US20070110559A1 - Integrated liquid cooling system - Google Patents
Integrated liquid cooling system Download PDFInfo
- Publication number
- US20070110559A1 US20070110559A1 US11/308,833 US30883306A US2007110559A1 US 20070110559 A1 US20070110559 A1 US 20070110559A1 US 30883306 A US30883306 A US 30883306A US 2007110559 A1 US2007110559 A1 US 2007110559A1
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- United States
- Prior art keywords
- rotor
- cooling system
- liquid cooling
- heat
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01D—NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAM TURBINES
- F01D1/00—Non-positive-displacement machines or engines, e.g. steam turbines
- F01D1/34—Non-positive-displacement machines or engines, e.g. steam turbines characterised by non-bladed rotor, e.g. with drilled holes
- F01D1/36—Non-positive-displacement machines or engines, e.g. steam turbines characterised by non-bladed rotor, e.g. with drilled holes using fluid friction
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D13/00—Pumping installations or systems
- F04D13/02—Units comprising pumps and their driving means
- F04D13/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D13/0673—Units comprising pumps and their driving means the pump being electrically driven the motor being of the inside-out type
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/04—Shafts or bearings, or assemblies thereof
- F04D29/046—Bearings
- F04D29/047—Bearings hydrostatic; hydrodynamic
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/586—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps
- F04D29/588—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps cooling or heating the machine
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K5/00—Casings; Enclosures; Supports
- H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
- H02K5/12—Casings or enclosures characterised by the shape, form or construction thereof specially adapted for operating in liquid or gas
- H02K5/128—Casings or enclosures characterised by the shape, form or construction thereof specially adapted for operating in liquid or gas using air-gap sleeves or air-gap discs
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
- H02K7/08—Structural association with bearings
- H02K7/085—Structural association with bearings radially supporting the rotary shaft at only one end of the rotor
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
- H02K7/08—Structural association with bearings
- H02K7/086—Structural association with bearings radially supporting the rotor around a fixed spindle; radially supporting the rotor directly
- H02K7/088—Structural association with bearings radially supporting the rotor around a fixed spindle; radially supporting the rotor directly radially supporting the rotor directly
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
- H02K7/14—Structural association with mechanical loads, e.g. with hand-held machine tools or fans
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/08—Fluid driving means, e.g. pumps, fans
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates generally to a liquid cooling system for dissipation of heat from heat-generating components, and more particularly to an integrated liquid cooling system suitable for removing heat from electronic components of computers.
- the heat-absorbing member, the heat-dissipating member and the pump are connected together generally by a plurality of connecting tubes so as to form the heat transfer loop.
- the typical liquid cooling system has a big volume and occupies more room in a computer system, and is not adapted to the small size necessary for a personal computer.
- the liquid cooling system has many connecting tubes with a plurality of connections, which are prone to leakage of the coolant so giving the system low reliability and high cost.
- the heat-absorbing member, the heat-dissipating member and the pump are to be located at different locations when mounted to the computer system. In this situation, mounting of the liquid cooling system to the computer system or demounting of the liquid cooling system from the computer system is tiresome and time-consuming work. In addition, vibration and noise produced by the reciprocating pump adversely affect the heat-generating component and the computer system.
- An integrated liquid cooling system in accordance with an embodiment for removing heat from a heat-generating electronic component includes a base, a pump mounted in the base and a heat-dissipating member communicating with the pump and coupling with the base.
- the pump includes a casing having a chamber.
- a rotor, a partition seat and a stator are in turn received in the chamber.
- a top cover is attached on the casing.
- the casing includes a bottom plate absorbing heat generated by the electronic component.
- a plurality of pairs of interconnecting surfaces are formed between the partition seat and the rotor and the bottom plate, one surface of the at least one pair of interconnecting surfaces forming a plurality of grooves or protrusions, thereby forming a fluid film therebetween for dynamically supporting thrust on the rotor during rotation of the rotor.
- FIG. 1 is an assembled, isometric view of a liquid cooling system in accordance with a preferred embodiment of the present invention
- FIG. 2 is an exploded view of FIG. 1 , but shown from another aspect
- FIG. 3 is an isometric view of a heat-dissipating member of the liquid cooling system of FIG. 2 ;
- FIG. 4 is an exploded view of a pump of the liquid cooling system of FIG. 2 ;
- FIG. 5 is a view similar to FIG. 4 , but shown from a different aspect
- FIGS. 6-8 , 11 , 14 are isometric views of a rotor in accordance with other embodiments.
- FIG. 9 is an exploded view of a pump of the liquid cooling system of FIG. 2 with a minor modification
- FIGS. 10 , 12 - 13 are isometric views of a partition seat in accordance with other embodiments.
- FIG. 15 is an exploded view of a pump of a liquid cooling system in accordance with a second embodiment
- FIG. 16 is an exploded view of a pump of a liquid cooling system in accordance with a third embodiment
- FIG. 17 is an exploded view of a pump and a base of a liquid cooling system in accordance with a fourth embodiment
- FIG. 18 is an exploded view of a pump and a base of a liquid cooling system in accordance with a fifth embodiment.
- FIG. 19 is an assembled, cross-sectional view of the pump and the base of FIG. 18 .
- FIG. 1 and FIG. 2 illustrate a liquid cooling system in accordance with a preferred embodiment of the present invention.
- the liquid cooling system includes a base 10 , a pump 20 mounted in the base 10 , and a heat-dissipating member 30 communicating with the pump 20 and coupling with the base 10 .
- the base 10 , the pump 20 and the heat-dissipating member 30 are connected together in series without any connecting tubes.
- a heat transfer loop is formed by the base 10 , the pump 20 and the heat dissipating member 30 .
- a coolant such as water is filled into the pump 20 and is circulated through the heat transfer loop under force from the pump 20 .
- the base 10 is made from Polyethylene (PE) or Acrylonitrile Butadiene Styrene (ABS), and has a rectangular configuration.
- the base 10 defines an opening 100 in a central portion thereof for receiving and securing the pump 20 therein.
- the base 10 forms a pair of ears 12 extending from left and right sides thereof, wherein a pair of mounting holes 120 is defined in each ear 12 for receiving screws 40 with springs 42 therein.
- Annular rings 44 are used to snap into recesses (not labeled) defined in lower portions of the screws 40 thereby to attach the screws 40 and the springs 42 to the base 10 before the liquid cooling system is mounted on a supporting member (not shown), for example, a printed circuit board on which a heat-generating electronic component is mounted.
- a pair of rectangular slots 102 , 104 is symmetrically defined at two opposite sides of the base 10 beside the opening 100 .
- a pair of rectangular channels 106 , 108 is respectively defined between the opening 100 and the slots 102 , 104 .
- the channels 106 , 108 communicate the opening 100 with the slots 102 , 104 .
- the pump 20 comprises a hollow casing 21 , a magnetic rotor 22 , a partition seat 23 , a stator 24 and a top cover 25 hermetically attached to a top end of the casing 21 .
- the casing 21 is made of a metallic material with good heat conductivity, and defines a chamber 212 for receiving the rotor 22 , the partition seat 23 and the stator 24 one on top of the other in that order therein.
- the casing 21 comprises a bottom plate 214 having a blind hole 213 defined in a central portion thereof.
- the bottom plate 214 serves as a heat-absorbing plate to contact with the heat-generating electronic component and absorb heat generated by the electronic component.
- An inlet 26 corresponding to the channel 106 of the base 10 and an outlet 27 corresponding to the channel 108 of the base 10 are formed at two opposite sides of an outer surface of the casing 21 , so that the coolant is capable of entering into casing 21 via the inlet 26 and exiting the casing 21 via the outlet 27 .
- the magnetic rotor 22 has a hollow cylindrical configuration and is mounted in the chamber 212 of the casing 21 .
- the rotor 22 includes an impeller having a wall 220 and a substrate 227 connecting with a bottom end of the wall 220 , and a magnetic ring 222 securely abutting against an inner surface of the wall 220 of the impeller.
- An upper axle 226 extends upwardly from a center of the substrate 227 of the impeller.
- a lower axle 228 extends downwardly from the center of the substrate 227 of the impeller, for engaging in the blind hole 213 of the bottom plate 214 of the casing 21 . Referring to FIGS.
- an agitator 223 is formed on a bottom surface of the substrate 227 and received in the chamber 212 of the casing 21 , for agitating the coolant of the chamber 212 .
- the agitator 223 comprises a plurality of agitating plates 225 .
- the shape of the agitating plate 225 is linear (shown in FIG. 6 ).
- the agitating plates 225 may have a curvilinear configuration (shown in FIGS. 7-8 ), wherein the agitating plates 225 of FIG. 8 are configured circularly around the lower axle 228 without connection with the lower axle 228 .
- the impeller forms a plurality of plate-shaped vanes 224 extending radially and outwardly from an outer surface of the wall 220 . When the rotor 22 rotates, the plate-shaped vanes 224 agitate the coolant in the chamber 212 of the casing 21 , for providing a pressure to the coolant and to thereby circulate the coolant in the liquid cooling system.
- the partition seat 23 is mounted between the rotor 22 and the stator 24 for isolating the coolant from the stator 24 to prevent the coolant from entering the stator 24 and short-circuiting the stator 24 .
- the partition seat 23 comprises a cylindrical body 231 having an outer circumferential surface mating with the magnetic ring 222 .
- the body 231 has an inner space 230 and an annular plate 233 extending outwardly from a top of the cylindrical body 231 .
- a shaft 236 extends upwardly from a center of a bottom portion 232 of the cylindrical body 231 .
- a mating hole 238 is defined in a center of the bottom portion 232 , for receiving the upper axle 226 of the rotor 22 therein.
- the rotor 22 mates with the casing 21 and the partition seat 23 to form a plurality of interconnecting surfaces therebetween, such as between a bottom surface of the annular plate 233 and a top surface of the wall 220 of the rotor 22 , and between the outer surface of the body 231 of the partition seat 23 and the inner surface of the magnetic ring 222 of the rotor 22 , between a bottom surface of the substrate 227 of the rotor 22 and a top surface of the bottom plate 214 of the casing 21 , and between an outer surface of the lower axle 228 and an inner surface of the blind hole 213 .
- one surface of the at least one pair of interconnecting surfaces forms a plurality of dynamic pressure generating grooves or protrusion means, thereby forming a fluid film therebetween for dynamically supporting a radial or axial thrust on the impeller and reducing friction therebetween during rotation of the rotor 22 .
- a plurality of dynamic pressure generating grooves 235 is formed on the outer circumferential surface of the body 231 mating with the smooth inner surface of the magnetic ring 222 of the impeller.
- the plurality of grooves 235 has a herringbone groove pattern.
- the herringbone groove pattern of the radial dynamic pressure generating grooves 235 are so formed as to provide a pumping action for thrusting the coolant between the outer circumferential surface of the body 231 and the inner surface of the magnetic ring 222 of the rotor 22 as the rotor 22 rotates, thereby forming a fluid film therebetween for dynamically supporting a radial thrust on the impeller.
- the thrust dynamic pressure generating grooves 235 may be formed on the inner surface of the magnetic ring 222 of the rotor for mating with the outer surface of the body 231 which is smooth according to the modification.
- the dynamic pressure generating grooves 235 of the partition seat 23 of FIGS. 4-5 may be replaced by a plurality of protrusions 234 which are formed on the outer circumferential surface of the body 231 mating with the smooth inner surface of the magnetic ring 222 of the impeller to form a fluid film therebetween for dynamically supporting a radial thrust on the impeller.
- a plurality of dynamic pressure generating grooves 237 is formed on the bottom surface of the annular plate 233 engaging with the smooth top surface of the wall 220 of the impeller of FIG. 5 .
- the plurality of grooves 237 has a herringbone groove pattern.
- the herringbone groove pattern of the dynamic pressure generating grooves 237 are so formed as to provide a pumping action for thrusting the coolant toward the bottom surface of the annular plate 233 of the partition seat 23 and the top surface of the impeller as the rotor 22 rotates, thereby forming a fluid film therebetween for dynamically supporting an axial thrust on the impeller.
- the dynamic pressure generating grooves 237 is formed on the bottom surface of the bottom portion 232 engaging with the smooth top surface of the substrate 227 of the rotor 22 .
- the dynamic pressure generating grooves 237 may be formed on a bottom surface of the substrate 227 .
- the dynamic pressure generating grooves (not shown) may be formed on the top surface of the wall 220 of the impeller to engage with the smooth bottom surface of the annular plate 233 of the partition seat 23 .
- the grooves formed on the top surface of the wall 220 of the impeller may be replaced by a plurality of protrusions 2222 (shown in FIG. 9 ), thereby forming a fluid film between the top surface of the wall 220 and the smooth bottom surface of the annular plate 233 of the partition seat 23 for dynamically supporting an axial thrust on the impeller.
- the stator 24 is received in the space 230 of the partition seat 23 .
- the stator 24 comprises a cylindrical center portion 241 having a center hole 243 defined therein, six generally T-shaped pole members 240 extending radially and outwardly from the center portion 241 .
- the center hole 243 of the center portion 241 fittingly receives the shaft 236 of the partition seat 23 .
- Each pole member 240 of the stator 24 is surrounded by a coil 242 .
- a printed circuit board (not shown) is mounted on a top of the center portion 241 and electrically connects with the coils of the stator 24 .
- the top cover 25 defines a center hole 250 therein, for providing passage of lead wires of the printed circuit board therethough. An edge of the top cover 25 hermetically contacts with the top of the casing 21 .
- the heat-dissipating member 30 includes a plurality of metal fins 301 , a plurality of heat-dissipating conduits 304 , and a pair of opposite fluid tanks 302 , 303 connected to ends of the heat-dissipating conduits 304 .
- the fluid tanks 302 , 303 have openings 3020 , 3030 corresponding to openings 1020 , 1040 of the slots 102 , 104 of the base 10 .
- the pump 20 is mounted in the center opening 100 of the base 10 , wherein the inlet 26 and the outlet 27 are respectively received in the channels 106 , 108 , and a pair of blocks 110 , 112 surrounding around the inlet 26 and the outlet 27 is clamped in the channels 106 , 108 , for fixing the inlet 26 and the outlet 27 to the channels 106 , 108 .
- the inlet 26 and the outlet 27 communicate with the slots 102 , 104 , respectively.
- the heat-dissipating member 30 is mounted on the base 10 , wherein the openings 3020 , 3030 of the fluid tanks 302 , 303 are communicated with the openings 1020 , 1040 of the slots 102 , 104 , respectively, so that the fluid tanks 302 , 303 of the heat-dissipating member 30 are in fluid communication with the slots 102 , 104 of the base 10 .
- the base 10 , the pump 20 and the heat-dissipating member 30 are connected together without any connecting tubes, and the pump 20 is in fluid communication with both the base 10 and the heat-dissipating member 30 so as to drive the coolant to circulate through the chamber 212 of the pump 20 , the slots 102 , 104 of the base 10 and the fluid tanks 302 , 303 and the conduits 304 of the heat-dissipating member 30 .
- the combination of the base 10 , the pump 20 and the heat-dissipating member 30 is fixed to the printed circuit board such that the bottom plate 214 of the pump 20 intimately contacts with the electronic component on the printed circuit board.
- the coils 242 of the stator 24 are powered firstly to drive the magnetic ring 222 to rotate.
- the impeller is driven to rotate with the magnetic ring 222 .
- the impeller thus rotates with the plate-shaped vanes 224 to circulate the coolant in the liquid cooling system.
- heat generated by the electronic component is absorbed by the bottom plate 214 of the pump 20 and then is transferred to the coolant contained in the chamber 212 of the casing 21 of the pump 20 .
- the rotatable impeller quickly agitates the coolant via the plate-shaped vanes 224 thereof and forces the coolant to circulate in the liquid cooling system.
- the coolant absorbing the heat has a higher temperature and is driven out of the casing 21 of the pump 20 via the outlet 27 , and flows to the heat-dissipating member 30 via the slot 104 of the base 10 and the fluid tank 303 of the heat-dissipating member 30 . Thereafter, the coolant flows to the fluid tank 302 through the conduits 304 where the heat is dissipated to ambient air via the fins 301 . After releasing the heat, the coolant having a lower temperature is brought back to the chamber 212 of the pump 20 via the inlet 26 , thus continuously transporting the heat away from the electronic component.
- FIG. 15 shows a pump 20 in accordance with a second embodiment.
- the pump 20 of the second embodiment is similar to that of the previous preferred embodiment.
- a magnetic ring 222 ′ replaces the magnetic ring 222 of the rotor 22 of the previous preferred embodiment.
- the magnetic ring 222 ′ is embedded in the top annular surface of the substrate 227 of the rotor 22 and abuts against an inner surface of the wall 220 ′.
- the magnetic ring 222 ′ is so configured as to reduce weight of the rotor 22 .
- the partition seat 23 has a larger inner space 230 ′ than the inner space 230 of the previous preferred embodiment.
- one surface of the at least one pair of interconnecting surfaces between the partition seat 23 and the rotor 22 and the casing 21 may form a plurality of dynamic pressure generating grooves or protrusion means 234 , 2222 , thereby forming a fluid film therebetween for dynamically supporting a radial or axial thrust on the impeller and reducing friction therebetween during rotation of the rotor 22 .
- FIG. 16 shows a pump 20 in accordance with a third embodiment.
- the pump 20 of the third embodiment is similar with that of the previous preferred embodiment of FIG. 5 .
- a rotor 22 ′ replaces the rotor 22 .
- the rotor 22 ′ includes an annular impeller having a wall 220 , and a magnetic ring 222 securely abutting against the inner surface of the wall 220 of the impeller.
- the impeller forms a plurality of plate-shaped vanes 224 extending radially and outwardly from an outer surface of the wall 220 .
- An agitator 223 in a form like spokes is formed at a bottom of the rotor 22 ′ below the magnetic ring 222 and received in the chamber 212 of the casing 21 , for agitating the coolant of the chamber 212 .
- the agitator 223 comprises a plurality of agitating plates 225 extending radially and outwardly around a center hole 221 of the rotor 22 to connect an inner surface of the wall 220 .
- the partition seat 23 forms a lower shaft 238 ′ at a center of the bottom portion 232 thereof, for passing through the hole 221 of the rotor 22 ′ and engaging in the blind hole 213 of the bottom plate 214 of the casing 21 .
- one surface of the at least one pair of interconnecting surfaces between the partition seat 23 and the rotor 22 ′ and the casing 21 may form a plurality of dynamic pressure generating grooves 235 or protrusion means 234 , 2222 , thereby forming a fluid film therebetween for dynamically supporting a radial or axial thrust on the impeller and reducing friction therebetween during a rotation of the rotor 22 ′.
- FIG. 17 shows a pump 20 and a base 10 ′ in accordance with a fourth embodiment.
- a base 10 ′ replaces the base 10 of the aforementioned embodiments.
- the base 10 ′ forms joint flanges 105 , 107 at a top of the slots 102 , 104 thereof, for hermetically engaging in the openings 3020 , 3030 of the fluid tanks 302 , 303 of the heat-dissipating member 30 .
- one surface of the at least one pair of interconnecting surfaces between the partition seat 23 and the rotor 22 and the casing 21 may form a plurality of dynamic pressure generating grooves (not shown) or protrusion means 234 , thereby forming a fluid film therebetween for dynamically supporting a radial or axial thrust on the impeller and reducing friction therebetween during a rotation of the rotor 22 .
- FIGS. 18-19 show a pump 20 ′ and a base 10 ′ in accordance with a fifth embodiment.
- a pump 20 ′ replaces the pump 20 of the aforementioned embodiments and the base 10 ′ is the same as the base 10 ′ of the fourth embodiment.
- Most parts of the pump 20 ′ of the fifth embodiment are the same as the aforementioned embodiments.
- a main difference is that in the fifth embodiment the pump 20 ′ comprises a casing 21 ′ having a plate-shaped configuration, while in the aforementioned embodiments the casing 21 has a cylindrical chamber.
- the casing 21 ′ comprises a disk-like plate 214 ′ having a top surface and a bottom surface. The bottom surface contacts with the heat-generating electronic component and absorbs the heat generated by the electronic component.
- a protrusion portion 215 ′ extends upwardly from the top surface of the plate 214 ′, for extending into the base 10 ′ and hermetically engaging in the opening 100 of the base 10 ′.
- the protrusion portion 215 ′ defines a blind hole 216 ′ in a central portion thereof, for receiving the lower axle 228 of the rotor 22 therein.
- one surface of the at least one pair of interconnecting surfaces between the partition seat 23 and the rotor 22 and the casing 21 may form a plurality of dynamic pressure generating grooves 235 or protrusion means 2222 , thereby forming a fluid film therebetween for dynamically supporting a radial or axial thrust on the impeller and reducing friction therebetween during a rotation of the rotor 22 .
- the magnetic rotor 22 , the partition seat 23 , the stator 24 are sequentially mounted in the opening 100 .
- the top cover 25 is secured to the base 10 ′ and covers a top of the opening 100 .
Abstract
An integrated liquid cooling system for removing heat from a heat-generating component includes a base (10), a pump (20) mounted in the base, and a heat-dissipating member (30) communicating with the pump and coupling with the base. The pump includes a casing (21) having a chamber (212). A rotor (22), a partition seat (23) and a stator (24) are received in the chamber. A top cover (25) is attached on the casing. The casing includes a bottom plate (214) absorbing heat generated by the electronic component. A plurality of pairs of interconnecting surfaces are formed between the partition seat and the rotor and between the rotor and the bottom plate, one surface of the at least one pair of interconnecting surfaces forming a plurality of grooves (235, 237) or protrusions (234, 2222), thereby forming a fluid film therebetween for dynamically supporting a thrust on the rotor during a rotation of the rotor.
Description
- This application is related to U.S. patent application Ser. No. 11/308,547 filed on Apr. 5, 2006 and entitled “INTEGRATED LIQUID COOLING SYSTEM”; the co-pending U.S. patent application is assigned to the same assignee as the instant application. The disclosure of the above-identified application is incorporated herein by reference.
- The present invention relates generally to a liquid cooling system for dissipation of heat from heat-generating components, and more particularly to an integrated liquid cooling system suitable for removing heat from electronic components of computers.
- With the continuing development of computer technology, electronic packages such as central processing units (CPUs) are generating more and more heat that requires immediate dissipation. Conventional heat dissipating devices such as combined heat sinks and fans are not effective enough to dissipate the heat generated by modern integrated chip packages. Liquid cooling systems have therefore been increasingly used in computer technology to cool these electronic packages.
- A typical liquid cooling system generally comprises a heat-absorbing member, a heat-dissipating member and a pump. These individual components are connected together in series so as to form a heat transfer loop. In practice, the heat-absorbing member is maintained in thermal contact with a heat-generating component (e.g. a CPU) for absorbing heat generated by the CPU. The liquid cooling system employs a coolant circulating through the heat transfer loop so as to continuously transport the thermal energy absorbed by the heat-absorbing member to the heat-dissipating member where the heat is dissipated. The pump is used to drive the coolant, after being cooled in the heat-dissipating member, back to the heat-absorbing member.
- In the typical liquid cooling system, the heat-absorbing member, the heat-dissipating member and the pump are connected together generally by a plurality of connecting tubes so as to form the heat transfer loop. However, the typical liquid cooling system has a big volume and occupies more room in a computer system, and is not adapted to the small size necessary for a personal computer. Furthermore, the liquid cooling system has many connecting tubes with a plurality of connections, which are prone to leakage of the coolant so giving the system low reliability and high cost. Moreover, the heat-absorbing member, the heat-dissipating member and the pump are to be located at different locations when mounted to the computer system. In this situation, mounting of the liquid cooling system to the computer system or demounting of the liquid cooling system from the computer system is tiresome and time-consuming work. In addition, vibration and noise produced by the reciprocating pump adversely affect the heat-generating component and the computer system.
- Therefore, it is desirable to provide a liquid cooling system which overcomes the foregoing disadvantages.
- An integrated liquid cooling system in accordance with an embodiment for removing heat from a heat-generating electronic component includes a base, a pump mounted in the base and a heat-dissipating member communicating with the pump and coupling with the base. The pump includes a casing having a chamber. A rotor, a partition seat and a stator are in turn received in the chamber. A top cover is attached on the casing. The casing includes a bottom plate absorbing heat generated by the electronic component. A plurality of pairs of interconnecting surfaces are formed between the partition seat and the rotor and the bottom plate, one surface of the at least one pair of interconnecting surfaces forming a plurality of grooves or protrusions, thereby forming a fluid film therebetween for dynamically supporting thrust on the rotor during rotation of the rotor.
- Other advantages and novel features of the present invention will become more apparent from the following detailed description of preferred embodiment when taken in conjunction with the accompanying drawings, in which:
- Many aspects of the present apparatus and method can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present apparatus and method. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
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FIG. 1 is an assembled, isometric view of a liquid cooling system in accordance with a preferred embodiment of the present invention; -
FIG. 2 is an exploded view ofFIG. 1 , but shown from another aspect; -
FIG. 3 is an isometric view of a heat-dissipating member of the liquid cooling system ofFIG. 2 ; -
FIG. 4 is an exploded view of a pump of the liquid cooling system ofFIG. 2 ; -
FIG. 5 is a view similar toFIG. 4 , but shown from a different aspect; -
FIGS. 6-8 , 11, 14 are isometric views of a rotor in accordance with other embodiments. -
FIG. 9 is an exploded view of a pump of the liquid cooling system ofFIG. 2 with a minor modification; - FIGS. 10,12-13 are isometric views of a partition seat in accordance with other embodiments.
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FIG. 15 is an exploded view of a pump of a liquid cooling system in accordance with a second embodiment; -
FIG. 16 is an exploded view of a pump of a liquid cooling system in accordance with a third embodiment; -
FIG. 17 is an exploded view of a pump and a base of a liquid cooling system in accordance with a fourth embodiment; -
FIG. 18 is an exploded view of a pump and a base of a liquid cooling system in accordance with a fifth embodiment; and -
FIG. 19 is an assembled, cross-sectional view of the pump and the base ofFIG. 18 . -
FIG. 1 andFIG. 2 illustrate a liquid cooling system in accordance with a preferred embodiment of the present invention. The liquid cooling system includes abase 10, apump 20 mounted in thebase 10, and a heat-dissipatingmember 30 communicating with thepump 20 and coupling with thebase 10. Thebase 10, thepump 20 and the heat-dissipatingmember 30 are connected together in series without any connecting tubes. A heat transfer loop is formed by thebase 10, thepump 20 and theheat dissipating member 30. A coolant such as water is filled into thepump 20 and is circulated through the heat transfer loop under force from thepump 20. - The
base 10 is made from Polyethylene (PE) or Acrylonitrile Butadiene Styrene (ABS), and has a rectangular configuration. Thebase 10 defines anopening 100 in a central portion thereof for receiving and securing thepump 20 therein. Thebase 10 forms a pair ofears 12 extending from left and right sides thereof, wherein a pair ofmounting holes 120 is defined in eachear 12 for receivingscrews 40 withsprings 42 therein.Annular rings 44 are used to snap into recesses (not labeled) defined in lower portions of thescrews 40 thereby to attach thescrews 40 and thesprings 42 to thebase 10 before the liquid cooling system is mounted on a supporting member (not shown), for example, a printed circuit board on which a heat-generating electronic component is mounted. A pair ofrectangular slots base 10 beside theopening 100. A pair ofrectangular channels opening 100 and theslots channels slots - With reference also to
FIGS. 4-5 , thepump 20 comprises ahollow casing 21, amagnetic rotor 22, apartition seat 23, astator 24 and atop cover 25 hermetically attached to a top end of thecasing 21. - The
casing 21 is made of a metallic material with good heat conductivity, and defines achamber 212 for receiving therotor 22, thepartition seat 23 and thestator 24 one on top of the other in that order therein. Thecasing 21 comprises abottom plate 214 having ablind hole 213 defined in a central portion thereof. Thebottom plate 214 serves as a heat-absorbing plate to contact with the heat-generating electronic component and absorb heat generated by the electronic component. Aninlet 26 corresponding to thechannel 106 of thebase 10 and anoutlet 27 corresponding to thechannel 108 of thebase 10 are formed at two opposite sides of an outer surface of thecasing 21, so that the coolant is capable of entering intocasing 21 via theinlet 26 and exiting thecasing 21 via theoutlet 27. - The
magnetic rotor 22 has a hollow cylindrical configuration and is mounted in thechamber 212 of thecasing 21. Therotor 22 includes an impeller having awall 220 and asubstrate 227 connecting with a bottom end of thewall 220, and amagnetic ring 222 securely abutting against an inner surface of thewall 220 of the impeller. Anupper axle 226 extends upwardly from a center of thesubstrate 227 of the impeller. Alower axle 228 extends downwardly from the center of thesubstrate 227 of the impeller, for engaging in theblind hole 213 of thebottom plate 214 of thecasing 21. Referring toFIGS. 6-8 , anagitator 223 is formed on a bottom surface of thesubstrate 227 and received in thechamber 212 of thecasing 21, for agitating the coolant of thechamber 212. Theagitator 223 comprises a plurality of agitatingplates 225. The shape of the agitatingplate 225 is linear (shown inFIG. 6 ). Alternatively, the agitatingplates 225 may have a curvilinear configuration (shown inFIGS. 7-8 ), wherein the agitatingplates 225 ofFIG. 8 are configured circularly around thelower axle 228 without connection with thelower axle 228. The impeller forms a plurality of plate-shapedvanes 224 extending radially and outwardly from an outer surface of thewall 220. When therotor 22 rotates, the plate-shapedvanes 224 agitate the coolant in thechamber 212 of thecasing 21, for providing a pressure to the coolant and to thereby circulate the coolant in the liquid cooling system. - The
partition seat 23 is mounted between therotor 22 and thestator 24 for isolating the coolant from thestator 24 to prevent the coolant from entering thestator 24 and short-circuiting thestator 24. Thepartition seat 23 comprises acylindrical body 231 having an outer circumferential surface mating with themagnetic ring 222. Thebody 231 has aninner space 230 and anannular plate 233 extending outwardly from a top of thecylindrical body 231. Ashaft 236 extends upwardly from a center of abottom portion 232 of thecylindrical body 231. Amating hole 238 is defined in a center of thebottom portion 232, for receiving theupper axle 226 of therotor 22 therein. - The
rotor 22 mates with thecasing 21 and thepartition seat 23 to form a plurality of interconnecting surfaces therebetween, such as between a bottom surface of theannular plate 233 and a top surface of thewall 220 of therotor 22, and between the outer surface of thebody 231 of thepartition seat 23 and the inner surface of themagnetic ring 222 of therotor 22, between a bottom surface of thesubstrate 227 of therotor 22 and a top surface of thebottom plate 214 of thecasing 21, and between an outer surface of thelower axle 228 and an inner surface of theblind hole 213. Among the plurality of pairs of interconnecting surfaces, one surface of the at least one pair of interconnecting surfaces forms a plurality of dynamic pressure generating grooves or protrusion means, thereby forming a fluid film therebetween for dynamically supporting a radial or axial thrust on the impeller and reducing friction therebetween during rotation of therotor 22. - Again referring to
FIGS. 4-5 , a plurality of dynamicpressure generating grooves 235 is formed on the outer circumferential surface of thebody 231 mating with the smooth inner surface of themagnetic ring 222 of the impeller. The plurality ofgrooves 235 has a herringbone groove pattern. The herringbone groove pattern of the radial dynamicpressure generating grooves 235 are so formed as to provide a pumping action for thrusting the coolant between the outer circumferential surface of thebody 231 and the inner surface of themagnetic ring 222 of therotor 22 as therotor 22 rotates, thereby forming a fluid film therebetween for dynamically supporting a radial thrust on the impeller. Referring toFIG. 9 , according to a minor modification of thepump 20 of this embodiment, the thrust dynamicpressure generating grooves 235 may be formed on the inner surface of themagnetic ring 222 of the rotor for mating with the outer surface of thebody 231 which is smooth according to the modification. - Referring to
FIG. 10 , the dynamicpressure generating grooves 235 of thepartition seat 23 ofFIGS. 4-5 may be replaced by a plurality ofprotrusions 234 which are formed on the outer circumferential surface of thebody 231 mating with the smooth inner surface of themagnetic ring 222 of the impeller to form a fluid film therebetween for dynamically supporting a radial thrust on the impeller. ReferringFIG. 11 , the dynamicpressure generating grooves 235 of themagnetic ring 222 ofFIG. 9 may be replaced by a plurality ofprotrusions 234 formed on the inner surface of themagnetic ring 222 of therotor 20 mating with the smooth outer surface of thebody 231 to form a fluid film therebetween for dynamically supporting a radial thrust on the impeller. - Referring
FIG. 12 , a plurality of dynamicpressure generating grooves 237 is formed on the bottom surface of theannular plate 233 engaging with the smooth top surface of thewall 220 of the impeller ofFIG. 5 . The plurality ofgrooves 237 has a herringbone groove pattern. The herringbone groove pattern of the dynamicpressure generating grooves 237 are so formed as to provide a pumping action for thrusting the coolant toward the bottom surface of theannular plate 233 of thepartition seat 23 and the top surface of the impeller as therotor 22 rotates, thereby forming a fluid film therebetween for dynamically supporting an axial thrust on the impeller. Referring toFIG. 13 , the dynamicpressure generating grooves 237 is formed on the bottom surface of thebottom portion 232 engaging with the smooth top surface of thesubstrate 227 of therotor 22. Referring toFIG. 14 , the dynamicpressure generating grooves 237 may be formed on a bottom surface of thesubstrate 227. Referring toFIG. 5 , the dynamic pressure generating grooves (not shown) may be formed on the top surface of thewall 220 of the impeller to engage with the smooth bottom surface of theannular plate 233 of thepartition seat 23. The grooves formed on the top surface of thewall 220 of the impeller may be replaced by a plurality of protrusions 2222 (shown inFIG. 9 ), thereby forming a fluid film between the top surface of thewall 220 and the smooth bottom surface of theannular plate 233 of thepartition seat 23 for dynamically supporting an axial thrust on the impeller. - Referring to
FIG. 4 , thestator 24 is received in thespace 230 of thepartition seat 23. Thestator 24 comprises acylindrical center portion 241 having acenter hole 243 defined therein, six generally T-shapedpole members 240 extending radially and outwardly from thecenter portion 241. Thecenter hole 243 of thecenter portion 241 fittingly receives theshaft 236 of thepartition seat 23. Eachpole member 240 of thestator 24 is surrounded by acoil 242. A printed circuit board (not shown) is mounted on a top of thecenter portion 241 and electrically connects with the coils of thestator 24. - The
top cover 25 defines acenter hole 250 therein, for providing passage of lead wires of the printed circuit board therethough. An edge of thetop cover 25 hermetically contacts with the top of thecasing 21. - Referring to
FIG. 2 andFIG. 3 , the heat-dissipatingmember 30 includes a plurality ofmetal fins 301, a plurality of heat-dissipatingconduits 304, and a pair of oppositefluid tanks conduits 304. Thefluid tanks openings openings slots base 10. - In assembly, the
pump 20 is mounted in the center opening 100 of thebase 10, wherein theinlet 26 and theoutlet 27 are respectively received in thechannels blocks inlet 26 and theoutlet 27 is clamped in thechannels inlet 26 and theoutlet 27 to thechannels inlet 26 and theoutlet 27 communicate with theslots member 30 is mounted on thebase 10, wherein theopenings fluid tanks openings slots fluid tanks member 30 are in fluid communication with theslots base 10. Thus, thebase 10, thepump 20 and the heat-dissipatingmember 30 are connected together without any connecting tubes, and thepump 20 is in fluid communication with both thebase 10 and the heat-dissipatingmember 30 so as to drive the coolant to circulate through thechamber 212 of thepump 20, theslots base 10 and thefluid tanks conduits 304 of the heat-dissipatingmember 30. The combination of thebase 10, thepump 20 and the heat-dissipatingmember 30 is fixed to the printed circuit board such that thebottom plate 214 of thepump 20 intimately contacts with the electronic component on the printed circuit board. - In operation, the
coils 242 of thestator 24 are powered firstly to drive themagnetic ring 222 to rotate. The impeller is driven to rotate with themagnetic ring 222. The impeller thus rotates with the plate-shapedvanes 224 to circulate the coolant in the liquid cooling system. Simultaneously, heat generated by the electronic component is absorbed by thebottom plate 214 of thepump 20 and then is transferred to the coolant contained in thechamber 212 of thecasing 21 of thepump 20. The rotatable impeller quickly agitates the coolant via the plate-shapedvanes 224 thereof and forces the coolant to circulate in the liquid cooling system. The coolant absorbing the heat has a higher temperature and is driven out of thecasing 21 of thepump 20 via theoutlet 27, and flows to the heat-dissipatingmember 30 via theslot 104 of thebase 10 and thefluid tank 303 of the heat-dissipatingmember 30. Thereafter, the coolant flows to thefluid tank 302 through theconduits 304 where the heat is dissipated to ambient air via thefins 301. After releasing the heat, the coolant having a lower temperature is brought back to thechamber 212 of thepump 20 via theinlet 26, thus continuously transporting the heat away from the electronic component. -
FIG. 15 shows apump 20 in accordance with a second embodiment. Thepump 20 of the second embodiment is similar to that of the previous preferred embodiment. However, amagnetic ring 222′ replaces themagnetic ring 222 of therotor 22 of the previous preferred embodiment. Themagnetic ring 222′ is embedded in the top annular surface of thesubstrate 227 of therotor 22 and abuts against an inner surface of thewall 220′. Themagnetic ring 222′ is so configured as to reduce weight of therotor 22. Thepartition seat 23 has a largerinner space 230′ than theinner space 230 of the previous preferred embodiment. In the second embodiment, one surface of the at least one pair of interconnecting surfaces between thepartition seat 23 and therotor 22 and thecasing 21 may form a plurality of dynamic pressure generating grooves or protrusion means 234, 2222, thereby forming a fluid film therebetween for dynamically supporting a radial or axial thrust on the impeller and reducing friction therebetween during rotation of therotor 22. -
FIG. 16 shows apump 20 in accordance with a third embodiment. Thepump 20 of the third embodiment is similar with that of the previous preferred embodiment ofFIG. 5 . However, arotor 22′ replaces therotor 22. Therotor 22′ includes an annular impeller having awall 220, and amagnetic ring 222 securely abutting against the inner surface of thewall 220 of the impeller. The impeller forms a plurality of plate-shapedvanes 224 extending radially and outwardly from an outer surface of thewall 220. Anagitator 223 in a form like spokes is formed at a bottom of therotor 22′ below themagnetic ring 222 and received in thechamber 212 of thecasing 21, for agitating the coolant of thechamber 212. Theagitator 223 comprises a plurality of agitatingplates 225 extending radially and outwardly around acenter hole 221 of therotor 22 to connect an inner surface of thewall 220. Thepartition seat 23 forms alower shaft 238′ at a center of thebottom portion 232 thereof, for passing through thehole 221 of therotor 22′ and engaging in theblind hole 213 of thebottom plate 214 of thecasing 21. In the third embodiment, one surface of the at least one pair of interconnecting surfaces between thepartition seat 23 and therotor 22′ and thecasing 21 may form a plurality of dynamicpressure generating grooves 235 or protrusion means 234, 2222, thereby forming a fluid film therebetween for dynamically supporting a radial or axial thrust on the impeller and reducing friction therebetween during a rotation of therotor 22′. -
FIG. 17 shows apump 20 and a base 10′ in accordance with a fourth embodiment. In the fourth embodiment, a base 10′ replaces thebase 10 of the aforementioned embodiments. The base 10′ formsjoint flanges slots openings fluid tanks member 30. In the fourth embodiment, one surface of the at least one pair of interconnecting surfaces between thepartition seat 23 and therotor 22 and thecasing 21 may form a plurality of dynamic pressure generating grooves (not shown) or protrusion means 234, thereby forming a fluid film therebetween for dynamically supporting a radial or axial thrust on the impeller and reducing friction therebetween during a rotation of therotor 22. -
FIGS. 18-19 show apump 20′ and a base 10′ in accordance with a fifth embodiment. In the fifth embodiment, apump 20′ replaces thepump 20 of the aforementioned embodiments and the base 10′ is the same as the base 10′ of the fourth embodiment. Most parts of thepump 20′ of the fifth embodiment are the same as the aforementioned embodiments. A main difference is that in the fifth embodiment thepump 20′ comprises acasing 21′ having a plate-shaped configuration, while in the aforementioned embodiments thecasing 21 has a cylindrical chamber. Thecasing 21′ comprises a disk-like plate 214′ having a top surface and a bottom surface. The bottom surface contacts with the heat-generating electronic component and absorbs the heat generated by the electronic component. A protrusion portion 215′ extends upwardly from the top surface of theplate 214′, for extending into the base 10′ and hermetically engaging in theopening 100 of the base 10′. The protrusion portion 215′ defines ablind hole 216′ in a central portion thereof, for receiving thelower axle 228 of therotor 22 therein. After thecasing 21′ is mounted to a bottom of the base 10′ with the protrusion 215′ fitted in a lower part of theopening 100, achamber 212′ of thepump 20′ is defined by a part of theopening 100 above thecasing 21′. In the fifth embodiment, one surface of the at least one pair of interconnecting surfaces between thepartition seat 23 and therotor 22 and thecasing 21 may form a plurality of dynamicpressure generating grooves 235 or protrusion means 2222, thereby forming a fluid film therebetween for dynamically supporting a radial or axial thrust on the impeller and reducing friction therebetween during a rotation of therotor 22. In the fifth embodiment, themagnetic rotor 22, thepartition seat 23, thestator 24 are sequentially mounted in theopening 100. Finally, thetop cover 25 is secured to the base 10′ and covers a top of theopening 100. - It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (17)
1. A liquid cooling system for a heat-generating electronic component comprising:
a base defining therein a center opening and slots, and channels communicating the opening with the slots;
a heat-dissipating member mounted to the base, and defining therein a plurality of fluid flow channels for passage of a coolant;
a pump having a chamber receiving the coolant therein, and being mounted in the opening and being in fluid communication with the channels of the base and the channels of the heat-dissipating member via the slots, the pump comprising a bottom plate having a top surface and a bottom surface, and a rotor received and rotating in the chamber, a plurality of pairs of interconnecting surfaces formed between the rotor and the chamber, one surface of the at least one pair of interconnecting surfaces forming a plurality of grooves or protrusions, thereby forming a fluid film therebetween for dynamically supporting a thrust on the rotor during a rotation of the rotor.
2. The liquid cooling system of claim 1 , wherein the pump comprises a casing having the chamber and the bottom plate, the rotor, a partition seat, a stator and a top cover hermetically attached to a top end of the casing, wherein the rotor, the partition seat and the stator are received one after the other in that order in the chamber of the casing, the partition seat is mounted between the rotor and the stator for isolating the coolant from the stator to prevent the coolant entering the stator.
3. The liquid cooling system of claim 2 , wherein the partition seat comprises a body having an inner space and a bottom portion, and a plate extending outwardly from a top of the body.
4. The liquid cooling system of claim 3 , wherein the rotor comprises a wall having a plurality of vanes extending outwardly form an outer surface of the wall.
5. The liquid cooling system of claim 4 , wherein the plate of the partition seat mates with a top surface of the wall to form a plurality of interconnecting surfaces therebetween, and one of the interconnecting surfaces forms a plurality of grooves or protrusions.
6. The liquid cooling system of claim 4 , wherein a magnetic ring abuts against an inner surface of the wall and mates with an inner surface of the body to form a plurality of interconnecting surfaces therebetween, and one of the interconnecting surfaces forms a plurality of grooves or protrusions.
7. The liquid cooling system of claim 6 , an agitator is received in the chamber of the casing and formed below the magnetic ring of the rotor, for agitating the coolant in the chamber of the casing.
8. The liquid cooling system of claim 7 , wherein the agitator comprises a plurality of agitating plates extending radially and outwardly from a center of the rotor to connect with an inner surface of the wall.
9. The liquid cooling system of claim 4 , wherein a substrate is connected with a bottom end of the wall, the substrate having a bottom surface mating with a top surface of the bottom plate of the casing to form a plurality of interconnecting surfaces therebetween, and one of the interconnecting surfaces forms a plurality of grooves or protrusions.
10. The liquid cooling system of claim 9 , wherein a magnetic ring is embedded in the top surface of the substrate and abuts against an inner surface of the wall of the rotor.
11. The liquid cooling system of claim 9 , wherein the bottom portion of the partition seat mates with the substrate of the rotor to form a plurality of interconnecting surfaces therebetween, and one of the interconnecting surfaces forms a plurality of grooves or protrusions.
12. The liquid cooling system of claim 1 , wherein the heat-dissipating member comprises a plurality of fins, a plurality of heat-dissipating conduits, and a pair of opposite fluid tanks connected to ends of the heat-dissipating conduits, wherein the heat-dissipating conduits and the fluid tanks form the plurality of fluid flow channels.
13. The liquid cooling system of claim 12 , wherein joint flanges are formed at tops of the slots, for hermetically engaging in the fluid tanks of the heat-dissipating member.
14. A pump for use with a liquid cooling system comprising:
a casing defining therein a chamber with a heat-absorbing plate adapted for contacting with a heat-generating electronic component, and an inlet and an outlet both being in flow communication with the chamber;
a rotor received in the chamber, the rotor comprising an impeller being rotatable to drive the liquid to enter the chamber via the inlet and to exit the chamber via the outlet, a magnetic ring being carried by the impeller, the impeller comprising a cylindrical wall;
a stator received in the chamber to drive the rotor to rotate;
a partition seat received in the chamber and arranged between the stator and the rotor to space the stator and the rotor, the partition seat comprising a cylindrical body having a bottom portion, an annular plate extending outwardly from a top of the cylindrical body; and
a top cover mounted to a top of the casing;
wherein a plurality of pairs of interconnecting surfaces are formed between the partition seat and the rotor and between the bottom plate and the rotor, one surface of the at least one pair of interconnecting surfaces forming a plurality of grooves or protrusions, thereby forming a fluid film therebetween for dynamically supporting a thrust on the impeller during a rotation of the rotor.
15. The pump of claim 14 , wherein a substrate is connected with a bottom end of the wall of the impeller.
16. The pump of claim 15 , wherein the magnetic ring abuts against an inner surface of the wall.
17. The pump of claim 16 , wherein the plurality of pairs of interconnecting surfaces comprises interconnecting surfaces formed between the annular plate of the partition seat and a top of the wall of the rotor, and interconnecting surfaces formed between an outer surface of the body of the partition seat and an inner surface of the magnetic ring of the rotor, and interconnecting surfaces formed between the bottom portion of the partition seat and the substrate of the rotor, and interconnecting surfaces formed between the substrate of the rotor and the bottom plate of the casing.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200510101502.4 | 2005-11-16 | ||
CNB2005101015024A CN100468710C (en) | 2005-11-16 | 2005-11-16 | Integrated liquid cooling heat radiator |
Publications (1)
Publication Number | Publication Date |
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US20070110559A1 true US20070110559A1 (en) | 2007-05-17 |
Family
ID=38040990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/308,833 Abandoned US20070110559A1 (en) | 2005-11-16 | 2006-05-12 | Integrated liquid cooling system |
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US (1) | US20070110559A1 (en) |
CN (1) | CN100468710C (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US20190307020A1 (en) * | 2018-03-30 | 2019-10-03 | Nidec Corporation | Cooling apparatus |
US20190307019A1 (en) * | 2018-03-30 | 2019-10-03 | Nidec Corporation | Cooling apparatus |
CN112696382A (en) * | 2019-10-23 | 2021-04-23 | 建准电机工业股份有限公司 | Thin pump |
US11391520B2 (en) * | 2019-08-13 | 2022-07-19 | Shenzhen APALTEK Co., Ltd. | Liquid cooling device with water tank structure |
GB2622110A (en) * | 2022-09-02 | 2024-03-06 | City Univ Of London | Pump |
WO2024047226A1 (en) * | 2022-09-02 | 2024-03-07 | City, University of London | Pump |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101451531B (en) * | 2007-11-30 | 2012-07-04 | 富准精密工业(深圳)有限公司 | Pump |
CN110867424B (en) * | 2019-11-21 | 2022-02-18 | 上海交通大学 | Micro-channel heat sink system with built-in micro-rotor for strengthening heat exchange of nanofluid |
CN113190926B (en) * | 2021-04-20 | 2023-02-10 | 西安理工大学 | Modeling method for microprotrusion contact containing nonmetallic inclusions |
CN114307551A (en) * | 2021-12-29 | 2022-04-12 | 高邮市环创资源再生科技有限公司 | High tower exhaust-gas treatment equipment |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6050785A (en) * | 1998-11-04 | 2000-04-18 | Sunonwealth Electric Machine Industry Co., Ltd. | Axle balance plates for miniature heat dissipating fan assemblies |
US6132170A (en) * | 1998-12-14 | 2000-10-17 | Sunonwealth Electric Machine Industry Co., Ltd. | Miniature heat dissipating fans with minimized thickness |
US6808371B2 (en) * | 2001-09-25 | 2004-10-26 | Matsushita Electric Industrial Co., Ltd. | Ultra-thin pump and cooling system including the pump |
US6839234B2 (en) * | 2002-05-15 | 2005-01-04 | Matsushita Electric Industrial Co., Ltd. | Cooling device and an electronic apparatus including the same |
US20050226745A1 (en) * | 2004-03-31 | 2005-10-13 | Kabushiki Kaisha Toshiba | Pump, cooling apparatus, electrical appliance and personal computer combined with the pump |
US7016195B2 (en) * | 2002-11-28 | 2006-03-21 | Kabushiki Kaisha Toshiba | Cooling fluid pump and electric apparatus, such as personal computer, provided with the pump |
US7071587B2 (en) * | 2001-09-07 | 2006-07-04 | Rotys Inc. | Integrated cooler for electronic devices |
US7209355B2 (en) * | 2002-05-15 | 2007-04-24 | Matsushita Electric Industrial Co., Ltd. | Cooling device and an electronic apparatus including the same |
US7232292B2 (en) * | 2001-08-21 | 2007-06-19 | Rotys Inc. | Integrated motorized pump |
US7312986B2 (en) * | 2005-02-21 | 2007-12-25 | Kabushiki Kaisha Toshiba | Cooling device for an electronic apparatus |
US7319587B2 (en) * | 2003-09-30 | 2008-01-15 | Kabushiki Kaisha Toshiba | Electronic apparatus having pump unit |
-
2005
- 2005-11-16 CN CNB2005101015024A patent/CN100468710C/en not_active Expired - Fee Related
-
2006
- 2006-05-12 US US11/308,833 patent/US20070110559A1/en not_active Abandoned
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6050785A (en) * | 1998-11-04 | 2000-04-18 | Sunonwealth Electric Machine Industry Co., Ltd. | Axle balance plates for miniature heat dissipating fan assemblies |
US6132170A (en) * | 1998-12-14 | 2000-10-17 | Sunonwealth Electric Machine Industry Co., Ltd. | Miniature heat dissipating fans with minimized thickness |
US7232292B2 (en) * | 2001-08-21 | 2007-06-19 | Rotys Inc. | Integrated motorized pump |
US7071587B2 (en) * | 2001-09-07 | 2006-07-04 | Rotys Inc. | Integrated cooler for electronic devices |
US6808371B2 (en) * | 2001-09-25 | 2004-10-26 | Matsushita Electric Industrial Co., Ltd. | Ultra-thin pump and cooling system including the pump |
US6839234B2 (en) * | 2002-05-15 | 2005-01-04 | Matsushita Electric Industrial Co., Ltd. | Cooling device and an electronic apparatus including the same |
US7209355B2 (en) * | 2002-05-15 | 2007-04-24 | Matsushita Electric Industrial Co., Ltd. | Cooling device and an electronic apparatus including the same |
US7016195B2 (en) * | 2002-11-28 | 2006-03-21 | Kabushiki Kaisha Toshiba | Cooling fluid pump and electric apparatus, such as personal computer, provided with the pump |
US7319587B2 (en) * | 2003-09-30 | 2008-01-15 | Kabushiki Kaisha Toshiba | Electronic apparatus having pump unit |
US20050226745A1 (en) * | 2004-03-31 | 2005-10-13 | Kabushiki Kaisha Toshiba | Pump, cooling apparatus, electrical appliance and personal computer combined with the pump |
US7312986B2 (en) * | 2005-02-21 | 2007-12-25 | Kabushiki Kaisha Toshiba | Cooling device for an electronic apparatus |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190307020A1 (en) * | 2018-03-30 | 2019-10-03 | Nidec Corporation | Cooling apparatus |
US20190307019A1 (en) * | 2018-03-30 | 2019-10-03 | Nidec Corporation | Cooling apparatus |
US11236738B2 (en) * | 2018-03-30 | 2022-02-01 | Nidec Corporation | Cooling apparatus |
US11252837B2 (en) * | 2018-03-30 | 2022-02-15 | Nidec Corporation | Cooling apparatus |
US11391520B2 (en) * | 2019-08-13 | 2022-07-19 | Shenzhen APALTEK Co., Ltd. | Liquid cooling device with water tank structure |
CN112696382A (en) * | 2019-10-23 | 2021-04-23 | 建准电机工业股份有限公司 | Thin pump |
TWI747065B (en) * | 2019-10-23 | 2021-11-21 | 建準電機工業股份有限公司 | Thin pump |
GB2622110A (en) * | 2022-09-02 | 2024-03-06 | City Univ Of London | Pump |
WO2024047226A1 (en) * | 2022-09-02 | 2024-03-07 | City, University of London | Pump |
Also Published As
Publication number | Publication date |
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CN100468710C (en) | 2009-03-11 |
CN1967823A (en) | 2007-05-23 |
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JP2000341902A (en) | Fan motor with heat sink and small-sized flat motor |
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Owner name: FOXCONN TECHNOLOGY CO., LTD.,TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIU, TAY-JIAN;HOU, CHUEN-SHU;TUNG, CHAO-NIEN;REEL/FRAME:017610/0978 Effective date: 20060424 |
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