WO2014179136A1

WO2014179136A1 - Methods of separating desired parts of a thin sheet from a carrier

Info

Publication number: WO2014179136A1
Application number: PCT/US2014/035215
Authority: WO
Inventors: Anatoli Anatolyevich Abramov
Original assignee: Corning Incorporated
Priority date: 2013-04-29
Filing date: 2014-04-24
Publication date: 2014-11-06
Also published as: TW201441045A

Abstract

Methods of separating a desired part of a thin sheet from a carrier are disclosed. The methods include injecting a fluid towards an edge of the desired part of the thin sheet, where the thin sheet is not bonded with the carrier in a non-bonded area that includes the desired part and bonded to the carrier in a bonded area. The fluid lifts at least a portion of the desired part from the carrier. The method also includes inserting a barrier layer between the desired part of the thin sheet and the carrier at a position proximate to the position where the desired part of the thin sheet is lifted from the carrier.

Description

METHODS OF SEPARATING DESIRED PARTS OF A THIN SHEET

FROM A CARRIER

[0001] This application claims the benefit of priority under 35 U.S.C. § 119 of U.S. Provisional Application Serial No. 61/817035 filed on April 29, 2013, the content of which is relied upon and incorporated herein by reference in its entirety.

BACKGROUND

Field

[0002] The present disclosure generally relates to methods of separating thin sheets from carriers and, in particular, methods of separating thin sheets from a support structure used in manufacturing electrical components on the thin sheets.

Technical Background

[0003] Certain electronics devices are manufactured as laminates, where electronic circuits are formed on a plastic base material made of one or more polymer films. Such laminated electronic devices include photovoltaic cells, organic light emitting diodes, liquid crystal displays, and patterned thin film transistors. However, manufacturing electronic devices on thin glass sheets may provide technical advantages to manufacturing those devices on plastic base materials. In particular, thin glass sheets are moisture resistant.

[0004] However, manufacturing electrical components on thin sheets may be complicated by the flexibility of the thin sheet itself. Accordingly, methods of manufacturing electrical components on thin sheets may be desired.

SUMMARY

[0005] Because of the flexibility of the thin sheet itself, in some instances, the bottom surface of the thin sheet may be bonded to a carrier, which supports the thin sheet as the thin sheet progresses through various manufacturing operations, including forming electrical components along the top surface of the thin sheet. When the additional support provided by the carrier is not needed, at least a portion of the thin sheet upon which the electrical components are formed may be separated from the carrier. Further, because the electrical components formed on the thin sheet may be fragile, lifting the thin sheet portion from the carrier while minimizing physical contact with the electrical components formed on the top surface of the thin sheet may reduce the likelihood of damage to the electrical components.

[0006] According to various embodiments, a method of separating a desired part of a thin sheet from a carrier includes injecting a fluid towards an edge of the desired part of the thin sheet, where the thin sheet is not bonded with the carrier in a non-bonded area that includes the desired part and bonded to the carrier in a bonded area. The fluid lifts at least a portion of the desired part from the carrier. The method also includes inserting a barrier layer between the desired part of the thin sheet and the carrier at a position proximate to the position where the desired part of the thin sheet is lifted from the carrier.

[0007] According to further embodiments, a method of separating a desired part of a thin sheet from a carrier includes injecting a fluid towards an edge of the desired part of the thin sheet, where the fluid lifts at least a portion of the desired part of the thin sheet from the carrier. The method also includes inserting a barrier layer between the desired part of the thin sheet and the carrier at a position proximate to the position where desired part of the thin sheet is lifted from the carrier. The method further includes directing the barrier layer between the desired part of the thin sheet and the carrier such that the barrier layer extends beyond the desired part of the thin sheet in at least one direction.

[0008] Additional features and advantages of the embodiments described herein will be set forth in the detailed description which follows, and in part will be readily apparent to those skilled in the art from that description or recognized by practicing the embodiments described herein, including the detailed description that follows, the claims, as well as the appended drawings.

[0009] It should be understood that both the foregoing general description and the following detailed description described various embodiments and are intended to provide an overview or framework for understanding the nature and character of the claimed subject matter. The accompanying drawings are included to provide a further understanding of the various embodiments, and are incorporated into and constitute a part of this specification. The drawings illustrate the various embodiments described herein, and together with the description serve to explain the principles and operations of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS [0010] FIG. 1 schematically depicts a perspective view of a glass manufacturing line including an article according to one or more embodiments shown or described herein;

[0011] FIG. 2 schematically depicts a cross-sectional side view of the article coupled to a pallet shown along line A- A of FIG. 1;

[0012] FIG. 3 schematically depicts a top view of an article according to one or more embodiments shown or described herein;

[0013] FIG. 4 schematically depicts a cross-sectional side view of the article coupled to a pallet shown along line B-B of FIG. 3;

[0014] FIG. 5 schematically depicts a perspective view of a forced-fluid injection system positioned to inject fluid towards an article in an injection operation of a electrical component manufacturing operation according to one or more embodiments shown or described herein;

[0015] FIG. 6 schematically depicts a cross-sectional side view of a forced-fluid injection system positioned to inject fluid towards an article shown along line C-C of FIG. 5;

[0016] FIG. 7 schematically depicts a top view of a barrier layer insertion operation of a electrical component manufacturing operation according to one or more embodiments shown or described herein; and

[0017] FIG. 8 schematically depicts a cross-sectional side view of the barrier layer insertion operation shown along line D-D of FIG. 7.

DETAILED DESCRIPTION

[0018] Reference will now be made in detail to embodiments of methods of separating desired parts of thin sheets from carriers used to support the thin sheets in electrical component manufacturing operations. Referring in general to FIG. 1, manufacturing electrical components by forming electrical components onto a thin sheet may improve the characteristics of the electrical components. Portions of the bottom surface of the thin sheet are partially bonded to carrier, thereby forming an article. After the electrical components are formed on a top surface of the thin sheet, a plurality of vents, or defects, are introduced to the thin sheet in a scoring operation. The thin sheet is flexed to propagate the vents through the thickness of the thin glass sheet, thereby separating the thin glass sheet into a desired part and a remaining portion that remains bonded at least partially to the carrier. A stream of fluid is injected towards a newly- formed edge of the desired part of the thin glass sheet, which lifts at least a portion of the thin sheet from the carrier. A barrier layer may be inserted between the desired part of the thin sheet and the carrier at a position proximate to the position where the desired part of the thin sheet is lifted from the carrier by the stream of fluid. Thus, the desired part of the thin sheet having electrical components placed along the top surface can be lifted and repositioned from a carrier without contacting the top surface of the desired part of the thin sheet and the electrical components formed thereon.

[0019] Referring in detail to FIG. 1, an article 2 used in the manufacturing of electrical components 120 formed on a thin sheet 20 is depicted. In the depicted embodiment, the article 2 includes the thin sheet 20, which is coupled to the carrier 10. In embodiments according to the present disclosure, the thin sheet 20 may be have a thickness of 300 microns or less including, for example and without limitation, a thickness from about 10 to about 50 microns, or from about 50 to about 100 microns, or from about 100 to about 150 micros, or from about 150 to about 300 microns, or for example, 300, 290, 280, 275, 270, 260, 250, 240, 230, 225, 220, 210, 200, 190, 180, 170, 160, 150, 140, 130, 120, 110, 100, 90, 80, 70, 60, 50, 40, 30, 20, or 10 microns. Thin sheets 20 that exhibit such thicknesses may typically be flexible. However, existing manufacturing processes and manufacturing lines 70 incorporating those processes for producing electrical components 120 may require increased rigidity in the thin sheet material. Accordingly, to incorporate a thin sheet 20 according to the present disclosure into existing manufacturing lines 70, a thin sheet 20 may be at least partially coupled to a carrier 10. Coupling the thin sheets 20 to the carrier 10 increases the rigidity of the article 2, thereby improving use of flexible thin sheets 20 in existing manufacturing lines 70. The article 2 may exhibit stiffness and thickness corresponding to a thicker sheet for which the processing equipment was originally designed to accommodate.

[0020] The thin sheet 20 may be of any suitable material including glass, or glass-ceramic. When made of glass, thin sheet 20 may be of any suitable composition, including alumino- silicate, boro -silicate, alumino-boro-silicate, soda- lime- silicate, and may be either alkali containing or alkali free depending upon the thin sheet's application of use.

[0021] The carrier 10 may be a variety of materials including, for example and without limitation, glass or a glass-ceramic composite. Examples of suitable glass compositions include alumino-silicate, boro-silicate, alumino-boro-silicate, soda-lime-silicate, and may be either alkali containing or alkali- free. The carrier 10 may have a thickness, and therefore stiffness, greater than the thin sheet 20. The thickness may be from about 0.3 to 3 mm. Thickness of the carrier 10 may be selected such that the combined thickness of the article 2 is similar to the thickness of the thicker sheet for which the processing equipment was originally designed to accommodate.

[0022] Referring now to FIG. 2, the thin sheet 20 may be bonded to carrier 10 at bonding locations 98 along a bottom surface, here a first side 131, of the thin sheet 20. In some embodiments, the thin sheet 20 is bonded to the carrier 10 through direct contact between the thin sheet 20 and the carrier 10. In other embodiments, the bonding between the carrier 10 and the thin sheet 20 may be made with a bonding agent or a surface preparation. In yet other embodiments, a release layer (not shown) may be deposited onto portions of one of the thin sheet 20 or the carrier 10 in regions forming non-bonded areas 42 on which the desired parts will be made. The release layer may increase the roughness of the interface between the thin sheet 20 and the carrier 10, which may reduce the strength of any bond between the thin sheet 20 and the carrier 10 in portions where the release layer is disposed.

[0023] In embodiments that include the release layer, it is desirable for the deposited material to be cleanable, that is removable from the carrier as by etching, and yet that are easily able to form a roughened surface to facilitate separation of the desired parts of the thin sheet from the carrier. In one embodiment, the release layer is in a crystalline form as it exists on the carrier. Suitable materials for the release layer include, for example and without limitation, zinc oxide (ZnO), 0.2-4.0% aluminum doped zinc oxide (AZO), 0.2-4.0% gallium doped zinc oxide (GZO), tin oxide (Sn0₂), aluminum oxide (A1₂0₃) gallium oxide (Ga₂0₃), bismuth oxide (Bi₂0₃), F- Sn0₂, F-Si0₂, TiON, and TiCN. Standard deposition techniques may be used to put the materials on the carrier.

[0024] The release layer may include a surface roughness > 2 nm Ra to facilitate prevention of a strong bond in the non-bonded area. However, as the surface roughness increases, the amount of gas trapped between the thin sheet and carrier may also increase, which tends to lead to processing problems when the article 2 is in high temperature and/or low pressure environments. Accordingly, there is likely an upper limit to the amount of surface roughness that may be practically used.

[0025] In another embodiment, the release layer may operate on the principle of forming no OH bonding with the thin glass sheet, and need not have a particular roughness to provide a non- bonded area. Materials that may be used in this process include, for example and without limitation, tin oxide, Ti0₂, Silica (Si0₂), refractory materials, Si (silicon nitride), SiC, diamond-like carbon, graphitic carbon, graphene, titanium nitride, Alumina, Titania (Ti0₂), SiON (siliconoxynitride), F-Sn0₂, F-Si0₂, and/or materials having a melting point less than about 1000°C and/or a strain point greater than about 1000°C.

[0026] The non-bonded area 42 may include some bonding between the thin sheet 20 and carrier 10, but that bonding is of sufficient weakness to allow the desired part 56 of the thin sheet 20 to be removed from the carrier without damage to the desired part 56 of the thin sheet 20. Throughout the present disclosure, such areas are referred to as unbonded or non-bonded areas 42 for the sake of convenience. The unbonded areas 42 have a bond strength significantly less than the bond strength in the bonded areas 40. It is from these non-bonded areas 42 that the desired parts 56 are extracted. Therefore, the desired parts 56 are included in the unbonded areas 42 of the thin sheet 20. In the embodiment depicted in FIGS. 1 and 2, the thin sheet 20 is bonded to the carrier 10 along the periphery of the thin sheet 20, and contacts but is not bonded with carrier 10 at positions along the interior of the thin sheet 20. Alternatively, the desired parts of the thin sheet on which the electrical components 120 are formed are discrete non-bonded areas, whereas the discreet non-bonded areas are surrounded by areas wherein the thin sheet 20 and the carrier 10 are bonded to one another. Positions of the article 2 where the thin sheet 20 is bonded to the carrier 10 define a bonded area 40, while positions of the article 2 where the thin sheet 20 is detached from the carrier 10 define a non-bonded area 42, which includes at least the desired part 56. In subsequent manufacturing operations, the desired part 56 is separated from the bonded area 40, and the desired part 56 containing electrical components 120 may undergo further processing and/or be delivered to a customer for use.

[0027] As further depicted in FIG. 1, the article 2 may be positioned on a pallet 80. The pallet 80 may selectively secure the article 2 in position, thereby allowing the pallet 80 to carry the article 2 along a manufacturing line 70 for processing of the article 2. In some embodiments, the pallet 80 may include a vacuum platen 82 that contacts the carrier 10 of the article 2 and maintains the position of the article 2 by maintaining a negative gauge pressure. In some embodiments, the article 2 may be processed along a manufacturing line 70 that laminates a plurality of integrated electronic circuits onto the thin sheet 20. Examples of such integrated electronic circuits include, for example and without limitation, photovoltaic (PV) cells, organic light emitting diodes (OLED), liquid crystal displays (LCDs), and patterned thin film transistor (TFT) electronics. The integrated electronic circuits may be manufactured according to various techniques.

[0028] Referring again to FIG. 2 and as discussed hereinabove, the thin sheet 20 may be bonded to a carrier 10 to form an article 2. The thin sheet 20 may be permanently bonded to the carrier 10 in positions corresponding to the bonded area 40 and separated from the carrier 10 at positions away from the bonded area 40, which is defined as the non-bonded area 42. In some embodiments, the thin sheet 20 may be attracted to the carrier 10 at positions corresponding to the desired part 56 of the thin sheet 20. This attraction between the non-bonded area 42 of the thin sheet 20 and the carrier 10, for example, at positions corresponding to the desired part 56, may be attributed to the van der Waals interaction between proximately-located molecules of the thin sheet 20 and the carrier 10. Without being bound by theory, the van der Waals interaction between proximate molecules decreases in strength with increasing distance between the molecules. As such, the van der Walls forces between the thin sheet 20 and the carrier 10 may be greatest in positions where the thin sheet 20 contacts the carrier 10.

[0029] In some embodiments, the electrical components 120 that are formed on the thin sheet 20 may be fragile and prone to handling damage. Accordingly, minimizing contact with the electrical components 120 formed along the second side 133 of the thin sheet 20 while removing the thin sheet 20 from the carrier 10 may reduce the likelihood of handling damage to the electrical components 120.

[0030] Referring now to FIGS. 3 and 4, to separate the thin sheet 20 from the carrier 10, the desired part 56 of the thin sheet 20 is separated from the bonded area 40 of the thin sheet 20. In one embodiment, the thin sheet 20 may be scored through a mechanical scoring process or a laser scoring process. The scoring process generally introduces defects, referred to as vents 61, into the thin sheet 20. In a mechanical scoring process, a score wheel 90 is positioned along the second surface 133 of the thin sheet 20 and translated, while a force is applied from the score wheel to the thin sheet 20. As the score wheel 90 is translated along the second surface 133 of the thin sheet 20, the score wheel forms a plurality of vents 61 that extend from the second surface 133 of the thin sheet 20. In a laser scoring process, a laser (not shown), for example and without limitation, a Nd:YAG laser or an Nd:YV04 laser, introduces a beam of light to the thin sheet 20 along the second surface 133. The laser may ablate away a portion of the thin sheet 20, thereby forming a plurality of vents 61 in the thin sheet. Alternatively, an initiation flaw may be made in the surface of the thin sheet, and the flaw propagated with the laser to form a desired contour around a portion (i.e., a desired part) of the thin sheet 20 to be separated from the bonded area 40 and to be removed from the carrier 10. The vents 61 produced in the scoring process extend through at least a portion of the thickness 22 of the thin sheet 20. In some embodiments, the vents 61 may extend through a portion of the thickness 22 of the thin sheet 20, for example the vents 61 may extend through greater than about 50% of the thickness 22 of the thin sheet 20. In other embodiments, the vents 61 may extend through up to 100% of the thickness of the thin sheet 20. The scoring process defines the desired part 56 that is yielded from the thin sheet 20. In the depicted embodiments, the vents 61 may be positioned between the desired part 56 and the bonded area 40 of the thin sheet 20. The vents 61 enable the desired part 56 of the thin sheet 20 to be separated from a portion of the thin sheet 20 in the non-bonded area 42, thereby allowing the desired part 56 to be removed from the carrier 10 without overcoming the bonding force between the thin sheet 20 and the carrier 10 in the bonded area 40.

[0031] The vents 61 may be introduced in a variety of positions and orientations on the thin sheet 20, such that the desired part 56 having the desired size and shape may be obtained from the thin sheet 20. While the embodiment depicted in FIG. 3 demonstrate that the vents 61 may extend to the perimeter of the thin sheet 20 through the bonded area 40, it should be understood that the vents 61 may be terminated before approaching the perimeter of the thin sheet 20. In some embodiments (not shown), the vents 61 may be disposed such that the vents 61 are spaced apart from the perimeter of the thin sheet 20. In other embodiments, the vents 61 are spaced apart from one another such that adjacent vents 61 do not overlap one another. In these embodiments, the portion of the thin sheet 20 having no vent present is separated upon propagation of the proximal vents 61, as discussed below.

[0032] Referring to FIG. 4, in the depicted embodiment, the scoring process introduces vents 61 into the thin sheet 20 that extend through all of the thickness 22 of the thin sheet 20. In such embodiments, the vents 61 fully separate the desired part 56 from the bonded area 40, such that the desired part 56 of the thin sheet 20 is no longer attached to the carrier 10. In other embodiments, the scoring process introduces vents 61 into the thin sheet 20 that extend through a portion (and not all) of the thickness 22 of the thin sheet 20. In these embodiments, the desired part 56 of the thin sheet 20 remains coupled to the carrier 10 through the bonding of the bonded area 40 to the carrier 10. In these embodiments, the vents 61 are propagated through the thickness 22 of the thin sheet 20 in a propagation operation subsequent to the scoring operation. The vents 61 may be propagated by an application of a force to the thin sheet 20, for example by bending the thin sheet 20 with a breaking bar 92 that contacts and deflects the thin sheet 20 and deflects (or flexes) the carrier 10, thereby introducing a force that propagates the vents 61 through the thickness 22 of the thin sheet 20. As depicted in FIG. 4, the pallet 80 may generally correspond in size to the desired part 56 of the thin sheet 20 or may be sized smaller in dimension than the desired part 56, such that when a load is applied to the bonded area 40 of the thin sheet 20 at positions outside of the desired part 56 defined by the vents 61, the load tends flex the carrier 10 and open the vents 61 along the edge 84 of the pallet 80. The carrier 10, however, may maintain structural integrity of the article 2 throughout the load application operation.

[0033] Alternatively or in addition, a high-density fluid, for example a liquid, (not shown) may be introduced to at least one of the surfaces of the thin sheet 20, for example the second side 133 of the thin sheet 20. The high-density fluid may modify the force balance along the thin sheet 20, thereby encouraging the vents 61 to propagate through the thickness 22 of the thin sheet 20. In embodiments that incorporate lasers to propagate the vents 61 in the thin sheet 20, a coolant nozzle (not shown) may follow the laser as the laser traverses along the surface of the thin sheet 20. The coolant nozzle may provide local cooling to the thin sheet 20 in regions that were previously heated by the laser. The differential heating and cooling of the local regions of the thin sheet 20 introduced by the laser and the coolant nozzle creates a stress that propagates vents 61 through the thickness of the thin sheet 20.

[0034] Referring now to FIG. 5, embodiments according to present disclosure may include a forced-fluid injection system 200, which is adapted to inject fluid towards an edge 58 of the desired part 56 of the thin sheet 20 such that the injected fluid lifts at least a portion of the desired part 56 of the thin sheet 20 from the carrier 10. The forced- fluid injection system 200 may include at least one fluid nozzle 210 that is in fluid communication with a fluid manifold 220. The fluid manifold 220 is pressurized and supplies a gaseous fluid, for example and without limitation, air, oxygen, nitrogen, helium, and the like, to the fluid nozzles 210. A plurality of fluid nozzles 210 may be in fluid communication with a fluid manifold 220, such that similar fluid pressure may be introduced to the plurality of fluid nozzles 210. Alternatively or in addition, individual fluid nozzles 210 may be in fluid communication with individual fluid manifolds 220, such that fluid pressure introduced to each of the fluid nozzles 210 may be varied.

[0035] Referring to FIG. 6, in some embodiments, the fluid nozzles 210 may have an internal flow diameter 212 from about 0.5 mm to about 2.0 mm. The fluid nozzles 210 may be arranged such that the fluid nozzles 210 inject fluid at an injection angle 214 relative to the desired part 56 of the thin sheet 20. In some embodiments, the fluid nozzles 210 may be arranged such that the injection angle 214 that is obtuse (greater than 90 degrees), for example, from about 105 degrees to about 165 degrees relative to the second surface 133 of the desired part 56 of the thin sheet 20. In further embodiments, the fluid nozzles 210 may be arranged such that injection angle 214 from about 1 15 degrees to about 150 degrees relative to the second surface 133 of the desired part 56 of the thin sheet 20. A plurality of fluid nozzles 210 may be arranged along a nozzle support frame (not shown) that positions the plurality of fluid nozzles 210 relative to the thin sheet 20, such that the position of the plurality of fluid nozzles 210 is repeatable as a series of articles 2 are moved along the manufacturing line.

[0036] The fluid nozzles 210 are angled relative to the second surface 133 of the thin sheet 20 such that pressurized fluid is towards the edge of the desired part 56 of the thin sheet 20. At least a portion of the pressurized fluid is injected into a spacing created between the desired part 56 and the bonded area 40 of the thin sheet 20, and between the desired part 56 of the thin sheet 20 and the carrier 10. The high pressure region exhibits increased static pressure as compared to a proximate region along the second side 133 of the thin sheet 20. The high pressure region may separate at least a portion of the desired part 56 of the thin sheet 20 from the carrier 10. The pressurized fluid may overcome any forces, including the van der Waals forces between the thin sheet 20 and the carrier 10 as discussed hereinabove, that otherwise maintain contact between the desired part 56 of the thin sheet 20 and the carrier 10.

[0037] In some embodiments, the fluid nozzles 210 eject fluid across the second side 133 of the thin sheet 20 opposite the carrier 10. The fluid ejected over the second side 133 of the thin sheet 20 may reduce the static pressure along the second side 133 of the thin sheet 20. As such, forces maintaining contact between the desired part 56 of the thin sheet 20 and the carrier 10 may be reduced such that fluid injected below the desired part 56 of the thin sheet 20 lifts the desired part 56 from the carrier 10 with a small force applied to the underside of the thin sheet 20. [0038] Referring to FIGS. 7 and 8, with at least a portion of the desired part 56 of the thin sheet 20 lifted from the carrier 10 by pressurized fluid injected from the forced- fluid injection system 200, a barrier layer 240 may be inserted between the desired part 56 of the thin sheet 20 and the carrier 10. The barrier layer 240 may take a variety of forms and shapes, and may be made from a variety of materials. In one embodiment, the barrier layer 240 is made from clean room paper having low particle formation. In the embodiment depicted in FIGS. 7 and 8, the barrier layer 240 has at least one of a lengthwise dimension 242 or a widthwise dimension 244 that is greater than the corresponding lengthwise dimension 136 or the widthwise dimension 138 of the desired part 56 of the thin sheet 20. The forced-fluid injection system 200 continues to inject pressurized fluid below the desired part 56 of the thin sheet 20, with the pressurized fluid flowing beneath the first side 131 of the thin sheet 20 and lifting the thin sheet 20 from the carrier 10, such that the barrier layer 240 may be translated beneath the desired part 56 of the thin sheet 20. Further, the injected fluid, together with the barrier layer 240 may create a lifting front that applies a force that tends to separate the desired part 56 of the thin sheet 20 from the carrier 10 at positions proximate to the leading edge 246 of the barrier layer 240. The lifting front may progress along the thin sheet 20 in the direction of barrier layer 240 insertion and/or fluid injection. In some embodiments, the barrier layer 240 may be translated beneath the desired part 56 in at least one of the lengthwise dimension 136 or the widthwise dimension 138 such that complete separation of the desired part 56 of the thin sheet 20 from the carrier 10 may be achieved. The desired part 56 of the thin sheet 20 may thereafter be moved by handling the barrier layer 240. Portions of the barrier layer 240 extending beyond the desired part 56 of the thin sheet 20 are defined as the gripping portions 248 of the barrier layer 240.

[0039] With complete separation of the desired part 56 of the thin sheet 20 achieved, the desired part 56 of the thin sheet 20, along with the attached electrical components 120 may be separated from the carrier 10 by gripping and lifting the barrier layer 240. Thus, the barrier layer 240 allows for handling of the desired part 56 of the thin sheet 20 without contacting the second side 133 of the thin sheet 20 upon which electrical components 120 are attached.

[0040] It should be understood that manufacturing electrical components on thin sheets may provide advantages over alternative thin sheet materials. Processing flexible thin sheets in existing manufacturing lines may require supplementing the thin sheet with a carrier to thicken and/or stiff the glass substrate so that the glass substrate may be processed in existing equipment design to accommodate thicker and/or stiff er substrates. Portions of the thin sheet may be removed from the carrier after processing by scoring the thin sheet, thereby separating a desired part of the thin sheet from an bonded area of the thin sheet, and injecting fluid between the desired part of the thin sheet and the carrier to lift at least a portion of the thin sheet from the carrier. A barrier layer inserted between the desired part of the thin sheet and the carrier allows for handling of the desired part of the thin sheet without contacting the electrical components, reducing the likelihood of damage to the electrical components.

[0041] It should now be understood that apparatuses and methods for manufacturing electrical components on a thin sheet according to the present disclosure allow for the use of thin, flexible thin sheets with legacy manufacturing equipment. By coupling the thin sheet to the carrier, the thin sheet exhibits rigidity during the electrical component production operations. Separating the thin sheet from the carrier and introducing a barrier layer beneath the thin sheet allows for the electrical assembly to be transported without contacting the electrical components themselves, which are formed onto a surface of the thin sheet.

[0042] In a first aspect, the disclosure provides a method of separating a desired part of a thin sheet from a carrier comprising: injecting a fluid towards an edge of the desired part of the thin sheet, the thin sheet being not bonded with the carrier in a non-bonded area that includes the desired part and bonded to the carrier in a bonded area, wherein the fluid lifts at least a portion of the desired part from the carrier; and inserting a barrier layer between the desired part of the thin sheet and the carrier at a position proximate to the position where the desired part of the thin sheet is lifted from the carrier.

[0043] In a second aspect, the disclosure provides a method of separating a desired part of a thin sheet from a carrier comprising: injecting a fluid towards an edge of the desired part of the thin sheet, the fluid lifting at least a portion of the desired part of the thin sheet from the carrier; inserting a barrier layer between the desired part of the thin sheet and the carrier at a position proximate to the position where desired part of the thin sheet is lifted from the carrier; and directing the barrier layer between the desired part of the thin sheet and the carrier such that the barrier layer extends beyond the desired part of the thin sheet in at least one direction.

[0044] In a third aspect, the disclosure provides the methods of the first or second aspects, further comprising forming vents in the thin sheet, the vents defining the edge of the desired part of the thin sheet. [0045] In a fourth aspect, the disclosure provides the methods of the third aspect, further comprising propagating the vents through the thin sheet to separate the bonded area from the desired part.

[0046] In a fifth aspect, the disclosure provides the methods of the fourth aspect, wherein the vents are propagated through the thin sheet by flexing the thin sheet together with the carrier.

[0047] In a sixth aspect, the disclosure provides the methods of the third through fifth aspects, wherein the vents are formed in the thin sheet by a mechanical scoring.

[0048] In a seventh aspect, the disclosure provides the methods of the third through sixth aspects, wherein the vents are formed into the thin sheet by a laser scoring.

[0049] In an eighth aspect, the disclosure provides the methods of the first through seventh aspects, further comprising supporting the thin sheet and the carrier with a vacuum platen, the vacuum platen being sized smaller than the desired part.

[0050] In a ninth aspect, the disclosure provides the methods of the first through eighth aspects, wherein the fluid injected towards the edge of the desired part of the thin sheet overcomes attraction forces between the thin sheet and the carrier.

[0051] In a tenth aspect, the disclosure provides the methods of the first through ninth aspects, wherein the fluid injected towards the edge of the desired part of the thin sheet flows between the thin sheet and the barrier layer and lifts at least a portion of the desired part of the thin sheet from the carrier at a position spaced apart from the edge of the desired part of the thin sheet.

[0052] In an eleventh aspect, the disclosure provides the methods of the first through tenth aspects, further comprising directing the barrier layer between the thin sheet and the carrier such that the barrier layer extends beyond a periphery of the desired part of the thin sheet in at least one direction.

[0053] In a twelfth aspect, the disclosure provides the methods of the eleventh aspect, further comprising gripping the portion of the barrier layer that extends beyond the periphery of the desired part of the thin sheet.

[0054] In a thirteenth aspect, the disclosure provides the methods of the first through twelfth aspects, wherein the fluid is injected towards the edge of the desired part of the thin sheet through at least one fluid nozzle. [0055] In a fourteenth aspect, the disclosure provides the methods of the thirteenth aspect, wherein the at least one fluid nozzle is oriented at an injection angle that is obtuse relative to a second surface of the thin sheet opposite the carrier.

[0056] In a fifteenth aspect, the disclosure provides the methods of the thirteenth or fourteenth aspect, wherein the fluid injected through the at least one fluid nozzle creates a high pressure region between the thin sheet and the carrier.

[0057] It is noted that the terms "substantially" and "about" may be utilized herein to represent the inherent degree of uncertainty that may be attributed to any quantitative comparison, value, measurement, or other representation. These terms are also utilized herein to represent the degree by which a quantitative representation may vary from a stated reference without resulting in a change in the basic function of the subject matter at issue.

[0058] While particular embodiments have been illustrated and described herein, it should be understood that various other changes and modifications may be made without departing from the spirit and scope of the claimed subject matter. Moreover, although various aspects of the claimed subject matter have been described herein, such aspects need not be utilized in combination. It is therefore intended that the appended claims cover all such changes and modifications that are within the scope of the claimed subject matter.

Claims

1. A method of separating a desired part of a thin sheet from a carrier comprising:

injecting a fluid towards an edge of the desired part of the thin sheet, the thin sheet being not bonded with the carrier in a non-bonded area that includes the desired part and bonded to the carrier in a bonded area, wherein the fluid lifts at least a portion of the desired part from the carrier; and

inserting a barrier layer between the desired part of the thin sheet and the carrier at a position proximate to the position where the desired part of the thin sheet is lifted from the carrier.

2. The method of separating a desired part of a thin sheet from a carrier of claim 1, further comprising forming vents in the thin sheet, the vents defining the edge of the desired part of the thin sheet.

3. The method of separating a desired part of a thin sheet from a carrier of claim 2, further comprising propagating the vents through the thin sheet to separate the bonded area from the desired part.

4. The method of separating a desired part of a thin sheet from a carrier of claim 3, wherein the vents are propagated through the thin sheet by flexing the thin sheet together with the carrier.

5. The method of separating a desired part of a thin sheet from a carrier of claim 2, wherein the vents are formed in the thin sheet by a mechanical scoring.

6. The method of separating a desired part of a thin sheet from a carrier of claim 2, wherein the vents are formed into the thin sheet by a laser scoring.

7. The method of separating a desired part of a thin sheet from a carrier of claim 1, further comprising supporting the thin sheet and the carrier with a vacuum platen, the vacuum platen being sized smaller than the desired part.

8. The method of separating a desired part of a thin sheet from a carrier of claim 1, wherein the fluid injected towards the edge of the desired part of the thin sheet overcomes attraction forces between the thin sheet and the carrier.

9. The method of separating a desired part of a thin sheet from a carrier of claim 1, wherein the fluid injected towards the edge of the desired part of the thin sheet flows between the thin sheet and the barrier layer and lifts at least a portion of the desired part of the thin sheet from the carrier at a position spaced apart from the edge of the desired part of the thin sheet.

10. The method of separating a desired part of a thin sheet from a carrier of claim 1, further comprising directing the barrier layer between the thin sheet and the carrier such that the barrier layer extends beyond a periphery of the desired part of the thin sheet in at least one direction.

11. The method of separating a desired part of a thin sheet from a carrier of claim 10, further comprising gripping the portion of the barrier layer that extends beyond the periphery of the desired part of the thin sheet.

12. The method of separating a desired part of a thin sheet from a carrier of claim 1, wherein the fluid is injected towards the edge of the desired part of the thin sheet through at least one fluid nozzle.

13. The method of separating a desired part of a thin sheet from a carrier of claim 12, wherein the at least one fluid nozzle is oriented at an injection angle that is obtuse relative to a second surface of the thin sheet opposite the carrier.

14. The method of separating a desired part of a thin sheet from a carrier of claim 12, wherein the fluid injected through the at least one fluid nozzle creates a high pressure region between the thin sheet and the carrier.

15. A method of separating a desired part of a thin sheet from a carrier comprising:

injecting a fluid towards an edge of the desired part of the thin sheet, the fluid lifting at least a portion of the desired part of the thin sheet from the carrier;

inserting a barrier layer between the desired part of the thin sheet and the carrier at a position proximate to the position where desired part of the thin sheet is lifted from the carrier; and

directing the barrier layer between the desired part of the thin sheet and the carrier such that the barrier layer extends beyond the desired part of the thin sheet in at least one direction.

16. The method of claim 15, further comprising:

forming vents in the thin sheet at positions between a desired part of the thin sheet and a bonding region of the thin sheet, the desired part of the thin sheet being detached from the carrier and the thin sheet being coupled to the carrier in the bonding region; and

propagating the vents through the thin sheet to separate the bonding region from the desired part, the vents defining the edge of the desired part of the thin sheet.

17. The method of claim 16, wherein the fluid injected towards the edge of the thin sheet overcomes an attraction force between the desired part of the thin sheet and the carrier.

18. The method of claim 15, wherein the fluid is injected towards the edge of the thin sheet through at least one fluid nozzle.

19. The method of claim 18, wherein the at least one fluid nozzle is oriented at an injection angle that is obtuse relative to a second side of the thin sheet opposite a first side of the thin sheet that is positioned proximate to the carrier.

20. The method of claim 18, wherein the fluid injected through the at least one fluid nozzle creates a high pressure region between the thin sheet and the carrier.