WO2004008471A1

WO2004008471A1 - Image display device, image display device manufacturing method, and manufacturing device

Info

Publication number: WO2004008471A1
Application number: PCT/JP2003/008929
Authority: WO
Inventors: Hisakazu Okamoto; Tsukasa Ooshima; Akiyoshi Yamada; Takashi Enomoto; Masahiro Yokota; Takashi Nishimura; Hirotaka Unno; Hiroharu Takezawa
Original assignee: Kabushiki Kaisha Toshiba
Priority date: 2002-07-15
Filing date: 2003-07-14
Publication date: 2004-01-22
Also published as: TWI278886B; JPWO2004008471A1; EP1542255A1; KR100686668B1; CN1663006A; KR20050010928A; TW200411695A

Abstract

An external device of an image display device includes a front substrate (11) and a rear substrate (12) arranged to oppose to the front substrate. The front substrate has a periphery portion attached to a periphery portion of the rear substrate to form a sealed space by a sealing layer (21) containing a conductive sealing adhesive. An electrode (30) is mounted on the external device for electrical connection with the sealing layer. The electrode is formed by a conductive member, in electrical contact with the sealing layer, and has an electrical connection section (38) exposed outside.

Description

Specification

Image display device, method of manufacturing image display device, and manufacturing device

The present invention relates to a flat-type image display device having substrates arranged to face each other, a method for manufacturing an image display device, and a device for manufacturing an image display device.

Background art

In recent years, various image display devices have been developed as next-generation light-weight and thin display devices that replace cathode ray tubes (hereinafter referred to as CRTs). Such image display devices include a liquid crystal display (hereinafter, referred to as an LCD) that controls the intensity of light by using the orientation of liquid crystal, and a plasma display that emits phosphors using ultraviolet light of plasma discharge. Panels (hereinafter referred to as PDPs), field emission displays (hereinafter referred to as FEDs) that emit phosphors with electron beams from field emission electron-emitting devices, and electrons in surface conduction electron-emitting devices There are surface-conduction electron emission displays (hereinafter referred to as SEDs) that emit phosphors by beams.

For example, FEDs and SEDs generally have a front substrate and a rear substrate that are opposed to each other with a predetermined gap, and these substrates are joined to each other through a rectangular frame-shaped side wall. And constitute a vacuum envelope. A phosphor screen is formed on the inner surface of the front substrate, and a number of electron-emitting devices are provided on the inner surface of the rear substrate as electron emission sources for exciting the phosphor to emit light. In order to support the atmospheric load applied to the rear substrate and the front substrate, a plurality of support members are disposed between these substrates. The potential on the back substrate side is almost the ground potential, and the anode voltage Va is applied to the phosphor screen. Then, the red, green, and blue phosphors that make up the phosphor screen are irradiated with the electron beam emitted from the emitter, and the phosphors emit light to display images. With such FEDs and SEDs, the thickness of the display device can be reduced to about several mm, and it can be compared with CRTs used as displays for televisions and computers today. As a result, the weight and the thickness can be reduced.

With the above-mentioned FED and SED, it is necessary to maintain the inside of the envelope at a high vacuum. Also, in the case of PDP, it is necessary to evacuate the envelope once and then to fill the discharge gas. As a method of manufacturing an FED provided with a vacuum envelope, for example, Japanese Patent Application Laid-Open No. 2000-220980 and Japanese Patent Application Laid-Open No. 2001-210258 Discloses a method of performing final assembly of a front substrate and a rear substrate constituting an envelope in a vacuum chamber.

In this method, first, the front substrate and the rear substrate brought into the vacuum chamber are sufficiently heated. This is to reduce the gas release from the inner wall of the envelope, which is the main cause of the deterioration of the envelope vacuum. Next, when the front and back substrates cooled down and the degree of vacuum in the vacuum chamber was sufficiently improved, a getter film for improving and maintaining the vacuum degree of the envelope was placed on the phosphor screen. Form. After that, the front substrate and the rear substrate are heated again to a temperature at which the sealing material melts, and the front substrate and the rear substrate are heated. Cool in a state where the sealing material is solidified in a state where the sealing material is combined with the predetermined position.

The vacuum envelope made by such a method can perform both the sealing process and the vacuum sealing process, does not require much time for evacuation, and can obtain an extremely good degree of vacuum. And can be. As a sealing material, it is desirable to use a low-melting-point material suitable for sealing and sealing batch processing.

However, when assembling in such a vacuum, the processes performed in the sealing process include heating, positioning, and cooling, and the sealing material melts and solidifies for a long time. The front substrate and the rear substrate must be kept in place. In addition, there are problems in productivity and characteristics associated with sealing, such as that the front substrate and the rear substrate are thermally expanded due to heating and cooling at the time of sealing, and alignment accuracy is likely to deteriorate.

As a method to solve this problem, a method is used in which a conductive sealing material such as indium is energized, and the conductive sealing material itself is heated and melted by Joule heat to bond the substrates (hereinafter referred to as energizing heating and ) Are being considered. According to this method, it is not necessary to spend an enormous amount of time for cooling the substrate, and the envelope can be vacuum-sealed in a short time and with a simple device. That is, by using a conductive sealing material, it is possible to selectively heat only the sealing material having a small heat capacity without heating the substrate, and to deteriorate the positional accuracy due to the thermal expansion of the substrate. Can be suppressed. Also, since the heat capacity of the sealing material is very small compared to the heat capacity of the substrate, it requires more heating and cooling than the method of heating the entire substrate. Time and time can be greatly reduced, and mass productivity can be greatly improved.

However, in the case of electric heating, it is necessary to supply a stable current to the conductive sealing material. If the current value is not stable, the time required for dissolving the conductive sealing material differs depending on the individual enclosure, and stable substrate bonding cannot be performed. If the conductive sealing material is overheated, the heat will crack the substrate. On the other hand, if not melted sufficiently, the bonding of the substrates will be insufficient, and problems will occur such that the vacuum of the envelope cannot be maintained in the subsequent evacuation process. Disclosure of the invention

The present invention has been made in view of the above points, and an object of the present invention is to provide a method of manufacturing an image display device and a manufacturing device capable of performing a sealing operation quickly and stably. And.

In order to achieve the above object, an image display device according to an aspect of the present invention includes a front substrate, and a back substrate disposed opposite to the front substrate, wherein a sealing layer containing a conductive sealing material is provided. Thus, the front substrate and the rear substrate are attached to the envelope in which the peripheral edges of the substrates are sealed, and the envelope is attached to the envelope while electrically contacting the sealing layer. And an electrode for supplying electricity.

A method of manufacturing an image display device according to another aspect of the present invention includes an image display device including an envelope having a front substrate and a rear substrate, which are arranged to face each other and whose peripheral portions are joined to each other. The method of manufacturing

At least one edge of the front and back substrates A sealing material having conductivity is arranged to form a sealing layer, and an electrode is attached to at least one of the front substrate and the rear substrate on which the sealing layer is formed, and the sealing is performed. In the state where the front substrate and the rear substrate are electrically opposed to each other and the front substrate and the rear substrate are arranged to face each other, an electric current is applied to the sealing layer through the electrode, and the sealing layer is heated and melted to thereby surround the front substrate and the rear substrate. Join the parts together.

According to the image display device and the method of manufacturing the image display device configured as described above, the image display device includes an electrode that is previously attached to the envelope and is electrically connected to the sealing layer, and is sealed through the electrode. The envelope is constructed by heating the deposited layer with electric current. Therefore, a stable current can be applied to the sealing layer formed of the conductive sealing material, and the sealing operation of the image display device can be quickly and stably performed.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a perspective view showing the entire FED according to the first embodiment of the present invention.

FIG. 2 is a perspective view showing the internal configuration of the FED.

FIG. 3 is a cross-sectional view taken along line III-III in FIG.

FIG. 4 is an enlarged plan view showing a part of the phosphor screen of the FED.

FIG. 5 is a perspective view showing the FED electrode.

6A and 6B are plan views respectively showing a front substrate and a rear substrate used for manufacturing the FED.

FIG. 7 is a perspective view showing a state in which electrodes are attached to the rear substrate of the FED. FIG. 8 is a cross-sectional view showing a state in which a rear substrate and a front substrate, each having indium disposed in the sealing portion, are opposed to each other.

FIG. 9 is a diagram schematically showing a vacuum processing apparatus used for manufacturing the FED.

FIG. 10 is a plan view schematically showing a state in which a power supply is connected to an electrode of the FED in the FED manufacturing process.

FIG. 11 is a perspective view showing a part of an FED according to a second embodiment of the present invention.

FIG. 12A and FIG. 12B are cross-sectional views showing the manufacturing process of the FED according to the second embodiment.

FIG. 13 is a plan view schematically showing a state in which a power supply is connected to an electrode of the FED in a process of manufacturing the FED according to the third embodiment of the present invention.

FIG. 14A and FIG. 14B are cross-sectional views showing the manufacturing process of the FED according to the third embodiment.

FIG. 15 is a perspective view showing the entire FED according to the fourth embodiment of the present invention.

Figure 16 is a cross-sectional view of Figure 15 taken along line XVI—XVI.

FIG. 17 is a perspective view showing the FED electrode.

FIG. 18A and FIG. 18B are plan views respectively showing a front substrate and a rear substrate used for manufacturing the FED.

FIG. 19 is a cross-sectional view showing a state in which the rear substrate and the front substrate on which indium is arranged are opposed to each other.

FIG. 20 is a cross-sectional view showing a modification of the electrode in the fourth embodiment. FIG. 21 is a perspective view showing another modification of the electrode in the fourth embodiment.

FIG. 22 is a cross-sectional view showing another modified example of the fourth embodiment.

FIG. 23 is a perspective view showing the entire FED according to the fifth embodiment of the present invention.

FIG. 24 is a cross-sectional view along the line XXIV-XXIV of FIG. FIG. 25 is a perspective view showing an FED electrode according to the fifth embodiment.

FIG. 26 is a cross-sectional view showing an electrode according to a modification of the fifth embodiment.

FIG. 27 is a perspective view showing an electrode according to another modification of the fifth embodiment.

FIG. 28 is a cross-sectional view showing an electrode according to another modification of the fifth embodiment.

FIG. 29 is a perspective view showing an electrode according to still another modification of the fifth embodiment.

FIG. 30 is a perspective view showing an FED according to a sixth embodiment of the present invention.

FIG. 31A is a plan view showing a front substrate used for manufacturing the above-mentioned FED.

FIG. 31B is a plan view showing a back substrate, side walls, and spacers used for manufacturing the above-mentioned FED.

FIG. 32 is a cross-sectional view showing a step of sealing the front substrate and the side wall in the manufacturing method according to the sixth embodiment. FIG. 33 is a plan view showing a modification of the electrode in the sixth embodiment.

FIG. 34A and FIG. 34B are plan views each showing another modified example of the electrode in the sixth embodiment.

FIG. 35 is a cross-sectional view showing the method of manufacturing the FED according to the seventh embodiment of the present invention.

FIG. 36 is a cross-sectional view showing a sealing step using an electrode according to a modification of the seventh embodiment.

FIG. 37 is a cross-sectional view showing the method of manufacturing the FED according to the eighth embodiment of the present invention.

FIG. 38 is a cross-sectional view showing a state where electrodes are inserted between the substrates in the eighth embodiment.

FIG. 39 is a cross-sectional view showing a state where both substrates are pressed in a direction approaching each other in the eighth embodiment.

FIG. 40 is a cross-sectional view showing a method of manufacturing an FED according to a ninth embodiment of the present invention.

FIG. 41 is a cross-sectional view showing a state where an electrode is brought into contact with a welded portion of a sealing layer in the ninth embodiment.

FIG. 42 is a perspective view showing the entire FED according to the tenth embodiment of the present invention.

Figure 43 is a cross-sectional view along the line XLIII—XLIII of Figure 42. FIG. 44 is a perspective view showing the FED electrode according to the tenth embodiment.

FIG. 45 is a perspective view showing a state where electrodes are attached to a rear substrate in the tenth embodiment. FIG. 46 is a cross-sectional view showing a state where the rear substrate and the front substrate on which the sealing layer is disposed are arranged to face each other in the tenth embodiment.

FIG. 47 is a cross-sectional view showing a state in which the back substrate and the front substrate are pressed in a direction approaching each other in the tenth embodiment, and the contact portions of the electrodes are sandwiched between sealing layers.

FIG. 48 is a perspective view showing an electrode according to a modification of the tenth embodiment.

FIG. 49 is a perspective view showing an electrode according to another modification in the tenth embodiment.

FIG. 50 is a perspective view showing an electrode according to still another modification of the tenth embodiment.

FIG. 51 is a cross-sectional view showing an electrode according to another modification of the tenth embodiment.

FIG. 52 is a cross-sectional view showing a state in which the rear substrate and the front substrate on which indium is arranged are opposed to each other in a modification of the tenth embodiment.

FIG. 53 is a cross-sectional view showing a state in which the rear substrate and the front substrate on which an indicator is arranged are opposed to each other in another modification of the tenth embodiment.

FIG. 54 is a perspective view showing an electrode according to a modification of the tenth embodiment.

FIG. 55 is a cross-sectional view showing a step of removing an electrode in the first embodiment of the present invention.

FIG. 56 is a cross-sectional view showing a step of removing an electrode in the eleventh embodiment. FIG. 57 is a perspective view showing the FED with the electrodes removed in the first embodiment.

FIG. 58 is a cross-sectional view showing the FED with the electrodes removed in the eleventh embodiment.

FIG. 59 is a cross-sectional view showing a step of removing an electrode in the modification of the first embodiment.

FIG. 60 is a cross-sectional view showing a step of removing an electrode in another modification of the eleventh embodiment.

FIG. 61A to FIG. 61E are plan views respectively showing modified examples of the concave portion formed in the sealing layer of FED in the first embodiment.

FIG. 62 is a cross-sectional view showing a step of cutting an electrode in the first embodiment of the present invention.

FIG. 63 is a cross-sectional view showing a step of removing the cut electrode in the first embodiment.

FIG. 64 is a cross-sectional view showing an FED according to a thirteenth embodiment of the present invention.

FIG. 65 is a perspective view showing a state where an electrode is mounted on the rear substrate in the thirteenth embodiment.

FIG. 66 is a cross-sectional view showing the manufacturing apparatus according to the thirteenth embodiment.

FIG. 67 is a perspective view schematically showing the manufacturing apparatus.

FIG. 68 is a cross-sectional view showing a manufacturing apparatus according to a modification of the thirteenth embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an FED and a method of manufacturing the FED according to the first embodiment of the present invention will be described in detail with reference to the drawings.

As shown in Fig. 1 or Fig. 4, the FED has a front substrate 11 and a rear substrate 12 each made of a rectangular glass plate, and these substrates are separated by a gap of 1 to 2 mm. They are arranged facing each other. The front substrate 11 and the rear substrate 12 are joined to each other via a rectangular frame-shaped side wall 18 to form a flat rectangular vacuum envelope 10 whose inside is maintained in a vacuum. Make up.

Inside the vacuum envelope 10, a plurality of plate-like support members 14 are provided to support the atmospheric pressure load applied to the front substrate 11 and the rear substrate 12. The support members 14 extend in a direction parallel to one side of the vacuum envelope 10 and are arranged at predetermined intervals along a direction orthogonal to the one side. ing. The support member 14 is not limited to the plate shape, and may be a columnar shape.

On the inner surface of the front substrate 11, a phosphor screen 16 functioning as an image display surface is formed. The phosphor screen 16 is composed of phosphor layers R, G, and B of red, green, and blue, and a light absorbing layer 20 positioned between these phosphor layers. R, G, and B extend in a direction parallel to the one side of the vacuum envelope 10 and are arranged at predetermined intervals along a direction orthogonal to the one side. . The light absorbing layer 20 is provided around the phosphor layers R, G, and B. On the phosphor screen 16, for example, a metal knock 17 made of aluminum force and a getter film 13 are sequentially deposited. As shown in FIG. 3, on the inner surface of the rear substrate 12, there are a number of electron emission sources for exciting the phosphor layers of the phosphor screen 16, each emitting an electron beam. The electron-emitting device 22 is provided. These electron-emitting devices 22 are arranged in a plurality of columns and a plurality of rows corresponding to each pixel. Specifically, a conductive force layer 24 is formed on the inner surface of the back substrate 12, and a silicon dioxide having a large number of cavities 25 is formed on the conductive force layer. A film 26 is formed. A gate electrode 28 made of molybdenum, niobium, or the like is formed on the silicon dioxide film 26. A cone-shaped electron-emitting device 22 made of molybdenum or the like is provided in each cavity 25 on the inner surface of the rear substrate 12.

In the FED having the above configuration, a video signal is input to the electron-emitting device 22 and the gate electrode 28 formed in a simple matrix system. When the electron-emitting device 22 is used as a reference, a gate voltage of +100 V is applied when the luminance is the highest. Further, +10 kV is applied to the phosphor screen 16 with a printing force B. As a result, an electron beam is emitted from the electron-emitting device 22. The size of the electron beam emitted from the electron-emitting device 22 is modulated by the voltage of the gate electrode 28, and this electron beam excites the phosphor layer of the phosphor screen 16. The image is displayed by emitting light.

Since a high voltage is applied to the phosphor screen 16, a high strain point glass is formed on the glass plates for the front substrate 11, the rear substrate 12, the side walls 18, and the support members 14. It is used. See below As described above, the space between the rear substrate 12 and the side wall 18 is sealed with a low-melting glass 19 such as a frit glass. Front board 1

The gap between 1 and the side wall 18 is sealed by a sealing layer 21 containing indium (In) as a low-melting sealing material having conductivity.

The FED includes a plurality of, for example, a pair of electrodes 30, and these electrodes are attached to the envelope 10 in a state of being electrically connected to the sealing layer 21. These electrodes 30 are used as electrode members when energizing the sealing layer 21.

As shown in FIG. 5, each electrode 30 serves as a conductive member, for example.

That is, the electrode 30 is bent so as to have a substantially U-shaped cross-section, and is formed into a flat first plate portion 3 by machining a copper plate having a thickness of 0.2 mm. 3a, the second plate portion 33b opposed to the first plate portion with a gap therebetween, and the first and second plate portions extend at substantially right angles, and the first and second plate portions 33b extend at substantially right angles. It has a conducting portion 38 that connects the edges of the two plates at the same time. 1st plate 3

3ba has first and second contact portions 36a and 36b which are electrically connected to the sealing layer 21 respectively. First and second contact 3

A slit 45 is formed between 6a and 36b, and the second contact portion is formed.

36 b has a claw shape and can be easily elastically deformed. As shown in FIG. 1 or FIG. 3, each electrode 30 is attached to the vacuum envelope 10 while being elastically engaged with the back substrate 12 and the side wall 18, for example. . That is, the electrode 30 is

1 With the edge and the side wall 18 of the back substrate 1 2 elastically held between the plate 33 b and the second plate 33 b, the vacuum envelope 1 Fixed to 0. The first and second contact portions 36a and 36b of the first plate portion 33a are in contact with the sealing layer 21 and are electrically conductive. The conducting portion 38 of the electrode 30 faces the side surface and the side wall 18 of the back substrate 12 and is exposed outside the vacuum envelope 10. The pair of electrodes 30 are provided at two diagonally separated corners of the vacuum envelope 10, respectively, and are arranged symmetrically with respect to the sealing layer 21.

Next, a method of manufacturing the FED having the above configuration will be described in detail.

First, a phosphor screen 16 is formed on a plate glass serving as the front substrate 11. In this case, a plate glass having the same size as the front substrate 11 is prepared, and a phosphor strip pattern is formed on the plate glass by a plotter machine. The plate glass on which the phosphor stripe pattern is formed and the plate glass for the front substrate are placed on a positioning jig and set on an exposure table. In this state, the phosphor stripe pattern is exposed and developed, so that a phosphor screen is generated on a glass plate serving as the front substrate 11. Thereafter, a metal back 17 is formed on the phosphor screen 16 to form the metal back 17. Subsequently, an electron-emitting device 22 is formed on the glass plate for the rear substrate 12. This is achieved by forming a matrix-shaped conductive power source layer 24 on a sheet glass, and forming a second oxide layer on this power source layer by, for example, a thermal oxidation method, a CVD method, or a sputtering method. An insulating film of a silicon film is formed. Thereafter, a metal film for forming a gate electrode such as molybdenum or niobium is formed on the insulating film by, for example, a sputtering method or an electron beam evaporation method. Next, A resist pattern having a shape corresponding to the gate electrode to be formed is formed on the metal film by lithography. Using the resist pattern as a mask, the metal film is etched by a wet etching method or a dry etching method to form a gate electrode 28.

Thereafter, the insulating film is etched by a wet or dry etching method using the resist pattern and the gate electrode 28 as a mask to form a cavity 25. After removing the resist pattern, electron beam evaporation is performed from a direction inclined at a predetermined angle with respect to the surface of the rear substrate 12, thereby forming, for example, aluminum or nickel on the gate electrode 28. A release layer is formed. Thereafter, for example, molybdenum is vapor-deposited as a material for forming a force source from a direction perpendicular to the rear substrate surface by an electron beam vapor deposition method. As a result, the electron-emitting device 22 is formed inside the cavity 25. Next, the release layer and the metal film formed thereon are removed by a lift-off method. Subsequently, the side wall 18 and the support member 14 are sealed in the atmosphere on the inner surface of the back substrate 12 with the low melting point glass 19.

Thereafter, as shown in FIGS. 6A and 6B, an adhesive is applied to a predetermined width and thickness over the entire periphery of the sealing surface of the side wall 18 to form a sealing layer 21a. Similarly, indium is applied to the sealing surface facing the side wall of the front substrate 11 in a rectangular frame with a predetermined width and thickness to form a sealing layer 21b. The filling of the sealing layers 21a and 21b with respect to the sealing surface of the side wall 18 and the front substrate 11 is performed by applying molten indium to the sealing surface as described above. Alternatively, the method is carried out by placing indium in a solid state on a sealing surface.

Subsequently, as shown in FIG. 7, a pair of electrodes 30 is mounted on the back substrate 12 to which the side walls 18 are joined. At this time, the first contact portion 36a of each electrode 30 is brought into contact with the sealing layer 21a on the side wall 18 to electrically connect the electrode to the sealing layer. I do. In order to ensure the conductivity between the first contact portion 36a and the sealing layer, solder between the sealing layer 21a and the first contact portion 36a must be soldered in advance. Is also effective. The electrode 30 requires a pair of a positive electrode and a single electrode on the substrate, and it is desirable that the length of current flowing from each electrode to the sealing layers 21a and 21b be equal. Therefore, a pair of electrodes 30 is attached to two diagonally opposite corners of the rear substrate 12, and the length of the sealing layers 21 a and 21 b located between the electrodes is It is set almost equally on both sides of.

After the electrodes 30 are mounted, the rear substrate 12 and the front substrate 11 are opposed to each other with a predetermined distance therebetween, and are put into a vacuum processing apparatus in this state. Here, for example, a vacuum processing apparatus 100 as shown in FIG. 9 is used. The vacuum processing apparatus 100 includes a load chamber 101, a baking, electron beam cleaning chamber 102, a cooling chamber 103, a getter film deposition chamber 104, and an assembling chamber. 105, cooling room 106 and unloading room 107 are provided. The assembly room 105 is connected to a DC power supply 120 for energization and a computer 122 for controlling the power supply. Each chamber of the vacuum processing apparatus 100 is configured as a processing chamber capable of performing vacuum processing, and all the chambers are evacuated during the manufacture of the FED. Each of these The rooms are connected by a gate valve (not shown). The above-mentioned front substrate 11 and rear substrate 12 arranged at a predetermined interval are first loaded into a load chamber 101, and after the load chamber 101 is evacuated to a vacuum atmosphere, baking and electron beams are performed. It is sent to the washing room 102.

In the baking and electron beam cleaning chamber 102, each member is heated to a temperature of 300 ° C. to release the surface adsorbed gas on the side wall of each substrate. At the same time, baking and electron beams are emitted from an electron beam generator (not shown) provided in the electron beam cleaning room 102, and are emitted from the phosphor screen surface of the front substrate 11 and the rear substrate 12 Irradiate the element surface. At this time, the entire surface of the phosphor screen and the entire surface of the electron-emitting device are cleaned by deflecting and scanning the electron beam by a deflecting device mounted outside the electron beam generator. .

Then, the front substrate 11 and the rear substrate 12 that have been subjected to the heating and the electron beam cleaning are sent to a cooling chamber 103 and cooled to a temperature of about 120 ° C. In the vapor deposition chamber 104 which is sent to the vapor deposition chamber 104, a Ba film is vapor-deposited as a getter film outside the phosphor layer. The surface of the Ba film is prevented from being contaminated with oxygen, carbon, or the like, and can maintain an active state.

Subsequently, the front substrate 11 and the rear substrate 12 are sent to the assembly room 105. In this assembly room 105, as shown in FIG. 8, the front substrate 11 and the rear substrate 12 were moved in a direction approaching each other while maintaining the temperature at about 120 ° C. The second contact portion 36b of the first substrate is brought into contact with the sealing layer 21b on the front substrate 11 side. to this Thus, each electrode 30 is electrically connected to the sealing layer 2 lb. At this time, the second contact portion 36b is elastically pressed against the sealing layer 21b by the spring pressure, so that stable conductivity can be secured.

Next, as shown in FIG. 10, after the power supply 120 is electrically connected to the pair of electrodes 30, the sealing layer 21 a on the side wall 18 side and the sealing layer 21 a on the front substrate 11 side are formed. Electricity is applied to each of the bonding layers 21b to heat the sealing layer to melt the indium. At this time, by bringing the connection terminal 40 connected to the power supply 120 into contact with the conducting portion 38 of the electrode 30, the power supply and the electrode, and the electrode and the sealing layer 21 a, 21 b and can be reliably conducted.

After the indium is melted, the front substrate 11 and the rear substrate 12 are pressed in a direction approaching each other. Thus, the sealing layers 2 la and 2 lb are fused to form the sealing layer 21, and the peripheral portion of the front substrate 11 and the side wall 18 are sealed by the sealing layer. The vacuum envelope 10 formed by the above process is cooled to room temperature in the cooling chamber 106 and taken out of the unload chamber 107. This completes the FED vacuum envelope.

After the completion of the vacuum envelope, the electrode 30 may be cut off if necessary.

According to the FED configured as described above and the method for manufacturing the same, the electrode 30 for supplying electricity to the sealing layer 21 was previously mounted on the envelope and electrically connected to the sealing layer. Therefore, a stable current can be applied to the sealing layer 21 via the electrode 30 during the heating by energization. Therefore, at the time of sealing, the sealing layer The conductive low melting point sealing material to be formed can be stably and reliably melted in a predetermined energizing time, and as a result, the sealing layer 21 can be quickly and surely not cracked. Sealing can be performed.

Since the front and rear substrates are sealed and bonded in a vacuum atmosphere, the surface adsorbed gas can be sufficiently released by using both baking and electron beam cleaning, and the getter film has excellent adsorption capacity. Can be obtained. In addition, since the indium is sealed and joined by energizing and heating, there is no need to heat the entire front and back substrates, and the getter film is deteriorated. The substrate is broken during the sealing process. And the like can be eliminated, and at the same time, the sealing time can be shortened.

Therefore, it is possible to inexpensively obtain an FED that is excellent in mass productivity and that can obtain a stable and good image at the same time.

Next, an FED according to a second embodiment of the present invention will be described. In the above-described embodiment, each electrode is configured to include the first contact portion that is conductive to the sealing layer on the side wall and the second contact portion that is conductive to the sealing layer on the front substrate side. According to this embodiment, as shown in FIG. 11, FIG. 12A and FIG. 12B, the electrode 30 is provided with a single contact portion 36a. The pair of electrodes 30 are mounted on a pair of diagonally opposite corners of the rear substrate 12, respectively, and are attached to the envelope while elastically holding the side wall 18 and the rear substrate 12. It is attached. At this time, each contact portion 36a is in contact with the upper surface of the sealing layer 21a and is electrically connected to the sealing layer. In the sealing step, the front substrate 11 on which the sealing layer 2 1 b is formed is arranged to face the rear substrate 12, so that the contact portions 36 a of the respective electrodes 30 form the sealing layer 2 1. Both a and 2 lb are in contact and electrically connected. Then, the sealing layers 2 la and 2 lb can be simultaneously energized through these electrodes 30 to heat and melt the indium.

In the second embodiment, the other configuration is the same as that of the above-described first embodiment, and the same portions are denoted by the same reference numerals and detailed description thereof will be omitted. Also, in the second embodiment, the same operation and effect as in the first embodiment can be obtained. In the first and second embodiments, each electrode 30 may be mounted and fixed to the front substrate side.

According to the third embodiment shown in FIG. 13, FIG. 14A and FIG. 14B, the FED is a pair of first conductive members for supplying electricity to the sealing layer 21 a formed on the side wall 18. It includes an electrode 30 a and a pair of second electrodes 30 b for supplying electricity to the sealing layer 21 b formed on the front substrate 11. The first and second electrodes 30a and 30b are formed in a clip shape almost in the same manner as the above-described electrode 30.However, each electrode has one contact portion 36. Has become.

The pair of first electrodes 30 a are mounted on a pair of diagonally opposite corners of the rear substrate 12, respectively, and are attached while elastically sandwiching the side wall 18 and the rear substrate 12. ing. At this time, each of the first electrodes 30a is electrically connected to the sealing layer with its contact portion 36 in contact with the sealing layer 21a. The pair of second electrodes 3 Ob is formed on a pair of corners of the front substrate 11 opposite to each other in a diagonal direction. Each is mounted and attached with the front substrate elastically sandwiched. At this time, each of the second electrodes 3 Ob has a first electrode 30 a and a second electrode 30 whose contact portions 36 are in contact with the sealing layer 21 b and are electrically connected to the sealing layer. It is desirable that b be divided into four corners without overlapping each other.

In the sealing step, as shown in FIGS. 13 and 14A, the pair of connection terminals 40 a connected to the power supply 120 are brought into contact with the conductive portions 38 of the first electrode 30 a, respectively. Then, the power supply and the first electrode, and the first electrode and the sealing layer 2 la are electrically connected. Further, the pair of connection terminals 4 O b connected to the power supply 120 are brought into contact with the conducting portions 38 of the second power 30 b, respectively, so that the power supply and the second electrode, and the second electrode and the sealing layer 2 Make lb conductive. In this state, current is applied to each of the sealing layer 21a on the side wall 18 and the sealing layer 21b on the front substrate 11 to heat the sealing layer and melt the indium. Thereafter, as shown in FIG. 14B, the front substrate 11 and the rear substrate 12 are pressed in a direction approaching each other, whereby the sealing layers 21 a and 21 b are fused and sealed. The adhesion layer 21 is formed, and the peripheral portion of the front substrate 11 and the side wall 18 are sealed by the sealing layer.

In the third embodiment, the other configuration is the same as that of the above-described first embodiment, and the same portions are denoted by the same reference numerals and detailed description thereof will not be repeated. In the third embodiment, the same operation and effect as those of the first embodiment can be obtained. Further, according to the third embodiment, the current flowing through the sealing layer 21a on the rear substrate 12 side and the sealing layer 21b on the front substrate 11 side are individually , And more appropriate energization heating can be performed.

Next, an FED according to a fourth embodiment of the present invention will be described.

As shown in FIGS. 15 to 17, the FED includes a vacuum envelope 10 and a plurality of, for example, a pair of electrodes 30 attached to the vacuum envelope. The vacuum envelope 10 includes a front substrate 11 and a rear substrate 12 each made of a rectangular glass plate, and these substrates 11 and 12 are arranged at a peripheral portion through a rectangular frame-shaped side wall 18. Are joined together. A phosphor screen 16, a metal back 17, and a getter film 13 are formed on the inner surface of the front substrate 11. On the inner surface of the rear substrate 12, a number of electron-emitting devices 22 for exciting the phosphor layer of the phosphor screen 16 are provided. A large number of wirings 23 for supplying a potential to the electron-emitting devices 22 are provided in a matrix on the inner surface of the rear substrate 12, and the ends of the wirings 23 are provided at the ends of the vacuum envelope 10. It is drawn out to the periphery.

The pair of electrodes 30 is attached to the envelope 10 in a state of being electrically connected to the sealing layer 21. These electrodes 30 are used as electrodes when energizing the sealing layer 21. Each electrode 30 is formed by bending a copper plate having a thickness of, for example, 0.2 mm as a conductive member. That is, the electrode 30 is bent so as to have a substantially U-shaped cross-section, and is a clip-like mounting that can be attached to a peripheral portion of the front substrate 11 or the rear substrate 12. Portion 32, wedge-shaped body portion 34 located alongside the mounting portion, torso A contact portion 36 located at the extended end of the body portion and a flat conducting portion 38 formed by the mounting portion and the back portion of the body portion are integrally provided. The contact portion 36 has a horizontal extension L of 2 mm or more. Further, the body portion 34 is formed in a band shape, and extends obliquely upward and outward from the contact portion 36. As a result, the body portion 34 forms the outflow regulating portion 37 positioned higher than the contact portion 36 along the vertical direction.

Each electrode 30 is attached in a state of being elastically engaged with, for example, a back substrate 12 of the vacuum envelope 10. That is, the electrode 30 is attached to the vacuum envelope 10 in a state where the peripheral portion of the rear substrate 12 is elastically held by the attachment portion 32. The contact portion 36 of each electrode 30 is in contact with the sealing layer 21 and is electrically conductive. The body 34 extends from the contact portion 36 to the outside of the vacuum envelope 10, and the outflow regulating portion 37 is located vertically higher than the contact portion 36. are doing. The conduction portion 38 is exposed on the outer surface of the vacuum envelope 10 so as to face the side surface of the rear substrate 12. The pair of electrodes 30 are provided at two diagonally separated corners of the vacuum envelope 10, respectively, and are arranged symmetrically with respect to the sealing layer 21.

The other configuration of the FED is the same as that of the above-described first embodiment, and the same portions are denoted by the same reference characters and will not be described in detail.

Next, a method of manufacturing the above FED will be described in detail. This manufacturing method is almost the same as the manufacturing method according to the first embodiment, and different portions will be mainly described. First, a front substrate 11 on which a phosphor screen and a metal back 17 are formed, and a rear substrate 12 on which electron-emitting devices 22 are formed are prepared. Subsequently, the side wall 18 and the support member 14 are sealed on the inner surface of the rear substrate 12 with the low melting point glass 19 in the atmosphere. Thereafter, as shown in FIGS. 18A and 18B, indium is applied to a predetermined width and thickness over the entire periphery of the sealing surface of the side wall 18 to form a sealing layer 21a. To form A sealing layer 21b is formed by applying an image in a rectangular frame shape with a predetermined width and thickness to a sealing surface facing the side wall of the front substrate 11. The filling of the sealing layers 21a and 21 with respect to the side walls 18 and the sealing surface of the front substrate 11 may be performed by applying molten indium to the sealing surface as described above, or This is performed by a method of placing indium in a solid state on a sealing surface.

Subsequently, a pair of electrodes 30 is mounted on the back substrate 12 to which the side walls 18 are joined. At this time, the electrode is electrically connected to the sealing layer by bringing the contact portion 36 of each electrode 30 into contact with the sealing layer 2 la on the side wall 18. The pair of electrodes 30 is mounted on two diagonally opposite corners of the back substrate 12, and the length of the sealing layers 21 a and 21 b located between the electrodes is equal to the length of each electrode. Almost equal on both sides.

After the electrodes 30 are mounted, the rear substrate 12 and the front substrate 11 are arranged facing each other with a predetermined interval therebetween, and in this state, are put into the vacuum processing apparatus 100 shown in FIG. The front substrate 11 and the rear substrate 12 are baked through the loading chamber 101 and sent to the electron beam cleaning chamber 102. Baking, electron beam cleaning room 102, each The seed member is heated to a temperature of 300 ° C. to release gas adsorbed on the surface of each substrate. At the same time, an electron beam is irradiated from the electron beam generator onto the phosphor screen surface of the front substrate 11 and the electron-emitting device surface of the rear substrate 12 so that the phosphor screen surface and the electrons are emitted. The entire surface of the emission element surface is cleaned with an electron beam.

In the baking step, the sealing layers 21a and 21b are heated and melted. The sealing layer 21a on the rear substrate 12 side tends to flow out through the electrode 30. Since each electrode 30 is provided with an outflow restricting portion 37 positioned higher than the contact portion 36, the outflow restricting portion allows molten indium to flow outside the back substrate. Can be suppressed.

Next, the front substrate 11 and the rear substrate 12 are sent to a cooling chamber 103, cooled to a temperature of about 120 ° C., and then sent to a getter film deposition chamber 104, where the phosphor B _a film is deposited forming the outer layer. Subsequently, the front substrate 11 and the rear substrate 12 are sent to the assembly room 105, and as shown in FIG. 19, the hot plates 131, 1 in the assembly room are placed in a state of facing each other, as shown in FIG. 3 and 2 respectively. The front substrate 11 is fixed to the upper hot plate 13 1 with the fixing jig 13 3 so as not to drop.

Thereafter, the front substrate 11 and the rear substrate 12 are moved in a direction approaching each other while being maintained at about 120 ° C., and pressurized at a predetermined pressure. As a result, the contact portion 36 of each electrode 30 is sandwiched between the sealing layer 21b on the front substrate 11 side and the sealing layer 21a on the rear substrate 12 side, and each electrode 3 0 is electrically connected to the sealing layers 21a and 21b. At this time, the contact part 36 has a horizontal length of 2 mm or more. As a result, it is possible to stably contact the sealing layers 21a and 21b. By applying indium to the contact portion 36 of the electrode 30 in advance, it is possible to more stably supply electricity to the sealing material.

In this state, after the power supply 120 is electrically connected to the pair of electrodes 30, for example, each of the sealing layer 21 a on the side wall 18 side and the sealing layer 21 b on the front substrate 11 side is connected, for example. , 140 A DC current is applied in the constant current mode. As a result, the sealing layers 21a and 21b are heated to melt the indium. At this time, the connection terminal connected to the power supply 120 is brought into contact with the conducting portion 38 of the electrode 30 to make the power supply and the electrode, and the electrode and the sealing layer 21a, 21b. And can be reliably conducted. In addition, since each electrode 30 is in equivalent contact with the sealing layers 21a and 21b, it is possible to supply electricity stably, and almost the same amount of current flows through each sealing layer. And it can be melted evenly.

By melting the indium as described above, the sealing layer 21 a and 2 lb are fused to form a sealing layer 21, and the peripheral layer of the front substrate 11 is formed by the sealing layer. The part and the side wall 18 are sealed. The vacuum envelope 10 formed by the above process is cooled to room temperature in the cooling chamber 106 and is taken out from the unload chamber 107, whereby the vacuum envelope is removed. 10 is completed. After the vacuum envelope 10 is completed, the electrode 30 may be cut off if necessary. According to the FED configured as described above and the method of manufacturing the same, the first embodiment described above is used. The same operation and effect as described above can be obtained. Further, according to the fourth embodiment, a current is applied to the sealing material. Since the electrode 30 has an outflow restricting portion positioned higher than the contact portion, the electrode 30 restricts the molten sealing material from flowing out through the electrode in the baking step or the like. As a result, the sealing layer can be maintained at a uniform thickness, the envelope can be reliably sealed over the entire circumference, and wiring caused by leakage of the sealing material can be achieved. It is possible to prevent short shots. Therefore, it is possible to obtain an inexpensive FED that is excellent in mass productivity and that can obtain stable and good images at the same time.

In the above-described fourth embodiment, the body portion 34 of each electrode 30 is configured so that almost the entire body extends obliquely upward from the contact portion 36 to form the outflow regulation portion 37. As shown in FIG. 20, a part of the body part 34 may be extended vertically higher than the contact part 36 to form the outflow restriction part 37. . In addition, each electrode 30 was configured to have a mounting part integrally, but as shown in Figs. 21 and 22, the electrode 30 has a contact part 36, a lunar union part 34, and an outflow control. It may be configured to include the unit 37 and the base unit 39, and may be configured to be attached to the rear substrate 12 using a separate clip 46.

In the modified examples shown in FIGS. 20 to 22, other configurations are the same as those of the above-described fourth embodiment, and the same portions are denoted by the same reference numerals and detailed description thereof will be omitted. Is omitted. Further, even when the electrodes according to these modified examples are used, the same operation and effect as those of the above-described embodiment can be obtained.

Next, an FED according to a fifth embodiment of the present invention will be described. As shown in FIGS. 23 and 25, the FED includes a vacuum envelope 10 and a plurality of, for example, a pair of electrodes 30 attached to the vacuum envelope. The pair of electrodes 30 is attached to the envelope 10 in a state of being electrically connected to the sealing layer 21. Each electrode 30 is formed by bending a copper plate having a thickness of, for example, 0.2 mm as a conductive member. That is, the electrode 30 is bent so that the cross section becomes substantially U-shaped, and can be attached to the front substrate 11 or the rear substrate 12 by sandwiching the peripheral portion thereof. The mounting part 32, the wedge-shaped body part 34 positioned side by side with the mounting part, the contact part 36 positioned at the extension end of the body part, and extending from the contact part to the body part side along with the body part It has a drain portion 35 located therein and a flat conducting portion 38 formed by the mounting portion and the back portion of the body portion.

The contact portion 36 has a horizontal extension L of 2 mm or more. The body portion 34 is formed in a belt shape, and extends outward and diagonally upward from the contact portion 36. As a result, the body portion 34 forms the outflow regulating portion 37 located higher than the contact portion 36 along the vertical direction. The body portion 34 forms a flow path for flowing a current from the conducting portion 38 to the contact portion 36.

The drain portion 35 is formed in a band shape and extends obliquely downward and outward from the contact portion 36. As a result, the drain portion 35 is formed at a position lower than the contact portion 36 along the vertical direction. The width of the drain portion 35 is smaller than the width of the body portion 34, and is formed, for example, to about 1 mm. As will be described later, the drain portion 35 is used to discharge the molten sealing material to the outside. Forming a road.

Each electrode 30 is attached in a state of being elastically engaged with, for example, a back substrate 12 of the vacuum envelope 10. That is, the electrode 30 is attached to the vacuum envelope 10 while the peripheral portion of the rear substrate 12 is elastically held by the mounting portion 32. The contact portion 36 of each electrode 30 is in contact with the sealing layer 21 and is electrically connected to the sealing layer. The body 34 extends from the contact 36 to the outside of the vacuum envelope 10, and the outflow restricting portion 37 is located vertically higher than the contact 36. The drain portion 35 extends from the contact portion 36 to the outside of the vacuum envelope 10 and is located lower than the contact portion 36 in the vertical direction. The conduction portion 38 faces the side surface of the rear substrate 12 and is exposed on the outer surface of the vacuum envelope 10. The pair of electrodes 30 are provided at two diagonally separated corners of the vacuum envelope 10, respectively, and are arranged symmetrically with respect to the sealing layer 21.

The other configuration of the FED is the same as that of the above-described fourth embodiment, and the same portions are denoted by the same reference characters and will not be described in detail. The FED according to the fifth embodiment is manufactured by the same manufacturing method as the manufacturing method according to the fourth embodiment.

According to the fifth embodiment, in the baking step, the sealing layers 21a and 2lb are heated and melted. Then, the sealing layer 21a on the rear substrate 12 side tends to flow out through the electrode 30 to the outside. However, since each electrode 30 is provided with an outflow control portion 37 located higher than the contact portion 36, this outflow control is performed. The control section can prevent the molten indium from flowing out of the rear substrate. Also, a part of the molten indium flows outside the back substrate 12 from the drain portion 35 of the electrode 30, and the width of the drain portion is larger than the width of the body portion 34. Is small, so the amount of runoff is small. For example, if the amount of outflow of molten indium can be suppressed to about 1Z10 compared to the electrode without the outflow regulation part 37 and the drain part, In addition, there is a problem that the sealing layer becomes relatively thin so that it can easily leak from the sealing portion, and if the indium that has flowed out contacts the wiring on the substrate to generate a short-circuit. Such problems can be prevented.

Also, in the sealing step, the sealing layers 21 a and 21 b are fused to form a sealing layer 21, and the peripheral portion of the front substrate 11 and the side wall 18 are formed by the sealing layer. Seal. At this time, the front substrate 11 and the rear substrate 12 are pressed toward each other, so that the molten indium is crushed and excess indium is generated. This excess indium tries to flow out to the substrate side. Here, since each electrode 30 is provided with a drain portion 35 located lower than the contact portion 36, the excess molten alloy is actively drained. In other words, the drain portion 35 of the electrode 30 is formed to have a width smaller than that of the body portion 34, but because the indium is pressurized. All of the excess indium travels along the drain portion 35 of the electrode and is pushed down to the periphery of the substrate. Each electrode 30 is attached to the corner of the rear substrate 12, and the drain 35 is located at a position separated from the wiring 23. Has been extended to. Therefore, the indium flowing out of the drain portion 35 does not come into contact with the wiring 23, and it is possible to prevent a short-circuit of the wiring due to the outflow indium. In addition, by applying an indium to the drain portion 35 of the electrode 30 and a region in the vicinity thereof in advance, it is possible to more stably flow into the sealing material.

In addition, according to the FED and the method of manufacturing the same according to the fifth embodiment, the same functions and effects as those of the above-described first embodiment can be obtained.

In the fifth embodiment, the body portion 34 of each electrode 30 is configured so that almost the whole extends obliquely upward from the contact portion to form the outflow regulating portion 37. For example, FIG. As shown in FIG. 6, a part of the body part 34 may be extended to a position higher in the vertical direction than the contact part 36 to form the outflow regulating part 37.

Further, in the fifth embodiment, each electrode 30 has a configuration in which the mounting portion is integrally provided. However, as shown in FIGS. 27 and 28, the contact portion 36, the body portion 34, the outflow It is configured to include a regulating part 37, a drain part 35 and a base part 39, and is attached to the rear substrate 12 by using a separate tap 46 having a conducting part 38. May be.

The drain portion 35 of the electrode 30 is not limited to the configuration provided side by side with the body portion 34, and may be provided at the center of the body portion 34 as shown in FIG. 27. good. In this case, the drain portion 35 is formed by cutting and raising a part of the body portion 34, and the body portion allows the sealing material to flow from the contact portion 36 to the drain portion 35. Opening 4 2 Is formed.

As shown in FIG. 29, the number of the drain portions 35 of the electrodes 30 is not limited to one, and a pair of drain portions 35 may be provided on both sides of the body portion 34. In this case, the configuration of each drain unit 35 is the same as that of the above-described embodiment.

In the modification shown in FIG. 26 or FIG. 29, the other configuration is the same as that of the above-described fifth embodiment, and the same portions are denoted by the same reference numerals and detailed description thereof will be omitted. Omitted. Also, even when the electrodes according to these modified examples are used, the same operation and effect as those of the above-described embodiment can be obtained. It is also possible to use a configuration in which the above-described embodiment and the modified examples shown in FIGS. 26 to 29 are combined with each other.

Next, an FED according to a sixth embodiment of the present invention and a method for manufacturing the same will be described. As shown in FIG. 30, the FED includes a flat rectangular vacuum envelope 10 and a plurality of, for example, a pair of electrodes 30 attached to the envelope. In the sixth embodiment, the configuration of the FED is the same as that of the above-described embodiment except for the electrode 30. Therefore, the description will focus on different configurations. At the same time, the structure of the FED will be described together with the manufacturing method.

As shown in Figure 13A and Figure 13B, the phosphor screen

A front substrate 11 on which a metal pack 16 and a metal pack 17 are formed, and a rear substrate 12 on which an electron-emitting device is formed are prepared. Subsequently, the side wall 18 and the supporting member 14 are sealed on the inner surface of the rear substrate 12 with low melting glass in the air. Then sidewall 1

(8) Apply the specified width and thickness over the entire circumference of the sealing surface To form a rectangular frame-shaped sealing layer 21a. An image is applied to the sealing surface facing the side wall of the front substrate 11 in a predetermined width and thickness in a rectangular frame shape, and the rectangular frame-shaped sealing corresponding to the sealing layer 21a on the rear substrate 11 side. The deposition layer 21b is formed. The filling of the sealing layer 21a and 2lb with respect to the side wall 18 and the sealing surface of the front substrate 11 is performed by applying molten indium to the sealing surface as described above, or This is performed by a method of placing indium in a solid state on a sealing surface.

Subsequently, the front substrate 11 and the rear substrate 12 are sent into, for example, a vacuum processing apparatus shown in FIG. 9 and sealed in a vacuum atmosphere. In this case, the front substrate 11 and the rear substrate 12 are heated and sufficiently degassed. The heating temperature is appropriately set to about 200 ° C to 500 ° C. By the degassing process, gas released from the inner wall of the envelope component member is reduced, and the degree of vacuum in the vacuum envelope is prevented from deteriorating. Next, a getter film is formed on the phosphor screen 16 of the front substrate 11. This is because the residual gas after forming the vacuum envelope is adsorbed and evacuated by the getter film, and the degree of vacuum in the vacuum envelope is maintained at a favorable level.

Subsequently, the front substrate 11 and the rear substrate 12 are overlapped with each other at a predetermined position such that the phosphor screen 16 and the electron-emitting device face each other. In this state, electricity is passed to the sealing layers 21a and 2lb, and these sealing materials are heated and dissolved. Thereafter, the current is stopped, and the heat of the sealing layers 21a and 21b is quickly diffused and conducted to the front substrate 11 and the side wall 18 to solidify the sealing layers 21a and 21b. As a result, the front substrate 1 1 and the side wall 18 are bonded to the sealing layer 2 1 They are sealed to each other by a, 21b.

Next, the above-mentioned sealing step will be described in more detail. As shown in FIGS. 31 and 32, in the state before sealing, the temperature of the front substrate 11 and the rear substrate 12 is lower than the melting points of the sealing layers 21 a and 21 b. The sealing layers 21a and 21b are solidified. In this state, the front substrate 11 and the rear substrate 12 are overlapped at a predetermined position, and the sealing layers 21a and 21b are overlapped with each other. Further, a predetermined load is applied to the front substrate 11 and the rear substrate 12 by the pressurizing devices 23a and 23b in a direction approaching each other. The image display area is held in a predetermined gap by the support member 14.

At this time, the plate-like electrode 30 is disposed between the sealing layers 21 a and 21 b at two corners of the side wall 18 opposed to each other in the diagonal direction. As shown in FIG. 31B, the electrode 30 has two contact portions 36a and 36b, each of which is in electrical contact with the sealing layer, and is formed in a substantially Y-shape. ing. The contact portions 36a and 36b of each electrode 30 are in contact with these sealing layers on both sides of the corners of the sealing layers 21a and 2lb. A gap 30c is formed between the two contact portions 36a and 36b to allow the molten sealing material to flow out. As a method of sandwiching the electrode 30, a method of fixing it with a clip of the same material as the electrode can be used. The electrode 30 is formed of a single element or an alloy containing at least one of Cu, Al, Fe, Ni, Co, Be, and Cr.

Next, connect the power supply terminals 24a and 24b to the electrode 30 respectively. Touch. These power supply terminals 24 a and 24 b are connected to a power supply 120. In this state, when a predetermined current is passed through the power supply terminals 24 a and 24 b and the electrode 30 to the sealing layer 21 a _{s 21} b, the sealing layer 21 a Only 2 lb heats and melts. At this time, the excess sealing material that has melted is applied to the two contact portions of each electrode 30.

Through the gap 30c surrounded by 36a, 36b and the sealing layer, the water flows out of the side wall 18 from the corner of the side wall 18.

Then, when the power supply was stopped and the power supply terminals 24a and 24b were removed, the heat of the sealing layers 21a and 21b having a small heat capacity was transferred to the front substrate 11 and side wall 18 due to the temperature gradient. Heat is dissipated. Sealing layer 2 1 a

21b reaches thermal equilibrium with the front substrate 11 and the side wall 18 having a large heat capacity, and is rapidly cooled and solidified. As a result, the front substrate 11 and the side wall 18 are sealed to each other by the sealing layers 21a and 21b, and the inside has a vacuum envelope 10 maintained at a high vacuum. FED is obtained. After the sealing, the electrode 30 is made of a sealing material layer.

It is fixed to the vacuum envelope 10 in a sealed state together with 21a and 2lb.

According to the FED and the method of manufacturing the FED according to the sixth embodiment configured as described above, the vacuum envelope can be vacuum-sealed by an extremely short and simple manufacturing apparatus. It can be. In other words, by using a sealing material having conductivity, it is possible to selectively heat only the sealing material having a small heat capacity, that is, a small volume, without heating the substrate. Therefore, it is possible to suppress the deterioration of the positioning accuracy due to the thermal expansion of the substrate.

Because the heat capacity of the sealing layer is very small compared to the heat capacity of the substrate Compared to the conventional method of heating the entire substrate, the time required for heating and cooling can be significantly reduced, and mass productivity can be greatly improved. Furthermore, the only device required for sealing is a mere power supply terminal and a mechanism for bringing the terminal into contact with the power supply terminal, so that a very simple and clean device suitable for ultra-high vacuum can be realized.

Each electrode 30 for supplying electricity to the sealing layers 21a and 21b has a plurality of contact portions 36a and 36b, and a gap 30c is formed between these contact portions. Is formed. Therefore, at the time of sealing, it is possible to positively flow the excess molten sealing material to the outside from the gap 30 c defined between the contact portions 36 a and 36 b. You. Therefore, by providing the contact portion of the electrode 30 at an appropriate position, it is possible to prevent the sealing material from protruding onto the wiring of the substrate and the like, without causing a short-circuit between the wirings. Quick and stable sealing is possible.

The electrode 30 need only have a gap through which the sealing material passes between the contact portions, and is not limited to the above-described Y-shaped shape. For example, as shown in FIG. It may be shaped. The electrode 30 may have three or more contact portions in contact with the sealing material. For example, as shown in FIG. 34A, the electrode 30 may be formed in a shape having four contact portions 36a, 36b32a32b. In this case, a gap 30 c through which the sealing material passes is formed between the adjacent contact portions.

In addition, the contact portion of the electrode 30 is not limited to the two sides sandwiching the corner of the vacuum envelope, and as shown in FIG. 34B, the sealing layer 21 is formed on one side of the corner of the envelope. You may touch a and 21b. Is electrode 30 corner? The sealing material may flow out from the corner of the envelope 30 d force because it is located slightly off. In the modified examples shown in FIG. 33, FIG. 34a and FIG. 34B, other configurations are the same as those of the above-described embodiment, and the same portions are denoted by the same reference numerals. Detailed description is omitted. Also in these modified examples, the same operation and effect as in the sixth embodiment can be obtained.

In the above-described sixth embodiment, the electrode 30 is configured to directly contact the sealing layers 2 la and 2 lb. However, according to the manufacturing method according to the seventh embodiment shown in FIG. The electrode 30 may be covered with the conductive material layer 31, and the electrode may be brought into contact with the sealing layer via the conductive material layer 31.

That is, in the sealing step, a pair of plate-shaped electrodes 30 is sandwiched between the sealing layers 21a and 21b, respectively. In each electrode 30, the surface that comes into contact with sealing layers 21 a and 21 b is previously covered with conductive material layer 31. Here, both surfaces of each electrode 30 are coated with, for example, In or an alloy containing In which is the same conductive material as sealing layers 21a and 21b. The conductive material layer 31 is formed, for example, by applying a conductive material to the electrode surface with a soldering iron to which ultrasonic waves have been applied. Thereby, each electrode 30 is in contact with sealing layers 21 a and 21 b via conductive material layer 31. The electrode 30 is formed of a single element or an alloy including at least any one of Cu, Al, Fe, Ni, Co, Be, and Cr.

Next, connect the power supply terminals 24a and 24b to the electrode 30 respectively. Touch. These power supply terminals 24 a and 24 b are connected to a power supply 120. In this state, when a predetermined current is applied to the sealing layers 21a and 21b through the power supply terminals 24a and 24b and the electrode 30, only the sealing material generates heat. Dissolve. Then, when the power supply is stopped and the power supply terminals 24a and 24b are removed, the heat of the sealing layers 21a and 21b having a small heat capacity is transferred to the front substrate 11 and the side wall 18 by the temperature gradient. Heat is dissipated. Therefore, the sealing layers 21a and 21b reach thermal equilibrium with the front substrate 11 and the side wall 18 having a large heat capacity, and are rapidly cooled and solidified. As a result, the front substrate 11 and the side wall 18 are sealed to each other by the sealing layers 21a and 21b, and the FED having the vacuum envelope 10 whose inside is maintained at a high vacuum is provided. can get. After sealing, the electrode 30 is fixed to the vacuum envelope 10 while being sealed together with the sealing layers 21a and 21b.In the seventh embodiment, the other components are described above. The sixth embodiment is the same as the sixth embodiment described above, and the same portions are denoted by the same reference characters and will not be described in detail. Detailed description is omitted. In the seventh embodiment configured as described above, the same operation and effect as those of the sixth embodiment can be obtained. The electrode 30 for supplying electricity to the sealing layers 21 a and 21 b has a surface in contact with the sealing layer covered with a conductive material layer 31. Therefore, when the sealing layers 21a and 21b are energized and melted, the wettability between the electrode 30 and the sealing material is improved, and the increase in contact resistance between the sealing material and the electrode is prevented. Can be done. This prevents abnormal heat generation at the contact portion and eliminates the possibility that the sealing layers 21a and 21b are disconnected. As a result, in a short time and It is possible to manufacture FEDs with high yield.

In addition, by covering the surface of the electrode 30 with the conductive material layer 31, the molten sealing material that has become excessive at the time of sealing can be actively removed from the electrode to the outside of the envelope. It can be discharged to

In the above-described seventh embodiment, the configuration is such that the electrode 30 is sandwiched between the sealing layers 21a and 21b.However, the configuration is such that current is supplied while the electrode is in contact with only one sealing material. You may. That is, as shown in FIG. 36, the front substrate 11 and the rear substrate 12 are overlapped at a predetermined position, and the sealing layers 21 a and 21 b are overlapped and brought into contact with each other. Pressing devices 23a and 23b apply a predetermined sealing load to front substrate 11 and rear substrate 12 in directions approaching each other. Then, the electrodes 30 are arranged so as to be in contact with the sealing material 21b.

The electrode can be held in such a way that the electrode is fixed with a clip of the same material as the sealing layer so that it contacts the sealing layer 21a, 2lb of the front substrate 11 in advance, or a power supply terminal A method may be used in which the electrodes are fixedly held on the 24a and 24b with a clip or the like, and the electrodes are sandwiched when the front substrate 11 and the rear substrate 12 are overlapped at a predetermined position.

In this case, the surface of each electrode 30 that comes into contact with the sealing layer 21 b is covered with the conductive material layer 31 in advance. The conductive material layer 31 is formed, for example, by applying a conductive material to the electrode surface with a soldering iron to which an ultrasonic wave is applied. Note that a conductive material layer may also be formed on a surface of the electrode that is not in contact with the sealing material, in order to allow excess sealing material to protrude from the electrode 30 during sealing. The other configuration is the same as that of the seventh embodiment, and the same portions are denoted by the same reference characters and will not be described in detail. Also, in the above configuration, it is possible to obtain the same functions and effects as in the above-described seventh embodiment.

Regarding the form of the current flowing through the sealing material, not only a direct current but also an alternating current that fluctuates at a commercial frequency may be used. In this case, the trouble of converting the commercial current transmitted by the alternating current into the direct current can be omitted, and the device can be simplified. Further, an alternating current fluctuating at a high frequency of the kHz level may be used. In this case, the same heating effect as described above can be obtained with a smaller current value because the Joule heat increases by an amount corresponding to an increase in the effective resistance value to a high frequency due to the skin effect.

Further, the power to be energized and the time are set to about 5 to 300 seconds in the above embodiment. If the energization time is long (low power), the cooling rate decreases due to a rise in the temperature around the substrate and adverse effects occur due to thermal expansion. If the energization time is short (high power), the conductive sealing material is used. Disconnection due to non-uniform filling of glass and cracking due to glass thermal stress occur. Therefore, it is desirable to set the optimal power and time (including temporal power change) for each object.

Furthermore, the temperature difference between the substrate temperature at the time of sealing and the melting point of the sealing material is about 20 ° C. to 150 ° C. in the above embodiment. If the temperature difference is large, the cooling time can be shortened, but the thermal stress of the glass increases. Therefore, it is desirable to set optimum conditions for each object. Next, a method of manufacturing an FED according to the eighth embodiment of the present invention will be described. In the eighth embodiment, the configuration of the FED and the configuration other than the sealing step in the manufacturing method are the same as those of the above-described sixth embodiment, and different portions will be mainly described.

As shown in Fig. 37, in the sealing process, the front substrate 11 and the rear substrate 12 sent to the assembly chamber of the vacuum processing apparatus are hot plates 131, 132 while facing each other. The outer surfaces are kept in close contact with each other. That is, the rear substrate 12 is placed on the hot plate 13 2, and the front substrate 11 is fixed to the upper hot plate 13 1 by the fixing jig 13 3 so as not to drop. .

Subsequently, as shown in FIG. 38 and FIG. 39, for example, a pair of plate-like electrodes 30 made of copper and having a thickness of about 0.2 mm is prepared, and these electrodes 30 are attached to the front substrate. Insert between 1 1 and rear substrate 1 2. At this time, the pair of electrodes 30 are provided at opposing positions, and the tip of each electrode is placed between the sealing layer 21b on the front substrate 11 side and the sealing layer 21a on the rear substrate 12 side. Insert to be located. For example, the pair of electrodes 30 is disposed on two diagonally opposite corners, two short sides, or two long sides of the substrate.

Next, the upper hot plate 13 1 and the front substrate 11 were lowered, and almost the entire sealing layer 21 b provided on the front substrate 11 was provided on the side wall 18 on the rear substrate side. Contact with sealing layer 21a. At the same time, the front board 1 1 and the rear board 1 2 On the other hand, here, both substrates are pressed with a desired pressure in a direction approaching each other. At that time, each electrode 30 is sandwiched between the upper and lower sealing layers 21a and 2lb. Thus, each electrode 30 electrically contacts the upper and lower indiums 21 at the same time.

In this state, a DC current of 14 O A is supplied from the power supply to the sealing layers 21 a and 21 b through the pair of electrodes 30 in the constant current mode. As a result, the indium on which the sealing layer is formed is heated and melted, and the front substrate 11 and the side wall 18 are hermetically joined by the sealing layers 21a and 21b. ·

Thereafter, by stopping the energization, the molten indium is solidified, and the envelope 10 is formed. The envelope formed in this way is cooled to room temperature in the cooling chamber 106 and taken out from the inlet chamber 107. Through the above steps, a vacuum envelope is completed.

According to the eighth embodiment, as in the previous embodiment, the front substrate 11 and the rear substrate 12 are sealed and joined in a vacuum atmosphere, so that baking and electron beam cleaning are used together. As a result, the surface adsorbed gas can be sufficiently released, and a getter film having an excellent adsorption ability can be obtained. In addition, by heating and heating the indium, the entire surface of the front substrate and the rear substrate are not required to be heated and sealed, so that the getter film is deteriorated and the substrate is broken during the sealing process. Troubles can be eliminated. At the same time, the sealing time can be shortened, and a manufacturing method with excellent mass productivity can be achieved.

In addition, the front substrate 11 and the rear substrate 1 2 At least one of them is pressed so that the front substrate and the rear substrate come close to each other, and at least a part of the sealing layer 21 a, 2 lb is applied between the front substrate and the periphery of the rear substrate. In the sandwiched state, the sealing layer is energized and heated and melted. As a result, the sealing layer after the fusion is sandwiched between the front substrate 11 and the side wall 18, so that the sealing layers 21 a and 21 b along the periphery of the substrate are formed. Excessive cohesion due to the limited space between the front substrate 11 and the side walls 18 even if local irregularities occur in the molten image due to variations in cross-sectional area, gravity, etc. Attempted melting is pushed back to the sparse part. As a result, the occurrence of irregularities in the sealing layer can be suppressed. Therefore, the cross-sectional area of the sealing layer after melting is uniform over the entire circumference of the front substrate 11 and the side wall 18, and during bonding, the sealing layer can be heated evenly over the entire assembly. it can. From this, it is possible to prevent disconnection due to local heating of the sealing layer, cracks in the substrate, etc., and to perform stable bonding. Further, it is possible to provide an FED which can be manufactured at low cost, has high reliability, and can obtain good images.

According to the above-described manufacturing method, each electrode 30 is simultaneously electrically contacted with both the sealing layer 21b on the front substrate 11 side and the sealing layer 21a on the side wall side. Electric current can be supplied in a state in which the sealing layer is in equivalent contact with the sealing layer. As a result, almost the same amount of current can flow through each sealing layer. As a result, the sealing layers provided on the front substrate 11 and the rear substrate 12 can be uniformly heated and melted, and stable bonding can be performed. Next, a method of manufacturing an FED according to a ninth embodiment of the present invention will be described.

In the above-described eighth embodiment, the electrode 30 is sandwiched between the upper and lower sealing layers 21a and 21b, and is brought into electrical contact with both sealing layers at the same time. According to the ninth embodiment, the sealing layers 21a and 21b are partially welded to each other in advance at a portion where the electrode 30 is brought into contact, and the electrode 30 is brought into contact with the welded portion. I have.

More specifically, the front substrate 11 and the rear substrate 12 sent to the assembly chamber 105 of the vacuum processing apparatus are held by a plurality of support pins 128 as shown in FIG. Are pressed in the direction of approaching each other. Thereby, the sealing layer 21 b provided on the front substrate 11 and the sealing layer 21 a provided on the side wall 18 come into contact with each other. In a portion where the electrode 30 is in contact, for example, the sealing layer 21 b provided on the front substrate 11 has an extension 21 c that extends outward from other portions. are doing. For example, the extending portions 21 c are provided near two opposing corners of the front substrate 11, respectively.

Subsequently, at a position corresponding to the extension 21c, for example, an induction heating coil 127 is arranged to face the corner of the rear substrate 12 below the corner thereof, and the sealing layer is formed by the induction heating coil 127. 21a and 21b are locally heated with high frequency, and the sealing layers are partially welded to each other. Thereby, the welded portions 21 d are formed at the two corners opposing each other in the diagonal direction.

Thereafter, an electrode 30 made of copper having a thickness of about 0.2 mm is inserted between the front substrate 11 and the rear substrate 12, and is attached to each of the welded portions 21 d. To the extension 2 1 c. In this state, power is supplied to the sealing layers 21a and 2lb from a power source through a pair of electrodes 30. As a result, the indium is heated and melted, and the front substrate 11 and the side walls 18 are hermetically bonded by the sealing layers 21a and 21b. As a result, the molten indium is solidified, and the envelope 10 is formed. The envelope formed in this way is cooled to room temperature in the cooling chamber and taken out of the unloading chamber. Through the above steps, a vacuum envelope is completed.

The other configuration is the same as that of the above-described embodiment, and the same portions are denoted by the same reference numerals and detailed description thereof will be omitted. The ninth embodiment configured as described above According to this, at the position where the electrode 30 is brought into contact, the opposing indiums are welded before energization, so that the sealing layer 21 b on the front substrate 11 side and the side wall 18 side are welded. Almost the same amount of current can be shunted and flown to the sealing layer 21a. This makes it possible to heat and melt both sealing layers 2 la 21 b uniformly. Further, since the sealing layer is energized while the front substrate 11 and the rear substrate 12 are pressed in a direction approaching each other, the sealing layer after melting is cut off in the same manner as in the eighth embodiment. The change in area can be suppressed, and the entire sealing layer can be uniformly heated and heated. From the above, it is possible to stably join the front substrate 11 and the rear substrate 12 to obtain a FED with improved reliability.

In the eighth and ninth embodiments, for example, the electrodes may be put into a vacuum processing apparatus in a state where the electrodes are attached to a substrate in advance, The shapes and materials of the poles are not limited to those in the above embodiment. In addition, the sealing is performed with the sealing material provided on both the front substrate and the side wall. However, the sealing may be performed with the sealing material provided on at least one of the front substrate and the side wall. .

Next, an FED according to a tenth embodiment of the present invention and a method for manufacturing the same will be described.

As shown in FIGS. 42 and 43, the FED includes a vacuum envelope 10 and a plurality of, for example, a pair of electrodes 30 attached to the vacuum envelope. The vacuum envelope 10 includes a front substrate 11 and a rear substrate 12 each made of a rectangular glass plate, and these substrates 11 and 12 are arranged at a peripheral portion through a rectangular frame-shaped side wall 18. Are joined together. On the inner surface of the front substrate 11, a phosphor screen 16, a metal knock 17, and a getter film 13 are formed. On the inner surface of the rear substrate 12, a number of electron-emitting devices 22 for exciting the phosphor layer of the phosphor screen 16 are provided. A large number of wirings 23 for supplying a potential to the electron-emitting devices 22 are provided in a matrix on the inner surface of the rear substrate 12, and the ends of the wirings 23 are provided at the ends of the vacuum envelope 10. It is drawn out to the periphery.

The pair of electrodes 30 is attached to the envelope 10 in a state of being electrically connected to the sealing layer 21. These electrodes 30 are used as electrodes when energizing the sealing layer 21. As shown in FIG. 44, each electrode 30 is formed by bending a copper plate having a thickness of, for example, 0.2 mm as a conductive member. That is, the electrode 30 is bent so that its cross section is substantially U-shaped, and Attachment part 32, body part 34 extending from the attachment part and serving as a current path to the sealing layer, contact part 36 located at the extended end of the body part and capable of contacting the sealing layer, and attachment part And a flat conducting portion 38 formed by the back of the body.

The mounting portion 32 is integrally provided with a holding portion bent in a clip shape, and can be attached while holding the peripheral portion of the front substrate 11 or the rear substrate 12. The contact portion 36 has a horizontal extension L of 2 mm or more. Further, the body portion 34 is formed in a belt shape, and extends obliquely upward from the mounting portion 32. As a result, the contact portion 36 is located higher than the mounting portion 32 and the body portion 34 in the vertical direction.

As shown in FIG. 42 and FIGS. 43 and 44, each electrode 30 is elastically attached to the peripheral portion of the rear substrate 12 by, for example, the mounting portion 32 of the vacuum envelope 10. It is attached to the vacuum envelope 10 while being clamped. The contact portion 36 of each electrode 30 is in contact with the sealing layer 21 and is electrically connected. The body portion 34 extends from the contact portion 36 to the outside of the vacuum envelope 10, and the conduction portion 38 faces the side surface of the rear substrate 12 and faces the vacuum envelope 1. Exposed on the outer surface of 0. The pair of electrodes 30 are provided at two diagonally separated corners of the vacuum envelope 10, respectively, and are arranged symmetrically with respect to the sealing layer 21.

The other configuration of the FED is the same as that of the above-described first embodiment, and the same portions are denoted by the same reference characters and will not be described in detail. Next, a method of manufacturing the FED according to the tenth embodiment will be described in detail. Here, the description will focus on the parts that are different from the manufacturing method according to the first embodiment.

First, similarly to the first embodiment, a front substrate 11 on which a phosphor screen 16 and a metal back 17 are formed, and a rear substrate 12 on which an electron-emitting device 22 is formed Prepare Subsequently, the side wall 18 and the support member 14 are sealed on the inner surface of the rear substrate 12 with the low melting point glass 19 in the atmosphere. Thereafter, indium is applied to a predetermined width and thickness over the entire periphery of the sealing surface of the side wall 18 to form a sealing layer 21a. An image is applied to the sealing surface facing the side wall of the front substrate 11 in a rectangular frame shape with a predetermined width and thickness to form a sealing layer 2 lb.

Subsequently, as shown in FIG. 45, a pair of electrodes 30 is mounted on the back substrate 12 to which the side walls 18 are joined. At this time, each electrode 30 is mounted such that the contact portion 36 does not contact the sealing layer 21a and faces the sealing layer 21 with a gap. The electrode 30 requires a pair of a positive electrode and a single electrode on the substrate, and each energizing path of the sealing layers 21a and 21b, which are energized in parallel between the pair of electrodes, has its length It is desirable to make them equal. Therefore, a pair of electrodes 30 is mounted on two diagonally opposite corners of the rear substrate 12, and the length of the sealing layers 21 a and 21 b located between the electrodes is It is set almost equally on both sides of.

After the electrodes 30 are mounted, the rear substrate 12 and the front substrate 11 are arranged facing each other with a predetermined interval therebetween, and in this state, they are put into the vacuum processing apparatus 100 shown in FIG. Front board 1 1 and rear board 1 2 is sent to the electron beam cleaning chamber 102 through the loading chamber 101 for baking. In the baking and electron beam cleaning chamber 102, the various members are heated to a temperature of 300 ° C. to release the gas adsorbed on the surface of each substrate. At the same time, an electron beam is irradiated from the electron beam generator onto the phosphor screen surface of the front substrate 11 and the electron emission element surface of the rear substrate 12 so that the phosphor screen surface and the electrons are emitted. The entire surface of the emission element surface is cleaned with an electron beam.

In the baking step, the sealing layers 21a and 21b are once melted by heating to have fluidity, but the contact portions 36 of the electrodes 30 are connected to the sealing layers 21a and 21b. They face each other with a gap without contact. Therefore, it is possible to suppress the molten indium from flowing out of the rear substrate 12 through the electrode 30.

The front substrate 11 and the back substrate 12 that have been baked and cleaned with an electron beam are sent to the cooling chamber 103, cooled to a temperature of about 120 ° C, and then to the getter film deposition chamber 104. Is sent. In the deposition chamber 104, a Ba film is formed as a getter film 27 outside the metal back 17 by vapor deposition. The Ba film can prevent the surface from being contaminated with oxygen, carbon, and the like, and can maintain an active state.

Subsequently, the front substrate 11 and the rear substrate 12 are sent to the assembly room 105. As shown in Fig. 46, in this assembly room 105, the front substrate 11 and the rear substrate 12 are placed on the hot plates 131, 132 in the assembly room in a state where they are opposed to each other. Each is retained. Fixing jig 1 3 so that the front substrate 1 1 does not fall Fix to the upper hot plate 1 3 1 with 3.

Thereafter, the front substrate 11 and the rear substrate 12 are moved in a direction approaching each other while being maintained at about 120 ° C., and pressurized at a predetermined pressure. The substrate may be moved by moving both the front substrate 11 and the rear substrate 12 so as to approach each other, or by moving one of the front substrate and the rear substrate so as to approach each other.

As shown in FIG. 47, by applying a predetermined pressure, the sealing layer 21b on the front substrate 11 and the sealing layer 21a on the rear substrate 12 are brought into contact with each other. At the same time, the contact portion 36 of each electrode 30 is sandwiched between the sealing layers 21a and 21b, and each electrode 30 is electrically connected to the sealing layers 21a and 2lb. Connecting. At this time, since the contact portion 36 is formed with a horizontal length of 2 mm or more, the contact portion 36 can stably contact the sealing layers 21a and 21b. By applying indium to the contact portion 36 of the electrode 30 in advance, it is possible to obtain a better contact and energization state with respect to the sealing layer.

In this state, as shown in FIG. 10, after the power supply 120 is electrically connected to the pair of electrodes 30, the sealing layer 21 a on the side wall 18 side and the front substrate 11 side are connected. For example, a direct current of 14 OA is applied to each of the sealing layers 21b in the constant current mode. This heats the sealing layers 21a and 2lb to melt the indium. At this time, by bringing the connection terminal 40 connected to the power supply 120 into contact with the conducting portion 38 of the electrode 30, the power supply and the electrode, and the electrode and the sealing layer 21 a, 2 1 b and can be reliably conducted. You. In addition, since each electrode 30 is in equivalent contact with the sealing layers 21a and 21b, it is possible to supply electricity stably, and to have approximately the same amount in each of the sealing layers. Electric current can be applied to heat and melt evenly.

By fusing indium, the sealing layers 21 a and 21 b are fused to form a sealing layer 21, and the peripheral layer and the side wall 1 of the front substrate 11 are formed by the sealing layer. 8 Seal and. The front substrate 11, side wall 18, and rear substrate 12 sealed by the above process are cooled to room temperature in the cooling chamber 106, and are taken out from the unload chamber 107. As a result, the vacuum envelope 10 of the FED is

7 "!

After the vacuum envelope 10 is completed, the pair of electrodes 30 may be cut off if necessary.

According to the FED configured as described above and the method of manufacturing the same, a stable current can be applied to the sealing layer 21 via the electrode 30 mounted on the rear substrate during the heating by energization. Accordingly, at the time of sealing, the conductive low-melting-point sealing material constituting the sealing layer can be stably and reliably melted for a predetermined energizing time, and as a result, the sealing layer 21 Quick and reliable sealing can be performed without cracks.

By using both baking and electron beam cleaning, the surface adsorbed gas can be sufficiently released, and a getter film with excellent adsorption ability can be obtained. Also, by sealing and joining the indium by energizing and heating the indium, it is not necessary to heat the entire front substrate and the rear substrate, while maintaining the entire substrate at a low temperature. The sealing operation can be performed quickly and stably. At the same time, it is possible to eliminate problems such as deterioration of the getter film and cracking of the substrate during the sealing process.

In the state before the sealing, the contact portion of the electrode faces the sealing layer with a gap without contacting the sealing layer. Therefore, even if the sealing material is melted in the baking step or the like, it is possible to prevent the melted sealing material from flowing out through the electrode. Accordingly, the sealing layer can be maintained at a uniform thickness over the entire circumference, and it is possible to prevent a short-circuit of the wiring due to the outflow of the sealing material. From the above, it is possible to inexpensively obtain an FED that is excellent in mass productivity and that can obtain a stable and good image.

In the tenth embodiment described above, the contact portion 36 and the body portion 34 of each electrode 30 are formed in a band shape having the same width. As shown in FIG. 48, the body portion 34 may be formed to have a width smaller than the width of the contact portion 36. Here, the body portion 34 is formed in a band shape having a uniform width over the entire length. Further, as shown in FIG. 49, the body portion 34 has a portion connected to the contact portion 36 formed to have a width smaller than the width of the contact portion. It may be formed so that the width gradually increases toward 2.

As described above, the electrode 30 is used in which the width of the body portion 34, particularly the width of the body portion at least in a portion connected to the contact portion 36 is smaller than the width of the contact portion. As a result, during energization heating, the heat generated in the body part 34 is quickly transmitted to the sealing layer via the contact part 36. Can be obtained. Therefore, it is possible to more stably supply current to the sealing layer, and the temperature of the entire sealing layer is almost uniformly increased, so that bonding can be performed quickly and reliably.

In this case, the width of the body portion 34 is narrowed, but the body portion may be controlled by making a cutout in the hole, or may be controlled by reducing the thickness of the body portion. Further, the material may be changed in the body part and other parts, and the heat generation may be controlled by overlapping the plate materials.

In the above-described tenth embodiment, the mounting portion of each electrode 30 is configured to integrally include a clip-like holding portion. However, as shown in FIGS. It may be configured to include a separate clip 46 that functions as a unit. That is, the electrode 30 has a contact portion 36, a body portion 34, and a flat base portion 39, which are integrally formed by bending a plate material. The mounting portion for the electrode 30 is composed of a base portion 39 and a separate clip 46. The electrode 30 is formed by clamping the base 39 and the periphery of the substrate, here, the periphery of the rear substrate 12, with the clip 46, whereby the rear substrate 1 Attached to 2.

In the modification shown in FIG. 48 or FIG. 51, other configurations are the same as those of the above-described embodiment, and the same portions are denoted by the same reference numerals and detailed description thereof will be omitted. . Also, in these embodiments, the same operation and effect as those of the above-described embodiment can be obtained.

In the tenth embodiment, a pair of electrodes are attached to opposite diagonal portions of the rear substrate, and current is applied to the sealing layer while the substrates are pressed against each other. However, the present invention is not limited to this, and a pair of electrodes may also be attached to the front substrate side, and the sealing layer may be separately energized and heated and melted separately from the rear substrate side.

In this case, as shown in FIG. 52, the front substrate 11 and the rear substrate 12 sent to the assembly room are fixed on the hot plates 131, 132, and are opposed to each other. They are moved toward each other. The contact portion of the electrode 30 attached to the rear substrate 12 electrically contacts the sealing layer 21b on the front substrate 11 side, and the contact portion of the electrode 30 attached to the front substrate 11 The contact portion makes electrical contact with the sealing layer 21a on the rear substrate 12 side. At this time, the sealing layer 21b on the front substrate 11 side and the sealing layer 21a on the rear substrate 12 side are held in a state where they do not contact each other.

By applying a current to the sealing layers 21a and 21b through the electrodes 30 in this state, the sealing layers 21a and 21b are separately melted. I do. After the melting, the energization is stopped, the two substrates 1 1 1 2 are moved further in the direction of approaching each other, and the pressure is applied, whereby the sealing layers 21 a and 21 b are fused to form a sealing layer. 21 is formed, and the peripheral portion of the front substrate 11 and the side wall 18 are sealed by the sealing layer 21.

Attach two pairs of electrodes to one of the substrates, apply electricity to the sealing layer 2 1a on the rear substrate 12 with one pair of electrodes, and apply the sealing layer 2 on the front substrate 1 1 with the other pair of electrodes. It is also possible to adopt a configuration that energizes 1b.

In this case, as shown in FIG. 53, two pairs of electrodes 30 are attached to rear substrate 12. Front board 11 sent to the assembly room and The rear substrate 12 is fixed on the hot plates 13 1 and 13 2, and is arranged to face each other, and then moved in a direction approaching each other. Of the electrodes attached to the rear substrate 12, the contact portions 36 of a pair of electrodes are in electrical contact with the sealing layer 21 b on the front substrate 11 side. As shown in FIG. 54, the other pair of electrodes 30 has a convex portion 47 formed on the body 34 of the electrode. When the front substrate 11 and the rear substrate 12 are moved in a direction approaching each other, the convex portion 47 abuts on the peripheral edge of the front substrate 11, and the electrode contact portion 36 is the rear substrate. 12 Moves in the direction of the sealing layer 21a on the side, and makes electrical contact with the sealing layer 21a. At this time, the sealing layer 21b on the front substrate 11 side and the sealing layer 21a on the rear substrate 12 side are held in a state where they do not contact each other.

In this state, by applying a current to the sealing layers 21a and 21b from the electrode 30 force, the sealing layers 21a and 21b are separately heated and melted. After the melting, the power supply is stopped, and the front substrate 11 and the rear substrate 12 are moved further closer to each other and pressurized. Thus, the sealing layers 21 a and 2 lb are fused to form a sealing layer 21, and the peripheral portion of the front substrate 11 and the side wall 18 are sealed by the sealing layer.

In the modified examples shown in FIGS. 52, 53 and 54, the other configuration is the same as that of the above-described tenth embodiment, and the same parts are the same as those of the tenth embodiment. The detailed description is omitted by attaching the reference numerals. Also in the above modified example, the same operation and effect as in the above-described embodiment can be obtained.

On the other hand, in each of the above-described embodiments, the FED vacuum envelope After the sealing is completed, the electrode may be removed from the vacuum envelope. According to the manufacturing method according to the eleventh embodiment of the present invention, after the sealing, the electrode 3 is removed from the vacuum envelope 10. It is configured to excise zero. For example, in the tenth embodiment, after sealing, the envelope 10 is removed from the unload chamber 107 of the vacuum processing apparatus. In this envelope 10, the electrode 30 remains firmly bonded to the sealing layer 21. Therefore, these electrodes 30 are removed from the envelope 10 by the following steps.

First, as shown in Fig. 55, a blade of an ultrasonic cutter 60 was inserted into the interface between the electrode 30 and the sealing layer 21 to form a sealing member located around the contact portion 36 of the electrode. The adhesion layer 21 is removed by ultrasonic cutting. When the ultrasonic cutter 60 is used, the frictional force between the blade and the sealing layer 21 is reduced by the ultrasonic vibration, so that the sealing layer can be easily formed with little pressure. Can be cut and removed.

When the sealing layer around the contact portion 36 of the electrode 30 is removed in this way, the bonding strength between the electrode and the sealing layer becomes weak. In this state, as shown in FIG. 56, the mounting portion 32 of the electrode 30 is chucked by a holding jig (not shown) and pulled out in the direction of the arrow. As a result, the electrode 30 can be mechanically removed from the envelope 10 without damaging the substrate or the sealing layer.

In the FED configured as described above, by removing the electrode 30, the concave portion 41 corresponding to the trace where the electrode contact portion 36 is arranged is formed in the sealing layer 21. Remains. That is, as shown in FIGS. 57 and 58, two corners 40 a and 40 b of the sealing layer 21 opposed to each other in the diagonal direction of the vacuum envelope 10. Located in At two locations, for example, recesses 41 each having a width of 5 mm and a depth of about 1 mm are formed, each opening toward the outside of the vacuum envelope. Thereby, at corners 40 a and 40 b of vacuum envelope 10, sealing layer 21 is formed such that its width is partially reduced.

In the eleventh embodiment, the other configuration is the same as that of the above-described tenth embodiment, and the same portions are denoted by the same reference characters and will not be described in detail.

According to the manufacturing method and the FED according to the first embodiment configured as described above, it is possible to obtain the same operation and effects as those of the above-described embodiment. By removing the electrodes that are unnecessary parts in the FED after sealing, there is an advantage that the handling of the envelope is simplified. For example, when the FED is incorporated into a cabinet as a monitor, it is possible to prevent the electrodes from becoming an obstacle. The part of the electrode protruding from the substrate may damage other equipment or workers, or the load on the enclosure via the electrode may cause problems such as breakage of the enclosure. . Further, it is not necessary to modify the transfer device and the like so as to be compatible with the electrodes, so that the manufacturing cost can be reduced.

By performing ultrasonic vibration cutting such as with an ultrasonic power meter, the sealing material around the electrode can be removed, and the electrode can be easily removed.

In the first embodiment described above, when removing the electrode 30 from the vacuum envelope 10, an ultrasonic cutter was used. However, the electrode 30 may be removed by the following method. That is, as shown in Figure 59 Thus, the ultrasonic vibrator 64 connected to the ultrasonic wave generating source 62 is brought into contact with the electrode 30 and the electrode 30 is directly ultrasonically vibrated. In this case, the electrode 30 itself functions as a blade of the ultrasonic cutter, and ultrasonically cuts the interface between the contact portion 36 of the electrode and the sealing layer 21. Thus, the sealing material around the electrode 30 can be removed, and the electrode can be easily removed.

In the sealing layer 21, a region near the contact portion 36 of the sealed electrode 30 is partially heated and softened, and the bonding strength between the electrode and the sealing layer 21 is reduced. The electrode may be pulled out from the sealing layer. This is performed by inductively heating the sealing layer 21 near the contact portion 36 of the electrode 30. That is, as shown in FIG. 60, after sealing, for example, the induction heating coil 66 is disposed adjacent to the front substrate 11 of the vacuum envelope 10 in the vicinity of the electrode 30. By applying a high frequency to the induction heating coil 66, the sealing layer 21 is heated at a high frequency via the front substrate 11, and the sealing layer is partially softened.

In this case, the mounting portion 32 of the electrode 30 is chucked in advance by a holding jig (not shown) to apply a weak tensile force to the outside of the substrate. Then, when the sealing layer 21 is softened, the bonding strength between the electrode 30 and the sealing layer 21 is weakened, and the electrode 30 can be pulled out. After the electrode 30 is pulled out, the heated portion of the sealing layer 21 is quickly cooled by stopping the energization of the induction heating coil 66 and separating the induction heating coil 66 from the vacuum envelope 10. The envelope 10 is completed.

In the embodiment shown in FIG. 60, near the contact portion 36 of the electrode 30 After the adjacent sealing layer 21 is melted by induction heating, the electrode may be mechanically removed. In this case, if the heating time is long, a wide area of the sealing layer 21 melts and flows out, and the hermetic sealing of the envelope may be broken. Therefore, it is desirable to perform heating in a short time of about 3 to 30 seconds. In a short time, only the sealing material in the vicinity of the contact portion 36 of the electrode 30 is melted, and the electrode 30 can be removed while the vacuum tightness of the envelope 10 is maintained.

Further, instead of induction heating, the area around the electrode may be heated by a local heater or another method.

In the embodiments shown in FIGS. 59 and 60, other configurations are the same as those of the above-described first embodiment, and the same portions are denoted by the same reference numerals and detailed description thereof will be omitted. In addition, in the FED, in the sealing layer 21, a concave portion 41 as shown in FIG. 61A or 61 E is formed in the sealing layer 21 according to the position where the electrode is arranged and the shape of the electrode. You may. According to the modification shown in FIG. 6A, the corners of the side wall 18 and the sealing layer 21 are formed at right angles, and the recesses 41 are formed at the corners of the sealing layer and extend diagonally. It has a rectangular shape. According to the modification shown in FIG. 61B, the corners of the side wall 18 and the sealing layer 21 are formed at right angles, and the recesses 41 are formed in a shape in which the corners of the sealing layer are chamfered, and the diagonal direction Has been extended.

According to the modification shown in FIG. 61C, the corners of the side wall 18 and the sealing layer 21 are formed in an arc shape, and the recess 41 is formed in the corner of the sealing layer and extends diagonally. It has a rectangular shape. According to the modification shown in FIG. 6 1D, the corners of the side wall 18 and the sealing layer 21 are arc-shaped. The bottom surface of the concave portion 41 is formed at a corner of the sealing layer and has a shape protruding in an arc shape in a diagonal direction. Further, according to the modification shown in FIG. 61E, the corners of the side wall 18 and the sealing layer 21 are formed in an arc shape, and the recess 41 is formed in a shape in which the corner of the sealing layer is chamfered. Extend diagonally

In addition, the concave portion 41 may have a shape other than the above depending on the shape of the electrode used. The electrode 30 is not limited to the corner of the envelope, and may be, for example, the center of the long side or the short side as long as the energization path length of each of the sealing layers 21 is set to be equal. It may be arranged in a part. In this case, the upper part 41 is formed at the center of the long side or the short side of the sealing layer 21 corresponding to the position of the electrode 30. The position and shape of the recess 41 can be set arbitrarily.

When sealing is performed in the assembly chamber 105 described above, the sealing layers 21a and 21b provided on the front substrate 11 and the rear substrate 12 are separately energized and sealed. After the material is melted, the two substrates can be sealed by applying a desired pressure in a direction approaching each other. In this case, two pairs and four electrodes 30 are required for the two substrates.These electrodes are mounted, for example, on the four corners of the rear substrate 12, respectively. Is used to energize the sealing layer 21 a provided on the back substrate 12, and the other pair of electrodes is used to energize the sealing layer 2 lb provided on the front substrate 11. Therefore, after the electrodes are removed after the sealing, four concave portions 41 are formed in the sealing layer 21 of the vacuum envelope 10.

The number of these recesses is limited to two or four as described above. Instead, the number can be arbitrarily determined according to the number of electrodes used. For example, when energization sealing is performed using four electrodes whose contact portions are bifurcated, eight recesses are formed. In the first embodiment described above, the entire electrode is taken out of the vacuum envelope. Although the configuration was excluded, the electrodes may be removed while leaving a part. According to the manufacturing method of the twelfth embodiment of the present invention, the electrode 30 is cut in the middle of the body, and the other part of the electrode except the contact part 36 is removed from the envelope.

More specifically, for example, the front substrate 11, the side walls 18, and the rear substrate 12 sealed by the same processes as those of the above-described tenth embodiment are connected to the cooling chamber 1 of the vacuum processing apparatus. It is sent to 06 and cooled to room temperature. In this state, the contact portion 36 of the electrode 30 is firmly joined to the sealing layer 21. As shown in Fig. 62, the cooling room 106 is equipped with an automatic cutter 70. The automated cutter 70 is extended so as to sandwich the body part 34 of the electrode 30, and the body part 34 is cut near the contact part 36 by the automated cutter.

Subsequently, as shown in FIG. 63, the mounting portion 32 of the cut electrode 30 is chucked by a holding jig (not shown), pulled out in the direction of the arrow, and removed from the rear substrate 12. Exclude As a result, the contact portion 36 of the electrode 30 and a part of the body portion 34 are left on the envelope 10 side, and the other portion of the electrode including the mounting portion 32 is separated from the envelope. . Since the portion of the electrode 30 other than the contact portion 36 is merely elastically sandwiched between the back substrate 12, the substrate 30 and the sealing layer 21 are easily damaged without being damaged. Can be removed You. After cutting the tip of the electrode 30, the envelope 10 is sent to the unloading chamber 107, and is taken out of the unloading chamber 107. Thus, the vacuum envelope 10 of the FED is completed.

In the FED configured as described above, by removing most of the electrode 30, the two corners of the vacuum envelope 10 are brought into contact with the contact portion 36 of the electrode 30 and the electrode 30. Only the conductor pieces 7 1 including a part of the body 3 4 remain.

In the twelfth embodiment, the other configuration is the same as that of the above-described tenth embodiment, and the same portions are denoted by the same reference characters and will not be described in detail.

According to the manufacturing method and the FED according to the first embodiment configured as described above, it is possible to obtain the same operation and effects as those of the above-described embodiment. Also, by removing most of the electrodes, which are unnecessary parts in the FED after sealing, the tip of the electrode remains at the corner of the envelope, but the area is very small. The advantage of the enclosure is that it is easier to handle the envelope. For example, when the FED is installed in a cabinet as a monitor, it is possible to prevent the electrodes from becoming obstacles. The part of the electrode protruding from the substrate can hurt other equipment and workers, or eliminate the problem that the load acts on the envelope via the electrode and the envelope breaks. . Furthermore, there is no need to modify the transfer device or the like to be compatible with the electrodes, and the manufacturing cost can be reduced. By removing the electrode 30 from the vacuum envelope after cutting, the electrode can be easily removed without damaging the sealing layer or the substrate. In the first and second embodiments, the electrodes are cut and removed in the cooling chamber of the vacuum processing apparatus. However, the electrodes are cut in the cooling chamber, and the envelope is passed through the unload chamber to the outside. After the removal, the cut portion of the electrode may be manually removed from rear substrate 12.

In addition, the electrode was cut by an automatic power meter attached to the cooling chamber of the vacuum processing device.However, the present invention is not limited to this, and a device for cutting and removing the electrode is prepared separately from the vacuum processing device. A configuration in which cutting is performed by using may be used. If the electrode is thin and can be cut easily, the operator may manually cut it with a pliers or the like.

In the above-described embodiment, a pair of electrodes that energize the sealing layer 21a on the rear substrate side and a pair of electrodes that energize the sealing layer 21b on the front substrate side are separately provided. Electric current may be applied to the sealing layer using the electrodes. In this case, the completed FED has a structure in which four conductor pieces 71 corresponding to the electrode tip end remain. It goes without saying that the position, shape and number of the electrodes are not limited to the above embodiment.

Next, a method and an apparatus for manufacturing an FED according to a thirteenth embodiment of the present invention will be described. FIG. 64 shows an FED manufactured by the present embodiment. The other configuration of the FED is the same as that of the FED shown in the above-described embodiment, and the same portions are denoted by the same reference characters and will not be described in detail.

In the method of manufacturing the FED according to the thirteenth embodiment, first, similarly to the above-described embodiment, the phosphor screen 16 and the A front substrate 11 on which a back 17 is formed and a rear substrate 12 on which an electron-emitting device 22 is formed are prepared.

The side wall 18 and the support member 14 are sealed on the inner surface of the back substrate 12 with low melting glass in the air. Thereafter, an aluminum film is applied to a predetermined width and thickness over the entire periphery of the sealing surface of the side wall 18 to form a rectangular frame-shaped sealing layer 21a. An image is applied to the sealing surface facing the side wall of the front substrate 11 in a rectangular frame shape with a predetermined width and thickness, and a rectangular frame corresponding to the sealing layer 21a on the rear substrate 11 side. To form a sealing layer 21b.

Next, as shown in FIG. 65, a pair of conducting electrodes 30 are mounted on the back substrate 12 to which the side walls 18 are joined. Each electrode 30 is formed by bending a copper plate having a thickness of, for example, 0.2 mm as a conductive member. Each electrode 30 is capable of contacting the mounting portion 32 that can be attached to the periphery of the back substrate 12, the tongue piece 44 held by a holding jig described later, and the sealing layer 21 a. Contact portions 36 are integrally provided. Each of the electrodes 30 is attached to the rear substrate while the peripheral portion of the rear substrate 12 is elastically held by the mounting portion 32. At this time, the contact portion 36 of each electrode 30 is brought into contact with the sealing layer 21a formed on the side wall 18 to electrically connect the electrode to the sealing layer. The tongue piece 44 protrudes outward from the rear substrate 12.

After the pair of electrodes 30 are mounted on the rear substrate 12, the rear substrate 12 and the front substrate 11 are arranged facing each other with a predetermined distance therebetween, and are put into a vacuum processing apparatus in this state. Here, for example, the vacuum processing apparatus 100 shown in FIG. 9 is used. The above-described front substrate 11 and rear substrate 12 arranged at a predetermined distance from each other are first loaded into a load chamber 101. After the atmosphere in the loading chamber 101 is changed to a vacuum atmosphere, it is sent to a baking and electron beam cleaning chamber 102.

In the baking and electron beam cleaning chamber 102, various members are heated to a temperature of 300 ° C. to release gas adsorbed on the surface of each substrate. At the same time, the electron beam from the electron beam generator (not shown) attached to the baking and electron beam cleaning chamber 102 is used to emit the phosphor screen on the front substrate 11 and the electron-emitting devices on the rear substrate 12. Illuminate the surface. At this time, the electron beam is deflected and scanned by a deflector mounted outside the electron beam generator, thereby cleaning the entire phosphor screen surface and the electron emission element surface with the electron beam, respectively. The front substrate 11 and the rear substrate 12 after line cleaning are sent to the cooling chamber 103, cooled to a temperature of about 120 ° C, and then sent to the getter film deposition chamber 104. Can be In the vapor deposition chamber 104, a barium film is formed by vapor deposition as a getter film outside the phosphor layer. The barrier film can prevent the surface from being contaminated with oxygen, carbon, and the like, and can maintain an active state.

Subsequently, the front substrate 11 and the rear substrate 12 are sent to the assembly room 105. As shown in FIGS. 66 and 67, inside the assembly chamber 105, hot plates 131, 1332, and a lower hot plate for holding and heating both substrates are provided. A drive mechanism 150 for vertically driving the plate 13 2, a wire 13 4 for energizing the sealing layer, and a pair of electrodes 30 respectively in contact with the pair of electrodes 30. Contact electrode 13 5, holding device 13 6 for holding and holding a pair of electrodes 30, driving mechanism 13 7 for driving holding device 13 6 vertically and in-plane inward, substrate A plurality of guide rollers 1338 are provided for moving the substrate in an in-plane direction, that is, a direction parallel to the substrate surface. The contact electrode 135 is attached to the lower hot plate 132. The wiring 134 is connected to a power supply 120 provided outside the assembly room 105. ·

The front substrate 11 and the rear substrate 12 sent to the assembly chamber 105 are first mechanically positioned with respect to the respective hot plates 13 1 and 13 2 by the guide rollers 1 38. At this time, after the front substrate 11 is positioned on the transport jig, the front substrate 11 is suction-fixed to the hot plate 1331 by a known electrostatic suction technique so as not to drop. After the rear substrate 12 is set on the lower hot plate 132, it is positioned by the guide rollers 1338. At the same time, the tongue pieces 44 of the pair of electrodes 30 contact the corresponding contact electrodes 135 and are electrically connected.

After the mutual alignment between the front substrate 11 and the rear substrate 12 is completed, the hot plate drive mechanism 150 moves the rear substrate 12 toward the front substrate 11 and pressurizes it with a predetermined pressure. As a result, the contact portion 36 of each electrode 30 is sandwiched between the sealing layers 21b and 21a of the front substrate 11 and the rear substrate 12 and each electrode is bonded to the sealing layer of both substrates. Electrical contact at the same time.

In this state, the sealing layer 2 1 is passed from the power supply 120 through the electrode 30. A DC current of 14 OA is applied to a and 21b in the constant current mode, whereby the indium is heated and melted, and the front substrate 11 and the rear substrate 12 are hermetically sealed. You. After the energization is stopped, as shown in Fig. 67, the driving mechanism 13 7 moves the holding device 13 6 to the tongue piece 4 4 of the electrode 30 and the tongue piece 4 4 Sandwich. Then, the drive mechanism 13 7 moves the holding device 13 6 along with the electrodes 30 to the outside of the substrate along a direction parallel to the surface of the rear substrate 12, and the respective electrodes 30 are melted. Away from the indium and back substrate 12. Immediately after the power supply is stopped, the indium is in a molten state, and the electrode 30 can be easily detached from the sealing layer. If the sealing layer 21 is held as it is after the separation of the electrode 30, the melted solid is solidified and the envelope 10 is formed. The envelope 10 after sealing is sent to the cooling chamber 106, cooled to room temperature, and taken out of the unloading chamber 107. Through the above steps, the vacuum envelope 10 of the FED is completed.

As described above, according to the method and the apparatus for manufacturing an FED according to the thirteenth embodiment, the sealing and joining of the front substrate 11 and the rear substrate 12 are performed in a vacuum atmosphere. Therefore, the surface adsorbed gas can be sufficiently released by using the baking and the electron beam cleaning in combination, and a getter film having excellent adsorption ability can be obtained. By sealing and joining the indium by energizing and heating it, it is not necessary to heat the entire front and back substrates, and the getter film may be degraded and the substrate may be cracked during the sealing process. Defects can be eliminated. At the same time, shorten the sealing time This makes it possible to achieve a manufacturing method with excellent mass productivity. By removing the electrode from the insulator in the assembly chamber after energization, the electrode does not remain on the FED after sealing. Therefore, for example, it is possible to prevent the FED from being obstructed when the FED is incorporated into a cabinet as a monitor, or to prevent the enclosure from being broken by the electrodes, and other problems. You. This has the advantage that handling of the envelope after sealing is simplified.

In the above-described thirteenth embodiment, a pair of electrodes 30 was attached to the rear substrate 12 and then charged into the vacuum processing apparatus. However, the present invention is not limited to this. The manufacturing method and the manufacturing apparatus may be such that they are installed and charged into a vacuum processing apparatus without attaching an electrode to the substrate.

As shown in FIG. 68, the FED manufacturing apparatus according to the fifteenth embodiment of the present invention includes hot plates 13 1, 13 2, and a lower plate for fixing and heating and holding both substrates. The drive mechanism 150 for driving the hot plate 13 2 in the vertical direction, the wiring 13 4 for conducting electricity to the sealing layer, the electrode 14 5, and the electrode 14 5 are the surface of the substrate. Drive mechanism 13 7 for driving in a direction parallel to the substrate and in a direction perpendicular to the surface of the board, and a plurality of guide rollers 13 8 for moving and positioning the board in a direction parallel to the surface. 1 34 is connected to a power supply 120 outside the assembly room. The other configuration of the manufacturing apparatus is the same as that of the above-described 13th embodiment, and the same parts are denoted by the same reference numerals. The detailed explanation is omitted. In the 14th embodiment, the front substrate 11 and the rear substrate 12 sent to the assembling chamber 105 firstly receive guide rollers 13 1, 13 2 corresponding to the respective hot plates 13 1, 13 2. It is mechanically positioned by 1 3 8. At this time, after the front substrate 11 is positioned on the transport jig, the front substrate 11 is attracted to the hot plate 13 1 by a known electrostatic attraction technique so as not to drop. Then, the electrode driving mechanism 13 7 The hot plate driving mechanism 150 moves the electrode 144 and the rear substrate 12 in the direction of the front substrate 11 and pressurizes them at a desired pressure. As a result, each electrode 145 is sandwiched between the sealing layers 21a and 21b of both substrates, and each electrode comes into electrical contact with the sealing layer of both substrates simultaneously.

In this state, a DC current of 14 OA is supplied from the power supply 120 through the electrode 144 to the sealing layers 21a and 21b in the constant current mode. Thereby, the indium is heated and melted, and the front substrate 11 and the rear substrate 12 are hermetically sealed. After the energization is stopped, the electrode driving mechanism 1337 moves the electrode 144 outward from the substrate, and separates it from the molten indium. Immediately after the power is turned off, the indium is in a molten state, so that the electrode 145 can be easily separated from the indium force. If the electrodes are kept as they are for several minutes after the separation of the electrodes, the molten indium solidifies and the envelope 10 is formed. The envelope 10 after sealing is sent to a cooling chamber 106, cooled to room temperature, and taken out from the unloading chamber 107.

In the fifteenth embodiment, other configurations are the same as those of the thirteenth embodiment, and the description of the same parts will be omitted. According to the above configuration, the electrode 145 for energization is installed in the assembly chamber 105, and is detached from the sealing layer after energization. Therefore, similarly to the thirteenth embodiment, the electrode does not remain on the FED after sealing. Incorporating the FED into the cabinet as a monitor will prevent problems such as electrode failure or envelope rupture caused by the electrodes.

In the 14th embodiment, two pairs of electrodes are provided, and four pairs of electrodes are brought into contact with the sealing layer on the front substrate side and the sealing layer on the rear substrate side, each of which is energized. It may be a process of pressurizing the substrates. It goes without saying that the position, shape and number of electrodes are not limited to the above embodiment.

The present invention is not limited to the various embodiments described above, and can be variously modified within the scope of the present invention. In the embodiments described above, the vacuum envelope having the configuration in which the side wall is sandwiched between the front substrate and the rear substrate is used, but the configuration in which the side wall is integrated with the front substrate or the rear substrate is also used. Also, the configuration may be such that the side walls are joined so as to cover the front substrate and the rear substrate from the side surfaces. Furthermore, the sealing surfaces to be sealed by energizing heating of the sealing material may be two surfaces between the front substrate and the side wall and between the rear substrate and the side wall.

In the above-described embodiment, the sealing material on the front substrate and the sealing material on the rear substrate are brought into contact with each other and heated by energization.However, after these sealing materials are heated in a non-contact state and then solidified, It may be joined between. The configuration of the phosphor screen and the configuration of the electron-emitting device are not limited to the embodiment of the present invention, but may be other configurations. It may be good. Also,

The sealing material is not limited to an insulator, but may be any other material having conductivity. In general, if a metal undergoes a phase change, a sharp change in resistance occurs, so that it can be used as a sealing material. For example, a metal or alloy containing at least one of In, Sn, Pb, Ga, and Bi can be used as the sealing material.

The above-mentioned FED has a configuration in which one or two pairs of electrodes are provided, but has a configuration in which at least one electrode is attached to an envelope in advance, and other necessary components are used in the sealing process. A configuration may be adopted in which the electrodes are mounted on an envelope and heated by energization. In addition, the plurality of electrodes are arranged so that the energization paths of the sealing layer located between the electrodes are equal in length to each other, or are arranged at positions symmetrical with respect to the sealing layer. As long as it is provided, it may be provided not only at the corner of the envelope but also at another position.

In the above-described embodiment, the sealing layer made of indium is provided on both the rear substrate side and the front substrate side. However, in a state where the sealing layer is provided on only one of the front substrate and the rear substrate, A configuration in which the substrate and the substrate are sealed may be employed.

The outer shape of the vacuum envelope and the configuration of the support member are not limited to the above embodiment. A matrix-shaped light absorbing layer and a phosphor layer may be formed, and a columnar support member having a cross-shaped cross section may be positioned and sealed to the light absorbing layer. As the electron-emitting device, a pn-type cold cathode device, a surface conduction electron-emitting device, or the like may be used. In the above embodiment, the step of bonding the substrates in a vacuum atmosphere However, it is also possible to implement in other atmosphere environment.

The present invention is not limited to the FED, and can be applied to other image display devices such as an SED and a PDP, or to an image display device in which the inside of the envelope does not have a high vacuum.

Industrial applicability

As described above, according to the present invention, a sealing operation can be performed stably and quickly, and an image display device and a method of manufacturing an image display device capable of displaying a high-quality image with high reliability. And manufacturing equipment can be provided.

Claims

Range of request

1. It has a front substrate and a rear substrate opposed to the front substrate, and a peripheral layer of the front substrate and the rear substrate is sealed by a sealing layer containing a conductive sealing material. An attached envelope, an electrode member attached to the envelope in a state where the envelope is in electrical contact with the sealing layer, and energized to the sealing layer.

An image display device comprising:

The above-mentioned electrode member is formed by bending a metal plate and facing the first plate portion and the second plate portion with a gap therebetween, and the conductive portion connecting the first and second plate portions. The image display device according to claim 1, further comprising: an outer peripheral portion of the front substrate or the rear substrate sandwiched between the first and second plate portions.

3. The image display device according to claim 2, wherein the first plate portion includes a contact portion electrically contacting the sealing layer.

4. The envelope has a frame-like side wall joined between the rear substrate and a peripheral portion of the rear substrate, and at least one of the rear substrate and the front substrate is provided with the sealing layer interposed therebetween. The electrode member is sealed to a side wall, and the electrode member sandwiches the at least one peripheral portion of the rear substrate and the front substrate and the side wall between the first and second plate portions. The image display device according to claim 2, wherein the image display device is attached to a device.

5. The electrode member includes: a contact portion electrically contacting the sealing layer; a body extending from the contact portion toward the outside of the envelope; and an outer portion of the envelope. Having an exposed conductive portion, and The image display device according to claim 1, wherein the body portion has an outflow regulating portion positioned higher than the contact portion along the vertical direction.

6. The electrode member comprises: a contact portion electrically contacting the sealing layer; a body portion extending from the contact portion toward the outside of the envelope; The body portion has a flow-out regulating portion positioned higher than the contact portion along the vertical direction, and the drain portion is positioned lower than the contact portion along the vertical direction. The image display device according to claim 1, wherein

7. The image display device according to claim 5, wherein the electrode member has a conductive portion that is exposed or protrudes outside the envelope.

8. The image display device according to claim 5, wherein the electrode member has a mounting portion sandwiching a peripheral portion of the front substrate or the rear substrate, and is attached to the envelope.

9. The image display device according to claim 5, wherein the electrode member is formed by bending a metal plate.

10. The image display device according to claim 5, wherein the contact portion of the electrode member has a horizontal portion having a horizontal extension length of 2 mm or more.

11. The image display device according to claim 6, wherein the drain portion of the electrode member has a width smaller than a width of the body portion.

12. The image display device according to claim 5, wherein a contact portion of the electrode member and a region in the vicinity thereof are filled with a conductive material.

13. The image according to claim 6, wherein a conductive material is filled in a contact portion of the electrode member and a region in the vicinity thereof, as well as a drain region and a region in the vicinity thereof. Display device.

14. The electrode member includes: a contact portion electrically contacting the sealing layer; and a body extending from the contact to the outside of the envelope. 2. The image display device according to claim 1, wherein at least a part has a cross-sectional area smaller than a cross-sectional area of the contact portion.

15. The image display according to claim 14, wherein the contact portion of the electrode member is located higher than the body portion along the vertical direction.

(6) The electrode member according to (1), wherein the electrode member has a plurality of contact portions which are in electrical contact with the sealing layer and are arranged with a gap through which the sealing material can flow out. Image display device as described.

17. The image display device according to claim 16, wherein the electrode member has a plurality of contact portions in contact with the sealing layer on both sides of one corner of the envelope.

18. The image display device according to claim 16, wherein the electrode member has a plurality of contact portions in contact with the sealing material on one side of one corner of the envelope.

19. The image display device according to claim 16, wherein the electrode member is formed in a Y-shape having two contact portions.

20. The sealing layer is formed in a substantially rectangular frame shape, and a plurality of the electrode members are provided symmetrically with respect to the sealing layer. The image display device according to claim 1, wherein the image display device is electrically connected to the sealing layer.

21. The sealing layer is formed in a substantially rectangular frame shape, and the electrode member is mounted on the back substrate and electrically connected to the sealing layer with the first electrode and the front substrate. The image display device according to claim 1, further comprising: a second electrode attached and electrically connected to the sealing layer.

22. The image display device according to claim 1, wherein the sealing material contains at least one of In, Sn, Pb, and GaBi.

23. The electrode member is formed of a single element or an alloy containing at least one of Cu, Al, Fe, Ni, Co, Be, and Cr. 3. The image display device according to 1.

24. The method according to claim 1, further comprising: a phosphor layer provided on an inner surface of the front substrate; and a plurality of electron-emitting devices provided on the rear substrate, each of which excites the phosphor layer. The image display device described in the above.

25. The envelope has a frame-shaped side wall joined between peripheral portions of the front substrate and the rear substrate, and the sealing layer is at least one of the front substrate and the rear substrate. The image display device according to claim 1, wherein the image display device is provided between the side wall and the side wall.

26. An envelope having a front substrate and a rear substrate, both of which are arranged to face each other and whose peripheral edges are joined by a sealing material having conductivity,

At least a part of each is covered with a conductive material layer, and each of them is electrically contacted with the sealing material via the conductive material layer. A plurality of electrode members provided by

An image display device comprising:

27. The envelope has a frame-like side wall joined between the peripheral portions of the front substrate and the rear substrate, and the sealing material is at least one of the front substrate and the rear substrate. 27. The image display device according to claim 26, provided between the side wall and the side wall.

28. The sealing material is provided in a frame shape along the peripheral edge of the envelope, and the plurality of electrode members are provided at least at two corners of the envelope. The image display device according to claim 26, wherein the image display device is provided in a unit.

29. The electrode member according to claim 26, wherein each of the electrode members is formed of a single element or an alloy containing at least one of Cu, Al, FeNi, Co, Be, and Cr. 3. The image display device according to 1.

30. The image display device according to claim 26, wherein the sealing material contains any one of In, Sn, Pb, Ga, and Bi.

31. The conductive material layer is composed of In, Sn, Pb, Ga,

27. The image display device according to claim 26, comprising any one of B i.

3 2. A front substrate and a rear substrate that are arranged to face each other, and a sealing layer that contains a conductive sealing material and is disposed along at least one inner peripheral edge of the front substrate and the rear substrate. And an envelope in which peripheral portions of the front substrate and the rear substrate are joined via the sealing layer, and a plurality of pixels provided in the envelope. , Each facing the outside of the envelope Image display characterized by having a plurality of recesses that have been opened

33. The image display device according to claim 32, wherein the plurality of recesses are located at two or four corners of the envelope.

34. A front substrate and a rear substrate that are arranged to face each other, and a sealing layer containing a conductive sealing material that is disposed along at least one inner peripheral edge of the front substrate and the rear substrate. An envelope in which peripheral portions of the front substrate and the rear substrate are joined together via the sealing layer, and a plurality of pixels provided in the envelope.

The envelope includes a plurality of conductor pieces (note: it is difficult to differentiate the electrode from the electrode) and includes a contact portion bonded to the sealing layer and is located at a peripheral portion of the envelope. Image display device.

35. The image display device according to claim 34, wherein the conductor pieces are arranged at corners of the envelope.

36. A method for manufacturing an image display device including an envelope having a front substrate and a rear substrate, both of which are disposed to face each other and whose peripheral portions are joined together,

Forming a sealing layer by disposing a conductive sealing material on at least one peripheral portion of the front substrate and the rear substrate;

An electrode member is attached to at least one of the front substrate and the rear substrate on which the sealing layer is formed, and electrically connected to the sealing layer.

With the front substrate and the rear substrate facing each other, electricity is supplied to the sealing layer through the electrode member, and the sealing layer is heated and melted. And bonding the peripheral portions of the front substrate and the rear substrate to each other.

37. A method for manufacturing an image display device including an envelope having a front substrate and a rear substrate which are arranged opposite to each other and whose peripheral portions are joined together,

At the peripheral portions of the front substrate and the rear substrate, a sealing material having conductivity is arranged to form sealing layers, respectively.

An electrode member is attached to at least one of the front substrate and the back substrate, and is electrically connected to the sealing layer formed on at least one of the at least one substrate;

After the front substrate and the rear substrate are arranged to face each other, the electrode member is brought into electrical contact with a sealing layer formed on the other of the front substrate and the rear substrate, and then the sealing layer is passed through the electrode member. And a method of manufacturing an image display device in which the sealing layer is heated and melted to join peripheral portions of the front substrate and the rear substrate.

38. A method for manufacturing an image display device comprising an envelope having a front substrate and a rear substrate which are arranged opposite to each other and whose peripheral portions are joined together,

An electrode member comprising: a contact portion; a body portion having a flow-out restricting portion extending from the contact portion and being vertically higher than the contact portion; and a conducting portion. Prepare

The electrode member is sealed with the body portion extending outward from the sealing layer and the conductive portion being exposed or projected to the outside. Attaching to the at least one of the front substrate and the rear substrate on which the layer is formed, bringing the contact portion into electrical contact with the sealing layer,

In a state where the front substrate and the rear substrate are opposed to each other, electricity is supplied to the sealing layer through the electrode member, and the sealing layer is heated and melted to join the peripheral portions of the front substrate and the rear substrate. A method for manufacturing an image display device.

39. A method for manufacturing an image display device comprising an envelope having a front substrate and a rear substrate which are arranged opposite to each other and whose peripheral portions are joined together,

A body portion having a contact portion, an outflow regulation portion extending vertically from the contact portion, and being higher than the contact portion in the vertical direction, and extending from the contact portion. And an electrode member provided with a drain portion located lower than the contact portion along the vertical direction, and

With the body member and the drain portion extending outward from the sealing layer and the conductive portions exposed or protruding to the outside, the electrode substrate is provided with the front substrate and the back substrate on which the sealing layer is formed. At least one of the plates is attached to the plate, and the contact portion is brought into electrical contact with the sealing layer,

In a state where the front substrate and the rear substrate are arranged to face each other, electricity is supplied to the sealing layer through the electrode member to heat and melt the sealing layer, and the front substrate and the rear substrate are brought closer to each other. The peripheral portions of the front substrate and the rear substrate are joined together with the melted sealing material by applying pressure, and excess molten sealing material is discharged from the drain portion of the electrode member to the outside. A method for manufacturing an image display device to be leaked.

40. A method for manufacturing an image display device including an envelope having a front substrate and a rear substrate, both of which are opposed to each other and whose peripheral portions are joined together,

A sealing layer having conductivity is arranged between the peripheral portions of the front substrate and the rear substrate to form a sealing layer,

An electrode member having a plurality of contact portions arranged with a gap allowing the sealing material to flow out is prepared,

A plurality of contact portions of the electrode member are brought into electrical contact with the sealing layer, respectively;

While the front substrate and the rear substrate are pressed in a direction approaching each other, electricity is supplied to the sealing layer through the electrode member to heat and melt the sealing material. A method of manufacturing an image display device, comprising joining an adhesive by the above-mentioned molten sealing material, and flowing out excess molten sealing material to the outside through a gap between contact portions of the electrode members.

41. A method for manufacturing an image display device including an envelope having a front substrate and a rear substrate, which are arranged facing each other and whose peripheral portions are joined together,

A sealing layer having conductivity is disposed between the peripheral portions of the front substrate and the rear substrate to form a sealing layer,

At least a part of each is covered with a conductive material layer. Prepare multiple electrode members

Electrically contacting the electrode member with the sealing layer via the conductive material layer,

A method for producing an image display device, comprising: applying an electric current to the sealing layer via the electrode member to melt the sealing material; and joining peripheral portions of the front substrate and the rear substrate.

42. The method according to claim 41, wherein a conductive material is supplied to the electrode member while applying ultrasonic waves to form the conductive material layer.

43. A frame-shaped side wall is arranged between the peripheral portions of the front substrate and the rear substrate, and the sealing layer is provided between at least one of the front substrate and the rear substrate and the side wall. The method for manufacturing an image display device according to any one of claims 36 to 41, wherein a current is applied to the sealing layer through the electrode member to melt the sealing material.

Claim 4. A metal containing at least one of In, Sn, PbGa, and Bi is used as the sealing material, as described in any one of claims 36 to 41. Manufacturing method of an image display device.

4 5. Claims for setting the temperature of the front substrate and the rear substrate immediately before energizing the sealing material to be lower than the melting point of the sealing material 3 6 or 4 1 5. The method for manufacturing an image display device according to item 1.

46. The method for manufacturing an image display device according to any one of claims 36 to 41, wherein electricity is supplied to the sealing layer while the envelope is maintained in a vacuum atmosphere.

4 7. Add the front and rear substrates in a vacuum After degassing by heating, it is cooled to a temperature lower than the melting point of the sealing material while maintaining the vacuum atmosphere,

By energizing the sealing layer, only the sealing material is heated and melted.

The method according to any one of claims 36 to 41, wherein the energization of the sealing layer is stopped, and the heat of the sealing layer is conducted to the front substrate and the rear substrate to cool and solidify the sealing layer. Section 1 describes a method for manufacturing an image display device.

48. An image comprising: an envelope having a front substrate and a rear substrate, which are arranged facing each other and whose peripheral portions are joined together, and a plurality of pixels provided in the envelope. A method of manufacturing a display device,

Forming a sealing layer by arranging a conductive sealing material on at least one peripheral portion of the front substrate and the rear substrate;

The front substrate and the rear substrate are arranged so as to face each other with the sealing material interposed therebetween,

At least one of the front substrate and the rear substrate arranged opposite to each other is pressed in a direction in which the front substrate and the rear substrate approach each other, and at least a part of the sealing material is used as the front substrate. Hold it in contact with the peripheral part of the rear substrate,

A method for manufacturing an image display device, wherein an electric current is applied to the sealing layer by an electrode member in the pressurized state to heat and melt the sealing material.

49. A sealing layer having conductivity is disposed around the periphery of the front substrate and the periphery of the back substrate to form a sealing layer, and at least a part of the sealing layers is at least partially connected to each other. While in contact, The method for producing an image display device according to claim 48, wherein electricity is supplied to these sealing layers.

50. An envelope having a front substrate and a rear substrate, which are arranged to face each other and whose peripheral portions are joined to each other with a side wall interposed therebetween, and a plurality of pixels provided in the envelope. A method for manufacturing an image display device,

A sealing material having conductivity is arranged on at least one of the periphery of the front substrate and the back substrate, and the at least one of the side walls, and

The front substrate and the rear substrate are arranged facing each other with the sealing material and the side wall interposed therebetween,

At least one of the front substrate and the rear substrate disposed opposite to each other is pressed in a direction in which the front substrate and the rear substrate approach each other, and at least a part of the sealing material is used as the front substrate and the rear substrate. Sandwiching at least one peripheral portion of the rear substrate in contact with the side wall,

A method for manufacturing an image display device, wherein an electric current is applied to the sealing material by an electrode member in the pressurized state to heat and melt the sealing material.

51. A sealing layer having conductivity is formed by disposing sealing materials having conductivity on at least a peripheral portion of at least one of the front substrate and the rear substrate and the side wall. The method for manufacturing an image display device according to claim 50, wherein current is applied to these sealing materials in a state where at least a part of the sealing layers is in contact with each other.

52. The electrode according to claim 48 or 51, wherein the electrode member is sandwiched between the sealing layers, and a current is applied to the sealing material through the electrode member. 3. The method for manufacturing an image display device according to item 1.

5 3. An image including an envelope having a front substrate and a rear substrate that are arranged facing each other and whose peripheral portions are joined together, and a plurality of pixels provided in the envelope. In the manufacturing method of the display device,

A sealing layer having conductivity is disposed around the front substrate and the rear substrate to form a sealing layer.

The front substrate and the rear substrate are disposed so as to face each other with the sealing layer interposed therebetween,

At least a part of the sealing layers provided on the front substrate and the rear substrate disposed opposite to each other are welded to each other,

A method for producing an image display device, wherein an electrode member is brought into contact with the welding portion, and both the sealing layers are energized through the electrode member to heat and melt the sealing material.

54. A method for manufacturing an image display device including an envelope having a front substrate and a rear substrate, which are arranged opposite to each other and whose peripheral portions are joined together,

An electrode member comprising: a mounting portion that can be mounted on at least one of the front substrate and the rear substrate; and a contact portion that can be in contact with the sealing layer.

The electrode is attached to at least one of the front substrate and the rear substrate in a state where the contact portion has a gap with respect to the sealing layer, While maintaining a gap between the contact portion and the sealing layer, the front substrate and the rear substrate are arranged to face each other,

The front substrate and the rear substrate arranged opposite to each other are pressed in a direction to approach each other, and the front substrate and the rear substrate are brought into contact with each other via the sealing layer. Electrical contact with the sealing layer,

In the pressurized state, an electric current is applied to the sealing layer through the electrode member, and the sealing layer is heated and melted to join the peripheral portions of the front substrate and the rear substrate to each other. Method.

55. A method for manufacturing an image display device comprising an envelope having a front substrate and a rear substrate, which are arranged opposite to each other and whose peripheral portions are joined together,

Attaching the electrode member to the front substrate and the rear substrate with the contact portion leaving a gap with respect to the sealing layer;

While maintaining a gap between the contact portion and the sealing layer, the front substrate and the rear substrate are arranged to face each other,

Moving the front substrate and the rear substrate disposed opposite to each other in a direction approaching each other, electrically contacting a contact portion of an electrode member attached to the front substrate with a sealing layer of the rear substrate; The contact part of the electrode member attached to the rear substrate is sealed Electrical contact with the coating

In a state where the electrode member is in electrical contact with the sealing layer, a current is applied to the sealing layer through the electrode member to heat and melt the sealing layer, A method of manufacturing an image display device, wherein the peripheral portions of the front substrate and the rear substrate are joined by pressing the rear substrates in a direction approaching each other.

56. A method for manufacturing an image display device, comprising: an envelope having a front substrate and a rear substrate, both of which are arranged opposite to each other and whose peripheral portions are joined together,

An electrode member comprising: a mounting portion attachable to at least one of the front substrate and the rear substrate; and a contact portion capable of contacting the sealing layer.

The electrode member is attached to one of the front substrate and the rear substrate in a state where the contact portion has a gap with respect to the sealing layer, and the gap is maintained between the contact portion and the sealing layer. The front substrate and the rear substrate are arranged facing each other,

The front substrate and the rear substrate arranged opposite to each other are moved in a direction approaching each other,

The contact portion of the electrode member is brought into electrical contact with the sealing layer, and in a state where the electrode member is in electrical contact with the sealing layer, a current is applied to the sealing layer through the electrode member. Then, the sealing layer is heated and melted, and the front substrate and the rear substrate arranged opposite to each other are pressed in a direction approaching each other, so that the front substrate and the rear substrate are pressed. A method for manufacturing an image display device in which peripheral portions are joined to each other.

57. After heating the front substrate and the rear substrate to release the adsorbed gas from the front substrate and the rear substrate, pressurize the opposed front and rear substrates in a direction approaching each other. 3. The method for manufacturing an image display device according to item 1.

58. At least one of the front substrate and the rear substrate is irradiated with an electron beam to clean the electron beam, and then the front substrate and the rear substrate disposed opposite to each other are pressed in a direction to approach each other. Item 54. The method for manufacturing an image display device according to Item 54.

59. After releasing the adsorbed gas, a getter film is formed on the inner surface of the front substrate, and then the opposed front substrate and rear substrate are pressurized in a direction approaching each other. 57. The method for manufacturing an image display device according to item 7.

60. The method for manufacturing an image display device according to claim 54, wherein In or an alloy containing In is applied to a contact portion of the electrode member in advance.

61. The mounting portion of the electrode member has a clip-like holding portion capable of holding a peripheral portion of at least one of the front substrate and the back substrate. 4. The method for manufacturing the image display device according to 4.

62. The image display device according to claim 54, wherein the electrode member has a trunk extending from the mounting portion and a conductive portion, and the contact portion extends from the trunk. Production method.

6 3. The sealing material is a metal containing any of In, Sn, Pb, Ga, and Bi. 2. The method for manufacturing an image display device according to item 1.

64. The method for manufacturing an image display device according to any one of claims 48 to 62, wherein the sealing layer is electrically heated in a vacuum atmosphere.

65. An envelope having a front substrate and a rear substrate, which are arranged to face each other and whose peripheral portions are joined to each other via a sealing layer, and a plurality of pixels provided in the envelope. A method for manufacturing an image display device comprising:

Forming a sealing layer by arranging a conductive sealing material along at least one inner peripheral edge of the front substrate and the rear substrate;

In a state in which the front substrate and the rear substrate are opposed to each other, electricity is passed to the sealing layer via an electrode member that is in electrical contact with the sealing layer, and the sealing layer is heated and melted to form the front substrate. And the peripheral portions of the back substrate are joined with the above-mentioned molten sealing material,

Method for manufacturing image display device for removing the electrode member after bonding

66. The method for manufacturing an image display device according to claim 65, wherein an interface between the electrode member and the sealing layer is cut by ultrasonic cutting to remove the electrode member.

67. The method for manufacturing an image display device according to claim 66, wherein ultrasonic waves are applied to the electrode member to ultrasonically cut an interface between the electrode member and the sealing layer to remove the electrode member.

68. The method according to claim 65, wherein after bonding the front substrate and the back substrate, the electrode member is removed in a state where the sealing layer is heated and softened or melted around the electrode member. Painting A method for manufacturing an image display device.

6 9. An image display comprising: an envelope having a front substrate and a rear substrate which are arranged opposite to each other and whose peripheral portions are joined together, and a plurality of pixels provided in the envelope 內. A method of manufacturing the device,

A sealing material having conductivity is arranged along at least one inner peripheral edge of the front substrate and the rear substrate to form a sealing layer, and a contact portion of an electrode member is electrically connected to the sealing layer. When the front substrate and the rear substrate are opposed to each other, electricity is supplied to the sealing layer via the electrode member, and the sealing layer is heated and melted. Are joined by the above-mentioned molten sealing material,

A method for manufacturing a planar image display device, comprising: cutting the vicinity of a contact portion of the electrode member contacting the sealing layer after the joining, and removing a portion other than the vicinity of the contact portion of the electrode member.

70. The electrode member comprises: a mounting portion mounted on at least one of the front substrate and the rear substrate; and a body extending from the mounting portion to the contact portion.

The method according to claim 69, wherein after the joining, the body is cut in the vicinity of the contact portion, and the body and the mounting portion are removed from the envelope.

7 1. An envelope having a front substrate and a rear substrate that are arranged opposite to each other and whose peripheral portions are joined together, and a plurality of pixels provided in the envelope are provided. A method of manufacturing an image display device, A conductive sealing material is disposed along at least one inner peripheral edge of the front substrate and the rear substrate,

With the front substrate and the rear substrate facing each other, electricity is passed to the sealing material via an electrode member that is in electrical contact with the sealing material, and the sealing material is heated and melted.

After completion of the energization, in a state where the sealing material is melted, the electrode member is removed and separated from the sealing material,

A method for manufacturing an image display device, wherein the peripheral portions of the front substrate and the rear substrate are joined to each other by the melted sealing forest.

72. The method for manufacturing an image display device according to claim 71, wherein the electrode member is brought into contact with the sealing material immediately before the energization, and is removed and separated from the sealing material after the energization is completed.

7 3. An image display comprising an envelope having a front substrate and a rear substrate that are arranged opposite to each other and whose peripheral portions are joined together, and a plurality of pixels provided in the envelope. A method of manufacturing the device,

A conductive frame member and a sealing material that is melted by heating are arranged along at least one inner peripheral edge of the front substrate and the rear substrate.

In a state where the front substrate and the rear substrate are arranged to face each other, electricity is supplied to the frame member via an electrode member that is in electrical contact with the frame member, and the sealing material is heated by the heat generated by the frame member. After the completion of the energization, the electrode member is removed from the frame-shaped member while the sealing material is melted, and separated.

The peripheral parts of the front substrate and the rear substrate were fused together. A method for manufacturing an image display device to be joined with a sealing material.

74. The method for manufacturing an image display device according to claim 73, wherein the electrode member is brought into contact with the frame member immediately before the energization, and is removed and separated from the frame member after the energization is completed.

75. The method according to claim 71 or 73, wherein the sealing material is a metal containing at least one of In, Sn, Pb, and GaBi.

76. An envelope having a front substrate and a rear substrate which are arranged opposite to each other and whose peripheral portions are joined together, and at least one inner peripheral edge of the front substrate and the rear substrate. A manufacturing apparatus for an image display device, comprising: a sealing layer including a material having conductivity disposed along a plurality of pixels; and a plurality of pixels provided in the envelope.

An electrode member capable of electrically contacting the sealing layer,

A power supply for supplying a current through the electrode member,

A holding device for holding and fixing the electrode member,

A driving mechanism for moving the holding device in a plane direction of the front substrate or the rear substrate;

An apparatus for manufacturing an image display device, comprising:

7 7. An envelope having a front substrate and a rear substrate which are arranged opposite to each other and whose peripheral portions are joined together, and along at least one inner peripheral edge of the front substrate and the rear substrate. A manufacturing apparatus for an image display device, comprising: a sealing layer including a material having conductivity, which is disposed and a plurality of pixels provided in the envelope. A plurality of electrode members provided so as to be able to electrically contact the sealing material;

A power supply for supplying a current to the sealing layer via the electrode member, and a drive mechanism for driving the electrode member in at least one of the front substrate and the rear substrate in an in-plane direction;

An apparatus for manufacturing an image display device, comprising: