US7982297B1 - Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same - Google Patents
Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same Download PDFInfo
- Publication number
- US7982297B1 US7982297B1 US11/682,666 US68266607A US7982297B1 US 7982297 B1 US7982297 B1 US 7982297B1 US 68266607 A US68266607 A US 68266607A US 7982297 B1 US7982297 B1 US 7982297B1
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- semiconductor
- package
- semiconductor package
- substrate
- semiconductor die
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- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
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- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H01L2924/151—Die mounting substrate
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- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
- H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18165—Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip
Abstract
Description
Claims (18)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/682,666 US7982297B1 (en) | 2007-03-06 | 2007-03-06 | Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US11/682,666 US7982297B1 (en) | 2007-03-06 | 2007-03-06 | Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same |
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US7982297B1 true US7982297B1 (en) | 2011-07-19 |
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US11/682,666 Active 2027-05-24 US7982297B1 (en) | 2007-03-06 | 2007-03-06 | Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same |
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Cited By (13)
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---|---|---|---|---|
US20100148350A1 (en) * | 2008-12-16 | 2010-06-17 | Renesas Technology Corp. | Semiconductor device and method for manufacturing the same |
US20110241197A1 (en) * | 2010-04-01 | 2011-10-06 | Horst Theuss | Device and Method for Manufacturing a Device |
US20120199964A1 (en) * | 2007-09-07 | 2012-08-09 | Jung-Do Lee | Electronic device having stack-type semiconductor package and method of forming the same |
US20130241044A1 (en) * | 2012-03-16 | 2013-09-19 | Samsung Electronics Co., Ltd. | Semiconductor package having protective layer and method of forming the same |
US8618654B2 (en) * | 2010-07-20 | 2013-12-31 | Marvell World Trade Ltd. | Structures embedded within core material and methods of manufacturing thereof |
US20140232015A1 (en) * | 2013-02-18 | 2014-08-21 | Infineon Technologies Ag | Semiconductor Modules and Methods of Formation Thereof |
US20140252657A1 (en) * | 2013-03-06 | 2014-09-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package Alignment Structure and Method of Forming Same |
US20140353824A1 (en) * | 2013-05-29 | 2014-12-04 | Huawei Technologies Co., Ltd. | Package-on-package structure |
CN105720049A (en) * | 2014-12-15 | 2016-06-29 | 英特尔公司 | Opossum-die package-on-package apparatus |
US9576917B1 (en) * | 2013-11-18 | 2017-02-21 | Amkor Technology, Inc. | Embedded die in panel method and structure |
US10600773B2 (en) * | 2016-09-09 | 2020-03-24 | Toshiba Memory Corporation | Semiconductor device manufacturing method |
US11101840B1 (en) * | 2020-02-05 | 2021-08-24 | Samsung Electro-Mechanics Co., Ltd. | Chip radio frequency package and radio frequency module |
US11183765B2 (en) | 2020-02-05 | 2021-11-23 | Samsung Electro-Mechanics Co., Ltd. | Chip radio frequency package and radio frequency module |
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