WO2022083314A1

WO2022083314A1 - X64 architecture-based smart mobile phone

Info

Publication number: WO2022083314A1
Application number: PCT/CN2021/116356
Authority: WO
Inventors: 景泉淞
Original assignee: 景泉淞
Priority date: 2020-10-23
Filing date: 2021-09-03
Publication date: 2022-04-28
Also published as: CN212875888U

Abstract

Disclosed in the present invention is an X64 architecture-based smart mobile phone, comprising: a PCB, a CPU, a first chipset, a second chipset, and a plurality of remote wireless modules provided inside the smart mobile phone. The CPU, the first chipset, the second chipset, and the plurality of remote wireless modules are disposed on two sides of the PCB; the CPU and the first chipset are connected to the second chipset; the plurality of remote wireless modules are all connected to the second chipset; and the plurality of remote wireless modules comprise SIM card or e-SIM based communication modules. The X64 architecture-based smart mobile phone disclosed in the present invention has excellent performance and high compatibility and scalability, can conduct voice or video calls on the basis of communication technologies such as LTE, 2G, 3G, 4G, 5G, Wi-Fi, and Bluetooth, can run some mainstream AAA games smoothly at a medium-low image quality of 30 fps, and provides a new solution for handling office work while on the go.

Description

A Smart Mobile Phone Based on X64 Architecture

technical field

The utility model relates to a wireless communication technology, in particular to an intelligent mobile phone with an X64 architecture.

Background technique

In the prior art, the architecture of the smart mobile phone basically adopts the ARM architecture, whether it is the chip architecture of Qualcomm, MediaTek and Hisilicon or the A-series processors of Apple, all of them adopt the ARM architecture. ARM adopts the mode of licensing chip design solutions to other companies, and has formed more than 100 partners around the world. At the same time, ARM adopts the RISC pipeline instruction set, which is fundamentally at a disadvantage in completing comprehensive work. In applications with relatively fixed tasks, its advantages can be brought into full play. The reason why the current smart mobile phone mainly adopts the processor of ARM architecture is mainly due to the low power consumption and high efficiency of ARM.

However, with the improvement of people's living standards, the dependence on the performance of mobile phones is also increasing. The ARM architecture connects the CPU and data storage devices through a dedicated data interface, so the performance expansion of ARM storage, memory, etc. is difficult to carry out. ARM-structured systems generally cannot be extended, and their performance is greatly limited.

Utility model content

The technical problem to be solved by the present invention is that the performance of the existing intelligent mobile phone based on the ARM architecture is greatly limited, and the purpose is to provide an intelligent mobile phone of the X64 architecture to solve the above problems.

The utility model is realized through the following technical solutions:

An intelligent mobile phone with X64 architecture, comprising a PCB board, a CPU, a first chipset, a second chipset and a remote wireless module arranged inside the intelligent mobile phone; the CPU, the first chipset, the second chipset and the The remote wireless modules are all arranged on the PCB board; the remote wireless module adopts a communication module based on a SIM card or e-SIM; the remote wireless module is connected to the CPU, the first chipset and/or the second chipset; The CPU is connected to the first chipset, and the second chipset is connected to the CPU and/or the first chipset; the CPU, the first chipset, the second chipset and the remote wireless module can be any two or optional The three are integrated into one chip; the CPU, the first chipset, the second chipset and the long-range wireless module can also be integrated into one chip.

In the existing technology, with the advancement of science and technology, the emergence of 7nm or even 5nm process makes the X86 architecture, especially the X64 architecture CPU, sharply reduce the power consumption while maintaining high performance, which makes the energy-efficient X64 architecture processor replace ARM The application of the architecture processor in 4G or 5G smart mobile phones becomes possible. At the same time, due to the emergence of the Sino-US trade war, the processor of the X64 architecture also provides a new technical solution for domestic smart mobile phones.

When the utility model is applied, the inventor provides an intelligent mobile phone based on the X64 architecture. First, the space utilization problem of the intelligent mobile phone is solved through the solution of the PCB board. The CPU, the first chipset, the second chipset and the remote When the wireless module is arranged on the PCB board, since the thickness of the chip set is very small, the size of the PCB board can be greatly reduced when these chips and modules are placed on two sides of the double-sided PCB. Different from the technical solutions of notebooks, notebooks often use 9-15-inch screens because of their office use, which allows the notebook circuit board to use a single-layer circuit board with a larger area.

The present utility model is completely different. Considering the portability of the smart mobile phone, the inventor adopts the technical solution of the PCB board. Chipsets of related chips, such as INTEL series comet lake architecture processors and icelake architecture processors, use 10nm process, and for example, AMD series Ryzen 2, Ryzen 3 and Ryzen 4 processors use 7nm process. Core displays such as Xe and Vega enable it to run at a power consumption of 7 to 15W, and its performance far exceeds the existing ARM architecture processors. With the promotion of the 5nm process, the power consumption of these processors will be further reduced. In the present invention, the size of the entire smart mobile phone can be compressed to the physical size of 200mm×90mm×12mm or even smaller, which fully meets the portable requirements of mobile phones. There is an increase, but the utility model can smoothly run the mainstream desktop-level operating systems such as deepin, winning kylin, Ubuntu, AndroidX86, Win10, red flag linux, etc.

At the same time, in the present invention, a variety of integration schemes are provided. The CPU, the first chipset, the second chipset and the remote wireless module can be optionally two or three integrated into one chip, that is to say, selecting these four Two or three of them are integrated to improve the integration degree of the present invention, and further the integration degree of the present invention can be further improved by adopting the way of fully integrating the above four chips. The utility model has strong performance, strong compatibility and scalability, and can use LTE, 2G, 3G, 4G, 5G and other communication technologies for voice or video calls; A new solution has also been developed for portable office.

Further, the communication module based on the SIM card or e-SIM adopts a 2G communication module, a 3G communication module, a 4G communication module and/or a 5G communication module.

When the utility model is applied, a 4G or 5G communication module based on SIM card or e-SIM is also integrated on the PCB board, which is also different from the LTE wireless communication adopted by some existing tablet computers. It is suitable for low-traffic applications such as video calls, but it is not enough for high-traffic applications such as high-definition video calls, so the present invention adopts a 4G or 5G SIM card communication scheme. At the same time, the SIM card communication solution of 4G or 5G can also be backward compatible with the communication protocols of 2G and 3G. Similarly, the communication protocols such as 6G that will appear in the future are also applicable to the present utility model, and various existing wireless communication methods are also applicable. in this utility model.

Further, the first chipset adopts a north bridge chipset or an MCH chipset; the second chipset adopts a south bridge chipset or an ICH chipset.

Further, it also includes display screen, ROM and GPU;

the ROM is connected to the first chipset, and the ROM is arranged on the PCB;

The GPU is connected to the CPU, the first chipset or the second chipset; the GPU can be integrated with the CPU, the first chipset or the second chipset into a single chip;

The display screen is connected to the GPU through a driver chip.

When the utility model is applied, a GPU can be integrated, which is called a core graphics card. The GPU can be connected in a direct connection mode or a bus mode. The core graphics card can complete the display operation related functions.

Further, the display screen adopts LED, LCD, OLED, Mini LED or Mirco LED.

When the utility model is applied, LED and LCD display screens can be used for different needs, and at the same time, the OLED folding screen can be adopted for reference to the technology of related enterprises.

Further, it also includes a bluetooth communication module and a WIFI module connected to the second chipset; the bluetooth communication module is wirelessly connected to a bluetooth peripheral; the bluetooth peripheral includes a bluetooth keyboard and a bluetooth mouse.

Further, it also includes a USB module, BIOS chip, audio processing chip, RAM and EC; the USB module, BIOS chip, audio processing chip, RAM and EC are all arranged on the PCB, and the USB module, BIOS The chip, the audio processing chip, the RAM and the EC are all connected to the second chip set; the audio processing chip is connected with a sound playing device arranged in the smart mobile phone.

When the utility model is applied, in view of the excellent expansibility of the X64 processor, the module arrangement of a general desktop computer can be adopted, and a USB module, a BIOS chip, an audio processing chip and a RAM can be added to improve the applicability. e-interface or Thunderbolt 4 to further improve scalability and interface communication speed;

At the same time, the EC module, as an important module for power control in the present invention, also needs to be connected to the second chipset, and controls the power of each device to increase battery life.

Further, it also includes a heat sink and a heat dissipation transmission device; a heat dissipation fin is provided in the CPU, the first chipset, the second chipset and/or the remote wireless module; the hot end of the heat dissipation transmission device is arranged on the heat dissipation device. The heat sink and the heat dissipation transmission device are both arranged inside the smart mobile phone.

Further, it also includes a cooling fan; the cooling transmission device adopts a heat pipe, and a cooling fan is arranged on the cold end of the heat pipe; the cooling fan is arranged on the smart mobile phone.

When the utility model is applied, two schemes are provided for heat dissipation, one is active heat dissipation and the other is passive heat dissipation, wherein the active heat dissipation is designed for chips with higher power consumption, and the fan is used to actively dissipate heat from the cold end of the heat pipe; passive heat dissipation; Heat dissipation is designed for chips with lower power consumption. The heat dissipation transmission device can use a vapor chamber, and the cold end is passively dissipated.

In the present invention, the modules used are all existing modules, and the present invention only organically combines them to achieve new technical effects, and does not involve software improvements.

Compared with the prior art, the utility model has the following advantages and beneficial effects:

1. An intelligent mobile phone with an X64 architecture of the present utility model has powerful performance and extremely strong compatibility and scalability;

2. An intelligent mobile phone with an X64 architecture of the present invention can use communication technologies such as LTE, 2G, 3G, 4G, and 5G for voice or video calls;

3. The utility model is an intelligent mobile phone with an X64 architecture, which runs most of the current mainstream 3A games smoothly at a medium picture quality of 30FPS, and also provides a new solution for portable office work.

Description of drawings

The accompanying drawings described herein are used to provide a further understanding of the embodiments of the present invention, and constitute a part of the present application, and do not constitute a limitation to the embodiments of the present invention. In the attached image:

Fig. 1 is the structural representation of the utility model;

2 is a schematic diagram of an embodiment of the present utility model;

3 is a schematic diagram of an embodiment of the present utility model;

4 is a schematic diagram of an embodiment of the present utility model;

5 is a schematic diagram of an embodiment of the present utility model;

6 is a schematic diagram of an embodiment of the present utility model;

FIG. 7 is a schematic diagram of an embodiment of the present invention.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present utility model clearer, the present utility model will be described in further detail below in conjunction with the embodiments and the accompanying drawings. The invention is not intended to limit the present invention.

Example

When this embodiment is implemented, the inventor provides a smart mobile phone based on the X64 architecture. First, the space utilization problem of the smart mobile phone is solved through the solution of the PCB board. The CPU, the first chipset, the second chipset and the remote When the wireless module is arranged on the PCB board, since the thickness of the chip set is very small, the size of the PCB board can be greatly reduced when these chips and modules are placed on two sides of the double-sided PCB. Different from the technical solutions of notebooks, notebooks often use 9-15-inch screens because of their office use, which allows the notebook circuit board to use a single-layer circuit board with a larger area.

The present utility model is completely different. Considering the portability of the smart mobile phone, the inventor adopts the technical solution of the PCB board. Chipsets of related chips, such as INTEL series comet lake architecture processors and icelake architecture processors, use 14nm or 10nm process, and for example, AMD series Zen3 processors use 7nm process technology, and they are equipped with Iris Xe and Vega and other core display enablers. It can run at a power consumption of 7 to 15W, and its performance far exceeds the existing ARM architecture processors. With the promotion of the 5nm process, the power consumption of these processors will be further reduced. In the present invention, the size of the entire smart mobile phone can be compressed to the physical size of 200mm×90mm×12mm or even smaller, which fully meets the portable requirements of mobile phones. There is an increase, but the utility model can smoothly run mainstream desktop-level operating systems such as deepin, winning kylin, Ubuntu, AndroidX86, Win10, red flag linux, etc., with powerful performance, strong compatibility and scalability, and can use LTE, 2G, 3G, 4G, 5G and other communication technologies are used for voice or video calls; at the same time, most mainstream 3A games are run smoothly at medium picture quality of 30FPS, which also improves a new solution for portable office.

As shown in FIG. 1 , this embodiment provides an implementation manner in which the first chipset, the CPU, and the second chipset are connected in sequence.

To further illustrate the working process of this embodiment, the communication module based on the SIM card or e-SIM adopts a 2G communication module, a 3G communication module, a 4G communication module and/or a 5G communication module.

When this embodiment is implemented, a 4G or 5G SIM card or e-SIM-based communication module is also integrated on the PCB, which is also different from the LTE wireless communication used by some existing tablet computers. The LTE wireless communication rate is It is suitable for low-traffic applications such as video calls, but it is not enough for high-traffic applications such as high-definition video calls, so the present invention adopts a 4G or 5G SIM card communication scheme. At the same time, the 4G or 5G SIM card communication solution can also be backward compatible with 2G and 3G communication protocols; The communication module of the SIM communicates with the CPU, the first chipset and/or the second chipset through channels such as PCIE or USB.

As another implementation manner of the present invention, Huawei's ME909S-821 is used for wireless communication, and the ME909S-821 is connected to the CPU, the first chipset and/or the second chipset through PCIE, USB or M.2.

When this embodiment is implemented, with the development of integrated packaging technology, the packaging methods of the CPU, the first chipset, the second chipset, and the communication module based on the SIM card or e-SIM tend to be diverse, so in this embodiment, The integration degree of this embodiment is improved by encapsulating any two or three of the above-mentioned four, and even a technology of encapsulating all of the above-mentioned four can be used to further improve the integration degree of this embodiment.

In order to further illustrate the working process of this embodiment, the first chipset adopts a north bridge chipset or an MCH chipset; the second chipset adopts a south bridge chipset or an ICH chipset.

In order to further illustrate the working process of this embodiment, it also includes a display screen, a ROM and a GPU;

the ROM is connected to the first chipset, and the ROM is arranged on the PCB;

The display screen is connected to the GPU through a driver chip.

In order to further illustrate the working process of this embodiment, the display screen adopts LED, LCD, OLED, Mini LED or Mirco LED.

When this embodiment is implemented, LED and LCD display screens can be used for different needs, and at the same time, the OLED folding screen can be used for reference by the technology of related companies.

In order to further illustrate the working process of this embodiment, the plurality of remote wireless modules further include a Bluetooth communication module; the Bluetooth communication module is wirelessly connected to a Bluetooth peripheral device; the Bluetooth peripheral device includes a Bluetooth keyboard and a Bluetooth mouse.

In order to further illustrate the working process of this embodiment, it also includes a USB module, a BIOS chip, an audio processing chip and a RAM; the USB module, the BIOS chip, the audio processing chip, the EC control and the RAM are all arranged on the PCB board, In addition, the USB module, the BIOS chip, the audio processing chip and the RAM are all connected to the second chipset; the audio processing chip is connected to a sound playing device arranged in the smart mobile phone.

In the implementation of this embodiment, in view of the excellent scalability of the X64 processor, a general desktop computer module arrangement can be adopted, and a USB module, a BIOS chip, an audio processing chip and a RAM can be added to improve the applicability. The e-interface further improves scalability and interface communication speed.

In order to further illustrate the working process of this embodiment, a heat sink and a heat dissipation transmission device are also included; the CPU, the first chipset, the second chipset and/or multiple remote wireless modules are provided with heat sinks; The hot end of the transmission device is arranged on the heat sink; the heat sink and the heat dissipation transmission device are both arranged inside the smart mobile phone.

In order to further illustrate the working process of this embodiment, a cooling fan is also included; the heat dissipation transmission device adopts a heat pipe, and a cooling fan is arranged on the cold end of the heat pipe; the cooling fan is arranged on the smart mobile phone.

In order to further illustrate the working process of this embodiment, in this embodiment, the CPU and the first chipset use Intel's tenth-generation Core i7-10710U, which is packaged on the A side of the PCB board through BGA, and the second chipset uses PCH IBEX PEAK chipset, communication module with SIM card slot as shown in Figure 2.

On the basis of this embodiment, due to the high power consumption, heat dissipation is carried out by means of a heat pipe and a fan. Set the display screen above the B side of the PCB board.

In order to further illustrate the working process of this embodiment, in this embodiment, the CPU and the first chipset use AMD's Ryzen 5700U processor, which is packaged on the A side of the PCB board through BGA, and the second chipset uses an ICH7 chip Group, which is on the B side of the PCB board, and the remote wireless module adopts a communication module with a SIM card slot.

On the basis of this embodiment, due to the low power consumption, passive heat dissipation of heat pipes is adopted for heat dissipation. The cold ends of the heat pipes are arranged at the bottom of the whole body, and the A side of the PCB board also faces the bottom of the body. Set the display screen above the B side of the PCB board.

In order to further illustrate the working process of this embodiment, in this embodiment, the CPU and the first chipset use KX5000, KX6000 or KX7000 processors, and the domestic chips of Zhaoxin Kaixian series are more suitable for the application of the present invention. The technology adopts 16nm, but the integration degree is high. In this embodiment, the CPU and the first chipset are directly packaged on the PCB board by means of BGA packaging, and at the same time, the second chipset adopts the ZX-200IO expansion chip. In this embodiment, the CPU and the first chipset may integrate expansion interfaces such as PCIe, PCI, and M.2.

The schematic diagrams of the chipset pins are shown in Figure 3 and Figure 4. In this embodiment, the CPU and the first chipset adopt Intel CPU Sandy Bridge, the second chipset adopts Intel PCH, FIG. 3 is a partial wiring diagram of the CPU and the first chipset, and FIG. 4 is a partial wiring diagram of the second chipset.

As shown in Figures 5-7, as an implementation of the present invention, three buttons and two cameras are arranged on the front, the three buttons are arranged below the front, the screen is arranged above the buttons, and the camera is arranged on the upper part of the screen. As can be seen in Figure 6, there are three side buttons and a cooling fan outlet on the side of the body. The top side button is the volume adjustment button, the middle side button is the BIOS switch button, and the bottom side button is the BIOS switch button. The side button is the power button. As can be seen in Figure 7, a rear camera group and a fingerprint identification module are set on the back of the body for taking pictures and fingerprint identification.

The specific embodiments described above further describe the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above are only specific embodiments of the present invention and are not intended to limit the present invention The protection scope of the utility model, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

An intelligent mobile phone with an X64 architecture, characterized in that it includes a PCB board, a CPU, a first chipset, a second chipset and a remote wireless module arranged inside the intelligent mobile phone; the CPU, the first chipset and the first chipset The two chipsets are both arranged on the PCB board; the remote wireless module adopts a communication module based on a SIM card or e-SIM;

the remote wireless module is connected to the CPU, the first chipset and/or the second chipset;

the CPU is connected to the first chipset, and the second chipset is connected to the CPU and/or the first chipset;

The CPU, the first chipset, the second chipset and the remote wireless module can be integrated into one chip by any two or three of them;

The CPU, the first chipset, the second chipset and the long-range wireless module may also be integrated together into one chip.
The smart mobile phone with X64 architecture according to claim 1, wherein the communication module based on SIM card or e-SIM adopts 2G communication module, 3G communication module, 4G communication module and/or 5G communication module .
The smart mobile phone with an X64 architecture according to claim 1, wherein the first chipset adopts a north bridge chipset or an MCH chipset; the second chipset adopts a south bridge chipset or an ICH chipset .
A kind of intelligent mobile phone of X64 architecture according to claim 1, is characterized in that, also comprises display screen, ROM and GPU;

the ROM is connected to the first chipset, and the ROM is arranged on the PCB;

The GPU is connected to the CPU, the first chipset or the second chipset; the GPU can be integrated with the CPU, the first chipset or the second chipset into a single chip;

The display screen is connected to the GPU through a driver chip.
The smart mobile phone of an X64 architecture according to claim 4, wherein the display screen adopts LED, LCD, OLED, Mini LED or Mirco LED.
The intelligent mobile phone with an X64 architecture according to claim 1, further comprising a Bluetooth communication module and a WIFI module connected to the second chipset; the Bluetooth communication module is wirelessly connected to a Bluetooth peripheral; the Bluetooth peripherals include Bluetooth keyboards and Bluetooth mice.
The intelligent mobile phone of an X64 architecture according to claim 1, further comprising a USB module, a BIOS chip, an audio processing chip, a RAM and an EC; the USB module, the BIOS chip, the audio processing chip, the RAM and the EC; ECs are all arranged on the PCB board, and the USB module, BIOS chip, audio processing chip, RAM and EC are all connected to the second chipset; the audio processing chip is connected to the smart mobile phone sound playback device inside.
A smart mobile phone with X64 architecture according to claim 1, further comprising a heat sink and a heat dissipation transmission device; the CPU, the first chipset, the second chipset and/or the remote wireless module are provided with There is a heat sink; the hot end of the heat dissipation transmission device is arranged on the heat sink; the heat sink and the heat dissipation transmission device are both arranged inside the smart mobile phone.
The smart mobile phone with X64 architecture according to claim 8, further comprising a cooling fan; the cooling transmission device adopts a heat pipe, and a cooling fan is provided on the cold end of the heat pipe; on the smart mobile phone.