TW201628856A - Method and device for processing thin glasses - Google Patents

Abstract

The invention relates to a compound (4) comprising a glass carrier (3) and a glass film (1) or comprising a silicon wafer (2), wherein the glass film (1) or the silicon wafer (2) has a thickness of at most 400 [mu]m, particularly preferably of less than 145 [mu]m, wherein the glass carrier (3) has a greater thickness than the glass film (1) or the silicon wafer (2), and a surface (10) of the glass film (1) or of the silicon wafer (2) is directly adhesively joined to a surface (30) of the glass carrier (3), and wherein the difference of the linear expansion coefficients of the glasses of the glass carrier and glass film or silicon wafer is less than 0.3*10-6K-1, preferably less than 0.2*10-6K-1, according to amount, in a temperature interval of between 20 and 200 DEG C.

Description

Method and apparatus for processing thin glass

In summary, the present invention relates to the processing and processing of thin glass sheets. In particular, the present invention relates to the treatment of very thin glass films (which are used, for example, as substrates for thin layer processes) or microelectronic components, as well as the processing of germanium wafers for the fabrication of electronic or microelectronic components. .

Thin substrates or ultra-thin substrates are required for many applications in the field of microelectronics. These substrates are currently manufactured on the basis of single crystal germanium. The process of high purity germanium and the methods required to thin the wafer are complex and expensive. In this regard, glass offers a high quality and low cost alternative. It is currently possible to produce a glass having a thickness of 100 μm or less by direct melting. Standard thicknesses of 30 μm, 50 μm and 100 μm are currently available. These glasses have a flame-polished surface on both sides and meet the highest requirements for TTV (Total Thickness Variation) and surface roughness. In addition, depending on the specific needs, the glass can be adapted to the technical requirements of the expansion coefficient by selecting the type of glass, and the process makes the adjustable ability of the glass far superior to that of the single crystal crucible.

A method of treating relatively thin glass sheets has been described in US 6,735,982 B2. According to this method, the glass plate is electrostatically charged and placed on a reversely charged carrier. This carrier was removed after the treatment was carried out. For example, the treated glass sheet can be a front panel of an electronic display. The thickness of the glass plate is 0.5 mm.

US 2012/0040211 A1 discloses a lithium ion battery The glass film has a thickness of 300 μm or less and a surface roughness Ra of 100 Å or less.

Therefore, various applications are derived for thin glass, such as manufacturing miniaturized semiconductor elements on glass, or manufacturing thin film batteries. However, in this regard, particularly in the case where the glass substrate has a size suitable for mass production, the problem is generally the handleability of the thin glass. The characteristics of the glass film are similar to those of a thin plastic film, and its shape stability is limited.

A method has been described in WO 2014/179137 A1 in which a thin glass is held on a carrier. The thin glass is slit and the glass, together with the carrier, is heated by a temperature gradient that extends from the edge of the carrier to the center. The stress caused by this temperature gradient causes the thin glass to be separated at the scratch. However, the portions of the thin glass that are separated from each other are always connected to the carrier. The challenge is how to reliably strip these parts from the carrier.

Therefore, it is an object of the present invention to achieve reliable further processing even for extremely thin glass. The solution of the present invention to achieve this is the item of such separate items. Preferred embodiments of the invention are described in the accompanying claims.

1‧‧‧glass film

2‧‧‧矽 wafer

3, 7‧‧‧ glass carrier

4‧‧‧Complex consisting of 1,3

5‧‧‧Coating deposited on surface 11

6‧‧‧ Coatings, especially implemented as intermediate layers

8‧‧‧ Stripping line

9‧‧‧Typical coating

10, the surface of 11‧‧1, 2

12, 300‧‧‧Compressive stress area

13‧‧‧Lighting diode

14‧‧‧Liquid

15‧‧‧ Energy storage components

17‧‧‧through the passage of 1, 2

18‧‧‧ gap

20‧‧‧Ray beam

21‧‧‧Laser

30, the surface of 32‧‧3

The edge of 31‧‧3

Grooves in 33‧‧30

34‧‧‧ cavity

35‧‧‧ channel

36, 37‧‧‧ openings of 35 of the surfaces 30, 32

100‧‧‧glass membrane components

101‧‧‧矽 Wafer components

102‧‧‧Scratch

1 to 6 illustrate a method step of an embodiment of the method of the present invention in combination with a composite of a glass carrier and a glass film, or a germanium wafer instead of a glass film, wherein FIG. 2 and FIG. 3 are diagrams. a variant of the composite shown in Figure 1; Figure 6 is a variant of the composite of Figure 1 comprising a coating applied to a glass or tantalum wafer; 7 and 8 respectively show a glass carrier comprising a structured surface; FIG. 9 shows a composite comprising a glass carrier having a structured surface, and a glass film fixed to the glass carrier or FIG. 10 is a modification of the specific example shown in FIG. 9 including a channel connected to the surface of the glass carrier; FIG. 11 is a modification of the specific example shown in FIG. 10; and FIG. 12 shows a composite body, wherein The glass film is divided into glass film elements, or the germanium wafer is divided into individual wafer elements; FIG. 13 shows the operation of separating the glass film element or the germanium wafer element by heating the liquid; FIG. 14 and FIG. Two specific examples including a scored glass film or a creped wafer are shown; and Figure 16 is a modification of the example shown in Figures 14 and 15 including a cavity disposed between the scratches.

The invention will now be further described with reference to the accompanying drawings. In the figures, identical or functionally identical elements are denoted by the same reference numerals.

The method of the present invention is based on the fact that a glass film having a large size and a relatively large thickness is used for the purpose of improving the handleability thereof, and a glass carrier is used to fix the glass film on the glass carrier by adhesion. The method is also suitable for re-separating the glass film from the glass carrier after the process. The glass film is not damaged in the case where the adhesive force is set in a suitable manner and/or when a plurality of members are provided which input mechanical force at an appropriate position to overcome the adhesive force. The challenge is that processing steps, such as deposition of coatings, can also affect adhesion. Here, you need to avoid handling it. The early peeling in the process also needs to prevent the processing at high temperature from causing the connection between the glass film and the glass carrier to be too strong, so that the non-destructive peeling of the glass film cannot be achieved.

According to an alternative embodiment, a germanium wafer, in particular composed of a single crystal germanium, is bonded to the glass support and further processed to replace the glass film.

In summary, the present invention relates to a composite of a relatively thin and brittle material.

To this end, FIGS. 1 to 6 are diagrams exemplarily showing the steps of a specific example of the method of the present invention, and the glass carrier 3 and the glass film 1 of the present invention, or the wafer 2 for replacing the glass film 1 The composite formed.

The basis of the method for further processing thin glass of the present invention is to prepare a glass film 1 or a germanium wafer 2 having a thickness of 400 μm (micrometers) or less, preferably less than 145 μm (micrometers), and in a certain direction. The lateral dimension is at least 5 cm, and - the glass film 1 or the tantalum wafer 2 is fixed on the glass carrier 3, the thickness of the glass carrier being larger than the glass film 1 or the tantalum wafer 2. Among them, the glass film 1 or the germanium wafer 2 has the same or slightly different coefficient of expansion (CTE) as the glass carrier 3, and is usually realized by using the same or only slightly different glass composition for the glass film and the glass carrier.

More preferably, the composition of the glass film and the glass carrier are slightly different, wherein in particular, at least one of the glass components differs by at least 1% by weight of the content expressed by weight percent, and wherein all of the major glass groups The fraction, that is, the glass component having a content greater than 5 wt% of the composition, is less than or equal to 5%.

This approach results in slightly different chemical properties and in particular slightly different physical properties, such as in the case of van der Waals interactions.

According to one aspect of the invention, the glass film 1 or twin is attached by attachment The circle 2 is fixed to the glass carrier 3. Wherein, the surface of the glass film and the glass carrier or the surface of the silicon wafer and the glass carrier directly adhere to each other. That is, specifically, an adhesive or a synthetic resin is not used.

When using this method, two glass faces with higher flatness and lower surface roughness are usually combined. The molecular interaction between the two faces produces the adhesion, which fixes the glass film 1 to the glass carrier 3, or alternatively fixes the tantalum wafer 2 to the glass carrier 3.

The adhesion force is adjusted at the time of attachment so that the glass film is peeled off from the glass carrier after the process without causing damage to the glass film. This also applies to wafer applications.

The adhesion can be adjusted by: 1. manufacturing a glass comprising a flame-polished surface, 2. reducing surface roughness, such as surface polishing with a polishing agent such as cerium oxide, 3. using a cleaning agent And / or pure water or high purity water to clean the glass surface, 4. Ultrasonic cleaning or megasonic cleaning of the glass, or 5. Use an alternative dry cleaning method to clean particles larger than 0.2μm, 6. Plasma Cleaning, 7. flame cleaning, especially through flame cracking, 8. cleaning or surface conditioning by etching, 9. applying electric charge, 10. applying coating, especially inorganic layer, such as metal layer, oxide layer, nitrogen The compound, graphite layer or graphene layer is preferably embodied as a layer or intermediate layer composed of tantalum nitride (SiN), a tantalum semiconductor layer, a chromium layer, an aluminum layer and/or a layer composed of boron nitride (BN). The layers may be applied by CVD, PCVD, sol-gel method or spray coating, 11. The surface of the substrate carrier of the glass carrier is structured, 12. The pressure is applied to compress the glass, 13. Attached The same temperature conditions were set during the process to avoid stress. 14. After the attachment, the glass plate was tempered to increase the adhesion and the maximum temperature was raised to 30 ° C lower than the T _g .

Wherein, it is preferred to set the layer thickness of the coating to be 1 nm to 150 nm, wherein the adhesion force can be set as a function of the layer thickness, that is, for example, in the case of a thinner metal layer, larger or thicker The adhesion tends to be smaller compared to the metal layer. Therefore, different forces can be achieved on a glass carrier. In particular, a small force can be achieved in the edge region of the glass carrier in order to carry out the stripping.

Among them, the graphite layer is particularly suitable as an anti-adhesion layer.

According to a further development of the invention, a direct adhesive connection is achieved with the aid of a liquid. For this reason, water or an aqueous salt solution is particularly suitable for the glass. During the attachment process, the liquid on one or both surfaces is extruded and, in this case, the surfaces are also directly adhered to each other, wherein the residual intermediate intermediate molecules of the liquid are partially transmitted. These van der Waals forces establish a connection for the two components.

Figure 1 is a cross-sectional view of a composite 4 composed of a glass carrier 3 and a glass film 1 positioned thereon. The surface 11 of the glass film 1 opposite the surface 10 is exposed so that it can be processed. For example, a coating can be deposited on the surface 11.

The glass film 1 is further processed after this attachment operation. In particular, this further processing may also include processing steps performed at higher temperatures. In particular, this also relates to temperatures above 200 ° C, in particular above 300 ° C. Wherein these connections directly adhere to each other's surfaces 10, 30 compared to the organic adhesive The processing steps at elevated temperatures are not sensitive.

Alternatively, when the germanium wafer 2 is used, the germanium wafer 2 may be further processed after the attaching operation, wherein it is preferably heated to a temperature higher than 400 ° C, and optimally heated to above 500 ° C. temperature. According to another embodiment of the invention, further processing can also be carried out at room temperature or at a temperature below 100 °C.

According to a further development of the invention, the glass film 1 or the glass carrier 3, or the glass film 1 and the glass carrier 3, are reinforced. Particularly in the case where the glass film of the glass film 1 is thin, it is preferable to use chemical strengthening to achieve this. To this end, Figures 2 and 3 show a variant of the example shown in Figure 1. In the example shown in Fig. 2, the chemically strengthened glass film 1 is fixed on the glass carrier 3. Through the chemical strengthening operation, a plurality of compressive stress regions 12 are formed on the surfaces 10, 11. In the example shown in Figure 3, a chemically strengthened glass carrier 3 is employed. Correspondingly, a compressive stress region 300 is provided on the opposite surfaces 30, 32 of the glass carrier. Due to the large glass thickness of the glass carrier 3, the glass carrier 3 can be strengthened to a greater extent than the glass film 1, and/or the depth of the strengthened region 300 can be increased. Due to the large thickness, the glass carrier 3 can be thermally strengthened as appropriate.

The two embodiments can be combined to obtain a composite comprising a chemically strengthened glass film 1 and preferably a chemically strengthened glass carrier 3. In summary, in a development of the invention, the composite body 4 is provided in a manner not limited to the embodiments, wherein at least one of the composite components, namely the glass film 1 and the glass carrier 3, is strengthened. .

4 and 5 are cross-sectional views of a composite 4 comprising a coating 5 deposited on the exposed surface 11 of the glass film 1. The coating can be, for example, a single layer or a plurality of layers of semiconductor layers, or can also be an optically functional layer, such as a dielectric filter layer or an anti-reverse layer. Shot layer. Wherein, the further processing step of the deposition operation of the coating layer 5 may be to heat the glass film 1 to an upper limit of a temperature lower than the glass transition temperature by 50 ° C while maintaining adhesion. Thus, according to a further development of the invention, the further processing of the glass film comprises a deposition operation of layer 5, wherein the glass film 1 is heated during the deposition process. In general, the method of the present invention is also particularly suitable for processing steps in which the glass cannot be fixed or bound with an adhesive. In particular, this also relates to temperatures above 200 ° C, in particular above 300 ° C. According to a further development of the method, at least one further processing step is carried out on the composite body 4 composed of the glass film 1 and the glass carrier 3, wherein the glass film 1 is heated to a temperature of at least 200 ° C while remaining adhered. Preferably, it is at least 300 ° C.

Therefore, according to an aspect of the present invention, a method of further processing a thin glass is proposed, without being limited to the illustrated embodiment, wherein - the glass film 1 or the germanium wafer 2 is prepared to have a thickness of 400 μm or less. Preferably, it is less than or equal to less than 145 μm, and its lateral dimension in a certain direction is at least 5 cm, and - the glass film 1 or the germanium wafer 2 is fixed on the glass carrier 3 having a thickness larger than the glass film 1 or the germanium wafer 2, Specifically, the glass film 1 or the germanium wafer 2 is attached to the glass carrier 3 by attachment, thereby obtaining the composite 4 of the present invention, and - after at least one further processing step, mechanical force is used to coat the glass film 1 or The germanium wafer 2 is separated from the glass carrier 3.

In summary, this further processing may include fabricating a layer system for a lithium-based energy storage element, without being limited to the illustrated embodiment. To this end, in the first coating step, a conductive conductor layer for the two electrodes of the energy storage element can be deposited. In the subsequent process, The cathode material is first deposited on a conductor for the cathode, typically a lithium-cobalt oxide LCO. In the next step, a solid electrolyte is applied. For example, an amorphous material named LiPON composed of lithium, oxygen, nitrogen and phosphorus is suitably used for this purpose. In the next step, an anode material is deposited in a manner such that it is connected to the substrate, the conductor for the anode, and the solid electrolyte. In particular, lithium metal is used as the anode material. If the two conductors establish an electrically conductive connection, in the charged state, lithium ions migrate from the anode to the cathode through the solid ion conductor, thereby generating a current from the cathode to the anode through the conductive connection of the two conductors. Conversely, in an uncharged state, the plasma or the energy storage element is charged by applying an external voltage to cause the plasma to migrate from the cathode to the anode.

Since the expansion coefficients of the glass film 1 or the tantalum wafer 2 and the glass carrier 3 are the same or very similar, no temperature-dependent stress causing temporary peeling of the glass film 3 or the tantalum wafer 2 is generated at a high temperature. In particular, according to the present invention, the difference in linear expansion coefficients of the glass carrier and the glass film or the glass of the ruthenium wafer is less than 0.3 × 10 ^-6 K ^-1 , preferably less than 0.2 × 10 ^-6 K ^-1 . Preferably, this difference is also not exceeded in the temperature interval of 20 ° C to 200 ° C, preferably 20 ° C to 300 ° C. According to a particularly preferred embodiment, the difference in linear expansion coefficients is at least 0.05 x 10 ^-6 K ^-1 .

Such measures of the present invention differ from, for example, the attachment measures for glass elements employed in processing optical components. In this case, the attachment is used to secure the optical glass element, in particular the crucible, in order to carry out the processing. To strip the processed optical component from the carrier, the optical component is heated with the carrier. A mechanical stress is generated between the glass surfaces abutting each other through different linear expansion coefficients, thereby separating the glass element from the carrier.

After one or more further processing steps, the glass is used by using mechanical force The glass film 1 is separated from the glass carrier 3 or the tantalum wafer 2 is separated from the glass carrier 3.

The present invention also simplifies the treatment of a large-area glass film, so that a lateral dimension larger than 5 cm above is preferably used. In particular, the dimensions specific to the semiconductor process can be matched to commonly used wafer sizes. In particular, the glass carrier 3 has a diameter or side dimension of at least 150 mm.

For many applications, such as for the manufacture of the above-described components, it is generally preferred (after preferably further processing) to obtain each glass film element from the glass film 1 by dividing the glass film into segments. The present invention will be further described in detail below. Here, in the process of peeling the glass film 1 from the glass carrier 3, the segment separation may be performed after the operation.

Attachment of the glass film and the glass carrier can be assisted by charging the surface 10, 30. The charge on the surface, or the reverse polarity of the two surfaces, causes electromagnetic attraction and temporarily bonds the glass film to the contact surface of the glass carrier to establish an adhesion between the two contact faces. These adhesion forces are then only produced by the interaction of the contact surfaces. This electrostatic attraction is no longer required, and the electrostatic attraction is also absent or undetectable. After being attached to each other, the different charges are completely eliminated in a short time.

Further, since no adhesive of any type is used, after the further treatment and separation of the glass carrier, the glass films are not contaminated by the adhesive, and it is not necessary to perform a complicated cleaning operation on the glass film.

A typical deposition method is carried out in a vacuum. These include sputtering, evaporation or chemical vapor deposition in a low pressure environment. In addition to layer deposition, other further processing steps can be carried out in a vacuum. Such a step can be, for example, ion implantation performed in a vacuum. Therefore, according to a development of the invention, the glass film 1 and the glass carrier After abutting each other, at least one further processing step is carried out in a vacuum, without being limited to the illustrated embodiment. The present invention has the advantage here that the air bubbles between the glass film 1 and the glass carrier 3 are prevented by directly adhering the two smooth surfaces 10, 30 to each other.

After further processing is performed, for example, as shown in FIG. 4, the glass film 1 can be peeled off from the glass carrier 3 using mechanical force. In particular, it is possible to achieve sequential peeling by progressively lifting, thereby reducing the required force. In the example shown in Fig. 5, for this purpose a ejector 7 is attached to the exposed surface for lifting the glass film 1 in the event of a small curvature.

As described above, even at a high temperature, the glass film 1 and the glass carrier 3 are sufficiently firmly attached to each other for further processing. In general, however, the adhesion is preferably not too large in order to peel the glass film 1 from the glass carrier 3. Among them, the composite 4 comprising the glass carrier 3 and the glass film 1 (thickness of 400 μm or less, preferably less than 145 μm) of the present invention has the following characteristics: - the average adhesion force in the range of the surface 10 of the glass film which rests on the glass carrier 3 is so small that, for the length of each centimeter of the peeling line 8 when the glass film 1 is peeled off from the glass carrier 3 The required peel force is less than 1 Newton. The peeling line 8 is as shown in FIG. The peeling line is a linear region on the glass film, and when the glass film 1 is bent and peeled off, it is separated from the glass carrier 3 in this region. However, without the use of a method for achieving mechanical or chemical edge separation, the initial peel force on the edges can be greatly increased. On the other hand, in order to achieve a sufficiently strong adhesion, in order to reliably fix the glass film 1 on the glass carrier 3 during further processing, the peeling force is preferably at least 0.01 for each centimeter length of the peeling line 8. Newton.

In order to provide the composite 4 with sufficient stability, in particular, the thickness of the glass carrier 3 is at least three times the thickness of the glass film 1. Further, the thickness of the composite 4 is preferably at least 400 μm. According to an alternative or additional embodiment of the invention, the thickness of the glass carrier 1 is preferably selected according to the lateral side dimension of the glass carrier or, in the case of a circular glass carrier, depending on its diameter. In order to achieve sufficient mechanical stability during the attachment and stripping of the glass film 1, in particular sufficient rigidity, and to prevent the glass carrier from being too thick and difficult to handle, the thickness d and the maximum side of the glass carrier are measured in millimeters. In the case of the size S, the ratio d ³ /S ^2/3 is 2 × 10 ^-3 to 14 × 10 ^-3 , preferably 6 × 10 ^-3 to 12 × 10 ^-3 .

The method of the invention is particularly applicable to such further processing steps carried out at higher temperatures. In this case, mechanical stress can be generated between the glass carrier 3 and the glass film 1 by a different coefficient of thermal expansion during heating. Therefore, according to a preferred embodiment of the present invention, a glass is selected for the glass carrier 3, and its linear thermal expansion coefficient is different from the linear thermal expansion coefficient of the glass film 1 by a maximum of 0.2 × 10 ^-6 K ^-1 . More preferably, the glass used in the glass carrier 3 is the same as the glass used in the glass film 1, provided that the resulting adhesive force is within the above range, i.e., neither strong nor weak.

A group of glasses suitable for use in the present invention, particularly as a material for the glass film 1, and also as a material for the glass carrier 3, is an alkali-free borosilicate glass. The following composition (wt%) is preferably used here:

Such glasses are also found in US 2002/0032117 A1, the contents of which are related to glass composition and glass properties are also fully incorporated into the present application. Such glass, commercially available under the name AF32, is marketed by the applicant.

Another preferred type of glass is boron bismuth glass having the following composition (wt%):

One such glass is Schott Glass D263. Such glasses having a more precise composition are also found in US 2013/207058 A1, the contents of which are also incorporated herein by reference. According to another embodiment of the present invention, at least one of the glass carrier 3 and the glass film 1 element is constructed of glass having the above composition. It is preferable to use such a glass for the glass carrier 3 as well as for the glass film 1.

Both of the above glass types are particularly suitable for the manufacture of very thin glass films, in particular glass films having a thickness of less than 145 [mu]m, which at the same time have a smooth surface in order to achieve good adhesion. Further, the above-mentioned alkali-free borosilicate glass is also particularly suitable for use as a substrate (particularly a ruthenium-based substrate) in semiconductor fabrication. Based on the alkali-free composition, no alkali ions are diffused inwardly to the semiconductor layer deposited on the glass. The coefficient of linear thermal expansion is also similar to that of 矽.

In order to achieve a strong adhesion so as to reliably separate the glass film, according to another embodiment of the present invention, a glass having a certain hardness is used. Among them, the solution is applicable to both the glass carrier 3 and the glass film 1. If the glasses are relatively soft, the adhesion is enhanced. On the other hand, hard glass can cause the attachment to be too small. According to a specific example of the present invention, glass having a Knoop hardness of 520 to 650 is preferably used.

Other glass compositions are listed below which are suitable for the production of glass films having a thickness of less than or equal to 400 μm, particularly preferably less than 145 μm, and which are suitable for adhesion to a glass carrier, in particular a glass carrier of the same material.

Example 1

The glass composition for both the glass film 1 and the glass carrier 3 is the exemplary composition (wt%) already provided above:

Example 2

The glass composition for the glass film 1 and/or the glass carrier 3 is the exemplary composition (wt%) provided above:

As an additional aspect, the sum of the contents of MgO, CaO and BaO is characterized in that it is in the range of 8 to 18% by weight.

Example 3

The glass composition for the glass film 1 and/or the glass carrier 3 is provided by the following exemplary composition (wt%):

Example 4

A glass for the glass film 1 and/or the glass carrier 3 has the following exemplary composition (wt%):

Through this composition, the following characteristics of the glass are achieved:

Example 5

Another glass for the glass film 1 and/or the glass carrier 3 has the following exemplary composition (wt%):

Through this composition, the following characteristics of the glass are achieved:

Example 6

Another glass for the glass film 1 and/or the glass carrier 3 has the following exemplary composition (wt%):

Through this composition, the following characteristics of the glass are achieved:

Example 7

Another glass for the glass film 1 and/or the glass carrier 3 has the following exemplary composition (wt%):

Through this composition, the following characteristics of the glass are achieved:

Example 8

Another glass for the glass film 1 and/or the glass carrier 3 has the following exemplary composition (wt%):

Through this composition, the following characteristics of the glass are achieved:

Example 9

Another glass for the glass film 1 and/or the glass carrier 3 has the following exemplary composition (wt%):

Through this composition, the following characteristics of the glass are achieved:

Example 10

Another glass for the glass film 1 and/or the glass carrier 3 has the following exemplary composition (wt%):

Through this composition, the following characteristics of the glass are achieved:

Example 11

Another glass for the glass film 1 and/or the glass carrier 3 has the following exemplary composition (wt%):

Through this composition, the following characteristics of the glass are achieved: α _(20-300) 8.3.10 ^-6 /K

Example 12

Another glass for the glass film 1 and/or the glass carrier 3 has the following exemplary composition (wt%):

Through this composition, the following characteristics of the glass are achieved:

Example 13

The other glass has the following exemplary composition (wt%):

Further, the glass may contain 0 to 1% by weight of P ₂ O ₅ , SrO, BaO; and 0 to 1% by weight of a refined preparation: SnO ₂ , CeO ₂ or As ₂ O ₃ or other refined preparations.

Example 14

The other glass has the following exemplary composition (wt%):

Example 15

The other glass has the following exemplary composition (wt%):

Through this composition, the following characteristics of the glass are achieved: α _(20-300) 3.8.10 ^-6 /K

Example 16

The other glass has the following exemplary composition (wt%):

Through this composition, the following characteristics of the glass are achieved:

Example 17

The other glass has the following exemplary composition (wt%):

Through this composition, the following characteristics of the glass are achieved:

Example 18

The other glass has the following exemplary composition (wt%):

Through this composition, the following characteristics of the glass are achieved:

Example 19

The other glass has the following exemplary composition (wt%):

Example 20

The other glass has the following exemplary composition (wt%):

Through this composition, the following characteristics of the glass are achieved:

Example 21

The other glass has the following exemplary composition (wt%):

Through this composition, the following characteristics of the glass are achieved:

In the case of none of the above, in all of the above embodiments, 0 to 1% by weight of a refining agent such as SnO ₂ , CeO ₂ , As ₂ O ₃ , Cl ^- , F ^- , sulfate may be optionally contained.

As described above, the present invention holds the glass film 1 on the glass carrier 3 by direct adhesion (attachment) to the surfaces abutting each other. Among them, it is particularly preferable to constitute the surfaces through the respective glass itself.

According to an alternative embodiment of the invention, a silicon wafer, in particular composed of a single crystal germanium, can be used instead of the glass film.

However, according to another embodiment of the invention, a coating may be applied to at least one of the surfaces 10, 30 of the glass carrier 3 and the glass film 1 (the wafer 2), which is embodied in particular as an intermediate layer. As an example and variant of the composite 4 shown in Fig. 1, Fig. 6 shows such a composite in which a coating 6 is deposited on the glass film 1 or the tantalum wafer 2. The glass film 1 and the glass carrier 3, or the germanium wafer 2 and the glass carrier 1 are spaced apart therefrom, for the purpose of showing only a coating on the glass film 1 or the germanium wafer 2 in this example. 6. The coating 6 is preferably electrically insulating as the glass, regardless of whether the coating is applied to the glass carrier 3 or applied to the glass film 1 or the wafer 2 as shown. Or applied to the two components.

An example of further processing of the composite 4 comprising the tantalum wafer 2 is to coat an inorganic coating, in particular a layer of tantalum nitride (SiN), a tantalum semiconductor layer, a metallic chromium layer, an aluminum layer and/or Or a layer composed of boron nitride (BN) having a thickness of 1 to 500 nm, which is particularly embodied as being intermediate between the surfaces 10 and 30 of the tantalum wafer 2 and the glass carrier 3 as shown in FIG. Layer 6.

An example of further processing of the glass film 1 is to deposit a semiconductor layer having photoelectron function. For example, as shown in FIG. 6, the light-emitting diode 13 can be fabricated on the glass film by depositing and structuring the semiconductor layer. In this case, the coating 6 can be an anti-reflective coating to enhance the light efficiency of the LED. Methods for fabricating gallium nitride light-emitting diodes on glass substrates are known.

According to a further development of the invention, the further processing of the glass film comprises: manufacturing or applying an optoelectronic component on the surface 11 opposite the surface 10 attached to the glass carrier 3, without being limited to the illustrated example.

Furthermore, the coating 6, which is situated on the glass carrier 3 and/or the glass film 1, in particular the interfacial layer or the intermediate layer 6, can also be used to adjust the adhesion. If the adhesion is greater or less than the above limit due to the glass used, another material may be applied as a coating to adjust the adhesion.

In the case where the adhesion is too large, even for the extremely thin glass, the adhesion can be adjusted by another scheme, thereby achieving non-destructive peeling after further processing the glass film 1. To this end, the surface of the glass carrier 3 can be structured accordingly such that the bearing surface or the contact surface between the two surfaces 10, 30 is smaller than the surface 10 of the glass film 1, thereby preventing the entire surface from adhering.

This solution of course also applies to the composite 4 composed of the glass carrier 3 and the tantalum wafer 2.

To this end, in the example shown in Fig. 7, a plurality of grooves 33 are provided in the surface 30 of the glass carrier 3. After the glass film 1 or the germanium wafer 2 is applied, the glass film or the germanium wafer is positioned above the recess 33 instead of on the glass carrier 3. The contact surface is reduced to a degree that is the area occupied by the recess 33 on the glass film or the germanium wafer. These grooves preferably extend to the edge of the glass film or the germanium wafer. If the lateral dimension of the glass film 1 or the tantalum wafer 2 is exactly equal to the size of the glass carrier 3 as in the previous examples, the recess 33 preferably extends to the edge 31 of the glass carrier 3.

According to a variant of the above-described development of the invention, the structured surface 30 comprising the recess 33 of the glass carrier 3 is realized by a structured coating 9 on the glass carrier 3. See Figure 8 for a related example. To make such a coating, for example, a sol-gel layer can be applied and texturized by embossing, or the intermediate layer of the complementary configuration can be lifted to effect structuring of the coating.

In the vacuum process in the further processing of the glass film 1 or the germanium wafer 2 This structured surface of the glass carrier 3 is also highly advantageous. When the glass film 1 or the germanium wafer 2 is applied to the glass carrier, bubbles may be generated. This may also occur in the case where the two particles are present between the surfaces 10, 30 of each other, and the two surfaces are partially separated. During the vacuum process, such bubbles may cause cracking or peeling of the glass film 1 or the tantalum wafer 2 due to a pressure difference generated in the vacuum. The groove 33 allows the bubble to be discharged into the adjacent groove 33 or to prevent the generation of bubbles during the application.

Another advantage of this specific example is that the stripping operation of the glass film 1 or the germanium wafer 2 is also simplified after the further processing because the glass film 1 or the germanium wafer 2 is not attached in the region of the recess 33. On the glass carrier.

In addition, the above-described structured coating layer may be disposed on the glass film or the tantalum wafer to achieve the above advantages.

In summary, all of the coatings described on the glass carrier 3 and/or the glass film 1 are preferably inorganic coatings. The significance of this solution is to prevent degradation of the coating during further processing at elevated temperatures.

The disclosure of FIGS. 9 to 16 for the composite 4 comprising the glass carrier 3 and the glass film 1 is also applicable to the corresponding composite 4 comprising the silicon wafer 2 instead of the glass film 1, wherein the wafer 2 is modified accordingly. .

Figure 9 shows a composite 4 in which a glass carrier 3 is used, the surface 30 of which is also structured as shown in Figures 7 and 8 such that the contact surface formed between the two surfaces 10, 30 is smaller than that of the glass film 1. Surface 10. In particular, a plurality of grooves 33 are also provided. In summary, the recess 33 can be in the form of an open channel and is not limited to the illustrated embodiment. This is also illustrated by the examples of Figures 7 and 8. In the composite comprising the glass film 1, one or more cavities 34 are formed from the grooves 33. The at least one cavity 34 is also facing It is defined to the surface 10 of the glass carrier 3. More preferably, such cavities can be used to assist or effect the peeling or attachment of the glass film 1 and/or to adjust for changes in the adhesion during this further processing, in particular to suppress such changes. The glass film 1 can be held on the glass carrier 3 by adjusting the pressure difference such that the ambient pressure is greater than the pressure of the fluid in the cavity, or a pressure for attaching the glass film 1 can be produced on the glass carrier. Tight force. In the principle of peeling off the glass film 1 by utilizing the pressure difference between the fluid in the cavity 34 and the environment, it is not only directed to the direct adhesion fixation of the glass film on the glass carrier, i.e., to attachment. For example, based on this principle, the adhesion generated by the adhesive or a suitable plastic layer can be overcome to peel the glass film.

Therefore, in summary, according to another aspect of the present invention, it is not limited to the specific technical solution and shape of the cavity 34 (as shown in the example of FIG. 9), and is not limited to the direct adhesion of the glass film 1 to the glass carrier 3. Connected, a composite body 4 is provided, in which at least one cavity 34 is provided, which is delimited by the surface 10 of the glass film 1 facing the glass carrier 3. In particular, the cavity 34 is preferably in communication with the environment, i.e., open to the environment for fluid exchange. According to another embodiment, however, the cavity can also be isolated from the environment. The cavity may be closed prior to, or during or after the further processing. Various scenarios are further described below.

Taking the glass carrier 3 shown in FIG. 7 and FIG. 8 as an example, wherein the groove 33 extends to the edge, the glass film is attached, or in summary, after the glass film 1 is fixed on the glass carrier 3, The resulting cavity has an opening on the edge 31. In particular, according to the invention, a composite 4 comprising a glass carrier 3 and a glass film 1 is also provided, the thickness of the glass film being less than 400 μm, particularly preferably less than 145 μm, wherein the thickness of the glass carrier 3 is greater than that of the glass film 1 , wherein the glass film 1 attached to the glass carrier 3, Wherein, the surface 30 of the glass carrier 3 adopts a structuring scheme such that the contact surface formed between the two surfaces 10, 30 is smaller than the surface 10 of the glass film 1 facing the glass carrier, and the composite body The glass carrier is structured to have at least one cavity 34 which is delimited by the surface 10 of the glass film 1 facing the glass carrier 3. The cavity 34 is preferably open to the environment and in communication with the environment for feeding or discharging the fluid, or for example, to achieve pressure equalization during high temperature and/or vacuum processes during further processing of the glass film 1. However, according to a further development, the cavity 34 can also be closed, depending on the specific requirements, so that a pressure difference is produced in a targeted manner. This scenario is further explained below.

That is, a solution for stripping the glass film after the further processing, or assisting in this operation, is to create a pressure differential between the fluid in the cavity 34 and the environment, wherein the fluid is overpressured relative to the ambient pressure. under. That is, in this case, an undesired "separation" effect, which may be caused by the above-mentioned undesired bubbles existing between the surfaces during the vacuum process, is utilized to assist or achieve the peeling.

Correspondingly, according to a further development of the method according to the invention, at least one cavity 34 is formed when the glass film 1 is attached to the glass carrier 3, which is bounded by the surface 10 of the glass film 1 facing the glass carrier 3, and wherein In the process of separating the glass film 1 from the glass carrier 3 by mechanical force, a pressure difference is generated between the fluid in the at least one cavity 34 and the environment in a manner such that the pressure of the fluid located in the cavity 34 Greater than the ambient pressure. The force due to this pressure difference acts on the side 10 of the glass film in a direction away from the glass carrier.

The attachment can also be assisted by a reverse pressure differential. In other words, to effect attachment, the glass film 1 is attracted to the glass carrier 3 through a negative pressure in the cavity 34 relative to the ambient pressure. This variant is also extremely advantageous because it is possible to achieve this glass first. The precise orientation of the glass film requires no pressing force or only a small pressing force. If the glass film is properly positioned, the glass 1 can be adsorbed onto the glass carrier by creating a pressure differential between the fluid located in the cavity 34 and the environment. This adsorption not only assists the attachment but also holds and fixes the glass film 1 on the glass carrier 3. That is, according to a specific example, in order to fix the glass film 1 on the glass carrier 3, a negative pressure is generated in the cavity 34, and the glass film 1 is adsorbed on the glass carrier 3.

As an alternative or in addition, the attachment may also be assisted or effected by electromagnetic charging of the surfaces. This difference in charge causes mutual attraction of the surface of the glass carrier 3 and the glass film 1, and wherein the difference in charge is usually quickly eliminated after the contact occurs and the direct adhesion is formed.

In addition to applying the coating to the optical, electronic or optoelectronic component, further processing of the glass film may also include processing the glass itself. To this end, Figure 9 shows an application. After the glass film 1 is fixed on the glass carrier 3, a plurality of grooves are provided in the glass film. Specifically, as shown in Fig. 9, these grooves may be channels 17, which connect the surfaces 10, 11 of the glass film 1. That is, without being limited to this embodiment, according to a further development of the invention, the further processing comprises the insertion of a groove, which is preferably a channel connecting the surfaces 10, 11. For example, a glass film 1 containing such a channel 17 or a glass film member including a channel which can be separated from the glass film 1 can be used as a so-called "insertion layer". The interposer layer serves as an insulating interlayer for a wiring surface located on an electronic circuit or member, particularly an integrated circuit. The passage 17 is for achieving perforation through the insulating intermediate layer by placing a conductive material.

If, as described above, a groove for forming a cavity and establishing a pressure difference with respect to the environment in the cavity is provided in the glass carrier 3, as shown, the channel 17 is preferably not inserted above the groove 33, This will cause the cavity 34 to open. But according to another In a specific example, in the case where the glass film 1 is peeled off by pressure increase without using the groove 33 or the cavity 34 formed by the groove, the channels may be inserted above the groove 33. To illustrate this specific example, the channel 17 (shown on the rightmost channel) shown in FIG. 9 is in communication with the recess 33. The cavity 34 formed through the recess 33 in communication with the passage 17 is preferably used herein to accommodate the material accumulated during the processing of the glass and, as the case may be, to draw it. In addition, fluid can be fed or discharged for different processing steps or inspection steps. For example, it is thus possible to verify whether the channel 17 actually connects the surfaces 10, 11 through the inflow or outflow of fluid.

Figure 10 is a modification of such a composite 4 comprising a cavity 34 as shown in Figure 9. In the particular embodiment shown in Fig. 10, a channel 35 is provided which is embodied as a recess 33 and which passes through the glass carrier 3, which connects the two opposing surfaces 30, 32 and communicates with the environment through the opening 36. The opening 37 in the surface 30 is closed in the composite 4 through the surface 10 of the glass film. With this solution, the fluid can be fed from the side exposed, ie from the bottom surface of the composite 4, and/or the desired pressure difference can be set. The opening 36 on the bottom side surface 32 is not required to have the same size as the opening on the surface 30 constituting the contact surface with the glass film 1. In order to exert a greater force on the glass film 1 through the fluid, the opening 37 closed by the glass film may also be larger than the opposite opening 36 in the side surface 32.

In addition, even in the case where the glass carrier comprises a groove 33 extending to the edge as shown in FIGS. 7 and 8, a similar effect is produced in which a hydrostatic transmission is realized at a given pressure difference. Force. In this case, the surface to which the glass film 1 is applied with pressure is also larger than the opening formed on the edge 31 with respect to the attached glass film.

According to a specific example of the invention, the gaseous medium, in particular the empty Gas is used as a fluid.

In the specific examples described above, the glass film is adhered to the glass carrier 3. However, according to another embodiment of the present invention, the glass film 1 can be attached to the glass carrier 3 through a pressure difference, and is not mainly bonded or directly adhered. Therein, the film is pressed and held on the glass carrier 3 by achieving a relative environment in the cavity 34, in particular a lower pressure relative to the environment on the surface 11 of the glass carrier 3. In particular, this particular embodiment of the invention facilitates further processing in which the further processing steps are not carried out under vacuum. However, this specific example also applies to further processing steps carried out at very high temperatures. This embodiment and the other embodiments of the present invention in which the pressure of the fluid in the cavity 34 is greater than the ambient pressure to peel the glass film 1 are common in that the glass film 1 is self-incremented by increasing the pressure in the cavity 34. The glass carrier 3 is separated.

Accordingly, according to another aspect of the present invention, a method for further processing a thin glass is proposed which is independent of the manner in which the glass film 1 is adhered to the glass carrier 3, and is also independent of the linear thermal expansion coefficient of the glass, wherein - The glass film 1 is prepared to have a thickness of 400 μm or less, particularly preferably less than 145 μm, and a lateral dimension of at least 5 cm in a certain direction, and a glass film 1 is fixed on the glass carrier 3 having a thickness larger than that of the glass film 1, In the process of fixing the glass film 1 on the glass carrier 3, at least one cavity 34 is formed which is defined by the surface 10 of the glass film 1 facing the glass carrier 3, and - after at least one further processing step, the glass film 1 is Separation from the glass carrier 3 is by increasing the pressure in the cavity 34.

Therein, the cavity can also be continuously maintained under negative pressure during further processing. In particular, the pressing force generated by the negative pressure can be achieved here. The glass film 1 is fixed, or at least through such a pressing force, to assist in the fixing. To this end, in the specific example shown in Fig. 10, for example, the side 32 of the glass carrier 3 can be connected to a source of negative pressure. For example, the glass carrier 3 can be applied to a vacuum panel by the side 32. The glass film 1 is fixed to the glass carrier 3 by the negative pressure thus generated in the cavity 34. In summary, without being limited to the embodiments, in accordance with a specific embodiment of the present invention, a negative pressure is present in at least one of the cavities 34 of the composite 4, which adsorbs the glass film 1 on the glass carrier 3.

Conversely, however, during the process of performing the stripping and further processing of the glass film 1, an overpressure may also be generated transiently in at least one of the cavities 34. In particular, this solution can be combined with a solution for attaching the fixed glass film 1, and this solution is advantageous for further processing at high temperatures. At higher temperatures, direct adhesion is enhanced and, depending on the circumstances, many covalent and strong bonds may form between the surfaces. This will increase the difficulty of subsequent stripping operations. If the over-pressure is generated through the (equal) cavity 34, particularly at high temperatures (e.g., 200 ° C or above) during further processing, the adhesion can be offset. Thereby, a strong bond is formed between the surfaces, or at least to some extent.

Therefore, in a specific example comprising the attached glass film according to the method of the present invention, at least one cavity 34 is formed when the glass film 1 and the glass carrier 3 are attached, which is oriented by the glass film 1 toward the glass carrier 3. Surface 10 is defined, and wherein at least one further processing step is performed wherein the glass film 1 is heated to a temperature of at least 200 ° C, preferably at least 300 ° C, and wherein the cavity 34 is in this further processing step Under pressure.

According to one embodiment of the invention, thermal expansion of fluids, typically several orders of magnitude higher than solids, can be utilized to provide sufficient action for the stripping operation. force. The basic idea of this solution is that, to achieve separation, the fluid is first filled into the at least one cavity 34, the opening to the environment is closed, and the fluid is subsequently heated. In this case, thermal expansion of the fluid causes an overpressure in the cavity 34.

Correspondingly, according to this embodiment of the invention, the composite body 4 also has at least one fluid-filled closed cavity 34 which is bounded by the surface 10 of the glass film 1 facing the glass carrier 3.

Among them, extremely high pressure can be generated by using a liquid as a fluid. The thermal expansion of a liquid is typically several orders of magnitude higher than that of glass, and the liquid has less compressibility at the same time.

FIG. 11 shows such a specific example of the composite 4. In order to prepare the peeling of the glass film 1, the channel 35 is filled with the liquid 14. Another glass carrier 7 is provided on the bottom side surface 32 of the glass carrier 3 and is connected to the glass carrier 3. As a result, the opening 36 of the glass carrier 3 facing away from the surface 32 of the glass film 1 is closed.

When the composite 4 is heated, the degree of expansion of the liquid 14 is much higher than that of the glass carrier 3 and the glass film 1, so that a high pressure can be applied to the glass 1 until the glass film 1 is separated from the glass carrier 3.

As previously mentioned, the opening 37 of the passage 35 leading to the surface 30 of the glass carrier 3 which constitutes the contact surface is larger than the opening 36 in the opposite surface 32. In the specific example shown in Fig. 11, the passage 35 extends in a tapered shape toward the surface 30 constituting the contact surface of the glass carrier 3. Of course, other geometries, such as cup-shaped extensions on surface 30, may also be employed.

Furthermore, the embodiment shown in Fig. 11 is also an example of a specific example of the method of the present invention, wherein at least in the portion of the further processing of the glass film, the cavity 34 is in communication with the environment, wherein the glass film 1 is self-contained Before the glass carrier 3 is peeled off, The cavity 34 containing the fluid is closed, and then the peeling of the glass film 1 is achieved or assisted by increasing the pressure of the fluid.

According to a further development of the invention, the glass film 1 can be separated into individual glass film elements from the surface 11, ie from the surface facing away from the glass carrier 3, before being stripped from the glass carrier 3. In particular, the glass film elements can be provided with optical, electrical or optoelectronic components by further processing. After the separation operation is carried out, the obtained composite contains glass film elements which are held on the glass carrier 3 but which have been laterally separated and which are provided with the members. Therefore, the composite 4 thus processed can also be regarded as a composite comprising a plurality of glass films held side by side. Figure 12 shows such an example. For example, the light-emitting diode 13 shown in Fig. 6 can also be used as a member. However, in the example shown in Fig. 12, an energy storage element 15 serving as a member is exemplarily provided, which is preferably a lithium-based energy storage element.

According to a specific example of the present invention, after the members are applied, the glass film 1 is divided by sawing. Thus, the separation of the surface 3 facing away from the glass carrier 3 is achieved here by inserting the sawing gap into the surface 11. Correspondingly, each of the glass film elements 100 is separated from each other by a plurality of gaps 18 which are preferably embodied as sawing gaps. The width of the gaps is usually from 30 μm to 200 μm. According to a specific example, the sawing gap 18 can also extend into the glass carrier 3 as shown in FIG. 12, but wherein the glass carrier 3 is not separated by the sawing gap 18. Each of the glass film elements 100 is adhered to the glass carrier 3 although it is laterally spaced. After this method step, the glass film 1, that is, the glass film element 100, can be separated using mechanical force. In particular, the glass film element 100 can be lifted individually or in groups. This scheme corresponds to the so-called "access method" used in semiconductor manufacturing. According to a further development, a pressure difference can be created between the fluid in the cavity 34 defined by the surface 10 of the glass membrane element 100 and the environment, i.e. by increasing the pressure in the cavity 34 defined by the glass membrane element 100. To achieve the stripping. To this end, in Figure 12 In the example, similar to the specific example shown in FIG. 10 or FIG. 11, the glass carrier 3 is provided with a plurality of channels 35. Peeling can be achieved by accommodating a preferably liquid fluid in the channels and heating the fluid as shown in the example of FIG. The opening 37 of the passage 35 or other recess 33 is preferably located under each of the glass film elements 100.

Further, in the case of the disposing method, a means for applying a pressure difference to the cavity 34 alone is preferably provided. In this way, the lifting operation of the specific glass film element 100 can be achieved or assisted by the pressure difference, while the remaining glass film elements 100 are still attached to the glass carrier.

The above scheme is also applicable to the following composite 4: it is provided with a glass carrier 3 and a silicon wafer 2 for replacing the glass film 1, and a germanium wafer element 101 corresponding to the glass film element 100 (Figs. 12 to 16).

If the liquid 14 is filled into the cavity 34 and the cavity 34 is closed as shown in Fig. 11, the cavities can be selectively heated. For this purpose, it is expedient to use a source of radiation whose radiation is absorbed by the liquid 14 in order to effect heating of the liquid.

In summary, the method described in connection with the example of FIG. 12 is based on the fact that after the further processing, preferably after the application of the optical, electrical or optoelectronic component, the glass film 1 is divided into a plurality of laterally spaced but also attached The glass film member 100 on the glass carrier, and wherein, after the separating operation, the glass film member 100 is peeled off and lifted from the glass carrier by mechanical force alone or in groups.

As described above, according to a preferred refinement of the present invention, the operation of applying a mechanical force to peel the glass film member 100 preferably includes: causing the pressure of the fluid in the cavity 34 closed by the glass film member 100 to be higher than Environmental pressure.

Figure 13 shows a specific example of the method outlined above. After further processing of the glass film 1, for example, as shown in the figure, optical, electrical or optoelectronic After the sub-components, the cavities that are in communication with the environment and contain fluid (here, liquid 14) are reclosed. As in the example shown in Fig. 11, the closure is achieved by fixing another glass carrier 7. However, the cavities can also be individually closed by filling a cavity 36, for example a curable medium of synthetic resin, and forming a blockage that closes the opening 36 after curing. In order to peel off each of the glass film elements 100, a laser beam having a wavelength absorbed by the fluid is directed to a cavity located under the glass film element 100, and the laser beam is absorbed on the cavity or in the cavity. .

For example, the laser light 20 of the laser 21 can be passed through the glass carrier 7. In this case, the glass of the glass carrier 7 is permeable to the laser radiation, and the fluid in the cavity 34 absorbs the laser radiation and heats up, thereby being closed by the cavity 100 as in the illustrated example. The glass film element 100 is separated by an overpressure caused by the temperature rise.

According to a specific example of the present invention, in order to peel off the glass film 1, or to peel off each of the glass film members 100 as in the example of Fig. 13, a liquid contained in the cavity 34 is also used, wherein the liquid is evaporated to produce Pressing, as an alternative or in addition to the following solution: volumetric expansion of the liquid in at least one of the cavities 34 by heating. A suitable liquid such as water, or in the case of a moisture sensitive layer on the glass film 1, an organic liquid such as ethanol or an organic solvent may also be used.

The invention is not only suitable for polymerizing laterally spaced glass membrane elements 100 in the composite, but is also particularly suitable for use with pre-slit glass membranes 1. In particular, the pre-scratching operation is particularly suitable for separating the glass film element 100 into the respective glass film elements 100 during the peeling process of the glass film 1.

In the specific example shown in Fig. 14, a plurality of linear scratches 102 are inserted into the outer surface 11 of the glass film 1 facing away from the glass carrier 3. Through the scratches 102 in each line The glass film 1 is broken to obtain a corresponding glass film element 100. In the specific example of the present invention shown in Fig. 14, the glass film 1 may be first fixed to the glass carrier 3 by attachment, and then the scratches 102 may be inserted. Here, the support provided by the rigid glass carrier 3 greatly reduces the risk of undesired breakage during the splaying operation of the glass film 1.

However, depending on the particular processing, the scratches 102 on the outer surface 11 may also cause interference in this further processing. In this case, the glass film 1 may be pre-cut before being attached to the glass carrier, and then the glass film 1 is applied to the glass carrier 3 by the pre-scratched surface, preferably by attachment. The glass film is attached to the glass carrier.

Figure 15 shows such a composite. Even in the specific example shown in FIG. 14, the scratch 102 may be provided before being fixed on the glass carrier 3.

The two methods are characterized in that a plurality of linear scratches 102 are pre-cut for the glass film 1 before being peeled off from the glass carrier 3, and wherein the glass film is removed during or after the peeling from the glass carrier 3 1 is divided into glass film elements 100 defined by the linear scratches 102. In the specific example shown in Fig. 15, the scratches 102 are provided before the glass film 1 is further processed. In summary, it is especially preferred to pre-cut the glass film 1 before it is further processed. This prevents the formation of glass particles in the scribing operation, which can cause contamination of the surface 10. Therefore, in the specific example shown in Fig. 14, the glass film 1 can be attached first, and then the scratches are set, and the surface 11 is cleaned before the further processing.

Whether the scratches are inserted on the surface 11 which is exposed, i.e., away from the glass carrier 3, or is inserted on the surface 10 facing the glass carrier 3, the linear thermal expansion coefficient of the glass carrier 3 and the glass film 1 is only slightly different, Even the same. This can also be included in the specific example of the pre-scratching operation, as shown in the embodiment of FIGS. 12 and 13 The specific example in which the glass film element 100 is separated is combined. Thus, the laterally spaced and large glass film element 100 can be further divided by the linear scratches 102.

In summary, according to a preferred embodiment of the present invention, the glass is laminated before the process of peeling the glass film 1 from the glass carrier 3 (for example, as shown in FIG. 13), during the process, or after the process. The film is divided into glass film elements 100. However, in this case, after the separating operation, the section of the glass film 1 forming the glass film element 100 is directly connected to the glass carrier 3. For example, if the glass film 1 is connected to the glass carrier only through its edge, the glass film 1 is lifted on the unjoined areas under a bending load which causes the contact surface to be concavely curved. In the composite body including the glass carrier 3 as in the embodiment shown in Figs. 12 and 13, in the case where the respective sections of the glass film element 100 are not connected to the glass carrier 3, the glass film elements may not be separated. In general, the glass film element 100 is also the section of the glass film to be further processed. In summary, the segment of the glass film 1 to be further processed is preferably joined to the glass carrier 3, whether it is divided into individual glass film elements or the glass film is used as a whole after peeling.

Figure 16 is a modification of the example shown in Figures 14 and 15. Similar to the specific example shown in Fig. 12, a plurality of cavities 34 defined by the glass film 1 are provided in the composite body 4 shown in Fig. 16. As in the example of Figures 14 and 15, a plurality of linear scratches 102 are provided here in place of the gap 18. The section between the scratches 102 defines a glass film element 100 that is subsequently realized by a singulation or separation operation. In order to prevent undesired unsealing due to scratches 102, or to prevent load on the scratches 102 in the presence of a pressure difference between the cavity 34 and the environment, as shown, in the case of the glass film 1 being viewed The cavity 34 is preferably disposed between the linear scratches 102. In other words, the linear scratches 102 preferably extend between the sections of the glass film 1, which close the cavity 34 on the surface 30 of the glass carrier 3 facing the glass film 1.

The above scheme is also applicable to the following composite 4: it is provided with a glass carrier 3 and a silicon wafer 2 for replacing the glass film 1, and a germanium wafer element 101 corresponding to the glass film element 100 (Figs. 12 to 16).

1‧‧‧glass film

2‧‧‧矽 wafer

3‧‧‧ glass carrier

4‧‧‧Complex consisting of 1,3

Surface of 10‧‧1, 2

Surface of 11‧‧1, 2

Surface of 30‧‧3

Claims (22)

a composite (4) comprising a glass carrier (3) and a glass film (1) or comprising a glass carrier (3) and a germanium wafer (2), wherein the glass film (1) or the germanium wafer (2) The thickness is less than or equal to 400 μm, particularly preferably less than 145 μm, wherein the thickness of the glass carrier (3) is greater than the glass film (1) or the germanium wafer (2), and the glass film (1) or the germanium wafer (2) The surface (10) is directly bonded to the surface (30) of the glass carrier (3), and wherein the glass carrier (3) and the glass film (2) are in a temperature interval of 20 ° C to 200 ° C, Or the difference between the linear expansion coefficient of the glass carrier (3) and the glass of the ruthenium wafer (2) is less than 0.3 × 10 ^-6 K ^-1 , preferably less than 0.2 × 10 ^-6 K ^-1 . The composite (4) according to the above claim, wherein the glass carrier (3) and the glass film (1) are composed of the same glass. The composite (4) of claim 1 or 2, wherein the average adhesion force is so small that the glass film (1) is peeled off from the glass carrier (3), or the germanium wafer (2) When peeling from the glass carrier (3), the required peel force is less than 1 Newton per centimeter of the length of the peeling line (8), wherein the peeling line (8) is the glass film (1) or the tantalum wafer (2) a linear region on which the glass film (1) or the tantalum wafer (2) is separated from the glass carrier (3), wherein the stripping line is The peel force is preferably at least 0.01 Newtons per length of 8). The composite (4) according to any one of the preceding claims, having at least one of the following features: the thickness of the glass carrier (3) is at least the thickness of the glass film (1) or the silicon wafer (2) Three times, in the case where the thickness d of the glass carrier (3) and the maximum side size or diameter S are measured in millimeters, the ratio d ³ /S ^2/3 is 2 × 10 ^-3 to 14 × 10 ^-3 , preferably 6 × 10 ^-3 to 12 × 10 ^-3, (4) the thickness of the composite is at least 400 m, (3) the size of the diameter or side of at least 150 mm glass support, glass support (3) and The glass of the glass film (1) or the tantalum wafer (2) has a Knoop hardness of 520 to 650. The composite (4) according to any one of the preceding claims, wherein at least one of the glass film (1) and the glass carrier (3) element is preferably composed of a glass film (1) and a glass carrier ( 3) Glass, which has one of the following components: or The composite (4) according to any one of the preceding claims, wherein at least one of the surface (10, 30) of the glass carrier (3) and the glass film (1) or the silicon wafer (2) is deposited particular Is a coating applied as the intermediate layer (6), which is preferably an inorganic coating, in particular a layer composed of tantalum nitride (SiN), a tantalum semiconductor layer, a metallic chromium layer, an aluminum layer and/or boron nitride. (BN) a layer formed, and the thickness of the coating layer is preferably from 1 to 500 nm. The composite (4) according to any one of the preceding claims, wherein the surface (30) of the glass carrier (3) is structured such that a contact surface formed between the two surfaces (10, 30) is smaller than the glass The film (1) or the surface (10) of the germanium wafer (2) facing the glass carrier (3). The composite (4) of the above-mentioned claim, wherein the glass film (1) or the surface (10) of the silicon wafer (2) facing the glass carrier (3) defines at least one cavity (34), wherein The cavity is preferably in communication with the environment. The composite (4) according to any one of the preceding claims, wherein the glass film (1) or the tantalum wafer (2) is separated into a glass film that is held on the glass carrier (3) and laterally spaced apart Element (100) or germanium wafer element (101). The composite (4) according to any of the preceding claims, wherein the glass film (1) or the tantalum wafer (2) is pre-cut. The composite (4) according to any one of the preceding claims, wherein at least one of the glass film (1) and the glass carrier (3) component is reinforced, preferably chemically strengthened. The composite (4) according to any one of the preceding claims, wherein the glass film (1) or the tantalum wafer (2) and the glass of the glass carrier (3) have a Knoop hardness of 520 to 650. A method for further processing a thin glass, wherein a glass film (1) or a germanium wafer (2) having a thickness of 400 μm or less, particularly preferably less than 145 μm, and a lateral dimension of at least 5 cm in a certain direction, is prepared. And fixing the glass film (1) or the germanium wafer (2) on the glass carrier (3) having a thickness larger than the glass film (1) or the germanium wafer (2), in particular, by attaching the glass film (1) or the germanium wafer (2) is connected to the glass carrier (3), And obtaining the composite (4) according to any one of the preceding claims, and after at least one further processing step, mechanically applying the glass film (1) or the silicon wafer (2) from the glass carrier (3) ) Separation. The method of any of the preceding claims, wherein after the glass film (1) or the silicon wafer (2) is applied to the glass carrier (3), at least one further processing step is performed in a vacuum. The method of any of the preceding claims, wherein the further processing of the glass film (1) or the germanium wafer (2) comprises fabricating a layer system for a lithium-based energy storage element, or in the glass film ( 1) or on the surface (11) of the germanium wafer (2) opposite to the surface (10) attached to the glass carrier (3), a plurality of optoelectronic components are fabricated or applied, preferably inserted into the recesses, which preferably The channels (17) to which the surfaces (10, 11) are connected. The method of any of the preceding claims, wherein at least one further processing step is performed, wherein the glass film (1) or the tantalum wafer (2) is heated to at least 200 ° C while remaining adhered, Preferably, the temperature is at least 300 ° C, wherein it is preferred to heat the tantalum wafer (2) to a temperature above 400 ° C, preferably to a temperature above 500 ° C. The method of any of the preceding claims, wherein at least one cavity (34) is formed during attachment of the glass film (1) or the germanium wafer (2) and the glass carrier (3) Described by the glass film (1) or the surface (10) of the germanium wafer (2) facing the glass carrier (3), and wherein the glass film (1) or the germanium wafer (2) is self-glazed using mechanical force The operation of stripping the carrier (3) includes creating a pressure differential between the fluid located in the at least one cavity (34) and the environment such that the pressure of the fluid in the cavity (34) is greater than the ambient pressure. The method of claim 16, wherein the glass film (1) or the germanium wafer (2) During the attachment of the glass carrier (3), at least one cavity (34) is formed by the glass film (1) or the surface (10) of the silicon wafer (2) facing the glass carrier (3) Defining, and wherein, in the further processing step, the glass film (1) or the tantalum wafer (2) is heated to a temperature of at least 200 ° C, preferably at least 300 ° C, such that the cavity 34) Under overpressure. The method of any of the preceding claims, wherein at least one cavity (34) is formed during attachment of the glass film (1) or the germanium wafer (2) and the glass carrier (3) Described by the glass film (1) or the surface (10) of the silicon wafer (2) facing the glass carrier (3), and wherein the attachment is carried out through the fluid located in the cavity (34) A pressure difference is generated between the environments, and the glass film (1) or the tantalum wafer (2) is adsorbed on the glass carrier (3). The method of any one of the preceding claims, wherein after the further processing, each glass film element (100) or crucible is produced by separating the glass film (1) or the segment of the germanium wafer (2). Wafer component (101). The method of any of the preceding claims, wherein after the further processing, preferably after applying the optical, electrical or optoelectronic component, the glass film is removed from the surface (11) facing away from the glass carrier (3) ( 1) or the germanium wafer (2) is divided into glass film members (100) or individual wafer members (101) which are laterally spaced but attached to the glass carrier (3), and wherein the spacer After the operation, the glass film members (100) or the wafer members (101) are peeled off and lifted from the glass carrier (3) by mechanical force alone or in groups. The method of any one of the preceding claims, wherein a plurality of linear scratches (102) are pre-cut for the glass film (1) or the germanium wafer (2) prior to stripping from the glass carrier (3). And wherein, during or after the stripping of the glass carrier (3), the glass film (1) Or the germanium wafer (2) is separated into a glass film element (100) or a germanium wafer element (101) defined by the linear scratches (102).