CN112055507A - Heat dissipation device and terminal - Google Patents
Heat dissipation device and terminal Download PDFInfo
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- CN112055507A CN112055507A CN202010548292.8A CN202010548292A CN112055507A CN 112055507 A CN112055507 A CN 112055507A CN 202010548292 A CN202010548292 A CN 202010548292A CN 112055507 A CN112055507 A CN 112055507A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
Abstract
The invention discloses a heat dissipation device and a terminal, wherein the heat dissipation device is applied to the terminal and comprises: the battery comprises a metal middle frame, a main board, two batteries and a heat conducting component, wherein the main board, the two batteries and the heat conducting component are arranged in the metal middle frame; the main board is arranged in the middle of the metal middle frame; the two batteries are respectively arranged on the left side and the right side of the mainboard; the heat conducting component covers the mainboard and the battery and is used for connecting the mainboard and the battery and conducting partial heat of the mainboard to the battery; the problem that the temperature difference between a main board area and an auxiliary board area is large and the temperature equalization and heat dissipation of a terminal complete machine are not facilitated due to the fact that the existing three-section type heat dissipation structure of the top main board, the middle battery and the bottom auxiliary board is adopted is solved; the invention also discloses a terminal, and by implementing the scheme, the problem of high heat in the mainboard area is solved, the capability of conducting the heat in the mainboard area to the outside of the mobile terminal is improved, and the temperature-equalizing and heat-dissipating capability of the whole terminal is facilitated.
Description
Technical Field
The present invention relates to the field of heat dissipation technologies, and in particular, to a heat dissipation apparatus and a terminal.
Background
In recent years, with the diversified demands of users, the performance requirements of electronic products become higher and higher, the heat dissipation efficiency is an important factor influencing the performance of terminals, the performance of electronic products with low heat dissipation efficiency is difficult to reach a certain height, and the electronic products are disadvantageous to the use of users and the popularization of markets.
At present, referring to fig. 3, a three-section heat dissipation structure of a top PCB main board 301, a middle battery 302, and a bottom sub-board 303 is adopted, the top PCB main board performs heat dissipation according to the front and back sides, heat of heat-generating chips such as CPU, Modem, and PM on the front side of the main board is transferred to a metal middle frame and a screen to perform uniform-temperature natural convection heat dissipation and radiation heat dissipation, heat of main heat-generating chips such as IC and WiFi on the back side of the main board is transferred to a metal air duct, an ultra-thin silent fan is arranged in the system, cold air flows through the metal air duct through an air inlet to perform heat exchange, and junction temperature of the heat-generating chips. The PCB mainboard heating components have high power and high heat productivity, and the surface temperature of the upper frame is easily higher due to the fact that the PCB mainboard is close to the upper frame, so that the user experience is influenced; when the terminal is transversely held for use, the temperature difference between the upper frame and the lower frame is large, the holding hand feeling is poor, and the user experience is influenced; the three-section type heat dissipation structure has large temperature difference between the main board area and the auxiliary board area, and is not beneficial to the temperature equalization and heat dissipation of the whole terminal, so that the user satisfaction is reduced.
Disclosure of Invention
The invention aims to solve the technical problem that the temperature difference between a main board area and a secondary board area of the existing three-section type heat dissipation structure is large, so that the whole terminal is not beneficial to temperature equalization and heat dissipation, and provides a heat dissipation device and a terminal aiming at the technical problem.
In order to solve the above technical problem, the present invention provides a heat dissipation device applied to a terminal, the heat dissipation device including: the battery comprises a metal middle frame, a main board, two batteries and a heat conducting component, wherein the main board, the two batteries and the heat conducting component are arranged in the metal middle frame; the main board is arranged in the middle of the metal middle frame; the two batteries are respectively arranged on the left side and the right side of the mainboard; the heat conducting component covers the mainboard and the battery and is used for connecting the mainboard and the battery and conducting partial heat of the mainboard to the battery.
Optionally, the heat dissipation device further comprises a heat dissipation member, and the heat dissipation member is arranged on the back surface of the main board and used for heat dissipation on the back surface of the main board.
Optionally, the heat sink is a heat dissipation fan.
Optionally, the heat dissipation device further comprises a metal air duct, the metal air duct is connected with the back surface of the main board and the heat dissipation member, and the back surface of the main board performs forced convection heat dissipation with the heat dissipation member through the metal air duct.
Optionally, the heat dissipation member is disposed in the middle of the side edge of the main board, and the heat dissipation member is close to the side edge of the metal.
Optionally, the heat dissipation fan is provided with a dust removal separation net.
Optionally, the heat conducting component is a temperature equalizing plate.
Optionally, a heat conducting adhesive layer is coated on a region where the heat conducting component contacts the main board and the battery.
Optionally, the temperature equalization plate is covered with graphite.
Further, the invention also provides a terminal, which comprises the heat dissipation device.
Advantageous effects
The invention provides a heat dissipation device and a terminal, wherein the heat dissipation device is applied to the terminal and comprises: the battery comprises a metal middle frame, a main board, two batteries and a heat conducting component, wherein the main board, the two batteries and the heat conducting component are arranged in the metal middle frame; the main board is arranged in the middle of the metal middle frame; the two batteries are respectively arranged on the left side and the right side of the mainboard; the heat conducting component covers the mainboard and the battery and is used for connecting the mainboard and the battery and conducting partial heat of the mainboard to the battery; the problem that the temperature difference between a main board area and an auxiliary board area is large and the temperature equalization and heat dissipation of a terminal complete machine are not facilitated due to the fact that the existing three-section type heat dissipation structure of the top main board, the middle battery and the bottom auxiliary board is adopted is solved; the invention also discloses a terminal, and by implementing the scheme, the problem of high heat in the mainboard area is solved, the capability of conducting the heat in the mainboard area to the outside of the mobile terminal is improved, and the temperature-equalizing and heat-dissipating capability of the whole terminal is facilitated.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
fig. 1 is a schematic diagram of a hardware structure of an optional terminal for implementing various embodiments of the present invention;
FIG. 2 is a diagram of a wireless communication system for the terminal shown in FIG. 1;
FIG. 3 is a schematic structural diagram of a conventional three-stage heat dissipation device;
fig. 4 is a schematic structural diagram of a heat dissipation device according to a first embodiment of the present invention;
fig. 5 is a schematic structural diagram of a heat dissipation device according to a second embodiment of the present invention.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the following description, suffixes such as "module", "component", or "unit" used to denote elements are used only for facilitating the explanation of the present invention, and have no specific meaning in itself. Thus, "module", "component" or "unit" may be used mixedly.
The terminal may be implemented in various forms. For example, the terminal described in the present invention may include a mobile terminal such as a mobile phone, a tablet computer, a notebook computer, a palmtop computer, a Personal Digital Assistant (PDA), a Portable Media Player (PMP), a navigation device, a wearable device, a smart band, a pedometer, and the like, and a fixed terminal such as a Digital TV, a desktop computer, and the like.
The following description will be given by way of example of a mobile terminal, and it will be understood by those skilled in the art that the construction according to the embodiment of the present invention can be applied to a fixed type terminal, in addition to elements particularly used for mobile purposes.
Referring to fig. 1, which is a schematic diagram of a hardware structure of a mobile terminal for implementing various embodiments of the present invention, the mobile terminal 100 may include: RF (Radio Frequency) unit 101, WiFi module 102, audio output unit 103, a/V (audio/video) input unit 104, sensor 105, display unit 106, user input unit 107, interface unit 108, memory 109, processor 110, and power supply 111. Those skilled in the art will appreciate that the mobile terminal architecture shown in fig. 1 is not intended to be limiting of mobile terminals, which may include more or fewer components than those shown, or some components may be combined, or a different arrangement of components.
The following describes each component of the mobile terminal in detail with reference to fig. 1:
the radio frequency unit 101 may be configured to receive and transmit signals during information transmission and reception or during a call, and specifically, receive downlink information of a base station and then process the downlink information to the processor 110; in addition, the uplink data is transmitted to the base station. Typically, radio frequency unit 101 includes, but is not limited to, an antenna, at least one amplifier, a transceiver, a coupler, a low noise amplifier, a duplexer, and the like. In addition, the radio frequency unit 101 can also communicate with a network and other devices through wireless communication. The wireless communication may use any communication standard or protocol, including but not limited to GSM (Global System for Mobile communications), GPRS (General Packet Radio Service), CDMA2000(Code Division Multiple Access 2000), WCDMA (Wideband Code Division Multiple Access), TD-SCDMA (Time Division-Synchronous Code Division Multiple Access), FDD-LTE (Frequency Division duplex Long Term Evolution), and TDD-LTE (Time Division duplex Long Term Evolution).
WiFi belongs to short-distance wireless transmission technology, and the mobile terminal can help a user to receive and send e-mails, browse webpages, access streaming media and the like through the WiFi module 102, and provides wireless broadband internet access for the user. Although fig. 1 shows the WiFi module 102, it is understood that it does not belong to the essential constitution of the mobile terminal, and may be omitted entirely as needed within the scope not changing the essence of the invention.
The audio output unit 103 may convert audio data received by the radio frequency unit 101 or the WiFi module 102 or stored in the memory 109 into an audio signal and output as sound when the mobile terminal 100 is in a call signal reception mode, a call mode, a recording mode, a voice recognition mode, a broadcast reception mode, or the like. Also, the audio output unit 103 may also provide audio output related to a specific function performed by the mobile terminal 100 (e.g., a call signal reception sound, a message reception sound, etc.). The audio output unit 103 may include a speaker, a buzzer, and the like.
The a/V input unit 104 is used to receive audio or video signals. The a/V input Unit 104 may include a Graphics Processing Unit (GPU) 1041 and a microphone 1042, the Graphics Processing Unit 1041 Processing image data of a fixed picture or video obtained by an image capturing device (e.g., a camera) in a video capturing mode or an image capturing mode. The processed image frames may be displayed on the display unit 106. The image frames processed by the graphic processor 1041 may be stored in the memory 109 (or other storage medium) or transmitted via the radio frequency unit 101 or the WiFi module 102. The microphone 1042 may receive sounds (audio data) via the microphone 1042 in a phone call mode, a recording mode, a voice recognition mode, or the like, and may be capable of processing such sounds into audio data. The processed audio (voice) data may be converted into a format output transmittable to a mobile communication base station via the radio frequency unit 101 in case of a phone call mode. The microphone 1042 may implement various types of noise cancellation (or suppression) algorithms to cancel (or suppress) noise or interference generated in the course of receiving and transmitting audio signals.
The mobile terminal 100 also includes at least one sensor 105, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor includes an ambient light sensor that can adjust the brightness of the display panel 1061 according to the brightness of ambient light, and a proximity sensor that can turn off the display panel 1061 and/or a backlight when the mobile terminal 100 is moved to the ear. As one of the motion sensors, the accelerometer sensor can detect the magnitude of acceleration in each direction (generally, three axes), can detect the magnitude and direction of gravity when stationary, and can be used for applications of recognizing the posture of a mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer and tapping), and the like; as for other sensors such as a fingerprint sensor, a pressure sensor, an iris sensor, a molecular sensor, a gyroscope, a barometer, a hygrometer, a thermometer, and an infrared sensor, which can be configured on the mobile phone, further description is omitted here.
The display unit 106 is used to display information input by a user or information provided to the user. The Display unit 106 may include a Display panel 1061, and the Display panel 1061 may be configured in the form of a Liquid Crystal Display (LCD), an Organic Light-Emitting Diode (OLED), or the like.
The user input unit 107 may be used to receive input numeric or character information and generate key signal inputs related to user settings and function control of the mobile terminal. Specifically, the user input unit 107 may include a touch panel 1071 and other input devices 1072. The touch panel 1071, also referred to as a touch screen, may collect a touch operation performed by a user on or near the touch panel 1071 (e.g., an operation performed by the user on or near the touch panel 1071 using a finger, a stylus, or any other suitable object or accessory), and drive a corresponding connection device according to a predetermined program. The touch panel 1071 may include two parts of a touch detection device and a touch controller. The touch detection device detects the touch direction of a user, detects a signal brought by touch operation and transmits the signal to the touch controller; the touch controller receives touch information from the touch sensing device, converts the touch information into touch point coordinates, sends the touch point coordinates to the processor 110, and can receive and execute commands sent by the processor 110. In addition, the touch panel 1071 may be implemented in various types, such as a resistive type, a capacitive type, an infrared ray, and a surface acoustic wave. In addition to the touch panel 1071, the user input unit 107 may include other input devices 1072. In particular, other input devices 1072 may include, but are not limited to, one or more of a physical keyboard, function keys (e.g., volume control keys, switch keys, etc.), a trackball, a mouse, a joystick, and the like, and are not limited to these specific examples.
Further, the touch panel 1071 may cover the display panel 1061, and when the touch panel 1071 detects a touch operation thereon or nearby, the touch panel 1071 transmits the touch operation to the processor 110 to determine the type of the touch event, and then the processor 110 provides a corresponding visual output on the display panel 1061 according to the type of the touch event. Although the touch panel 1071 and the display panel 1061 are shown in fig. 1 as two separate components to implement the input and output functions of the mobile terminal, in some embodiments, the touch panel 1071 and the display panel 1061 may be integrated to implement the input and output functions of the mobile terminal, and is not limited herein.
The interface unit 108 serves as an interface through which at least one external device is connected to the mobile terminal 100. For example, the external device may include a wired or wireless headset port, an external power supply (or battery charger) port, a wired or wireless data port, a memory card port, a port for connecting a device having an identification module, an audio input/output (I/O) port, a video I/O port, an earphone port, and the like. The interface unit 108 may be used to receive input (e.g., data information, power, etc.) from external devices and transmit the received input to one or more elements within the mobile terminal 100 or may be used to transmit data between the mobile terminal 100 and external devices.
The memory 109 may be used to store software programs as well as various data. The memory 109 may mainly include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required by at least one function (such as a sound playing function, an image playing function, etc.), and the like; the storage data area may store data (such as audio data, a phonebook, etc.) created according to the use of the cellular phone, and the like. Further, the memory 109 may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device.
The processor 110 is a control center of the mobile terminal, connects various parts of the entire mobile terminal using various interfaces and lines, and performs various functions of the mobile terminal and processes data by operating or executing software programs and/or modules stored in the memory 109 and calling data stored in the memory 109, thereby performing overall monitoring of the mobile terminal. Processor 110 may include one or more processing units; preferably, the processor 110 may integrate an application processor, which mainly handles operating systems, user interfaces, application programs, etc., and a modem processor, which mainly handles wireless communications. It will be appreciated that the modem processor described above may not be integrated into the processor 110.
The mobile terminal 100 may further include a power supply 111 (e.g., a battery) for supplying power to various components, and preferably, the power supply 111 may be logically connected to the processor 110 via a power management system, so as to manage charging, discharging, and power consumption management functions via the power management system.
Although not shown in fig. 1, the mobile terminal 100 may further include a bluetooth module or the like, which is not described in detail herein.
In order to facilitate understanding of the embodiments of the present invention, a communication network system on which the mobile terminal of the present invention is based is described below.
Referring to fig. 2, fig. 2 is an architecture diagram of a communication Network system according to an embodiment of the present invention, where the communication Network system is an LTE system of a universal mobile telecommunications technology, and the LTE system includes a UE (User Equipment) 201, an E-UTRAN (Evolved UMTS Terrestrial Radio Access Network) 202, an EPC (Evolved Packet Core) 203, and an IP service 204 of an operator, which are in communication connection in sequence.
Specifically, the UE201 may be the terminal 100 described above, and is not described herein again.
The E-UTRAN202 includes eNodeB2021 and other eNodeBs 2022, among others. Among them, the eNodeB2021 may be connected with other eNodeB2022 through backhaul (e.g., X2 interface), the eNodeB2021 is connected to the EPC203, and the eNodeB2021 may provide the UE201 access to the EPC 203.
The EPC203 may include an MME (Mobility Management Entity) 2031, an HSS (Home Subscriber Server) 2032, other MMEs 2033, an SGW (Serving gateway) 2034, a PGW (PDN gateway) 2035, and a PCRF (Policy and Charging Rules Function) 2036, and the like. The MME2031 is a control node that handles signaling between the UE201 and the EPC203, and provides bearer and connection management. HSS2032 is used to provide registers to manage functions such as home location register (not shown) and holds subscriber specific information about service characteristics, data rates, etc. All user data may be sent through SGW2034, PGW2035 may provide IP address assignment for UE201 and other functions, and PCRF2036 is a policy and charging control policy decision point for traffic data flow and IP bearer resources, which selects and provides available policy and charging control decisions for a policy and charging enforcement function (not shown).
The IP services 204 may include the internet, intranets, IMS (IP Multimedia Subsystem), or other IP services, among others.
Although the LTE system is described as an example, it should be understood by those skilled in the art that the present invention is not limited to the LTE system, but may also be applied to other wireless communication systems, such as GSM, CDMA2000, WCDMA, TD-SCDMA, and future new network systems.
Based on the above mobile terminal hardware structure and communication network system, the present invention provides various embodiments of the method.
First embodiment
Fig. 4 is a schematic structural diagram of a heat dissipation device provided in this embodiment, where the heat dissipation device includes: a metal middle frame 403, and a main board 401, two batteries 402, and a heat conducting member 405 which are arranged in the metal middle frame; the main board 401 is arranged in the middle of the metal middle frame 403; the two batteries 402 are respectively arranged at the left side and the right side of the main board 401; the heat conducting member 405 covers the motherboard 401 and the battery 402, and is used for connecting the motherboard 401 and the battery 402 and conducting part of heat of the motherboard 401 to the battery 402.
It should be understood that, in the present embodiment, the main heat dissipation object may be an electronic component on the motherboard 401, and specifically, the electronic component may be a Central Processing Unit (CPU). It is understood that a central processing unit is an operation core and a control core of an electronic device, and functions mainly to interpret computer instructions and process data in computer software. The central processing unit is composed of an arithmetic unit, a controller, a register, a cache and a bus for realizing data, control and state of the relation between the arithmetic unit, the controller, the register and the cache, and is used as the core of the whole system, and meanwhile, the central processing unit is also the highest execution unit of the whole system, so the central processing unit becomes the core component for determining the performance of the electronic device. Of course, in some other embodiments, the object to be radiated may also refer to other processors or other electronic components, and is not limited to the cpu as the object to be radiated.
Because the heat of the main board is too large, the terminal is unevenly cooled, and in the embodiment of the invention, the main board 401 is selectively arranged in the middle of the metal middle frame 403; the two batteries 402 are respectively arranged at the left side and the right side of the main board 401; the heat conducting component 405 covers the motherboard 401 and the battery 402, and is used for connecting the motherboard 401 and the battery 402 and conducting part of heat of the motherboard 401 to the battery 402; it should be understood that, in the embodiment of the present invention, the batteries 402 are disposed on two sides of the main board 401, that is, on the upper portion and the lower portion of the metal middle frame 403, and the number of the batteries 402 should not be limited, and may be set according to actual requirements, or one battery 402 may be selectively disposed on a single side of the main board 401, or a plurality of batteries 402 are uniformly disposed on two sides of the main board 401.
Further, the heat dissipation device further includes a heat dissipation member 404, and the heat dissipation member is disposed on the back surface of the motherboard 401 and used for heat dissipation on the back surface of the motherboard 401. The heat dissipation on the back of the motherboard 401 may be main heat generating chips such as charging IC and WiFi on the back of the motherboard, and the heat dissipation object may also refer to other electronic components, and is not limited to the heat generating chips listed in this embodiment.
The heat dissipation member 404 may be a heat dissipation fan.
In some embodiments, the heat dissipation device further includes a metal air duct, the metal air duct connects the back surface of the main board and the heat dissipation member 404, and the back surface of the main board 401 performs forced convection heat dissipation with the heat dissipation member through the metal air duct. The back plate side can also be provided with a plurality of layers of graphite for heat dissipation.
Preferably, the heat dissipation element 404 is disposed in the middle of the side of the main board 401, and the heat dissipation element 404 is close to the side of the metal middle frame 403. It should be understood that the heat dissipation member 404 is disposed in the middle of the side of the motherboard 401, which may facilitate uniform heat dissipation of the chip, and the heat dissipation fan, which is close to the side of the metal middle frame, may facilitate heat dissipation. In the specific implementation process, a plurality of radiating pieces can be arranged according to actual requirements, so that the radiating effect is enhanced, and the number of the radiating pieces is not limited.
In some embodiments, a dust-removing screen may be disposed on the heat dissipation fan. It should be understood that, as the service life of the terminal is prolonged, a lot of dust will be in the terminal, which will affect the service life of the cooling fan and the effect of the cooling fan, so that the dust-removing screen can prolong the service life of the cooling fan and improve the use effect.
In an embodiment of the present invention, the heat conducting member may be a temperature equalizing plate. And meanwhile, the heat conducting part is coated with a heat conducting adhesive layer in the contact area of the mainboard and the battery. The temperature equalizing plate is also covered with graphite. Through setting up heat-conducting glue layer, temperature-uniforming plate can be so that the heat of mainboard derives as fast as possible, through multilayer graphite, derives the heat to metal center and screen.
Advantageous effects
This embodiment provides a heat abstractor, and this heat abstractor is applied to the terminal, and this heat abstractor includes: the battery comprises a metal middle frame, a main board, two batteries and a heat conducting component, wherein the main board, the two batteries and the heat conducting component are arranged in the metal middle frame; the main board is arranged in the middle of the metal middle frame; the two batteries are respectively arranged on the left side and the right side of the mainboard; the heat conducting component covers the mainboard and the battery and is used for connecting the mainboard and the battery and conducting partial heat of the mainboard to the battery; simultaneously through setting up the radiating piece, a heat dissipation for the mainboard back, promote regional heat conduction of mainboard to mobile terminal external ability, do benefit to terminal complete machine samming heat-sinking ability, when the terminal transversely grips the use, it is little with lower frame difference in temperature to go up the frame, it feels to grip, improve user experience and feel, this heat abstractor passes through overall arrangement and built-in system fan can be quick conduction out the inside heat of cell-phone, improve mainboard SOC and rechargeable battery piece temperature, improve cell-phone operation and charging speed, prolonged service life, safety is improved, simultaneously this heat abstractor simple structure, high reliability.
Second embodiment
For better understanding of the present invention, the present embodiment is described with reference to a more specific example, and please refer to fig. 5, in which the heat dissipation apparatus provided in the embodiment of the present invention includes: a metal middle frame 403, and a main board 401, two batteries 402, a heat dissipation fan 403, and a heat conduction member 405 arranged in the metal middle frame; the main board 401 is arranged in the middle of the metal middle frame 403; the two batteries 402 are respectively arranged at the left side and the right side of the main board 401; the heat conducting component 405 covers the motherboard 401 and the battery 402, and is used for connecting the motherboard 401 and the battery 402 and conducting part of heat of the motherboard 401 to the battery 402; the heat dissipation fan 403 is disposed on the back of the motherboard 401.
Because the heat of the main board is too large, the terminal is unevenly cooled, so that the heat is dissipated from the front side and the back side of the main board, in the embodiment of the invention, the main board 401 is selectively arranged in the middle of the metal middle frame 403; the two batteries 402 are respectively arranged at the left side and the right side of the main board 401; the heat conducting component 405 covers the motherboard 401 and the battery 402, and is used for connecting the motherboard 401 and the battery 402 and conducting part of heat of the motherboard 401 to the battery 402; it should be understood that, in the embodiment of the present invention, it is equivalent to disposing the batteries 402 on both sides of the main board 401, i.e. on the upper and lower portions of the metal middle frame 403, and the number of the batteries 402 can be set according to actual requirements, one battery can be disposed, disposed on a single side of the main board 401,
the heat dissipation on the back of the motherboard 401 may be main heat generating chips such as charging IC and WiFi on the back of the motherboard, and the heat dissipation object may also refer to other electronic components, and is not limited to the heat generating chips listed in this embodiment.
The heat dissipation device further comprises a metal air duct 405, the metal air duct 405 is connected with the back of the main board 401 and the heat dissipation fan 404, and the back of the main board 401 and the heat dissipation member are subjected to forced convection heat dissipation through the metal air duct 405.
Preferably, the heat dissipation element 404 is disposed in the middle of the side of the main board 401, and the heat dissipation element 404 is close to the side of the metal middle frame 403. It should be understood that the heat dissipation member 404 is disposed in the middle of the side of the motherboard 401, which may facilitate uniform heat dissipation of the chip, and the heat dissipation fan, which is close to the side of the metal middle frame, may facilitate heat dissipation. In the specific implementation process, a plurality of radiating fins can be arranged according to actual requirements to enhance the radiating effect, and the number of radiating fins is not limited by the invention.
In some embodiments, a dust-removing screen may be disposed on the heat dissipation fan. It should be understood that, as the service life of the terminal is prolonged, a lot of dust will be in the terminal, which will affect the service life of the cooling fan and the effect of the cooling fan, so that the dust-removing screen can prolong the service life of the cooling fan and improve the use effect.
In an embodiment of the present invention, the heat conducting member may be a temperature equalizing plate 406. And meanwhile, the heat conducting part is coated with a heat conducting adhesive layer in the contact area of the mainboard and the battery. The temperature equalization plate is also covered with graphite 407. Through setting up heat-conducting adhesive layer, temperature-uniforming plate can make mainboard 401's heat as early as possible derive, through multilayer graphite, derive metal center and screen with the heat.
Advantageous effects
The second embodiment provides a heat dissipation apparatus, which is applied to a terminal, and includes: the battery comprises a metal middle frame, a main board, two batteries and a heat conducting component, wherein the main board, the two batteries and the heat conducting component are arranged in the metal middle frame; the main board is arranged in the middle of the metal middle frame; the two batteries are respectively arranged on the left side and the right side of the mainboard; the heat conducting component covers the mainboard and the battery and is used for connecting the mainboard and the battery and conducting partial heat of the mainboard to the battery; simultaneously through setting up radiator fan, a heat dissipation for the mainboard back, promote regional heat conduction of mainboard to mobile terminal external ability, do benefit to terminal complete machine samming heat-sinking ability, when the terminal transversely grips the use, it is little with lower frame difference in temperature to go up the frame, it feels to grip, improve user experience and feel, this heat abstractor passes through overall arrangement and built-in system fan can be quick conduction out the inside heat of cell-phone, improve mainboard SOC and rechargeable battery piece temperature, improve cell-phone operation and charging speed, prolonged service life, safety is improved, simultaneously this heat abstractor simple structure, high reliability.
Third embodiment
The embodiment also provides a terminal, which comprises the heat dissipation device in the first embodiment or the second embodiment, wherein the heat dissipation device can rapidly conduct internal heat of a mobile phone through the layout and the built-in system fan, so that the SOC of a main board and the temperature of a rechargeable battery piece are improved, the operation and charging speed of the mobile phone are improved, the service life is prolonged, the safety is improved, meanwhile, the heat dissipation device is simple in structure and high in reliability, and compared with the existing terminal, the terminal provided by the embodiment greatly improves the heat dissipation effect and the heat dissipation efficiency, prolongs the service life of the terminal, ensures the reliability of the terminal, and further improves the experience satisfaction degree of users; meanwhile, the whole mechanical structure of the heat dissipation device of the terminal provided by the embodiment is simple in composition, strong in realizability and more convenient for designers.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present invention may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present invention.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A heat dissipation device applied to a terminal is characterized in that the heat dissipation device comprises: the battery comprises a metal middle frame, a main board, two batteries and a heat conducting component, wherein the main board, the two batteries and the heat conducting component are arranged in the metal middle frame;
the main board is arranged in the middle of the metal middle frame;
the two batteries are respectively arranged on the left side and the right side of the mainboard;
the heat conducting component covers the mainboard and the battery and is used for connecting the mainboard and the battery and conducting partial heat of the mainboard to the battery.
2. The heat dissipating device of claim 1, further comprising a heat dissipating member disposed on the back surface of the main board for dissipating heat from the back surface of the main board.
3. The heat dissipating device of claim 2, wherein said heat dissipating member is a heat dissipating fan.
4. The heat dissipating device according to claim 2, further comprising a metal air duct connecting the back surface of the main board and the heat dissipating member, wherein the back surface of the main board performs forced convection heat dissipation with the heat dissipating member through the metal air duct.
5. The heat dissipating device of claim 2, wherein said heat dissipating member is disposed in the middle of the side of said main board, while said heat dissipating member is disposed near the side of said metal middle frame.
6. The heat dissipating device of claim 2, wherein a dust-removing screen is provided on the heat dissipating fan.
7. The heat dissipating device of any of claims 1-6, wherein the heat conducting member is a vapor chamber.
8. The heat dissipating device of claim 7, wherein the area of the heat conducting member in contact with the motherboard and the battery is coated with a layer of heat conducting adhesive.
9. The heat sink of claim 7, wherein the vapor chamber is covered with graphite.
10. A terminal, characterized in that the terminal comprises a heat sink according to any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010548292.8A CN112055507A (en) | 2020-06-16 | 2020-06-16 | Heat dissipation device and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010548292.8A CN112055507A (en) | 2020-06-16 | 2020-06-16 | Heat dissipation device and terminal |
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| CN112055507A true CN112055507A (en) | 2020-12-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010548292.8A Pending CN112055507A (en) | 2020-06-16 | 2020-06-16 | Heat dissipation device and terminal |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022127175A1 (en) * | 2020-12-15 | 2022-06-23 | 荣耀终端有限公司 | Electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080008861A (en) * | 2006-07-21 | 2008-01-24 | (주)케이티에프테크놀로지스 | Portable terminal having heat exhaust structure |
| CN106790797A (en) * | 2016-12-13 | 2017-05-31 | 奇酷互联网络科技（深圳）有限公司 | Center of terminal device and preparation method thereof and mobile terminal |
| CN109462963A (en) * | 2018-10-29 | 2019-03-12 | 努比亚技术有限公司 | A kind of radiator and terminal |
| CN110086912A (en) * | 2019-04-29 | 2019-08-02 | 南昌黑鲨科技有限公司 | A kind of terminal |
| CN110691493A (en) * | 2019-09-27 | 2020-01-14 | 努比亚技术有限公司 | Air-cooled heat dissipation device based on mobile terminal and mobile terminal |
-
2020
- 2020-06-16 CN CN202010548292.8A patent/CN112055507A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080008861A (en) * | 2006-07-21 | 2008-01-24 | (주)케이티에프테크놀로지스 | Portable terminal having heat exhaust structure |
| CN106790797A (en) * | 2016-12-13 | 2017-05-31 | 奇酷互联网络科技（深圳）有限公司 | Center of terminal device and preparation method thereof and mobile terminal |
| CN109462963A (en) * | 2018-10-29 | 2019-03-12 | 努比亚技术有限公司 | A kind of radiator and terminal |
| CN110086912A (en) * | 2019-04-29 | 2019-08-02 | 南昌黑鲨科技有限公司 | A kind of terminal |
| CN110691493A (en) * | 2019-09-27 | 2020-01-14 | 努比亚技术有限公司 | Air-cooled heat dissipation device based on mobile terminal and mobile terminal |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022127175A1 (en) * | 2020-12-15 | 2022-06-23 | 荣耀终端有限公司 | Electronic device |
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