TWI832530B - Electronic circuit module - Google Patents

Abstract

A circuit module is provided, including a circuit unit, a first cooling unit, and a second cooling unit. The first and second cooling units are disposed on opposite sides of the circuit unit. The first cooling unit has a heat pipe, a first centrifugal fans, and a first main fin unit. The second cooling unit has a second centrifugal fans and a second main fin unit. The heat pipe is connected between the first and second main fin units.

Description

Circuit module

The invention relates to a circuit module. More specifically, the present invention relates to a circuit module having a heat pipe.

As the performance requirements of independent graphics cards in desktop computers are getting higher and higher, power consumption and heat generation are also increasing. How to improve its cooling performance has become an important challenge for researchers in this technical field.

In view of the aforementioned conventional problems, one embodiment of the present invention provides a circuit module including a circuit unit, a first heat dissipation unit and a second heat dissipation unit. The aforementioned circuit unit has an integrated circuit component, and the aforementioned first heat dissipation unit is disposed on a first side of the aforementioned circuit unit and has a heat pipe, a first centrifugal fan and a first main fin unit, wherein the aforementioned first centrifugal fan The fan generates airflow through the aforementioned first main fin unit.

The aforementioned second heat dissipation unit is disposed on a second side of the aforementioned circuit unit and has a second centrifugal fan and a second main fin unit, wherein the aforementioned second centrifugal fan generates airflow through the aforementioned second main fin unit, and the aforementioned The heat pipe connects the first main fin unit and the two main fin units.

In one embodiment, the circuit module is elongated, and the first main fin unit has a plurality of fins, wherein the fins extend toward a long axis direction of the circuit module.

In one embodiment, the first heat dissipation unit further includes a first axial flow fan and a first auxiliary fin unit, and the first axial flow fan generates airflow through the first auxiliary fin unit.

In one embodiment, the circuit module is elongated, wherein the first fin unit has a plurality of fins, and the fins extend toward one of the short-axis directions of the circuit module.

In one embodiment, the first heat dissipation unit further has a first heat conduction plate and a first heat pipe, wherein the first main fin unit is disposed on the first heat conduction plate, and the first heat pipe is connected to the first heat pipe. Thermal conductive plate and the aforementioned first pair of fin units.

In one embodiment, the second heat dissipation unit further has a second axial flow fan and a second auxiliary fin unit, and the second axial flow fan generates airflow to pass through the second auxiliary fin unit.

In one embodiment, the second heat dissipation unit further has a second heat conduction plate and a second heat pipe, wherein the second main fin unit is disposed on the second heat conduction plate, and the second heat pipe is connected to the second heat pipe. The thermal conductive plate and the aforementioned second pair of fin units.

In one embodiment, the heat pipe has a U-shaped structure.

In one embodiment, the first centrifugal fan and the first main fin unit are adjacent to the integrated circuit component.

In one embodiment, the second centrifugal fan and the second main fin unit are adjacent to the integrated circuit component.

The following describes the circuit module according to the embodiment of the present invention. However, it can be readily appreciated that the present embodiments provide many suitable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments disclosed are merely illustrative of specific ways to use the invention and are not intended to limit the scope of the invention.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is understood that these terms, such as terms defined in commonly used dictionaries, should be interpreted to have a meaning consistent with the relevant technology and the background or context of the present disclosure, and should not be interpreted in an idealized or overly formal manner. Interpretation, unless specifically defined herein.

The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. The direction terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only for reference to the directions in the attached drawings. Therefore, the directional terms used in the embodiments are used to illustrate but not to limit the present invention.

Please refer to Figures 1, 2, 3, and 4 together. Figure 1 shows a perspective view of the circuit module 100 according to an embodiment of the present invention, and Figure 2 shows a perspective view of the circuit module 100 in Figure 1 from another perspective. , Figure 3 shows a perspective view of the circuit module 100 in Figure 1 with the first housing H1 and second housing H2 removed, Figure 4 shows the circuit module 100 in Figure 2 with the first housing removed. The three-dimensional view behind H1 and the second housing H2.

As shown in Figures 1, 2, 3, and 4, the circuit module 100 according to an embodiment of the present invention is, for example, a display card module installed inside a desktop computer or other electronic device. It has a long strip structure and mainly It includes a circuit unit B, a thermal conductive element N, a first housing H1, a second housing H2, a first centrifugal fan CF1, a second centrifugal fan CF2, a first axial flow fan AF1, and a second centrifugal fan CF1. Axial fan AF2, a first main fin unit CS1, a second main fin unit CS2, a first auxiliary fin unit AS1, a second auxiliary fin unit AS2 and are connected to the aforementioned first main fin unit CS1 and at least a U-shaped heat pipe P of the second main fin unit CS2, wherein the heat pipe P may include, for example, a heat pipe or other heat conductive element.

For example, the circuit unit B may include a printed circuit board (PCB), and one or more integrated circuit components (such as GPU) may be disposed on the printed circuit board, wherein the integrated circuit components may pass through the thermally conductive element N The heat is transferred to the second main fin unit CS2 located below the circuit unit B. In addition, the first housing H1 and the second housing H2 are disposed on the upper and lower sides of the circuit unit B respectively.

It should be understood that the aforementioned first centrifugal fan CF1, first axial flow fan AF1, first main fin unit CS1 and first auxiliary fin unit AS1 are all arranged inside the first housing H1, wherein the first centrifugal fan CF1 The first main fin unit CS1 is adjacent to an integrated circuit component (such as a GPU) on the circuit unit B, and the heat generated by the integrated circuit component can be discharged through the first centrifugal fan CF1 and the first main fin unit CS1 Circuit Module 100.

In addition, the first main fin unit CS1 can be connected to the first auxiliary fin unit AS1 through the heat pipe and the heat conduction plate, thereby quickly transferring the heat of the first main fin unit CS1 to the first auxiliary fin unit. AS1, and the first axial flow fan AF1 can be used to discharge the heat of the first fin unit AS1 from the circuit module 100.

As can be seen from Figures 2, 3, and 4, the plurality of fins of the first main fin unit CS1 extend toward one of the long axis directions of the circuit module 100, and the plurality of fins of the first secondary fin unit AS1 The fins extend toward one of the short-axis directions of the circuit module 100, that is to say, the fins of the first main fin unit CS1 and the first auxiliary fin unit AS1 are perpendicular to each other.

On the other hand, the aforementioned second centrifugal fan CF2, second axial flow fan AF2, second main fin unit CS2 and second auxiliary fin unit AS2 are all arranged inside the second housing H2, where the second centrifugal fan CF2 and The second main fin unit CS2 is adjacent to the aforementioned integrated circuit component (such as GPU) in the circuit unit B, and the heat generated by the integrated circuit component can be transferred to the second main fin unit CS2 through the thermal conductive element N, and then the heat generated by the integrated circuit component can be transferred to the second main fin unit CS2. The air flow is then generated through the second centrifugal fan CF2 to discharge the heat of the second main fin unit CS2 from the circuit module 100 .

In addition, the aforementioned second main fin unit CS2 can be connected to the second auxiliary fin unit AS2 through the heat pipe and the heat conduction plate, thereby quickly transferring the heat of the second main fin unit CS2 to the second auxiliary fin. unit AS2, and the second axial flow fan AF2 can be further used to discharge the heat of the second sub-fin unit AS2 from the circuit module 100.

In this embodiment, since the first main fin unit CS1 and the second main fin unit CS2 are connected to each other through the U-shaped heat pipe P, the first main fin unit CS1 and the second main fin unit can be Heat exchange is performed between the units CS2, so that the heat generated by the aforementioned integrated circuit elements can be simultaneously and quickly discharged through the first main fin unit CS1 and the second main fin unit CS2 on the upper and lower sides of the circuit unit B. Circuit Module 100.

As can be seen from Figures 2, 3, and 4, the plurality of fins of the aforementioned second main fin unit CS2 extend toward one of the long axis directions of the circuit module 100, and the plurality of fins of the second secondary fin unit AS2 The fins extend toward one of the short-axis directions of the circuit module 100, that is to say, the second main fin unit CS2 and the second auxiliary fin unit AS2 are perpendicular to each other.

Next, please refer to Figures 5 and 6 together. Figure 5 shows the first centrifugal fan CF1, the first axial flow fan AF1, the first main fin unit CS1, the first auxiliary fin unit AS1, the heat pipe P, and the A schematic diagram of a heat conduction plate T1 and a first heat pipe P1 together forming a first heat dissipation unit M1. Figure 6 shows the second centrifugal fan CF2, the second axial fan AF2, the second main fin unit CS2, and the second auxiliary fin. The unit AS2, the second heat conduction plate T2 and the second heat pipe P2 together form a schematic diagram of a second heat dissipation unit M2.

As shown in Figure 5, the first main fin unit CS1 is disposed on the first heat conduction plate T1, and the first heat conduction plate T1 is connected to the first auxiliary fin unit AS1 through the first heat pipe P1, so Once the heat of the first main fin unit CS1 is transferred to the first auxiliary fin unit AS1 through the first heat conduction plate T1 and the first heat pipe P1, the first auxiliary fin unit AS1 can further be moved by the first axial flow fan AF1. The heat dissipation circuit module 100 of the chip unit AS1.

It should be noted that the aforementioned first centrifugal fan CF1, first axial flow fan AF1, first main fin unit CS1, first auxiliary fin unit AS1, heat pipe P, first heat conduction plate T1 and first heat pipe P1 A first heat dissipation unit M1 can be formed together, which is disposed on the first side of the circuit unit B, in which both ends of the U-shaped heat pipe P extend into the first main fin unit CS1 and the second main fin unit CS2 respectively. This allows for rapid and effective heat transfer between the two.

As shown in Figure 6, the aforementioned second main fin unit CS2 is disposed on the second heat conduction plate T2, and the second heat conduction plate T2 is connected to the second auxiliary fin unit AS2 through the second heat pipe P2, so Once the heat of the second main fin unit CS2 is transferred to the second auxiliary fin unit AS2 through the second heat conduction plate T2 and the second heat pipe P2, the second axial flow fan AF2 can further be used to generate airflow to move the second fin unit AS2. The heat dissipation circuit module 100 of the second pair of fin units AS2.

It should be noted that the aforementioned second centrifugal fan CF2, second axial flow fan AF2, second main fin unit CS2, second auxiliary fin unit AS2, second heat conduction plate T2 and second heat pipe P2 together form a first The two heat dissipation units M2 are arranged on the second side of the circuit unit B, in which the heat of the second main fin unit CS2 can be transferred to the first main fin unit CS1 through the heat pipe P, so that the heat generated by the aforementioned integrated circuit components The heat can be discharged from the circuit module 100 simultaneously and quickly through the first main fin unit CS1 and the second main fin unit CS2 on the upper and lower sides of the circuit unit B.

Please refer to Figures 7 and 8 together. Figure 7 shows a side view of the circuit unit B, the thermal conductive element N, the first heat dissipation unit M1 and the second heat dissipation unit M2 after they are combined. Figure 8 shows the circuit unit B, Another side view of the thermal conductive element N, the first heat dissipation unit M1 and the second heat dissipation unit M2 after being combined.

As shown in Figure 7, the first heat dissipation unit M1 and the second heat dissipation unit M2 are respectively located on the first side and the second side of the circuit unit B after assembly, in which the first and second centrifugal fans CF1 and CF2 can be moved along the Airflow is generated in the horizontal direction, and the airflow can be discharged from the circuit module 100 through the first and second main fin units CS1 and CS2. On the other hand, the first and second axial flow fans AF1 and AF2 can generate airflow in the vertical direction, and cause the airflow to flow through the first and second auxiliary fin units AS1 and AS2 and discharge from the circuit module 100, whereby the airflow can be Make full use of space and greatly improve the heat dissipation efficiency of the circuit module 100.

In this embodiment, the density of the first and second main fin units CS1 and CS2 is higher than the density of the first and second auxiliary fin units AS1 and AS2.

As can be seen from Figure 8, the two ends of the U-shaped heat pipe P respectively extend into the first main fin unit CS1 and the second main fin unit CS2 on both sides of the circuit unit B, thereby enabling a gap between the two. Perform fast and effective heat transfer. In this way, the heat of the second main fin unit CS2 can be transferred to the first main fin unit CS1 through the heat pipe P, so that the heat generated by the aforementioned integrated circuit components (such as GPU) can be simultaneously and quickly passed through The first main fin unit CS1 and the second main fin unit CS2 on both sides of the circuit unit B are discharged from the circuit module 100 .

Although the embodiments and their advantages of the present invention have been disclosed above, it should be understood that any modification, substitution and modification can be made by those of ordinary skill in the art without departing from the spirit and scope of the present invention. In addition, the protection scope of the present invention is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Anyone with ordinary knowledge in the relevant technical field can learn from the disclosure of the present invention. It is understood that processes, machines, manufacturing, material compositions, devices, methods and steps currently or developed in the future can be used according to the present invention as long as they can perform substantially the same functions or obtain substantially the same results in the embodiments described herein. Therefore, the protection scope of the present invention includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps. In addition, each patent application scope constitutes an individual embodiment, and the protection scope of the present invention also includes the combination of each patent application scope and embodiments.

Although the present invention has been disclosed above in terms of preferred embodiments, they are not intended to limit the present invention. Anyone familiar with this art can make some modifications and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the appended patent application scope.

100:Circuit module AF1: First axial fan AF2: Second axial fan AS1: The first fin unit AS2: Second fin unit B:Circuit unit CF1: First centrifugal fan CF2: Second centrifugal fan CS1: First main fin unit CS2: Second main fin unit H1: first shell H2: Second shell M1: first cooling unit M2: Second cooling unit N: Thermal conductive element P:heat pipe P1: The first heat pipe P2: Second heat pipe T1: The first thermal conductive plate T2: Second thermal conductive plate

Figure 1 shows a perspective view of a circuit module 100 according to an embodiment of the present invention. Figure 2 shows another perspective view of the circuit module 100 in Figure 1 . FIG. 3 shows a perspective view of the circuit module 100 in FIG. 1 with the first housing H1 and the second housing H2 removed. FIG. 4 shows a perspective view of the circuit module 100 in FIG. 2 with the first housing H1 and the second housing H2 removed. Figure 5 shows that the first centrifugal fan CF1, the first axial flow fan AF1, the first main fin unit CS1, the first auxiliary fin unit AS1, the heat pipe P, the first heat conduction plate T1 and the first heat pipe P1 together form a Schematic diagram of the first heat dissipation unit M1. Figure 6 shows that the second centrifugal fan CF2, the second axial flow fan AF2, the second main fin unit CS2, the second auxiliary fin unit AS2, the second heat conduction plate T2 and the second heat pipe P2 together form a second heat dissipation unit. Schematic diagram of M2. Figure 7 shows a side view of the circuit unit B, the thermal conductive element N, the first heat dissipation unit M1 and the second heat dissipation unit M2 after they are combined. FIG. 8 shows another side view of the circuit unit B, the thermal conductive element N, the first heat dissipation unit M1 and the second heat dissipation unit M2 after they are combined.

100:Circuit module

B:Circuit unit

H1: first shell

H2: Second shell

AF1: First axial fan

AS1: The first fin unit

AS2: Second fin unit

CF1: First centrifugal fan

N: Thermal conductive element

Claims (10)

A circuit module including: A circuit unit having an integrated circuit component; A first heat dissipation unit, disposed on a first side of the circuit unit, has a heat pipe, a first centrifugal fan and a first main fin unit, wherein the first centrifugal fan generates airflow through the first main fin slice unit; and a second heat dissipation unit, disposed on a second side of the circuit unit, having a second centrifugal fan and a second main fin unit, wherein the second centrifugal fan generates airflow through the second main fin unit, and The heat pipe connects the first main fin unit and the two main fin units. The circuit module of claim 1, wherein the circuit module is elongated, and the first main fin unit has a plurality of fins, wherein the fins extend toward a long axis direction of the circuit module. The circuit module of claim 1, wherein the first heat dissipation unit further has a first axial flow fan and a first auxiliary fin unit, and the first axial flow fan generates airflow through the first auxiliary fin unit. The circuit module of claim 3, wherein the circuit module is elongated, and the first fin unit has a plurality of fins, and the fins extend toward a short axis direction of the circuit module. The circuit module of claim 4, wherein the first heat dissipation unit further has a first heat conduction plate and a first heat pipe, wherein the first main fin unit is disposed on the first heat conduction plate, and the first heat pipe Connect the first thermal conductive plate and the first fin unit. The circuit module of claim 3, wherein the second heat dissipation unit further has a second axial flow fan and a second auxiliary fin unit, and the second axial flow fan generates airflow through the second auxiliary fin unit. The circuit module of claim 6, wherein the second heat dissipation unit further has a second heat conduction plate and a second heat pipe, wherein the second main fin unit is disposed on the second heat conduction plate, and the second heat pipe Connect the second thermal conductive plate and the second fin unit. The circuit module of claim 1, wherein the heat pipe has a U-shaped structure. The circuit module of claim 1, wherein the first centrifugal fan and the first main fin unit are adjacent to the integrated circuit component. The circuit module of claim 1, wherein the second centrifugal fan and the second main fin unit are adjacent to the integrated circuit component.

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