TW202350056A - Heat dissipating system - Google Patents

Abstract

A heat dissipating system for electronic devices includes a first heat dissipation device, a thermal conduction component, and a second heat dissipation device. A thermal conduction component is disposed around the first heat dissipation device and is configured to thermally contact a heat source. The second heat dissipation device is disposed adjacent to the thermal conduction component. The first heat dissipation device is configured to generate a first working fluid toward the thermal conduction component, such that the heat transferred from the heat source to the thermal conduction component is dissipated in a plurality of directions away from the first heat dissipation device. The second heat dissipation device is configured to generate a second working fluid, such that the heat distributed adjacent to the second heat dissipation device is dissipated in at least one direction away from the second heat dissipation device.

Description

Cooling system

The present disclosure relates to a heat dissipation system, and in particular to a heat dissipation system for electronic devices.

As the performance of electronic devices continues to improve, the requirements for heat dissipation efficiency of electronic devices are also getting higher and higher, especially for gaming laptops. While improving processor performance, in order to enhance heat dissipation and cooling, the cooling system required by gaming laptops is often more complex and bulky, making gaming laptops thicker and heavier than ordinary laptops. It is also heavier, thus reducing the portability of gaming laptops.

Therefore, how to propose a cooling system that can solve the above problems is one of the problems that the industry is currently eager to invest in research and development resources to solve.

In view of this, one purpose of the present disclosure is to provide a heat dissipation system that can solve the above problems.

The present disclosure relates to a heat dissipation system for an electronic device, including a first heat dissipation device, a heat conduction component and a second heat dissipation device. The thermal conductive component is disposed around the first heat dissipation device and configured to contact the heat source. The second heat dissipation device is disposed adjacent to the heat conduction component. The first heat dissipation device is configured to generate a first working fluid toward the heat conduction component, causing the heat transferred from the heat source to the heat conduction component to be dispersed in a plurality of directions away from the first heat dissipation device. The second heat dissipation device is configured to generate a second action fluid, causing heat adjacent to the second heat dissipation device to be dispersed in at least one direction away from the second heat dissipation device.

In some embodiments, at least one direction away from the second heat dissipation device is at least one direction toward the heat conduction component.

In some embodiments, at least one direction away from the second heat dissipation device is at least one direction away from the heat conductive component.

In some embodiments, the thermally conductive component further includes a thermally conductive element extending to the second heat sink and a heat exchanger adjacent the second heat sink, and the second working fluid passes through the heat exchanger.

In some embodiments, the heat dissipation system further includes a first baffle disposed between the heat conduction component and the second heat dissipation device.

In some embodiments, the thermally conductive component is a vapor chamber, a heat pipe, a graphite sheet, or a highly conductive metal.

In some embodiments, the thermally conductive component is disposed completely around the first heat dissipation device.

In some embodiments, the thermally conductive component is partially disposed around the first heat sink.

In some embodiments, a thermally conductive component is located between the first heat sink and the second heat sink.

In some embodiments, the first heat dissipation device is an open centrifugal fan. The open centrifugal fan includes at least one axial air inlet and a plurality of radial air outlets, and the radial air outlets respectively correspond to the ones far away from the first heat dissipation device. direction.

In some embodiments, the second heat dissipation device is a closed centrifugal fan, and the closed centrifugal fan includes at least one axial air inlet and at least one lateral air outlet.

In some embodiments, the closed centrifugal fan further includes a housing and a second baffle. The housing has at least one axial air inlet and at least one lateral air outlet. The second baffle surrounds the housing.

In some embodiments, the closed centrifugal fan further includes a housing and a third baffle. The housing has at least one axial air inlet and at least one lateral air outlet. The third baffle is disposed on the housing and located at the outer edge of at least one axial air inlet.

To sum up, in the heat dissipation system of the present disclosure, the heat conduction component evenly disperses the heat from the heat source through the working fluid generated by the first heat dissipation device. The second heat dissipation device further generates a working fluid to guide the heat in a specific direction. The heat-conducting element extended from the heat-conducting component can further dissipate the heat of the heat-conducting component and guide the heat to the path through which the working fluid generated by the second heat dissipation device passes. In addition, the first blocking body disposed between the heat conduction component and the second heat dissipation device allows the first heat dissipation device and the second heat dissipation device to have independent (thermal) flow fields, reducing unnecessary heat transfer and preventing internal heat transfer in the system. The backflow of hot air leads to reduced heat dissipation efficiency. Compared with the current heat dissipation systems commonly used in electronic devices, it can achieve a better heat dissipation and cooling effect.

These and other aspects of the present disclosure will become apparent from the following description of preferred embodiments taken in conjunction with the accompanying drawings, but may be made without departing from the spirit and scope of the novel concepts of the present disclosure. changes and modifications.

The following disclosure will now be described more fully herein by drawings and references, in which some exemplary embodiments are shown. The present disclosure may be implemented in different forms and should not be limited by the embodiments mentioned below. However, these embodiments are provided to facilitate a more complete understanding of the disclosure and to fully convey the scope of the invention to those skilled in the art. The same reference numbers will be used throughout the text to refer to similar elements.

Please refer to FIG. 1 , which illustrates a top view of a heat dissipation system 100 according to some embodiments of the present disclosure. As shown in FIG. 1 , the heat dissipation system 100 includes a heat conduction component 101 , a first heat dissipation device 102 and a second heat dissipation device 103 . The thermal conductive component 101 is arranged around the first heat dissipation device 102 . As shown in FIG. 1 , the heat conduction component 101 is partially disposed around the first heat dissipation device 102 . In some embodiments, the thermal conductive component 101 is completely disposed around the first heat dissipation device 102 (refer to FIG. 5 ). The second heat dissipation device 103 is disposed adjacent to the heat conduction component 101 . In some embodiments, the thermal conductive component 101 is located between the first heat dissipation device 102 and the second heat dissipation device 103 .

The thermal conductive component 101 is configured to thermally contact the heat source of the electronic device. The number of heat sources is not limited to one. If there are two heat sources, they are arranged on opposite sides of the first heat dissipation device 102 to disperse the heat sources and reduce the superposition of heat energy generated by the two heat sources. Similarly, if there are more than three heat sources, they are all arranged around the first heat dissipation device 102 . In embodiments of the present disclosure, the electronic device may be, but is not limited to, a portable electronic device such as a notebook computer or a palmtop computer.

The thermal conductive component 101 may be a vapor chamber, a heat pipe, a graphite sheet or a highly conductive metal, which can absorb and disperse the heat from the heat source to the thermal conductive component 101 . It should be understood that the heat conduction component 101 can have different shapes and configurations in conjunction with the first heat dissipation device 102, the second heat dissipation device 103 and the external structure of the system, while remaining within the scope of the present disclosure.

Please refer to FIGS. 2A and 2B , which respectively illustrate a perspective view and a side view of the first heat dissipation device 102 according to some embodiments of the present disclosure. In these embodiments, the first heat dissipation device 102 is an open centrifugal fan, including at least one axial air inlet 104 and several radial air outlets 105 . These radial air outlets 105 respectively correspond to the air outlet directions away from the first heat dissipation device 102 . For example, as shown in Figure 2B, an open centrifugal fan has two axial air inlets 104 and several radial air outlets 105. The open centrifugal fan introduces air from outside the system through the two axial air inlets 104. The cold air is then blown to the heat transfer component 101 along different air outlet directions through the radial air outlet 105 (as shown by the arrow of the first acting fluid WF1 in Figure 2B). In the embodiment of the present disclosure, the first heat dissipation device 102 may be, but is not limited to, an open centrifugal fan.

Please refer to FIGS. 3A and 3B , which respectively illustrate a perspective view and a side view of the second heat dissipation device 103 according to some embodiments of the present disclosure. In these embodiments, the second heat dissipation device 103 is a closed centrifugal fan, including at least one axial air inlet 106 and at least one lateral air outlet 107 . For example, as shown in Figure 3B, a closed centrifugal fan has two axial air inlets 106 and one lateral air outlet 107. The closed centrifugal fan introduces cold from outside the system through the two axial air inlets 106. air, and then the cold air is discharged along the opening direction through the lateral air outlet 107 (as shown by the arrow of the second acting fluid WF2 in Figure 3B). In the embodiment of the present disclosure, the second heat dissipation device 103 may be, but is not limited to, a closed centrifugal fan.

In some embodiments, the second heat dissipation device 103 further includes a housing 108 and a second baffle 109 . The housing 108 has at least one axial air inlet 106 and at least one lateral air outlet 107 . For example, as shown in Figures 3A and 3B, the housing 108 has two axial air inlets 106 and one lateral air outlet 107. The second baffle 109 surrounds the housing 108 and is configured to prevent the heat carried by the heat conduction component 101 adjacent to the second heat dissipation device 103 from heating the second heat dissipation device 103, causing the cold air introduced by the second heat dissipation device 103 to be heated. Thereby reducing cooling efficiency.

In some embodiments, the second heat dissipation device 103 further includes a housing 108 and a third baffle 110 . As shown in Figure 3A, the third baffle 110 is disposed on the housing 108, respectively located at the outer edges of the two axial air inlets 106. Its purpose is to ensure that the air introduced by the two axial air inlets 106 comes from outside the system, rather than from the higher temperature air circulating near the second heat sink 103 . Although the third baffle 110 is annular in FIG. 3A , it should be understood that the third baffle 110 can have different shapes and configurations according to different flow field characteristics while remaining within the scope of the present disclosure. .

In the drawings of this disclosure, the first heat dissipation device 102 is shown as an open centrifugal fan as an example, and the second heat dissipation device 103 is shown as a closed centrifugal fan as an example.

Returning to Figure 1, the first heat dissipation device 102 takes in air from outside the system, and the introduced cold air is blown radially to the heat conduction component 101 along different air outlet directions, accelerating the heat conduction component 101 to evenly distribute the heat from the heat source to Thermal conductive components 101 are everywhere. Then, the cold air introduced by the second heat dissipation device 103 exchanges heat with the heat conduction component 101. While the cold air absorbs heat, the heat adjacent to the second heat dissipation device 103 is also dispersed outward along the air outlet direction.

Although only one first heat dissipation device 102 and one second heat dissipation device 103 are shown in the embodiment shown in FIG. 1 , it should be understood that the heat dissipation system 100 may include any number of first heat dissipation devices 102 and second heat dissipation devices. 103, while remaining within the scope of this disclosure.

For example, FIG. 4 illustrates a top view of a heat dissipation system 100' according to some embodiments of the present disclosure. As shown in Figure 4, the heat dissipation system 100' includes a heat conduction component 101, a first heat dissipation device 102, two second heat dissipation devices 103 and a heat exchanger 111. Specifically, the first heat dissipation device 102 blows the cold air to the heat conduction component 101 along different air outlet directions, thereby accelerating the even dispersion of heat in the heat conduction component 101 . Then, the cold air introduced by the second heat dissipation device 103 exchanges heat with the heat conduction component 101 . In addition, as shown in FIG. 4 , the air outlet direction of the second heat dissipation device 103 faces the heat exchanger 111 (such as a heat dissipation fin), which promotes the dispersion of heat from the heat exchanger 111 and accelerates the air convection near the heat conduction component 101 . Reduce heat accumulation in dead zones of the flow field.

In some embodiments, the air outlet direction of the second heat dissipation device 103 is a direction away from the heat conduction component 101 . In these embodiments, the cold air of the second heat dissipation device 103 does not directly exchange heat with the heat conduction component 101, but with a heat conduction element (such as a heat conduction element 112) extending from the heat conduction component 101 and a heat exchanger (such as a heat exchanger). 113) Heat exchange, so that the first heat dissipation device 102 and the second heat dissipation device 103 each have independent (thermal) flow fields to prevent the return of hot air in the system from reducing the heat dissipation efficiency.

For example, FIG. 5 illustrates a top view of a heat dissipation system 200 according to other embodiments of the present disclosure. As shown in FIG. 5 , the air outlet direction of the second heat dissipation device 103 is away from the heat conduction component 101 and perpendicular to the short axis of the heat conduction component 101 . The thermally conductive component 101 further includes a thermally conductive element 112 . The thermal conductive element 112 extends to the outside of the lateral air outlet 107 of the second heat dissipation device 103, and the cold air introduced by the second heat dissipation device 103 exchanges heat with the thermal conductive element 112. In addition, as mentioned above, the second heat dissipation device 103 may further include a second blocking body 109 to block the heat from the portion of the heat conductive component 101 adjacent to the second heat dissipation device 103 . In this way, the first heat dissipation device 102 and the second heat dissipation device 103 each have independent (thermal) flow fields, which conduct and discharge heat in different directions.

Similarly, although only one first heat dissipation device 102, one second heat dissipation device 103 and one heat conductive element 112 are shown in the embodiment shown in FIG. The heat dissipation device 102, the second heat dissipation device 103 and the thermal conductive element 112 are all within the scope of the present disclosure.

For example, FIG. 6 illustrates a top view of a heat dissipation system 200' according to other embodiments of the present disclosure. As shown in FIG. 6 , the heat dissipation system 200 ′ includes a heat conduction component 101 , a first heat dissipation device 102 , two second heat dissipation devices 103 , a heat exchanger 111 , two heat conduction elements 112 and two heat exchangers 113 . Specifically, the first heat dissipation device 102 blows cold air to the heat conduction component 101 along different air outlet directions to accelerate the even dispersion of heat in the heat conduction component 101. The heat exchanger 111 increases the heat convection and heat radiation area and accelerates the heat dissipation of the heat conduction component 101. efficiency. At the same time, the heat conduction element 112 guides part of the heat of the heat conduction component 101 to the outside of the lateral air outlet 107 of the second heat dissipation device 103, and the cold air introduced by the second heat dissipation device 103 interacts with the heat exchanger 113 (such as a heat dissipation fin). For heat exchange, the heat exchanger 113 can increase the heat convection and heat radiation area and improve the heat dissipation efficiency.

Please refer to FIG. 7 , which illustrates a top view of a heat dissipation system 200'' according to other embodiments of the present disclosure. In some embodiments, in order to block the heat transfer between the portion of the thermal conductive component 101 adjacent to the second heat dissipation device 103 and the second heat dissipation device 103, and to enhance the respective (heat) flow of the first heat dissipation device 102 and the second heat dissipation device 103, To separate the fields, the heat dissipation system 200'' further includes a first baffle 114 to reduce unnecessary heat transfer and prevent the backflow of hot air in the system from reducing the heat dissipation efficiency. For example, the first baffle 114 is disposed around the edge of the heat conduction component 101, as shown in FIG. 7 . As mentioned above, the heat conduction component 101 can be a vapor chamber, a heat pipe, a graphite sheet or a highly conductive metal, etc. Therefore, the first baffle 114 can have different configurations according to different structures of the heat conduction component 101 while maintaining Within the scope of this disclosure.

From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that in the heat dissipation system of the present disclosure, the heat conduction component evenly disperses the heat from the heat source through the working fluid generated by the first heat dissipation device. The second heat dissipation device further generates a working fluid to guide the heat in a specific direction. The heat-conducting element extended from the heat-conducting component can further dissipate the heat of the heat-conducting component and guide the heat to the path through which the working fluid generated by the second heat dissipation device passes. In addition, the first blocking body disposed between the heat conduction component and the second heat dissipation device allows the first heat dissipation device and the second heat dissipation device to have independent (thermal) flow fields, reducing unnecessary heat transfer and preventing internal heat transfer in the system. The backflow of hot air leads to reduced heat dissipation efficiency. Compared with the current heat dissipation systems commonly used in electronic devices, it can achieve a better heat dissipation and cooling effect.

The foregoing description is merely illustrative and descriptive of exemplary embodiments of the present disclosure, and is not intended to be exhaustive or to limit the precise forms of the invention disclosed in the present disclosure. The above teachings may be modified or varied.

The embodiments were chosen and described in order to explain the contents of the present disclosure and their practical applications to thereby inspire others skilled in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will be apparent to those skilled in the art to which this disclosure belongs without departing from the spirit and scope of this disclosure. Therefore, the scope of the present disclosure is determined by the appended claims rather than by the foregoing specification and the exemplary embodiments described therein.

100,100',200,200',200'': cooling system 101:Thermal conductive components 102:First heat dissipation device 103: Second heat dissipation device 104,106: Axial air inlet 105: Radial air outlet 107: Side air outlet 108: Shell 109:Second blocking body 110:Third block 111,113:Heat exchanger 112: Thermal conductive element 114:First blocking body WF1: first acting fluid WF2: Secondary acting fluid

The drawings illustrate one or more embodiments of the disclosure and, together with the written description, serve to explain principles of the disclosure. Wherever possible, the same drawing numbers will be used throughout the drawings to refer to similar or identical elements of the embodiments, where: Figure 1 is a top view of a heat dissipation system according to some embodiments of the present disclosure. FIG. 2A is a perspective view of a first heat dissipation device according to some embodiments of the present disclosure. Figure 2B is a side view of a first heat dissipation device according to some embodiments of the present disclosure. FIG. 3A is a perspective view of a second heat dissipation device according to some embodiments of the present disclosure. Figure 3B is a side view of a second heat dissipation device according to some embodiments of the present disclosure. Figure 4 is a top view of a heat dissipation system according to some embodiments of the present disclosure. FIG. 5 is a top view of a heat dissipation system according to other embodiments of the present disclosure. FIG. 6 is a top view of a heat dissipation system according to other embodiments of the present disclosure. FIG. 7 is a top view of a heat dissipation system according to other embodiments of the present disclosure.

200': Cooling system

101:Thermal conductive components

102:First heat dissipation device

103: Second heat dissipation device

107: Side air outlet

111,113:Heat exchanger

112: Thermal conductive element

Claims (13)

A heat dissipation system for electronic devices, including: a first heat dissipation device; a heat conductive component disposed around the first heat dissipation device and configured to contact a heat source; and a second heat dissipation device disposed adjacent to the heat conduction component, Wherein the first heat dissipation device is configured to generate a first working fluid toward the heat conduction component, causing the heat transferred from the heat source to the heat conduction component to be dispersed in a plurality of directions away from the first heat dissipation device, and the second heat dissipation device is configured to generate A second acting fluid causes the heat adjacent to the second heat dissipation device to be dispersed in at least one direction away from the second heat dissipation device. The heat dissipation system of claim 1, wherein the at least one direction away from the second heat dissipation device is at least one direction toward the heat conduction component. The heat dissipation system of claim 1, wherein the at least one direction away from the second heat dissipation device is at least one direction away from the heat conduction component. The heat dissipation system of claim 3, wherein the heat conduction component further includes a heat conduction element extending to the second heat dissipation device and a heat exchanger adjacent to the second heat dissipation device, and the second working fluid passes through the heat exchanger . The heat dissipation system according to claim 4, further comprising a first blocking body disposed between the heat conduction component and the second heat dissipation device. The heat dissipation system as claimed in claim 1, wherein the heat conductive component is a vapor chamber, a heat pipe, a graphite sheet or a highly conductive metal. The heat dissipation system of claim 1, wherein the heat conductive component is completely arranged around the first heat dissipation device. The heat dissipation system of claim 1, wherein the heat conductive component is partially disposed around the first heat dissipation device. The heat dissipation system of claim 1, wherein the heat conduction component is located between the first heat dissipation device and the second heat dissipation device. The heat dissipation system of claim 1, wherein the first heat dissipation device is an open centrifugal fan, and the open centrifugal fan includes at least one axial air inlet and a plurality of radial air outlets, and the radial air outlets Corresponding to the directions away from the first heat dissipation device respectively. The heat dissipation system of claim 1, wherein the second heat dissipation device is a closed centrifugal fan, and the closed centrifugal fan includes at least one axial air inlet and at least one lateral air outlet. The cooling system as described in claim 10, wherein the closed centrifugal fan further includes: A housing having the at least one axial air inlet and the at least one lateral air outlet; and A second blocking body surrounds the housing. The cooling system as described in claim 10, wherein the closed centrifugal fan further includes: A housing having the at least one axial air inlet and the at least one lateral air outlet; and A plurality of third baffles are provided on the housing and located at the outer edge of the at least one axial air inlet.

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