USD911298S1 - Chip - Google Patents

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Publication number
USD911298S1
USD911298S1 US29/733,401 US202029733401F USD911298S US D911298 S1 USD911298 S1 US D911298S1 US 202029733401 F US202029733401 F US 202029733401F US D911298 S USD911298 S US D911298S
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US
United States
Prior art keywords
chip
view
ornamental design
design
perspective
Prior art date
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Active
Application number
US29/733,401
Inventor
Krzysztof Krasnopolski
David Schmid
Fatma Burcu Celikkol Zijlstra
Joanna Alicja Borek-Donten
Ruedi Bieri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stat Peel AG
Original Assignee
Stat Peel AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stat Peel AG filed Critical Stat Peel AG
Priority to US29/733,401 priority Critical patent/USD911298S1/en
Application granted granted Critical
Publication of USD911298S1 publication Critical patent/USD911298S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of the chip, showing our new design;
FIG. 2 is a top view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a front view thereof;
FIG. 5 is a rear view thereof;
FIG. 6 is a left side view thereof; and,
FIG. 7 is a right side view thereof.
The broken lines shown in the drawings represent portions of the chip that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a chip, as shown and described.
US29/733,401 2017-02-17 2020-05-01 Chip Active USD911298S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/733,401 USD911298S1 (en) 2017-02-17 2020-05-01 Chip

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
XHDM096232 2017-02-17
WODM/096233 2017-02-17
XHDM096233 2017-02-17
WODM/096232 2017-02-17
US29/614,262 USD887998S1 (en) 2017-02-17 2017-08-17 Chip
US29/733,401 USD911298S1 (en) 2017-02-17 2020-05-01 Chip

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/614,262 Division USD887998S1 (en) 2017-02-17 2017-08-17 Chip

Publications (1)

Publication Number Publication Date
USD911298S1 true USD911298S1 (en) 2021-02-23

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ID=71092780

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US29/614,262 Active USD887998S1 (en) 2017-02-17 2017-08-17 Chip
US29/733,401 Active USD911298S1 (en) 2017-02-17 2020-05-01 Chip

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US29/614,262 Active USD887998S1 (en) 2017-02-17 2017-08-17 Chip

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US (2) USD887998S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD940669S1 (en) * 2018-11-19 2022-01-11 Kokusai Electric Corporation Boat for substrate processing apparatus
USD941786S1 (en) * 2019-11-22 2022-01-25 T-Worx Holdings, LLC Circuit board
USD941788S1 (en) * 2020-03-06 2022-01-25 Norman R. Byrne Circuit board
USD947800S1 (en) * 2018-07-23 2022-04-05 CACI, Inc.—Federal Integrated module
USD973664S1 (en) * 2019-09-06 2022-12-27 Murata Manufacturing Co., Ltd. IC-chip for RFID tag

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD887998S1 (en) * 2017-02-17 2020-06-23 Stat Peel Ag Chip
JP1663818S (en) * 2018-12-26 2020-07-20
USD936025S1 (en) * 2018-12-26 2021-11-16 Lg Chem, Ltd. Flexible printed circuit board for battery module
TWD202895S (en) * 2019-03-27 2020-02-21 家登精密工業股份有限公司 Reticle pod connecting frame
JP1659716S (en) * 2019-08-29 2020-05-18
JP1659676S (en) 2019-08-29 2020-05-18
JP1659677S (en) * 2019-08-29 2020-05-18
JP1659675S (en) 2019-08-29 2020-05-18
JP1659673S (en) * 2019-08-29 2020-05-18
JP1659678S (en) 2019-08-29 2020-05-18
JP1659674S (en) * 2019-08-29 2020-05-18
JP1654981S (en) * 2019-08-30 2020-03-16
JP1654980S (en) * 2019-08-30 2020-03-16
JP1680214S (en) * 2020-08-21 2021-03-01
JP1680215S (en) * 2020-08-21 2021-03-01
JP1680216S (en) * 2020-08-21 2021-03-01
JP1680217S (en) * 2020-08-21 2021-03-01
JP1680501S (en) * 2020-08-21 2021-03-08

Citations (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD310514S (en) 1987-04-23 1990-09-11 Digital Equipment Corporation Chip cartridge
US5148266A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
US5148265A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
USD365092S (en) 1993-08-12 1995-12-12 Siemens Aktiengesellschaft Chipcard module
USD406822S (en) 1997-03-06 1999-03-16 Siemens Aktiengesellschaft Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module
USD430024S (en) 1998-11-04 2000-08-29 Affymetrix, Inc. Chip packaging device
US6201296B1 (en) 1996-09-23 2001-03-13 Siemens Aktiengesellschaft Semiconductor chip with protection against analyzing
US6211572B1 (en) 1995-10-31 2001-04-03 Tessera, Inc. Semiconductor chip package with fan-in leads
US6297561B1 (en) 1999-05-26 2001-10-02 United Microelectronics Corp. Semiconductor chip
US6307269B1 (en) 1997-07-11 2001-10-23 Hitachi, Ltd. Semiconductor device with chip size package
USD456367S1 (en) 2000-12-15 2002-04-30 Protek Devices, Lp Semiconductor chip
US6410355B1 (en) * 1998-06-11 2002-06-25 Sandisk Corporation Semiconductor package using terminals formed on a conductive layer of a circuit board
US6441473B1 (en) * 1997-09-12 2002-08-27 Agere Systems Guardian Corp. Flip chip semiconductor device
USD466873S1 (en) 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
US20050082375A1 (en) * 2003-10-20 2005-04-21 Renesas Technology Corp. IC card
US7307848B2 (en) * 2003-07-17 2007-12-11 Sandisk Corporation Memory card with raised portion
US7525200B2 (en) 2003-12-24 2009-04-28 Seiko Epson Corporation Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
US7538442B2 (en) * 2005-09-30 2009-05-26 Sharp Kabushiki Kaisha Semiconductor chip and semiconductor device
US20090230537A1 (en) 2008-03-12 2009-09-17 Yong Liu Semiconductor die package including embedded flip chip
US7830666B2 (en) * 2000-01-06 2010-11-09 Super Talent Electronics, Inc. Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board
US7838892B2 (en) * 2004-04-29 2010-11-23 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor chip and method for forming a contact structure for making electrical contact with an optoelectronic semiconductor chip
US7919873B2 (en) * 2001-09-17 2011-04-05 Megica Corporation Structure of high performance combo chip and processing method
US8148806B2 (en) * 2000-05-19 2012-04-03 Megica Corporation Multiple chips bonded to packaging structure with low noise and multiple selectable functions
US20120117315A1 (en) * 2009-07-23 2012-05-10 Kabushiki Kaisha Toshiba Semiconductor memory card
US8291144B2 (en) * 2009-08-14 2012-10-16 Sandisk Il Ltd. Dual interface card with backward and forward compatibility
USD675582S1 (en) 2011-06-27 2013-02-05 Uninet Imaging, Inc. Chip assembly
US20140106621A1 (en) * 2012-10-11 2014-04-17 Carry Technology Co., Ltd. Memory card adapter device
USD711842S1 (en) 2011-08-04 2014-08-26 Swisscom Ag Electronic chip card
USD715234S1 (en) 2013-04-18 2014-10-14 SemiLEDs Optoelectronics Co., Ltd. Flip chip
USD720354S1 (en) * 2011-11-22 2014-12-30 Kabushiki Kaisha Toshiba Module with built-in integrated circuits for use with IC card
USD727861S1 (en) 2013-08-24 2015-04-28 Apex Microelectronics Co., Ltd. Ink cartridge chip
USD728577S1 (en) * 2014-07-01 2015-05-05 Google Inc. Mobile device module
USD730906S1 (en) * 2014-07-01 2015-06-02 Google Inc. Mobile device module
USD736212S1 (en) 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD756317S1 (en) * 2014-08-26 2016-05-17 Féinics Amatech Teoranta Layout for contact pads and connection bridges of a transponder chip module
USD773467S1 (en) * 2015-11-12 2016-12-06 Samsung Electronics Co., Ltd. Memory card
USD864968S1 (en) * 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD887998S1 (en) * 2017-02-17 2020-06-23 Stat Peel Ag Chip

Patent Citations (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD310514S (en) 1987-04-23 1990-09-11 Digital Equipment Corporation Chip cartridge
US5148266A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
US5148265A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
USD365092S (en) 1993-08-12 1995-12-12 Siemens Aktiengesellschaft Chipcard module
US6211572B1 (en) 1995-10-31 2001-04-03 Tessera, Inc. Semiconductor chip package with fan-in leads
US6201296B1 (en) 1996-09-23 2001-03-13 Siemens Aktiengesellschaft Semiconductor chip with protection against analyzing
USD406822S (en) 1997-03-06 1999-03-16 Siemens Aktiengesellschaft Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module
US6307269B1 (en) 1997-07-11 2001-10-23 Hitachi, Ltd. Semiconductor device with chip size package
US6441473B1 (en) * 1997-09-12 2002-08-27 Agere Systems Guardian Corp. Flip chip semiconductor device
US6410355B1 (en) * 1998-06-11 2002-06-25 Sandisk Corporation Semiconductor package using terminals formed on a conductive layer of a circuit board
USD430024S (en) 1998-11-04 2000-08-29 Affymetrix, Inc. Chip packaging device
US6297561B1 (en) 1999-05-26 2001-10-02 United Microelectronics Corp. Semiconductor chip
US7830666B2 (en) * 2000-01-06 2010-11-09 Super Talent Electronics, Inc. Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board
US8148806B2 (en) * 2000-05-19 2012-04-03 Megica Corporation Multiple chips bonded to packaging structure with low noise and multiple selectable functions
USD456367S1 (en) 2000-12-15 2002-04-30 Protek Devices, Lp Semiconductor chip
US7919873B2 (en) * 2001-09-17 2011-04-05 Megica Corporation Structure of high performance combo chip and processing method
USD472528S1 (en) 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD466873S1 (en) 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
US7307848B2 (en) * 2003-07-17 2007-12-11 Sandisk Corporation Memory card with raised portion
US20050082375A1 (en) * 2003-10-20 2005-04-21 Renesas Technology Corp. IC card
US7525200B2 (en) 2003-12-24 2009-04-28 Seiko Epson Corporation Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
US7838892B2 (en) * 2004-04-29 2010-11-23 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor chip and method for forming a contact structure for making electrical contact with an optoelectronic semiconductor chip
US7538442B2 (en) * 2005-09-30 2009-05-26 Sharp Kabushiki Kaisha Semiconductor chip and semiconductor device
US20090230537A1 (en) 2008-03-12 2009-09-17 Yong Liu Semiconductor die package including embedded flip chip
US20120117315A1 (en) * 2009-07-23 2012-05-10 Kabushiki Kaisha Toshiba Semiconductor memory card
US8291144B2 (en) * 2009-08-14 2012-10-16 Sandisk Il Ltd. Dual interface card with backward and forward compatibility
USD675582S1 (en) 2011-06-27 2013-02-05 Uninet Imaging, Inc. Chip assembly
USD711842S1 (en) 2011-08-04 2014-08-26 Swisscom Ag Electronic chip card
USD720354S1 (en) * 2011-11-22 2014-12-30 Kabushiki Kaisha Toshiba Module with built-in integrated circuits for use with IC card
US20140106621A1 (en) * 2012-10-11 2014-04-17 Carry Technology Co., Ltd. Memory card adapter device
USD715234S1 (en) 2013-04-18 2014-10-14 SemiLEDs Optoelectronics Co., Ltd. Flip chip
USD727861S1 (en) 2013-08-24 2015-04-28 Apex Microelectronics Co., Ltd. Ink cartridge chip
USD728577S1 (en) * 2014-07-01 2015-05-05 Google Inc. Mobile device module
USD730906S1 (en) * 2014-07-01 2015-06-02 Google Inc. Mobile device module
USD736212S1 (en) 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD756317S1 (en) * 2014-08-26 2016-05-17 Féinics Amatech Teoranta Layout for contact pads and connection bridges of a transponder chip module
USD864968S1 (en) * 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD773467S1 (en) * 2015-11-12 2016-12-06 Samsung Electronics Co., Ltd. Memory card
USD887998S1 (en) * 2017-02-17 2020-06-23 Stat Peel Ag Chip

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD947800S1 (en) * 2018-07-23 2022-04-05 CACI, Inc.—Federal Integrated module
US11333677B2 (en) 2018-07-23 2022-05-17 CACI, Inc.—Federal Methods and apparatuses for detecting tamper using heuristic models
US11662698B2 (en) 2018-07-23 2023-05-30 CACI, Inc.—Federal Methods and apparatuses for detecting tamper using machine learning models
US11747775B2 (en) 2018-07-23 2023-09-05 CACI, Inc.—Federal Integrated tamper detection system and methods
USD940669S1 (en) * 2018-11-19 2022-01-11 Kokusai Electric Corporation Boat for substrate processing apparatus
USD973664S1 (en) * 2019-09-06 2022-12-27 Murata Manufacturing Co., Ltd. IC-chip for RFID tag
USD941786S1 (en) * 2019-11-22 2022-01-25 T-Worx Holdings, LLC Circuit board
USD968344S1 (en) 2019-11-22 2022-11-01 T-Worx Holdings, LLC Circuit board
USD941788S1 (en) * 2020-03-06 2022-01-25 Norman R. Byrne Circuit board

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