JP2004296632A - Component mounting apparatus and element placement method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate fixing apparatus and a substrate fixing method capable of ensuring satisfactory adhesiveness of film-like substrate to a lower supporting member, and maintaining stable mounting quality. <P>SOLUTION: In a component mounting apparatus for mounting a component 12 on a film-like substrate 11, a deformation correcting the head 14 having a pressing surface covering the entire portion of component mounting portion of the substrate and provided with a pressing member 20 moving vertically by a cylinder 16 is disposed so as to be able to move integrally the mounting head 13. With this configuration, since the deformation of the substrate 11 can be corrected by pressing the substrate 11 in a state of being placed on a lower support surface 7a of a lower supporting member 5, satisfactory adhesiveness to the lower supporting member can be ensured even when a film-like substrate being easily bent is handled. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a component mounting apparatus and a component mounting method for mounting components on a substrate.
[0002]
[Prior art]
In a component mounting apparatus that mounts components on a substrate, a lower receiving portion that supports the substrate from a lower surface side at a mounting position is provided. When a thin and flexible substrate such as a film-like substrate is to be used, it is necessary to correct the bending by sucking and holding the substrate from the lower surface side by vacuum suction when receiving the substrate. Therefore, when such a substrate is targeted, a substrate having a substrate suction groove on the surface is used as a lower receiving member (for example, see Patent Document 1).
[0003]
[Patent Document 1]
JP-A-11-17397
[Problems to be solved by the invention]
However, the above-mentioned conventional method has the following difficulties when a thin film-shaped substrate is targeted. Since the film-shaped substrate has extremely low rigidity and is easily bent, the substrate may be completely warped or partially unevenly deformed in the previous process or may be supplied to the mounting process. In such a case, even if the substrate is placed on the lower receiving member and vacuum suction is performed from the lower surface side, the suction force is hard to reach the entire surface of the substrate because the rigidity of the substrate is extremely small.
[0005]
That is, the portion sucked by the suction hole or the suction groove is attracted to the lower receiving surface, but the other portion remains floating from the lower receiving surface, so that good adhesion of the substrate cannot be secured. If such a floating of the substrate occurs at a component mounting portion, stable component operation is not performed, resulting in a decrease in mounting quality.
[0006]
In view of the above, the present invention provides a substrate fixing device and a substrate fixing method capable of securing good adhesion to a lower receiving member and maintaining stable mounting quality for a film-like substrate. Aim.
[0007]
[Means for Solving the Problems]
2. The component mounting device according to claim 1, wherein the component mounting device mounts the component on a film-shaped substrate, and a lower receiving surface that contacts the lower surface of the substrate, sucks and holds the substrate by vacuum suction, and receives the lower surface. A deformation receiving head for holding down the substrate placed on the lower receiving surface and pressing the substrate against the lower receiving surface to correct the deformation of the substrate; and And a mounting head for mounting the substrate on the received substrate.
[0008]
A component mounting apparatus according to a second aspect is the component mounting apparatus according to the first aspect, wherein the deformation correction head has a pressing surface that contacts and presses the upper surface of the substrate.
[0009]
A component mounting apparatus according to a third aspect is the component mounting apparatus according to the first aspect, wherein the deformation correcting head includes a positioning pin that positions the substrate by fitting into a positioning hole provided in the substrate. Have.
[0010]
A component mounting apparatus according to a fourth aspect is the component mounting apparatus according to the first aspect, wherein the deformation correction head has a heating unit for heating the substrate.
[0011]
The component mounting apparatus according to claim 5 is the component mounting apparatus according to claim 1, wherein the deformation correction head has a gas blowing hole that blows a gas to an upper surface of the substrate, and the substrate is blown by the gas. Is pressed against the lower receiving surface without contact.
[0012]
The component mounting apparatus according to claim 6 is the component mounting apparatus according to any one of claims 1 to 5, wherein the deformation correction head horizontally moves integrally with the mounting head, and moves up and down individually with the mounting head. It has a head elevating means.
[0013]
8. The component mounting method according to claim 7, wherein the component is mounted on a film-shaped substrate, wherein the lower receiving surface contacts the lower surface of the substrate, sucks and holds the substrate by vacuum suction, and receives the lower surface. A substrate mounting step of loading the substrate into the lower receiving portion having the lower mounting surface and mounting the substrate on the lower receiving surface, and pressing the substrate mounted on the lower receiving surface from above by the deformation correcting head. A deformation correction process of correcting the deformation of the substrate by pressing against the lower receiving surface, and a component mounting process of mounting components by a mounting head on the substrate received by the lower receiving portion in a state where the deformation of the substrate is corrected. including.
[0014]
The component mounting method according to claim 8 is the component mounting method according to claim 7, wherein the deformation correction head has a pressing surface that abuts against and presses an upper surface of the substrate, and the substrate is corrected in the deformation correction step. The pressing surface is brought into contact with the pressing surface.
[0015]
A component mounting method according to a ninth aspect is the component mounting method according to the seventh aspect, wherein the deformation correcting head has a positioning pin for positioning the substrate by fitting into a positioning hole provided in the substrate. Then, the substrate is positioned at the same time as correcting the deformation of the substrate.
[0016]
A component mounting method according to a tenth aspect is the component mounting method according to the seventh aspect, wherein the deformation correction head has a heating unit for heating the substrate, and heats the substrate simultaneously with the deformation correction of the substrate. Do.
[0017]
The component mounting method according to claim 11 is the component mounting method according to claim 7, wherein the deformation correction head has a gas blowing hole for blowing gas to an upper surface of the substrate, and the gas is supplied in the deformation correction step. , The substrate is pressed against the lower receiving surface in a non-contact manner.
[0018]
According to the present invention, by providing a deformation correction head that presses the substrate placed on the lower receiving surface from above and presses the substrate against the lower receiving surface to correct the deformation of the substrate, the film-shaped substrate is targeted. As a result, good adhesion to the lower receiving member can be secured.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a component mounting apparatus according to one embodiment of the present invention, FIG. 2 is a structural explanatory view of a deformation correcting head of the component mounting apparatus according to one embodiment of the present invention, and FIGS. FIG. 6 is a process diagram of a component mounting method according to an embodiment of the present invention, and FIG. 6 is a structural explanatory view of a deformation correcting head of the component mounting apparatus according to an embodiment of the present invention.
[0020]
First, the structure of the component mounting apparatus will be described with reference to FIG. This component mounting apparatus has a function of mounting components such as electronic components on a thin and flexible substrate such as a film-like flexible substrate made of a material such as polyimide. In FIG. 1, a base plate 4 is mounted on a moving table 1 composed of an X table 2 and a Y table 3, and a central portion of the upper surface of the base plate 4 is provided with a lower plate for receiving a substrate and holding a height position. A receiving member 5 is provided. The lower receiving member 5 has a shape in which a convex portion 7 is provided on the upper surface of a rectangular block 5a, and the upper surface of the convex portion 7 is a lower receiving surface 7a that comes into contact with the lower surface of the substrate to receive the lower portion.
[0021]
On both sides of the lower receiving member 5 on the upper surface of the base plate 4, cylinders 9 are disposed in a vertical posture, and rods 9 a of the cylinders 9 are connected to transport rails 10 disposed in the X direction. On the transport rail 10, the thin film-shaped substrate 11 is transported by a transport mechanism (not shown), and is positioned at the mounting operation position. The transfer rail 10 serves as a board transfer unit that transfers and positions the board 13.
[0022]
A mounting head 13 having a deformation correcting head 14 (to be described later) that moves integrally is provided above the mounting work position, and a mounting tool 13a of the mounting head 13 has an electronic component 12 ( Parts) are held. By lowering the mounting head 13 with respect to the substrate 11 positioned at the mounting position, the electronic component 12 is mounted on the component mounting portion 11a.
[0023]
By driving the cylinder 9, the transport rail 10 moves up and down while being guided by the guide member 10a. The transport rail 10 serves as a support for supporting both sides of the substrate 11 from below, and the cylinder 9 serves as an elevating means for elevating and lowering the substrate 11 relative to the lower receiving member 5. When the transport rail 10 is lowered, the lower surface of the substrate 11 abuts on the lower receiving surface 7a, and the vertical position is fixed.
[0024]
The lower receiving surface 7a is provided with a suction groove 7b for sucking a substrate, and the suction groove 7b is connected to a vacuum suction means 18 via a piping member 17. By driving the vacuum suction means 18 with the substrate 11 placed on the lower receiving surface 7a, the substrate 11 is held on the lower receiving surface 7a by vacuum suction. Further, positioning holes 7c corresponding to positioning pins provided on the deformation correcting head 14 described later are provided on the lower receiving surface 7a at diagonal positions.
[0025]
Next, the deformation correction head 14 will be described with reference to FIG. As shown in FIG. 2B, a cylinder 16 is disposed on the side surface of the mounting head 13 via a bracket 15 in a downward posture, and a rod 16 a of the cylinder 16 is connected to the deformation correction head 14. By driving the cylinder 16 as the deformation correcting head lifting / lowering means, the deformation correcting head 14 moves up and down individually with the mounting head 13. That is, the deformation correction head 14 is configured to have a deformation correction head lifting / lowering unit that moves horizontally with the mounting head 13 and moves up and down individually with the mounting head 13.
[0026]
In the deformation correcting head 14, a plate-shaped pressing member 20 is slidably arranged in a vertical direction below a horizontal holding member 6 fixed to a rod 16a along a slide shaft 8 fixed to the holding member 6. It has a configuration. Further, the pressing member 20 is swingable to the extent that it follows the inclination of the lower receiving surface 7a. Here, the pressing member 20 has a shape having a pressing surface large enough to cover the entire area of the component mounting portion 11a of the target substrate 11.
[0027]
A spring 19 is mounted between the holding member 6 and the pressing member 20. When the deformation correcting head 14 is lowered and the lower surface of the pressing member 20 abuts against the substrate 11 as a pressing target, a downward biasing force of the spring 19 acts via the pressing member 20 to mount the component on the substrate 11. The range 11a is pressed against the lower receiving surface 7a over the front surface.
[0028]
The holding member 6 is provided with vertical positioning pins 21 facing downward at positions corresponding to the positioning holes 11b of the substrate 11 and the positioning holes 7c of the lower receiving surface 7a. Further, the pressing member 20 is provided with a through hole 20 a at a position corresponding to the positioning pin 21, through which the positioning pin 21 can pass without interference. When the deformation correcting head 14 is lowered with respect to the substrate 11 placed on the lower receiving member 4, the positioning pins 21 are fitted into the positioning holes 11b and the positioning holes 7c. Is positioned with respect to the normal position. In the drawings, illustration of the positioning pins 21 is omitted as appropriate. Although the positioning pins 21 are not essential, it is desirable to have the positioning pins because the positioning of the substrate becomes easy.
[0029]
This component mounting apparatus is configured as described above. Next, a component mounting method for mounting an electronic component on a film-like substrate will be described with reference to FIGS. 3, 4, and 5. FIG. First, impurities on the electrodes of the substrate 11 are removed by performing a plasma cleaning process on the substrate 11 (plasma cleaning step). Note that this step is not essential, but it is desirable that plasma treatment be performed to improve the bonding between the component and the substrate. Next, the substrate 11 is carried by the transport rail 10 onto the lower receiving member 5 arranged at the mounting operation position, and the substrate 11 is placed on the lower receiving surface 7a as shown in FIG. Mounting process).
[0030]
At this time, since the rigidity of the substrate 11 is extremely small and it is easy to bend, the substrate 11 is carried in with the entire surface being warped or partially deformed in an uneven manner in the previous step. In particular, in the case of the substrate 11 that has been subjected to the plasma processing in the previous step, the substrate 11 shows complicated uneven deformation due to thermal deformation during the plasma processing. For this reason, the substrate 11 does not adhere to the lower receiving surface 7a, and mounting electronic components on the substrate 11 in this state causes mounting failure.
[0031]
In order to prevent such a mounting failure due to the deformation of the board, in the present embodiment, the deformation of the board described below is corrected. That is, as shown in FIG. 3B, the mounting head 13 is moved, and the deformation correcting head 14 attached to the side surface is positioned above the substrate 11 mounted on the lower receiving member 5. Then, as shown in FIG. 4A, the deformation correcting head 14 is lowered by driving the cylinder 16. At this time, the positioning pin 21 is fitted into the positioning hole 11b of the substrate 11 and further fitted into the positioning pin 7c provided on the lower receiving surface 7a, whereby the substrate 11 is positioned at the correct mounting work position.
[0032]
The deformation correction head 14 is further lowered, and the pressing member 20 is brought into contact with the upper surface of the substrate 11, so that the substrate 11 placed on the lower receiving surface 7 a is pressed downward by the spring 19. The sheet 20 is pressed down from above by a sheet and pressed against the lower receiving surface 7a. At this time, the pressing member 20 presses the entire area of the component mounting portion 11a against the lower receiving surface 7a. As a result, the warpage of the substrate 11 is corrected, and as shown in FIG. 4B, the lower surface of the substrate 11 adheres to the lower receiving surface 7a (deformation correction step). By driving the vacuum suction means 18 in this state, the substrate 11 is vacuum-sucked on the lower receiving surface 7a by the suction groove 7b, and the position and the posture are fixed.
[0033]
Thereafter, the deformation correction head 14 is raised, and the mounting head 13 is moved to align the electronic component 12 held by the mounting tool 13a with the component mounting portion 11a of the substrate 11, as shown in FIG. I do. Next, as shown in FIG. 5B, the mounting head 13 is lowered, and the electronic component 12 is pressed and mounted on the substrate 11 (component mounting step). At this time, it is preferable to apply ultrasonic vibration to the electronic component 12 because the bonding between the electronic component 12 and the substrate 11 can be quickly realized.
[0034]
Thereby, when the target is a film-shaped substrate that is easily bent, particularly when the target is a substrate that has been subjected to plasma processing in the previous process and has been complicatedly deformed into a wavy state due to thermal influence during the plasma processing, Adhesion to the lower receiving surface 7a of the electronic component 11 can be ensured, and stable mounting quality can be maintained when the electronic component 12 is mounted.
[0035]
As shown in FIG. 6A, a deformation correction head 14A having a pressing member 20A having a built-in heater 22 may be used. Thus, when the substrate 11 is pressed by the pressing member 20A, the substrate 11 can be heated by the heat from the heater 22 at the same time as the deformation of the substrate is corrected, and the heating efficiency for component mounting can be improved. That is, in this example, the deformation correction head 14A is configured to have a heating unit for heating the substrate 11.
[0036]
Further, in the above-described example, the deformation correction head has been described as an example in which the pressing member is pressed against the substrate by pressing the pressing member against the substrate. However, as shown in FIG. May be used, and a deformation correction head 14B having a configuration in which a gas supply source 23 is connected to the pressing member 20B may be used. In this example, the substrate 11 is pressed against the lower receiving surface 7a in a non-contact manner by blowing gas from the gas blowing holes in the deformation correction step. Further, a positioning pin similar to that shown in FIG. 2 may be provided, or a heating means similar to that shown in FIG. 6A may be provided, and the gas heated by the heating means may be blown from the gas blowing hole.
[0037]
【The invention's effect】
According to the present invention, a deformation correction head is provided for pressing down the substrate placed on the lower receiving surface from above and pressing the substrate against the lower receiving surface to correct the deformation of the substrate. As a result, good adhesion to the lower receiving member can be secured.
[Brief description of the drawings]
FIG. 1 is a perspective view of a component mounting apparatus according to an embodiment of the present invention; FIG. 2 is a structural explanatory view of a deformation correcting head of the component mounting apparatus according to an embodiment of the present invention; FIG. FIG. 4 is a process diagram of a component mounting method according to an embodiment of the present invention. FIG. 5 is a process diagram of a component mounting method according to an embodiment of the present invention. FIG. 1 is a structural explanatory view of a deformation correcting head of a component mounting apparatus according to an embodiment of the present invention.
5 Lower receiving member 7a Lower receiving surface 7b Suction groove 11 Substrate 12 Electronic component 13 Mounting head 14 Deformation correction head

Claims (11)

What is claimed is: 1. A component mounting apparatus for mounting a component on a film-like substrate, comprising: A deformation correction head that corrects the deformation of the substrate by pressing down the substrate placed on the surface from above and pressing the substrate against the lower receiving surface, holding the component, and mounting the component on the lower received substrate A component mounting device comprising a mounting head. The component mounting apparatus according to claim 1, wherein the deformation correction head has a pressing surface that contacts and presses the upper surface of the substrate. 2. The component mounting apparatus according to claim 1, wherein the deformation correcting head has a positioning pin for positioning the substrate by fitting into a positioning hole provided in the substrate. The component mounting apparatus according to claim 1, wherein the deformation correction head has a heating unit for heating the substrate. 2. The component mounting according to claim 1, wherein the deformation correction head has a gas blowing hole for blowing gas to an upper surface of the substrate, and the substrate is pressed against the lower receiving surface in a non-contact manner by blowing the gas. apparatus. The component mounting apparatus according to claim 1, wherein the deformation correction head includes a deformation correction head elevating unit that horizontally moves integrally with the mounting head and moves up and down separately from the mounting head. A component mounting method for mounting a component on a film-like substrate, wherein the substrate is loaded into a lower receiving portion having a lower receiving surface that contacts the lower surface of the substrate, holds the substrate by vacuum suction, and receives the lower surface. A substrate mounting step of mounting the substrate on the lower receiving surface, and pressing the substrate mounted on the lower receiving surface from above by a deformation correcting head and pressing the substrate against the lower receiving surface. And a component mounting step of mounting components by a mounting head on a substrate received by a lower receiving portion in a state in which the deformation of the substrate has been corrected. . 8. The component mounting method according to claim 7, wherein the deformation correcting head has a pressing surface that is pressed against the upper surface of the substrate, and the pressing surface is brought into contact with the substrate in the deformation correcting step. 8. The substrate according to claim 7, wherein the deformation correcting head has positioning pins for positioning the substrate by fitting into positioning holes provided in the substrate, and performs positioning of the substrate simultaneously with correction of the deformation of the substrate. Component mounting method. 8. The component mounting method according to claim 7, wherein the deformation correcting head has a heating unit for heating the substrate, and heats the substrate simultaneously with correcting the deformation of the substrate. 8. The deformation correcting head has a gas blowing hole for blowing gas to an upper surface of the substrate, and presses the substrate against the lower receiving surface in a non-contact manner by blowing gas in the deformation correcting step. Component mounting method described.

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