US20090154169A1 - Led lamp with a heat sink - Google Patents
Led lamp with a heat sink Download PDFInfo
- Publication number
- US20090154169A1 US20090154169A1 US12/039,637 US3963708A US2009154169A1 US 20090154169 A1 US20090154169 A1 US 20090154169A1 US 3963708 A US3963708 A US 3963708A US 2009154169 A1 US2009154169 A1 US 2009154169A1
- Authority
- US
- United States
- Prior art keywords
- post
- led
- led lamp
- holder
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a light emitting diode (LED) lamp, and more particularly to an LED lamp incorporating a heat sink for enhancing a heat dissipation thereof.
- LED light emitting diode
- an LED lamp has a trend of substituting for the fluorescent lamp for an indoor lighting purpose; in order to increase the overall lighting brightness, a plurality of LEDs are often incorporated into a signal lamp, in which how to efficiently dissipate heat generated by the plurality of LEDs becomes a challenge.
- an LED lamp comprises a solid cylinder and a plurality of LEDs mounted on the cylinder.
- the plurality of LEDs may be arranged in a plurality of lines on a circumferential periphery of the cylinder and along a height direction of the cylinder, or just radially mounted on a top surface of the cylinder.
- heat generated by the plurality of LEDs is dispersed to ambient air via the cylinder.
- the heat dissipating capability of the cylinder is limited since a size limitation of the LED lamp. In order to obtain more heat dissipating areas, the cylinder should be made having a large size. However, it is costly to just increase a volume of the cylinder since much more material is needed when manufacturing the solid cylinder. Furthermore, the increase of the volume of the solid cylinder also causes the LED lamp to become heavy, which may lead an inconvenient transportation or handling thereof.
- An LED lamp includes a post, a heat sink enclosing the post, an LED module mounted in the post, a holder secured on the LED module, and a lens covering the holder.
- the heat sink is formed by a plurality of parallel fins, each having an annular and planar configuration to contact and surround the post. Since the heat sink is formed around the post, heat generated by an LED of the LED module is able to be conducted via the post to the heat sink, which dissipates the heat to the ambient air sufficiently since the fins of the heat sink have a large heat dissipating area. Furthermore, a light weight and low cost of the plurality of fins facilitate a transportation and handling of the LED lamp and reduce a total cost of the LED lamp.
- FIG. 1 is an assembled, isometric view of an LED lamp with a heat sink in accordance with a preferred embodiment of the present invention
- FIG. 2 is an exploded view of FIG. 1 ;
- FIG. 3 is a top view of a post of the LED lamp of FIG. 1 .
- an LED lamp in accordance with a preferred embodiment of the present invention comprises a post 10 , a heat sink 20 mounted around the post 10 , an LED module 30 resting on the post 10 , a holder 40 fixed on the LED module 30 , and a lens 50 disposed above the heat sink 20 and covering the holder 40 .
- the post 10 has a solid, cylindrical configuration and is made of metal having good heat conducting capability, such as copper, aluminum, or an alloy thereof.
- the post 10 defines an opening 12 in an upper portion thereof and has an annular sidewall 120 around the opening 12 .
- a pair of curved, inwardly projecting protrusions 14 are formed by the post 10 , located below the opening 12 , wherein each of the pair of curved protrusions 14 has an outer circumference coupling with an inner periphery of the sidewall 120 , and an inner circumference being coaxial with the outer circumference.
- the inner circumference and the outer circumference of the protrusion 14 have a common center with that of the post 10 .
- a gap (not labeled) is defined between two confronting ends of the pair of curved protrusions 14 .
- the pair of curved protrusions 14 are used for positioning the LED module 30 in the opening 12 as the LED module 30 is assembled to the post 10 .
- a pair of threaded holes 16 are defined in a base 15 of the post 10 , located corresponding to the gaps, respectively, for threadedly receiving screws 60 therein.
- a through hole 18 is defined through a portion of the inner circumference of one of the pair of curved protrusions 14 and the base 15 of the post 10 . The through hole 18 is used for extending a wire (not shown) through the post 10 to electrically connect to the LED module 30 with a power source.
- the heat sink 20 consists of a plurality of parallel fins 22 each having a planar, annular shape.
- Each of the plurality of fins 22 has an interior diameter similar to an exterior diameter of the post 10 , whereby the plurality of fins 22 can be mounted around the post 10 .
- the plurality of fins 22 are securely mounted around the post 10 along the height direction of the post 10 by soldering in a manner that the plurality of fins 22 are spaced from each other with equal and predetermined distances therebetween.
- the plurality of fins 22 occupies a whole circumferential periphery of the post 10 to thereby totally receive the post 10 therein, which is shown in FIG. 1 .
- the LED lamp in accordance with the present invention can have a large heat dissipating area.
- the LED module 30 comprises a printed circuit board 34 having a floral shape, and an LED 32 mounted on a center of the printed circuit board 34 .
- the LED module 30 is fixed on the base 15 of the post 10 by extending the screws 60 through corresponding recesses (not labeled) in an edge of the printed circuit board 34 to screw into the pair of threaded holes 16 in the base 15 of the post 10 , respectively.
- the LED module 30 is surrounded by the pair of curved protrusions 14 .
- the holder 40 is disposed on the LED module 30 in a manner that it has a disk-like lower portion 42 accommodated in the opening 12 of the post 10 , and a tapered upper portion 44 located upon a top end of the post 10 (illustrated in FIG. 1 ).
- the holder 40 defines a hole 420 in a center of the lower portion 42 for extension of the LED 32 into the holder 420 , whereby light emitted from the LED 32 is able to be reflected by an inner surface of the holder 40 to radiate through the lens 50 to illuminate an object outside the LED lamp.
- the lens 50 is received into the tapered upper portion 44 of the holder 40 for concentrating the light produced by the LED 32 into a light beam, whereby the LED lamp can project the light with sufficient intensity.
- the lens 50 which covers the holder 40 can protect the LED module 30 from damage or contamination.
- the post 10 Since the plurality of fins 22 formed around and contacting the post 10 provides a large amount of heat dissipating areas to the LED lamp, the heat generated by the LED 32 can be dissipated to the ambient via the plurality of fins 22 very efficiently and sufficiently, thus preventing the LED 32 from overheating or failing. Therefore, the post 10 does not need to be made having a large size to obtain a high heat dissipating capability.
- the cost of the plurality of fins 22 of the present invention added onto the post 10 is relatively low, and the weight of the plurality of fins 22 is light as well; thus, a total cost of the LED lamp is reduced, and a convenient handling or transportation of the LED lamp is achieved.
- the heat sink 20 can be changed to a new one which has a suitable size according to different demands, before it is soldered to the post 10 .
- the LED lamp in accordance with the present invention can be more easily modified to meet different requirements than the conventional LED lamp.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
- 1. Field of the Invention
- The present invention relates to a light emitting diode (LED) lamp, and more particularly to an LED lamp incorporating a heat sink for enhancing a heat dissipation thereof.
- 2. Description of Related Art
- As an energy-efficient light, an LED lamp has a trend of substituting for the fluorescent lamp for an indoor lighting purpose; in order to increase the overall lighting brightness, a plurality of LEDs are often incorporated into a signal lamp, in which how to efficiently dissipate heat generated by the plurality of LEDs becomes a challenge.
- Conventionally, an LED lamp comprises a solid cylinder and a plurality of LEDs mounted on the cylinder. The plurality of LEDs may be arranged in a plurality of lines on a circumferential periphery of the cylinder and along a height direction of the cylinder, or just radially mounted on a top surface of the cylinder. When the plurality of LEDs are activated to lighten, heat generated by the plurality of LEDs is dispersed to ambient air via the cylinder.
- The heat dissipating capability of the cylinder is limited since a size limitation of the LED lamp. In order to obtain more heat dissipating areas, the cylinder should be made having a large size. However, it is costly to just increase a volume of the cylinder since much more material is needed when manufacturing the solid cylinder. Furthermore, the increase of the volume of the solid cylinder also causes the LED lamp to become heavy, which may lead an inconvenient transportation or handling thereof.
- What is needed, therefore, is an LED lamp with a heat sink which can overcome the above-mentioned disadvantages.
- An LED lamp includes a post, a heat sink enclosing the post, an LED module mounted in the post, a holder secured on the LED module, and a lens covering the holder. The heat sink is formed by a plurality of parallel fins, each having an annular and planar configuration to contact and surround the post. Since the heat sink is formed around the post, heat generated by an LED of the LED module is able to be conducted via the post to the heat sink, which dissipates the heat to the ambient air sufficiently since the fins of the heat sink have a large heat dissipating area. Furthermore, a light weight and low cost of the plurality of fins facilitate a transportation and handling of the LED lamp and reduce a total cost of the LED lamp.
- Other advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
- Many aspects of the present apparatus can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present apparatus. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an assembled, isometric view of an LED lamp with a heat sink in accordance with a preferred embodiment of the present invention; -
FIG. 2 is an exploded view ofFIG. 1 ; and -
FIG. 3 is a top view of a post of the LED lamp ofFIG. 1 . - Referring to
FIGS. 1 and 2 , an LED lamp in accordance with a preferred embodiment of the present invention comprises apost 10, aheat sink 20 mounted around thepost 10, anLED module 30 resting on thepost 10, aholder 40 fixed on theLED module 30, and alens 50 disposed above theheat sink 20 and covering theholder 40. - The
post 10 has a solid, cylindrical configuration and is made of metal having good heat conducting capability, such as copper, aluminum, or an alloy thereof. Thepost 10 defines anopening 12 in an upper portion thereof and has anannular sidewall 120 around theopening 12. Also illustrated inFIG. 3 , a pair of curved, inwardly projectingprotrusions 14 are formed by thepost 10, located below theopening 12, wherein each of the pair ofcurved protrusions 14 has an outer circumference coupling with an inner periphery of thesidewall 120, and an inner circumference being coaxial with the outer circumference. The inner circumference and the outer circumference of theprotrusion 14 have a common center with that of thepost 10. A gap (not labeled) is defined between two confronting ends of the pair ofcurved protrusions 14. The pair ofcurved protrusions 14 are used for positioning theLED module 30 in theopening 12 as theLED module 30 is assembled to thepost 10. A pair of threadedholes 16 are defined in abase 15 of thepost 10, located corresponding to the gaps, respectively, for threadedly receivingscrews 60 therein. A throughhole 18 is defined through a portion of the inner circumference of one of the pair ofcurved protrusions 14 and thebase 15 of thepost 10. Thethrough hole 18 is used for extending a wire (not shown) through thepost 10 to electrically connect to theLED module 30 with a power source. - Please referring back to
FIG. 2 , theheat sink 20 consists of a plurality ofparallel fins 22 each having a planar, annular shape. Each of the plurality offins 22 has an interior diameter similar to an exterior diameter of thepost 10, whereby the plurality offins 22 can be mounted around thepost 10. The plurality offins 22 are securely mounted around thepost 10 along the height direction of thepost 10 by soldering in a manner that the plurality offins 22 are spaced from each other with equal and predetermined distances therebetween. The plurality offins 22 occupies a whole circumferential periphery of thepost 10 to thereby totally receive thepost 10 therein, which is shown inFIG. 1 . Thus, the LED lamp in accordance with the present invention can have a large heat dissipating area. - As shown in
FIGS. 1-2 , theLED module 30 comprises a printedcircuit board 34 having a floral shape, and anLED 32 mounted on a center of the printedcircuit board 34. TheLED module 30 is fixed on thebase 15 of thepost 10 by extending thescrews 60 through corresponding recesses (not labeled) in an edge of the printedcircuit board 34 to screw into the pair of threadedholes 16 in thebase 15 of thepost 10, respectively. At this fixed position, theLED module 30 is surrounded by the pair ofcurved protrusions 14. When theLED 32 is activated to lighten, heat generated by theLED 32 is conducted to thepost 10 via the printedcircuit board 34, and then transferred to theheat sink 20. - The
holder 40 is disposed on theLED module 30 in a manner that it has a disk-likelower portion 42 accommodated in theopening 12 of thepost 10, and a taperedupper portion 44 located upon a top end of the post 10 (illustrated inFIG. 1 ). Theholder 40 defines ahole 420 in a center of thelower portion 42 for extension of theLED 32 into theholder 420, whereby light emitted from theLED 32 is able to be reflected by an inner surface of theholder 40 to radiate through thelens 50 to illuminate an object outside the LED lamp. - The
lens 50 is received into the taperedupper portion 44 of theholder 40 for concentrating the light produced by theLED 32 into a light beam, whereby the LED lamp can project the light with sufficient intensity. In addition, thelens 50, which covers theholder 40 can protect theLED module 30 from damage or contamination. - Since the plurality of
fins 22 formed around and contacting thepost 10 provides a large amount of heat dissipating areas to the LED lamp, the heat generated by theLED 32 can be dissipated to the ambient via the plurality offins 22 very efficiently and sufficiently, thus preventing theLED 32 from overheating or failing. Therefore, thepost 10 does not need to be made having a large size to obtain a high heat dissipating capability. In contrast to the conventional LED lamp that increases the heat dissipating areas just by increasing the volume of thepost 10, which is solid, the cost of the plurality offins 22 of the present invention added onto thepost 10 is relatively low, and the weight of the plurality offins 22 is light as well; thus, a total cost of the LED lamp is reduced, and a convenient handling or transportation of the LED lamp is achieved. On the other hand, compared to those LED lamps which form thefins 22 integrally on thepost 10, theheat sink 20 can be changed to a new one which has a suitable size according to different demands, before it is soldered to thepost 10. Thus, the LED lamp in accordance with the present invention can be more easily modified to meet different requirements than the conventional LED lamp. - It is believed that the present invention and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
Claims (17)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710125005.7 | 2007-12-12 | ||
CN2007101250057A CN101457914B (en) | 2007-12-12 | 2007-12-12 | LED lamp |
Publications (1)
Publication Number | Publication Date |
---|---|
US20090154169A1 true US20090154169A1 (en) | 2009-06-18 |
Family
ID=40752980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/039,637 Abandoned US20090154169A1 (en) | 2007-12-12 | 2008-02-28 | Led lamp with a heat sink |
Country Status (2)
Country | Link |
---|---|
US (1) | US20090154169A1 (en) |
CN (1) | CN101457914B (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100939231B1 (en) | 2009-09-23 | 2010-01-29 | 제이에스제이텍(주) | Light emitting diode lamp |
US20110051430A1 (en) * | 2009-08-25 | 2011-03-03 | Shih-Ming Chen | Assembly structure for led fixture |
US20120257399A1 (en) * | 2009-12-25 | 2012-10-11 | Itsuhiro Miyamoto | Lighting device |
CN103557484A (en) * | 2013-11-11 | 2014-02-05 | 深圳市库莱特光电科技有限公司 | COB (cache on board) ceiling lamp |
US20140078754A1 (en) * | 2012-09-14 | 2014-03-20 | Coselig Technology Corporation | Lamp with heat dissipating apparatus |
US20180054978A1 (en) * | 2016-08-30 | 2018-03-01 | GE Lighting Solutions, LLC | Luminaire including a heat dissipation structure |
US20190072266A1 (en) * | 2016-05-19 | 2019-03-07 | George P Pollack | LED Luminaire Having Improved Thermal Management |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8523411B2 (en) * | 2010-02-23 | 2013-09-03 | Panasonic Corporation | Light source device |
CN108071943A (en) * | 2016-11-12 | 2018-05-25 | 欧普照明股份有限公司 | A kind of LED light device |
Citations (12)
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US4729076A (en) * | 1984-11-15 | 1988-03-01 | Tsuzawa Masami | Signal light unit having heat dissipating function |
US5029335A (en) * | 1989-02-21 | 1991-07-02 | Amoco Corporation | Heat dissipating device for laser diodes |
US6491407B1 (en) * | 2000-09-07 | 2002-12-10 | Joshua Beadle | In-ground lighting fixture with gimbaled lamp assembly |
US20030189826A1 (en) * | 2002-04-04 | 2003-10-09 | Sang-Yeon Yoon | Flashlight using a light emitting diode as a lamp |
US20040201995A1 (en) * | 2001-12-10 | 2004-10-14 | Galli Robert D. | LED lighting assembly with improved heat management |
US6897486B2 (en) * | 2002-12-06 | 2005-05-24 | Ban P. Loh | LED package die having a small footprint |
US6910794B2 (en) * | 2003-04-25 | 2005-06-28 | Guide Corporation | Automotive lighting assembly cooling system |
US20080165547A1 (en) * | 2005-03-08 | 2008-07-10 | Grant Harold Amor | Led Lighting Apparatus in a Plastic Housing |
US7438448B2 (en) * | 2004-10-11 | 2008-10-21 | Neobulb Technologies, Inc. | Light set with heat dissipation means |
US20090027889A1 (en) * | 2007-07-23 | 2009-01-29 | Shung-Wen Kang | LED lamp instantly dissipating heat as effected by multiple-layer substrates |
US7543960B2 (en) * | 2006-12-15 | 2009-06-09 | Foxconn Technology Co., Ltd. | Light-emitting diode assembly |
US7553047B2 (en) * | 2006-06-01 | 2009-06-30 | Samsung Electronics Co., Ltd. | Lighting device |
Family Cites Families (2)
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TW512214B (en) * | 2000-01-07 | 2002-12-01 | Koninkl Philips Electronics Nv | Luminaire |
CN2932076Y (en) * | 2006-08-10 | 2007-08-08 | 威海科华照明工程有限公司 | High power light-emitting diode lighting device |
-
2007
- 2007-12-12 CN CN2007101250057A patent/CN101457914B/en not_active Expired - Fee Related
-
2008
- 2008-02-28 US US12/039,637 patent/US20090154169A1/en not_active Abandoned
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
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US4729076A (en) * | 1984-11-15 | 1988-03-01 | Tsuzawa Masami | Signal light unit having heat dissipating function |
US5029335A (en) * | 1989-02-21 | 1991-07-02 | Amoco Corporation | Heat dissipating device for laser diodes |
US6491407B1 (en) * | 2000-09-07 | 2002-12-10 | Joshua Beadle | In-ground lighting fixture with gimbaled lamp assembly |
US20040201995A1 (en) * | 2001-12-10 | 2004-10-14 | Galli Robert D. | LED lighting assembly with improved heat management |
US20030189826A1 (en) * | 2002-04-04 | 2003-10-09 | Sang-Yeon Yoon | Flashlight using a light emitting diode as a lamp |
US6897486B2 (en) * | 2002-12-06 | 2005-05-24 | Ban P. Loh | LED package die having a small footprint |
US6910794B2 (en) * | 2003-04-25 | 2005-06-28 | Guide Corporation | Automotive lighting assembly cooling system |
US7438448B2 (en) * | 2004-10-11 | 2008-10-21 | Neobulb Technologies, Inc. | Light set with heat dissipation means |
US20080165547A1 (en) * | 2005-03-08 | 2008-07-10 | Grant Harold Amor | Led Lighting Apparatus in a Plastic Housing |
US7553047B2 (en) * | 2006-06-01 | 2009-06-30 | Samsung Electronics Co., Ltd. | Lighting device |
US7543960B2 (en) * | 2006-12-15 | 2009-06-09 | Foxconn Technology Co., Ltd. | Light-emitting diode assembly |
US20090027889A1 (en) * | 2007-07-23 | 2009-01-29 | Shung-Wen Kang | LED lamp instantly dissipating heat as effected by multiple-layer substrates |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110051430A1 (en) * | 2009-08-25 | 2011-03-03 | Shih-Ming Chen | Assembly structure for led fixture |
KR100939231B1 (en) | 2009-09-23 | 2010-01-29 | 제이에스제이텍(주) | Light emitting diode lamp |
US20120257399A1 (en) * | 2009-12-25 | 2012-10-11 | Itsuhiro Miyamoto | Lighting device |
US8915625B2 (en) * | 2009-12-25 | 2014-12-23 | Nippon Seiki Co., Ltd. | Lighting device |
KR101764939B1 (en) | 2009-12-25 | 2017-08-03 | 닛폰 세이키 가부시키가이샤 | Lighting device |
US20140078754A1 (en) * | 2012-09-14 | 2014-03-20 | Coselig Technology Corporation | Lamp with heat dissipating apparatus |
CN103557484A (en) * | 2013-11-11 | 2014-02-05 | 深圳市库莱特光电科技有限公司 | COB (cache on board) ceiling lamp |
US20190072266A1 (en) * | 2016-05-19 | 2019-03-07 | George P Pollack | LED Luminaire Having Improved Thermal Management |
US20180054978A1 (en) * | 2016-08-30 | 2018-03-01 | GE Lighting Solutions, LLC | Luminaire including a heat dissipation structure |
US11134618B2 (en) * | 2016-08-30 | 2021-10-05 | Current Lighting Solutions, Llc | Luminaire including a heat dissipation structure |
Also Published As
Publication number | Publication date |
---|---|
CN101457914B (en) | 2011-06-08 |
CN101457914A (en) | 2009-06-17 |
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Legal Events
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AS | Assignment |
Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIU, JUN;CHEN, YONG-DONG;WUNG, SHIH-HSUN;REEL/FRAME:020578/0535 Effective date: 20080225 Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIU, JUN;CHEN, YONG-DONG;WUNG, SHIH-HSUN;REEL/FRAME:020578/0535 Effective date: 20080225 |
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |