USD813182S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD813182S1
USD813182S1 US29/592,124 US201729592124F USD813182S US D813182 S1 USD813182 S1 US D813182S1 US 201729592124 F US201729592124 F US 201729592124F US D813182 S USD813182 S US D813182S
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US
United States
Prior art keywords
semiconductor device
view
ornamental design
new design
device showing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/592,124
Inventor
Toshikazu Imai
Ryosuke Okawa
Eiji Yasuda
Takeshi Imamura
Kazuma Yoshida
Shigetoshi Sota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nuvoton Technology Corp Japan
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. reassignment PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IMAI, Toshikazu, IMAMURA, TAKESHI, OKAWA, Ryosuke, SOTA, Shigetoshi, YASUDA, EIJI, YOSHIDA, KAZUMA
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Publication of USD813182S1 publication Critical patent/USD813182S1/en
Assigned to PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD. reassignment PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
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Description

FIG. 1 is a front perspective view of a first embodiment of a semiconductor device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a first side view thereof;
FIG. 5 is a second side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a front perspective view of a second embodiment of a semiconductor device showing our new design;
FIG. 9 is a front view thereof;
FIG. 10 is a rear view thereof;
FIG. 11 is a first side view thereof;
FIG. 12 is a second side view thereof;
FIG. 13 is a top view thereof; and,
FIG. 14 is a bottom view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/592,124 2016-08-02 2017-01-26 Semiconductor device Active USD813182S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201630362734 2016-08-02
CN201630362734 2016-08-02

Publications (1)

Publication Number Publication Date
USD813182S1 true USD813182S1 (en) 2018-03-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/592,124 Active USD813182S1 (en) 2016-08-02 2017-01-26 Semiconductor device

Country Status (2)

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US (1) USD813182S1 (en)
JP (2) JP1582228S (en)

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD864883S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD864882S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD865690S1 (en) * 2017-09-27 2019-11-05 Hamamatsu Photonics K.K. Part for semiconductor device
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD930601S1 (en) * 2019-04-26 2021-09-14 The Noco Company Circuit board
USD934821S1 (en) 2019-07-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD937232S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD938374S1 (en) * 2019-09-09 2021-12-14 The Noco Company Circuit board
USD944219S1 (en) * 2019-09-09 2022-02-22 The Noco Company Circuit board
USD949117S1 (en) * 2019-09-09 2022-04-19 The Noco Company Circuit board
USD951213S1 (en) 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951212S1 (en) 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951215S1 (en) 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951214S1 (en) 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD956707S1 (en) * 2019-09-26 2022-07-05 Lapis Semiconductor Co., Ltd. Circuit board
USD958762S1 (en) * 2019-09-09 2022-07-26 The Noco Company Circuit board
USD1004127S1 (en) * 2021-04-09 2023-11-07 Ananda Devices Inc. Microfluidic slab
USD1004130S1 (en) * 2021-04-09 2023-11-07 Ananda Devices Inc. Microfluidic slab
USD1009777S1 (en) 2019-09-09 2024-01-02 The Noco Company Battery
USD1009815S1 (en) 2021-01-22 2024-01-02 The Noco Company Circuit board
USD1010591S1 (en) 2021-01-22 2024-01-09 The Noco Company Circuit board
USD1012872S1 (en) 2021-01-22 2024-01-30 The Noco Company Circuit board

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USD318461S (en) * 1988-04-13 1991-07-23 Ibiden Co., Ltd. Semi-conductor mounting substrate
USD319045S (en) * 1988-04-13 1991-08-13 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
USD319629S (en) * 1988-04-13 1991-09-03 Ibiden Co., Ltd. Semiconductor substrate with conducting pattern
USD319814S (en) * 1988-04-13 1991-09-10 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
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USD457146S1 (en) * 2000-11-29 2002-05-14 Kabushiki Kaisha Toshiba Substrate for a semiconductor element
USD466093S1 (en) * 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
USD487430S1 (en) * 2002-07-10 2004-03-09 Matsushita Electric Industrial Co., Ltd. Semiconductor memory element
US6753482B1 (en) * 2002-05-06 2004-06-22 Micron Technology, Inc. Semiconductor component with adjustment circuitry
US6836002B2 (en) * 2000-03-09 2004-12-28 Sharp Kabushiki Kaisha Semiconductor device
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
US20060043544A1 (en) * 2004-08-31 2006-03-02 Sharp Kabushiki Kaisha Semiconductor device, semiconductor module, and manufacturing method of semiconductor device
US20060097374A1 (en) * 2004-11-10 2006-05-11 Yoshimi Egawa Multi chip package
USD540272S1 (en) * 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
USD598380S1 (en) * 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD691101S1 (en) * 2011-11-08 2013-10-08 Seiko Epson Corporation Circuit board for an ink cartridge
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD754083S1 (en) * 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module

Patent Citations (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4949158A (en) * 1987-07-24 1990-08-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD318461S (en) * 1988-04-13 1991-07-23 Ibiden Co., Ltd. Semi-conductor mounting substrate
USD319045S (en) * 1988-04-13 1991-08-13 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
USD319629S (en) * 1988-04-13 1991-09-03 Ibiden Co., Ltd. Semiconductor substrate with conducting pattern
USD319814S (en) * 1988-04-13 1991-09-10 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
US5757082A (en) * 1995-07-31 1998-05-26 Rohm Co., Ltd. Semiconductor chips, devices incorporating same and method of making same
US5994772A (en) * 1996-12-19 1999-11-30 Lg Semicon Co., Ltd. Semiconductor package
USD427159S (en) * 1997-06-27 2000-06-27 Sony Corporation Semiconductor element
US6307269B1 (en) * 1997-07-11 2001-10-23 Hitachi, Ltd. Semiconductor device with chip size package
US6836002B2 (en) * 2000-03-09 2004-12-28 Sharp Kabushiki Kaisha Semiconductor device
USD457146S1 (en) * 2000-11-29 2002-05-14 Kabushiki Kaisha Toshiba Substrate for a semiconductor element
USD456367S1 (en) * 2000-12-15 2002-04-30 Protek Devices, Lp Semiconductor chip
USD466093S1 (en) * 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
USD471167S1 (en) * 2001-04-27 2003-03-04 Taiyo Yuden Co., Ltd. Hybrid integrated circuit board
US6753482B1 (en) * 2002-05-06 2004-06-22 Micron Technology, Inc. Semiconductor component with adjustment circuitry
USD487430S1 (en) * 2002-07-10 2004-03-09 Matsushita Electric Industrial Co., Ltd. Semiconductor memory element
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
US20060043544A1 (en) * 2004-08-31 2006-03-02 Sharp Kabushiki Kaisha Semiconductor device, semiconductor module, and manufacturing method of semiconductor device
US20060097374A1 (en) * 2004-11-10 2006-05-11 Yoshimi Egawa Multi chip package
USD540272S1 (en) * 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
USD598380S1 (en) * 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD691101S1 (en) * 2011-11-08 2013-10-08 Seiko Epson Corporation Circuit board for an ink cartridge
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD752000S1 (en) * 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
USD754083S1 (en) * 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
USD775093S1 (en) * 2013-10-17 2016-12-27 Vlt, Inc. Electric terminal
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD864883S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD864882S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD865690S1 (en) * 2017-09-27 2019-11-05 Hamamatsu Photonics K.K. Part for semiconductor device
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD1009778S1 (en) 2019-04-26 2024-01-02 The Noco Company Battery
USD1003842S1 (en) * 2019-04-26 2023-11-07 The Noco Company Circuit board
USD930601S1 (en) * 2019-04-26 2021-09-14 The Noco Company Circuit board
USD1003822S1 (en) 2019-04-26 2023-11-07 The Noco Company Battery
USD937793S1 (en) * 2019-04-26 2021-12-07 The Noco Company Circuit board
USD937792S1 (en) * 2019-04-26 2021-12-07 The Noco Company Circuit board
USD934821S1 (en) 2019-07-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD944219S1 (en) * 2019-09-09 2022-02-22 The Noco Company Circuit board
USD938374S1 (en) * 2019-09-09 2021-12-14 The Noco Company Circuit board
USD949117S1 (en) * 2019-09-09 2022-04-19 The Noco Company Circuit board
USD1009777S1 (en) 2019-09-09 2024-01-02 The Noco Company Battery
USD958762S1 (en) * 2019-09-09 2022-07-26 The Noco Company Circuit board
USD989014S1 (en) * 2019-09-09 2023-06-13 The Noco Company Circuit board
USD1001753S1 (en) 2019-09-09 2023-10-17 The Noco Company Circuit board
USD956707S1 (en) * 2019-09-26 2022-07-05 Lapis Semiconductor Co., Ltd. Circuit board
USD938925S1 (en) * 2019-10-24 2021-12-21 Nuvoton Technology Corporation Japan Semiconductor device
USD937232S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD937233S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD951212S1 (en) 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951214S1 (en) 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951215S1 (en) 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951213S1 (en) 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD1009815S1 (en) 2021-01-22 2024-01-02 The Noco Company Circuit board
USD1010591S1 (en) 2021-01-22 2024-01-09 The Noco Company Circuit board
USD1012872S1 (en) 2021-01-22 2024-01-30 The Noco Company Circuit board
USD1004127S1 (en) * 2021-04-09 2023-11-07 Ananda Devices Inc. Microfluidic slab
USD1004128S1 (en) * 2021-04-09 2023-11-07 Ananda Devices Inc. Microfluidic slab
USD1004130S1 (en) * 2021-04-09 2023-11-07 Ananda Devices Inc. Microfluidic slab
USD1004129S1 (en) * 2021-04-09 2023-11-07 Ananda Devices Inc. Microfluidic slab
USD1016323S1 (en) * 2021-04-09 2024-02-27 Ananda Devices Inc. Microfluidic slab

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Publication number Publication date
JP1582228S (en) 2017-07-24
JP1581768S (en) 2017-07-24

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