CN212875888U

CN212875888U - Intelligent mobile phone with X64 architecture

Info

Publication number: CN212875888U
Application number: CN202022391754.8U
Authority: CN
Inventors: 景泉淞
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-10-23
Filing date: 2020-10-23
Publication date: 2021-04-02
Anticipated expiration: 2030-10-23
Also published as: WO2022083314A1

Abstract

The utility model discloses an X64 framework intelligent mobile phone, which comprises a PCB board, a CPU, a first chip set, a second chip set and a plurality of remote wireless modules, wherein the PCB board, the CPU, the first chip set, the second chip set and the plurality of remote wireless modules are arranged in the intelligent mobile phone; the CPU, the first chipset, the second chipset and the plurality of remote wireless modules are arranged on two sides of the PCB, and the CPU, the first chipset and the plurality of remote wireless modules are connected to the second chipset; a plurality of remote wireless modules are connected to the second chipset; the plurality of remote wireless modules includes a SIM card or e-SIM based communication module. The utility model relates to an X64 structure intelligent mobile phone, which has strong performance, compatibility and expandability; the voice or video call can be carried out by using communication technologies such as LTE, 2G, 3G, 4G, 5G, WIFI, Bluetooth and the like; the method is used for smoothly running part of the current mainstream 3A games at the medium and low image quality of 30FPS, and also improves a new solution for portable office.

Description

Intelligent mobile phone with X64 architecture

Technical Field

The utility model relates to a wireless communication technology, concretely relates to intelligent mobile phone of X64 framework.

Background

In the prior art, the architecture of the smart mobile phone basically adopts an ARM architecture, and both the high-pass, the joint and Haisi chip architecture and the apple A-series processor adopt the ARM architecture. ARM adopts the mode of authorizing the design scheme of the chip to other companies for production, has become more than 100 partners in the world, and ARM adopts RISC pipeline instruction set at the same time, is in the disadvantage at all in the aspect of accomplishing comprehensive work, and its advantage can exert the most dribbling in some application occasions of relatively fixed task. At present, the intelligent mobile phone mainly adopts an ARM architecture processor, mainly because of the low power consumption and high efficiency of ARM.

However, with the improvement of living standard of people, the dependence on the performance of the mobile phone is more and more increased, and the ARM architecture connects the CPU and the data storage device through a dedicated data interface, so the performance expansion of the storage, the memory and the like of the ARM is difficult to perform, so a system adopting the ARM structure can not be generally expanded, and the performance is greatly limited.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that current intelligent mobile phone performance based on ARM framework has received very big restriction, and aim at provides the intelligent mobile phone of X64 framework, solves above-mentioned problem.

The utility model discloses a following technical scheme realizes:

an intelligent mobile phone with an X64 architecture comprises a PCB (printed Circuit Board) arranged inside the intelligent mobile phone, a CPU (Central processing Unit), a first chipset, a second chipset and a remote wireless module; the CPU, the first chipset, the second chipset and the remote wireless module are all arranged on the PCB; the remote wireless module adopts a communication module based on an SIM card or an e-SIM; the remote wireless module is connected with the CPU, the first chip set and/or the second chip set; the CPU is connected with the first chipset, and the second chipset is connected with the CPU and/or the first chipset; the CPU, the first chipset, the second chipset and the remote wireless module can be integrated into a chip by two or three optional chips; the CPU, the first chipset, the second chipset, and the remote wireless module may also be integrated together into one chip.

With the progress of scientific technology in the prior art, the emergence of 7nm or even 5nm technology enables the power consumption of an X86 architecture, especially an X64 architecture CPU, to be reduced sharply while keeping high performance, which makes it possible to apply an efficient and energy-saving X64 architecture processor to a 4G or 5G smart mobile phone instead of an ARM architecture processor. Meanwhile, due to the appearance of the trade war of China and America, the processor with the X64 architecture also provides a new technical solution for domestic intelligent mobile phones.

The utility model discloses during the application, the inventor provides an intelligent mobile phone based on X64 framework, at first is the space utilization problem of solving intelligent mobile phone through the scheme of PCB board, and when CPU, first chipset, second chipset and long-range wireless module set up on the PCB board, because the thickness of present chipset is very little, so when placing these chips and module on two faces of two-sided PCB, the size of reduction PCB board that can be very big. Different from the technical scheme of the notebook computer, the notebook computer usually adopts a 9-15 inch screen due to the need of considering office use, so that the circuit board of the notebook computer can have a large area to use a single-layer circuit board.

And the utility model discloses then totally different, consider the portability of intelligent mobile phone, the inventor has adopted the technical scheme of PCB board, in the utility model discloses in, CPU, first chipset can adopt the existing complete chipset of integrating GPU, CPU and relevant chip, the comet lake framework treater and the icelake framework treater of INTEL series adopt 10nm technology, for example again the keelson 2 of AMD series, keelson 3 and keelson 4 treater adopt 7nm technology, the Iris Xe and the core such as Vega that it carried show to make it can operate under 7 ~ 15W's consumption, and the performance is far beyond existing ARM framework treater. With the spread of 5nm technology, the power consumption of these processors is further reduced. In the utility model, the size of the whole intelligent mobile phone can be compressed to 200mm × 90mm × 12mm physical size or even smaller, completely satisfying the portable demand of the mobile phone, compared with the 150mm × 75mm × 8.3mm size of apple 11, though slightly increasing, the utility model can smoothly operate the mainstream desktop level operating systems such as deepin, Chinese kylin, Ubuntu, android X86, Win10, red flag linux, etc.,

and simultaneously, the utility model discloses in, provide multiple integration scheme, CPU, first chipset, second chipset and long-range wireless module can choose two or optional three integrations as a chip, that is to say select two or three in these four to integrate, improve the utility model discloses an integration level, and then can adopt four above-mentioned chip complete integrated modes to further improve the utility model discloses an integration level. The utility model has strong performance, compatibility and expandability, and can use communication technologies such as LTE, 2G, 3G, 4G, 5G and the like to carry out voice or video call; meanwhile, a part of current games are smoothly operated at the medium image quality of 30FPS, and a new solution is improved for portable office.

Further, the communication module based on the SIM card or the e-SIM adopts a 2G communication module, a 3G communication module, a 4G communication module and/or a 5G communication module.

The utility model discloses during the application, still integrated 4G or 5G's communication module based on SIM card or e-SIM on the PCB board, this also has some differences with the LTE radio communication that existing part panel computer adopted, LTE radio communication speed is lower, can also be suitable for to low flow application such as video conversation, but to high flow application such as high definition video conversation then do not feel relieved, so the utility model discloses a 4G or 5G's SIM card communication scheme. Simultaneously, 4G or 5G's SIM card communication scheme also can be to the communication protocol of compatible 2G, 3G, and is same, communication protocols such as 6G that appear in the future are applicable to equally the utility model discloses, existing various wireless communication mode is also applicable to equally the utility model discloses.

Further, the first chipset adopts a north bridge chipset or an MCH chipset; the second chipset adopts a south bridge chipset or an ICH chipset.

Furthermore, the system also comprises a display screen, a ROM and a GPU;

the ROM is connected to the first chipset and arranged on the PCB;

the GPU is connected with the CPU, the first chipset or the second chipset; the GPU can be integrated with a CPU, a first chip set or a second chip set into a chip;

the display screen is connected to the GPU through a driving chip.

The utility model discloses during the application, can integrate GPU, it is called the core display card, and GPU can adopt the mode that directly links to connect, also can adopt the mode of bus to connect, just can accomplish through the core display card and show the relevant function of operation.

Further, the display screen adopts LED, LCD, OLED, Mini LED or Mirco LED.

The utility model discloses during the application, can adopt LED and LCD display screen to the demand of difference, the technique that can reference relevant enterprise simultaneously adopts the mode of the folding screen of OLED.

Further, the system also comprises a Bluetooth communication module and a WIFI module which are connected to the second chipset; the Bluetooth communication module is wirelessly connected with a Bluetooth peripheral; the Bluetooth peripheral comprises a Bluetooth keyboard and a Bluetooth mouse.

Further, the device also comprises a USB module, a BIOS chip, an audio processing chip, a RAM and an EC; the USB module, the BIOS chip, the audio processing chip, the RAM and the EC are all arranged on the PCB, and the USB module, the BIOS chip, the audio processing chip, the RAM and the EC are all connected to the second chipset; the audio processing chip is connected with a sound playing device arranged in the intelligent mobile phone.

When the utility model is applied, in view of the excellent expansibility of the X64 processor, the module arrangement of a general desktop computer can be adopted, a USB module, a BIOS chip, an audio processing chip and a RAM are added to improve the applicability, and the expandability and the interface communication speed can be further improved by additionally installing a PCI-e interface or thunder and lightning 4;

simultaneously the EC module is as the utility model discloses in carry out power control's important module, also need connect in the second chipset to the control of each device power is various, increases battery duration.

Further, the device also comprises a radiating fin and a radiating transmission device; the CPU, the first chipset, the second chipset and/or the remote wireless module are/is provided with cooling fins; the hot end of the heat dissipation transmission device is arranged on the heat dissipation sheet; the radiating fin and the radiating transmission device are both arranged inside the intelligent mobile phone.

Furthermore, the device also comprises a heat radiation fan; the heat dissipation transmission device adopts a heat pipe, and a cooling fan is arranged on the cold end of the heat pipe; the cooling fan is arranged on the intelligent mobile phone.

When the heat pipe cooling structure is applied, two schemes are provided for heat dissipation, one scheme is active heat dissipation, and the other scheme is passive heat dissipation, wherein the active heat dissipation adopts a mode that a fan actively dissipates heat to a cold end of the heat pipe aiming at the chip design with higher power consumption; passive heat dissipation is designed aiming at the chip with lower power consumption, the heat dissipation transmission device can adopt a soaking plate, and the cold end adopts a passive mode to dissipate heat.

The utility model discloses in, the module that uses all adopts current module, the utility model discloses only combine its organic, realized new technological effect, do not relate to the improvement in the aspect of the software.

Compared with the prior art, the utility model, following advantage and beneficial effect have:

1. the utility model relates to an X64 structure intelligent mobile phone, which has strong performance, compatibility and expandability;

2. the utility model relates to an intelligent mobile phone with X64 architecture, which can use communication technologies such as LTE, 2G, 3G, 4G, 5G and the like to carry out voice or video call;

3. the utility model relates to an intelligent mobile phone of X64 framework is in the medium picture quality smoothness operation most mainstream 3A recreation at present with 30FPS, has also improved new solution for portable official working.

Drawings

The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of an embodiment of the present invention;

FIG. 3 is a schematic view of an embodiment of the present invention;

fig. 4 is a schematic view of an embodiment of the present invention;

fig. 5 is a schematic view of an embodiment of the present invention;

fig. 6 is a schematic view of an embodiment of the present invention;

fig. 7 is a schematic view of an embodiment of the present invention.

Detailed Description

To make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the following examples and drawings, and the exemplary embodiments and descriptions thereof of the present invention are only used for explaining the present invention, and are not intended as limitations of the present invention.

Examples

When the present embodiment is implemented, the inventor provides an intelligent mobile phone based on an X64 architecture, and firstly, the problem of space utilization of the intelligent mobile phone is solved by a PCB board, and when the CPU, the first chipset, the second chipset, and the remote wireless module are disposed on the PCB board, since the thickness of the chipset is now small, when the chips and the modules are placed on two sides of a double-sided PCB, the size of the PCB board can be greatly reduced. Different from the technical scheme of the notebook computer, the notebook computer usually adopts a 9-15 inch screen due to the need of considering office use, so that the circuit board of the notebook computer can have a large area to use a single-layer circuit board.

The utility model discloses then totally different, consider the portability of intelligent mobile phone, the inventor has adopted the technical scheme of PCB board, in the utility model discloses in, CPU, first chipset can adopt the existing complete chipset of integrating GPU, CPU and relevant chip, the comet lake framework treater and the icelake framework treater of INTEL series adopt 14nm or 10nm technology, for example again Zen3 treater of AMD series adopt 7nm processing procedure technology, the kernel such as its Iris Xe and Vega that carries on shows and makes it can operate under 7 ~ 15W's consumption, and the performance is far beyond existing ARM framework treater. With the spread of 5nm technology, the power consumption of these processors is further reduced. The utility model discloses in, whole intelligent mobile phone's size can compress to 200mm x 90mm x 12 mm's physical dimension and is littleer even, satisfies the portable demand of cell-phone completely, compares in apple 11 150mm x 75mm x 8.3 mm's size although slightly increase, the utility model discloses can smoothly operate deepin, well bid kylin, Ubuntu, AndroidX86, Win10, mainstream desktop level operating system such as red flag linux, powerful and compatible and scalability extremely strong to can use communication technology such as LTE, 2G, 3G, 4G, 5G to carry out voice or video conversation; meanwhile, most of the current mainstream 3A games are smoothly operated at the medium image quality of 30FPS, and a new solution is also improved for portable office.

As shown in fig. 1, this embodiment provides an implementation manner in which a first chipset, a CPU, and a second chipset are connected in sequence.

For further illustration of the working process of the embodiment, the SIM card or e-SIM based communication module employs a 2G communication module, a 3G communication module, a 4G communication module and/or a 5G communication module.

When this embodiment is implemented, still integrated 4G or 5G's communication module based on SIM card or e-SIM on the PCB board, this also has some differences with the LTE wireless communication that present part panel computer adopted, and LTE wireless communication speed is lower, can also be suitable for low flow application such as video conversation, but to high definition video conversation high flow application then do not care, so the utility model discloses a 4G or 5G's SIM card communication scheme has been adopted. Meanwhile, the SIM card communication scheme of 4G or 5G can also be downward compatible with the communication protocols of 2G and 3G; in this embodiment, the communication module based on the SIM card or the e-SIM is preferably a simmon SIM7600, and the communication module based on the SIM card or the e-SIM communicates with the CPU, the first chipset and/or the second chipset through a channel such as PCIE or USB.

As another implementation manner of the present invention, the wireless communication is performed by using the hua shi ME909S-821, and the ME909S-821 is connected to the CPU, the first chipset and/or the second chipset by PCIE, USB or m.2.

In the implementation of this embodiment, along with the development of the integrated packaging technology, the packaging manners of the CPU, the first chipset, the second chipset, and the communication module based on the SIM card or the e-SIM tend to be various, so in this embodiment, two or three optional manners of the above four are adopted for packaging to improve the integration level of this embodiment, and even the integration level of this embodiment can be further improved by adopting a technology of packaging all the above four.

For further explaining the working process of this embodiment, the first chipset adopts a north bridge chipset or an MCH chipset; the second chipset adopts a south bridge chipset or an ICH chipset.

For further explanation, the working process of the embodiment further includes a display screen, a ROM, and a GPU;

the ROM is connected to the first chipset and arranged on the PCB;

the display screen is connected to the GPU through a driving chip.

To further illustrate the operation of the present embodiment, the display screen is LED, LCD, OLED, Mini LED or Mirco LED.

When this embodiment is implemented, can adopt LED and LCD display screen to different demands, can use for reference the technique of relevant enterprise simultaneously and adopt the mode of OLED folding screen.

To further illustrate the operation of the present embodiment, the plurality of remote wireless modules further includes a bluetooth communication module; the Bluetooth communication module is wirelessly connected with a Bluetooth peripheral; the Bluetooth peripheral comprises a Bluetooth keyboard and a Bluetooth mouse.

For further explaining the working process of the embodiment, the device further comprises a USB module, a BIOS chip, an audio processing chip and an RAM; the USB module, the BIOS chip, the audio processing chip, the EC control chip and the RAM are all arranged on the PCB, and the USB module, the BIOS chip, the audio processing chip and the RAM are all connected to the second chip set; the audio processing chip is connected with a sound playing device arranged in the intelligent mobile phone.

In the implementation of this embodiment, in view of the excellent extensibility of the X64 processor, a general desktop-level computer module arrangement may be adopted, and the USB module, the BIOS chip, the audio processing chip, and the RAM may be added to improve the applicability, and the extensibility and the interface communication speed may be further improved by additionally installing the PCI-e interface.

For further explaining the working process of the embodiment, the heat dissipation device further comprises a heat dissipation sheet and a heat dissipation transmission device; the CPU, the first chipset, the second chipset and/or the plurality of remote wireless modules are/is provided with cooling fins; the hot end of the heat dissipation transmission device is arranged on the heat dissipation sheet; the radiating fin and the radiating transmission device are both arranged inside the intelligent mobile phone.

For further explaining the working process of the embodiment, the heat radiation device further comprises a heat radiation fan; the heat dissipation transmission device adopts a heat pipe, and a cooling fan is arranged on the cold end of the heat pipe; the cooling fan is arranged on the intelligent mobile phone.

To further illustrate the operation of this embodiment, the CPU and the first chipset in this embodiment use intel ten generations core i7-10710U, which are packaged on the a-side of the PCB board by BGA, while the second chipset uses PCH IBEX PEAK chipset, such as the communication module with SIM card slot shown in fig. 2.

On the basis of the embodiment, because the power consumption is higher, the heat is radiated by adopting a heat pipe and fan radiation mode, the heat radiation fan is arranged at the bottom of the whole machine body, and the surface A of the PCB also faces the bottom of the machine body. And a display screen is arranged above the surface B of the PCB.

To further illustrate the operation of this embodiment, in this embodiment, the CPU and the first chipset are implemented by an AMD rlong 5700U processor packaged on the a side of the PCB board by BGA, while the second chipset is implemented by an ICH7 chipset on the B side of the PCB board, and the remote wireless module is implemented by a communication module with a SIM card slot.

On the basis of the embodiment, because the power consumption is lower, the heat is radiated in a heat pipe passive heat radiation mode, the cold end of the heat pipe is arranged at the bottom of the whole machine body, and the surface A of the PCB also faces the bottom of the machine body. And a display screen is arranged above the surface B of the PCB.

For further explaining the working process of this embodiment, the CPU and the first chipset in this embodiment adopt KX5000, KX6000 or KX7000 processors, and the mega-chip-based domestic chip is more suitable for the application of the present invention, although the process of this kind of chip adopts 16nm, the integration level is higher, in this embodiment, the CPU and the first chipset adopt BGA package mode to be directly packaged on the PCB board, and simultaneously, the second chipset adopts ZX-200IO to expand the chip. In this embodiment, the CPU and the first chipset may integrate PCIe, PCI, m.2, and other expansion interfaces.

Such as the chipset pin diagrams shown in fig. 3 and 4. In this embodiment, the CPU and the first chipset use Intel CPU Sandy Bridge, the second chipset uses Intel PCH, fig. 3 is a partial wiring diagram of the CPU and the first chipset, and fig. 4 is a partial wiring diagram of the second chipset.

As shown in fig. 5-7, as an implementation manner of the utility model, openly be provided with three button and two cameras, three button sets up in positive below, and the screen sets up in the button top, and the camera sets up in the upper portion of screen. As can be seen from fig. 6, three side buttons and an air outlet of the cooling fan are arranged on the side surface of the machine body, wherein the side button at the top is a volume adjusting button, the side button at the middle is a BIOS switch button, and the side button at the bottom is a power button. As can be seen in fig. 7, a back camera group and a fingerprint recognition module are disposed on the back of the body for taking pictures and recognizing fingerprints.

The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above description is only the embodiments of the present invention, and is not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. An intelligent mobile phone with an X64 architecture is characterized by comprising a PCB (printed Circuit Board) arranged inside the intelligent mobile phone, a CPU (Central processing Unit), a first chipset, a second chipset and a remote wireless module; the CPU, the first chip set and the second chip set are all arranged on the PCB; the remote wireless module adopts a communication module based on an SIM card or an e-SIM;

the remote wireless module is connected with the CPU, the first chip set and/or the second chip set;

the CPU is connected with the first chipset, and the second chipset is connected with the CPU and/or the first chipset;

the CPU, the first chipset, the second chipset and the remote wireless module can be integrated into a chip by two or three optional chips;

the CPU, the first chipset, the second chipset, and the remote wireless module may also be integrated together into one chip.

2. The smart mobile phone of X64 architecture according to claim 1, wherein the SIM card or e-SIM based communication module is a 2G communication module, a 3G communication module, a 4G communication module and/or a 5G communication module.

3. The smart mobile phone of X64 architecture as claimed in claim 1, wherein the first chipset is a Northbridge chipset or an MCH chipset; the second chipset adopts a south bridge chipset or an ICH chipset.

4. The X64-based smart mobile phone of claim 1, further comprising a display screen, ROM, and GPU;

the ROM is connected to the first chipset and arranged on the PCB;

the display screen is connected to the GPU through a driving chip.

5. The X64-based smart mobile phone of claim 4, wherein the display screen is LED, LCD, OLED, Mini LED or Mirco LED.

6. The smart mobile phone of X64 architecture as claimed in claim 1, further comprising a bluetooth communication module and a WIFI module connected to the second chipset; the Bluetooth communication module is wirelessly connected with a Bluetooth peripheral; the Bluetooth peripheral comprises a Bluetooth keyboard and a Bluetooth mouse.

7. The smart mobile phone of X64 architecture as claimed in claim 1, further comprising a USB module, a BIOS chip, an audio processing chip, a RAM and an EC; the USB module, the BIOS chip, the audio processing chip, the RAM and the EC are all arranged on the PCB, and the USB module, the BIOS chip, the audio processing chip, the RAM and the EC are all connected to the second chipset; the audio processing chip is connected with a sound playing device arranged in the intelligent mobile phone.

8. The smart mobile phone of X64 architecture of claim 1, further comprising a heat sink and a heat sink transmission device; the CPU, the first chipset, the second chipset and/or the remote wireless module are/is provided with cooling fins; the hot end of the heat dissipation transmission device is arranged on the heat dissipation sheet; the radiating fin and the radiating transmission device are both arranged inside the intelligent mobile phone.

9. The smart mobile phone of X64 architecture as claimed in claim 8, further comprising a heat dissipation fan; the heat dissipation transmission device adopts a heat pipe, and a cooling fan is arranged on the cold end of the heat pipe; the cooling fan is arranged on the intelligent mobile phone.