JP2003068238A - Display device and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a display device for which a processing time for sealing fringing parts of a front face substrate and a rear face substrate can be reduced, and the fringing parts can be surely and easily sealed, and to provide a manufacture thereof. SOLUTION: This display device has a package in which circumferential edge parts of the front face substrate 11 and rear face substrate 12 arranged so as to be opposed each other are sealed interposing a sidewall 13 having a rectangular frame form. A sealing means for sealing the upper end of the sidewall 13 and the circumferential edge part of the front face substrate 11 comprises a conductive sealing material 21a arranged on the circumferential edge part of the front face substrate 11, a conductive member 22 having a rectangular frame form, and a sealing material 21b arranged on the sidewall 13. When both are sealed, the sealing materials 21a, 21b are energized to be heated and to be melt by energizing electrodes 22a, 22b of the conductive members. Consequently, the sidewall 13 and the circumferential edge part of the front face substrate 11 are sealed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat display device, and more particularly to a display device having a large number of electron-emitting devices inside a vacuum envelope, and a method for manufacturing the display device.

[0002]

2. Description of the Related Art In recent years, various flat-panel display devices have been developed as next-generation lightweight and thin display devices which will replace cathode ray tubes (hereinafter referred to as CRTs). Such flat panel display devices include a liquid crystal display (hereinafter referred to as LCD) that controls the intensity of light by utilizing the alignment of liquid crystals, and a plasma display panel (hereinafter referred to as PDP) that emits a phosphor by ultraviolet rays of plasma discharge. Field emission display (hereinafter referred to as FED) that emits a phosphor by an electron beam of a field emission type electron-emitting device, and a surface conduction electron emission display that emits a phosphor by an electron beam of a surface conduction type electron-emitting device. (Hereinafter referred to as SED).

For example, FEDs and SEDs generally have a front substrate and a rear substrate that are opposed to each other with a predetermined gap therebetween, and these substrates are joined to each other at their peripheral portions via a rectangular frame-shaped side wall. This constitutes a vacuum envelope. The envelope is required to have an extremely high degree of vacuum, and in order to support the atmospheric pressure load applied to the back substrate and the front substrate, a plurality of support members are arranged between these substrates. Further, a phosphor screen is formed on the inner surface of the front substrate, and a large number of electron-emitting devices (hereinafter,
(Referred to as an emitter).

The potential on the rear substrate side is almost the ground potential, and the anode voltage Va is applied to the phosphor screen. Then, the red, green, and blue phosphors forming the phosphor screen are irradiated with the electron beams emitted from the emitters,
An image is displayed by causing the phosphor to emit light.

In such an FED or SED, the thickness of the display device can be reduced to about several mm, which is lighter and thinner than the CRT currently used as a display for televisions and computers. In addition to being able to achieve power saving, power saving can also be achieved.

By the way, as a method of evacuating the envelope, first, the front substrate, the rear substrate, and the side walls, which are the constituent members of the envelope, are heated and bonded in the atmosphere with an appropriate sealing material, and then the front face is joined. A method is known in which, after exhausting the inside through an exhaust pipe provided on a substrate or a back substrate, the exhaust pipe is vacuum-sealed. However, in the case of a flat type envelope, such exhausting through the exhaust pipe requires an extremely long time until the desired vacuum degree is reached, and the attainable vacuum degree is also low. Therefore, there are problems in mass productivity and characteristics.

As another method, a method of finally assembling the front substrate and the rear substrate forming the envelope in a vacuum chamber can be considered. In this method, first, the front substrate and the back substrate brought into the vacuum chamber are sufficiently heated. This is to reduce the gas emission from the inner wall of the envelope, which is the main cause of degrading the vacuum degree of the envelope. Next, when the front substrate and the rear substrate are cooled and the degree of vacuum in the vacuum chamber is sufficiently improved, a getter film for improving and maintaining the degree of vacuum of the envelope is formed on the phosphor screen. Then, the front substrate and the back substrate are heated again to a temperature at which the sealing material melts, and cooled until the sealing material is solidified in a state where the front substrate and the back substrate are combined at a predetermined position via the side wall.

The vacuum envelope manufactured by such a method has both a sealing step and a vacuum sealing step, and does not require a great amount of time for exhausting using an exhaust pipe, and is extremely A good degree of vacuum can be obtained.

[0009]

However, in the case of assembling in such a vacuum, the processes performed in the sealing process include heating, positioning and cooling, and the sealing material is melted and solidified. The front and back substrates must be kept in place for a long time. Further, there is a problem in productivity and characteristics associated with the sealing such that the front substrate and the rear substrate are thermally expanded and contracted due to the heating and cooling during the sealing and the alignment accuracy is easily deteriorated.

Therefore, a sealing method is known which can shorten the time required for the sealing process and prevent thermal expansion and contraction of the substrate. According to this method, a conductive paste is printed on one of the substrate and the side wall that require sealing, a sealing material made of frit glass is provided on the other side, and the conductive paste is energized in a state in which the two are bonded to each other. Is heated and melted to seal the substrate and the side wall. Accordingly, it is not necessary to heat the substrate and the side wall in advance, and the time required for the sealing process can be shortened.

However, this method requires a printing step and a firing step for providing the conductive paste, which has a problem that the steps are complicated and the manufacturing cost is increased. Further, since the conductive paste is directly formed on the substrate or the side wall by printing, when the conductive paste is heated by energization, the substrate or the side wall may be cracked by thermal stress. In addition, since the heat of the thin conductive paste generated by printing is used to heat and melt the sealing material, it takes a lot of time to heat the sealing material to a desired temperature. There was a problem that the conductive paste would be easily broken if a large amount of liquid was flowed. Further, since the sealing material is not in direct contact with the substrate or the sidewall on the side where the conductive paste is printed (the substrate or the sidewall), sufficient airtightness cannot be obtained at this portion.

The present invention has been made in view of the above points, and an object thereof is to shorten the processing time for sealing the peripheral portions of the front substrate and the rear substrate, and to securely and easily seal the peripheral portions. An object of the present invention is to provide a display device and a method for manufacturing the display device.

[0013]

In order to achieve the above object, a display device of the present invention comprises a front substrate, a back substrate arranged to face the front substrate, and peripheral portions of the front substrate and the back substrate. A sealing means for sealing, and an envelope having a sealing means, wherein the sealing means is heated and melted by energization to seal the peripheral portion, and a conductive sealing material higher than the sealing material. It is characterized by having a conductive member having a melting point and arranged at the peripheral portion.

According to the above invention, by energizing the conductive member and the conductive sealing material, the sealing material is heated and melted, and the energization is stopped to cool the sealing material into individual pieces. Is sealed at its peripheral edge. Since the sealing material is directly energized and heated in this manner, the sealing material can be melted in a short time. Moreover, if the conductive member is made sufficiently thick, the conductive member will not be broken even if the amount of electricity is increased and the melting time is shortened. Further, since it is not necessary to heat the front substrate and the rear substrate, thermal expansion and thermal contraction of the substrate can be prevented, and the positional accuracy can be increased when the substrate is sealed.

The display device of the present invention comprises a front substrate,
A back substrate arranged to face the front substrate, a sealing means for sealing the peripheral portions of the front substrate and the back substrate,
And a sealing material that is melted by heating and seals the peripheral portion, and an encapsulating material that is placed in the sealing material to heat the sealing material and heats it by energization. It is characterized by having a conductive member.

According to the above invention, since the conductive member is arranged in the sealing material, the sealing material can be brought into contact with the peripheral portion of the substrate in a relatively wide area, and the airtightness can be improved. Further, unlike the conventional case, since it is not necessary to print the conductive paste, the printing process and the firing process can be omitted, the manufacturing process can be simplified, and the manufacturing cost can be reduced.
Further, since the conductive member does not contact the substrate, there is less concern that the substrate will be cracked by thermal stress.

The display device of the present invention includes a front substrate,
A back substrate disposed opposite to the front substrate; a frame-shaped side wall having conductivity provided between the front substrate and the back substrate at the peripheral portions of the front substrate and the back substrate; and the front substrate and the back substrate. A sealing material which is provided at a joint between at least one of the side walls and the side wall, and which is heated and melted by energizing the side wall to seal the joint part. To do.

According to the above invention, since the side wall is made conductive and the side wall is energized, the conductive member for energization can be omitted and the number of parts can be reduced.

The display device of the present invention includes a front substrate,
A back substrate disposed opposite to the front substrate; a frame-shaped side wall provided between the front substrate and the back substrate at a peripheral portion of the front substrate and the back substrate; at least one of the front substrate and the back substrate; And a sealing material for sealing the joint between the side wall and the side wall, the sealing means being melted by heating to seal the peripheral portion, and the sealing material. It is characterized in that it has a conductive member which is placed in the sealing material to heat the material and which is heated by electric current.

Further, according to the method of manufacturing a display device of the present invention, a display device having an envelope in which a front substrate and a back substrate arranged to face the front substrate are sealed at their peripheral portions is manufactured. In the method, a conductive sealing material that is heated and melted by energization and a conductive member having a melting point higher than that of the sealing material are provided in the peripheral portion, and the sealing is performed by energizing the conductive member and the sealing material. The adhesive material is heated and melted, and the front substrate and the rear substrate are sealed at their peripheral portions.

Further, according to the method of manufacturing a display device of the present invention, a display device having an envelope in which a front substrate and a rear substrate facing the front substrate are sealed at their peripheral portions is manufactured. In the method, a sealing material that is melted by heating is provided on the peripheral edge portion, a conductive member that is heated by energization is provided in the sealing material, and the sealing material is heated and melted by energizing the conductive member. The front substrate and the rear substrate are sealed at their peripheral portions.

Further, according to the method of manufacturing a display device of the present invention, a conductive frame-shaped side wall is provided in which a front substrate and a rear substrate arranged to face the front substrate are provided in the peripheral portion between the substrates. In a method of manufacturing a display device including an envelope sealed via a sidewall, a sealing material that is heated and melted by energization is provided at a joint between at least one of the front substrate and the back substrate and the sidewall, and the sidewall is provided. Is applied to heat and melt the sealing material to seal the front substrate and the rear substrate at their peripheral portions.

Further, according to the method of manufacturing a display device of the present invention, the front substrate and the back substrate arranged to face the front substrate are sealed between the substrates via the frame-shaped side wall provided in the peripheral portion thereof. In a method of manufacturing a display device including an attached envelope, a sealing material that is melted by heating is provided at a joint portion between at least one of the front substrate and the rear substrate and the side wall. Is provided with a conductive member that is heated by energization, and the encapsulating material is heated and melted by energizing the conductive member to seal the front substrate and the rear substrate at their peripheral portions.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments in which the display device of the present invention is applied to an FED will be described in detail below with reference to the drawings. As shown in FIG. 1, this FED comprises a front substrate 1 made of rectangular glass as an insulating substrate.
1 and a back substrate 12, which are 1-2
They are arranged facing each other with a gap of mm. The front substrate 11 and the rear substrate 12 are joined together at their peripheral portions via the rectangular frame-shaped side wall 13 to form a flat rectangular vacuum envelope 10 whose inside is maintained in a vacuum state. .

As shown in FIG. 3, the front substrate 11 and the side wall 1 are formed.
3, the back substrate 12 and the side wall 13 are joined by a low melting point sealing member 40 such as frit glass.

As shown in FIG. 2, a plurality of plate-shaped spacers 14 are provided inside the vacuum envelope 10 to support an atmospheric pressure load applied to the front substrate 11 and the rear substrate 12. These spacers 14 are arranged in a direction parallel to the long side of the vacuum envelope 10, and are arranged at predetermined intervals along the direction parallel to the short side.
The shape of the spacer 14 is not particularly limited to this, and for example, a columnar spacer or the like can be used.

As shown in FIG. 4, a phosphor screen 15 having red, green and blue phosphor layers 16 and a matrix-shaped black light absorbing layer 17 is formed on the inner surface of the front substrate 11, An aluminum film (not shown) is deposited as a metal back on the phosphor screen.

As shown in FIG. 3, a large number of electron-emitting devices 18 are provided on the inner surface of the rear substrate 12 as electron-emitting sources for exciting the phosphor layer 16. Electron-emitting device 18
Are arranged at positions facing the respective phosphor layers 16 in a one-to-one manner and emit an electron beam toward the corresponding phosphor layers.

Next, a method and an apparatus for manufacturing the FED configured as described above will be described. As shown in FIG. 5, a phosphor screen 15 is formed on the inner surface of the front substrate 11 in a state before assembly. On the inner surface of the front substrate 11 and on the outer peripheral edge of the phosphor screen 15, a conductive metallic solder is provided as a sealing material 21a in a rectangular frame shape. At this point, the front substrate 1
The temperature of 1 is set to a temperature lower than the melting point of the sealing material 21a, and the sealing material 21a is in a solidified state.

As shown in FIG. 6, a large number of electron-emitting devices 18 are formed on the inner surface of the rear substrate 12 before being assembled.
(Not shown here) is pre-formed,
In order to secure a gap with the front substrate 11 during assembly, the side wall 1
3 and the spacer 14 are attached by a low melting point sealing member 40. Further, on the side wall 13, a metal solder having the same conductivity as that of the above-mentioned sealing material 21a is sealed.
1b is provided in a rectangular frame shape at a position facing the sealing material 21a on the front substrate 11 side. At this time, the temperature of the rear substrate 12 is set to a temperature lower than the melting point of the sealing material 21b, and the sealing material 21b is in a solidified state.

The sealing materials 21a and 21b are 300 ° C.
Although a material that melts or softens is selected below, In (indium) or an alloy containing In is used as the sealing materials 21a and 21b in the present embodiment.

In FIG. 7A, sealing materials 21a and 21a are used when sealing the peripheral edge of the front substrate 11 and the upper end of the side wall 13.
A rectangular frame-shaped conductive member 22 sandwiched between b is shown. This conductive member 22 is made up of the above-mentioned sealing material 21a,
It functions as the sealing means 20 of the present invention together with 21b.

The conductive member 22 is formed of a nickel alloy plate having a cross-sectional area of 0.1 mm ² or more, and two electrodes 22a and 22b (connection terminals) are integrally projected from diagonal corners. . The width of the conductive member 22 is equal to the width of the sealing material 21.
It is set narrower than the width of a and 21b. The conductive member 2
As the material 2, an alloy containing iron (Fe), chromium (Cr), aluminum (Al) or the like in addition to nickel (Ni) may be used, and a material having a melting point of 500 ° C. or higher is used.

The coefficient of thermal expansion of the conductive member 22 is set to about 80 to 120% of the coefficient of thermal expansion of the sealing materials 21a and 21b, or 80 to 12 of the coefficient of thermal expansion of the side wall 13.
It is set to about 0%, or the front substrate 11 and the rear substrate 1
It is set between the minimum thermal expansion coefficient and the maximum thermal expansion coefficient of the thermal expansion coefficients of 2 and the side wall 13.

The front substrate 11 and the rear substrate 12 as described above are assembled in a vacuum chamber by sandwiching the conductive member 22 as described above and using the apparatus shown in FIG. 9 along the steps shown in FIG. First, the front substrate 11 and the rear substrate 1 described above
2, the conductive member 22 is introduced into a vacuum chamber, the inside of this vacuum layer is evacuated, and then the front substrate 11 and the rear substrate 12 are sufficiently degassed by heating. Heating temperature is 200 ℃ ~
The time is set to about 500 ° C. This is to reduce the rate of gas release from the inner wall that deteriorates the degree of vacuum after the vacuum envelope is formed, and prevent characteristic deterioration due to residual gas.

Next, a getter film is formed on the phosphor screen 15 of the front substrate 11 which has been degassed and cooled.
This is because the residual gas after becoming the vacuum envelope is adsorbed and exhausted by the getter film to maintain the vacuum degree in the vacuum envelope at a good level.

Then, the phosphor layer 16 and the electron-emitting device 18
The front substrate 11 and the rear substrate 12 are positioned with high precision and overlapped with each other so that they face each other. At this time, the sealing material 21 a and the side wall 13 provided on the peripheral portion of the front substrate 11
The conductive member 22 is sandwiched between the sealing material 21b provided above.

The front substrate 11 and the rear substrate 12 with the conductive member 22 sandwiched in this way are set in the apparatus shown in FIG. The front substrate 11 and the rear substrate 12
Are pressed and held by the pressurizing devices 23a and 23b at a predetermined pressure in a direction facing each other. Further, the power source 25 is connected to the electrodes 22a and 22b led out from the conductive member 22.

In this state, a predetermined current is made to flow from the power source 25 to the conductive member 22 through the electrodes 22a and 22b to energize the sealing materials 21a and 21b. Thereby, the conductive member 2
2 and the sealing materials 21a and 21b are heated, and only the sealing materials 21a and 21b are melted. That is, the conductive member 2
Since No. 2 is formed of a high melting point material that does not melt when energized, only the sealing materials 21a and 21b are melted. The melted sealing materials 21a and 21b are connected so as to surround the narrow conductive member 22. After that, when the energization is stopped, the heat of the sealing material 21 having a relatively small heat capacity in the connected state is quickly diffused and conducted to the front substrate 11 and the side wall 13 due to the temperature gradient, and the front substrate 11 and the side wall 13 having a large heat capacity. Then, thermal equilibrium is reached, and the sealing material 21 is rapidly cooled and solidified. As a result, the front substrate 11 and the side wall 13 are sealed.

As described above, according to this embodiment, the conductive member 22 is energized by an extremely simple structure.
Only the sealing material 21 can be efficiently and selectively and surely heated and melted, and the work process, processing time, and power consumption required for the sealing process can be significantly reduced, and the front substrate 11
Also, the peripheral portion of the back substrate 12 can be reliably and easily sealed.

That is, even if the sealing material 21 and the conductive member 22 are used in combination as in the present embodiment, the sealing material 21 is unevenly provided. The sealing material 21 does not break,
The sealing material 21 can be reliably energized in all regions, and the sealing material 21 can be reliably melted over the entire length. In addition, since the sealing material 21 has conductivity, the sealing material 21 can be directly heated and the melting time can be shortened as compared with the sealing material having no conductivity.

Further, as in this embodiment, the conductive member 2
By sandwiching 2 with the sealing material 21,
The conductive member 22 does not come into contact with the front substrate 11 and the side wall 13, and there is no concern that the front substrate 11 and the side wall 13 are cracked by thermal stress. In addition, the conductive member 22 is connected to the front substrate 11.
Further, since the side wall 13 does not contact the side wall 13, the area where the sealing material 21 contacts the front substrate 11 and the side wall 13 can be made large, and the sealing performance can be improved.

Further, according to this embodiment, since only the sealing material can be selectively heated and melted, it is not necessary to heat the front substrate and the rear substrate, and only the sealing material having a small heat capacity, that is, a small volume is used. It suffices if heating is performed, the amount of power used can be reduced, and deterioration of positional accuracy due to thermal expansion or thermal contraction of the substrate can be suppressed.

Further, as compared with the conventional method of heating the entire substrate, the time required for heating and cooling can be greatly shortened, and mass productivity can be greatly improved. Further, since the device required for sealing is only the power source, it is possible to realize a very simple and clean device suitable for ultra-high vacuum not only for the conventional full-scale heater but also for the electromagnetic induction heating method.

As for the form of the current to be applied, not only a direct current but also an alternating current varying at a commercial frequency may be used. In this case, it is possible to save the trouble of converting the commercial current transmitted as an alternating current into a direct current and simplify the device. Further, an alternating current that fluctuates at a high frequency of kHz level may be used. In this case, since the Joule heat increases by the amount that the effective resistance value for high frequency increases due to the skin effect, the same heating effect as described above can be obtained with a smaller current value.

Further, the electric power to be applied and the time are set to about 5 to 30 seconds in the embodiment. If the energization time is long (the power is small), the cooling rate will decrease due to the temperature rise around the substrate and the thermal expansion and contraction will cause adverse effects. If the energization time is short (the power is large), the conductive sealing material will be filled. Breakage due to unevenness and cracking due to glass thermal stress occur.
Therefore, it is necessary to set the optimum conditions for the power to be applied and the time (including temporal power change) for each object.

Further, regarding the temperature difference between the substrate temperature at the time of sealing and the melting point of the sealing material, in the present embodiment, 20 ° C. to 15 ° C.
It is about 0 ° C. When the temperature difference is large, the cooling time can be shortened, but the glass thermal stress becomes large. Therefore, it is also necessary to set the optimum conditions for each object.

The present invention is not limited to the above-described embodiments, but can be variously modified within the scope of the present invention. For example, in the above-described embodiment, the vacuum envelope 10 having the configuration in which the sidewall 13 is sandwiched between the front substrate 11 and the rear substrate 12 has been described, but the sidewall may be integrated with the front substrate or the rear substrate. Alternatively, the side wall may be joined so as to cover the front substrate and the rear substrate from the side surface.

Further, as shown in FIG. 10, the sealing surface to be sealed by the energization heating of the sealing material is provided between the front substrate 11 and the side wall 13 and between the rear substrate 12 and the side wall 13.
It may be a place. In this case, the side wall 13 and the peripheral portion of the front substrate 11 are sealed together as in the above-described embodiment, and the sealing means 20 of the present invention is interposed between the side wall 13 and the peripheral portion of the rear substrate 12. Let The sealing means 20 provided between the side wall 13 and the peripheral portion of the rear substrate 12 includes the side wall 13
The sealing material 21b is provided on the lower surface of the substrate, the conductive member 22 shown in FIG. 7B, and the sealing material 21a provided on the peripheral portion of the back substrate 12. Then, the power supply 26 is connected to the two electrodes 22c and 22d of the conductive member 22.

Further, as shown in FIG. 11, the side wall 24 is formed of a conductive material, and the sealing material 21a is provided between the side wall 24 and the peripheral portion of the front substrate 11, and the side wall 24 and the rear substrate 12 are provided. The sealing material 21b may be provided between the side wall 24 itself and the peripheral part of the side wall 24b to energize the side wall 24 itself. In this case, it is not necessary to provide the conductive member 22 in the sealing material 21 as a current-carrying member for heating and melting the sealing material 21, the manufacturing process can be simplified, the number of members can be reduced, and the manufacturing cost can be reduced. .

Further, irregularities may be formed on the surface of the conductive member 22 which is in contact with the sealing materials 21a and 21b. In this case, when melting the sealing material 21, between the members to be sealed, that is, between the conductive member 22 and the front substrate 11, between the conductive member 22 and the rear substrate 12, and between the conductive member 22 and the side wall 13. It is possible to suppress mechanical displacement between the front substrate 11 and the rear substrate 12, and to prevent positional displacement between the front substrate 11 and the rear substrate 12.

Further, the structure of the phosphor screen 15 and the structure of the electron-emitting device 18 are not limited to those in the above-described embodiment, and other structures may be used. Further, the sealing material may be filled only on one of the two surfaces to be sealed.

Furthermore, the present invention is not limited to a display device requiring a vacuum envelope such as an FED or SED, but may be applied to other display devices such as a PDP in which a discharge gas is injected after a vacuum is applied. It is valid.

A plurality of embodiments to which the present invention is applied will be described below. (Embodiment 1) An embodiment in which the front substrate 11 and the rear substrate 12 shown in FIGS. 5 and 6 are applied to a 36-inch TV FED display device will be described. The main configuration is the same as that described in the above embodiment.

Both the front substrate 11 and the rear substrate 12 are made of a glass material having a thickness of 2.8 mm, and the side wall 13 is 1.1 mm.
It is made of glass material. The sealing material 21a provided on the peripheral portion of the front substrate 11 and the sealing material 21b provided on the side wall 13 of the rear substrate 12 are In, which melts at about 160 ° C., and have a width of 3 to 5 mm and a thickness on one side. 0.1 to
It was formed to 0.3 mm.

As shown in FIG. 7A, the conductive member 22 is made of a nickel alloy in the shape of a frame plate having a width of 1 mm and a thickness of 0.1 mm. Electrodes 22a and 22b of the conductive member 22
Are provided at two target positions of the diagonal part where interference with the X wiring and the Y wiring of the opposing rear substrate 12 is small.
The conductive member 22 has a cross-sectional area of 0.1 mm ² or more in order to secure a sufficient amount of current when energized. Also, the electrode 2
The resistance between 2a and 22b is 0.05 to 0.5 at room temperature.
It was set to about Ω.

Then, the front substrate 11 and the rear substrate 12 are placed in a vacuum chamber together with the conductive member 22, and after degassing and getter film formation in the vacuum chamber, the state shown in FIG. The conductive member 22 is sandwiched between the side wall 13 and the side wall 13 provided upright on the rear substrate 12, and the pressure members 23a and 23b are loaded. That is, the front substrate 1
1, the rear substrate 12, and the conductive member 22, about 100 ℃
Placed in place at the temperature of
With the load of about 50kg. Further, the power source 25 is connected to the electrodes 22a and 22b of the conductive member 22.

In this state, the electrode 22 is connected via the power supply 25.
A direct current of 130 A is applied to a and 22b for 40 seconds to heat the conductive member 22 and melt the sealing members 21a and 21b uniformly and sufficiently over the entire circumference thereof. After the energization is stopped, the front substrate 1 and the rear substrate 12 are held for 30 seconds to radiate the heat of the sealing members 21a and 21b whose temperature has been raised by the energization heating to the front substrate 11 and the side wall 13, and the sealing member 21.
A and 21b were cooled and solidified.

When the vacuum envelope was manufactured in this way, the time required for sealing was reduced from about 30 minutes in the past to about 1 minute, and the apparatus for sealing was simple. We were able to.

(Second Embodiment) The main structure of the second embodiment is the same as that of the first embodiment. In the second embodiment, in the above-described sealing step, a sinusoidal alternating current with an effective current value of 120 A varying at a commercial frequency of 60 Hz is applied to the electrode 22 of the conductive member 22.
A vacuum was applied to a and 22b for 60 seconds and then held for 1 minute to form a vacuum envelope.

(Third Embodiment) The main structure of the third embodiment is the same as that of the first embodiment. In the third embodiment, in the sealing process described above, a frequency higher than the commercial frequency, for example, 300 k
A sinusoidal alternating current with an effective current value of 4 A varying at Hz was applied to the electrodes 22a and 22b of the conductive member 22 for 30 seconds and then held for 1 minute to form a vacuum envelope.

(Fourth Embodiment) The main structure of the fourth embodiment is the same as that of the first embodiment. In Example 4, as shown in FIG. 10, in addition to the bonding between the front substrate 11 and the side wall 13 described above, the bonding between the rear substrate 12 and the side wall 13 was also performed in the vacuum chamber using the above-described conductive member. . At this time, the front substrate 1
In the joint portion where the peripheral edge portion of 1 and the side wall 13 face each other, a rectangular frame-shaped sealing material 21a, the conductive member 22 shown in FIG.
And the rectangular frame-shaped sealing material 21b was provided. Further, the rectangular frame-shaped sealing material 21a, the conductive member 22 shown in FIG. 7 (b), and the rectangular frame-shaped sealing material 21b are provided at the joint where the peripheral edge of the rear substrate 12 and the side wall 13 face each other. Provided.

Then, the front substrate 11, the rear substrate 12, and the side wall 13 are superposed at the predetermined positions as described above, and the electrodes 22a and 22b are energized at 100 A for 150 seconds through the power source 25, and at the same time, the electrodes 22c and 22d are simultaneously fed. Power on 2
100 A was energized for 150 seconds via No. 6. After that, the sealing members 21a and 21b were cooled and solidified by holding for about 2 minutes to seal the front substrate 11, the rear substrate 12, and the side wall 13.

(Fifth Embodiment) The main configuration of the fifth embodiment is the same as that of the first embodiment. In the fifth embodiment, as shown in FIG. 11, the front substrate 11 and the rear substrate 12 are joined via the conductive side wall 24 and the side wall 24 itself is energized without using the conductive member 22 described above. Front substrate 11
The rear substrate 12 is sealed. At this time, as the side wall 24, a rectangular frame-shaped SU having a width of 2 mm and a height of 1.1 mm is used.
Using S304, energize 200A for 30 seconds, then 1
After 40 A was energized for 10 seconds, the front substrate 11 and the rear substrate 12 were held for about 2 minutes to cool and separate the sealing materials 21a and 21b.

[0065]

As described above, according to the display device and the manufacturing method of the display device of the present invention, the time required for the sealing process for sealing the peripheral portions of the front substrate and the rear substrate can be shortened, The peripheral portion can be securely and easily sealed.

[Brief description of drawings]

FIG. 1 is a perspective view showing the appearance of an FED according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a configuration on a rear substrate side of the FED of FIG.

FIG. 3 is a sectional view of the FED of FIG.

4 is an enlarged plan view showing a part of a phosphor screen formed on a front substrate of the FED shown in FIG.

5 is a plan view of the front substrate of the FED shown in FIG. 1 as viewed from the inside thereof.

FIG. 6 is a plan view showing a rear substrate, side walls, and spacers of the FED shown in FIG.

FIG. 7 is a plan view showing a conductive member used for manufacturing the FED of FIG.

FIG. 8 is a flowchart showing a flow of assembling in a vacuum chamber in the manufacturing process of the FED.

FIG. 9 is a schematic view showing a manufacturing apparatus for manufacturing the FED of FIG.

FIG. 10 is a schematic view for explaining an embodiment in which the front substrate, the rear substrate and the side wall are sealed.

FIG. 11 is a schematic view for explaining an embodiment in which a conductive side wall is energized and sealed.

[Explanation of symbols]

10 ... Display device, 11 ... Front substrate, 12 ... rear substrate, 13 ... Side wall, 14 ... Spacer, 15 ... Phosphor screen, 18 ... Electron emitting device, 21a, 21b ... sealing material, 22 ... Conductive member, 22a, 22b, 22c, 22d ... Electrodes, 23a, 23b ... Pressurizing device, 25, 26, 27 ... Power supply.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masahiro Yokota             2 shares, 1-9-1 Harara-cho, Fukaya City, Saitama Prefecture             Company Toshiba Fukaya Factory (72) Inventor Koji Nishimura             2 shares, 1-9-1 Harara-cho, Fukaya City, Saitama Prefecture             Company Toshiba Fukaya Factory F-term (reference) 5C012 AA05 BC03                 5C036 EE01 EE03 EE14 EE17 EF01                       EF06 EF09 EG02 EG06 EH11                       EH24

Claims (25)

[Claims] 1. An envelope comprising: a front substrate; a rear substrate arranged to face the front substrate; and a sealing means for sealing the peripheral portions of the front substrate and the rear substrate. The attaching means includes a conductive sealing material that is heated and melted by energization to seal the peripheral edge portion, and a conductive member having a melting point higher than the melting point of the sealing material and disposed on the peripheral edge portion. A display device characterized by. 2. An envelope having a front substrate, a back substrate arranged to face the front substrate, and a sealing means for sealing the peripheral portions of the front substrate and the back substrate, the envelope comprising: The attaching means includes a sealing material that is melted by heating to seal the peripheral portion, and a conductive member that is disposed in the sealing material to heat the sealing material and that is heated by energization. Display device. 3. A frame-shaped side wall composed of a front substrate, a back substrate arranged to face the front substrate, and a conductive member provided at a peripheral portion of the front substrate and the back substrate between the front substrate and the back substrate. And a sealing material which is provided at a joint between at least one of the front substrate and the rear substrate and the side wall and which is heated and melted by energizing the side wall to seal the joint. A display device comprising an enclosure. 4. A front substrate, a back substrate arranged to face the front substrate, frame-shaped side walls provided on the peripheral portions of the front substrate and the back substrate between the front substrate and the back substrate, and the front face. An envelope having sealing means for sealing a joint between at least one of the substrate and the rear substrate and the side wall, the sealing means being melted by heating to seal the peripheral portion. A display device, comprising: a sealing material for heat treatment; and a conductive member disposed in the sealing material for heating the sealing material and heated by an electric current. 5. The display device according to claim 2, wherein the sealing material has conductivity. 6. The display device according to claim 1, wherein the sealing material contains In or an alloy containing In. 7. The display device according to claim 6, wherein the sealing material melts or softens at 300 ° C. or lower. 8. The display device according to claim 1, wherein the conductive member has an uneven surface. 9. The conductive member has at least two connecting terminals extending to the outside of the envelope, and a power source is connected to these connecting terminals. The display device according to any one of claims. 10. The cross-sectional area of the conductive member is 0.1 mm.
The display device according to claim 1, wherein the display device is ^two or more. 11. The conductive member is made of Fe, Cr, Ni,
The display device according to claim 1, further comprising at least one of Al, Cu, Ag, Co, and Ti. 12. The conductive member is formed of a material having a melting point of 500 ° C. or higher.
5. The display device according to any one of 4 to 4. 13. The display device according to claim 1, wherein a thermal expansion coefficient of the conductive member is 80 to 120% of a thermal expansion coefficient of the sealing material. 14. The display device according to claim 4, wherein a coefficient of thermal expansion of the conductive member is 80 to 120% of a coefficient of thermal expansion of the side wall. 15. The coefficient of thermal expansion of the conductive member is between the smallest coefficient of thermal expansion and the largest coefficient of thermal expansion of the front substrate, the rear substrate and the side wall. The display device according to claim 4. 16. The display device according to claim 1, wherein an electron source and a phosphor are provided inside the envelope, and the inside is evacuated. 17. A method of manufacturing a display device comprising an envelope in which a front substrate and a rear substrate arranged to face the front substrate are sealed at their peripheral portions, wherein the peripheral portions are heated and melted by energization. A conductive sealing material to be used, and a conductive member having a melting point higher than the melting point of the sealing material are provided, and the conductive material and the sealing material are energized to heat and melt the sealing material, A method of manufacturing a display device, comprising sealing a front substrate and a rear substrate at their peripheral portions. 18. A method of manufacturing a display device comprising an envelope in which a front substrate and a back substrate arranged to face the front substrate are sealed at their peripheral portions, wherein the peripheral portions are melted by heating. A sealing member is provided, and a conductive member for heating by energization is provided in the sealing material. By energizing the energizing member, the sealing material is heated and melted, and the front substrate and the rear substrate are provided with peripheral portions thereof. A method for manufacturing a display device, comprising: 19. An envelope provided with a front substrate and a rear substrate arranged to face the front substrate sealed together via conductive frame-like side walls provided between the substrates at their peripheral portions. In the method for manufacturing a display device, a sealing material that is heated and melted by energization is provided at a joint between at least one of the front substrate and the back substrate and the side wall, and the side wall is energized to heat the sealing material. A method for manufacturing a display device, which comprises melting and sealing the front substrate and the rear substrate at their peripheral portions. 20. A display device having an envelope in which a front substrate and a rear substrate arranged to face the front substrate are sealed via a frame-shaped side wall provided between the substrates at a peripheral portion thereof. In the manufacturing method, a sealing material that is melted by heating is provided at a joint between at least one of the front substrate and the rear substrate and the side wall, and a conductive member that is heated by electricity is provided in the sealing material. A method for manufacturing a display device, comprising heating and melting the sealing material by energizing a conductive member to seal the front substrate and the rear substrate at their peripheral portions. 21. The method of manufacturing a display device according to claim 17, wherein a direct current is applied to the conductive member via a power source connected to the conductive member. 22. The method of manufacturing a display device according to claim 17, wherein an alternating current having a commercial frequency is applied to the conductive member via a power source connected to the conductive member. . 23. The display device according to claim 17, wherein an alternating current having a frequency higher than a commercial frequency is applied to the conductive member via a power source connected to the conductive member. Manufacturing method. 24. The temperature of the front substrate and the rear substrate immediately before energizing the conductive member is set to be lower than the melting point of the sealing material.
A method for manufacturing a display device according to any one of 1. 25. The method of manufacturing a display device according to claim 24, wherein the difference between the temperature of the front substrate and the rear substrate and the melting point of the sealing material is 20 ° C. to 150 ° C.