US20100051232A1 - Heat dissipation apparatus incorporating a fan - Google Patents
Heat dissipation apparatus incorporating a fan Download PDFInfo
- Publication number
- US20100051232A1 US20100051232A1 US12/490,277 US49027709A US2010051232A1 US 20100051232 A1 US20100051232 A1 US 20100051232A1 US 49027709 A US49027709 A US 49027709A US 2010051232 A1 US2010051232 A1 US 2010051232A1
- Authority
- US
- United States
- Prior art keywords
- fin
- fins
- assemblies
- heat sink
- fin assemblies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat dissipation apparatus includes a heat sink and a fan. The heat sink includes a plurality of radial first and second fins. The first and second fins each include a main body and an extension arm extending upwardly from the main body. The main bodies and the extension arms cooperatively form a space therebetween for securely receiving the fan therein. Each extension arm defines an engaging groove communicating with the space. A height of the extension arm of each second fin is less than that of the extension arm of each first fin. A fixing recess is defined over the extension arms of the second fins. The fan includes a frame extending downwardly out a plurality of legs and radially out a fixing arm. The legs have hooks engaging in the engaging grooves, and the fixing arm is fixed in the fixing recess.
Description
- Relevant subject matter is disclosed in co-pending U.S. patent application Ser. No. 12/331,391, filed on Dec. 9, 2008, both of which are assigned to the same assignee as the present application. The disclosure of the co-pending application is incorporated herein by reference.
- 1. Technical Field
- The present disclosure generally relates to heat dissipation, and particularly to a heat dissipation apparatus utilizing a fan for enhancing a dissipating efficiency.
- 2. Description of Related Art
- It is well known that if heat generated by electronic components, such as integrated circuit chips, during operation is not efficiently dissipated, these electronic components may suffer damage. Thus, heat dissipation apparatuses are often used to cool the electronic components.
- A typical heat dissipation apparatus includes a heat sink and a fan. The heat sink is thermally connected with a heat generating electronic component. The fan is mounted on the heat sink via a plurality of screws. During operation, heat generated by the heat generating electronic component is transferred to the heat sink. The fan produces an airflow towards the heat sink to dissipate the heat therefrom.
- However, in the heat dissipation apparatus, the fan is assembled to the heat sink via the plurality of screws, which complicates the assembly of the heat dissipation apparatus.
- What is needed, therefore, is a heat dissipation apparatus which overcomes the above-described limitations.
- Many aspects of the present heat dissipation apparatus can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the disclosed heat dissipation apparatus. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an assembled, isometric view of a heat dissipation apparatus in accordance with one embodiment of the disclosure. -
FIG. 2 is an exploded, isometric view of the heat dissipation apparatus of FIG -
FIG. 3 is an isometric view showing a fan disassembled from the heat dissipation apparatus ofFIG. 1 . - Referring to
FIGS. 1 and 2 , a heat dissipation apparatus in accordance with one embodiment of the disclosure is shown. The heat dissipation apparatus includes a high heatconductive base 10, aheat sink 20, a plurality ofheat pipes 30 thermally connecting thebase 10 with theheat sink 20, a heatconductive core 40 received in theheat sink 20, and afan 50 mounted in a top of theheat sink 20. - The
heat sink 20 is annular, and includes a pair offirst fin assemblies 21 and a pair ofsecond fin assemblies 23. - Each of the
first fin assemblies 21 is sectorial, and includes a plurality of radialfirst fins 211 stacked along a circumferential direction of theheat sink 20. An air channel 212 is defined between every two adjacentfirst fins 211. - Each of the
first fins 211 includes a rectangularmain body 213 and anextension arm 214 extending upwardly from themain body 213. Each of thefirst fin assemblies 21 defines a plurality of arcuate first receivinggrooves 215 therein through eachmain body 213, for receiving theheat pipes 30 therein, respectively. Theextension arm 214 extends upwardly form an outer-upper side of themain body 213, and has a width less than that of themain body 213. Theextension arm 214 forms astep 216 and defines anengaging groove 217 at an inner side thereof. A width of theextension arm 214 below thestep 216 is greater than a width of theextension arm 214 above thestep 216. Theengaging groove 217 is wedgy, and located below thestep 216. Theengaging groove 217 and thestep 216 are used to secure thefan 50 onto theheat sink 20. Theextension arm 214 extends perpendicularly and horizontally out atop flange 218 at a top side thereof, and astep flange 219 from thestep 216. All thetop flanges 218 of thefirst fins 211 of eachfirst fin assembly 21 cooperatively form a planartop surface 228. All thestep flanges 219 of thefirst fins 211 of eachfirst fin assembly 21 cooperatively form aplanar step surface 229. - The
second fin assemblies 23 are similar to thefirst fin assemblies 21, with each also being sectorial, and including a plurality ofsecond fins 231 stacked along the circumferential direction of theheat sink 20. Anair channel 232 is defined between every two adjacentsecond fins 231. - Each of the
second fins 231 includes amain body 233 and anextension arm 234. Themain body 233 of eachsecond fin 231 is substantially triangular, such that anopening 240 is defined at an outer-lower side of eachsecond fin assembly 23 when thesecond fins 231 are stacked together. Each of thesecond fin assemblies 23 defines an arcuate second receivinggroove 235 therein through eachmain body 233. The second receivinggroove 235 aligns with an upper one of the first receivinggrooves 215, and is in communication with the opening 240. - The
extension arm 234 extends upwardly form an outer-upper side of themain body 233 of eachsecond fin 231, and has a width less than that of themain body 233. A height of theextension arm 234 of eachsecond fin 231 is less than that of theextension arm 214 of thefirst fin 211. A top of theextension arm 234 is approximately level with that of thestep surface 229 of thefirst fin assembly 21. Theextension arm 234 defines a wedgyengaging groove 237 at an inner side thereof, aligning with theengaging groove 217 of thefirst fin 211. Alternatively, theengaging grooves heat sink 20 can be defined only in one of the first andsecond assemblies heat sink 20. Theextension arm 234 extends perpendicularly out atop flange 238 at a top side thereof. All thetop flanges 238 of thesecond fins 231 of eachsecond fin assembly 23 cooperatively form a planartop surface 248. Thetop surface 248 of eachsecond fin assembly 23 is coplanar with thestep surface 229 of eachfirst fin assembly 21. Thetop surface 248 of eachsecond fin assembly 23 and thestep surface 229 of eachfirst fin assembly 21 cooperatively support thefan 50 when thefan 50 is assembled on theheat sink 20. - Each of the
heat pipe 30 includes anarcuate condensation section 31. Parts of thecondensation sections 31 of theheat pipes 30 are inserted into the first receivinggrooves 215 of thefirst fin assemblies 20, and the other parts thereof are received in the second receivinggrooves 235 and theopenings 240 of the second fin assemblies. The heatconductive core 40 is cylindrical, and has a high heat conductivity. Preferably, the heatconductive core 40 is made of copper. - The
fan 50 includes aframe 51 and an impeller 52 mounted on theframe 51. Theframe 51 includes aholder 511 at a center thereof, arim 512 at an outer periphery thereof, and a plurality ofribs 513 connecting theholder 511 with therim 512. Theholder 511 supports the impeller 52, and the impeller 52 is hung on theholder 511 and faces downwardly. Therim 512 is annular, and extends perpendicularly and downwardly out a plurality oflegs 514. Thelegs 514 are evenly arranged on therim 512. Ahook 515 extends radially out from a free end of eachleg 514. Thehook 515 matches with the engaginggrooves second fin assemblies fan 50 into theheat sink 20. Therim 512 further extends radially out a pair of fixingarms 517 respectively aligning with thesecond fin assemblies 23. Each of the fixingarms 517 is substantially sectorial, and has an outwardly increased width along a radial direction of theheat sink 20. A height of each of the fixingarms 517 is equal to a height difference between theextension arm 234 of eachsecond fin assembly 23 and theextension arm 214 of eachfirst fin assembly 21. Theribs 513 are strip-shaped, for supporting theholder 511 at the center of theframe 51. Two of theribs 513 connect with therim 512 at locations which are adjacent to middles of the pair of the fixingarms 517, respectively, wherein one of the tworibs 513 defines awire groove 518 therein. Awire 519 is received in thewire groove 518, and electrically connects thefan 50 with a power source, for supplying electrical power to thefan 50. - Referring also to
FIG. 3 , during assembly of the heat dissipation apparatus, thecondensation sections 31 of theheat pipes 30 are respectively inserted into the first receivinggrooves 215 of the pair offirst fin assemblies 21 along two opposite orientations, with a free end of eachcondensation section 31 protruding out of a correspondingfirst fin assembly 21. Thefirst fin assemblies 21 and theheat pipes 30 are arranged on thebase 10. Thefirst fin assemblies 21 are oriented face to face, and space from each other. Thesecond fin assemblies 23 are inserted into spaces between thefirst fin assemblies 21 from top to bottom, respectively. The free end of thecondensation section 31 of eachheat pipe 30 has a top half entering into thesecond receiving groove 235 through theopening 240 of the correspondingsecond fin assembly 23 and a lower half received in theopening 240. At this time, thefirst fin assemblies 21 and thesecond fin assemblies 23 are alternate with each other, and cooperatively form theannular heat sink 20. All the engaginggrooves second fin assemblies groove 27 of theheat sink 20. The top surfaces 248 of thesecond fin assemblies 23 are coplanar with the step surfaces 229 of thefirst fin assemblies 21. Since the height of theextension arm 234 of eachsecond fin assembly 23 is less than that of theextension arm 214 of eachfirst fin assembly 21, asectorial fixing recess 25 is defined between thefirst fin assemblies 21 over thetop surface 248 of eachsecond fin assembly 23. - The heat
conductive core 40 is enclosed by themain bodies second fin assemblies second fin assemblies second fins second fin assemblies conductive core 40 in a radial pattern. Theextension arms second fin assemblies space 29 over the heatconductive core 40. Thesteps 216 and the step surfaces 229 of thefirst fin assemblies 21 are located in thespace 29, and the annular engaginggroove 27 communicates with thespace 29. - The
fan 50 is aligned with and pressed into thespace 29, with bottom surfaces of therim 512 of thefan 50 abut the step surfaces 229 of thefirst fin assemblies 21 and thetop surfaces 248 of thesecond fin assemblies 23. The fixingarms 517 are fixed in the fixing recesses 25, respectively, with bottom surfaces of the fixingarms 517 abutting on thetop surfaces 248 of thesecond fin assemblies 23. At this time, the impeller 52 is just received in thespace 29; top and outer side surfaces of the fixingarms 517 are coplanar with top surface and circumferential periphery of theheat sink 20, respectively; thehooks 515 of thelegs 514 of thefan 50 are engaged into the engaginggroove 27, for mounting thefan 50 in theheat sink 20. - During operation of the heat dissipation apparatus, the
base 10 absorbs heat from the heat generating electronic component, which is transferred to theheat sink 20 via the heatconductive core 40 and theheat pipes 30. Thefan 50 produces airflow toward theheat sink 20, and dissipates heat from theheat sink 20 into ambient air. - In the heat dissipation apparatus, the
fan 50 is mounted in thespace 29 of theheat sink 20, and the impeller 52 is enclosed by theheat sink 20, which makes the most of the cool airflow produced by thefan 50 flow through the first andsecond fins heat sink 20 enclosing thefan 50 severs as a sidewall for thefan 50, which saves material of thefan 50 and increases pressure of the airflow produced by thefan 50. - In addition, the
heat sink 20 includes thesteps 216 and the engaginggroove 27, and thefan 50 includes therim 512 and thelegs 514 withhooks 515. Thus, additional screws are not required to stably mount thefan 50 on theheat sink 20, which simplifies structure of the heat dissipation apparatus. Furthermore, theheat sink 20 includes the fixing recesses 25, and thefan 50 includes the fixingarms 517 respectively fixed in the fixing recesses 25, which prevents thefan 50 from rotating after assembly, and is favorable to orient thefan 50 so that it can be properly assembled to theheat sink 20. - Moreover, the first and
second fins second fin assemblies conductive core 40 in a radial pattern. The airflow produced by thefan 50 is easily guided toward other heat generating electronic components around theheat sink 20 through theairflow channels 212, 232 between the first andsecond fins heat sink 20, but also dissipates heat from the heat generating electronic components around theheat sink 20. - It is believed that the disclosure and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
Claims (11)
1. A heat dissipation apparatus, comprising:
a heat sink defining a recessed space at a center of a top end thereof, an upper portion of the heat sink surrounding the recessed space, at least one fixing recess being defined in a top end of the upper portion and at least one engaging groove being defined in an inner side of the upper portion, the at least one fixing recess and the at least one engaging groove communicating with the recessed space; and
a fan comprising a frame and an impeller assembled to the frame, the frame extending downwardly out a plurality of legs and radially out at least one fixing arm, each of the legs comprising a hook at a free end thereof, the hooks of the legs engaging in the at least one engaging groove of the heat sink, and the at least one fixing arm being fixed in the at least one fixing recess, for securely mounting the fan in the recessed space of the heat sink.
2. The heat dissipation apparatus of claim 1 , wherein the heat sink comprises a pair of first fin assemblies and a pair of second fin assemblies alternate with the pair of first fin assemblies, the first and second fin assemblies cooperatively forming an annular structure, the first fin assemblies and the second fin assemblies each comprising a plurality of fins, each fin comprising a main body and an extension arm extending upwardly from the main body, the extension arms of the first and second fin assemblies cooperatively forming the upper portion of the heat sink, a height of the extension arm of each fin of the second fin assembly being less than that of the extension arm of each fin of the first fin assembly, the at least one fixing recess being defined between the pair of first fin assemblies and over the extension arms of the fins of each second fin assembly.
3. The heat dissipation apparatus of claim 2 , wherein a width of each extension arm of the first and second fin assemblies is less than that of each main body of the first and second fin assemblies, the extension arms of the first and second fin assemblies cooperatively forming the recessed space therebetween, the engaging groove being defined in at least one extension arm of the first and second fin assemblies.
4. The heat dissipation apparatus of claim 2 , further comprising at least one heat pipe with an arcuate condensation section, the first and second fin assemblies each defining at least one receiving groove therein, the second fin assemblies each further defining an opening at an outer-down side thereof in communication with the at least one receiving groove of a corresponding second fin assembly, a part of the condensation section of the at least one heat pipe being inserted into the at least one receiving groove of each first fin assembly, and another part thereof entering into the at least one receiving groove of each second fin assembly through the opening of the corresponding second fin assembly.
5. The heat dissipation apparatus of claim 1 , wherein the frame comprises an annular rim, the legs extending downwardly and the at least one fixing arm extending radially out from the rim, the heat sink forming a step above the at least one engaging groove in the recessed space, the rim sitting on the step.
6. The heat dissipation apparatus of claim 5 , wherein the heat sink comprises a pair of first fin assemblies and a pair of second fin assemblies alternate with the pair of first fin assemblies, the first fin assemblies each comprising a plurality of first fins stacked along a circumferential direction of the heat sink, the second fin assemblies each comprising a plurality of second fins stacked along the circumferential direction of the heat sink, the step being formed on each of the first fin assemblies, each of the first fins extending perpendicularly and horizontally out a step flange from the step, all the step flanges of the first fins of each first fin assembly cooperatively forming a step surface, each of the second fins extending perpendicularly and horizontally out a top flange at a top end thereof, all the top flanges of the second fins of each second fin assembly cooperatively forming a top surface, the top surface of each second fin assembly being coplanar with the step surface of each first fin assembly, the rim of the fan sitting on the top surface of each second fin assembly and the step surface of each first fin assembly, the at least one fixing arm abutting the top surface of the each second fin assembly.
7. A heat dissipation apparatus, comprising:
a heat sink comprising a plurality of radial fins, each of the fins comprising a main body and an extension arm extending upwardly from the main body, a width of each extension arm of the fins being less than that of each main body of the fins, the main bodies and the extension arms of the fins cooperatively forming a space therebetween, the extension arms of the fins defining at least one engaging groove communicating with the space, the extension arms of a part of the fins protruding upwardly out from the extension arms of the other part of the fins, such that at least one fixing recess being defined at a top end of the heat sink; and
a fan comprising a frame and an impeller assembled to the frame, the frame extending downwardly out a plurality of legs and radially out at least one fixing arm, each of the legs comprising a hook at a free end thereof, the hooks of the legs engaging in the at least one engaging groove of the heat sink, and the at least one fixing arm being fixed in the at least one fixing recess, for securely mounting the fan in the space of the heat sink.
8. The heat dissipation apparatus of claim 7 , wherein the fins comprise a plurality of first fins and a plurality of second fins, the first fins being stacked together to cooperatively form a pair of first fin assemblies, the second fins being stacked together to cooperatively form a pair of second fin assemblies, the first fin assemblies being alternate with the second fin assemblies to form an annular structure, the extension arms of the first fins of the first fin assemblies protruding upwardly beyond the extension arms of the second fins the second fin assemblies.
9. The heat dissipation apparatus of claim 8 , wherein the frame comprises an annular rim, the legs extending downwardly and the at least one fixing arm extending radially out from the rim, each extension arm of the first fins of the first fin assemblies forming a step above the at least one engaging groove in the space, the rim sitting on the steps of the first fin assemblies.
10. The heat dissipation apparatus of claim 9 , wherein each of the first fins extending perpendicularly out a step flange from the step, all the step flanges of the first fins of each first fin assembly cooperatively forming a step surface, each of the second fins extending perpendicularly and horizontally out a top flange at a top end thereof, all the top flanges of the second fins of each second fin assembly cooperatively forming a top surface, the top surface of each second fin assembly being coplanar with the step surface of each first fin assembly, the rim of the fan sitting on the top surface of each second fin assembly and the step surface of each first fin assembly, the at least one fixing arm abutting the top surface of the each second fin assembly.
11. The heat dissipation apparatus of claim 8 , further comprising at least one heat pipe with an arcuate condensation section, the first and second fin assemblies each defining at least one receiving groove therein, the second fin assemblies each further defining an opening at an outer-down side thereof in communication with the at least one receiving groove of the corresponding second fin assembly, a part of the condensation section of the at least one heat pipe being inserted into the at least one receiving groove of each first fin assembly, and another part thereof entering into the at least one receiving groove of each second fin assembly through the opening of the corresponding second fin assembly.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810304232A CN101662918B (en) | 2008-08-27 | 2008-08-27 | Heat radiating device |
CN200810304232.0 | 2008-08-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100051232A1 true US20100051232A1 (en) | 2010-03-04 |
Family
ID=41723594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/490,277 Abandoned US20100051232A1 (en) | 2008-08-27 | 2009-06-23 | Heat dissipation apparatus incorporating a fan |
Country Status (2)
Country | Link |
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US (1) | US20100051232A1 (en) |
CN (1) | CN101662918B (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090147478A1 (en) * | 2007-12-07 | 2009-06-11 | Nidec Corporation | Heat sink fan |
CN102762081A (en) * | 2012-07-03 | 2012-10-31 | 东莞汉旭五金塑胶科技有限公司 | Radiator with built-in fan |
US10104808B2 (en) | 2014-05-23 | 2018-10-16 | Fronius International Gmbh | Heat sink and housing for an inverter with such a heat sink |
CN108871034A (en) * | 2018-06-20 | 2018-11-23 | 江苏英杰电子器件有限公司 | A kind of radiator of high intensity |
US10378836B2 (en) * | 2016-09-26 | 2019-08-13 | Asia Vital Components Co., Ltd. | Water-cooling radiator assembly |
EP4293234A1 (en) | 2022-06-17 | 2023-12-20 | FRONIUS INTERNATIONAL GmbH | Fan, cooling device with such a fan and housing with such a cooling device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107809878B (en) * | 2016-09-08 | 2020-08-04 | 奇鋐科技股份有限公司 | Water-cooling heat dissipation row structure |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090147478A1 (en) * | 2007-12-07 | 2009-06-11 | Nidec Corporation | Heat sink fan |
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CN102762081A (en) * | 2012-07-03 | 2012-10-31 | 东莞汉旭五金塑胶科技有限公司 | Radiator with built-in fan |
US10104808B2 (en) | 2014-05-23 | 2018-10-16 | Fronius International Gmbh | Heat sink and housing for an inverter with such a heat sink |
US10378836B2 (en) * | 2016-09-26 | 2019-08-13 | Asia Vital Components Co., Ltd. | Water-cooling radiator assembly |
CN108871034A (en) * | 2018-06-20 | 2018-11-23 | 江苏英杰电子器件有限公司 | A kind of radiator of high intensity |
EP4293234A1 (en) | 2022-06-17 | 2023-12-20 | FRONIUS INTERNATIONAL GmbH | Fan, cooling device with such a fan and housing with such a cooling device |
WO2023242382A1 (en) | 2022-06-17 | 2023-12-21 | Fronius International Gmbh | Cooling device having a fan and housing having a cooling device of this type |
Also Published As
Publication number | Publication date |
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CN101662918B (en) | 2012-10-10 |
CN101662918A (en) | 2010-03-03 |
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