USD911298S1 - Chip - Google Patents
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- Publication number
- USD911298S1 USD911298S1 US29/733,401 US202029733401F USD911298S US D911298 S1 USD911298 S1 US D911298S1 US 202029733401 F US202029733401 F US 202029733401F US D911298 S USD911298 S US D911298S
- Authority
- US
- United States
- Prior art keywords
- chip
- view
- ornamental design
- design
- perspective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
The broken lines shown in the drawings represent portions of the chip that form no part of the claimed design.
Claims (1)
- The ornamental design for a chip, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/733,401 USD911298S1 (en) | 2017-02-17 | 2020-05-01 | Chip |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
XHDM096232 | 2017-02-17 | ||
WODM/096233 | 2017-02-17 | ||
XHDM096233 | 2017-02-17 | ||
WODM/096232 | 2017-02-17 | ||
US29/614,262 USD887998S1 (en) | 2017-02-17 | 2017-08-17 | Chip |
US29/733,401 USD911298S1 (en) | 2017-02-17 | 2020-05-01 | Chip |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/614,262 Division USD887998S1 (en) | 2017-02-17 | 2017-08-17 | Chip |
Publications (1)
Publication Number | Publication Date |
---|---|
USD911298S1 true USD911298S1 (en) | 2021-02-23 |
Family
ID=71092780
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/614,262 Active USD887998S1 (en) | 2017-02-17 | 2017-08-17 | Chip |
US29/733,401 Active USD911298S1 (en) | 2017-02-17 | 2020-05-01 | Chip |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/614,262 Active USD887998S1 (en) | 2017-02-17 | 2017-08-17 | Chip |
Country Status (1)
Country | Link |
---|---|
US (2) | USD887998S1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD940669S1 (en) * | 2018-11-19 | 2022-01-11 | Kokusai Electric Corporation | Boat for substrate processing apparatus |
USD941786S1 (en) * | 2019-11-22 | 2022-01-25 | T-Worx Holdings, LLC | Circuit board |
USD941788S1 (en) * | 2020-03-06 | 2022-01-25 | Norman R. Byrne | Circuit board |
USD947800S1 (en) * | 2018-07-23 | 2022-04-05 | CACI, Inc.—Federal | Integrated module |
USD973664S1 (en) * | 2019-09-06 | 2022-12-27 | Murata Manufacturing Co., Ltd. | IC-chip for RFID tag |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD887998S1 (en) * | 2017-02-17 | 2020-06-23 | Stat Peel Ag | Chip |
JP1663818S (en) * | 2018-12-26 | 2020-07-20 | ||
USD936025S1 (en) * | 2018-12-26 | 2021-11-16 | Lg Chem, Ltd. | Flexible printed circuit board for battery module |
TWD202895S (en) * | 2019-03-27 | 2020-02-21 | 家登精密工業股份有限公司 | Reticle pod connecting frame |
JP1659716S (en) * | 2019-08-29 | 2020-05-18 | ||
JP1659676S (en) | 2019-08-29 | 2020-05-18 | ||
JP1659677S (en) * | 2019-08-29 | 2020-05-18 | ||
JP1659675S (en) | 2019-08-29 | 2020-05-18 | ||
JP1659673S (en) * | 2019-08-29 | 2020-05-18 | ||
JP1659678S (en) | 2019-08-29 | 2020-05-18 | ||
JP1659674S (en) * | 2019-08-29 | 2020-05-18 | ||
JP1654981S (en) * | 2019-08-30 | 2020-03-16 | ||
JP1654980S (en) * | 2019-08-30 | 2020-03-16 | ||
JP1680214S (en) * | 2020-08-21 | 2021-03-01 | ||
JP1680215S (en) * | 2020-08-21 | 2021-03-01 | ||
JP1680216S (en) * | 2020-08-21 | 2021-03-01 | ||
JP1680217S (en) * | 2020-08-21 | 2021-03-01 | ||
JP1680501S (en) * | 2020-08-21 | 2021-03-08 |
Citations (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD310514S (en) | 1987-04-23 | 1990-09-11 | Digital Equipment Corporation | Chip cartridge |
US5148266A (en) * | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies having interposer and flexible lead |
US5148265A (en) * | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies with fan-in leads |
USD365092S (en) | 1993-08-12 | 1995-12-12 | Siemens Aktiengesellschaft | Chipcard module |
USD406822S (en) | 1997-03-06 | 1999-03-16 | Siemens Aktiengesellschaft | Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module |
USD430024S (en) | 1998-11-04 | 2000-08-29 | Affymetrix, Inc. | Chip packaging device |
US6201296B1 (en) | 1996-09-23 | 2001-03-13 | Siemens Aktiengesellschaft | Semiconductor chip with protection against analyzing |
US6211572B1 (en) | 1995-10-31 | 2001-04-03 | Tessera, Inc. | Semiconductor chip package with fan-in leads |
US6297561B1 (en) | 1999-05-26 | 2001-10-02 | United Microelectronics Corp. | Semiconductor chip |
US6307269B1 (en) | 1997-07-11 | 2001-10-23 | Hitachi, Ltd. | Semiconductor device with chip size package |
USD456367S1 (en) | 2000-12-15 | 2002-04-30 | Protek Devices, Lp | Semiconductor chip |
US6410355B1 (en) * | 1998-06-11 | 2002-06-25 | Sandisk Corporation | Semiconductor package using terminals formed on a conductive layer of a circuit board |
US6441473B1 (en) * | 1997-09-12 | 2002-08-27 | Agere Systems Guardian Corp. | Flip chip semiconductor device |
USD466873S1 (en) | 2001-10-31 | 2002-12-10 | Siliconix Incorporated | Semiconductor chip package |
USD472528S1 (en) | 2001-10-31 | 2003-04-01 | Siliconix Incorporated | Semiconductor chip package |
US20050082375A1 (en) * | 2003-10-20 | 2005-04-21 | Renesas Technology Corp. | IC card |
US7307848B2 (en) * | 2003-07-17 | 2007-12-11 | Sandisk Corporation | Memory card with raised portion |
US7525200B2 (en) | 2003-12-24 | 2009-04-28 | Seiko Epson Corporation | Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device |
US7538442B2 (en) * | 2005-09-30 | 2009-05-26 | Sharp Kabushiki Kaisha | Semiconductor chip and semiconductor device |
US20090230537A1 (en) | 2008-03-12 | 2009-09-17 | Yong Liu | Semiconductor die package including embedded flip chip |
US7830666B2 (en) * | 2000-01-06 | 2010-11-09 | Super Talent Electronics, Inc. | Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board |
US7838892B2 (en) * | 2004-04-29 | 2010-11-23 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip and method for forming a contact structure for making electrical contact with an optoelectronic semiconductor chip |
US7919873B2 (en) * | 2001-09-17 | 2011-04-05 | Megica Corporation | Structure of high performance combo chip and processing method |
US8148806B2 (en) * | 2000-05-19 | 2012-04-03 | Megica Corporation | Multiple chips bonded to packaging structure with low noise and multiple selectable functions |
US20120117315A1 (en) * | 2009-07-23 | 2012-05-10 | Kabushiki Kaisha Toshiba | Semiconductor memory card |
US8291144B2 (en) * | 2009-08-14 | 2012-10-16 | Sandisk Il Ltd. | Dual interface card with backward and forward compatibility |
USD675582S1 (en) | 2011-06-27 | 2013-02-05 | Uninet Imaging, Inc. | Chip assembly |
US20140106621A1 (en) * | 2012-10-11 | 2014-04-17 | Carry Technology Co., Ltd. | Memory card adapter device |
USD711842S1 (en) | 2011-08-04 | 2014-08-26 | Swisscom Ag | Electronic chip card |
USD715234S1 (en) | 2013-04-18 | 2014-10-14 | SemiLEDs Optoelectronics Co., Ltd. | Flip chip |
USD720354S1 (en) * | 2011-11-22 | 2014-12-30 | Kabushiki Kaisha Toshiba | Module with built-in integrated circuits for use with IC card |
USD727861S1 (en) | 2013-08-24 | 2015-04-28 | Apex Microelectronics Co., Ltd. | Ink cartridge chip |
USD728577S1 (en) * | 2014-07-01 | 2015-05-05 | Google Inc. | Mobile device module |
USD730906S1 (en) * | 2014-07-01 | 2015-06-02 | Google Inc. | Mobile device module |
USD736212S1 (en) | 2014-07-01 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD756317S1 (en) * | 2014-08-26 | 2016-05-17 | Féinics Amatech Teoranta | Layout for contact pads and connection bridges of a transponder chip module |
USD773467S1 (en) * | 2015-11-12 | 2016-12-06 | Samsung Electronics Co., Ltd. | Memory card |
USD864968S1 (en) * | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
USD887998S1 (en) * | 2017-02-17 | 2020-06-23 | Stat Peel Ag | Chip |
-
2017
- 2017-08-17 US US29/614,262 patent/USD887998S1/en active Active
-
2020
- 2020-05-01 US US29/733,401 patent/USD911298S1/en active Active
Patent Citations (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD310514S (en) | 1987-04-23 | 1990-09-11 | Digital Equipment Corporation | Chip cartridge |
US5148266A (en) * | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies having interposer and flexible lead |
US5148265A (en) * | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies with fan-in leads |
USD365092S (en) | 1993-08-12 | 1995-12-12 | Siemens Aktiengesellschaft | Chipcard module |
US6211572B1 (en) | 1995-10-31 | 2001-04-03 | Tessera, Inc. | Semiconductor chip package with fan-in leads |
US6201296B1 (en) | 1996-09-23 | 2001-03-13 | Siemens Aktiengesellschaft | Semiconductor chip with protection against analyzing |
USD406822S (en) | 1997-03-06 | 1999-03-16 | Siemens Aktiengesellschaft | Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module |
US6307269B1 (en) | 1997-07-11 | 2001-10-23 | Hitachi, Ltd. | Semiconductor device with chip size package |
US6441473B1 (en) * | 1997-09-12 | 2002-08-27 | Agere Systems Guardian Corp. | Flip chip semiconductor device |
US6410355B1 (en) * | 1998-06-11 | 2002-06-25 | Sandisk Corporation | Semiconductor package using terminals formed on a conductive layer of a circuit board |
USD430024S (en) | 1998-11-04 | 2000-08-29 | Affymetrix, Inc. | Chip packaging device |
US6297561B1 (en) | 1999-05-26 | 2001-10-02 | United Microelectronics Corp. | Semiconductor chip |
US7830666B2 (en) * | 2000-01-06 | 2010-11-09 | Super Talent Electronics, Inc. | Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board |
US8148806B2 (en) * | 2000-05-19 | 2012-04-03 | Megica Corporation | Multiple chips bonded to packaging structure with low noise and multiple selectable functions |
USD456367S1 (en) | 2000-12-15 | 2002-04-30 | Protek Devices, Lp | Semiconductor chip |
US7919873B2 (en) * | 2001-09-17 | 2011-04-05 | Megica Corporation | Structure of high performance combo chip and processing method |
USD472528S1 (en) | 2001-10-31 | 2003-04-01 | Siliconix Incorporated | Semiconductor chip package |
USD466873S1 (en) | 2001-10-31 | 2002-12-10 | Siliconix Incorporated | Semiconductor chip package |
US7307848B2 (en) * | 2003-07-17 | 2007-12-11 | Sandisk Corporation | Memory card with raised portion |
US20050082375A1 (en) * | 2003-10-20 | 2005-04-21 | Renesas Technology Corp. | IC card |
US7525200B2 (en) | 2003-12-24 | 2009-04-28 | Seiko Epson Corporation | Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device |
US7838892B2 (en) * | 2004-04-29 | 2010-11-23 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip and method for forming a contact structure for making electrical contact with an optoelectronic semiconductor chip |
US7538442B2 (en) * | 2005-09-30 | 2009-05-26 | Sharp Kabushiki Kaisha | Semiconductor chip and semiconductor device |
US20090230537A1 (en) | 2008-03-12 | 2009-09-17 | Yong Liu | Semiconductor die package including embedded flip chip |
US20120117315A1 (en) * | 2009-07-23 | 2012-05-10 | Kabushiki Kaisha Toshiba | Semiconductor memory card |
US8291144B2 (en) * | 2009-08-14 | 2012-10-16 | Sandisk Il Ltd. | Dual interface card with backward and forward compatibility |
USD675582S1 (en) | 2011-06-27 | 2013-02-05 | Uninet Imaging, Inc. | Chip assembly |
USD711842S1 (en) | 2011-08-04 | 2014-08-26 | Swisscom Ag | Electronic chip card |
USD720354S1 (en) * | 2011-11-22 | 2014-12-30 | Kabushiki Kaisha Toshiba | Module with built-in integrated circuits for use with IC card |
US20140106621A1 (en) * | 2012-10-11 | 2014-04-17 | Carry Technology Co., Ltd. | Memory card adapter device |
USD715234S1 (en) | 2013-04-18 | 2014-10-14 | SemiLEDs Optoelectronics Co., Ltd. | Flip chip |
USD727861S1 (en) | 2013-08-24 | 2015-04-28 | Apex Microelectronics Co., Ltd. | Ink cartridge chip |
USD728577S1 (en) * | 2014-07-01 | 2015-05-05 | Google Inc. | Mobile device module |
USD730906S1 (en) * | 2014-07-01 | 2015-06-02 | Google Inc. | Mobile device module |
USD736212S1 (en) | 2014-07-01 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD756317S1 (en) * | 2014-08-26 | 2016-05-17 | Féinics Amatech Teoranta | Layout for contact pads and connection bridges of a transponder chip module |
USD864968S1 (en) * | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
USD773467S1 (en) * | 2015-11-12 | 2016-12-06 | Samsung Electronics Co., Ltd. | Memory card |
USD887998S1 (en) * | 2017-02-17 | 2020-06-23 | Stat Peel Ag | Chip |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD947800S1 (en) * | 2018-07-23 | 2022-04-05 | CACI, Inc.—Federal | Integrated module |
US11333677B2 (en) | 2018-07-23 | 2022-05-17 | CACI, Inc.—Federal | Methods and apparatuses for detecting tamper using heuristic models |
US11662698B2 (en) | 2018-07-23 | 2023-05-30 | CACI, Inc.—Federal | Methods and apparatuses for detecting tamper using machine learning models |
US11747775B2 (en) | 2018-07-23 | 2023-09-05 | CACI, Inc.—Federal | Integrated tamper detection system and methods |
USD940669S1 (en) * | 2018-11-19 | 2022-01-11 | Kokusai Electric Corporation | Boat for substrate processing apparatus |
USD973664S1 (en) * | 2019-09-06 | 2022-12-27 | Murata Manufacturing Co., Ltd. | IC-chip for RFID tag |
USD941786S1 (en) * | 2019-11-22 | 2022-01-25 | T-Worx Holdings, LLC | Circuit board |
USD968344S1 (en) | 2019-11-22 | 2022-11-01 | T-Worx Holdings, LLC | Circuit board |
USD941788S1 (en) * | 2020-03-06 | 2022-01-25 | Norman R. Byrne | Circuit board |
Also Published As
Publication number | Publication date |
---|---|
USD887998S1 (en) | 2020-06-23 |
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Legal Events
Date | Code | Title | Description |
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |