TW201217910A - Radiation-sensitive composition, protective film, interlayer insulation film and method for forming the same - Google Patents

Abstract

An object of the present invention is to provide a radiation-sensitive composition which is suitable for forming protective film and interlayer insulation film satisfying general requirements (such as transparency, heat-resistant transparency, surface hardness and so on) while having high adherence to ITO transparent conducting film or metal (such as molybdenum) wiring and high cracking resistance even under intensive conditions of high temperature and high humidity. The present invention is a radiation-sensitive composition comprising [A] siloxane, [B] polymer having repeat unit represented by the following formula (1) (wherein R1 is a hydrogen atom or a C1 to 4 alkyl group; R2 to R6 independently represents a hydrogen atom, a hydroxyl group or a C1 to 4 alkyl group; B is a single bond, -COO-* or -CONH-*; m is an integer of 0 to 3. Provided that at least one of R2 to R6 is a hydroxyl group; each linking bond * in -COO-* or -CONH-* is bonded to the carbon of (CH2)m) and [C] radiation-sensitive acid generator or radiation-sensitive base generator.

Description

201217910 VI. TECHNOLOGICAL FIELD OF THE INVENTION The present invention relates to a radiation sensitive composition suitable as a material for forming a display element such as a liquid crystal display device (OLED), and an interlayer insulating film. And the protective film and interlayer insulation [Prior Art] The display element is treated by a solvent or a pickling process in its process. In addition, when such a display element is splashed, the surface of the element is locally exposed to a high temperature. These protective films can be provided on the surface of the element due to such immersion treatment by a solvent or the like and damage of a high-temperature processor. Such a protective film is required to have the following properties: the corresponding substrate or the lower layer is further high on the protective film; has transparency: transparency is maintained even under high temperature conditions; surface hardness is sufficient; and wear resistance is satisfied in formation The material of the protective film of various properties includes a negative type of a polymer having a glycidyl group (refer to Japanese Laid-Open Patent Publication No. Hei 5-78453). A radiation-sensitive composition for a film is advantageous from a positive type. Therefore, a protective film having a negative-type radiation-sensitive display element (LCD), a protective film, and an interlayer insulating film, and a method of forming a film are widely used. Or the alkali solution or the like is immersed to form the wiring electrode layer, and the adhesion of the layer forming the protective film is not discolored due to the deterioration of the display element or the resistance of the display element. Excellent and so on. As the material, for example, the radiation sensitive composition S is known as a composition which is more cost-effective. -4 - 201217910 In addition, as the radiation-sensitive linear component for forming a protective film, an acrylic resin is mainly used. On the other hand, attempts have been made to use a polyoxyalkylene-based material which is more resistant to transparency and transparency than an acrylic resin (refer to Japanese Laid-Open Patent Publication No. 2000-1648, Japanese Patent Application Laid-Open No. Hei. Alkane-based materials and IT〇 (indium tin oxide) have insufficient transparent conductive film properties. They are prone to cracks (cleavage) on the cured film, so they are suitable as a protective film. In addition, the protective film is in the display element (Mo). When the adhesion of metal wiring such as tungsten (W), titanium (Ti), giant (Ta), niobium (Nb), copper (Cu), or aluminum is insufficient, the wiring is used as a starting point to protect against cracking and peeling. Therefore, it has been strongly desired to develop a polyfluorene-based radiation-linear composition which is excellent in heat resistance and transparency, and which is excellent in adhesion to metal wiring such as transparent conductive molybdenum, even under severe conditions of high temperature and high humidity. On the other hand, the interlayer insulating film is generally designed for the inter-wiring insulation of the display element in the form of a pattern. The pattern of the contact hole for wiring must be formed between the layers of the display element. Membrane forming material In the case of a negative-type sensitizing composition which is advantageous in terms of cost (refer to Japanese Laid-Open Patent Publication No. 2000-162769), it is difficult to form a hole having a usable pore diameter in practical use. From the viewpoint of the superiority of the formation of the contact hole, the interlayer insulating film of the display element is formed, and a positive-type radiation-type composition is widely used (refer to Japanese Laid-Open Patent Publication No. Hei. ). The molybdenum (A1) film aerobic alkane is not dense, and the film or the intergranular film inter-radiation type contact is made for the purpose of solidity 201217910. When manufacturing such a display element, various feelings can be used depending on the purpose and the process. Radiation linear composition. Recently, from the viewpoint of cost reduction, attempts have been made to unify the type of the radiation-sensitive composition, and it is desirable to form a protective film having a desired property such as transparency, heat resistance (heat-resistant transparency), surface hardness, and the like by using a radiation-sensitive composition. And interlayer insulating film. Therefore, as a material for forming a protective film, it is required to develop a radiation-sensitive linear composition which has a negative-type radiation linearity which is generally used, and which satisfies the above-mentioned required properties, and which is required as a material for forming an interlayer insulating film. Contact hole forming ability. Specifically, it is strongly desired to develop a negative-type radiation-sensitive linear composition of polysiloxanes, which can easily form transparency, heat resistance (heat-resistant transparency), substrate with ITO, and metal wiring such as molybdenum. The protective film and the interlayer insulating film which are excellent in adhesion, crack resistance, surface hardness, and abrasion resistance exhibit a resolution capable of forming a contact hole which can be practically used. PRIOR ART DOCUMENT Patent Document Patent Document 1 Patent Document 2 Patent Document 3 Patent Document 4 Patent Document 5 曰本特开平 5 - 7 8 4 5 3号 曰本特开 2000-001648号 曰本特开2006-178436号SUMMARY OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to provide a polysiloxane. A negative-type radiation linear composition suitable for forming transparency, heat resistance (heat-resistant transparency), surface hardness and abrasion resistance, and transparent to ITO even under severe conditions of high temperature and high humidity a conductive film or a metal wiring such as molybdenum and a protective film and an interlayer insulating film having high crack resistance, and having sufficient resolution; and a protective film and an interlayer insulating film formed of the composition and the protective film and the interlayer are further provided. A method of forming an insulating film. Means for Solving the Problems The present invention has been made in order to solve the above problems, and is a radiation sensitive composition comprising [A] a siloxane polymer, [B] a polymer having a repeating unit represented by the following formula (1), And [C] a radiation-sensitive linear acid generator or a radiation-sensitive linear base generator.

(1) 201217910 In the formula (1), R1 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R2 to R6 are each independently a hydrogen atom 'hydroxy group or an alkyl group having 1 to 4 carbon atoms, and B is a single The key, -COO-* or -CONH-*, m is an integer from 0 to 3. Wherein at least one of R2 to R6 is a hydroxyl group, a linkage of each * in -COO-* or -CONH-*, and a carbon linkage of (CHJm. The radiation-sensitive composition has a negative-type radiation linearity, except for the above In addition to the components [A] and [C], the component [B] of the polymer having a repeating unit having a specific structure is contained, whereby the transparency, the heat resistance (heat-resistant transparency), the surface hardness, and the like can be satisfactorily formed. Protective film and interlayer insulation for display elements which are excellent in adhesion and crack resistance to ITO transparent conductive films and metal wirings such as molybdenum under the severe conditions of high temperature and high humidity. Further, the radiation-sensitive composition exhibits a high resolution capable of forming a contact hole. The protective film or interlayer insulating film obtained from the radiation-sensitive composition is excellent in various properties as described above, and thus is particularly suitable as a display. The [A] methoxyalkane polymer of the radiation sensitive composition is preferably a hydrolysis condensate of the hydrolyzable decane compound represented by the following formula (2) (R7) q - Si. —(OR8)^ (2) In the formula (2), 'R7 is a non-hydrolyzable organic group having 1 to 20 carbon atoms' R8 is a hospital base having 1 to 4 carbon atoms, and q is 〇~3 In the radiation-sensitive composition, 'the above-mentioned [B] component is used together with the hydrolysis-condensation product of the water-soluble mortar compound represented by the above formula (2) as the [A] siloxane compound] It is possible to further improve the adhesion and crack resistance of the formed protective film and the interlayer insulating film of -8 - 201217910 to the metal wiring such as ITO transparent conductive film and molybdenum, and at the same time, higher resolution can be obtained. Further, the [D] dehydrating agent is further contained. As described above, the storage stability of the radiation sensitive composition can be improved by further containing a dehydrating agent. The radiation sensitive composition preferably further contains [Ε] ethylene. As the unsaturated compound, as described above, the crack resistance of the radiation sensitive composition can be improved by further containing an ethylenically unsaturated compound. The [C] radiation sensitive acid generator of the radiation sensitive composition is preferably selected. From triphenyl sulfonate and At least one of the group consisting of hydrogen thiophene key salts. Further, the [C] sensitizing radiobase generator of the radiation sensitive composition is preferably selected from the group consisting of 2-nitrobenzylcyclohexyl carbazate and hydrazine. At least one of the group consisting of -aminomethionine hydroxy guanamine. As a radiation sensitive acid generator or a radiation sensitive alkali generator, by using these compounds, the resolution of the radiation sensitive composition can be further improved. A method for forming a protective film or an interlayer insulating film for a display element of the present invention, comprising: (1) a step of forming a coating film of the radiation-sensitive composition on a substrate, and (2) forming the film formed in the step (1) At least a part of the coating film irradiates the radiation, (3) a step of developing the coating film irradiated with the radiation in the step (2), and (4) a step of heating the coating film developed in the step (3). 201217910 In the method, by using the above-described radiation-sensitive composition exhibiting excellent resolution, a pattern is formed by exposure and development by radiation, whereby protection for a display element having a fine and delicate pattern can be easily formed. Film or interlayer insulating film. Further, the protective film and the interlayer insulating film thus formed have general properties required for these films, that is, transparency, heat resistance (heat-resistant transparency), surface hardness and abrasion resistance, and metal wiring such as ITO transparent conductive film or molybdenum. The adhesion and crack resistance are all well balanced and excellent. Advantageous Effects of Invention As described above, the radiation sensitive composition of the present invention can form a good balance of transparency, heat resistance transparency, and surface hardness by containing the above [A], [B], and [C] components. And the general requirements of the abrasion resistance, and the protective film and interlayer insulation which exhibit excellent adhesion and crack resistance to the ITO transparent conductive film and metal wiring such as molybdenum under severe conditions of high temperature and high humidity. membrane. The protective film or interlayer insulating film thus formed is particularly suitable for use as a display element. Further, the radiation-sensitive composition exhibits sufficient resolution to form a level of the contact hole. Further, the radiation-sensitive linear composition has a negative-type radiation linearity, and is also more advantageous in terms of cost than an existing composition having a positive-type radiation. [Embodiment] The radiation sensitive composition of the present invention comprises [A] a decane polymer, and [B] a polymer having a repeating unit represented by the above formula (1) '[C] susceptibility to radiation Acid 201217910 A generating agent or a radiation-sensitive alkali generating agent and other optional components ([D] dehydrating agent, [E] ethylenically unsaturated compound, etc.) contained as needed. [A] component: siloxane polymer The siloxane polymer of the component [A] is not particularly limited as long as it is a polymer having a siloxane coupling. The component [A] is irradiated with radiation by a radiation sensitive composition containing the component, and an acid (acid active species) or a base which is produced by a [C] sensitizing radioactive acid generator or a sensitizing linear base to be described later. (base-active species) as a catalyst, condensation (according to the case, condensation with a decane compound having a specific structure as the [E] component of an optional component), to form a cured product, a siloxane polymer as the component [A], A hydrolysis condensate of the hydrolyzable decane compound represented by the above formula (2) is preferred. The "hydrolyzable group" of the hydrolyzable decane compound described in the present application generally means that it can be carried out in the coexistence of no catalyst and excess water by using at room temperature (about 2 5 t:) to about 1 Torr. . In the temperature range of (the temperature is hydrolyzed to form a group of a stanol group, or a group of a cerium oxide condensate may be formed. In contrast, the "non-hydrolyzable group" refers to the hydrolysis condition. In the hydrolysis reaction of the hydrolyzable decane compound represented by the above formula (2), a part of the hydrolyzable group may be left unhydrolyzed in the hydrolysis reaction of the hydrolyzable decane compound represented by the above formula (2). The "hydrolyzed condensate of a hydrolyzable decane compound" refers to a hydrolysis condensate formed by reaction and condensation between a stanol group of a part of a hydrolyzed decane compound. -11 - 201217910 The number of carbon atoms represented by the above R7 is Examples of the non-hydrolyzable organic group of 1 to 20 include an unsubstituted group having 1 to 12 carbon atoms or an alkyl group substituted with one or more of a vinyl group, a (meth) acryl fluorenyl group or an epoxy group. An aryl group having 6 to 12 carbon atoms, an aralkyl group having 7 to 12 carbon atoms, etc. These may be linear, branched or cyclic, and when a plurality of R7 are present in the same molecule, A combination of these. In addition, R7 may contain a structural unit having a hetero atom. Examples of such a structural unit include an ether, an ester, a thioether, etc. As an example of the alkyl group having 1 to 4 carbon atoms represented by the above R8, Examples of the methyl group, ethyl group, n-propyl group, isopropyl group, and butyl group include a methyl group and an ethyl group. From the viewpoint of easiness of hydrolysis, a methyl group and an ethyl group are preferable. An integer of 〜3, more preferably an integer of 0 to 2, particularly preferably 〇 or 1, and preferably, when l°q is an integer of 〇~2, hydrolysis and condensation reactions are more easily carried out, and as a result, [A] component The rate of the condensation reaction with (F component [F]) becomes faster, and the resolution of the composition and the adhesion of the formed protective film to the substrate can be improved. The hydrolyzable decane compound represented by the above formula (2) Examples of the cerium compound substituted with four hydrolyzable groups, a decane compound substituted with one non-hydrolyzable group and three hydrolyzable groups, two non-hydrolyzable groups and two hydrolyzable groups a substituted decane compound, three non-hydrolyzable groups and one hydrolyzable a group-substituted decane compound or a mixture thereof. -12-201217910 Specific examples of the hydrolyzable decane compound represented by the above formula (2) are: as a decane substituted with four hydrolyzable groups, respectively The compound may, for example, be tetramethoxynonane, tetraethoxydecane, tetrabutoxydecane, tetraphenoxydecane, tetrabenzyloxydecane, tetra-n-propoxydecane, tetraisopropoxydecane or the like; Examples of the hydrazine compound substituted with one non-hydrolyzable group and three hydrolyzable groups include methyltrimethoxydecane, methyltriethoxylimid,methyltriisopropoxydecane, and A. Tris-butoxy decane, ethyl trimethoxy decane, ethyl triethoxy decane, ethyl triisopropoxy decane, ethyl tributoxy decane, butyl trimethoxy decane, phenyl trimethoxy Basil, phenyltriethoxydecane, vinyltrimethoxydecane, vinyltriethoxydecane, vinyltri-n-propoxydecane, 3-methylpropenyloxypropyltrimethoxydecane 3-methoxypropenyloxypropyltriethoxyhydrazine , 3-propenyloxypropyltrimethoxydecane, 3-propyleneoxypropyltriethoxydecane, γ-glycidoxypropyltrimethoxydecane, 丫-glycidoxypropyl three Ethoxy decane, β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, etc.; as a brothel compound substituted by two non-hydrolyzable groups and two hydrolyzable groups, two Methyldimethoxydecane, diphenyldimethoxydecane, dibutyldimethoxydecane, etc.; as a brothel compound substituted by three non-hydrolyzable groups and one hydrolyzable group' Tributyl methoxy decane, trimethyl methoxy sane, trimethyl ethoxy decane, tributyl ethoxy decane, and the like are exemplified. In the hydrolyzable decane compound represented by the above formula (2), a decane compound substituted with four hydrolyzable groups is preferably substituted with a non-hydrolyzable group and three hydrolyzable groups. A decane compound is particularly preferably a decane compound substituted with one non-hydrolyzable group and three hydrolyzable groups. Specific examples of the preferred hydrolyzable decane compound include tetraethoxy sane, methyl trimethoxy decane, methyl triethoxy decane, methyl triisopropoxy decane, and methyl tributyl. Oxydecane, phenyltrimethoxydecane, ethyldimethoxy sand, ethyl triethoxy sand, ethyl triisopropoxy sand, ethyl tributoxydecane, butyl trimethyl Oxydecane, γ-glycidoxypropyltrimethoxydecane, 3-methylpropenyloxypropyltrimethoxydecane, 3-methylpropenyloxypropyltriethoxydecane. These hydrolyzable decane compounds may be used singly or in combination of two or more. The conditions for hydrolyzing and condensing the hydrolyzable decane compound represented by the above formula (2) are such that at least a part of the hydrolyzable sand compound represented by the above formula (2) is hydrolyzed, and the hydrolyzable group is converted into a stanol group. The condensation reaction is not particularly limited, and is carried out as follows by way of an example. The water used for the hydrolysis and condensation of the hydrolyzable decane compound represented by the above formula (2) is preferably water purified by a method such as reverse osmosis membrane treatment, ion exchange treatment or distillation, and can be suppressed by using such purified water. Side reaction to increase the reactivity of hydrolysis. The amount of water used is preferably 〇.1 to 3 mol', more preferably 〇.3 to 2 mol, based on the hydrolyzable group (_〇r8) of the hydrolyzable decane compound represented by the above formula (2). Further better for 〇.5~1.5mol of the amount of -14-201217910. The reaction rate of hydrolysis and condensation can be optimized by using this amount of water. The solvent used in the hydrolysis and condensation of the hydrolyzable decane compound represented by the above formula (2) is not particularly limited, and a solvent similar to the solvent used in the preparation of the radiation sensitive composition described later can be usually used. Preferable examples of such a solvent include ethylene glycol monoalkyl ether acetate, diethylene glycol dialkyl ether, propylene glycol monoalkyl ether, propylene glycol monoalkyl ether acetate, and propionic acid. Esters. Among these solvents, particularly preferred are diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monomethyl ether acetate or 3-methyl Methyl oxypropionate. The conditions for the hydrolysis and condensation reaction of the hydrolyzable decane compound represented by the above formula (2) are preferably acid catalysts (for example, hydrochloric acid, sulfuric acid, nitric acid, formic acid, oxalic acid, acetic acid, trifluoroacetic acid, trifluoromethanesulfonic acid, Phosphoric acid, acidic ion exchange resin, various Lewis acids, alkali catalysts (for example, nitrogen, amines, secondary amines, tertiary amines, pyridine and other nitrogen-containing compounds; basic ion exchange resins; The reaction is carried out in the presence of a catalyst such as a carbonate such as potassium carbonate; a carboxylate such as sodium acetate; a variety of Lewis bases; or an alkoxide (for example, an alkoxylated pin, a titanium alkoxide or an alkane oxide). For example, triethylamine can be used as the tertiary amine, and aluminum tetraisopropoxide can be used as the alkane alumina. The amount of the catalyst used is preferably from 〇.2m〇1, more preferably from 0.00001 to 〇.lmc)1, from the viewpoint of promoting hydrolysis and condensation reaction with respect to 1 mol of the monomer of the hydrolyzable decane compound. 201217910 The reaction temperature and reaction time in the hydrolysis and condensation of the hydrolyzable decane compound represented by the above formula (2) can be appropriately set. For example, the following conditions can be employed. The reaction temperature is preferably from 40 to 200 ° C, more preferably from 50 to 15 CTC. The reaction time is preferably from 30 minutes to 24 hours, more preferably from 1 to 12 hours. By selecting this reaction temperature and reaction time, the hydrolysis and condensation reactions can be carried out most efficiently. In the hydrolysis and condensation, a hydrolyzable decane compound, water, and a catalyst may be added in one portion of the reaction system to carry out a single-step reaction; or a hydrolyzable decane compound, water, and a catalyst may be added to the reaction system in several portions. Multi-step hydrolysis and condensation reactions. Further, after the hydrolysis and condensation reaction, a dehydrating agent is added, followed by evaporation to remove water and the resulting alcohol from the reaction system. The dehydrating agent used in this stage is generally dehydrated by adsorption or inclusion of excess water, and the dehydration can be completely eliminated or removed by evaporation, so that the dehydrating agent of the [D] component described later added to the radiation sensitive composition is not included. Within the scope of the. The molecular weight of the hydrolysis-condensation product of the hydrolyzable decane compound represented by the above formula (2) can be determined by GPC (gel permeation chromatography) using tetrahydrofuran in the mobile phase, and the number average molecular weight in terms of polystyrene is determined. . Further, the number average molecular weight of the hydrolysis condensate is usually preferably in the range of from 50,000 to 1,000, more preferably in the range of from 1,000 to 5,000. By setting the enthalpy of the number average molecular weight of the hydrolysis condensate to 500 or more, the film formation property of the coating film of the radiation-sensitive composition can be improved. On the other hand, the 値 of the number average molecular weight of the stomach from the # condensate is 10000 or less, and the sensitization of the radiation composition can be reduced linearly. -16-201217910 [B] component: a polymer [B] component having a repeating unit having a specific structure is a polymer having a repeating unit represented by the above formula (1), and the radiation-sensitive linear composition is used by using The polymer of the repeating unit of a specific structure can form a generally well-balanced property such as transparency, heat resistance (heat-resistant transparency), surface hardness, and abrasion resistance, while being in a severe condition of high temperature and high humidity. In the ITO transparent conductive film and metal wiring such as molybdenum, a protective film for a display element and an interlayer insulating film which exhibit high adhesion and crack resistance are also exhibited. As the polymer having the repeating unit represented by the above formula (1), it is preferred to use a phenolic hydroxyl group-containing unsaturated compound represented by the following formula (3) and another unsaturated compound copolymerizable therewith. Copolymer. As the other unsaturated compound which can be copolymerized with the phenolic hydroxyl group-containing unsaturated compound represented by the formula (3), it is preferred to use an epoxy group-containing unsaturated compound (including an oxypropylene group-containing unsaturated compound). H2g=c

(CH2)m

R4 In the formula (3), R1 is a hydrogen atom or a group having a carbon number of 4; R2 to R6 are each independently a hydrogen atom, a hydroxyl group or an alkyl group having 1 to 4 carbon atoms, and B is a single bond. -COO-* or - CONH- m is an integer from 0 to 3. 201217910 wherein, at least one of R2 to R6 is a hydroxyl group, a linkage of each of -COO-* or _C0NH_*, and a carbon linkage of (CH; !)^. The polymer having the repeating unit represented by the above formula (1) can be used in a solvent, in a polymerization initiator (for example, 2,2'-azobis(2,4-dimethylvaleronitrile)), a chain a phenolic hydroxyl group-containing unsaturated compound represented by the above formula (3) and other copolymerizable copolymers thereof in the presence of a transfer agent (for example, 2,4-diphenyl-4-methyl-1-pentene) The unsaturated compound and other monomers used as needed are produced by radical polymerization. The solvent used in the synthesis reaction is not particularly limited, and for example, diethylene glycol methyl ethyl ether can be used. The proportion of the phenolic hydroxyl group-containing unsaturated compound of the formula (3) is preferably from 5 to 60% by mass, particularly preferably from 5 to 50% by mass based on the total mass of the monomer mixture for forming the polymer. %. By using the phenolic hydroxyl group-containing unsaturated compound in such a ratio, it is possible to form a very high adhesion to an ITO transparent conductive film and a metal wiring such as molybdenum even under severe conditions of high temperature and high humidity. A protective film and an interlayer insulating film which are excellent in balance of various properties such as transparency and heat resistance (heat-resistant transparency), such as crack resistance. The phenolic hydroxyl group-containing unsaturated compound represented by the above formula (3), by definition of B and m in the formula, may be a compound represented by the following formulas (4) to (8). These phenolic hydroxyl group-containing unsaturated compounds represented by the formula (3) may be used singly or in combination of two or more. -18- (4) 201217910

In the formula (4), p is an integer of 1 to 3, and the definition of R1, R2, R3, and R is the same as defined in the above formula (3). R1, R5 and R1

〇X

NH

(5) The same meaning as in the above formula (3)

4, R5 and R1 -19- 1

In the formula (6), r is an integer of 1 to 3, and the definitions of R1, R2, R3 and R are the same as defined in the above formula (3). 201217910

The definition in ο) is the same

(8) In the formula (8), the definitions of R1, R2, R3, R4, R5, and R6 are the same as defined in the above formula (3). As the epoxy group-containing unsaturated compound copolymerized with the phenolic hydroxyl group-containing unsaturated compound represented by the formula (3), when the polymer having the repeating unit represented by the above formula (1) is formed, Examples of the propylene oxide-based unsaturated compound) include glycidyl acrylate, glycidyl methacrylate, α-ethyl acrylate glycidyl ester, and α-n-propyl acrylate glycidyl ester. Glycidyl α-n-butyl acrylate, 3,4-epoxybutyl acrylate, 3,4-epoxybutyl methacrylate, 6,7-epoxyheptyl acrylate, methyl 6,7-epoxyheptyl acrylate, α-ethyl acrylate-6,7-epoxyheptyl ester, o-vinylbenzyl glycidyl ether, m--20- 201217910 vinyl benzyl glycidyl ether , p-vinylbenzyl glycidyl ether, methyl propionate 3,4-epoxycyclohexyl vinegar, and the like. From the viewpoint of improving the copolymerization reactivity and the heat resistance (heat-resistant transparency) and surface hardness of the obtained protective film and interlayer insulating film, among these epoxy group-containing unsaturated compounds, glycidyl methacrylate is preferably used. Ester, 6,7-epoxyheptyl methacrylate, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, methacrylic acid 3, 4-epoxycyclohexyl ester and the like. Specific examples of the propylene oxide group-containing unsaturated compound include 3-(acryloxymethyl) propylene oxide, 3-(propylene methoxymethyl)-2-methyl propylene oxide, and 3 -(Propyloxymethyl)_3_ethylepoxypropyl, 3-(propionyloxymethyl)-2-trifluoromethylpropane, 3-(propyleneoxymethyl)- 2. Pentafluoroethyl propylene oxide, 3_(propylene methoxymethyl)_2_ based epoxy propylene, 3_(propylene methoxymethyl)-2,2-difluoro propylene oxide, 3- (Propylene methoxymethyl) 2,2,4-trifluoropropene oxide ' 3 —(propylene decyloxymethyl)-2,2,4,4-tetrafluoro propylene oxide, 3_(2_ Propylene oxiranyl ethyl) propylene oxide, 3-(2-propenyloxyethyl)_2-ethyl propylene oxide, (propylene oxyethyl) _3-ethyl propylene oxide, 3_( 2_Acryloxy group) 2 ~fluoromethyl propylene oxide, 3-(2-propenyloxyethyl)-2-pentafluoroepoxy propylene hydride, 3-(2-acryloxy ethoxylate Base)_2_phenyl propylene oxide 3 (2-propenyloxyethyl)_2,2-difluoropropylene oxide, 3_(2·acryloxy 7«;-β)_2,2,4 _Difluoropropylene oxide Acrylate such as 3-(2-propenyloxyethyl), 2,4,4-tetrafluoropropene oxide; 201217910 3-(methacryloxymethyl) propylene oxide, 3_(methyl Anodic oxymethyl)-2-methyl epoxide, 3-(methacryloxymethyl)_3_ethyl epoxide, 3-(methylpropionyloxymethyl) -2 -trifluoromethyl propylene oxide, 3-(methacryloxymethyl)-2 -pentafluoroethyl propylene oxide, 3-(methacryloxymethyl)-2 -Phenyl epoxide, 3-(methyl propyl methoxymethyl)-2,2-difluoroepoxypropanoid, 3-(methyl propyl decyloxymethyl)-2, 2,4-trifluoropropene oxide, 3-(methacryloxymethyl)-2,2,4,4-tetrafluoropropene oxide, 3-(2-methylpropenyloxyl) Ethyl epoxide, 3-(2-methylpropenyloxyethyl)-2-ethylepoxypropyl, 3-(2-methylpropenyloxyethyl)-3-ethyl Ethylene acrylate, 3-(2-methylpropionyloxyethyl)-2-difluoromethylepoxypropyl, 3-(2-methylpropionyloxyethyl)-2 - pentafluoroethyl propylene oxide, 3-(2-methylpropenyloxyethyl)-2- Propylene oxide, 3-(2-methylpropenyloxyethyl)_2,2-difluoroepoxypropane, 3-(2-methylpropenyloxyethyl)-2,2,4 a methacrylate such as trifluoropropylene oxide or 3-(2-methylpropenyloxyethyl)-2,2,4,4-tetrafluoropropylene oxide. These epoxy group-containing unsaturated compounds may be used singly or in combination of two or more. When the polymer having the repeating unit represented by the above formula (1) is formed, an example of another monomer copolymerized with the phenolic hydroxyl group-containing unsaturated compound represented by the formula (3) may be mentioned as an unsaturated residue. Acid, unsaturated phthalic anhydride, chain alkyl methacrylate, cyclic alkyl methacrylate, methyl propyl acrylate with hydroxyl group, cyclic aryl acrylate, aryl methacrylate, acrylic acid Aryl ester, unsaturated dicarboxylic acid diester, bicyclic unsaturation-22-201217910, maleimide compound, unsaturated aromatic compound, conjugated diene, unsaturated compound having tetrahydrofuran skeleton An unsaturated compound having a furan skeleton, an unsaturated compound having a tetrahydropyran skeleton, an unsaturated compound having a pyran skeleton, an unsaturated compound having a skeleton represented by the following formula (9), and other unsaturated Compound.

In the formula (9), R15 is a hydrogen atom or a methyl group, and η is an integer of 1 or more. Specific examples of such other monomers include, as the unsaturated carboxylic acid and the unsaturated carboxylic anhydride, monocarboxylic acids such as acrylic acid, methacrylic acid, and crotonic acid, maleic acid, fumaric acid, and citric acid. a dicarboxylic acid such as an acid, a mesaconic acid or a itaconic acid, and a dicarboxylic acid anhydride such as an acid anhydride of a compound exemplified herein as a dicarboxylic acid, a monosuccinic acid [2-(methyl)acryloyloxyethyl group Mono-[(meth)acryloyloxyalkyl]ester of polycarboxylic acid such as ester, phthalic acid mono [2:(methyl) propylene decyloxyethyl] ester, ω-carboxypoly Mono(meth)acrylate, 5-carboxybicyclo[2.2.1]hept-2-ene, 5,6-di, a polymer having a carboxyl group and a hydroxyl group at both terminals, such as a lactone mono(meth)acrylate Carboxybicyclo[2.2.1]hept-2-ene, 5-carboxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-5-ethylbicyclo[2.2.1] Hept-2-ene, 5-carboxy-6-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-ethylbicyclo[2.2.1]hept-2-ene, 5, a polycyclic compound having a carboxyl group such as 6-dicarboxybicyclo[2·2.1]hept-2-ene anhydride and an anhydride thereof; -23- 201217910 The acid chain alkyl ester may, for example, be methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, butyl methacrylate, butyl methacrylate or methacrylic acid 2- Ethylhexyl ester, isodecyl methacrylate, n-undecyl methacrylate, tridecyl methacrylate, n-octadecyl methacrylate, etc.; as methacrylic acid cyclic alkane The base ester may, for example, be cyclohexyl methacrylate, 2-methylcyclohexyl methacrylate, tricyclo[5.2.1.02,6]non-8-yl methacrylate or tricyclomethacrylate [5.2]. .1.02'6] 癸-8-yloxyethyl ester, isophorone methacrylate, etc.; as a methacrylate having a hydroxyl group, hydroxymethyl methacrylate, methacrylic acid 2 -hydroxyethyl ester, 3-hydroxypropyl methacrylate, 4-hydroxybutyl methacrylate, diethylene glycol monomethacrylate, 2,3-dihydroxypropyl methacrylate, 2 -methacryloxyethyl glucoside, 4-hydroxyphenyl methacrylate, etc.; as a cyclic alkyl acrylate Examples of the esters include cyclohexyl acrylate, 2-methylcyclohexyl acrylate, tricyclo[5.2.1.02'6]non-8-yl acrylate, and trimethyl methacrylate [5.2.1.〇2'6癸-8-yloxyethyl ester, isophorone acrylate, etc.; as aryl methacrylate, phenyl methacrylate, benzyl methacrylate, etc.; as aryl acrylate Examples thereof include phenyl acrylate and benzyl acrylate; and examples of the unsaturated dicarboxylic acid diester include diethyl maleate, diethyl fumarate, and diethyl itaconate; The bicyclic unsaturated compound may, for example, be a bicyclo[2.2.1]hept-2-ene, a 5-methylbicyclo[2.2.1]hept-2-ene or a 5-ethylbicyclo[2_2.1] Hept-2-ene, 5-methoxybicyclo-24- 201217910 [2.2.1] Hept-2-ene, 5-ethoxybicyclo[2.2.1]hept-2-ene, 5,6- Dimethoxybicyclo[2.2.1]hept-2-ene, 5,6-diethoxybicyclo[2.2.1]hept-2-ene, 5-tertiarybutoxycarbonylbicyclo[2.2 .1]hept-2-ene, 5-cyclohexyloxycarbonylbicyclo[2.2.1]hept-2-ene, 5-phenoxycarbonylbicyclo[2.2.1]hept-2-ene, 5, 6-two (three levels Oxycarbonyl)bicyclo[2.2.1]hept-2-ene, 5,6-di(cyclohexyloxycarbonyl)bicyclo[2.2.1]hept-2-ene, 5-(2'-hydroxyethyl Bi)[2.2.1]hept-2-ene, 5,6-dihydroxybicyclo[2.2.1]hept-2-ene, 5,6-di(hydroxymethyl)bicyclo[2.2.1 Hept-2-ene, 5,6-di(2, hydroxyethyl)bicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-methylbicyclo[2.2.1]hept-2 - alkene, 5-hydroxyl-5-ethylbicyclo[2.2.1]hept-2-ene, 5-hydroxymethyl-5-methylbicyclo[2.2.1]hept-2-ene; Examples of the quinone imine compound include N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, N-(4-hydroxyphenyl)male. Yttrium, N-(4-hydroxybenzyl)maleimide, N-succinimide-3-maleimide benzoate, N-succinimide-4-ma醯iminobutyrate, N-succinimide-6-maleimide caproate, N-succinimide-3-maleimide propionate, N-(9 - acridinyl) maleimide, etc.; as the unsaturated aromatic compound, styrene 'α-methylstyrene, o-methylstyrene, m-methylbenzene Ethylene, p-methylstyrene, p-methoxystyrene, etc.; as the conjugated diene, 1,3-butadiene, isoprene, 2,3-dimethyl-1,3- Butadiene or the like; examples of the unsaturated compound containing a tetrahydrofuran skeleton include tetrahydroindenyl (meth) acrylate, 2-methylpropenyloxy-tetrahydrofurfuryl propionate, and 3-(methyl group). Propylene decyloxytetrahydrofuran-2-one; etc.; as the unsaturated-containing-25-201217910 and the compound containing a furan skeleton, 2-methyl-5-(3-furyl)-1-pentene-3- can be exemplified Ketone, mercapto (meth) acrylate, 1-furan-2-but-3-en-2-one, 1-furan-2-butyl-3-methoxy-3-en-2-one, 6-(2-furyl)-2-methyl-1-hexen-3-one '6-furan-2-yl-hex-1-en-3-one, 2-furan-2-yl acrylate 1-methyl-ethyl ester, 6-(2-carboyl)-6-methyl-1-hepten-3-one, etc.; as an unsaturated compound containing a tetrahydropyran skeleton, it can be enumerated (tetrahydropyran-2-yl)methyl methacrylate, 2,6-dimethyl-8-(tetrahydropyran-2-yloxy)-oct-ene-3-one, 2- Tetrahydropyran-2-yl methacrylate , tetrahydropyran-2-oxy)-but-3-en-2-one, etc.; as an unsaturated compound containing a pyran skeleton, 4-(1,4-dioxa-5-oxygen is exemplified -6-Heptenyl)-6-methyl-2-pyran, 4-(1,5-dioxa-6-oxo-7-octenyl)-6-methyl-2-pyridyl Examples of the unsaturated compound having a skeleton represented by the above formula (9) include polyethylene glycol (η = 2 to 10) mono(meth)acrylate and polypropylene glycol (η = 2 to 10). Mono(meth)acrylate or the like; examples of the other non-radical compound include acrylonitrile, methacrylonitrile, vinyl chloride, vinylidene chloride, acrylamide, methacrylamide, and vinyl acetate. The amount of the [Β] component in the radiation-sensitive composition is preferably from 0.1 part by mass to 30 parts by mass, more preferably from 5% by mass to 20 parts by mass per 100 parts by mass of the component. Share. By using the amount of the [Β] component in an amount of from 0.1 part by mass to 30 parts by mass, it is possible to form a characteristic which does not lower the general requirements such as transparency and heat resistance (heat-resistant transparency), and has a metal wiring such as a transparent conductive film or molybdenum. A protective film and an interlayer insulating film having high adhesion and crack resistance. -26- 201217910 [c] Component: A radioactive acid generator or a radiation-sensitive linear generator which is a radioactive acid generator or a radiation-sensitive linear base generator [c] is defined as being capable of being released by irradiating radiation. Condensation and curing reaction of an aerobic acid polymer (preferably a hydrolyzable condensate of a hydrolyzable compound represented by the above formula (2)) to promote the component [A], or to promote the [A] component and the following The compound of the [F] component having a specific structure of a condensation of a decane compound, and an action of a catalyst for a curing reaction, or a compound of a basic active material. In addition, as the radiation which is used to decompose the [C] component and generate an anion of an acidic active material or an anion of an alkaline active material, visible light rays, ultraviolet rays, infrared rays, X-rays, xenon rays, and β rays may be mentioned. r ray, etc. Among these radiations, a certain curing level can be achieved from a certain energy level, and since the illuminating device is relatively inexpensive and small, it is preferable to use ultraviolet rays. Further, it is also preferred to use a radical polymerization initiator to be described later together with a radiation-sensitive acid generator or a radiation-sensitive linear base generator of the component [c]. The neutral active material produced by the radical polymerization initiator, that is, the radical does not promote the condensation reaction of the hydrolyzable decane compound, but when the [A] component has a radical polymerizable functional group, the functional group can be promoted. Aggregation. As the radiation-sensitive acid generator of the component [C], preferred are diphenyl iodine salt, triphenylsulfonium salt and tetrahydrothiophene salt, and particularly preferably triphenylsulfonium salt and tetrahydrothiophene key salt. . Specific examples of the diphenyl iodine salt include diphenyl iodine tetrafluoroborate, diphenyl iodine hexafluorophosphate, diphenyl-27-201217910 iodine hexafluoroarsenate, and Phenyl iodide trifluoromethanesulfonate, diphenyliodonium trifluoroacetate, diphenyl iodine gun-p-toluenesulfonate, diphenyl iodide butyl tris(2,6-difluoro Phenyl)borate, 4-methoxyphenyl-phenyl iodide tetrafluoroborate, bis(4-tributylphenyl)iodonium tetrafluoroborate, di(4-triphenylene) Iodine hexafluoroarsenate, bis(4-tributylphenyl)iodotrifluoromethanesulfonate, bis(4-tributylphenyl)iodotrifluoroacetate, 4_ Tert-butylphenyl) iodine-p-toluenesulfonate, bis(4-tributylphenyl) iodine camphorsulfonate, and the like. Specific examples of the triphenylsulfonium salt include triphenylsulfonium trifluoromethanesulfonate, triphenyl camphorsulfonate, triphenylsulfonium tetrafluoroborate, and triphenylsulfonium trifluoroacetate. Ester, triphenylsulfonium-p-toluenesulfonate, triphenylphosphonium butyl tris(2,6-difluorophenyl)borate, and the like. Specific examples of the tetrahydrothiophene key salt include i, 4·n-butoxynaphthalen-1-yl)tetrahydrothiophene trifluoromethanesulfonate and 1-(4-n-butoxynaphthalene-1). -yl)tetrahydrothiophene hexafluoro-n-butyl sulfonate, 1-(4-n-butoxynaphthalen-1-yl)tetrahydrothiophene gun-1,1,2,2-tetrafluoro- 2 -(norbornane-2-yl)ethanesulfonate ' 1-(4-n-butoxynaphthalen-1-yl)tetrahydrothiophene- 2-(5-tris-butoxycarbonyloxybicyclic [2.2.1]hept-2-yl)-1,1,2,2-tetrafluoroethanesulfonate, 1-(4-n-butoxynaphthalen-1-yl)tetrahydrothiophene-2- (6-tertiary butoxycarbonyloxybicyclo[2.2.1]hept-2-yl)-1,1,2,2-tetrafluoroethanesulfonate, 1-(4,7-dibutyl) Oxy-1-naphthyl)tetrahydrothiophene key trifluoromethanesulfonate and the like. Among these radiation-sensitive acid generators, from the viewpoint of improving the radiation sensitivity of the radiation-sensitive composition, triphenylsulfonium trifluoromethanesulfon-28-201217910 acid salt or triphenyl camphorsulfonic acid is particularly preferred. Salt, 1-(4,7-dibutoxy-1-naphthyl)tetrahydrothiophene trifluoromethanesulfonate" Examples of the radiation-sensitive alkali generating agent as the component [C] include 2- Nitrobenzylcyclohexylaminoformate, {[(2,6-dinitrobenzyl)oxy]carbonyl}cyclohexylamine, N-(2-nitrobenzyloxycarbonyl)pyrrolidine, Bis{[(2-nitrobenzyl)oxy]carbonyl}hex-1,6-diamine, triphenylmethanol, hydrazine-amine-methylhydrazine hydroxy decylamine, hydrazine-amine carbaryl hydrazine, 4- (Methylthiobenzimidyl)-1-methyl-1·sodium benzoate, (4-glyzoline benzhydryl)-1-benzyl-didimethylaminopropane, 2 -benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone, hexamine cobalt (III) tris(triphenylmethylborate), and the like. Among these radiation-sensitive alkali generating agents of the component [C], from the viewpoint of improving the radiation sensitivity of the radiation-sensitive composition, 2-nitrobenzylcyclohexylcarbamate and guanidine-amine A are particularly preferable. Mercaptohydroxyamine. The radiation-sensitive linear acid generator or the radiation-sensitive linear base generator of the component [C] may be used singly or in combination of two or more. The amount of the [C] component is preferably 0.1 part by mass to 20 parts by mass, more preferably 1 part by mass to 10 parts by mass, per 100 parts by mass of the [A] component. By using the amount of the component [c] in an amount of 0.1 part by mass to 20 parts by mass, the radiation sensitivity, the surface hardness of the protective film and the interlayer insulating film, the heat resistance (heat-resistant transparency), and the transparent conductive film for ITO can be obtained. A radiation-sensitive composition excellent in adhesion between metal wiring such as molybdenum and a good balance of crack resistance. -29 - 201217910 Other optional components The radiation sensitive composition of the present invention may contain [D] a dehydrating agent as needed, in addition to the above-mentioned [A] to [C] components, within a range that does not impair the desired effect. E] an ethylenically unsaturated compound, [F] a decane compound having a specific structure, a [G] acid diffusion inhibitor, a [H] radical polymerization initiator, and [I] a surfactant, and the like. The dehydrating agent of the component [D] is defined as a substance which converts water into a substance other than water by a chemical reaction, or a material which occludes water by physical adsorption or inclusion. By optionally containing the [D] dehydrating agent in the radiation-sensitive composition, moisture invading from the environment can be reduced. Therefore, by using the [D] dehydrating agent, the moisture in the composition can be lowered, thereby improving the storage stability of the composition. As such a [D] dehydrating agent, at least one compound selected from the group consisting of a carboxylate, an acetal (including a ketal), and a carboxylic anhydride is preferably used. Preferable examples of the carboxylic acid ester include an orthocarboxylic acid ester, a methoxyalkyl carbamate, and the like. Specific examples of the orthocarboxylic acid esters include methyl orthoformate, ethyl orthoformate, propyl orthoformate, butyl orthoformate, methyl orthoacetate, ethyl orthoacetate, propyl orthoacetate, and sodium orthoacetate. Ester, methyl orthopropionate, ethyl orthopropionate, and the like. Further, among these orthocarboxylic acid esters, an orthoformate such as orthoformate methyl vinegar is particularly preferred. Specific examples of the mercaptocarboxylic acid carbamate include trimethylmethionine acetate, tributylcarbamyl acetate, trimethylformamidinecarboxylate, trimethylformamidate oxalate, and the like. -30-201217910 Preferred examples of the acetal include reactants of aldehydes or ketones and alcohols, reactants of aldehydes or ketones and diols, and ketene alkyl acetals. Specific examples of the reactant of the aldehyde or the ketone and the alcohol include dimethyl acetal, diethyl acetal 'dipropyl acetal, and the like. Preferable examples of the carboxylic acid anhydride include formic anhydride, acetic anhydride, succinic anhydride, maleic anhydride, phthalic anhydride, benzoic anhydride, and benzoic anhydride. Among these carboxylic anhydrides, acetic anhydride and succinic anhydride are preferred in terms of dehydration effect. The amount of the [D] dehydrating agent is preferably 0.1 to 50 parts by mass, more preferably 0.5 to 30 parts by mass, even more preferably 1 to 10 parts by mass, per 100 parts by mass of the component [A]. By using the [D] dehydrating agent in an amount of 0.1 to 50 parts by mass, the storage stability of the radiation sensitive composition can be optimized. The component [E] is preferably a monofunctional, bifunctional or trifunctional or higher functional (meth) acrylate from the viewpoint of improving the polymerizability and improving the obtained cured film. Examples of the monofunctional (meth) acrylate include 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, diethylene glycol monoethyl acrylate, and diethylene glycol monoethyl. Ether methacrylate, (2-propenyloxyethyl)(2-propylpropyl) phthalate, (2-methylpropenyloxyethyl) (2-hydroxypropyl) Phthalic acid ester, ω-carboxy polycaprolactone monoacrylate, and the like. As a commercial product, for example, ARONIX Μ-1 0 1 , ARONIX M-lll, ARONIX M-114, ARONIX M-5300 (above, East Asia Synthetic Company); KAYARADTC-1 10S, KAYARADTC-120S (above, Japanese chemical) Company); VISCOAT158, VISCOAT23U (above, Osaka Organic Chemical Industry Co., Ltd.), etc. -3 1-201217910 Examples of the bifunctional (meth) acrylate include ethylene glycol diacrylate, propylene glycol diacrylate, propylene glycol dimethacrylate, ethylene glycol dimethacrylate, and diethylene glycol. Alcohol dipropanoate, diethylene glycol dimethacrylate, tetraethylene glycol diacrylate, tetraethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6_ Hexanediol dimethacrylate, 1,9-nonanediol diacrylate 'i, 9-nonanediol dimethacrylate, and the like. The product may, for example, be AR Ο NIX Μ - 2 1 0, AR Ο NI X M-240, ARONIX M-6200 (above, East Asia Synthetic Company); KAYARADHDDA, KAYARAD Η X-2 2 0, KAYARADR-6 04 (above) 'Nippon Chemical Co., Ltd.'; VISCOAT 260, VISCOAT 312, VISCOAT 3 3 5 HP (above 'Osaka Organic Chemical Industry Co., Ltd.); LIGHT-ACRYLATE1, 9-NDA (Kyoeisha Chemical Co., Ltd.), etc. Examples of the methyl acrylate include trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, neopentyl alcohol triacrylate, neopentyl alcohol trimethacrylate, and neopentyl. Tetraol tetraacrylate, neopentyl alcohol tetramethacrylate, dipentaerythritol pentaacrylate, dipentaerythritol pentamethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol a mixture of pentaacrylate and dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, ethylene oxide modified dipentaerythritol hexaacrylate, tris(2-propenyloxyl) Ethyl) phosphate, tris(2-methylpropenyloxyethyl) Phosphate ester, succinic acid modified neopentyl alcohol triacrylate, succinic acid modified dipentaerythritol pentaacrylate, tris(propylene oxyethyl) isocyanurate, and having a linear stretch Alkyl and -32-201217910 compounds having an alicyclic structure and having two or more isocyanate groups, and compounds having one or more hydroxyl groups in the molecule and three, four or five (meth) acryloyloxy groups A polyfunctional urethane acrylate compound obtained by the reaction or the like. As a commercial product, for example, ARON IX M-309' ARONIXM-315' ARONIX M-400> ARONIX M-405 'ARONIX M-450, ARONIX M-71 00, ARONIX M- 8 03 0, ARONIX M-8060, ARONIX TO- 1 450 (above, East Asia Synthetic Company); KAYARADTM PTA, KAYARADDPHA, K AYARADDPC A-2 0, KAYARADDPCA-3 0, KAYARADDPC A-6 0, KAYARADDPCA-120, K AYARADDPE A - 12 (above, capitalization) Pharmaceutical company); VISCOAT 295, VISCOAT 3 0 0 'VIS CO AT 3 6 0, VISCOAT GPT, VISCOAT 3PA, VISCOAT 400 (above, Osaka Organic Chemical Industry Co., Ltd.); as a polyfunctional urethane acrylate compound The products are listed as NEW FRONTIER R -1 1 5 0 (First Industrial Pharmaceutical Company), KAYARAD DPHA-4 0H (Nippon Chemical Co., Ltd.), and the like. Among these [E] components, 'preferably includes ω-carboxypolycaprolactone monoacrylate, 1,9-nonanediol dimethacrylate, trimethylolpropane diacrylate, and pentaerythritol triacrylate. a mixture of ester, neopentyl alcohol tetrapropionate, dipentaerythritol pentaacrylate, dinepentaerythritol hexaacetate vinegar, and dipentaerythritol hexaacrylate and pentaerythritol pentaacrylate , Epoxy modified dipentaerythritol hexaacrylate, succinic acid modified neopentyl alcohol triacrylate, succinic acid modified dipentaerythritol pentapropionate, polyfunctional amine - 33- 201217910 Products of urethane acrylate compounds, etc. Among them, a (meth) acrylate which is preferably 3 or more is particularly preferably a mixture of dipentaerythritol hexaacrylate and dipentaerythritol pentaacrylate. The [E] component may be used singly or in combination of two or more. The amount of the component [E] is 100 parts by mass or so, preferably 5 to 300 parts by mass, more preferably 10 to 200 parts by mass, and particularly preferably 2 to 100 parts by mass, based on the [A] component and the [B] component. . When the amount of the component [E] is within the above range, the sensitivity of the composition, the surface hardness of the obtained cured film, and the crack resistance are better. The component [F] is a decane compound represented by the following formula (10) or (12). The component [F] is an acid (acid active species) or a base (alkali) produced by irradiating the radiation-sensitive composition containing the component with radiation from the above-mentioned [C] sensitizing radioactive acid generator or sensitizing linear base. The active species) is condensed with a siloxane polymer of the [A] component (preferably a hydrolysis condensate of the hydrolyzable decane compound represented by the above formula (11)) to form a cured product. In the radiation-sensitive linear composition, the [F] component having the specific structure is contained in addition to the above-mentioned [B] component, and the formed protective film and interlayer insulating film can be further improved on the ITO transparent conductive film and Adhesion and crack resistance of metal wiring such as molybdenum. (R90) 3Si—R10—Si(ORl1)3 (1〇)

-34- 201217910

Si(OR12)3 *---^

(12) - Si(OR14)3b In the formula (10), R9 and R11 are each independently an alkyl group having 1 to 4 carbon atoms, and R1G is an alkyl group having 1 to 6 carbon atoms. A phenyl group or a group represented by the formula (11). In the formula (H), a is an integer of 1 to 4. In the formula (12), R12, R13 and R14 are each independently an alkyl group having 1 to 4 carbon atoms, and b is an integer of 1 to 6. Preferable specific examples of R9 and R11 of the formula (10) include a methyl group, an ethyl group, a propyl group and a butyl group. Among these alkyl groups, a methyl group or an ethyl group is more preferred. Preferable specific examples of R1 ^ of the formula (1 〇) include a methylene group, an exoethyl group, a propyl group, a trimethylene group, a tetramethylene group, a pentamethylene group, and a hexamethylene group. Stretch phenyl. Among these groups, a methylene group, an ethyl group, and a phenyl group are more preferred. Further, when R1() is a group represented by the formula (11), it is preferably 1 or 2 as a in the formula (11). By using the decane compound of the formula (1〇) having such a preferred structure as the [F] component, the reactivity with the component [A] can be improved. Preferred examples of R12, R13 and R14 in the formula (12) include a methyl group, an ethyl group, a propyl group and a butyl group from the viewpoint of reactivity with the component [A]. More preferably, these bases are methyl. Further, b in the formula (12) is preferably an integer from the viewpoint of reactivity with the component [A] and mutual solubility. -35- 201217910 In the radiation sensitive composition, the [F] component may be used singly or in combination of two or more. The decane compound of the formulae (10) and (12) is more preferably a decane compound having an isocyanurate ring represented by the formula (12). As described above, by using a decane compound having an isocyanurate ring in which three trialkoxycarbendany groups are bonded in one molecule, a radiation sensitive composition exhibiting high sensitivity can be obtained while The degree of crosslinking of the protective film and the interlayer insulating film formed of the composition can be improved. Further, by the radiation-sensitive composition containing the decane compound containing the isocyanurate ring, it is possible to form a close contact with the ITO transparent conductive film and the metal wiring such as molybdenum under severe conditions of high temperature and high humidity. A protective film and an interlayer insulating film which are more excellent in properties and crack resistance. Specific examples of the decane compound represented by the formulae (10) and (12) include bis(triethoxycarbenyl)ethane, bis(trimethoxyformanyl)methane, and di. (triethoxymethanealkyl)methane, di-1,2-(trimethoxycarbamidyl)ethane, di-1,2-(triethoxymethanealkyl)ethane, bis-1, 6-(trimethoxycarbamidyl) hexane, di-1,6-(triethoxycarbenyl) hexane, di-1,4-(trimethoxymethyl decyl) benzene, di-1 , 4-(triethoxycarbenyl)benzene, 1,4-bis(trimethoxyformamidomethyl)benzene, 1,4-bis(trimethoxyformamidoethyl)benzene, 1, 4-bis(triethoxycarbenylmethyl)benzene, 1,4-bis(triethoxymethylidenealkylethyl)benzene, tris-(3-trimethoxymethylidenemethyl)isocyanide Uric acid ester, tris-(3-triethoxymethylidene alkylmethyl)isocyanurate, tris-(3-trimethoxycarbamidylethyl)isocyanurate, tris-(3- Triethoxymethane alkyl ethyl) isocyanurate, tris-(3-trimethoxycarbane-36-201217910 propyl)isocyanurate, tris-(3-triethoxymethyl)矽alkylpropyl)isocyanurate and the like. Among these, from the viewpoint of improving the radiation sensitivity, the adhesion between the obtained protective film and the interlayer insulating film, the ITO transparent conductive film, and the metal wiring such as molybdenum, and the crack resistance, it is particularly preferable that it is 1,4-two (three Oxymethane alkylmethyl)benzene, bis(triethoxycarbenyl)ethane, tris-(3-trimethoxymethylideneethyl)isocyanurate, tris-(3-trimethoxy) Mercaptoalkylpropyl) isocyanurate, tris(3-triethoxycarbamidopropyl)isocyanurate. The amount of the decane compound having a specific structure of the component [F] is preferably 5 parts by mass to 70 parts by mass, more preferably 10 parts by mass to 50 parts by mass, per 100 parts by mass of the [A] component. By using the amount of the [F] component in an amount of from 5 parts by mass to 70 parts by mass, the radiation sensitivity and the balance between the obtained protective film and the interlayer insulating film for the adhesion and crack resistance of the ITO transparent conductive film and the metal wiring such as molybdenum can be obtained. A more sensitive radiation-sensitive composition The acid-diffusion controlling agent of the [G] component has a composition of an acidic active substance which is controlled by irradiation of radiation when a radiation-sensitive acid generator is used as the [C] component of the radiation-sensitive linear composition. The diffusion in the coating film suppresses the curing reaction in the non-exposed area. By using such an acid diffusion controlling agent together with a radiation-sensitive acid generator of the [C] component, the resolution of the radiation sensitive composition can be further improved (the contact hole containing the interlayer insulating film can be formed with high precision The sense of the desired pattern is linear). Examples of the acid diffusion controlling agent include monoalkylamines, dialkylamines, trialkylamines, aromatic amines, alkanolamines, aliphatic amines, and guanamine-containing compounds. Nitrogen-containing compounds such as urea compounds, imidazoles, pyridines, and other nitrogen-containing heterocyclic compounds. -37-201217910 Specific examples of these acid diffusion controlling agents include, respectively, mono-n-amines such as n-hexylamine, n-heptylamine, n-octylamine, n-decylamine, n-decylamine, and the like. The dialkylamines are di-n-butylamine, di-n-pentylamine, di-n-hexylamine, di-n-heptylamine, di-n-octylamine, di-n-decylamine, di-n-decylamine, and the like; The trialkylamines are triethylamine, tri-n-propylamine, tri-n-butylamine, tri-n-pentylamine, tri-n-hexylamine, tri-n-heptylamine, tri-n-octylamine, and tri-n-decane. Alkylamine, tri-n-decylamine, etc.; as aromatic amines are aniline, N-methylaniline, N,N-dimethylaniline, 2-methylaniline, 3-methylaniline, 4-methylaniline , 4-nitroaniline, diphenylamine, triphenylamine, 1-naphthylamine, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether, 4 , 4'-diaminobenzophenone, 4,4'-diaminodiphenylamine, 2,2'-bis(4-aminophenyl)propane, 2-(3-aminophenyl) )-2-(4-Aminophenyl)propane, 2-(4-aminophenyl)-2-(3-hydroxyphenyl)propane, 2-(4- Phenyl)-2-(4-hydroxyphenyl)propane, I,4-bis[1-(4-aminophenyl)-1-methylethyl]benzene, 1,3-di[1- (4-Aminophenyl)-1-methylethyl]benzene; etc.; as an alkanolamine, ethanolamine, diethanolamine, triethanolamine, etc.; as an aliphatic amine, ethylenediamine, hydrazine, hydrazine, hydrazine ,Ν'-tetramethylethylenediamine, 1,4-butanediamine, 1,6-hexanediamine, hydrazine, hydrazine, hydrazine, Ν'-tetrakis(2-hydroxyethyl)ethylenediamine, hydrazine ,Ν,Ν',Ν'-tetrakis(2-hydroxypropyl)ethylenediamine, polyethyleneimine, polyallylamine, dimethylaminoethylpropenylamine, etc.; -38- 201217910 The amine-containing compound is formamide, N-methylformamide, N,N-dimethylformamide, acetamide, N-methylacetamide, N,N-dimethylacetamide, Propylamine, benzamide, 2-pyrrolidone, N-methylpyrrolidone, etc.; as a urea compound, urea, methylurea, hydrazine, 1-dimethylurea, hydrazine, 3-dimethyl Urea, 1,1,3,3·tetramethylurea, 1,3-diphenylurea, tributylthiourea, etc.; as imidazoles are imidazole, benzimidazole, 2-methylimidazole, 4-A Imidazole, 2 - As a pyridine, pyridine, 2-methylpyridine, 4-methylpyridine '2-ethylpyridine, 4-ethylpyridine , 2-phenylpyridine, 4-phenylpyridine, N-methyl-4-phenylpyridine, nicotine, nicotinic acid, guanidinium nicotinate, porphyrin, 8-oxyquinoline, acridine, etc.; Other nitrogen-containing heterocyclic compounds are pyr trap, pyrazole, argon, quinazoline, porphyrin, 4-methyl morpholine, pipe trap, 1,4-dimethylpiped, 1,4-diaza Second ring [2. 2. 2] octane, 2,4,6-tris(2-pyridyl)-1,3,5-tritrap, and the like. Among these nitrogen-containing compounds, preferred are trialkylamines and pyridines. Preferred trialkylamines include triethylamine, tri-n-butylamine, tri-n-pentylamine, tri-n-hexylamine, tri-n-heptylamine, and tri-n-octylamine. Further, as a particularly preferable pyridine, 2,4,6-tris(2-pyridyl)-1,3,5-trin, pyridine '2-methylpyridine, 4-methylpyridine, 2 -ethylpyridine, 4-ethylpyridine, 2-phenylpyridine, 4-phenylpyridine, N-methyl-4-phenylpyridine, nicotine, nicotinic acid, niacinamide, quinoline, 8- Oxyhydrin, acridine. These acid diffusion controlling agents may be used singly or in combination of two or more. -39- 201217910 The amount when the [G] acid diffusion controlling agent is used is usually 15 parts by mass or less, preferably 0%, per 100 parts by mass of the [A] component. 001 to 15 parts by mass' is further preferably 0. 005 to 5 parts by mass. By using the [G] acid diffusion controlling agent in an amount of 0. 001 to 15 parts by mass, it is possible to form a protective film or an interlayer insulating film having a pattern with good precision while suppressing the radiation sensitivity of the radiation-sensitive composition to be low. In the radiation sensitive composition, a [H] radical polymerization initiator (radical generator) may be mixed, and a radioactive acid generator of the [C] component or a radiation sensitive alkali generator may be used together. The radical polymerization initiator is a compound having a function of receiving radiation and decomposing to generate a radical, and the radical initiates a polymerization reaction of a radical polymerizable functional group. For example, when the component [A] is a compound containing a (meth)acrylinyl group in the formula (2), the polymerization reaction between the components [A] can be promoted by using a [H] radical polymerization initiator. The degree of crosslinking of the film as a whole. As such a radical polymerization initiator, for example, acetophenone, acetophenone benzyl ketal, hydrazine, 1_(4-isopropylphenyl)_2-hydroxy-2-methylpropane-1 can be mentioned. -ketone, carbazole, keshan, 4_chlorobenzophenone, 4,4,-diaminobenzophenone 'H-dimethoxy deoxybenzoin, 3,3,_dimethyl -4-methoxybenzophenone, 9-oxathiazide, 2-methyl-(methylthio)phenyl]-2-zinomorpho-propan-2-one, 2_(4 _Methylbenzyl)_2-dimethylamino-1-(4-morpholinophenyl)-butan- ketone, 2-benzyl-2-dimethylamino-1-(4- Phenolinophenyl)-butan-one-ketone, triphenylamine, 2,4,6-trimethylbenzoic acid-based phosphine oxide, bis(2,6•dimethoxybenzylidene) )_2,4,4_三甲-40- 201217910 pentyl phosphine oxide, benzyl dimethyl ketal, i-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenyl propyl 1-ketone, anthrone, anthracene, benzaldehyde, benzoin ethyl ether, benzoin propyl ether, benzophenone, benzophenone derivative, methyl ketone, 3-methylacetophenone, 3, 3 ',4,4'-tetrakis (tertiary butylperoxycarbonyl) Benzophenone, ethyl ketone-l-[9-ethyl-6-(2-methylbenzhydryl)-9H-indazol-3-yl]-1-(0-ethylindenyl), etc. . These radical generating agents may be used singly or in combination of two or more. . The amount when the [H] radical polymerization initiator is used is preferably 0. by mass based on 100 parts by mass of the component [A]. 1 to 30 parts by mass, more preferably 1 to 20 parts by mass. The amount of the [H] radical polymerization initiator in the radiation-sensitive composition is 0. 1 to 30 parts by mass, a protective film and an interlayer insulating film having high surface hardness, high adhesion to a metal wiring such as molybdenum, and high heat resistance (heat-resistant transparency) and excellent balance can be formed. The surfactant of the component [I] can be added to improve the coating property of the radiation sensitive composition, to reduce coating unevenness, and to improve the developability of the radiation irradiation portion. Examples of preferred surfactants include nonionic surfactants, fluorine-containing surfactants, and organic terpene surfactants. Examples of the nonionic surfactant include polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, and polyoxyethylene oleyl ether; and polyoxyethylene octylphenyl; a polyoxyethylene aryl ether such as an ether or a polyoxyethylene nonylphenyl ether; a polyethylene glycol dialkyl ester such as polyethylene glycol dilaurate or polyethylene glycol distearate; Base) Acrylic copolymers and the like. Examples of the (meth)acrylic copolymers are represented by a commercially available product - 4 1- 201217910, and POLY FLOW No. 57, POLY FLOW No. 95 (manufactured by Kyoeisha Chemical Co., Ltd.) and the like. The fluorine-containing surfactant may, for example, be 1,1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl)ether or 1,12,2-tetrafluoro. Octyl hexyl ether, octaethylene glycol bis(1,1,2,2-tetrafluorobutyl)ether, hexaethylene glycol (1,1,2,2,3,3-hexafluoropentyl) Fluorine ethers such as ether, octapropylene glycol bis(1,1,2,2-tetrafluorobutyl)ether, hexapropylene glycol bis(1,1,2,2,3,3-hexafluoropentyl) ether ; sodium perfluorododecylsulfonate; 1,1,2,2,8,8,9,9,10,10-decafluorododecane, 1,1,2,2,3,3 a fluoroalkane such as hexafluorodecane; a sodium fluoroalkylbenzenesulfonate; a fluoroalkyl oxyethylene ether; a fluoroalkylammonium iodide; a fluoroalkyl polyoxyethylene ether; Perfluoroalkylpolyoxyethanols; perfluoroalkylalkanes; fluorine-containing alkyl esters. Examples of such a fluorine-containing surfactant include EFTOPEF 301, 303, and 352 (manufactured by New Akita Chemical Co., Ltd.), MEGEFAC F171, 172, and 173 (manufactured by Dainippon Ink Co., Ltd.), and FLUORAD FC430 and 431 ( Sumitomo 3Μ (manufacturing), AsahiGuard AG710, SURFLON S-382, SC-101, 102, 103, 104, 105, 106 (made by Asahi Glass Co., Ltd.), FTX-218 (manufactured by NEOS). Examples of the polyfluorene-based surfactants include commercially available product names, and examples thereof include SH200-100cs, SH28PA, SH30PA, ST89PA, SH190, and SH8400FLUID (manufactured by Toray Dow Corning Co., Ltd.), and organooxane polymerization. KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.) and the like. -42- 201217910 The amount ' when using the [I] surfactant is relative to 100 parts by mass of [A] component, preferably 0. 01~1〇 parts by mass, more preferably 0. 05 to 5 parts by mass. The coating property of the radiation sensitive linear composition can be optimized by using the amount of the [I] surfactant in an amount of from 0.01 to 10 parts by mass. Radiation-sensitive composition The radiation-sensitive composition of the present invention has a feeling of mixing the polymer of the [A] component of the above-mentioned [A] component, the polymer of the repeating unit having a specific structure of the [B] component, and the [C] component. A radioactive acid generator or a radiation sensitive alkali generator, and an optional component (a dehydrating agent of the [D] component, etc.) are prepared. Usually, the radiation-sensitive composition is preferably prepared and used in a state of being dissolved or dispersed in a suitable solvent. For example, a radiation sensitive composition is prepared by mixing [A], [B], and [C] components and optional components in a predetermined ratio in a solvent. . As the solvent which can be used in the preparation of the radiation sensitive composition, a solvent which uniformly dissolves or disperses each component and does not react with each component is suitably used. Examples of such a solvent include ethers, diethylene glycol alkyl ethers, ethylene glycol alkyl ether acetates, propylene glycol monoalkyl ethers, propylene glycol monoalkyl ether acetates, and propylene glycol monoalkanes. Alkyl ether propionates, aromatic hydrocarbons, ketones, vinegars, and the like. Examples of the solvent include, for example, tetrahydrofuran as the ether; .  Examples of the diethylene glycol alkyl ethers are diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, and diethylene glycol. Alcohol ethyl methyl ether and the like; -43- 201217910 As the ethylene glycol alkyl ether acetate, for example, methyl cellosolve acetate, ethyl cellosolve acetate, ethylene glycol monobutyl ether An acid ester, ethylene glycol monoethyl ether acetate or the like; as a propylene glycol monoalkyl ether, for example, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, etc.; The propylene glycol monoalkyl ether acetate is, for example, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, etc.; The alkyl ether propionates are, for example, propylene glycol monomethyl ether propionate, propylene glycol monoethyl ether propionate, propylene glycol monopropyl ether propionate, propylene glycol monobutyl ether propionate, etc.; The class is, for example, toluene, xylene, etc.; as a ketone is, for example, methyl ethyl ketone, methyl isobutyl ketone, or a ring Ketone, 2-heptanone, 4-hydroxy-4-methyl-2-pentanone, etc.; as esters are, for example, methyl acetate, ethyl acetate, propyl acetate, isopropyl acetate, butyl acetate, 2- Ethyl hydroxypropionate, methyl 2-hydroxy-2-methylpropionate, ethyl 2-hydroxy-2-methylpropionate, methyl hydroxyacetate, ethyl hydroxyacetate, butyl glycolate, methyl lactate Ethyl lactate, propyl lactate, butyl lactate, methyl 3-hydroxypropionate, ethyl 3-hydroxypropionate, propyl 3-hydroxypropionate, butyl 3-hydroxypropionate, 2-hydroxy-3 Methyl methyl butyrate, methyl methoxyacetate, ethyl methoxyacetate, propyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, Propyl ethoxyacetate, butyl ethoxyacetate, methyl propoxyacetate, ethyl 4-44-201217910 propoxyacetate, propyl propoxyacetate, butyl acetoacetate, butoxyacetic acid Methyl ester, ethyl butoxylate, propyl butoxyacetate, butyl butoxyacetate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, 2-methoxypropane Propyl acrylate, butyl 2-methoxypropionate, Methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, and the like. Among these solvents, from the viewpoints of excellent solubility or dispersibility, non-reactivity of each component, and easiness of forming a coating film, diethylene glycol alkyl ethers and ethylene glycol alkyl ethers are preferred. Acetate, propylene glycol monoalkyl ether, propylene glycol monoalkyl ether acetate, ketones and esters, particularly preferably diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, methyl Cellulolytic acetate, ethyl cellosolve acetate, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, cyclohexanone, Propyl acetate, isopropyl acetate, butyl acetate, 2-ethyl propyl acetonate, 2- thiol- 2. -methyl methacrylate, 2-hydroxy-2-methylpropionic acid ethyl acetate, methyl lactate, ethyl lactate, propyl lactate, lactic acid butyl vinegar, 2-methoxypropionic acid 7 methyl vinegar, 2 - Ethyl methoxypropionate. These solvents may be used singly or in combination. In addition to the above solvents, 'as needed, it may be combined with dry ethyl ether, dihexyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl acid, diethylene glycol monobutyl ether, acetone Acetone, isophorone, hexanoic acid, citric acid, b octanol, 1-nonanol 'benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate' diethyl maleate, γ-butane A high boiling point solvent such as an ester, ethylene carbonate, propylene carbonate, phenyl cellosolve acetate, or carbitol acetate is used together. -45- 201217910 When the radiation-sensitive composition is prepared in a solution or dispersion state, it is the total amount of components other than the solvent in the solution (that is, the total of [A], [B], and [C] components, and other optional components. The ratio can be arbitrarily set depending on the purpose of use and the desired film thickness, and is preferably 5 to 50% by mass, more preferably 1 to 40% by mass, still more preferably 15 to 35% by mass. Formation of Protective Film or Interlayer Insulating Film Next, a method of forming a cured film of a protective film or an interlayer insulating film on a substrate using the above-described radiation sensitive composition will be described. The method includes the following steps described in the following order. (1) a step of forming a coating film of the radiation sensitive composition of the present invention on a substrate, (2) a step of irradiating at least a part of the coating film formed in the step (1), and (3) a step ( 2) a step of developing a coating film irradiated with radiation, and (4) a step of heating the coating film developed in the step (3). (1) Step of Forming Coating Film of Radiation-Sensitive Composition on Substrate In the step (1), after applying a solution or dispersion of the radiation-sensitive composition of the present invention onto a substrate, it is preferably The solvent is removed by heating (prebaking) the coated surface to form a coating film. Examples of the substrate that can be used include glass, quartz, rhodium, and resin. Specific examples of the resin include open-loop polymers of polyethylene terephthalate, polybutylene terephthalate, polyether oxime, polycarbonate, polyimine, and cyclic olefin. Hydride, etc. -46-201217910 The coating method of the composition solution or the dispersion liquid is not particularly limited, and an appropriate method such as a spray method, a roll coating method, a spin coating method (spin coating method), a slit die coating method, or a bar coating method can be employed. . Among these coating methods, a spin coating method or a slit die coating method is particularly preferred. The pre-baking conditions are preferably about NJO minutes at 7 Torr to 12 Torr C depending on the type of each component, the mixing ratio, and the like. (2) Step of irradiating at least one portion of the coating film with radiation In at least the above step (2), at least a part of the formed coating film is exposed. In this case, when the film is partially exposed, it is usually exposed by a mask having a prescribed pattern. As the radiation to be used for exposure, for example, visible light, ultraviolet light, far ultraviolet light, electron beam, X-ray or the like can be used. Among these radiations, radiation having a wavelength in the range of 190 to 450 nm is preferable, and radiation having ultraviolet rays of 3 6 5 n m is particularly preferable. The amount of exposure in this step is by illuminance meter (OAI model 356, OAI Optical Associ at eslnc. Manufactured) The enthalpy of the intensity at 365 nm of the radiation is measured, preferably 100 to 10, OOO J/m 2 , more preferably 500 to 6,000 J/m 2 ° (3) Development step, in the step (3) above, The exposed coating film is developed to remove unnecessary portions (unirradiated portions of the radiation) to form a predetermined pattern. As the developing solution used in the developing step, an aqueous solution of a base (an inert compound) is preferred. Examples of the base include inorganic bases such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium citrate, sodium metasilicate, and ammonia, and quaternary ammonium salts such as tetramethylammonium hydroxide and tetraethylammonium hydroxide. Wait. -47- 201217910 Further, in such an alkaline aqueous solution, a water-soluble organic solvent such as methanol or ethanol or a surfactant may be added in an appropriate amount. The concentration of the alkali in the aqueous alkaline solution is preferably 0. from the viewpoint of obtaining appropriate developability.  i% by mass or more and 5% by mass or less. As the developing method, an appropriate method such as a liquid-filling method, a dipping method, a vibration dipping method, or a shower method can be used. The development time varies depending on the composition of the radiation sensitive composition, and is preferably about 10 to 180 seconds. After this development treatment, for example, after 30 to 90 seconds of running water washing, for example, by compressing the air. Air or compressed nitrogen is air dried to form the desired pattern. (4) Heating step In the step (4), a patterning film is heated by a heating means such as a hot plate or a supply box to promote the condensation reaction of the above [A] (and [E] component), and it is surely obtained. Cured product. The heating temperature is, for example, 1 2 0 to 2 50 °C. The heating time varies depending on the type of the heating device, for example, 5 to 3 minutes for the heating step on the hot plate and 30 to 90 minutes for the heating step in the oven. A stepwise baking method or the like which performs a heating step of 2 or more times can also be used. Thus, a pattern-like film corresponding to a desired protective film or interlayer insulating film can be formed on the surface of the substrate. Protective film or interlayer insulating film The film thickness of the protective film or interlayer insulating film thus formed is preferably a film. 1~8μιη, more preferably 0. 1~6μηι, further preferably 0. 1~4μπι. The protective film or the interlayer insulating film formed of the radiation sensitive composition of the present invention is excellent in various properties such as transparency, heat-resistant transparency, surface hardness, abrasion resistance, and crack resistance as shown in the following examples, and has a high solution. -48- 201217910 A highly accurate pattern formed by a radiation-sensitive composition of resolution. Further, the protective film or the interlayer insulating film is more excellent in adhesion and crack resistance to an ITO transparent conductive film and a metal wiring such as molybdenum even under severe conditions of high temperature and high humidity. Therefore, the protective film or interlayer insulating film is suitable for use as a display element. EXAMPLES Hereinafter, the present invention will be more specifically described by way of Synthesis Examples and Examples. However, the present invention is not limited by the following examples. The number average molecular weight (?n) and weight average molecular weight (Mw) of the hydrolyzed condensate of the hydrolyzable decane compound obtained in each of the following Synthesis Examples are as follows. Gel permeation chromatography (GPC) determination of the manner described. Device: GPC-101 (manufactured by Showa Denko Co., Ltd.) Column: A combination of GPC-KF-801, GPC-KF-802, GPC-KF-803, and GPC-KF-804 (manufactured by Showa Denko) : tetrahydrofuran .  Synthesis Example of Oxane Polymer [Synthesis Example 1] In a container with a stirrer, 25 parts by mass of propylene glycol monomethyl ether was added, followed by addition of 30 parts by mass of methyltrimethoxydecane and 23 parts by mass of phenyltrimethoxy Base decane and 0. 1 part by mass of aluminum tetraisopropoxide was heated to a solution temperature of 60 °C. The solution temperature reached 60. (: Thereafter, adding 18 parts by mass of ion-exchanged water' was heated to 75 ° C for 3 hours. Then, 28 parts by mass of methyl orthoformate was added as a dehydrating agent, and stirred for 1 hour. Then, the solution was -49- 201217910 The temperature is 40 ° C, and while maintaining the temperature, the water and the methanol produced by the hydrolysis condensation are removed. The hydrolysis condensate (A-1) is obtained as above. The solid concentration of the hydrolysis condensate (A-1) is 40. . 5 mass%, the number of the obtained hydrolysis condensate The average molecular weight (?n) was 1,500, and the molecular weight distribution (Mw/Mn) was 2. 2. [Synthesis Example 2] In a container with a stirrer, 25 parts by mass of propylene glycol monomethyl ether was added, followed by 22 parts by mass of methyltrimethoxydecane and 12 parts by mass of γ-glycidoxypropyltrimethoxydecane. 20 parts by mass of phenyltrimethoxydecane and 0. A hydrolysis condensate (Α-2) was obtained by the same method as in Synthesis Example 1 using 0.1 part by mass of triethylamine. The solid content of the hydrolysis condensate (Α-2) was 39. 8 mass%, the obtained hydrolysis condensate had a number average molecular weight (?η) of 1,300 and a molecular weight distribution (Mw/Mn) of 2. 2. [Synthesis Example 3] In a container with a stirrer, 25 parts by mass of propylene glycol monomethyl ether was added, followed by 22 parts by mass of methyltrimethoxydecane and 12 parts by mass of 3-methylpropenyloxypropyltrimethyl Oxydecane, 20 parts by mass of phenyltrimethoxydecane and 0. The hydrolysis-condensation product (A-3) was obtained in the same manner as in Synthesis Example 1 except for 5 parts by mass of oxalic acid. The solid content concentration of the hydrolysis condensate (A-3) was 39. 8 mass%, the obtained hydrolysis condensate had a number average molecular weight (?n) of 1,200 and a molecular weight distribution (Mw/Mn) of 2. 5. -50-201217910 Synthesis Example of Copolymer [Synthesis Example 4] In a flask equipped with a condenser and a stirrer, 8 parts by mass of 2,2,-azobis(2,4-dimethylvaleronitrile) was added. 6 parts by mass of 2,4-diphenyl-4-methyl-1-pentene and 220 parts by mass of diethylene glycol methyl ethyl ether. Next, 1 part by mass of glycidyl methacrylate, 20 parts by mass of styrene, and 25 parts by mass of trimethyl methacrylate were added. 2. 1. 〇2,6]癸-8-yl ester, 1 part by mass of 3-methylpropenyloxypropyltrimethoxydecane, and 40 parts by mass of p-isopropenylphenylhydrazine (compound represented by the above formula (8) After the nitrogen replacement, slow stirring was started. The temperature of the solution was raised to 70 ° C, and the temperature was maintained for 5 hours to obtain a polymer solution containing the copolymer (B-1). The solid solution concentration of the obtained polymer solution was 32. 6% by mass. The obtained polymer had a number average molecular weight of 3,300. In addition, the molecular weight distribution (Mw/Mn) is 1. 8. [Synthesis Example 5] In a flask equipped with a condenser and a stirrer, 8 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 6 parts by mass of 2,4-diphenyl were added. Base-4-methyl-p-pentene and 22 parts by mass of diethylene glycol methyl ethyl ether. Next, 10 parts by mass of glycidyl methacrylate, 20 parts by mass of styrene, and 25 parts by mass of trimethyl methacrylate were added. 2. 1. 02,6]癸-8-yl ester, 1 part by mass of 3-methylpropenyloxypropyltrimethoxydecane, and 40 parts by mass of p-vinylphenol (compound represented by the above formula (8)), A polymer solution containing the copolymer (B-2) was obtained by the same method as in Synthesis Example 4. The obtained polymer solution had a solid component concentration of 3 0 · 2% by mass. The obtained polymer had a number average molecular weight of 3,000. In addition, the molecular weight distribution (Mw/Mn) is 1. 9. 201217910 [Synthesis Example 6] In a flask equipped with a condenser and a stirrer, 8 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 6 parts by mass of 2,4-di were added. Phenyl-4-methyl-1-pentene and 220 parts by mass of diethylene glycol methyl ethyl ether. Next, 10 parts by mass of glycidyl methacrylate '20 parts by mass of styrene and 25 parts by mass of trimethyl methacrylate were added. 2. 1. 02'6] 癸-8-yl ester, 1 part by mass of 3-methacryloxypropyltrimethoxydecane, and 40 parts by mass of p-hydroxyphenyl methacrylate (compound represented by the above formula (7) The polymer solution containing the copolymer (B-3) was obtained by the same method as in Synthesis Example 4. The obtained polymer solution had a solid concentration of 32. 2% by mass. The resulting polymer had an average molecular weight of 3,400. In addition, the molecular weight distribution (Mw/Mn) is 1. 8. [Synthesis Example 7] In a flask equipped with a condenser and a stirrer, 8 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 6 parts by mass of 2,4-diphenyl were added. Base-4-methyl-1-pentene and 220 parts by mass of diethylene glycol methyl ethyl ether. Next, 10 parts by mass of glycidyl methacrylate, 20 parts by mass of styrene, and 25 parts by mass of trimethyl methacrylate were added. 2. 1. 〇2'6]癸-8-yl ester, 1 part by mass of 3-methylpropenyloxypropyltrimethoxydecane, and 40 parts by mass of p-hydroxymethylpropenylanilide (shown by the above formula (5) Compound) A polymer solution containing the copolymer (B-4) was obtained by the same method as in Synthesis Example 4. The obtained polymer solution had a solid concentration of 32. 7% by mass. The resulting polymer had an average molecular weight of 3,400. In addition, the molecular weight distribution (Mw/Mn) is 1. 8. -52-201217910 [Synthesis Example 8] In a flask equipped with a condenser and a stirrer, '8 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 6 parts by mass of 2 were added. 4-Diphenyl-4-methyl-p-pentene and 22 parts by mass of diethylene glycol methyl ethyl ether. Next, '1 gram by mass of glycidyl methacrylate, 20 parts by mass of styrene, and 25 parts by mass of trimethyl methacrylate were added. 2. 1. 02'6] anthracene-8-yl ester, 1 part by mass of 3-methylpropenyloxypropyltrimethoxydecane, and 40 parts by mass of 4-hydroxybenzyl methacrylate (expressed by the above formula (6) The compound (B-5) polymer solution was obtained by the same method as in Synthesis Example 4. The obtained polymer solution had a solid concentration of 30. 7% by mass. The amount of the obtained polymer had an average molecular weight of 3,200. In addition, the molecular weight distribution (Mw/Mn) is 1. 9. [Synthesis Example 9] In a flask equipped with a condenser and a stirrer, 8 parts by mass of 2,2,-azobis(2,4-dimethylvaleronitrile) and 6 parts by mass of 2,4-diphenyl were added. Base-4-methyl-l-pentene and 220 parts by mass of diethylene glycol methyl ethyl ether. Next, add the mass of the mass of methyl glycidyl glycidyl ester, 20 parts by mass of phenylethyl sulphate, and 25 temporary portions of methyl propyl sulphonate [5. 2. 1. 02'6] 癸-8-based vinegar, 1 part by mass of 3-methylpropyl decyloxypropyl dimethoxy sand and 40 parts by mass of n-(4-amino) methacrylamide (Compound of the above formula (4)) A polymer solution containing the copolymer (B-6) was obtained by the same method as in Synthesis Example 4. The obtained mixture solution had a solid concentration of 32. 0% by weight. The obtained polymer had a number average molecular weight of 3, 〇〇〇. Further, the molecular weight distribution (Mw/Mn) was -53 - 201217910 [Synthesis Example 10] In a flask equipped with a condenser and a stirrer, 8 parts by mass of 2,2'-azobis(2,4-dimethyl) was added. Pentylene nitrile), 6 parts by mass of 2,4-diphenyl-4-methyl-1-pentene, and 220 parts by mass of diethylene glycol methyl ethyl ether. Next, 10 parts by mass of glycidyl methacrylate, 20 parts by mass of styrene, 25 parts by mass of N-cyclohexylmaleimide, 1 part by mass of 3-methylpropenyloxypropyltrimethoxydecane, and 40 parts by mass of p-isopropenylphenol (compound represented by the above formula (8)) was obtained by the same method as in Synthesis Example 4 to obtain a polymer solution containing a copolymer (B-7). The obtained polymer solution has a solid concentration of 30. 9% by mass. The resulting polymer had a number average molecular weight of 2,900. In addition, the molecular weight distribution (Mw/Mn) is 1. 8. [Synthesis Example 11] In a flask equipped with a condenser and a stirrer, 8 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 6 parts by mass of 2,4-diphenyl were added. Base-4-methyl-l-pentene and 220 parts by mass of diethylene glycol methyl ethyl ether. Next, 10 parts by mass of glycidyl methacrylate, 20 parts by mass of styrene, 25 parts by mass of N-cyclohexylmaleimide, 1 part by mass of 3-methylpropenyloxypropyltrimethoxydecane, and 40 parts by mass of p-vinylphenol (compound represented by the above formula (8)) was obtained by the same method as in Synthesis Example 4 to obtain a polymer solution containing the copolymer (B-8). The obtained polymer solution has a solid concentration of 30. 8% by mass. The resulting polymer had a number average molecular weight of 2,800. In addition, the molecular weight distribution (Mw/Mn) is 1. 8. -54-201217910 [Synthesis Example 12] In a flask equipped with a condenser and a stirrer, 8 parts by mass of 2,2,-azobis(2,4-dimethylvaleronitrile) and 6 parts by mass of 2 were added. 4-Diphenyl-4-methyl-1-pentene and 220 parts by mass of diethylene glycol methyl ethyl ether. Next, a mass part of glycidyl methacrylate, 20 parts by mass of styrene, 25 parts by mass of N-cyclohexylmaleimide, 1 part by mass of 3-methacryloxypropyltrimethoxydecane, and 40 parts by weight are added. A mass ratio of p-hydroxyphenyl methacrylate (compound represented by the above formula (7)) was obtained by the same method as in Synthesis Example 4 to obtain a polymer solution containing a copolymer (B-9). The solid solution concentration of the obtained polymer solution was 32. 9% by mass. The number average molecular weight of the obtained polymer was 3. 200. In addition, the molecular weight distribution (Mw/Mn) is 1. 8. [Synthesis Example 13] In a flask equipped with a condenser and a stirrer, 8 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 6 parts by mass of 2,4-diphenyl were added. Base-4-methyl-l-pentene and 220 parts by mass of diethylene glycol methyl ethyl ether. Pick up. . And adding 10 parts by mass of glycidyl methacrylate, 20 parts by mass of styrene, 25 parts by mass of N-cyclohexylmaleimide, 1 part by mass of 3-methylpropenyloxypropyltrimethoxydecane, and 40 parts by mass of p-hydroxymethylpropenylanilide (the compound represented by the above formula (5)) was obtained by the same method as in Synthesis Example 4 to obtain a polymer solution containing the copolymer (B-10). The solid solution concentration of the obtained polymer solution was 3 2. 9% by mass. The number average molecular weight of the obtained polymer was 3. 200. In addition, the molecular weight distribution (Mw/Mn) is 1. 8. -55-201217910 [Synthesis Example 14] In a flask equipped with a condenser and a stirrer, 8 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 6 parts by mass of 2 were added. 4-diphenyl·4-methyl-1-pentene and 220 parts by mass of diethylene glycol methyl ethyl ether. Next, 10 parts by mass of glycidyl methacrylate, 20 parts by mass of styrene, 25 parts by mass of N-cyclohexylmaleimide, 1 part by mass of 3-methylpropenyloxypropyltrimethoxynonane, and 10 parts by mass and 40 parts by mass of 4-hydroxybenzyl methacrylate (compound represented by the above formula (6))' A polymer solution containing the copolymer (B-11) was obtained by the same method as in Synthesis Example 4. The obtained polymer solution had a solid concentration of 32. 9% by mass. The obtained polymer had a number average molecular weight of 3,100. In addition, the molecular weight distribution (Mw/Mn) is 2. 0. [Synthesis Example 15] In a flask equipped with a condenser and a stirrer, 8 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 6 parts by mass of 2,4-di were added. Phenyl-4-methyl-p-pentene and 22 parts by mass of diethylene glycol methyl ethyl ether. Next, 1 part by mass of glycidyl methacrylate, 20 parts by mass of styrene, 25 parts by mass of N-cyclohexylmaleimide, and 1 part by mass of 3-methylpropenyloxypropyltrimethoxydecane were added. And 4 parts by mass of N-(4-hydroxybenzyl)methacrylamide (the compound represented by the above formula (4)), the copolymer (B-12) was obtained by the same method as in Synthesis Example 4. Polymer solution. The obtained polymer solution had a solid concentration of 32. 0% by mass. The obtained polymer had a number average molecular weight of 3,300. In addition, the molecular weight distribution (Mw/Mn) is 1. 9. -56-201217910 [Synthesis Example 16] In a flask equipped with a condenser and a stirrer, 8 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 6 parts by mass of 2 were added. 4-diphenyl-4-methyl-l-pentene and 220 parts by mass of diethylene glycol methyl ethyl ether β, followed by adding 10 parts by mass of glycidyl methacrylate, 20 parts by mass of styrene, 25 mass Part by weight of n-lauryl methacrylate, 1 part by mass of 3-methylpropenyloxypropyltrimethoxydecane, and 40 parts by mass of p-isopropenylphenol (compound represented by the above formula (8)) In the same manner as in Synthesis Example 4, a polymer solution containing a copolymer (B-13) was obtained. The solid content concentration of the obtained polymer solution was 31. 0% by mass. The obtained polymer had a number average molecular weight of 3,000. Further, the molecular weight distribution (Mw/Mn) was 1. 9. [Synthesis Example 1 7] In a flask equipped with a condenser and a stirrer, 8 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 6 parts by mass of 2,4_2 were added. Phenyl-4 methyl-pentene and 220 parts by mass of diethylene glycol methyl ethyl ether. Next, a part by mass of glycidyl methacrylate, 20 parts by mass of styrene, 25 parts by mass of n-benzyl methacrylate, 1 part by mass of 3-methacryloxypropyltrimethoxydecane, and 4 parts are added. A mass ratio of the p-hydroxyphenyl methacrylate (the compound represented by the above formula (7)) was measured by the same method as in Synthesis Example 4 to obtain a polymer solution containing the copolymer (B-14). The obtained polymer solution had a solid concentration of 32. 0% by mass. The obtained polymer had a number average molecular weight of 3,300. Further, molecular weight distribution 1 > -57 - 201217910 [Synthesis Example 1 8] In a flask equipped with a condenser and a stirrer, '8 parts by mass of 2,2'-azobis(2,4-dimethylpentane) was added. Nitrile), 6 parts by mass of 2,4-diphenyl-4-methyl-1-pentene, and 220 parts by mass of diethylene glycol methyl ethyl ether. Next, 1 part by mass of 3,4-epoxycyclohexyl methacrylate, 20 parts by mass of styrene, and 25 parts by mass of tricyclo t5·2·1·02'6]癸-8-yl methacrylate were added. 1 part by mass of 3-methylpropenyloxypropyltrimethoxydecane and 40 parts by mass of p-hydroxymethylpropenylaniline (compound represented by the above formula (5)), the same as in Synthesis Example 4. In the method, a polymer solution containing a copolymer (B-15) was obtained. The obtained polymer solution had a solid concentration of 30. 0% by mass. The obtained polymer had a number average molecular weight of 3,200. In addition, the molecular weight distribution (Mw/Mn) is 1. 8° [Synthesis Example 19] In a flask equipped with a condenser and a stirrer, 8 parts by mass of 2,2,-azobis(2,4-dimethylvaleronitrile) and 6 parts by mass of 2,4- were added. Diphenyl-4-methyl-1-pentene and 220 parts by mass of diethylene glycol methyl ethyl ether. Next, 40 parts by mass of styrene, 5 parts by mass of 3-methylpropenyloxypropyltrimethoxy sand, and 55 parts by mass of p-isopropylbenzene (compound represented by the above formula (8)) are added. A polymer solution containing a copolymer (B_i 6) was obtained by the same method as in Synthesis Example 4. The solid content concentration of the obtained polymer solution was 31. 0 mass %. The resulting polymer had a number average molecular weight of 3,100. In addition, the molecular weight distribution (Mw/Mn) is 1. 9. -58-201217910 [Synthesis Example 20] In a flask equipped with a condenser and a stirrer, '8 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 6 parts by mass of 2 were added. 4-Diphenyl-4-methyl-1·pentene and 220 parts by mass of diethylene glycol methyl ethyl ether. Next, 4 parts by mass of styrene, 5 parts by mass of 3-methylpropenyloxypropyltrimethoxydecane, and 55 parts by mass of p-hydroxyphenyl methacrylate (compound represented by the above formula (7)) were added. The polymer solution containing the copolymer (B-17) was obtained by the same method as in Synthesis Example 4. The solid solution concentration of the obtained polymer solution was 3 2. 0% by mass. The obtained polymer had a number average molecular weight of 3,300. Further, the molecular weight distribution (Mw/Mn) was 1. 8» [Synthesis Example 21] In a flask equipped with a condenser and a stirrer, 8 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 6 parts by mass of 2,4· were added. Diphenyl-4-methyl-1-pentene and 220 parts by mass of diethylene glycol methyl ethyl ether. Next, 40 parts by mass of styrene, 5 parts by mass of 3-methylpropenyloxypropyltrimethoxydecane, and 55 parts by mass of p-hydroxymethylpropenylaniline (compound represented by the above formula (5)) are added. A polymer solution containing the copolymer (B-18) was obtained by the same method as in Synthesis Example 4. The solid solution concentration of the obtained polymer solution was 32. 0% by mass. The resulting polymer had a number average molecular weight of 3,300. Further, the molecular weight distribution (Mw/Mn) was 1. 8. [Synthesis Example 22] In a flask equipped with a condenser and a stirrer, 8 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 6 parts by mass of 2,4-diphenyl were added. Base-4-methyl-l--59- 201217910 Pentene and 220 parts by mass of diethylene glycol methyl ethyl ether. Subsequently, 80 parts by mass of glycidyl methacrylate and 2 parts by mass of styrene were added, and a copolymer (B -1 9 ) polymer solution was obtained by the same method as in Synthesis Example 4. The solid content concentration of the obtained polymer solution was 3 2 · 0% by mass. The obtained polymer had a number average molecular weight of 3,500. In addition, the molecular weight distribution (Mw/Mn) is 2. 0. [Synthesis Example 23] In a flask equipped with a condenser and a stirrer, 8 parts by mass of 2,2'·azobis(2,4-dimethylvaleronitrile) and 6 parts by mass of 2,4-diphenyl were added. Base-4-methyl-1-pentene and 220 parts by mass of diethylene glycol methyl ethyl ether. Then, 79 parts by mass of glycidyl methacrylate, 20 parts by mass of styrene, and 1 part by mass of 3-methylpropenyloxypropyltrimethoxydecane were added, and copolymerization was obtained by the same method as in Synthesis Example 4. (B-20) polymer solution. The solid solution concentration of the obtained polymer solution was 28. 0% by mass. The obtained polymer had a number average molecular weight of 3,000. In addition, the molecular weight distribution (Mw/Mn) is 1. 9° [Synthesis Example 24] In a flask equipped with a condenser and a stirrer, 8 parts by mass of 2,2,-azobis(2,4-dimethylvaleronitrile) and 6 parts by mass of 2,4- were added. Diphenyl-4-methyl-l-pentane and 220 parts by mass of monoethyl alcohol methyl ethyl acid. Next, 34 portions of methyl glycidyl acrylate, 25 parts by mass of styrene, and 35 parts by mass of trimethoprim were added. 2. 1. 02'6] 癸-8-yl ester and hydrazine part 3 - methacryloxypropyltrimethoxy decane' were obtained by the same method as in Synthesis Example 4 -60-201217910 to obtain a copolymer (B). - 2 1) Polymer solution. The solid solution concentration of the obtained polymer solution was 32. 0% by mass. The obtained polymer had an average molecular weight of 3,100. Further, the molecular weight distribution (Mw/Mn) was 1. 9. [Synthesis Example 25] In a flask equipped with a condenser and a stirrer, 8 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 6 parts by mass of 2,4-diphenyl were added. Base-4-methyl-l-pentene and 220 parts by mass of diethylene glycol methyl ethyl ether. Next, 34 parts by mass of glycidyl methacrylate, 25 parts by mass of styrene, 35 parts by mass of N-cyclohexylmaleimide, and 1 part by mass of 3-methylpropenyloxypropyltrimethoxy sands were added. A polymer solution containing the copolymer (B-22) was obtained by the same method as in Synthesis Example 4. The solid solution concentration of the obtained polymer solution was 3 2. 0% by mass. The resulting polymer had a number average molecular weight of 3,100. In addition, the molecular weight distribution (Mw/Mn) is 1. 9. Preparation of a radiation sensitive composition and formation of a protective film and an interlayer insulating film [Example 1] A solution containing a hydrolysis condensate (A-1) obtained in Synthesis Example 1 as a component [A] (corresponding to 1〇〇) A solution containing the copolymer (B-1) composed of a monomer containing the compound represented by the above formula (8) as a component [B] is added to the mass of the hydrolysis condensate (A_1) (solid content) (corresponding to 5 parts by mass of (B-1) (solid content)), and 3 parts by mass of (C-3) 2-nitrobenzylcyclohexylaminoformate as the component [C], 0. 05 parts by mass of 2,4,6-tris(2-pyridyl)-1,3,5-triazine, as a component [F]. 1 part by mass of a polyoxonic surfactant as a [H] component ("SH 8400 -6 1- 201217910 FLUID" manufactured by Toray Dow Corning Co., Ltd.), and propylene glycol monomethyl ether was added to have a solid concentration of Mass %, a radiation sensitive composition was prepared. The radiation sensitive composition was applied onto a Si〇2 impregnated glass substrate using a spin coater, and then prebaked on a hot plate at 90 ° C for 2 minutes to form a coating film (evaluation of ITO adhesion described later) In the case of using a substrate with ITO, a substrate with Mo was used for the evaluation of Mo adhesion. Next, the obtained film was subjected to ultraviolet light exposure at an exposure amount of 5,000 J/m 2 . Then, borrow 2. 38% by mass aqueous solution of tetramethylammonium hydroxide, after developing 80 at 25 ° C, washing with pure water for 1 minute' then heating in an oven at 23 ° C for 60 minutes to form a film thickness of 2. 0 μηι protective film. In addition, the number of revolutions of the spinner is adjusted when the coating film is formed so that the film thickness after heating is 3·0 μm, except that the mask having a contact hole pattern having a size of 20 μm, 30 μm, 40 μm, and 50 μm is exposed at 150 μm. The slit (the interval between the substrate and the reticle) is exposed to form an interlayer insulating film in the same manner as the protective film is formed. [Examples 2 to 57 and Comparative Examples 1 to 7] Except that the types and amounts of the respective components are as described in Table 1, and the implementation 1 . Similarly, a radiation sensitive composition is prepared, and a protective film and an interlayer insulating film are formed. Further, the number of parts of the mixing amounts of the respective components in Tables 1 to 4 indicates the parts by mass. The physical properties of the protective films formed in Examples 1 to 57 and Comparative Examples 1 to 7 were transparent, heat-resistant and transparent, pencil hardness (surface hardness), abrasion resistance, crack resistance, and a substrate such as a substrate and molybdenum. The adhesion of the wiring, and the formation of the sense of 20, the coating of the second component, and the resolution of the linear composition of the upper layer of the -62-201217910 (the clarity of the interlayer insulating film) as follows. The "resolution" of the radiation sensitive composition is an evaluation of the performance of a precise contact hole in which the composition can form an interlayer insulating film, and at the same time provides an evaluation as "clearness" of the interlayer insulating film. (1) Evaluation of Transparency of Protective Film For each of the examples and the comparative examples, the substrate having the protective film formed above was a spectrophotometer (150-20 type double beam manufactured by Hitachi, Ltd.). The light transmittance (%) at a wavelength of 400 to 800 nm was measured. The minimum 値 of the light transmittance (%) having a wavelength of 400 to 800 nm is evaluated as transparency, and is shown in Tables 1 to 4. When the enthalpy is 95% or more, the transparency of the protective film is considered to be good. When it is carried out for the interlayer insulating film, since it is only the film thickness (3.  Since Ομπι) is different from the protective film, the evaluation of the transparency of the interlayer insulating film and the evaluation of the transparency of the protective film were similarly determined. (2) Evaluation of heat-resistant transparency of the protective film In each of the examples and the comparative examples, the substrate having the protective film formed as above was heated in a cleaning oven at 300 ° C for 30 minutes, according to the above (1) "Protection The method described in "Evaluation of transparency of a film" measures the light transmittance before and after heating. The heat-resistant transparency (%) calculated according to the following formula is shown in the table. When the enthalpy is 5% or less, the heat-resistant transparency of the protective film is considered to be good. When it is carried out for the interlayer insulating film, since it is only the film thickness (3. Since the 0 μιη) was different from the protective film, the evaluation of the heat-resistant transparency of the interlayer insulating film was judged in the same manner as the evaluation of the heat-resistant transparency of the protective film. Heat-resistant transparency (%) = light transmittance before heating (%) - light transmittance after heating (%) -63 - 201217910 (3) Determination of pencil hardness (surface hardness) of protective film for each example and comparison In the example, the substrate having the protective film formed as described above is exemplified by JIS-K-5400-1990. 4. 1 Pencil scratch test, the pencil hardness (surface hardness) of the protective film was measured, and as shown in Tables 1 to 4, when the 値 was 3H or more, the surface hardness of the protective film was considered to be good. When it is carried out for the interlayer insulating film, it is only the film thickness (3. Since 0 μηι) was different from the protective film, the evaluation of the pencil hardness of the interlayer insulating film and the evaluation of the pencil hardness of the protective film were similarly determined. (4) Evaluation of abrasion resistance of the protective film In each of the examples and the comparative examples, the substrate having the protective film formed as described above was loaded on the steel ball #0000 using a JSPS friction tester. The weight of 〇g is repeated 1 time. The wear was evaluated by the naked eye according to the following criteria. The results are shown in Tables 1 to 4. Judgment criteria ◎: No damage at all 〇: With 1 to 3 scars △: With 4 to 1 root scars x: With 10 or more flaws, if it is ◎ or 〇, it is considered to have good wear resistance. Sex. When it is carried out for the interlayer insulating film, it is only the film thickness (3. Since 0 μπ1) is different from the protective film, the evaluation of the abrasion resistance of the interlayer 'insulating film and the evaluation of the abrasion resistance of the protective film were similarly determined. -64-201217910 (5) Confirmation of the presence or absence of cracks (evaluation of crack resistance) In each of the examples and the comparative examples, the substrate having the protective film formed as described above was allowed to stand at 23 ° C for 24 hours to cause cracks on the surface of the protective film. Or use a laser microscope (VK-8500 manufactured by KEYENCE) to confirm the cracks. The evaluation is based on the following criteria. The results are shown in Tables 1-4. . Judgment criteria ◎: There are no cracks at all: There are 1 to 3 cracks △: There are 4 to 10 cracks X: If there are more than 1 cracks, as long as it is ◎ or 〇, it is considered that the result of crack detection is good. . When it is carried out for the interlayer insulating film, it is only the film thickness (3. Since 0 μιη) is different from the protective film, the evaluation of the crack resistance of the interlayer insulating film and the evaluation of the crack resistance of the protective film were similarly determined. (6) Evaluation of ΙΤΟ (indium-tin oxide) adhesion and Mo (molybdenum) adhesion of the protective film, except for using a substrate with ITO and a substrate of Mo (molybdenum), by way of various examples and comparison For example, a protective film was formed as above, and a pressure cooker test (1 20 ° C, humidity of 100%, 4 hours) was carried out. After that, proceed to JI S - K - 5 4 0 0 - 1 9 9 0. 5. 3 Adhesive checkerboard tape method was used to obtain the number of checkerboards remaining in one checkerboard, and the ITO adhesion and Mo adhesion of the protective film were evaluated. The results are shown in Tables 1 to 4. On the substrate with I TO, when the number of checkerboards remaining in 100 checkerboards exceeds 90, it is considered that the ITO adhesion is good. In addition, the adhesion of the substrate with Mo tends to be unsatisfactory compared to the substrate with ITO. Therefore, for the substrate with Mo, the number of checkerboards remaining in the 100 checkerboards exceeds 8 At 0, it is considered that the adhesion is good. When it is carried out for the interlayer insulating film, it is only the film thickness (3. Ομιη) is different from the protective film. Therefore, the evaluation of the adhesion between the interlayer insulating film and the adhesion of Mo and the evaluation of the ITO adhesion and the Mo adhesion of the protective film can be judged to be the same. (7) Radiation Evaluation of the resolution of the composition (the sharpness of the interlayer insulating film) When the interlayer insulating film in each of the examples and the comparative examples is formed, it can be considered that the contact hole pattern of 30 μηα or less can be expressed. Good. The size of the contact hole pattern which can be resolved (the smallest size which can be expressed up to 20 μm to 50 μm) is shown in Tables 1 to 4. In addition, in Table 1, [C] a radioactive acid generator or a radiation sensitive alkali generator, a [Ε] ethylenically unsaturated compound, [F] a decane compound having a specific structure, and a [G] acid diffusion controlling agent The abbreviations of the [Η] radical polymerization initiator and the [I] surfactant are respectively represented by the following. C-1: triphenylsulfonium trifluoromethanesulfonate C 2 : 1-(4,7-dibutoxy-1-naphthalenyl)tetrahydrothiophene trifluoromethanesulfonate C-3 : 2-nitrate a mixture of benzylcyclohexyl carbazate hydrazone-1: dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate (trade name: MAX-3 5 1 0, Nippon Kayaku Co., Ltd.) Manufactured by the company) E-2: Pentaerythritol triacrylate (trade name: A-TMM-3LMN 'Manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) -66- 201217910 Fl: 1,4-bis(trimethoxymethyl)矽alkylmethyl)benzene F-2: bis(triethoxycarbenyl)ethane F-3: tris(3-trimethoxycarbamidylpropyl)isocyanurate Gl: 2,4, 6-tris(2-pyridyl)-1,3,5-three tillage H-1: ethyl ketone-l-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole- 3-yl]-1-(anthracene-acetyl fluorene) (trade name · IRGACURE IRGACURE OXE02, CIBA SPECIALTY CΗΕ ΜICALSCIBA SPECIALTY CHEMICALS (manufactured by the company)) 1-1 : Polyoxonated surfactant ((share) '' SH 8400 FLUID' by Toray Dow Corning) -67- 201217910 [Table i] Ingredient Names 1 2 3 4 5 6 7 8 9 ] 〇11 12 13 14 15 16 A-] 100 100 100 100 100 100 [A] component: A-2 100 100 )00 100 100 A-3 100 100 100 100 100 B-1 5 5 5 B-2 5 5 5 B-3 5 5 5 B-4 5 5 5 Copolymer component B^5 5 5 5 B-6 5 B-7 β. 8 Β-9 Β-10 B-ll Β-12 Β-13 Β-14 Β-15 Β·16 Β-Ι7 Β-18 Β-19 Β-20 Β-21 Β-22 [C] Component: Radiation Acid generator or sensitizing linear base generator C-1 3 3 C-2 3 03 3 [H] component: B-sex unsaturated compound Ε-1 Ε-2 [F Cheng cc: decane compound F-1 F -2 30 30 30 30 F-3 30 30 30 [G] component: acid diffusion control agent G-1 0. 05 0. 05 0. 05 0. 05 0. 05 0. 05 0. 05 0. 05 [H] component: radical polymerization initiator Η-Ι m component: interface flavour Μ 0. 1 0. 0. 1 0. 1 0. 1 0. 1 0. 1 0. 1 0. 1 0. 1 0. 1 0. 1 0. 1 0. 1 0. 1 0. 1 Physical property evaluation transparency (%) 9* 98 95 98 98 99 98 9$ 98 9% 9S 98 9B 98 98 Heat-resistant transparency (%) 4 5 4 4 5 4 4 4 4 5 5 4 4 5 4 Fiber Xia 3H 3H 3H 4H 4H 4H 3H 3H 3H 4H 4H 4H 3H 3H 3H 4H Wear resistance 0 〇〇〇 ◎ @ 0 〇0 0 ◎ ◎ 〇〇〇〇 crack resistance ◎ 〇 ◎ ◎ 〇 ◎ ◎ ◎ @ ◎ @ ◎ ◎ ◎ ◎ @ ΙΤΟ密潍() 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 Mo Adhesion (90) 90 90 90 100 90 100 90 90 90 90 100 100 90 90 90 100 Resolution 30 30 30 30 30 30 30 30 30 30 20 30 30 30 30 30 -6 8- 201217910 [Table 2] Example ingredient name 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 A-1 100 100 100 ]〇() [A credit: A-2 100 100 100 100 100 100 50 | (X) A-3 100 100 100 50 100 B-1 B-2 B-3 B-4 B-5 B-6 5 5 B-7 5 S 5 B-8 5 5 5 B-9 5 5 10 30 50 5 B-10 5 5 B-11 Copolymer composition B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 [C] Component: Radiation-induced linear acid generation Agent or radiation sensitive alkali generator C-1 3 C-2 J 3 » 3 0. 5 3 C-3 [E] component: Ethylene unsaturated compound E-1 30 10 20 E-2 30 10 15 [F] component: decane compound F-1 30 30 30 F-2 30 30 F-3 30 30 30 30 30 30 30 30 [GJ component: acid diffusion control agent G-1 0. 03 0. 03 0. 05 0. 03 0. 03 0. 0) 0. 0) 〇. 〇} 00) [H] component: radical polymerization initiator H-1, 5 5 3 3 [I] component: surfactant Μ 0. 1 0. 1 0. 1 0. 1 0. 1 0. 1 0. 1 0. 1 0. 1 0. 1 0. 1 0. 1 0. 1 (U <U (Π transparency (%) 98 98 98 98 98 98 98 98 98 98 98 98 98 98 98 98 heat-resistant transparency (%) 3 4 4 3 3 4 4 3 4 4 5 4 4 3 4 5 fiber Hardness 4H 4H 4H SH 5H 4H 4H SH 4H 4H 4H 3H 3K 5H 4H 4Η Abrasion resistance ◎ ◎ 〇 ◎ ◎ 〇〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ITO^tt(s) 100 100 100 100 100 100 100 >00 100 100 100 100 100 100 100 100 Mo Adhesion (4) 100 100 100 100 too 100 90 100 100 100 100 90 90 100 100 100 Analysis Degree 30 30 30 30 30 30 30 30 30 30 20 20 20 3« 30 3ϋ -69- 201217910 [Table 3] Ingredient name Example 33 34 35 36 37 38 39 40 41 42 43 44 4S 46 47 48 [A] Ingredients: Oxysiloxane polymer A-1 100 100 100 100 100 A-2 100 100 100 100 100 A-3 100 100 100 ]〇0 100 100 Copolymer component B-1 B-2 B-3 B-4 B -5 B-6 B-7 B-8 B-9 B-10 5 B-11 5 5 5 B-12 5 5 5 B-13 5 5 .5 B-14 5 5 5 B-I5 5 5 5 B-16 B-17 B-18 B-19 B-20 B-21 B-22 [C] component · Radiation-sensitive linear acid generator or radioactive linear base generator C-1 C-2 3 ' C-3 J [H] Component: B-sex unsaturated compound E-1 20 E-2 10 [F] Component: decane compound F-1 30 30 30 F-2 30 30 30 30 30 30 F-3 30 30 30 30 50 30 30 [G] component: acid diffusion control agent G-1 0.05 0.05 0.05 0.05 0.05 0.05 0.05 [H] component: radical polymerization initiator H-1 3 [I] component: surfactant 1-1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.J 0.1 0.1 0.1 0.1 0.1 0.1 0.1 Evaluation mm%) 98 98 98 98 98 9S 98 98 98 98 98 98 98 98 98 98 Resisting monthly (%) 5 4 4 5 4 3 4 4 4 5 4 4 5 4 4 3 Scale hardness 4H 4H 4H 4H 4H 4H 4H 4H 4H 4H 4H 4H 4H 4H 4H 5H Wear resistance ◎ @ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇〇 ◎ ◎ ◎ Crack resistance ◎ ◎ ◎ @ ◎ ◎ @ @ ◎ 〇 ◎ ◎ ◎ ◎ ◎ ◎ ΠΌ Adhesion (s) 100 100 100 100 100 100 100 100 100 100 100 100 ] 〇〇 100 100 100 Mo Adhesion (4) 100 100 100 100 ]00 100 100 ]〇 0 100 100 100 90 ]〇0 100 100 100 Resolution 30 30 30 30 30 30 30 30 30 30 30 30 30· 30 30 30 -70- 201217910 [Table 4] Ingredient name comparison example 49 50 51 52 53 54 55 56 51 1 2 3 4 5 6 7 [A credit: alkoxylate polymer A-1 100 100 100 100 100 100 100 100 A-2 100 100 100 100 A-3 100 !00 100 100 copolymer component B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-1I B-12 B-13 B-14 B-15 B-16 5 5 5 B-17 5 5 5 B-18 5 5 5 B-19 5 B-20 5 B-21 5 B-22 5 5 [C] Component: Radiation-sensitive acid generator or radiation-sensitive Antimony generating agent C-1 3 3 3 3 3 3 C-2 3 3 3 C-3 [H] component: Ethylene unsaturated compound E-] E-2 (7) Component: decane compound F-1 .10 30 F- 2 30 30 30 30 30 30 30 30 F-3 30 30 30 30 [G] component: acid brittle preparation GI 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 [H] component: free radical polymerization initiator H-1 m component :Interface contact agent 1-1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 Physical property evaluation Transparency (%) 98 98 98 98 98 98 98 98 98 97 97 97 97 97 97 9$ Heat-resistant transparency (%) 4 4 5 5 4 5 7 8 6 7 7 7 8 Filament 4H 4H 4H 4H 4H 4H 4H 4H 4H 3H 3H 3H 3H 3H 3H 3H Wear resistance 〇 ◎ ◎ ◎ ◎ ◎ ◎ © 〇 〇〇〇〇〇 〇〇〇〇〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ΙΤΟ 饰 ) 100 100 100 100 100 100 100 100 85 85 85 50 40 85 85 Mo adhesion ( 100 100 90 100 100 100 100 100 100 60 50 50 20 10 60 60 Resolution 30 30 30 30 30 30 30 30 30 40 50 40 50 50 40 40 201217910 As shown in the results of Tables 1 to 4, the present invention can be known. In addition to the [A] and [C] components, the radiation sensitive composition of Examples 1 to 5 7 contains the [B] component of the polymer which is a repeating unit having a specific structure, and can form a good balance to achieve transparency. 'Generally required properties such as heat-resistant transparency, pencil hardness (surface hardness) and abrasion resistance, and excellent adhesion to the ITO transparent conductive film and the molybdenum substrate even under severe conditions of high temperature and high humidity. Crack-resistant protective film (and interlayer insulating film). In addition, it is also known that the radiation-sensitive composition exhibits such a sufficient resolution that a contact hole may be formed. On the other hand, the protective film (interlayer insulating film) formed of the composition of Comparative Example 1 which does not contain the component [B] of the present invention has a markedly poor adhesion to the ITO transparent conductive film and the molybdenum substrate, and These compositions did not show sufficient resolution. INDUSTRIAL APPLICABILITY The radiation-sensitive linear composition of the present invention can form a property which satisfactorily satisfies the general requirements such as transparency, heat-resistant transparency, surface hardness, and the like, and even under severe conditions of high temperature and high humidity, ITO The transparent conductive film and the metal wiring such as molybdenum exhibit a protective film and an interlayer insulating film which have excellent adhesion and crack resistance. Further, the radiation-sensitive linear composition has negative radiation sensitivity and is advantageous in terms of cost. Therefore, the protective film or interlayer insulating film thus formed is particularly suitable for use as a display element. [Simple description of the diagram] Ο /\\\ [Description of main component symbols]

An* no 0 -72-

Claims (1)

201217910 VII. Patent application scope: 1. A radiation sensitive linear composition comprising: [A] a siloxane polymer, [B] a polymer having a repeating unit represented by the following formula (1), and [C a radiation sensitive acid generator or a radiation sensitive alkali generator; In the formula (1), R1 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and each of R2 to R6 is independently a hydrogen atom, a hydroxyl group or an alkyl group having 1 to 4 carbon atoms, and B is a single bond. -COO-* or -CONH-*, m is an integer from 0 to 3; wherein at least one of 'R2~r6 is a hydroxyl group, .COO" or a linkage of each * in the test-CONH-* and (Cii2 ) m carbon connection. 2. The radiation-sensitive linear composition of claim 1, wherein the [A] oxalyl polymer is a hydrolysis condensate of the hydrolyzable decane compound represented by the following formula (2): (R7)q-Si —(OR8)4_q (2) In the formula (2), R7 is a non-hydrolyzable organic group having 1 to 20 carbon atoms, R8 is an alkyl group having 1 to 4 carbon atoms, and q is 〇~3. The integer. -73-201217910 3. The radiation sensitive composition of claim 1, further comprising [D] a dehydrating agent. 4. The radiation sensitive composition of claim 3, which further comprises [E] an ethylenically unsaturated compound. 5. The radiation sensitive composition according to claim 1, 2 or 3, wherein at least one selected from the group consisting of triphenylsulfonate and tetrahydrothiophene key salt is used as [C] radiation sensitive Acid generator. 6) The radioactive linear composition of claim 1, 2 or 3, wherein the composition is selected from the group consisting of 2-nitrobenzylcyclohexylcarbamate and hydrazine-amine-methylhydrazine hydroxy guanamine At least one of the groups acts as a [C] sensory radioactive base generator. 7. A radiation sensitive composition as claimed in claim 1, 2 or 3, which is used for forming a protective film or an interlayer insulating film of a display element. 8. A method of forming a protective film for a display element, comprising: (1) a step of forming a coating film of a radiation-sensitive linear composition of claim 7 on a substrate, (2) a step (1) a step of irradiating at least a part of the coating film formed in the film, (3) a step of developing the coating film irradiated with radiation in the step (2), and (4) heating the coating film developed in the step (3) A step of. A protective film for a display element formed of a radiation-sensitive composition as in claim 7 of the patent application. -74-201217910 ίο. A method of forming an interlayer insulating film for a display element, comprising: (1) a step of forming a coating film of a radiation-sensitive linear composition of claim 7 on a substrate, (2) a step of irradiating at least a part of the coating film formed in the step (1) with radiation, (3) a step of developing the coating film irradiated with radiation in the step (2), and (4) heating at the step (3) The step of developing the coating film. 1 1 An interlayer insulating film of a display element formed of a radiation-sensitive composition as in claim 7 of the patent application. -75- 201217910 IV. Designated representative map: (1) The representative representative of the case is: None. (2) A brief description of the component symbols of this representative figure: None. 5. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: