TWI669049B - Electronic machine - Google Patents

Abstract

An electronic device according to an embodiment includes: a cooling target unit disposed in a housing, including a first cooling target portion and a second cooling target portion; and being disposed on the cooling target unit, having a space for partitioning the housing The wall-shaped member forms a first flow path that passes through the first cooling target portion and a second flow path guide that passes through the second cooling target portion.

Description

Electronic machine

[0001] Embodiments of the present invention relate to electronic devices.

[0002] It is known that, for example, an electronic device includes a cooling target unit such as a CPU (Central Processing Unit) in a housing, and a cooling device that cools the cooling target unit. In addition, an electronic device in which a cooling target portion is provided at a plurality of positions is known. As an example, there is Japanese Patent Laid-Open No. 6-125187 (hereinafter referred to as Patent Document 1), and similarly, there is Japanese Patent Laid-Open No. 2010-198185 (hereinafter referred to as Patent Document) 2).

[0003] An object of the embodiments of the present invention is to provide an electronic device with high cooling performance. [0004] An electronic device according to an embodiment includes: a cooling target unit disposed in a housing, including a first cooling target portion and a second cooling target portion; and being disposed on the cooling target unit, and having the housing The space is divided into a plurality of wall-shaped members, and a flow path guide portion that passes through the first cooling target portion and the second flow path that passes through the second cooling target portion is formed.

[0006] Hereinafter, a configuration of an electronic device 10 according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 5. FIG. 1 is a perspective view showing the configuration of the electronic device 10 of the embodiment, and FIG. 2 is a plan view of the electronic device 10. FIG. 3 is a cross-sectional view showing a part of the configuration of the electronic device 10. FIG. 4 is a perspective view showing the structure of the flow path guide 20, and FIG. 5 is a plan view showing the structure of the flow path guide 20. [0007] In addition, the internal structure of the frame shown in the figure, the top plate is omitted for explanation. The arrows X, Y, and Z in the figure represent three directions perpendicular to each other, with X extending in the first direction, Y in the second direction, and Z in the third direction, respectively. In addition, in the present embodiment, the posture in which the bottom plate is downward is shown as an example with respect to the directions such as up, down, left, right, and front, but it is suitable for changing according to the posture of the electronic device 10. [0008] As shown in FIGS. 1 and 2, the electronic device 10 includes a housing 11, a substrate unit 12 as a cooling target unit, a HDD (Hard Disc Drive) unit 13, an IC (Integrated Circuits) chip unit 15, The power supply unit 16, the cooling unit 17, and the flow path guide 20. The frame 11 includes, for example, a rectangular bottom plate 11a, a front side plate 11b, a pair of left and right side plates 11c and 11d, a rear side plate 11e, and a top plate 11f disposed opposite the bottom plate 11a. The housing 11 surrounds the storage space 11g formed in a rectangular parallelepiped shape by the bottom plate 11a, the top plate 11f, and the two sets of side plates 11b to 11e. The housing 11 accommodates various electronic components such as the HDD unit 13, the cooling unit 17, and the board unit 12 in the housing space 11 g. [0009] The front side plate 11b includes a ventilation structure 31 having a plurality of ventilation holes and configured to be capable of inhalation, and includes a disk port for an optical drive disc (drive disc) or an insertion port for the HDD unit 13 , Connect various terminals of various cables such as USB. [0010] The rear side plate 11e includes a ventilation structure 31 having a plurality of ventilation holes, and various terminals for connecting various cables such as a USB (Universal Serial Bus). [0011] A plurality of HDD units 13 are arranged side by side in the X direction on one end side in the housing space 11g. In addition, a cooling unit 17 is provided adjacent to the rear of the HDD unit 13 in the storage space 11g. Furthermore, in the accommodation space 11g, the substrate unit 12 is arranged behind the cooling unit 17. [0012] The HDD unit 13 includes a plurality of HDDs and HDD housings each holding the HDDs. The cooling unit 17 is arranged behind the HDD unit 13, in other words, on the secondary side in the air flow path. A ventilation path is formed from the ventilation structure portion 31 of the front side plate 11b to the air intake portion of the cooling unit 17. Among them, in the air flow path, the upstream side in the blowing direction is called a primary side, and the downstream side is called a secondary side. [0013] As shown in FIGS. 1 to 4, the cooling unit 17 includes a fan holder 32 disposed on the bottom plate 11 a of the housing 11 and a plurality of fan units 34 a to 34 c supported by the fan holder 32. In the present embodiment, three first fan units 34a, second fan units 34b, and third fan units 34c are arranged side by side in the X direction. [0014] The fan holder 32 is a frame arranged on the bottom plate 11a of the frame body 11, and has a plurality of fan accommodating portions that respectively hold the fan units 34a to 34c. [0015] Each of the plurality of fan units 34a to 34c includes a fan case 35 having an air outlet 35a, and a blower fan 36 disposed in the fan case 35. The blower fan 36 is connected to the output shaft of the fan motor to be driven in rotation. The cooling unit 17 includes an intake port on the HDD unit 13 side and an air supply port 35a on the opposite side. In the present embodiment, the first fan unit 34a and the second fan unit 34b are arranged to face the substrate unit 12, and the third fan unit 34c is arranged to face the IC wafer unit 15. [0016] The substrate unit 12 includes a substrate 41 disposed on the bottom plate 11a, which is the bottom of the housing 11, a first CPU unit 42 mounted on the substrate 41, and a second CPU unit 43 disposed on the secondary side of the first CPU unit 42, The R (Redundant) A (Array of) I (Inexpensive or Independent) D (Discs) card unit 44 disposed behind the first CPU unit 42, that is, to the side of the second CPU unit 43. In this embodiment, the substrate 41 and the first CPU unit 42 on the substrate 41 become the first cooling target part, the second CPU unit 43 becomes the second cooling target part, and the RAID card unit 44 becomes the third cooling target part. [0017] The substrate 41 is a PCB substrate and is arranged parallel to the bottom plate 11a along the XY plane. [0018] The first CPU unit 42 is disposed near the air outlet 35a of the second fan unit 34b. The first CPU unit 42 includes a first CPU 45 mounted on the substrate 41 and a first heat sink 47 mounted on the first CPU 45. The first heat dissipation plate 47 includes a plurality of heat dissipation fins arranged upright at a predetermined pitch Pt1. [0019] The second CPU unit 43 is arranged behind the first fan unit 34a on the right side, that is, a position behind the first CPU unit 42. [0020] The second CPU unit 43 includes a second CPU 46 mounted on the substrate 41, and a second heat sink 48 mounted on the second CPU 46. The second heat dissipation plate 48 includes a plurality of heat dissipation fins (fins) that are arranged upright at a predetermined pitch Pt2. The upper end of the second heat dissipation plate 48 is arranged at a predetermined position higher than the first heat dissipation plate 47. [0021] The RAID card unit 44 is disposed behind the first CPU unit 42. The RAID card unit 44 includes a plurality of RAID cards 44a that are provided upright on the substrate 41 and that mount various electronic components. The upper end of the RAID card 44a has, for example, a height higher than the upper end of the first heat sink 47 and substantially the same height as the upper end of the second heat sink 48. [0022] The channel guide 20 is formed of a transparent resin material having excellent heat resistance and workability. The flow path guide 20 is formed along the outer shape of the substrate unit 12, covers the substrate unit 12, and is formed integrally with a plurality of wall-shaped members that divide the flow path into a plurality of pluralities. The flow path guide 20 is disposed on the substrate unit 12 and forms a plurality of flow paths F1, F2, and F3 that pass through the substrate unit 12 from the cooling unit 17 and penetrate backward. [0023] The flow path guide 20 is provided with a continuous integral body: a first cover wall 21 that is a partition wall that is disposed on the first heat sink 47 on the secondary side of the second fan unit 34b, and the first fan unit 34a The secondary side of the battery flows to the duct portion 22 of the second flow path divided by the second heat sink 48 and the power supply protection portion 23 covering the power supply unit. [0024] The first cover wall 21 is a secondary side of the air outlet 35a of the second fan unit 34b, and crosses in the height direction to divide the space into upper and lower plate-like members. The first cover wall 21 is arranged at a height near the center in the Z direction of the air outlet 35a of the second fan unit 34b, and is arranged along the XY plane. The first cover wall 21 is arranged to face the upper end of the first heat dissipation plate 47 with a slight gap therebetween. The end portion of the first cover wall 21 is provided with a plurality of mounting pieces bonded to the frame 11 by an associated structure. [0025] The first cover wall 21 has a narrowed portion 21a slightly in front of the central portion of the first CPU 45. The narrowed portion 21a constitutes a continuous step by making a part of the first cover wall 21 descend with an inclined surface. In other words, the first cover wall 21 is continuous by the narrowed portion 21a in which the surfaces of different heights become inclined surfaces. The narrower portion 21a is closer to the secondary side and the gap distance between the first heat dissipation plate 47 and the first cover wall 21 is reduced. In the rear part of the narrowed portion 21a, for example, the distance S1 between the first heat dissipation plate 47 and the first cover wall 21 is configured to be narrower than the pitch Pt1 of the heat dissipation fins of the heat dissipation plate. [0026] On the upper surface of the first cover wall 21, there are formed a first guide rib 21b and a second guide rib 21c which are provided upright. The first guide bar 21b and the second guide bar 21c have a predetermined thickness, and are wall-shaped members that extend obliquely toward the rear on the center side so as to be displaced. The first guide bar 21b and the second guide bar 21c have the same height as the second cover wall 24. The first guide bar 21b and the second guide bar 21c are arranged with a predetermined distance therebetween to form a first opening 21d through which cooling air can pass. [0027] On the lower side of the first cover wall 21, a first flow path F1 is formed from the cooling unit 17 to the first heat radiation plate 47. [0028] The duct portion 22 extends from the vicinity of the air outlet 35a of the first fan unit 34a to a predetermined distance rearward at a predetermined width, and then tilts and shifts toward the rear to increase the width dimension, and covers the upper and side of the second heat sink 48 at the rear square. [0029] The duct portion 22 includes a second cover wall 24, and a pair of guide side walls 25, 26 disposed on both side edges of the second cover wall 24. The duct portion 22 forms a second flow path F2 from the vicinity of the air outlet 35a of the first fan unit 34a to the second heat dissipation plate 48. [0030] The second cover wall 24 is disposed in front of the air outlet 35a of the first fan unit 34a at a height position higher than the air outlet 35a. The second cover wall 24 is a wall-shaped member arranged crosswise in the height direction, and divides the space into upper and lower sides. The second cover wall 24 is arranged at a predetermined distance above the first cover wall 21 and extends parallel to the bottom plate 11a along the XY plane. [0031] A narrowed portion 24a is formed at a predetermined position of the second cover wall 24 that is further forward than the center of the second CPU unit 43 and a portion facing it. The narrowed portion 24a is formed at a predetermined step of the second cover wall 24 so that the position is lowered so that the position becomes lower. The area behind the narrowed portion 24a of the second cover wall 24 is arranged to face the upper end of the second heat dissipation plate 48 with a slight gap. The distance S2 between the second heat dissipation plate 48 and the second cover wall 24 is set to be narrower than the pitch Pt2 of the heat dissipation fins of the second heat dissipation plate 48, closer to the secondary side than the narrowed portion 24a. [0032] The guide side walls 25 and 26 are wall-shaped members extending along the ZY plane, and divide the space into a plurality of directions in the X direction that is the parallel direction of the blower fans. One guide side wall 25 (first side wall portion) extends downward from one side edge of the second cover wall 24. The guide side wall 25 is divided into two parts, and has a front side wall 25a and a rear side wall 25b. The lower end of the front side wall 25 a of the guide side wall 25 extends to a part of the other side edge of the first cover wall 21. In other words, the front side wall 25 a of the guide side wall 25 is provided upright from the side edge of the first cover wall 21. A second opening 25c having a predetermined width is formed between the front side wall 25a and the rear side wall 25b. Through the second opening 25c, the second flow path F2 in the duct portion 22 communicates with the space on the first cover wall 21. The other guide side wall 26 is formed over the entire length of the second cover wall 24. [0033] A second flow path F2 from the first fan unit 34a to the second heat dissipation plate 48 is formed in the area surrounded by the guide side walls 25 and 26 on the lower side of the duct portion 22. [0034] The rear portion of the side wall 25 is guided to form an inner wall rear side wall 25b that is a side wall of the second heat dissipation plate 48, a bottom wall portion 25d having a predetermined width that extends outward of the rear side wall 25b, and the bottom wall portion 25d The outer wall portion 25e provided upright at the other end is integrally provided in a double structure. The guide side wall 25 has a predetermined width. The guide side wall 25 narrows the gap between the second heat dissipation plate 48 and the RAID card unit 44 to prevent air leakage into the gap, and guides the air blowing direction so as to effectively cool the RAID card unit 44. [0035] Outside the guide side wall 25, a third flow path F3 is formed from the vicinity of the air outlet 35a of the second fan unit 34b through the first cover wall 21 to the RAID card unit 44. [0036] The guide side wall 26 (second side wall portion) is integrally provided with an inner wall portion 26c along the side of the second heat dissipation plate 48, a bottom wall portion 26d of a predetermined width, and upright from the other end of the bottom wall portion 26d The outer wall portion 26e facing the inner wall portion 26c. The guide side wall 26 has a predetermined width in which the gap between the second heat sink 48 and the power supply unit 16 is buried. The guide side wall 26 suppresses air leakage into the gap, and guides the air blowing direction so as to effectively cool the second heat dissipation plate 48. The upper edge of the outer wall portion 26e continues to the power protection portion 23. [0037] The inner wall portion 26c of the guide side wall 26 is displaced and inclined near the center of the duct portion 22 at the narrowed portion 24a. That is, in the narrowed portion 24a, the flow path of the duct portion 22 is narrowed in the X direction in addition to the Z direction by the inner wall portion 26c, and is configured to increase the flow velocity. [0038] The power supply protection unit 23 is a plate-shaped member facing and covering the power supply unit 16. The edge part of the power protection part 23 is provided with a plurality of mounting pieces bonded to the frame 11 by an associated structure. [0039] The flow path guide portion 20 configured as above is covered from above the substrate unit 12, and a plurality of mounting pieces 28 provided on the outer peripheral portion are fixed to the frame body 11 by an associated structural member such as a bolt. [0040] The shape and size of each part of the flow path guide 20 are determined based on the air distribution ratio corresponding to the amount of heat generated by the plurality of cooling target parts. That is, the air volume from the two fan units 34a, 34b is distributed in accordance with the heat generation amount of each unit 42, 43, 44 and is set to be guided to the three flow paths F1, F2, F3. For example, the calorific value of the first CPU unit 42 is approximately the same as the calorific value of the second CPU unit 43, and the calorific value of the RAID card unit 44 is about 1/3. [0041] In the present embodiment, after the fan motor 55 is rotationally driven by the control unit, air passes through the ventilation paths formed on the upper and lower suction sides of the HDD unit 13, is sucked into the fan case from the suction port, and is blown from the air The port 35a is blown toward the rear toward the substrate unit 12. [0042] At this time, the air sent from the air outlet 35a is guided by the flow path guide portion 20 provided in front of the air outlet 35a. That is, the air from the two fan units 34a and 34b is divided up and down by the first cover wall 21 on one side, and is guided by the duct portion 22 on the other side. [0043] The air guided to the first cover wall 21 is further guided by the first guide bar 21b and the second guide bar 21c, and a part of it is guided to the third flow path F3 from the first opening 21d , A part is guided into the catheter portion 22 from the second opening 25c. The air guided to the first flow path F1 cools the first CPU unit 42. In addition, the air guided to the second flow path F2 cools the second CPU unit 43. The air guided to the third flow path F3 again cools the RAID card unit 44. [0044] At this time, the narrowed portions 21a and 24a formed in the first cover wall 21 and the second cover wall 24 increase the flow velocity of the air, thereby improving the cooling performance of the portion where heat generation is particularly high. [0045] According to the electronic device 10 configured as described above, while covering the substrate unit 12, by providing the flow path guide portion 20 that divides the flow path in plural, the air volume from the cooling unit 17 can be directed to the plural positions Cooling objects are properly distributed to achieve effective cooling. [0046] Specifically, the duct portion 22 and the first cover wall 21 divide the air volume up, down, left, and right to effectively guide the heat sink to different positions. [0047] Furthermore, by setting the height of the second heat dissipation plate 48 on the secondary side to be higher than the first heat dissipation plate 47 on the primary side, the second heat dissipation plate 48 on the secondary side can also be distributed into a desired air volume . That is, for example, when radiating plates of generally the same height are arranged in parallel at the front and back, since the air warmed by the first radiating plate 47 on the primary side is supplied to the secondary side radiator plate, although the cooling efficiency decreases, However, according to the present embodiment, cool air can also be reliably supplied to the second heat dissipation plate 48 on the secondary side. [0048] In the above embodiment, the first cover wall 21 and the second cover wall 24 are covered on the heat dissipation plates 47 and 48 to prevent the cooling air from leaking upward and improve the cooling effect. In addition, by forming the narrowed portions 21a and 24a in the first cover wall 21 and the second cover wall 24, the flow rate of a desired portion having a high heat generation amount is increased, and the cooling can be effectively performed. [0049] In the present embodiment, the plural fan units 34a, 34b are arranged in parallel, but by connecting the fan units 34a, 34b of both the first flow path F1 and the second flow path F2, respectively, in either When the fan units 34a and 34b fail, the cooling air that can be left over in the fan units 34a and 34b can maintain the cooling performance. [0050] In addition, for example, in the above-described embodiment, the guide sidewalls 25 and 26 have a double structure without dead space, and the shape of the flow path guide 20 is a shape along the outer shape of the substrate unit 12 It can suppress the leakage of cooling air and can effectively use the cooling air. [0051] Furthermore, if the flow path guide 20 is made of a transparent resin, even if the flow path guide 20 is attached, the wiring status can be confirmed. In addition, the plurality of wall-shaped members provided in the flow path guide 20, in addition to the division of the flow path, can also regulate the position of various cables, and the workability of wiring work can be improved. [0052] In addition, the present invention is not limited to the above embodiment. [0053] For example, although the channel guide portion 20 is formed of a transparent resin material, it is not limited to this, and may be formed of other materials such as metal. [0054] For example, in the above-described embodiment, although the flow path guide portion 20 is configured in the above-described shape in accordance with the shape of the substrate unit 12 and the heat generation amount of each portion, it is not limited thereto. For example, it is also possible to change the position or shape of the wall-shaped member appropriately in accordance with the positional relationship and number of the units 42, 43, and 44. In addition, the flow path may be increased or decreased according to the position and number of the cooling target portion. [0055] In addition, although several embodiments of the present invention have been described, these embodiments are merely illustrative and do not intend to limit the scope of the present invention. These novel embodiments can also be implemented in other various forms, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and also include the equal scope of the invention described in the patent application scope.

[0056]

10‧‧‧Electronic machine

11‧‧‧Frame

12‧‧‧Cooling target unit (substrate unit)

13‧‧‧HDD unit

15‧‧‧IC chip unit

16‧‧‧Power supply unit

17‧‧‧cooling unit

20‧‧‧Flower guide

11a‧‧‧Bottom plate

11b, 11c, 11d

11e‧‧‧Side panel at the rear

11f‧‧‧Top plate

11g‧‧‧ containment space

31‧‧‧Ventilation Structure Department

32‧‧‧Fan bracket

34a ～ 34c‧‧‧fan unit

35a‧‧‧Air outlet

35‧‧‧scallop

36‧‧‧Supply fan

41‧‧‧ substrate

42‧‧‧ 1st CPU unit

43‧‧‧ 2nd CPU unit

44‧‧‧RAID card unit

45‧‧‧ 1st CPU

47‧‧‧The first heat sink

46‧‧‧ 2nd CPU

48‧‧‧The second heat sink

44a‧‧‧RAID card

F1, F2, F3

22‧‧‧Catheter Department

23‧‧‧Power Protection Department

21‧‧‧The first wall

21a‧‧‧Narrowing

21b‧‧‧First guide

21c‧‧‧Leader 2

24‧‧‧The second wall

[0005] FIG. 1 is a perspective view showing the configuration of an electronic device of an embodiment. [Figure 2] A plan view of the same electronic device. [Fig. 3] A cross-sectional view showing a part of the structure of the electronic device. [FIG. 4] A perspective view showing the structure of a flow path guide portion of the electronic device. [FIG. 5] A plan view showing the structure of the flow path guide of the electronic device.

Claims (7)

An electronic device includes: a cooling target unit disposed in a housing and including a first cooling target portion and a second cooling target portion; disposed on the cooling target unit, and having a space for partitioning the housing into a plurality of A wall-shaped member and forming a first flow path passing through the first cooling target portion and a flow path guide portion passing through the second flow path of the second cooling target portion; and an air blowing device; the first cooling target portion arrangement On the downstream side in the blowing direction of the air blowing device; the second cooling target portion is disposed downstream of the first cooling target portion in the blowing direction of the blowing device; the first cooling target portion and the second cooling target portion, It is arranged at a position overlapping when projecting upstream in the blowing direction facing the blowing device. The electronic device according to claim 1, wherein the flow path guide portion has a space downstream of the blowing direction of the blowing device in a first direction crossing the blowing direction into a plurality of first 1 side wall portion, a first cover wall covering the first cooling target portion that extends to one side in the first direction of the first side wall portion, and a first cover wall that extends to the other side in the first direction on the first side wall portion 2 cover wall; the first side wall portion and the second cover wall extend further downstream than the first cooling target portion in the air blowing direction, and the second cover wall covers the first wall portion on the downstream side in the air blowing direction 2 On the cooling target portion, and the first side wall portion covers the side of the second cooling target portion in the first direction. The electronic device according to claim 2, wherein the blower device includes a plurality of blower fans juxtaposed in the first direction; the cooling target unit is a substrate unit including a substrate disposed at the bottom of the housing; and the first The cooling target portion is a first CPU unit including: a first CPU disposed on the substrate and a first heat dissipation fin disposed on the first CPU; and the second cooling target portion is: A second CPU further downstream of the first CPU, and a second CPU unit disposed on the second CPU and having a second heat dissipation fin with a height higher than the first heat dissipation fin; the second cover wall is disposed further than the first cover wall High position; under the first cover wall, the first flow path that flows to the first cooling target portion is formed; the first side wall portion, from the side edge of the second cover wall in the first direction Extending downward and connected to the side edge of the first cover wall in the first direction on the other side; the electronic device is further provided with a first side extending downward from the side edge of the second cover wall in the first direction on the other side 2 side wall portion; a duct portion formed by the second cover wall and the first side wall portion and the second side wall portion is formed from the other side of the first direction of the first flow path toward the downstream side in the air blowing direction The second flow path extending to the second cooling target portion. The electronic device according to claim 2 or claim 3, wherein the first cover wall or the second cover wall is more in the air blowing direction than the center of the first cooling target portion or the second cooling target portion The upstream side includes a narrowed portion that is displaced downward so as to reduce the first flow path or the second flow path. The electronic device according to claim 2 or claim 3, comprising: a third cooling target portion disposed downstream of the first cover wall and the first cooling target portion in the air blowing direction; and the first cover The wall divides the space in the height direction; on the one side of the first side wall in the first direction, a third flow path that flows to the third cooling target portion through the upper side of the first cover wall is formed. The electronic device according to claim 2 or claim 3, wherein the first side wall portion has a front side wall and a rear side wall, and has a space disposed on the first cover wall and the second flow path, in Between the front side wall and the rear side wall, an opening connecting the space on the first cover wall and the second flow path under the second cover wall; on the upper surface of the first cover wall, provided with: extending upward The wall-shaped member is a guide bar extending downstream in the air blowing direction on the second flow path side and facing the opening of the first side wall portion The electronic device according to claim 2 or claim 3, wherein the flow path guide portion is integrally formed with a plurality of wall-shaped members made of a transparent material, and is in a state of being covered from the cooling target portion The mounting portion associated with the aforementioned frame body is formed integrally.