WO2002101804A1 - Exposure device, device manufacturing method, and temperature stabilization flow passage device - Google Patents

Exposure device, device manufacturing method, and temperature stabilization flow passage device Download PDF

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Publication number
WO2002101804A1
WO2002101804A1 PCT/JP2002/005763 JP0205763W WO02101804A1 WO 2002101804 A1 WO2002101804 A1 WO 2002101804A1 JP 0205763 W JP0205763 W JP 0205763W WO 02101804 A1 WO02101804 A1 WO 02101804A1
Authority
WO
WIPO (PCT)
Prior art keywords
temperature
gas
exposure
flow passage
exposure chamber
Prior art date
Application number
PCT/JP2002/005763
Other languages
French (fr)
Japanese (ja)
Inventor
Yuzo Kato
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to JP2003504451A priority Critical patent/JPWO2002101804A1/en
Publication of WO2002101804A1 publication Critical patent/WO2002101804A1/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

An exposure device (10), comprising temperature stabilization flow passage devices (100A, 100B) forming a part of the flow passages for the gas supplied by a feeder (52, 56, 58, 62, 64) and, after suppressing a variation in temperature of the gas flowing thereinto, allowing the gas to flow out into a space inside an exposure chamber (16), for example, into a moving space of a wafer stage (WST) inside a main column (34) through jetting units (102A, 102B), whereby the gas with suppressed temperature variation can be supplied into the exposure chamber and, accordingly, the controllability of temperature in the exposure chamber can be increased by suppressing a variation in temperature of the gas in at least a part of the inside of the exposure chamber.
PCT/JP2002/005763 2001-06-11 2002-06-11 Exposure device, device manufacturing method, and temperature stabilization flow passage device WO2002101804A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003504451A JPWO2002101804A1 (en) 2001-06-11 2002-06-11 Exposure apparatus, device manufacturing method, and temperature stabilized flow path apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-176149 2001-06-11
JP2001176149 2001-06-11

Publications (1)

Publication Number Publication Date
WO2002101804A1 true WO2002101804A1 (en) 2002-12-19

Family

ID=19017182

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/005763 WO2002101804A1 (en) 2001-06-11 2002-06-11 Exposure device, device manufacturing method, and temperature stabilization flow passage device

Country Status (2)

Country Link
JP (1) JPWO2002101804A1 (en)
WO (1) WO2002101804A1 (en)

Cited By (20)

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JP2005062462A (en) * 2003-08-12 2005-03-10 Hoya Corp Method for housing mask blank, mask blank housing body and method for manufacturing mask blank
WO2006028188A1 (en) * 2004-09-10 2006-03-16 Nikon Corporation Stage apparatus and exposure apparatus
JP2006287160A (en) * 2005-04-05 2006-10-19 Nikon Corp Exposure device and manufacturing method therefor
JP2007158305A (en) * 2005-10-21 2007-06-21 Asml Netherlands Bv Gas shower, lithography apparatus, and use of gas shower
JP2007184576A (en) * 2005-12-21 2007-07-19 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7838182B2 (en) 2003-07-08 2010-11-23 Hoya Corporation Container for housing a mask blank, method of housing a mask blank, and mask blank package
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US8446579B2 (en) 2008-05-28 2013-05-21 Nikon Corporation Inspection device and inspecting method for spatial light modulator, illumination optical system, method for adjusting the illumination optical system, exposure apparatus, and device manufacturing method
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US8462317B2 (en) 2007-10-16 2013-06-11 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8520291B2 (en) 2007-10-16 2013-08-27 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US20130271945A1 (en) 2004-02-06 2013-10-17 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US8675177B2 (en) 2003-04-09 2014-03-18 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger in first and second pairs of areas
US8854601B2 (en) 2005-05-12 2014-10-07 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9097981B2 (en) 2007-10-12 2015-08-04 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US9140993B2 (en) 2003-10-28 2015-09-22 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9164209B2 (en) 2003-11-20 2015-10-20 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical member with optical rotatory power having different thicknesses to rotate linear polarization direction
CN113204175A (en) * 2021-04-25 2021-08-03 华虹半导体(无锡)有限公司 Exposure method of immersion lithography machine
CN113406864A (en) * 2021-05-24 2021-09-17 上海顺灏新材料科技股份有限公司 Integrated monitoring system and monitoring method for peripheral equipment of photoetching machine

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6660179B2 (en) * 2015-12-28 2020-03-11 キヤノン株式会社 Exposure apparatus and article manufacturing method

Citations (4)

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Publication number Priority date Publication date Assignee Title
JPS6418002A (en) * 1987-07-14 1989-01-20 Nikon Corp Measuring apparatus
EP0838728A2 (en) * 1996-10-24 1998-04-29 Nikon Corporation Precision stage interferometer system with air duct
JPH1126363A (en) * 1997-06-30 1999-01-29 Nikon Corp Aligner
JP2000243684A (en) * 1999-02-18 2000-09-08 Canon Inc Aligner and device manufacture

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6418002A (en) * 1987-07-14 1989-01-20 Nikon Corp Measuring apparatus
EP0838728A2 (en) * 1996-10-24 1998-04-29 Nikon Corporation Precision stage interferometer system with air duct
JPH1126363A (en) * 1997-06-30 1999-01-29 Nikon Corp Aligner
JP2000243684A (en) * 1999-02-18 2000-09-08 Canon Inc Aligner and device manufacture

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* Cited by examiner, † Cited by third party
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US9146474B2 (en) 2003-04-09 2015-09-29 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger and different linear polarization states in an on-axis area and a plurality of off-axis areas
US9164393B2 (en) 2003-04-09 2015-10-20 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger in four areas
US9885959B2 (en) 2003-04-09 2018-02-06 Nikon Corporation Illumination optical apparatus having deflecting member, lens, polarization member to set polarization in circumference direction, and optical integrator
US8675177B2 (en) 2003-04-09 2014-03-18 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger in first and second pairs of areas
US9678437B2 (en) 2003-04-09 2017-06-13 Nikon Corporation Illumination optical apparatus having distribution changing member to change light amount and polarization member to set polarization in circumference direction
US7838182B2 (en) 2003-07-08 2010-11-23 Hoya Corporation Container for housing a mask blank, method of housing a mask blank, and mask blank package
JP2005062462A (en) * 2003-08-12 2005-03-10 Hoya Corp Method for housing mask blank, mask blank housing body and method for manufacturing mask blank
US9760014B2 (en) 2003-10-28 2017-09-12 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9423697B2 (en) 2003-10-28 2016-08-23 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9423698B2 (en) 2003-10-28 2016-08-23 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9244359B2 (en) 2003-10-28 2016-01-26 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9146476B2 (en) 2003-10-28 2015-09-29 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9140992B2 (en) 2003-10-28 2015-09-22 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9140993B2 (en) 2003-10-28 2015-09-22 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9885872B2 (en) 2003-11-20 2018-02-06 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical integrator and polarization member that changes polarization state of light
US9164209B2 (en) 2003-11-20 2015-10-20 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical member with optical rotatory power having different thicknesses to rotate linear polarization direction
US10281632B2 (en) 2003-11-20 2019-05-07 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical member with optical rotatory power to rotate linear polarization direction
US9429848B2 (en) 2004-02-06 2016-08-30 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US9423694B2 (en) 2004-02-06 2016-08-23 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US10241417B2 (en) 2004-02-06 2019-03-26 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US10234770B2 (en) 2004-02-06 2019-03-19 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US10007194B2 (en) 2004-02-06 2018-06-26 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US20130271945A1 (en) 2004-02-06 2013-10-17 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US9140990B2 (en) 2004-02-06 2015-09-22 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
WO2006028188A1 (en) * 2004-09-10 2006-03-16 Nikon Corporation Stage apparatus and exposure apparatus
JPWO2006028188A1 (en) * 2004-09-10 2008-05-08 株式会社ニコン Stage apparatus and exposure apparatus
JP2006287160A (en) * 2005-04-05 2006-10-19 Nikon Corp Exposure device and manufacturing method therefor
US9891539B2 (en) 2005-05-12 2018-02-13 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9310696B2 (en) 2005-05-12 2016-04-12 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US8854601B2 (en) 2005-05-12 2014-10-07 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9360763B2 (en) 2005-05-12 2016-06-07 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9429851B2 (en) 2005-05-12 2016-08-30 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
JP4568710B2 (en) * 2005-10-21 2010-10-27 エーエスエムエル ネザーランズ ビー．ブイ． Gas shower
JP2007158305A (en) * 2005-10-21 2007-06-21 Asml Netherlands Bv Gas shower, lithography apparatus, and use of gas shower
JP2007184576A (en) * 2005-12-21 2007-07-19 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
JP4576373B2 (en) * 2005-12-21 2010-11-04 エーエスエムエル ネザーランズ ビー．ブイ． Lithographic apparatus and device manufacturing method
US9057963B2 (en) 2007-09-14 2015-06-16 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US9366970B2 (en) 2007-09-14 2016-06-14 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US10101666B2 (en) 2007-10-12 2018-10-16 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US9097981B2 (en) 2007-10-12 2015-08-04 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US8462317B2 (en) 2007-10-16 2013-06-11 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8508717B2 (en) 2007-10-16 2013-08-13 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8520291B2 (en) 2007-10-16 2013-08-27 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US9857599B2 (en) 2007-10-24 2018-01-02 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9341954B2 (en) 2007-10-24 2016-05-17 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9057877B2 (en) 2007-10-24 2015-06-16 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US9678332B2 (en) 2007-11-06 2017-06-13 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US8446579B2 (en) 2008-05-28 2013-05-21 Nikon Corporation Inspection device and inspecting method for spatial light modulator, illumination optical system, method for adjusting the illumination optical system, exposure apparatus, and device manufacturing method
US8456624B2 (en) 2008-05-28 2013-06-04 Nikon Corporation Inspection device and inspecting method for spatial light modulator, illumination optical system, method for adjusting the illumination optical system, exposure apparatus, and device manufacturing method
CN113204175A (en) * 2021-04-25 2021-08-03 华虹半导体(无锡)有限公司 Exposure method of immersion lithography machine
CN113204175B (en) * 2021-04-25 2022-10-28 华虹半导体(无锡)有限公司 Exposure method of immersion lithography machine
CN113406864A (en) * 2021-05-24 2021-09-17 上海顺灏新材料科技股份有限公司 Integrated monitoring system and monitoring method for peripheral equipment of photoetching machine

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