TWI812193B - Desktop computer - Google Patents
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 25
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本揭露是有關於一種桌上型電腦,特別是一種有關於具有散熱組件之桌上型電腦。The present disclosure relates to a desktop computer, and in particular to a desktop computer having a heat dissipation component.
近年來使用者在挑選桌上型電腦時,除了重視效能之外,外觀也常是考量的重點,因而越來越多桌上型電腦採用側透型的機箱,並且搭配多種發光裝置,例如ARGB風扇或是有配置此類風扇的顯示卡等,而為了要使這些發光裝置的效果能夠較佳地由機箱的側蓋透出,現行常將顯示卡以直立的方式配置,使得ARGB風扇朝向側蓋以呈現其動態燈光效果。In recent years, when users choose desktop computers, in addition to paying attention to performance, appearance is also often the focus. Therefore, more and more desktop computers adopt side-transparent chassis and are equipped with a variety of light-emitting devices, such as ARGB. Fans or graphics cards equipped with such fans, etc. In order to make the effect of these light-emitting devices better visible through the side cover of the chassis, the graphics card is often arranged in an upright manner so that the ARGB fan faces the side. cover to reveal its dynamic lighting effects.
然而,相對於習知將顯示卡水平配置,直立式地配置顯示卡除了使得顯示卡本身較難散熱之外,也容易造成機箱內的產生各種擾流,而導致桌上型電腦整體散熱變差。However, compared to the conventional horizontal configuration of the graphics card, configuring the graphics card vertically not only makes it more difficult for the graphics card itself to dissipate heat, but also easily causes various turbulences in the chassis, resulting in poor overall heat dissipation of the desktop computer. .
因此,在本發明實施例中,提供一種桌上型電腦,具有一種散熱組件,藉由此散熱組件不僅可提升直立式顯示卡的散熱效率,更可以使得桌上型電腦整體的散熱效率提高。Therefore, in an embodiment of the present invention, a desktop computer is provided, which has a heat dissipation component. The heat dissipation component can not only improve the heat dissipation efficiency of the vertical graphics card, but also improve the overall heat dissipation efficiency of the desktop computer.
本發明之一實施例提供一種桌上型電腦,包括一機箱以及一散熱組件。機箱具有一前側以及一後側,其中前側與後側平行並且相對。 散熱組件包括至少一個第一風扇、一導風罩、以及至少一個第二風扇。至少一個第一風扇設置於機箱的前側。導風罩具有一進風口以及一出風口,進風口鄰接於至少一個第一風扇。至少一個第二風扇設置鄰近於導風罩的出風口。One embodiment of the present invention provides a desktop computer, including a chassis and a heat dissipation component. The chassis has a front side and a rear side, wherein the front side and the rear side are parallel and opposite. The heat dissipation component includes at least one first fan, an air guide hood, and at least one second fan. At least one first fan is disposed on the front side of the chassis. The air guide hood has an air inlet and an air outlet, and the air inlet is adjacent to at least one first fan. At least one second fan is disposed adjacent to the air outlet of the air guide hood.
根據本揭露一些實施例,桌上型電腦更包括一顯示卡,直立式地設置於機箱的後側,其中至少一個第二風扇設置於顯示卡並且朝向機箱的一左側,左側連接前側以及後側、並且垂直於前側以及後側。其中當沿著垂直於後側的一第一方向觀察時,顯示卡與導風罩的出風口不重疊。其中當沿著第一方向觀察時,進風口與出風口至少部分重疊,並且進風口的一剖面積大於出風口的一剖面積。其中當沿著平行於前側以及左側的一第二方向觀察時,導風罩具有梯形形狀。其中導風罩由一第一側壁、一第二側壁、一第三側壁、以及一第四側壁所構成,其中第一側壁距離左側最近,凹陷部由進風口往出風口逐漸遠離左側。其中側壁由進風口往出風口逐漸接近左側。其中第二側壁與第一側壁相對,並且鄰接於至少一個第二風扇。According to some embodiments of the present disclosure, the desktop computer further includes a graphics card, which is disposed vertically on the rear side of the chassis, wherein at least one second fan is disposed on the graphics card and faces a left side of the chassis, and the left side connects the front side and the rear side. , and perpendicular to the front and rear sides. When viewed along a first direction perpendicular to the rear side, the display card and the air outlet of the air guide do not overlap. When viewed along the first direction, the air inlet and the air outlet at least partially overlap, and a cross-sectional area of the air inlet is greater than a cross-sectional area of the air outlet. When viewed along a second direction parallel to the front side and the left side, the air guide hood has a trapezoidal shape. The air guide hood is composed of a first side wall, a second side wall, a third side wall, and a fourth side wall. The first side wall is closest to the left side, and the recessed portion gradually moves away from the left side from the air inlet to the air outlet. The side wall gradually approaches the left side from the air inlet to the air outlet. The second side wall is opposite to the first side wall and adjacent to at least one second fan.
根據本揭露一些實施例,其中至少一個第一風扇為兩個第一風扇,兩個第一風扇沿著第二方向排列,導風罩的進風口配置以涵蓋兩個第一風扇分別的一部份。其中導風罩的出風口沿著第二方向具有一導風罩長度,並且第二風扇沿著第二方向具有一第二風扇長度,導風罩長度與第二風扇長度大致相同。According to some embodiments of the present disclosure, the at least one first fan is two first fans, the two first fans are arranged along the second direction, and the air inlet of the air guide hood is configured to cover a portion of each of the two first fans. share. The air outlet of the air guide hood has a length of the air guide hood along the second direction, and the second fan has a second fan length along the second direction, and the length of the air guide hood is approximately the same as the length of the second fan.
為了讓本揭露之目的、特徵、及優點能更明顯易懂,下文特舉實施例,並配合所附圖示做詳細說明。其中,實施例中的各元件之配置係為說明之用,並非用以限制本揭露。且實施例中圖式標號之部分重複,係為了簡化說明,並非意指不同實施例之間的關聯性。以下實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明並非用來限制本揭露。In order to make the purpose, features, and advantages of the present disclosure more obvious and understandable, embodiments are given below and explained in detail with the accompanying figures. The configuration of each component in the embodiment is for illustrative purposes and is not intended to limit the disclosure. In addition, the partial repetition of numbers in the figures in the embodiments is for simplifying the description and does not imply the correlation between different embodiments. Directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only for reference to the directions in the attached drawings. Accordingly, the directional terms used are intended to illustrate and not to limit the disclosure.
此外,實施例中可能使用相對性的用語,例如「較低」或「底部」及「較高」或「頂部」,以描述圖示的一個元件對於另一元件的相對關係。能理解的是,如果將圖示的裝置翻轉使其上下顛倒,則所敘述在「較低」側的元件將會成為在「較高」側的元件。In addition, relative terms, such as "lower" or "bottom" and "higher" or "top" may be used in the embodiments to describe the relative relationship of one element to another element in the figures. It will be understood that if the illustrated device was turned upside down, elements described as being on the "lower" side would become elements described as being on the "higher" side.
在此,「約」、「大約」之用語通常表示在一給定值或範圍的20%之內,較佳是10%之內,且更佳是5%之內。在此給定的數量為大約的數量,意即在沒有特定說明的情況下,仍可隱含「約」、「大約」之含義。Here, the terms "about" and "approximately" usually mean within 20% of a given value or range, preferably within 10%, and more preferably within 5%. The quantities given here are approximate quantities, which means that without specific explanation, the meaning of "approximately" or "approximately" can still be implied.
請參考第1圖至第3圖,第1圖為根據本揭露一實施例的桌上型電腦1之立體圖,第2圖為根據本揭露一實施例的桌上型電腦1之另一角度的立體圖,第3圖為根據本揭露一實施例的桌上型電腦之部分元件的示意圖。桌上型電腦1包括一機箱100、一顯示卡110、一主機板120、一硬碟130、一電源供應器140、以及一散熱組件200。Please refer to Figures 1 to 3. Figure 1 is a perspective view of a
如第1圖以及第2圖所示,機箱100為一中空結構的長方體,以將上述元件容納於其中,具有一前側101、一後側102、一左側103、一右側104、一上側105、以及一下側106。前側101與後側102彼此平行相對並且垂直於一第一方向D1。上側105與下側106彼此平行相對並且垂直於一第二方向D2,左側103與右側104彼此平行相對並且垂直於一第三方向D3。左側103連接前側101以及後側102,並且垂直於前側101以及後側102,換句話說,第二方向D2平行於前側101以及左側103。在第1圖所示的實施例中,左側103為可拆卸並且透明的強化玻璃側蓋,因此可以由此左側103觀察機箱100內部的各個元件的配置。As shown in Figures 1 and 2, the
顯示卡110直立式地設置於機箱100的後側102,更詳細地說,顯示卡110具有接近矩形的板狀平面,直立式地設置是指將顯示卡110以板狀平面垂直於第三方向D3的方式固定在後側102。The
在一些實施例中,如第3圖所示,還可以將另一顯示卡110水平式地設置於前述直立式顯示卡110的上方,水平式地設置是指將顯示卡110以板狀平面垂直於第二方向D2的方式固定在後側102。由此,可以有效地利用機箱100內的空間,並使得桌上型電腦1的性能提高。In some embodiments, as shown in FIG. 3 , another
主機板120設置於上側105與顯示卡110之間的空間,硬碟130以及電源供應器140則是設置於下側106與顯示卡110之間的空間。藉由上述的配置,機殼100內部可以被大致劃分為三個區域,分別是配置有主機板120的上部區域、配置有顯示卡110的中間區域、以及配置有硬碟130以及電源供應器140的下部區域。因此,在本實施例中,散熱組件200依據這三個區域而配置,以提高桌上型電腦1整體的散熱效率。The
接著請參考第1圖至第6圖,第4圖為根據本揭露一實施例的導風罩250之立體圖,第5圖為根據本揭露一實施例的導風罩250之側視圖,第6圖為根據本揭露一實施例的導風罩250之俯視圖。散熱組件200包括至少一個第一風扇210、至少一個第二風扇220、至少一個第三風扇230、一第四風扇240、以及一導風罩250。在本實施例中,至少一個第一風扇210為兩個第一風扇211、212,第一風扇211、212具有一第一風扇寬度W1,設置於機箱100的前側101,並且沿著第二方向D2排列,用以將外部的空氣吸入至機箱100的內部。
Next, please refer to Figures 1 to 6. Figure 4 is a perspective view of the
至少一個第二風扇220設置於顯示卡110,並且設置鄰近於導風罩250,用以將空氣吸入以避免顯示卡110運轉時過熱。在本實施例中,至少一個第二風扇220為三個第二風扇221、222、223,沿著第一方向D1排列而朝向機箱100的左側103,與左側103相距一距離。
At least one
如第2圖所示,至少一個第三風扇230為兩個第三風扇231、232,設置於上側105,用以將機箱100內部的空氣由上側105排出。第四風扇240設置於後側102,用以將機箱100內部的空氣由後側102排出。雖然在本實施例中說明了各風扇的數量,但不限於此,可視需求變更。
As shown in FIG. 2 , the at least one
如第4圖至第6圖所示,導風罩250具有第一側壁S1、第二側壁S2、第三側壁S3、第四側壁S4,並且為第一側壁S1、第二側壁S2、第三側壁S3、第四側壁S4組成具有一進風口251以及一出風口252的中空結構。進風口251鄰接於第一風扇210,並且出風口252設置鄰近於第二風扇220。As shown in FIGS. 4 to 6 , the
在第一側壁S1、第二側壁S2、第三側壁S3、第四側壁S4中,第一側壁S1距離機殼100的左側103最近,並且具有一凹陷部R,凹陷部R由進風口251往出風口252逐漸遠離左側103。在本實施例中,第一風扇210可以採取具有動態燈光效果的風扇,例如RGB風扇或ARGB風扇等,而在第一側壁S1設置向機箱100內部凹陷一角度的凹陷部R,並且將凹陷部R一部份挖空為特定的文字符號,可以使得第一風扇210的燈光通過前述的文字符號而射入玻璃側蓋的左側103,達到最佳的視覺效果。Among the first side wall S1, the second side wall S2, the third side wall S3, and the fourth side wall S4, the first side wall S1 is closest to the
另外,第一側壁S1由進風口251往出風口252逐漸接近左側103,更詳細地說,由於第一風扇210與左側103之間具有一間距,而藉由將第一側壁S1朝向左側103貼近,可以減少間距內的空氣對從導風罩250流出的空氣造成的擾流。In addition, the first side wall S1 gradually approaches the
第二側壁S2與第一側壁S1相對,並且也由進風口251往出風口252逐漸接近左側103,以與第二風扇220鄰接。第三側壁S3與第四側壁S4彼此相對並且垂直於第二方向D2,而第三側壁S3與第四側壁S4之間的一距離為一導風罩長度L1。當沿著第二方向D2觀察時,導風罩250的第三側壁S3與第四側壁S4重疊並且具有梯形形狀。The second side wall S2 is opposite to the first side wall S1 and gradually approaches the
如第1圖以及第6圖所示,進風口251在第三方向D3具有一進風口寬度Wi,此進風口寬度Wi至少等於第一風扇211、212的第一風扇寬度W1,以盡可能完全收集由第一風扇211、212在第三方向D3吹出的空氣。此外,進風口251配置以涵蓋兩個第一風扇211、212分別的一部份。As shown in Figures 1 and 6, the
更詳細地說,由於第一風扇211、212在第二方向D2上下並列,因此可以設置進風口251罩蓋第一風扇211的下部分以及第一風扇212的上部分,以接收由第一風扇211的下部分以及第一風扇212的上部分吹出的空氣。當沿著第一方向D1觀察時,進風口251與出風口252至少部分重疊,進風口251的一剖面積A1(參考第5圖虛線框起部分)大於出風口252的一剖面積A2(參考第4圖虛線框起部分),並且顯示卡110與出風口252不重疊。In more detail, since the
如第3圖以及第4圖所示,第二風扇221、222、223沿著第二方向D2具有一第二風扇長度L2,第二風扇長度L2與導風罩長度L1大致相同,並且導風罩250以及第二風扇221、222、223設置在第二方向D2距離下側106相同或接近相同的高度處。因此,進入導風罩250的空氣皆被導向第二風扇221、222、223與左側103之間的空間,而被第二風扇221、222、223吸入。所以,相較於未設置導風罩250,可以避免空氣受到機殼100內其他元件的阻擋而產生的擾流,進而達到更佳的散熱效率。As shown in Figures 3 and 4, the
此外,由於導風罩250可將兩個第一風扇211、212吸入的空氣分成三個部分,因此可以而分別朝向上部區域、中間區域、以及下部區域進行散熱。也就是說,如前所述由第一風扇211的下部分以及第一風扇212的上部分吹出的空氣朝向中間區域,經由導風罩250而對顯示卡110進行散熱,並且空氣可由設置於後側102的複數個散熱孔H排出。In addition, since the
而由第一風扇211的上部分吹出的空氣則直接朝向上部區域,對主機板120進行散熱,並且空氣可經由設置於上側105的兩個第三風扇231、232以及設置於後側102的第四風扇240排出。The air blown by the upper part of the
至於由第一風扇212的下部分吹出的空氣則直接朝向下部區域,對硬碟130以及電源供應器140進行散熱,並且空氣可經由設置於下側106的複數個散熱孔H排出。The air blown from the lower part of the
如上所述,本揭露實施例提供了一種桌上型電腦,包括一機箱以及一散熱組件。機箱具有一前側以及一後側,其中前側與後側平行並且相對。 散熱組件包括至少一個第一風扇、一導風罩、以及至少一個第二風扇。至少一個第一風扇設置於機箱的前側。導風罩具有一進風口以及一出風口,進風口鄰接於至少一個第一風扇。至少一個第二風扇設置鄰近於導風罩的出風口。其中,藉由此散熱組件不僅可提升直立式顯示卡的散熱效率,更可以使得桌上型電腦整體的散熱效率提高。As mentioned above, embodiments of the present disclosure provide a desktop computer including a chassis and a heat dissipation component. The chassis has a front side and a rear side, wherein the front side and the rear side are parallel and opposite. The heat dissipation component includes at least one first fan, an air guide hood, and at least one second fan. At least one first fan is disposed on the front side of the chassis. The air guide hood has an air inlet and an air outlet, and the air inlet is adjacent to at least one first fan. At least one second fan is disposed adjacent to the air outlet of the air guide hood. Among them, this heat dissipation component can not only improve the heat dissipation efficiency of the vertical graphics card, but also improve the overall heat dissipation efficiency of the desktop computer.
雖然本發明的實施例及其優點已揭露如上,但應該瞭解的是,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作更動、替代與潤飾。此外,本發明之保護範圍並未侷限於說明書內所述特定實施例中的製程、機器、製造、物質組成、裝置、方法及步驟,任何所屬技術領域中具有通常知識者可從本發明揭示內容中理解現行或未來所發展出的製程、機器、製造、物質組成、裝置、方法及步驟,只要可以在此處所述實施例中實施大抵相同功能或獲得大抵相同結果皆可根據本發明使用。因此,本發明之保護範圍包括上述製程、機器、製造、物質組成、裝置、方法及步驟。另外,每一申請專利範圍構成個別的實施例,且本發明之保護範圍也包括各個申請專利範圍及實施例的組合。Although the embodiments and their advantages of the present invention have been disclosed above, it should be understood that any modification, substitution and modification can be made by those of ordinary skill in the art without departing from the spirit and scope of the present invention. In addition, the protection scope of the present invention is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Anyone with ordinary knowledge in the relevant technical field can learn from the disclosure of the present invention. It is understood that processes, machines, manufacturing, material compositions, devices, methods and steps currently or developed in the future can be used according to the present invention as long as they can perform substantially the same functions or obtain substantially the same results in the embodiments described herein. Therefore, the protection scope of the present invention includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps. In addition, each patent application scope constitutes an individual embodiment, and the protection scope of the present invention also includes the combination of each patent application scope and embodiments.
1:桌上型電腦1:Desktop computer
100:機箱100:Chassis
101:前側101:Front side
102:後側102:Rear side
103:左側103:Left
104:右側104:Right
105:上側105: Upper side
106:下側106: Lower side
110:顯示卡110: Graphics card
120:主機板120: Motherboard
130:硬碟130:Hard disk
140:電源供應器140:Power supply
200:散熱組件200: Cooling components
210,211,212:第一風扇210,211,212:The first fan
220,221,222,223:第二風扇220,221,222,223: Second fan
230,231,232:第三風扇230,231,232: Third fan
240:第四風扇240:Fourth fan
250:導風罩250:Air guide cover
251:進風口251:Air inlet
252:出風口252:Air outlet
D1:第一方向D1: first direction
D2:第二方向D2: second direction
D3:第三方向D3: Third direction
H:散熱孔H:Heat dissipation hole
L1:導風罩長度L1: Length of air guide hood
L2:第二風扇長度L2: Second fan length
R:凹陷部R: Recessed part
S1:第一側壁S1: first side wall
S2:第二側壁S2: Second side wall
S3:第三側壁S3: Third side wall
S4:第四側壁S4: fourth side wall
W1:第一風扇寬度W1: first fan width
Wi:進風口寬度Wi: air inlet width
本揭露可藉由之後的詳細說明並配合圖示而得到清楚的了解。要強調的是,按照業界的標準做法,各種特徵並沒有按比例繪製,並且僅用於說明之目的。事實上,為了能夠清楚的說明,因此各種特徵的尺寸可能會任意地放大或者縮小。 第1圖為根據本揭露一實施例的桌上型電腦之立體圖。 第2圖為根據本揭露一實施例的桌上型電腦之另一角度的立體圖。 第3圖為根據本揭露一實施例的桌上型電腦之部分元件的示意圖。 第4圖為根據本揭露一實施例的導風罩之立體圖。 第5圖為根據本揭露一實施例的導風罩之側視圖。 第6圖為根據本揭露一實施例的導風罩之俯視圖。 This disclosure can be clearly understood through the following detailed description and accompanying illustrations. It is emphasized that, in accordance with standard practice in the industry, various features are not drawn to scale and are used for illustration purposes only. In fact, the dimensions of the various features may be arbitrarily exaggerated or reduced for clarity of illustration. Figure 1 is a perspective view of a desktop computer according to an embodiment of the present disclosure. Figure 2 is a perspective view of a desktop computer according to an embodiment of the present disclosure from another angle. FIG. 3 is a schematic diagram of some components of a desktop computer according to an embodiment of the present disclosure. Figure 4 is a perspective view of an air guide cover according to an embodiment of the present disclosure. Figure 5 is a side view of an air guide according to an embodiment of the present disclosure. Figure 6 is a top view of an air guide according to an embodiment of the present disclosure.
1:桌上型電腦 1:Desktop computer
100:機箱 100:Chassis
101:前側 101:Front side
102:後側 102:Rear side
103:左側 103:Left
104:右側 104:Right
105:上側 105: Upper side
106:下側 106: Lower side
110:顯示卡 110: Graphics card
120:主機板 120: Motherboard
130:硬碟 130:Hard disk
140:電源供應器 140:Power supply
200:散熱組件 200: Cooling components
210,211,212:第一風扇 210,211,212:The first fan
220,221,222,223:第二風扇 220,221,222,223: Second fan
230:第三風扇 230:Third fan
240:第四風扇 240:Fourth fan
250:導風罩 250:Air guide cover
D1:第一方向 D1: first direction
D2:第二方向 D2: second direction
D3:第三方向 D3: Third direction
H:散熱孔 H:Heat dissipation hole
W1:第一風扇寬度 W1: first fan width
Claims (10)
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TW111115951A TWI812193B (en) | 2022-04-27 | 2022-04-27 | Desktop computer |
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TW111115951A TWI812193B (en) | 2022-04-27 | 2022-04-27 | Desktop computer |
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TWI812193B true TWI812193B (en) | 2023-08-11 |
TW202343193A TW202343193A (en) | 2023-11-01 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6721180B2 (en) * | 2002-07-31 | 2004-04-13 | Infineon Technologies Ag | Cooling hood for circuit board |
TWM305924U (en) * | 2006-08-11 | 2007-02-01 | Hon Hai Prec Ind Co Ltd | Assembly apparatus for guiding airflow |
US20080007911A1 (en) * | 2004-12-22 | 2008-01-10 | Dometic Sweden Ab | Apparatus Casing |
TWM357845U (en) * | 2008-12-08 | 2009-05-21 | Cooler Master Co Ltd | Air duct |
TWI318732B (en) * | 2006-12-07 | 2009-12-21 | Inventec Corp | Heat dissipation wind guidance hood assembly |
US8837138B2 (en) * | 2012-02-27 | 2014-09-16 | Hewlett-Packard Development Company, L.P. | Removable airflow guide assembly with a processor air cooler and memory bank coolers |
-
2022
- 2022-04-27 TW TW111115951A patent/TWI812193B/en active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6721180B2 (en) * | 2002-07-31 | 2004-04-13 | Infineon Technologies Ag | Cooling hood for circuit board |
US20080007911A1 (en) * | 2004-12-22 | 2008-01-10 | Dometic Sweden Ab | Apparatus Casing |
TWM305924U (en) * | 2006-08-11 | 2007-02-01 | Hon Hai Prec Ind Co Ltd | Assembly apparatus for guiding airflow |
TWI318732B (en) * | 2006-12-07 | 2009-12-21 | Inventec Corp | Heat dissipation wind guidance hood assembly |
TWM357845U (en) * | 2008-12-08 | 2009-05-21 | Cooler Master Co Ltd | Air duct |
US8837138B2 (en) * | 2012-02-27 | 2014-09-16 | Hewlett-Packard Development Company, L.P. | Removable airflow guide assembly with a processor air cooler and memory bank coolers |
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