USD873227S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD873227S1
USD873227S1 US29/694,650 US201929694650F USD873227S US D873227 S1 USD873227 S1 US D873227S1 US 201929694650 F US201929694650 F US 201929694650F US D873227 S USD873227 S US D873227S
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United States
Prior art keywords
semiconductor device
view
ornamental design
designs
broken lines
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Active
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US29/694,650
Inventor
Rei YONEYAMA
Nobuchika AOKI
Hideki Tsukamoto
Akihiko Yamashita
Masayuki Ando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Filing date
Publication date
Priority claimed from JPD2017-23416F external-priority patent/JP1604090S/ja
Priority claimed from JPD2017-23417F external-priority patent/JP1604091S/ja
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to US29/694,650 priority Critical patent/USD873227S1/en
Assigned to MITSUBISHI ELECTRIC CORPORATION reassignment MITSUBISHI ELECTRIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ANDO, MASAYUKI, TSUKAMOTO, HIDEKI, Aoki, Nobuchika, YAMASHITA, AKIHIKO, YONEYAMA, REI
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FIG. 1 is a front, bottom and right side perspective view of a semiconductor device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a top view thereof;
FIG. 5 is a bottom view thereof;
FIG. 6 is a left side view thereof; and,
FIG. 7 is a right side view thereof.
The broken lines illustrate portions of the semiconductor device that form no part of the claimed designs.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/694,650 2017-10-23 2019-06-12 Semiconductor device Active USD873227S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/694,650 USD873227S1 (en) 2017-10-23 2019-06-12 Semiconductor device

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2017-023416 2017-02-10
JP2017-023417 2017-02-10
JPD2017-23416F JP1604090S (en) 2017-10-23 2017-10-23
JPD2017-23417F JP1604091S (en) 2017-10-23 2017-10-23
US29/643,231 USD864884S1 (en) 2017-10-23 2018-04-05 Semiconductor device
US29/694,650 USD873227S1 (en) 2017-10-23 2019-06-12 Semiconductor device

Related Parent Applications (1)

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US29/643,231 Division USD864884S1 (en) 2017-10-23 2018-04-05 Semiconductor device

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USD873227S1 true USD873227S1 (en) 2020-01-21

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US29/643,231 Active USD864884S1 (en) 2017-10-23 2018-04-05 Semiconductor device
US29/694,650 Active USD873227S1 (en) 2017-10-23 2019-06-12 Semiconductor device

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD893439S1 (en) * 2018-05-07 2020-08-18 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD903613S1 (en) * 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD920937S1 (en) * 2019-03-29 2021-06-01 Shindengen Electric Manufacturing Co., Ltd. Power module device containing semiconductor elements
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
USD975666S1 (en) * 2020-07-31 2023-01-17 Rohm Co., Ltd. Semiconductor module

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Publication number Priority date Publication date Assignee Title
JP1643135S (en) * 2019-03-15 2019-10-07
JP1644633S (en) * 2019-03-26 2019-11-05
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
USD939458S1 (en) * 2019-05-29 2021-12-28 Diodes Incorporated Leadframe
USD940090S1 (en) * 2019-05-29 2022-01-04 Diodes Incorporated Leadframe
JP1656709S (en) * 2019-05-31 2020-04-06
TWD206651S (en) * 2020-04-24 2020-08-21 財團法人工業技術研究院 Power module

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USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module
USD814431S1 (en) * 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device
USD847103S1 (en) * 2017-09-07 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD858467S1 (en) * 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device

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USD288557S (en) 1984-09-10 1987-03-03 Motorola, Inc. Semiconductor housing
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US5512782A (en) * 1993-10-13 1996-04-30 Fuji Electric Co., Ltd. Semiconductor device for DC/AC converter
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USD364384S (en) * 1994-05-23 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD396450S (en) * 1996-12-24 1998-07-28 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
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US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
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USD712853S1 (en) 2012-12-21 2014-09-09 Fuji Electric Co., Ltd. Semiconductor module
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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD893439S1 (en) * 2018-05-07 2020-08-18 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
USD903613S1 (en) * 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD920937S1 (en) * 2019-03-29 2021-06-01 Shindengen Electric Manufacturing Co., Ltd. Power module device containing semiconductor elements
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
USD975666S1 (en) * 2020-07-31 2023-01-17 Rohm Co., Ltd. Semiconductor module

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