10-20 Fujitsu Ltd Repairing device for electronic component, repairing method, and heat transfer cap member for use in repair
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