WO2018163284A1

WO2018163284A1 - Component mounting device and method for holding substrate

Info

Publication number: WO2018163284A1
Application number: PCT/JP2017/008997
Authority: WO
Inventors: 武小木曽
Original assignee: ヤマハ発動機株式会社
Priority date: 2017-03-07
Filing date: 2017-03-07
Publication date: 2018-09-13
Also published as: KR20190087578A; CN110192444B; JP6840223B2; CN110192444A; KR102208102B1; JPWO2018163284A1

Abstract

The present description discloses a component mounting device, i.e., a surface mounting machine 10, which is provided with: a backup unit 50 having a backup plate 51 that sucks and holds a printed board P, on which an electronic component E is to be mounted; and a mounting head 32 having a suction nozzle 34 that mounts the electronic component E on the printed board P. The surface mounting machine is configured such that the suction nozzle 34 can press the printed board P to the backup plate 51 in a step wherein the backup plate 51 holds and fixes the printed board P by sucking the printed board.

Description

Component mounting apparatus and substrate holding method

The technology disclosed in this specification relates to a component mounting apparatus and a substrate holding method.

For example, as a component mounting apparatus including a receiving member that sucks and holds a substrate on which a component is mounted, a device described in Japanese Patent Application Laid-Open No. 2004-296632 (Patent Document 1 below) is known. This component mounting apparatus includes a deformation correction head having a pressing member capable of pressing the entire component mounting portion of the substrate. The substrate is received by pressing the substrate against the receiving member by the pressing member to correct the deformation. Adsorb to the member.

JP 2004-296632 A

However, according to such a component mounting apparatus, in order to adsorb the substrate to the receiving member, a deformation correction head is provided on the side surface of the mounting head together with the drive mechanism separately from the mounting head for mounting the component on the substrate. Yes. For this reason, the number of parts is increased, and a space for arranging the deformation correction head and the drive mechanism is required, resulting in an increase in the size of the component mounting apparatus. Further, since the deformation correction head and the drive mechanism are provided on the side surface of the mounting head, it becomes an obstacle for moving the mounting head at high speed.

This specification discloses a technique for appropriately holding a substrate while suppressing an increase in the number of parts.

The technology disclosed in this specification is a component mounting apparatus including a holding plate that sucks and holds a substrate on which a component is mounted, and a mounting head that mounts the component on the substrate. In the process in which the holding plate sucks and holds the substrate, the substrate can be pressed against the holding plate.

In addition, the technology disclosed in this specification is a substrate holding method in a component mounting apparatus including a holding plate that sucks and holds a substrate on which a component is mounted, and a mounting head on which the component is mounted on the substrate. In the process in which the holding plate sucks and holds the substrate, the mounting head presses the substrate against the holding plate.

According to the component mounting apparatus having such a configuration, when the board is warped, the board can be pressed against the holding plate by the mounting head, so that the board can be properly held by the holding plate. In addition, since the substrate is pressed against the holding plate by the mounting head for mounting the component on the substrate, there is no need to provide a separate pressing mechanism for pressing the substrate separately from the mounting head as in the prior art, thus preventing an increase in the number of components. be able to. Moreover, since a space for disposing the pressing mechanism is not required, it is possible to prevent the component mounting apparatus from becoming large.

The component mounting apparatus disclosed in this specification may have the following configuration.
The mounting head may include a suction nozzle capable of pressing a predetermined position of the substrate.
According to such a configuration, the substrate can be pressed against the holding plate by pressing a predetermined position of the substrate with the suction nozzle.

The control unit may further include a control unit that performs a primary correction process of pressing the mounting head against the substrate when an adsorption error that causes insufficient adsorption of the substrate on the holding plate is detected.

According to such a configuration, when a suction error is detected in the holding plate, the mounting head presses the substrate.For example, compared to the case where the mounting head presses the substrate regardless of the presence or absence of the suction error, Work efficiency can be improved.

The controller may detect a suction error due to the warping of the substrate by comparing the pressure when the substrate is sucked by the holding plate with the pressure when the holding plate sucks the substrate properly.

According to such a configuration, a suction error due to the warpage of the substrate can be detected by comparing the pressure at the time of suction with the pressure when the holding plate appropriately sucks the substrate. Thereby, for example, the number of parts can be reduced as compared with the case of determining a substrate suction error by image recognition or the like, and a suction error can be confirmed with a simple configuration.

The controller may intermittently press a plurality of locations on the outer edge of the substrate by the mounting head in the primary correction process.

Generally, since the substrate is likely to warp at the outer edge portion, the mounting head can hold the substrate properly by the holding plate only by intermittently pressing the outer edge portion of the substrate as described above.

The control unit may end the pressing of the substrate by the mounting head when the elimination of the adsorption error is detected in the primary correction process.

According to such a configuration, when it is detected that the suction error has been resolved, the pressing of the substrate by the mounting head is completed. For example, mounting is performed in comparison with a case where multiple locations on the outer edge of the substrate are pressed by the mounting head. The work efficiency of work can be improved.

The control unit includes a storage unit that stores a pressing position when it is detected that the suction error has been eliminated by pressing the substrate by the mounting head, and the control unit is based on suction of the substrate on the holding plate. When releasing the holding, a substrate fixing releasing process may be performed in which the pressing position stored in the storage unit is pressed by the mounting head and the mounting head is slowly separated from the substrate.

According to such a configuration, when releasing the holding by the adsorption of the substrate, the rapid repulsion due to the warping of the substrate can be suppressed by slowly pulling the mounting head away from the substrate. Thereby, when holding | maintenance of a board | substrate is cancelled | released, it can suppress that the components mounted in the board | substrate shift.

The control unit includes a storage unit that stores a mounting position of the component mounted on the substrate, and when the pressing planned position of the substrate to be pressed by the mounting head and the mounting position of the component overlap, The pressing by the mounting head at the planned pressing position overlapping the mounting position may be stopped.

According to such a configuration, it is possible to prevent the component from being pressed by the mounting head and to prevent the mounted component from being damaged.

The control unit may determine a position adjacent to the planned pressing position and the mounting position as an alternative position that can be pressed by the mounting head when the planned pressing position and the mounting position overlap.

According to such a configuration, by pressing the alternative position with the mounting head, it is possible to appropriately hold the substrate with the holding plate while suppressing damage to the components by the mounting head.

According to the technique disclosed in this specification, it is possible to appropriately hold the substrate while suppressing an increase in the number of parts.

Plan view of surface mounter according to Embodiment 1 Front view of surface mounter Block diagram showing the electrical configuration of the surface mounter Top view of backup unit Side view of the head unit on the backup unit Diagram showing backup unit and pressure sensor Substrate fixing process flowchart Flow chart of primary correction process Flowchart of substrate fixation release processing Diagram showing positional relationship between printed circuit board and backup unit The perspective view which shows the state which has arranged the printed circuit board with curvature on the backup unit Side view showing warped printed circuit board placed on backup unit Side view showing a state where the warped portion of the printed circuit board is being pressed by the suction nozzle The flowchart of the primary correction process concerning Embodiment 2. The figure which showed the state where the electronic component is mounted in the pressing position of the printed circuit board

<Embodiment 1>
The first embodiment exemplifies a surface mounter (an example of a “component mounting apparatus”) 10 that mounts an electronic component (an example of “component”) E on a printed circuit board (an example of “substrate”) P. As shown in FIG. 1, the surface mounter 10 has a base 11 having a substantially rectangular shape in plan view, a conveyor 12 for transporting the printed board P onto the base 11, and an electronic component E mounted on the printed board P. The component mounting unit 20, the backup unit 50 that supports the printed circuit board P at the mounting position, and the component supply device 13 for supplying the electronic component E to the component mounting unit 20 are configured.

In the following description, the horizontal direction is based on the horizontal direction in FIG. 1 (the long side direction of the base 11 and the conveyance direction of the conveyor 12) and the horizontal direction in FIG. Further, the front-rear direction is based on the up-down direction (short side direction of the base 11) in FIG. 1 and the left-right direction in FIG. 4, and in FIG. In the explanation, the left side in the figure is the front side and the right side in the figure is the rear side.

As shown in FIG. 1, the base 11 has a substantially rectangular shape in a plan view that is horizontally long in the left-right direction. On the base 11, a pair of transport conveyors 12, a pair of transport conveyors 12, and a pair of transport conveyors 12 are arranged. A backup unit 50, a component mounting unit 20, and the like arranged between them are arranged.

The pair of left and right transport conveyors 12 and the backup unit 50 are in a continuous state without any step, and can transport the printed circuit board P to be mounted in the left-right direction. As shown in FIG. 1, each conveyor 12 has a pair of conveyor belts 14 that are circulated and driven in the left-right direction, and a printed circuit board P is set on the pair of conveyor belts 14. The printed circuit board P is carried into the mounting position on the backup unit 50 along the conveyor belt 14 from the right side in the left-right direction. After mounting the electronic component E at the mounting position, the printed board P is moved in the left-right direction along the conveyor belt 14. It is designed to be carried out on the left side.

The backup unit 50 is for holding and fixing the printed circuit board P when the electronic component E is mounted on the printed circuit board P. As shown in FIGS. 2 and 4 to 6, the backup unit 50 is horizontally long. It has a block shape. The backup unit 50 includes a backup plate (an example of a “holding plate”) 51 on which the printed circuit board P is placed, a negative pressure supply member 52 provided below the backup plate 51, and a negative pressure supply member 52. Furthermore, it comprises a support member 53 disposed below and a pair of side plates 54 provided on both sides in the front-rear direction.

The backup plate 51 is made of metal, and the upper surface 51A of the backup plate 51 is set to have a high flatness. In addition, a plurality of suction holes 55 that are small enough to allow air to pass therethrough are provided on the upper surface 51A of the backup plate 51 side by side in the front-rear and left-right directions while penetrating the backup plate 51 in the vertical direction.

The negative pressure supply member 52 has a flat plate shape slightly thicker than the backup plate 51, and is provided in substantially the same size as the backup plate 51 in the front-rear and left-right directions. As shown in FIG. 6, a negative pressure supply path 56 corresponding to the suction hole 55 of the backup plate 51 is provided inside the negative pressure supply member 52, and an air supply device 60 is provided in the negative pressure supply path 56. The negative pressure is supplied from. When a negative pressure is supplied to the negative pressure supply path 56, a negative pressure is supplied to each suction hole 55, and the printed circuit board P placed on the upper surface 51A of the backup plate 51 is sucked by the backup plate 51 by the negative pressure. It is designed to be held and fixed.

The support member 53 is provided in a block shape having substantially the same size as the negative pressure supply member 52 in the front-rear and left-right directions. The backup unit 50 is fixed to the base 11 by fixing the support member 53 to the base 11 by a fixing mechanism (not shown).

The pair of side plates 54 is provided in a size that covers the backup plate 51, the negative pressure supply member 52, and the support member 53 from both sides in the front-rear direction, and the pair of side plates 54 positions the three members from both sides in the front-rear direction. It is fixed in the state. On the inner surface of each side plate 54, a conveyance belt 54A that circulates in the left-right direction is provided. Each conveyor belt 54A conveys the printed circuit board P in the left-right direction on the backup unit 50.

As shown in FIG. 1, the component supply device 13 is a feeder type, and two parts are arranged in the left-right direction on both sides in the up-down direction of the conveyer 12, and are arranged in a total of four locations. A plurality of feeders 16 are attached to these component supply devices 13 so as to be aligned in the left-right direction. Each feeder 16 includes an unillustrated electric delivery device that pulls out a component supply tape containing a plurality of electronic components E from a reel, and each feeder 16 has an electronic component E from the end on the conveyor 12 side. One by one.

The component mounting unit 20 takes out the electronic component E supplied from the component supply device 13 onto the base 11 and mounts it on the printed circuit board P. As shown in FIG. And a pair of Y-axis frames 21, an X-axis frame 26 installed on the pair of Y-axis frames 21, and a head unit 30 movably attached to the X-axis frame 26. ing.

The pair of Y-axis frames 21 are provided with a Y-axis guide rail 24 arranged along the Y-axis frame 21 and a Y-axis servo motor 25. When the Y-axis servo motor 25 is energized and controlled, The X-axis frame 26 and the head unit 30 attached to the X-axis frame 26 move in the front-rear direction along the Y-axis guide rail 24.

The X-axis frame 26 extends in the left-right direction. The X-axis frame 26 is provided with an X-axis guide rail 27 arranged along the X-axis frame 26 and an X-axis servo motor 28. When the energization of the X-axis servomotor 28 is controlled, the head unit 30 moves in the left-right direction along the X-axis guide rail 27.

As shown in FIGS. 1 and 2, the head unit 30 includes a box-shaped head unit main body 31 and a plurality of mounting heads (an example of a “mounting head”) 32 that performs the mounting operation of the electronic component E. Yes.

As shown in FIGS. 2 and 5, the plurality of mounting heads 32 are arranged side by side in the left-right direction in a form protruding downward from the head unit main body 31, and each mounting head 32 is a rotating shaft extending in the vertical direction. 33 and a suction nozzle (an example of a “mounting head”) 34 that can be attached to and detached from the lower end that is the tip of the rotary shaft 33.

The rotary shaft 33 is provided with a Z-axis servo motor 31A and an R-axis servo motor 31B provided in the head unit main body 31. As shown in FIG. 13, the rotary shaft 33 can be moved up and down by a Z-axis servomotor 31A, and can be rotated around an axis by an R-axis servomotor 31B.

As shown in FIGS. 5 and 6, the suction nozzle 34 has a substantially cylindrical shape extending in the vertical direction. The suction nozzle 34 is held at the lower end portion of the rotary shaft 33 by holding the upper end portion by a holding portion (not shown) provided at the lower end portion of the rotary shaft 33.

As shown in FIG. 6, the lower end opening edge of the suction nozzle 34 has a horizontal shape parallel to the upper surface of the base 11, and the suction nozzle 34 is provided inside the rotation shaft 33 and is not shown inside the suction nozzle 34. An air passage (not shown) communicating with the supply passage is provided.

A negative pressure or a positive pressure is supplied to the air passage from an air supply device 60 connected to the supply path of the rotary shaft 33. The suction nozzle 34 sucks and holds the electronic component E by the negative pressure supplied to the air passage, and releases the electronic component E by the positive pressure supplied to the air passage. The lower end opening edge of the suction nozzle 34 can press the electronic component E or the like. When the electronic component E is released by the suction nozzle 34, the suction nozzle 34 holding the electronic component E is connected to the printed circuit board P. The electronic component E can be mounted at an appropriate position on the printed circuit board P by being released by being slightly pressed against the printed circuit board P.

Therefore, the component mounting unit 20 can move the head unit 30 back and forth and right and left on the base 11 by driving the Y-axis servo motor 25 and the X-axis servo motor 28, and drives the Z-axis servo motor 31A. As a result, the suction nozzle 34 can be lowered to take out the electronic component E from the component supply device 13, or the electronic component E can be mounted on the printed circuit board P held and fixed to the backup unit 50. Yes.

As shown in FIG. 2, the head unit 30 is provided with a substrate recognition camera 20A on the side surface of the head unit main body 31, and the substrate recognition camera 20A takes an image of the printed board P and images the printed board P. It comes to recognize. Further, as shown in FIG. 1, a pair of component recognition cameras 15 are installed on both sides of the backup unit 50 in the front-rear direction on the base 11, and each component recognition camera 15 is a mounting head of the head unit 30. The electronic component E sucked and held by the camera 32 is photographed.

Next, the electrical configuration of the surface mounter 10 will be described with reference to FIG.

The surface mounter 10 is entirely controlled by a control unit 110, and the control unit 110 includes an arithmetic processing unit (an example of a “control unit”) 111 configured by a CPU or the like. The arithmetic processing unit 111 is connected to a motor control unit 112, a storage unit 113, an image processing unit 114, an external input / output unit 115, a component supply device communication unit 116, a management device communication unit 117, an operation unit 118, and the like.

The motor control unit 112 is based on a mounting program stored in the storage unit 113 according to a command from the arithmetic processing unit 111, and includes a Y-axis servo motor 25, an X-axis servo motor 28, a Z-axis servo motor 31A, and an R-axis servo motor. The electronic component E is mounted by controlling 31B, the conveyor 12, and the like.

The storage unit 113 stores various programs such as a mounting program for mounting the electronic component E on the printed board P, a board fixing program for holding and fixing the printed board P, various data, and the like. The various data includes information on the number of printed circuit boards P that are scheduled to be produced and board information related to the product type, information on the holding reference pressure when the backup unit 50 holds and fixes the printed board P, and the like.

The image processing unit 114 captures an image signal output from the board recognition camera 20A or the component recognition camera 15, and generates an image based on the captured image signal.

The external input / output unit 115 is a so-called interface. The arithmetic processing unit 111 takes in detection signals output from various sensors 62 such as the pressure sensor 63 of the air supply device 60 through the external input / output unit 115, and outputs a control signal to the air supply device 60 through the external input / output unit 115. To do.

The component supply device communication unit 116 is connected to the component supply device 13 and controls the component supply device 13 in an integrated manner.

The management device communication unit 117 is communicably connected to the management device 90. The management device 90 executes an optimization program based on the type of the printed circuit board P scheduled to be produced, and the order in which the electronic components E are mounted. Determine in advance.

The operation unit 118 includes a display device (not shown) such as a liquid crystal monitor, an input device (not shown) such as a keyboard and a mouse, etc., and receives an input from an operator and outputs it to the operator.

In addition, the arithmetic processing unit 111 controls the air supply device 60 through the external input / output unit 115 by executing the substrate fixing program stored in the storage unit 113, and the substrate that holds and fixes the printed circuit board P in the backup unit 50. Perform fixed processing.

Hereinafter, the substrate fixing process will be described with reference to the flowchart shown in FIG.

In the board fixing process, when the printed board P is transported to the mounting position on the backup unit 50, the arithmetic processing unit 111 controls the air supply device 60 through the external input / output unit 115, and the negative pressure supply member of the backup unit 50 is obtained. A negative pressure is supplied to 52 (S11). Thereby, negative pressure is supplied to the suction hole 55 of the backup plate 51, and the printed circuit board P arranged at the mounting position is sucked by the backup plate 51 of the backup unit 50.

Next, the arithmetic processing unit 111 takes in a detection signal from the pressure sensor 63 of the air supply device 60 through the external input / output unit 115, and the pressure of the pressure sensor 63 rises above the retained reference pressure stored in the storage unit 113. (S12). Here, the holding reference pressure is set to a value slightly lower than the pressure generated when the printed circuit board P is appropriately adsorbed to the backup plate 51.

When the pressure of the pressure sensor 63 is higher than the holding reference pressure (S12: YES), the arithmetic processing unit 111 determines that all the suction holes 55 of the backup plate 51 are blocked by the printed circuit board P. .
That is, assuming that the printed board P is properly held and fixed at the mounting position of the backup unit 50, the board fixing process is terminated.

On the other hand, when the pressure of the pressure sensor 63 is lower than the holding reference pressure (S12: NO), the arithmetic processing unit 111 does not block any of the suction holes 55 of the backup plate 51 with the printed board P, and does not close the printed board P. It is determined that the suction has become insufficient and a suction error has occurred in which the printed circuit board P is not properly held and fixed. Thereby, an adsorption error of the printed circuit board P is detected.

Specifically, for example, due to warping of the printed circuit board P, a portion P1 in which the warpage occurs in the printed circuit board P with respect to the backup plate 51 is in a floating state (see FIGS. 11 and 12). Since all the suction holes 55 in the plate 51 are not blocked by the printed circuit board P, it is determined that the printed circuit board P is not properly held and fixed, and a suction error is detected (S20).

In view of this, when detecting a suction error in which the printed circuit board P is not properly held and fixed, the arithmetic processing unit 111 performs primary correction processing for temporarily correcting the printed circuit board P (S20). The fact that the primary correction process has been performed is stored. During the substrate fixing process and the primary correction process, negative pressure is continuously supplied to the backup unit 50 from the air supply device 60.

Hereinafter, the primary correction process will be described with reference to the flowchart shown in FIG.

In the primary correction process, first, the motor control unit 112 drives the Y-axis servo motor 25 and the X-axis servo motor 28 according to a command from the arithmetic processing unit 111, and the mounting head 32 in the head unit 30 is placed on the printed circuit board P. Arrange (S21).

Next, the motor control unit 112 drives the Z-axis servo motor 31A in the head unit 30 to lower the suction nozzle 34 in the mounting head 32 and presses the planned pressing position PP set on the printed circuit board P.

Specifically, as shown in FIGS. 10 and 11, the plurality of pressing positions PP are intermittently set on the outer peripheral edge P2 of the printed circuit board P (in this embodiment, set at the four corners of the printed circuit board P). In the primary correction process, the first pressing position PP of the plurality of pressing positions PP is pressed by the suction nozzle 34 to press the printed circuit board P against the backup plate 51 (S22). In FIG. 10, the suction holes 55 on the upper surface 1 of the backup plate are reduced in number and enlarged for easy understanding.
Next, the lowered suction nozzle 34 is raised, and it is determined whether the pressure of the pressure sensor 63 is higher than the holding reference pressure (S23).

When the pressure of the pressure sensor 63 is higher than the holding reference pressure (S23: YES), the arithmetic processing unit 111 temporarily corrects the portion P1 in which the warp has occurred in the printed board P, and the printed board P is appropriate. The pressing position (pressed pressing scheduled position PP) PF is stored in the storage unit 113, and the primary correction process is terminated.

Specifically, as shown in FIG. 13, a portion P <b> 1 in which warpage has occurred in the printed circuit board P is temporarily corrected by pressing the pressing position PP on the printed circuit board P against the backup plate 51. Then, the portion P1 where the warp has occurred in the printed circuit board P is brought into close contact with the backup plate 51 by the negative pressure, and the printed circuit board P is held in a state where it is primarily corrected. Accordingly, all the suction holes 55 of the backup plate 51 are closed by the printed board P, and the printed board P is properly held and fixed, so that the pressure of the pressure sensor 63 is higher than the holding reference pressure. Get higher.

On the other hand, when the state where the pressure of the pressure sensor 63 is lower than the holding reference pressure (S23: NO) continues, the arithmetic processing unit 111 does not block all the suction holes 55 of the backup plate 51 with the printed board P. Then, it is determined that the printed circuit board P is not properly held and fixed, and the next scheduled pressing position PP among the plurality of scheduled pressing positions PP is pressed (S24).

Then, the processes of S23 and S24 are repeated until the pressure of the pressure sensor 63 rises above the holding reference pressure, and the plurality of scheduled pressing positions PP are sequentially pressed. When the pressure of the pressure sensor 63 rises above the holding reference pressure, the arithmetic processing unit 111 stores the pressing position PF in the storage unit 113 and ends the primary correction process.
That is, a plurality of scheduled pressing positions PP set on the printed circuit board P are sequentially pressed by the suction nozzle 34, and the calculation processing unit 111 increases the pressure of the pressure sensor 63 above the holding reference pressure, thereby eliminating the suction error. When it is detected that the pressing has been performed, the pressing of the planned pressing position PP by the suction nozzle 34 is terminated.

In the process of repeating the processes of S23 and S24, when the pressing position PF is the final pressing position PP, the arithmetic processing unit 111 determines the pressure of the pressure sensor 63 after pressing the final pressing position PP. It is determined whether the pressure is lower than the holding reference pressure (S25). When the pressure of the pressure sensor 63 is still lower than the holding reference pressure (S25: YES), the arithmetic processing unit 111 cannot perform the primary correction of the printed circuit board P by the primary correction process, and the backup unit 50 performs the printing. It is determined that the substrate P could not be properly held and fixed. Then, information such as an error message is displayed on the display device of the operation unit 118 (S26), and the primary correction process is terminated with an error.

In the primary correction process, when the printed circuit board P is appropriately held and fixed to the backup unit 50, the motor control unit 112 sends the electronic component E to the printed circuit board P based on the mounting program in accordance with a command from the arithmetic processing unit 111. Mount.

After completing the mounting of the electronic component E, the arithmetic processing unit 111 stops the supply of negative pressure from the air supply device 60 and releases the fixation of the printed circuit board P in the backup unit 50. Then, the printed circuit board P is carried out by the conveyor 12.

Here, when the printed circuit board P is temporarily corrected and held and fixed by the primary correction processing, when the supply of the negative pressure to the backup unit 50 is stopped, the temporarily corrected portion of the printed circuit board P (warping occurs in the printed circuit board P). There is a risk that the portion P1) that is being bent will be elastically repelled vigorously. If the temporarily corrected portion of the printed circuit board P is elastically repelled, the electronic component E mounted on the printed circuit board P is displaced.

Therefore, in the present embodiment, when the printed board P is released from being fixed, a board fixing release process for suppressing the elastic repulsion of the printed board P is performed.
Hereinafter, the substrate fixing release process will be described with reference to the flowchart shown in FIG.

In the substrate fixing release process, first, the arithmetic processing unit 111 determines whether or not the primary correction process has been performed in the substrate fixing process with reference to the storage unit 113 (S31). As a result of the determination, when the primary correction process is not performed (S31: NO), the arithmetic processing unit 111 stops the supply of the negative pressure from the air supply device 60. Then, the fixing of the printed board P is released in the backup unit 50 (S32), and the board fixing release process is terminated.

On the other hand, when the primary correction process is performed in the substrate fixing process (S31: YES), the arithmetic processing unit 111 calls the pressing position PF from the storage unit 113 (S33), and the motor control unit 112 and the Y-axis servomotor 25 The called pressing position PF is pressed by the suction nozzle 34 by driving the X-axis servo motor 28 and the Z-axis servo motor 31A (S34).

Next, the supply of the negative pressure from the air supply device 60 is stopped, and the fixing of the printed circuit board P is released in the backup unit 50 (S35).
Here, when the negative pressure is stopped, the suction position PF is pressed by the suction nozzle 34, although the suction by the negative pressure of the portion P1 where the warp has occurred in the printed board P is released. It is possible to prevent elastic repulsion of the portion P1 where the warp is generated.

Next, the arithmetic processing unit 111 drives the Z-axis servo motor 31A through the motor control unit 112 and presses the pressing position PF so that the warped portion P1 of the printed circuit board P does not vigorously elastically repel. The sucked nozzle 34 is lifted so as to be slowly separated from the printed board P (S36). Then, the portion P1 in which the warp is generated in the printed circuit board P is not elastically repelled, and the fixing of the printed circuit board P is completely released, and the circuit board fixing release process is finished.
That is, it is possible to prevent the electronic component E mounted on the printed circuit board P from being displaced due to releasing the holding and fixing of the printed circuit board P in the backup unit 50.

As described above, according to the present embodiment, even when the printed board P is partially lifted with respect to the backup plate 51 due to warpage of the printed board P or the like, the head unit 30. In the mounting head 32, the plurality of suction nozzles 34 are intermittently pressed against the backup plate 51 in order to press the plurality of pressing positions PP provided intermittently on the outer peripheral edge P2 of the printed board P, and the printed board P is temporarily corrected by the backup plate 51. Can be held and fixed. Thereby, it is possible to prevent the electronic component E from being unable to be mounted due to warpage of the printed circuit board P or the like.

Further, according to the present embodiment, the printed circuit board P is pressed against the backup plate 51 by the suction nozzle 34 for mounting the electronic component E on the printed circuit board P. That is, unlike the prior art, there is no need to separately provide a pressing mechanism for pressing the printed circuit board P against the backup plate 51, so that the number of parts of the surface mounter 10 is prevented from increasing and a space for disposing the pressing mechanism. It is possible to prevent the surface mounter 10 from increasing in size due to the provision of.

Further, according to the present embodiment, when the pressure of the pressure sensor 63 is not higher than the holding reference pressure in the board fixing process, the printed board P is properly held due to the warp of the printed board P or the like. It is determined that there is no suction error, and the primary correction process is performed only when a suction error has occurred. That is, for example, the working efficiency of the mounting operation can be improved as compared with the case where all the planned pressing positions PP of the printed circuit board P are pressed by the suction nozzle 34 regardless of the presence or absence of the suction mistake.

In addition, according to the present embodiment, the fact that the printed circuit board P is lifted with respect to the backup plate 51 and an adsorption error has occurred is stored in the storage unit 113 and the negative pressure when holding the printed circuit board P. Since the detection is performed by comparing with the holding reference pressure, for example, compared with the case where an adsorption error is determined from the image of the printed circuit board P, an increase in the number of components such as an apparatus for acquiring an image is prevented. In addition, the surface mounter 10 can be prevented from having a complicated configuration.

Further, according to the present embodiment, in the primary correction process, when a plurality of scheduled pressing positions PP set on the printed circuit board P are sequentially pressed by the suction nozzle 34 and it is detected that the suction mistake has been eliminated, Since the pressing of the planned pressing position PP by the nozzle 34 is completed, the working efficiency of the mounting work can be improved as compared with the case where the plurality of planned pressing positions PP set on the printed circuit board P are all pressed by the suction nozzle 34. It is like that.

By the way, when the suction mistake of the printed circuit board P has occurred, the printed circuit board P is held and fixed by the backup plate 51 by pressing the central part of the printed circuit board P or the entire printed circuit board P including the central part with the suction nozzle 34. A way to do this is also possible.

However, generally, the warp of the printed circuit board P tends to occur at the outer peripheral edge P2 of the printed circuit board P. That is, as in the present embodiment, the printed circuit board P can be held and fixed simply by sequentially pressing a plurality of scheduled pressing positions PP that are intermittently set on the outer peripheral edge P2 of the printed circuit board P. Therefore, for example, compared to the case where the suction nozzle 34 presses the central portion of the printed circuit board P or the entire printed circuit board P including the central portion, the number of places pressed by the suction nozzle 34 can be reduced, and the work efficiency of the mounting work can be reduced. Can be further improved.

If the plurality of pressing positions PP of the printed circuit board P are all pressed, but the printed circuit board P cannot be held in the backup unit 50, an error is displayed on the display device of the operation unit 118 and the printed circuit board is printed. Since it is possible to announce to the operator that P is defective, it is possible to reduce the reduction in work efficiency of the mounting work as much as possible.

Further, according to the present embodiment, when a suction error of the printed circuit board P occurs and the printed circuit board P is primarily corrected by the primary correction process, the pressing position PF where the printed circuit board P is pressed by the primary correction process is stored. . In the substrate fixing release process, the pressing position PF stored in the substrate fixing process is pressed by the suction nozzle 34, and after the holding and fixing of the printed circuit board P due to the negative pressure is released, the suction nozzle 34 is slowly raised. It can suppress that the part P1 in which the curvature has generate | occur | produced in the board | substrate P vigorously elastically repels. Thereby, it can suppress that the electronic component E mounted in the printed circuit board P shifts | deviates.

<Embodiment 2>
Next, Embodiment 2 will be described with reference to FIGS. 14 and 15.

In the second embodiment, a part of the primary correction processing of the first embodiment is changed in order to correspond to the printed circuit board P on which the electronic component E is partially mounted, and the configuration common to the first embodiment is used. Since the operation and the effect are duplicated, the description thereof is omitted. The same reference numerals are used for the same configurations as those in the first embodiment. The mounting position PM of the electronic component E already mounted on the printed circuit board P is, for example, stored in the storage unit 113 in the first embodiment when the electronic component E is mounted in the first embodiment, or the planned mounting position. This information is stored in the storage unit 113 in advance by storing the information in the storage unit 113.

As shown in the flowchart of FIG. 14, the primary correction process of the second embodiment is a process after S21 in the primary correction process of the first embodiment (process after the mounting head 32 in the head unit 30 is arranged on the printed circuit board P). After S21, the arithmetic processing unit 111 checks whether or not there is information on the mounting position PM of the electronic component E in the storage unit 113 (S31).

When there is no information on the mounting position PM of the electronic component E (the electronic component E is not mounted on the printed circuit board P) (S31: NO), the same processing as that after S22 in the primary correction processing of the first embodiment is executed.

On the other hand, when there is information on the mounting position PM of the electronic component E (the electronic component E is mounted on the printed circuit board P) (S31: YES), the arithmetic processing unit 111 mounts the electronic component E on the printed circuit board P. PM is called from the storage unit 113 (S32), and it is determined whether there is any overlap between the pressing position PP pressed by the suction nozzle 34 and the mounting position PM (S33).

When there is no overlap between the scheduled pressing position PP and the mounting position PM (S33: NO), the same processing as that after S22 in the primary correction processing of the first embodiment is executed.

On the other hand, as shown in FIG. 15, when there is an overlap between the planned pressing position PP and the mounting position PM (S33: YES), the arithmetic processing unit 111 is adjacent to both the planned pressing position PP and the mounting position PM. It is determined whether the position to be pressed can be pressed by the suction nozzle 34 (S34).

When the adjacent position can be pressed by the suction nozzle 34 (S34: YES), the arithmetic processing unit 111 determines the adjacent position as the alternative position PN as shown in FIG. 15 (S34) and newly presses the alternative position PN. The same processing as S22 and subsequent steps in the primary correction processing of the first embodiment is executed as the planned position PP.

If there is an overlap between the planned pressing position PP and the mounting position PM, but the position adjacent to the planned pressing position PP and the mounting position PM cannot be pressed by the suction nozzle 34 (S34: NO), the arithmetic processing unit 111 performs primary correction. As a result of the processing, the printed circuit board P cannot be primarily corrected and the printed circuit board P cannot be properly held and fixed by the backup unit 50, and information such as an error message is displayed on the display device of the operation unit 118 ( S35), the primary correction process ends in error.

As described above, according to the present embodiment, for example, the electronic component E is mounted on a part of the printed circuit board P by the surface mounter 10 shown in the first embodiment, and thereafter, different types of electronic components E are mounted. Even in this case, it is possible to prevent the electronic component E from being pressed by the suction nozzle 34 and to prevent the already mounted electronic component E from being damaged.

Furthermore, according to the present embodiment, not only is the electronic component E already mounted damaged, but also an alternative position PN adjacent to the planned pressing position PP is determined, and this alternative position PN is pressed by the suction nozzle 34. Thus, the printed circuit board P can be appropriately held and fixed by the backup unit 50.

<Other embodiments>
The technology disclosed in the present specification is not limited to the embodiments described with reference to the above description and drawings, and includes, for example, the following various aspects.

(1) In the above embodiment, the printed board P is used as an example of the board. However, the present invention is not limited to this, and the technology disclosed in this specification may be applied to a thin metal plate such as a lead frame.

(2) In the above embodiment, when the pressure of the pressure sensor 63 is not higher than the holding reference pressure stored in the storage unit 113, the backup plate 51 determines that there is an adsorption error of the printed circuit board P. However, the present invention is not limited to this, and a configuration may be adopted in which a suction error is determined by another detection mechanism such as image processing.

(3) In the embodiment described above, the scheduled pressing positions PP are set at the four corners that are intermittent at the outer peripheral edge of the printed circuit board P. However, the present invention is not limited to this, and in addition to the four corners of the printed circuit board, the center of each side or the center of the printed circuit board may be set as the planned pressing position.

(4) In the above embodiment, in the primary correction process, when the pressure of the pressure sensor 63 becomes higher than the holding reference pressure and the suction error is eliminated, the pressing of the pressing position PP by the suction nozzle 34 is finished. Made the configuration. However, the present invention is not limited to this, and in the primary correction process, the suction nozzle may be configured to press all the scheduled pressing positions.

(5) In the above embodiment, in the substrate fixing release process, when the planned pressing position PP and the mounting position PM overlap, a position adjacent to the planned pressing position PP and the mounting position PM is determined as the alternative position PN. did. However, the present invention is not limited to this, and when the scheduled pressing position and the mounting position overlap, an error display may be made assuming that the printed circuit board could not be held and fixed in the backup unit.

10: Surface mounter (an example of “component mounter”)
32: Mounting head (an example of “mounting head”)
34: Suction nozzle (an example of “mounted head”)
51: Backup plate (an example of a “holding plate”)
110: Control unit 111: Arithmetic processing unit (an example of “control unit”)
113: Storage unit E: Electronic component (an example of “component”)
P: Printed circuit board (an example of “board”)
P2: Outer edge portion of substrate PF: Pressing position PM: Mounting position PN: Alternative position PP: Pressing planned position

Claims

A holding plate for adsorbing and holding a board on which components are mounted;
A component mounting apparatus comprising a mounting head for mounting the component on the substrate,
The mounting head is a component mounting apparatus capable of pressing the substrate against the holding plate in a process in which the holding plate sucks and holds the substrate.
The component mounting apparatus according to claim 1, wherein the mounting head includes a suction nozzle capable of pressing a predetermined position of the substrate.
3. The component according to claim 1, further comprising a control unit that performs a primary correction process of pressing the mounting head against the substrate when an adsorption error that causes insufficient adsorption of the substrate on the holding plate is detected. 4. Mounting device.
The control unit detects an adsorption error due to a warp of the substrate by comparing a pressure when the substrate is sucked by the holding plate with a pressure when the holding plate sucks the substrate properly. The component mounting apparatus described.
The component mounting apparatus according to claim 3 or 4, wherein the control unit intermittently presses a plurality of locations on an outer edge portion of the substrate by the mounting head in the primary correction process.
6. The component mounting apparatus according to claim 5, wherein the control unit terminates the pressing of the board by the mounting head when the elimination of the suction error is detected in the primary correction process.
The control unit includes a storage unit that stores a pressing position when it is detected that the suction error has been resolved by pressing the substrate with the mounting head,
When the controller releases the holding of the substrate by the holding plate by the holding plate, the pressing position stored by the storage unit is pressed by the mounting head and the mounting head is slowly released from the substrate. The component mounting apparatus of Claim 6 which processes.
The control unit includes a storage unit that stores a mounting position of the component mounted on the substrate,
The pressing by the mounting head at the scheduled pressing position that overlaps with the mounting position is stopped when the planned pressing position of the board to be pressed by the mounting head overlaps with the mounting position of the component. Item 9. The component mounting apparatus according to any one of Items 7 to 9.
9. The control unit according to claim 8, wherein when the planned pressing position and the mounting position overlap, the control unit determines a position adjacent to the planned pressing position and the mounting position as an alternative position that can be pressed by the mounting head. The component mounting apparatus described.
A substrate holding method in a component mounting apparatus comprising a holding plate that sucks and holds a substrate on which a component is mounted, and a mounting head that mounts the component on the substrate,
A substrate holding method in which the substrate is pressed against the holding plate by the mounting head in a process in which the holding plate sucks and holds the substrate.