TWI413864B - Silsesquioxane-containing compound and method for preparing the same - Google Patents

Silsesquioxane-containing compound and method for preparing the same Download PDF

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TWI413864B
TWI413864B TW094124856A TW94124856A TWI413864B TW I413864 B TWI413864 B TW I413864B TW 094124856 A TW094124856 A TW 094124856A TW 94124856 A TW94124856 A TW 94124856A TW I413864 B TWI413864 B TW I413864B
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meth
acrylate
compound
compound containing
sesquiterpene
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TW200617603A (en
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Yoshiaki Horiuchi
Shingo Kanaya
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Nagase Chemtex Corp
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F230/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
    • C08F230/04Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
    • C08F230/08Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/22Esters containing halogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/28Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • C08F220/281Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing only one oxygen, e.g. furfuryl (meth)acrylate or 2-methoxyethyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/28Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • C08F220/283Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing one or more carboxylic moiety in the chain, e.g. acetoacetoxyethyl(meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F230/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
    • C08F230/04Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
    • C08F230/08Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
    • C08F230/085Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon the monomer being a polymerisable silane, e.g. (meth)acryloyloxy trialkoxy silanes or vinyl trialkoxysilanes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators

Abstract

<P>PROBLEM TO BE SOLVED: To provide a silsesquioxane-containing compound which can impart various desired functions such as photopolymerization, alkali solubility and weatherability and is suitable for a radiation-sensitive resin having characteristics of silicon resins such as transparency and heat resistance. <P>SOLUTION: The silsesquioxane-containing compound is obtained by the cocondensation of a copolymer of (A) a (meth)acrylic ester having a trialkoxysilyl group in the molecule and at least one of a (meth)acrylic ester having a functional group capable of imparting alkali solubility as a substituent and a (meth)acrylic ester having a functional group capable of imparting heat resistance as a substituent with a trialkoxysilane compound (C') having a carbon-carbon double bond in the molecule. The radiation-sensitive resin uses the compound. A method for producing the compound comprises performing the radical copolymerization of vinyl monomers and successively performing the cocondensation with a trialkoxysilane. <P>COPYRIGHT: (C)2006,JPO&amp;NCIPI

Description

含倍半矽氧烷之化合物及其製造方法Compound containing sesquiterpene oxide and preparation method thereof

本發明係關於具有丙烯酸系共聚鏈之含倍半矽氧烷化合物,尤其是,關於一種含倍半矽氧烷化合物,能賦予光聚合性、鹼可溶性、耐熱性、耐候性等各種所需機能,並且兼具透明性、耐熱性等矽系樹脂特徵而可適用於熱放射線性樹脂;並關於該化合物之製造方法,係於進行乙烯基單體之自由基共聚後接著進行三烷氧基矽烷共縮合。The present invention relates to a sesquiterpene oxide compound having an acrylic copolymer chain, and more particularly to a sesquiterpene oxide-containing compound capable of imparting various desired functions such as photopolymerizability, alkali solubility, heat resistance, weather resistance, and the like. And it is suitable for a thermal radiation-linear resin because it has the characteristics of a fluorene-based resin such as transparency and heat resistance; and the method for producing the compound is carried out by performing a radical copolymerization of a vinyl monomer followed by a trialkoxy decane. Co-condensation.

近年來,於液晶、LED等顯示元件領域中,具有高透明性(亦即,高可見光穿透率。以下同。)並且兼有良好耐熱性、放射線感度、顯影解析度及耐藥品性等特性之熱放射線性樹脂的需求性在升高中。尤其是高透明性這一點,苯酚樹脂、漆用酚醛樹脂、丙烯酸系共聚樹脂、脂環烷基系樹脂等習知之感光性樹脂很難滿足該要求。也就是說,習知樹脂無法充分滿足高透明性(包括於塗膜成膜時之透明性及加熱後透明性之耐熱透明性兩者)。為解決該問題,使用矽系樹脂以期待能有良好透明性、耐熱性之之例子已揭示者有數例。In recent years, in the field of display elements such as liquid crystals and LEDs, it has high transparency (that is, high visible light transmittance. The same applies hereinafter) and has good heat resistance, radiation sensitivity, development resolution, and chemical resistance. The demand for thermal radiation linear resins is rising. In particular, it is difficult to satisfy the requirements of a conventional photosensitive resin such as a phenol resin, a phenol resin for lacquer, an acrylic copolymer resin, or an alicyclic alkyl resin because of high transparency. That is to say, the conventional resin cannot sufficiently satisfy the high transparency (including both the transparency at the time of film formation of the coating film and the heat-resistant transparency of transparency after heating). In order to solve this problem, there have been several examples in which a lanthanoid resin is used in order to have good transparency and heat resistance.

含有倍半矽氧烷構造之熱放射線性樹脂已揭示者有含有梯狀(ladder)倍半矽氧烷構造之共聚物之光阻劑樹脂(例如,參見專利文獻1)。該共聚物係先將具側鏈之三烷氧基矽烷共縮合後,再合成含有乙烯基系側鏈之梯狀構造的倍半矽氧烷,然後,將含有能因酸而分解產生有機酸基之側鏈的丙烯酸系單體與含有上述乙烯基系側鏈之倍半矽氧烷共聚所得到,該聚合物之目的係做為正型光阻使用。但是,該共聚物由於係先以共縮合合成倍半矽氧烷後再將丙烯酸系單體進行自由基共聚,故完全消耗掉化合物中之乙烯性雙鍵,以致無法發揮光聚合性,沒有負型光阻之機能。又,梯狀倍半矽氧烷構造雖然矽含量高且熱安定性或氧電漿耐受性良好,對做為正型光阻是有利的,但是在高透明性、耐熱性方面仍不足。A thermoradiographic resin containing a sesquiterpene oxide structure has been disclosed as a photoresist resin containing a copolymer of a ladder sesquiterpene structure (for example, see Patent Document 1). The copolymer is obtained by co-condensing a trialkyloxy decane having a side chain, and then synthesizing a sesquiterpene oxide having a ladder-like structure of a vinyl side chain, and then decomposing the organic acid by the acid. The acrylic monomer of the side chain of the base is obtained by copolymerization with a sesquiterpene oxide containing the above vinyl side chain, and the polymer is used as a positive type resist. However, since the copolymer is subjected to radical copolymerization by synthesizing a sesquioxane by co-condensation, the acrylic monomer is completely consumed, so that the ethylenic double bond in the compound is completely consumed, so that photopolymerization cannot be exerted, and there is no negative The function of the type of photoresist. Further, the ladder sesquiterpene oxide structure is advantageous in that it is a positive photoresist, although it has a high niobium content and good thermal stability or oxygen plasma resistance, but it is still insufficient in terms of high transparency and heat resistance.

另外,已知有使用(甲基)丙烯醯氧基官能性梯狀倍半矽氧烷之鹼可溶性感光性樹脂(例如,參見專利文獻2)。該倍半矽氧烷不僅含有烷基、芳基、環己基等側鏈,並且含有(甲基)丙烯醯氧基,係由含(甲基)丙烯醯氧基之三烷氧基矽烷與含側鏈基之三烷氧基矽烷共縮合而成。但是,該倍半矽氧烷本身並不具有鹼可溶性。而且,完全沒有揭示關於含有含自由基共聚鏈之倍半矽氧烷的化合物。Further, an alkali-soluble photosensitive resin using a (meth)acryloxy functional ladder-like sesquiterpene alkane is known (for example, see Patent Document 2). The sesquiterpene oxide contains not only a side chain such as an alkyl group, an aryl group or a cyclohexyl group, but also a (meth) propylene fluorenyloxy group, which is composed of a (meth) acryloxy group-containing trialkoxy decane and a The side chain-based trialkoxy decane is co-condensed. However, the sesquiterpene alkane itself does not have alkali solubility. Moreover, there is no disclosure at all about the compound containing a sesquiterpene oxide containing a radical copolymer chain.

又,已知有使用側鏈含有羧基之倍半矽氧烷之光阻組成物(例如,參見專利文獻3)。但是,該倍半矽氧烷並不具有光聚合性。而且,完全沒有揭示關於含有含自由基共聚鏈之倍半矽氧烷的化合物。如上,具有高透明性並滿足光阻之基本物性,適用於熱放射線性樹脂之倍半矽氧烷化合物到目前為止仍為未知的。Further, a photoresist composition using a sesquioxane having a carboxyl group in a side chain is known (for example, see Patent Document 3). However, the sesquiterpene oxide does not have photopolymerizability. Moreover, there is no disclosure at all about the compound containing a sesquiterpene oxide containing a radical copolymer chain. As described above, the sesquioxalic acid compound suitable for the heat radiation linear resin is still unknown until it has high transparency and satisfies the basic physical properties of the photoresist.

[專利文獻1]WO99/09457號公報,第37~39頁等。[Patent Document 1] WO99/09457, pages 37 to 39, and the like.

[專利文獻2]日本特開平10-161315號公報,第(4)頁等。[Patent Document 2] Japanese Laid-Open Patent Publication No. Hei 10-161315, page (4), and the like.

[專利文獻3]日本特開平11-60734號公報,申請專利範圍等。[Patent Document 3] Japanese Laid-Open Patent Publication No. Hei 11-60734, the scope of which is incorporated herein by reference.

有鑑於上述現狀,本發明之目的為提供一種含有倍半矽氧烷之化合物,該化合物能賦予光聚合性、鹼可溶性、耐熱性、耐候性等各種所需機能,並且適用於兼具透明性、耐熱性等矽系樹脂之特徵之熱放射線性樹脂;並提供一種含有倍半矽氧烷之化合物的製造方法,係於乙烯基單體之自由基共聚之後接著進行三烷氧基矽烷之共縮合,以使化合物具有高設計自由度。In view of the above circumstances, an object of the present invention is to provide a compound containing sesquiterpene oxide which imparts various functions required for photopolymerization, alkali solubility, heat resistance, weather resistance, and the like, and is suitable for both transparency. a heat radiation linear resin characterized by a heat-resistant lanthanide resin; and a method for producing a compound containing sesquiterpene oxide, which is followed by radical copolymerization of a vinyl monomer followed by a trial of a trialkoxy decane Condensation to give the compound a high degree of design freedom.

本發明者為了解決上述課題努力地研究,結果洞悉藉由於乙烯基單體之自由基共聚後接著進行三烷氧基矽烷共縮合,可以確保含倍半矽氧烷化合物之高設計自由度,並依據該見解發現了能自由賦予倍半矽氧烷各種機能之製造方法,並進而完成了本發明。也就是說,本發明為一種含倍半矽氧烷之化合物,係使得分子中具有三烷氧基甲矽烷基之(甲基)丙烯酸酯(A)與可具有取代基之(甲基)丙烯酸酯(B)共聚成共聚物(I),再使該共聚物(I)與分子中具有乙烯性碳-碳雙鍵的三烷氧基矽烷化合物(C’)共縮合而製得。The present inventors have diligently studied in order to solve the above problems, and as a result, it has been found that high-design freedom of a sesquiterpene-containing oxane compound can be ensured by radical copolymerization of a vinyl monomer followed by co-condensation of a trialkoxy decane. Based on this finding, a manufacturing method capable of freely imparting various functions of sesquiterpene oxide was found, and the present invention was completed. That is, the present invention is a sesquiterpene-containing compound which is a (meth) acrylate (A) having a trialkoxycarbenyl group in the molecule and a (meth)acrylic acid which may have a substituent. The ester (B) is copolymerized into a copolymer (I), and the copolymer (I) is obtained by co-condensing a trialkoxy decane compound (C') having an ethylenic carbon-carbon double bond in the molecule.

本發明尚為含有上述鹼可溶性化合物之熱放射線性樹脂組成物。The present invention is also a heat radiation linear resin composition containing the above alkali-soluble compound.

本發明尚為具有上述組成物之硬化層的電子零件或光學零件用基材。The present invention is also an electronic component or a substrate for an optical component having a hardened layer of the above composition.

本發明尚為含倍半矽氧烷之化合物的製造方法,包括(1)將分子中具有三烷氧基甲矽烷基之(甲基)丙烯酸酯(A)與可具有取代基之(甲基)丙烯酸酯(B)共聚之製程,及(2)使所得到之共聚物與分子中可含有乙烯性碳-碳雙鍵之三烷氧基矽烷化合物(C)共縮合之製程。The present invention is also a process for producing a compound containing a sesquiterpene oxide, which comprises (1) a (meth) acrylate (A) having a trialkoxycarbenyl group in a molecule and a (meth) group which may have a substituent a process for copolymerizing acrylate (B), and (2) a process for co-condensing the obtained copolymer with a trialkoxy decane compound (C) which may contain an ethylene carbon-carbon double bond in the molecule.

本發明由於有以上構成,而具有以下效果。The present invention has the following effects due to the above configuration.

(1)本發明之含倍半矽氧烷的化合物能賦予光聚合性、鹼可溶性、耐熱性、耐候性等各種所需的機能。(1) The sesquiterpene-containing compound of the present invention can impart various desired functions such as photopolymerization, alkali solubility, heat resistance, and weather resistance.

(2)本發明之含倍半矽氧烷的化合物透明性、耐熱性良好。(2) The sesquioxane-containing compound of the present invention is excellent in transparency and heat resistance.

(3)本發明之含倍半矽氧烷之化合物可提供透明性、耐熱性良好之熱放射線性樹脂。(3) The sesquiterpene-containing compound of the present invention can provide a heat radiation linear resin excellent in transparency and heat resistance.

(4)本發明之熱放射線性樹脂具有良好耐熱性、高透明性、放射線感度、顯像解析度及耐藥品性等特性。(4) The heat radiation linear resin of the present invention has characteristics such as good heat resistance, high transparency, radiation sensitivity, development resolution, and chemical resistance.

以下,詳細說明本發明。Hereinafter, the present invention will be described in detail.

本發明中,分子中具有三烷氧基甲矽烷基之(甲基)丙烯酸酯(A)例如有,3-甲基丙烯醯氧丙基三甲氧基矽烷、3-甲基丙烯醯氧丙基三乙氧基矽烷、3-丙烯醯氧丙基三甲氧基矽烷、3-丙烯醯氧丙基三乙氧基矽烷等。In the present invention, the (meth) acrylate (A) having a trialkoxycarbenyl group in the molecule is, for example, 3-methylpropenyloxypropyltrimethoxydecane or 3-methylpropenyloxypropyl group. Triethoxy decane, 3-propenyl methoxypropyl trimethoxy decane, 3-propenyl methoxypropyl triethoxy decane, and the like.

可具有取代基之(甲基)丙烯酸酯(B)含有不具有取代基之(甲基)丙烯酸酯以及具有取代基之(甲基)丙烯酸酯,上述取代基不特別限定,可具有能對應於對含倍半矽氧烷之化合物所欲賦予機能之取代基。例如,可以選擇能對含倍半矽氧烷之化合物賦予鹼可溶性之官能基、能對含倍半矽氧烷之化合物賦予耐熱性及耐候性至少之一性質的官能基等。The (meth) acrylate (B) which may have a substituent contains a (meth) acrylate having no substituent and a (meth) acrylate having a substituent, and the above substituent is not particularly limited and may have a correspondence A substituent which is intended to impart functionality to a compound containing sesquiterpene. For example, a functional group capable of imparting alkali solubility to a compound containing sesquiterpene oxide and a functional group capable of imparting at least one of heat resistance and weather resistance to a compound containing sesquiterpene oxide can be selected.

具有該種取代基之(甲基)丙烯酸酯例如有,以能對含倍半矽氧烷之化合物賦予鹼可溶性之官能基做為取代基之(甲基)丙烯酸酯(b-1),例如,鄰苯二甲酸2-(甲基)丙烯醯氧基乙酯、六氫鄰苯二甲酸2-(甲基)丙烯醯氧基乙酯、丙烯酸β-羧基乙酯、單丙烯酸ω-羧基聚己內酯、氧化乙烯變性琥珀酸丙烯酸酯等。該等可以使用1種或併用2種以上。The (meth) acrylate having such a substituent is, for example, a (meth) acrylate (b-1) having a functional group capable of imparting alkali solubility to a compound containing a sesquiterpene oxide, for example, , 2-(methyl) propylene methoxyethyl phthalate, 2-(methyl) propylene methoxyethyl hexahydrophthalate, β-carboxyethyl acrylate, ω-carboxyl poly(acrylic acid) Caprolactone, ethylene oxide-modified succinic acid acrylate, and the like. These may be used alone or in combination of two or more.

以能對含倍半矽氧烷之化合物賦予耐熱性及耐候性中至少一種特性之官能基做為取代基之(甲基)丙烯酸酯(b-2),例如,(甲基)丙烯酸二環戊酯、(甲基)丙烯酸二環戊烯氧基乙酯、(甲基)丙烯酸異冰片酯、9-甲基丙烯醯氧甲芴、(甲基)丙烯酸四氫糠酯等。該等可使用1種或併用2種以上。(meth) acrylate (b-2) which is a substituent capable of imparting at least one of heat resistance and weather resistance to a compound containing sesquiterpene oxide, for example, bicyclo(meth)acrylate Amyl ester, dicyclopentenyloxyethyl (meth)acrylate, isobornyl (meth)acrylate, 9-methylpropenylmethoxymethylhydrazine, tetrahydrofurfuryl (meth)acrylate, and the like. These may be used alone or in combination of two or more.

其他可具有取代基之(甲基)丙烯酸酯(B)例如有以能對含倍半矽氧烷之化合物賦予密合性之官能基做為取代基之(甲基)丙烯酸酯(b-3),例如,(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基2-乙基己基氧丙酯、(甲基)丙烯酸2-羥基丁酯、丙烯酸己內酯、(甲基)丙烯酸甲氧基二乙二醇酯、(甲基)丙烯酸甲氧基三乙二醇酯、(甲基)丙烯酸壬基苯氧基聚丙二醇酯、羥基乙基乙烯基醚等;以能對含倍半矽氧烷之化合物賦予互溶性及疏水性中至少之一性質之官能基做為取代基之(甲基)丙烯酸酯(b-4),例如,(甲基)丙烯酸環己酯、(甲基)丙烯酸芐酯、(甲基)丙烯酸丁氧基乙酯、甲基丙烯酸鯨蠟酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸甘油酯、(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸、六氟丙酯、3-乙基-3-(甲基)丙烯醯氧甲基氧雜環丁烷、3-甲基-3-(甲基)丙烯醯氧甲基氧雜環丁烷、(甲基)丙烯酸異丁酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸月桂氧基聚乙二醇酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸甲氧基聚乙烯、(甲基)丙烯酸甲酯、(甲基)丙烯酸五甲基哌啶酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸異硬脂酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸四甲基哌啶酯、(甲基)丙烯酸辣木子油酯、三乙二醇二乙烯醚、八癸基乙烯醚等;以能對含倍半矽氧烷之化合物賦予難燃性之官能基做為取代基之(甲基)丙烯酸酯(b-5),例如,(甲基)丙烯酸三溴苯酯、丙烯酸EO變性三溴苯酯等。該等可使用1種或併用2種以上,又,可以併用上述酯(b-3)~(b-5)。也可以併用上述酯(b-1)~(b-5)。The other (meth) acrylate (B) which may have a substituent may, for example, be a (meth) acrylate (b-3) which has a functional group capable of imparting adhesion to a compound containing a sesquiterpene oxide as a substituent. ), for example, 2-hydroxyethyl (meth)acrylate, 2-hydroxy 2-ethylhexyloxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, caprolactone, (a) Base) methoxy diethylene glycol acrylate, methoxy triethylene glycol (meth) acrylate, decyl phenoxy propylene glycol (meth) acrylate, hydroxyethyl vinyl ether, etc.; a (meth) acrylate (b-4) which is a substituent which imparts a property of at least one of a miscibility and a hydrophobicity to a compound containing a sesquioxanes, for example, cyclohexyl (meth)acrylate , benzyl (meth) acrylate, butoxyethyl (meth) acrylate, cetyl methacrylate, ethyl (meth) acrylate, glyceryl (meth) acrylate, glycidyl (meth) acrylate Ester, (meth)acrylic acid, hexafluoropropyl ester, 3-ethyl-3-(meth)acryloyloxymethyloxetane, 3-methyl-3-(methyl)propene oxime base Oxetane, isobutyl (meth)acrylate, isodecyl (meth)acrylate, lauryloxypolyethylene glycol (meth)acrylate, lauryl (meth)acrylate, (methyl) Methoxypolyethylene acrylate, methyl (meth) acrylate, pentamethylpiperidine (meth) acrylate, phenoxyethyl (meth) acrylate, stearyl (meth) acrylate, (methyl) Isostearyl acrylate, tert-butyl (meth)acrylate, tetramethylpiperidine (meth)acrylate, moringichyl (meth)acrylate, triethylene glycol divinyl ether, octadecyl a vinyl ether or the like; a (meth) acrylate (b-5) which is a substituent capable of imparting flame retardancy to a compound containing a sesquiterpene oxide, for example, tribromophenyl (meth) acrylate , EO modified tribromophenyl ester, and the like. These may be used alone or in combination of two or more kinds, and the above esters (b-3) to (b-5) may be used in combination. The above esters (b-1) to (b-5) may also be used in combination.

(甲基)丙烯酸酯(A)與(甲基)丙烯酸酯(B)之共聚可依常法進行,可使用溶液聚合、懸浮聚合、乳化聚合等周知的方法,從操作容易性方面考量,較佳為溶液聚合法。以溶液聚合法製造本發明之共聚物時,首先,於上述(甲基)丙烯酸酯(A)與(甲基)丙烯酸酯(B)之單體混合物中溶解聚合起始劑,並依需要溶解鏈移轉劑。然後,將所得到之均勻混合液於既定聚合溫度維持一定時間使聚合完成,可得到共聚物。The copolymerization of the (meth) acrylate (A) and the (meth) acrylate (B) can be carried out according to a usual method, and a known method such as solution polymerization, suspension polymerization or emulsion polymerization can be used, from the viewpoint of ease of handling, Good solution polymerization. When the copolymer of the present invention is produced by a solution polymerization method, first, a polymerization initiator is dissolved in a monomer mixture of the above (meth) acrylate (A) and (meth) acrylate (B), and dissolved as needed. Chain transfer agent. Then, the obtained homogeneous mixture is maintained at a predetermined polymerization temperature for a certain period of time to complete the polymerization, and a copolymer can be obtained.

此時可使用之聚合起始劑較佳為10小時半衰期溫度為60~120℃之範圍內者。該種聚合起始劑例如有,2,2’-偶氮二異丁腈、2,2’-偶氮二(2,4-二甲基戊腈)、2,2’-偶氮二(2-甲基丁腈)、2,2’-偶氮二(2-甲基丙酸酯)、2,2’-偶氮二(N-氰基己基-2-甲基丙醯胺)、2,2’-偶氮二[N-(2-丙烯基)-2-甲基丙醯胺]等偶氮類;己酸1,1,3,3-四甲基丁基過氧化2-乙酯、己酸1-環己基-1-甲基乙基過氧化2-乙酯、己酸第三己基過氧化2-乙酯、己酸第三戊基-過氧化2-乙酯、己酸第三丁基-過氧化2-乙酯、第三丁基-過氧化異丁酸酯、第三丁基過氧化馬來酸、己酸第三戊基過氧化3,5,5-三甲酯、己酸第三丁基過氧化3,5,5-三甲酯、第三丁基過氧化月桂酸酯、第三己基過氧化苯甲酸酯、第三丁基過氧化乙酸酯、第三丁基過氧化間甲苯醯基苯甲酸酯、第三丁基過氧化苯甲酸酯等過氧化酯類;第三己基過氧化異丙基單碳酸酯、第三丁基過氧化異丙基單碳酸酯、第三丁基過氧化2-乙基己基單碳酸酯等過氧化單碳酸酯類;雙-3,5,5-三甲基己醯基過氧化物、辛醯基過氧化物、月桂醯基過氧化物、硬脂醯基過氧化物、琥珀酸過氧化物、間甲苯醯基過氧化物、苯甲醯基過氧化物、對氯苯甲醯基過氧化物等二醯基過氧化物類;二枯基過氧化物、第三丁基枯基過氧化物等二烷基過氧化物類等。該等可使用1種或併用2種以上。The polymerization initiator which can be used at this time preferably has a 10-hour half-life temperature in the range of 60 to 120 °C. Such polymerization initiators are, for example, 2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis ( 2-methylbutyronitrile), 2,2'-azobis(2-methylpropionate), 2,2'-azobis(N-cyanohexyl-2-methylpropionamide), Azo such as 2,2'-azobis[N-(2-propenyl)-2-methylpropionamide]; 1,1,3,3-tetramethylbutyl peroxy-2-oxide Ethyl ester, 1-cyclohexyl-1-methylethylperoxide 2-ethyl hexanoate, dihexylperoxyperoxide 2-ethyl hexanoate, hexyl pentyl-peroxide 2-ethyl hexanoate Acid tert-butyl-peroxide 2-ethyl ester, tert-butyl-peroxide isobutyrate, tert-butylperoxide maleic acid, hexanoic acid third pentyl peroxide 3,5,5-three Methyl ester, butyl hexanoate peroxy 3,5,5-trimethyl ester, tert-butylperoxylaurate, third hexyl peroxybenzoate, tert-butyl peroxyacetate a peroxy ester such as t-butyl peroxym-toluoyl benzoate or t-butyl peroxybenzoate; a third hexylperoxy isopropyl monocarbonate and a third butyl group Peroxymonocarbonate such as isopropyl monocarbonate or tert-butylperoxy 2-ethylhexyl monocarbonate; bis-3,5,5-trimethylhexyl peroxide, octyl sulfhydryl Oxide, lauryl peroxide, stearyl peroxide, succinic peroxide, m-toluene peroxide, benzhydryl peroxide, p-chlorobenzoyl peroxide, etc. Dimethyl peroxides; dialkyl peroxides such as dicumyl peroxide and t-butyl cumyl peroxide. These may be used alone or in combination of two or more.

共聚物(I)中(甲基)丙烯酸酯(A)成分之配合量較佳為5~95質量%。如果(甲基)丙烯酸酯(A)成分之配合量落於上述範圍,則對於含倍半矽氧烷之化合物之耐熱性、透明性、機械強度方面有好處。更佳為5~50質量%。The amount of the (meth) acrylate (A) component in the copolymer (I) is preferably from 5 to 95% by mass. When the compounding amount of the (meth) acrylate (A) component falls within the above range, it is advantageous in terms of heat resistance, transparency, and mechanical strength of the compound containing sesquiterpene oxide. More preferably 5 to 50% by mass.

共聚物(I)中(甲基)丙烯酸酯(B)成分之配合量較佳為含羧酸單體為5~95質量%,更佳為50~70質量%,其他單體較佳為0~50質量%。The amount of the (meth) acrylate (B) component in the copolymer (I) is preferably from 5 to 95% by mass, more preferably from 50 to 70% by mass, based on the carboxylic acid-containing monomer, and the other monomer is preferably 0. ~50% by mass.

共聚物(I)之重量平均分子量較佳為1000~50000。如果重量平均分子量超過50000,則與三烷氧基矽烷化合物(C)共縮合時可能發生凝膠化,反之,如果低於1000,則含倍半矽氧烷之化合物之顯影速度可能會過快,造成鹼溶解度控制困難或者無法得到充分的耐熱性。更佳為4000~40000,又更佳為7000~30000。The weight average molecular weight of the copolymer (I) is preferably from 1,000 to 50,000. If the weight average molecular weight exceeds 50,000, gelation may occur when co-condensed with the trialkoxydecane compound (C), whereas if it is less than 1000, the development rate of the compound containing sesquiterpene may be too fast. This makes it difficult to control alkali solubility or to obtain sufficient heat resistance. More preferably, it is 4,000 to 40000, and more preferably 7,000 to 30,000.

本發明中,分子中可含有乙烯性碳-碳雙鍵之三烷氧基矽烷化合物(C)包括分子中含有乙烯性碳-碳雙鍵之三烷氧基矽烷化合物(C’)及分子中不含有乙烯性碳-碳雙鍵之三烷氧基矽烷化合物。分子中含有乙烯性碳-碳雙鍵之三烷氧基矽烷化合物(C’)例如有,3-甲基丙烯醯氧丙基三甲氧基矽烷、3-甲基丙烯醯氧丙基三乙氧基矽烷、3-丙烯醯氧丙基三甲氧基矽烷等(甲基)丙烯醯氧三烷氧基矽烷、乙烯基三甲氧基矽烷、對苯乙烯基三甲氧基矽烷等。該等可使用1種或併用2種以上。In the present invention, the trialkoxy decane compound (C) which may contain an ethylenic carbon-carbon double bond in the molecule includes a trialkoxy decane compound (C') having an ethylenic carbon-carbon double bond in the molecule and a molecule A trialkoxy decane compound which does not contain an ethylene carbon-carbon double bond. The trialkoxy decane compound (C') having an ethylenic carbon-carbon double bond in the molecule is, for example, 3-methylpropenyloxypropyltrimethoxydecane or 3-methylpropenyloxypropyltriethoxylate. (Meth) propylene decyloxyalkoxy decane, vinyl trimethoxy decane, p-styryl trimethoxy decane, etc., such as decane or 3-propenyl methoxypropyltrimethoxy decane. These may be used alone or in combination of two or more.

分子中不含有乙烯性碳-碳雙鍵之三烷氧基矽烷化合物例如有,苯基三甲基矽烷、甲基三甲氧基矽烷、2-(3,4環氧)環己基乙基三甲氧基矽烷、3-環氧丙氧基丙基三乙氧基矽烷、N-2(胺乙基)3-胺丙基三甲氧基矽烷、3-胺丙基三甲氧基矽烷、3-胺丙基三乙氧基矽烷、3-三乙氧基甲矽烷基-N-(1,3-二甲基-丁叉)丙胺、N-苯基-3-胺丙基三甲氧基矽烷、3-脲基丙基三乙氧基矽烷、3-氯丙基三甲氧基矽烷、3-巰基丙基三甲基矽烷、3-異氰酸酯丙基三乙氧基矽烷等烷基、芳基系官能基所構成單體,可選用至少1種以上。A trialkoxy decane compound having no ethylenic carbon-carbon double bond in the molecule, for example, phenyltrimethylnonane, methyltrimethoxydecane, 2-(3,4 epoxy)cyclohexylethyltrimethoxy Baseline, 3-glycidoxypropyltriethoxydecane, N-2 (aminoethyl) 3-aminopropyltrimethoxydecane, 3-aminopropyltrimethoxydecane, 3-aminopropane Triethoxy decane, 3-triethoxycarbamido-N-(1,3-dimethyl-butylidene) propylamine, N-phenyl-3-aminopropyltrimethoxydecane, 3- An alkyl group or an aryl functional group such as ureidopropyltriethoxydecane, 3-chloropropyltrimethoxydecane, 3-mercaptopropyltrimethylnonane, 3-isocyanatepropyltriethoxydecane At least one or more of the constituent monomers may be used.

共聚物(I)與三烷氧基矽烷化合物(C)之共縮合可依常法進行,藉由於酸性觸媒存在下使烷氧基甲矽烷基水解,並藉由矽醇基之脫水縮合反應形成矽氧烷鍵。此時配合之水量較佳為對烷氧基甲矽烷基之莫耳數,為1.0~3.0。如果配合莫耳數落於該範圍內,則所得到含倍半矽氧烷之化合物為主要含有籠狀構造之梯狀、無規狀等構造之混合物。The co-condensation of the copolymer (I) with the trialkoxy decane compound (C) can be carried out by a usual method, by hydrolyzing the alkoxymethyl hydrazine group in the presence of an acidic catalyst, and by dehydration condensation reaction of the decyl alcohol group. A siloxane chain is formed. The amount of water to be blended at this time is preferably a molar number of alkoxycarbenyl group, and is 1.0 to 3.0. When the molar ratio of the molar amount falls within the range, the obtained sesquioxanes-containing compound is a mixture of a ladder-like or random structure mainly containing a cage structure.

上述酸性觸媒可使用例如,鹽酸、硫酸、硝酸、乙酸、磷酸、硼酸、三氟乙酸、三氟甲磺酸、對甲苯磺酸等。也可以使用四丁基氟化銨、氟化鉀、氟化鈉等氟系化合物等。其配合量較佳為0.01~0.1重量%。As the above acidic catalyst, for example, hydrochloric acid, sulfuric acid, nitric acid, acetic acid, phosphoric acid, boric acid, trifluoroacetic acid, trifluoromethanesulfonic acid, p-toluenesulfonic acid or the like can be used. A fluorine-based compound such as tetrabutylammonium fluoride, potassium fluoride or sodium fluoride can also be used. The compounding amount is preferably from 0.01 to 0.1% by weight.

共縮合反應之反應溫度為40~80℃,反應時間較佳為3~12小時。The reaction temperature of the co-condensation reaction is 40 to 80 ° C, and the reaction time is preferably 3 to 12 hours.

本發明之含倍半矽氧烷之化合物的製造方法如上所述,係先進行丙烯酸系單體之共聚,再將烷氧基甲矽烷基水解與脫水縮合以進行共縮合,故(i)容易對目的化合物導入碳-碳雙鍵、(ii)藉由使用具有各種取代基之共聚單體,可以輕易地對目的化合物賦予所需的特性,因此,本方法對目的化合物之設計自由度極大。例如(甲基)丙烯酸酯(B)使用取代基為能對含倍半矽氧烷之化合物賦予鹼可溶性之官能基的(甲基)丙烯酸酯(b-1)、取代基為能對含倍半矽氧烷之化合物賦予耐熱性及耐候性中至少之一性質之官能基的(甲基)丙烯酸酯(b-2),可對目的化合物賦予鹼可溶性與耐熱性及耐候性其中至少之一的性質,並且,藉由使分子中具有乙烯性碳-碳雙鍵之三烷氧基矽烷化合物(C’)共縮合,可以對目的化合物賦予光聚合性。該種鹼可溶性之含倍半矽氧烷之化合物適於做為負型熱放射線性樹脂組成物。再者,如果三烷氧基矽烷化合物(C)使用由上述烷基、芳基系官能基所構成之單體,則適於做為正型熱放射線性樹脂組成物。The method for producing a sesquiterpene oxide-containing compound of the present invention is as described above, wherein the copolymerization of the acrylic monomer is carried out, and then the alkoxymethyl hydrazine is hydrolyzed and dehydrated to carry out co-condensation, so that (i) is easy. The introduction of a carbon-carbon double bond to the target compound and (ii) the use of a comonomer having various substituents can easily impart desired properties to the target compound, and therefore, the method has a great degree of freedom in designing the target compound. For example, the (meth) acrylate (B) uses a substituent which is a (meth) acrylate (b-1) capable of imparting an alkali-soluble functional group to a compound containing a sesquiterpene oxide, and the substituent is a double The (meth) acrylate (b-2) which imparts a functional group having at least one of heat resistance and weather resistance to at least one of heat resistance and weather resistance, and at least one of alkali solubility, heat resistance and weather resistance can be imparted to the target compound. Further, by co-condensing a trialkoxy decane compound (C') having an ethylenic carbon-carbon double bond in the molecule, photopolymerizability can be imparted to the target compound. The alkali-soluble sesquiterpene-containing compound is suitable as a negative-type thermal radiation linear resin composition. Further, when the trialkoxydecane compound (C) is a monomer composed of the above alkyl group or an aryl functional group, it is suitably used as a positive thermal radiation linear resin composition.

上述熱放射線性樹脂組成物中,可以配合光聚合起始劑(E)、交聯劑(F)及界面活性劑(G)。上述光聚合起始劑(E)例如有,硫咕噸酮、2,4-二乙基硫咕噸酮等硫咕噸酮類;4,4’-二甲胺基二苯甲酮、4,4’-二乙胺基二苯甲酮等二苯甲酮類;2,2-二乙氧基苯乙酮、2,2’-二甲氧基-2-苯基苯乙酮、2-甲基[4-(甲基硫)苯基]-2-嗎啉基-1-丙酮、2-芐基-2-二甲胺基-1-(4-嗎啉基苯基)-丁烷-1-酮等苯乙酮類;2-(4-甲氧基-1-萘基)-4,6-雙(三氯甲基)-s-三嗪等鹵化物;2,4,6-三甲基苯甲醯基二苯基膦氧化物等醯基膦氧化物類;及3,3’,4,4’-四(第三丁基過氧化羰基)二苯甲酮等過氧化物等。The photopolymerization initiator (E), the crosslinking agent (F), and the surfactant (G) may be blended in the above thermally radiation-linear resin composition. The photopolymerization initiator (E) is, for example, a thioxanthone such as thioxanthone or 2,4-diethylthioxanthone; 4,4'-dimethylaminobenzophenone, 4 , benzophenones such as 4'-diethylaminobenzophenone; 2,2-diethoxyacetophenone, 2,2'-dimethoxy-2-phenylacetophenone, 2 -methyl[4-(methylthio)phenyl]-2-morpholinyl-1-propanone, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)-butyl Acetophenones such as alkyl-1-ketones; halides such as 2-(4-methoxy-1-naphthyl)-4,6-bis(trichloromethyl)-s-triazine; 2,4, a mercaptophosphine oxide such as 6-trimethylbenzimidyldiphenylphosphine oxide; and 3,3',4,4'-tetrakis(t-butylperoxycarbonyl)benzophenone Oxide, etc.

上述光聚合起始劑(E)之配合量較佳為熱放射線性樹脂組成物全體之0.5~10重量%,更佳為1~5重量%。The amount of the photopolymerization initiator (E) is preferably from 0.5 to 10% by weight, more preferably from 1 to 5% by weight based on the total mass of the thermally radiation-linear resin composition.

上述交聯劑(F)例如有,二(甲基)丙烯酸1,6-己二醇酯、二(甲基)丙烯酸1,4-丁二醇酯、二(甲基)丙烯酸乙二醇酯、二(甲基)丙烯酸二乙二醇酯、二(甲基)丙烯酸四乙二醇酯、二(甲基)丙烯酸三丙二醇酯、二(甲基)丙烯酸新戊二醇酯、二(甲基)丙烯酸聚(丁二醇酯)、二(甲基)丙烯酸1,3-丁二醇酯、二(甲基)丙烯酸三乙二醇酯、二(甲基)丙烯酸三異丙二醇酯、二(甲基)丙烯酸聚乙二醇酯、二(甲基)丙烯酸聚丙二醇酯、雙酚A二(甲基)丙烯酸酯、三(甲基)丙烯酸三羥甲基丙烷、單羥基三(甲基)丙烯酸季戊四醇酯、三羥甲基丙烷三乙氧基三(甲基)丙烯酸酯、四(甲基)丙烯酸季戊四醇酯、二-三羥甲基丙烷四(甲基)丙烯酸酯、單羥基五(甲基)丙烯酸二季戊四醇酯、六(甲基)丙烯酸二季戊四醇酯、三聚異氰酸氧化乙烯(以下,稱EO)變性三(甲基)丙烯酸酯、三羥甲基丙烷EO變性三(甲基)丙烯酸酯、三羥甲基丙烷氧化丙烯變性三(甲基)丙烯酸酯、各種胺基甲烷酯多元(甲基)丙烯酸酯以及各種酯多元(甲基)丙烯酸酯等。該等多官能(甲基)丙烯酸酯單體或低聚物可以使用東亞合成(股)、日本化藥(股)之市售品。The above crosslinking agent (F) is, for example, 1,6-hexanediol di(meth)acrylate, 1,4-butylene glycol di(meth)acrylate, ethylene glycol di(meth)acrylate , diethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, di(a) Poly(butylene glycol) acrylate, 1,3-butylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, triisopropyl glycol di(meth)acrylate, Poly(ethylene glycol) (meth)acrylate, polypropylene glycol di(meth)acrylate, bisphenol A di(meth)acrylate, trimethylolpropane tris(meth)acrylate, monohydroxytris(methyl) Pentaerythritol acrylate, trimethylolpropane triethoxytri(meth) acrylate, pentaerythritol tetra(meth)acrylate, di-trimethylolpropane tetra(meth) acrylate, monohydroxy five ( Dipentaerythritol methyl methacrylate, dipentaerythritol hexa(meth) acrylate, ethylene oxide trimeric isocyanate (hereinafter referred to as EO) denatured tris(meth) acrylate, trimethylolpropane EO denatured three (a) ) Acrylate, propylene oxide modified trimethylolpropane tri (meth) acrylate, polyhydric esters of various aminomethane (meth) acrylate esters of polyols, and various (meth) acrylate. Commercially available products of East Asia Synthetic Co., Ltd. and Nippon Kayaku Co., Ltd. can be used as the polyfunctional (meth) acrylate monomer or oligomer.

上述交聯劑(F)之配合量較佳為熱放射線性樹脂組成物全體之20重量%以下,又更佳為10重量%以下。The amount of the crosslinking agent (F) is preferably 20% by weight or less, and more preferably 10% by weight or less based on the entire amount of the thermally radiation-linear resin composition.

上述界面活性劑(G)例如有,聚氧化乙烯月桂醚、聚氧化乙烯硬脂醚、聚氧化乙烯油醚等聚氧化乙烯烷醚類;聚氧化乙烯辛基苯醚、聚氧化乙烯壬基苯醚等聚氧化乙烯芳基醚類;聚氧化乙烯二月桂酸酯、聚氧化乙烯二硬脂酸酯等聚氧化乙烯二烷基酯非離子系界面活性劑;耶夫托普EF301、耶夫托普303、耶夫托普352(新秋田化成(股)製);美加法克F171、美加法克F172、美加法克F173(大日本墨水化學工業(股)製);夫洛拉得FC-430、夫洛拉得FC-431(住友3M公司(股)製);阿薩烯加得AG710、薩非隆S-382、薩非隆SC-101、薩非隆SC-102、薩非隆SC-103、薩非隆SC-104、薩非隆SC-105、薩非隆SC-106(旭硝子(股)製)等名稱市售之氟系界面活性劑;有機矽氧烷聚合物KP341(信越化學工業(股)製);(甲基)丙烯酸系共聚物波利夫羅第57號、95號(共榮社油脂化學工業(股)製)等。該等可使用1種或併用2種以上。The above surfactant (G) is, for example, polyoxyethylene alkyl ether such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether or polyethylene oxide oleyl ether; polyoxyethylene octylphenyl ether, polyoxyethylene decyl benzene Polyoxyethylene aryl ethers such as ether; polyoxyethylene dialkyl ester nonionic surfactants such as polyoxyethylene dilaurate or polyoxyethylene distearate; Yevtop EF301, Yevto 303, Yevtop 352 (New Akita Chemicals Co., Ltd.); US$F171, Mecca F172, Mecca F173 (Daily Ink Chemical Industry Co., Ltd.); Flora FC- 430, Flora FC-431 (Sumitomo 3M Co., Ltd.); Asadian Plus AG710, Safran S-382, Saflon SC-101, Saflon SC-102, Saflon SC-103, Saflon SC-104, Saflon SC-105, Saflon SC-106 (Asahi Glass Co., Ltd.) and other names of commercially available fluorine-based surfactants; organic siloxane polymer KP341 ( Shin-Etsu Chemical Co., Ltd.); (meth)acrylic copolymer Polyfro No. 57, No. 95 (manufactured by Kyoeisha Oil Chemical Industry Co., Ltd.). These may be used alone or in combination of two or more.

上述界面活性劑(G)係用以提高含有溶劑之本發明熱放射線性樹脂組成物的塗佈性。The above surfactant (G) is used to improve the coatability of the heat radiation linear resin composition of the present invention containing a solvent.

上述界面活性劑(G)之配合量較佳為熱放射線性樹脂組成物全體之2重量%以下,更佳為1重量%以下。The amount of the surfactant (G) to be added is preferably 2% by weight or less, and more preferably 1% by weight or less based on the total amount of the thermally radiation-linear resin composition.

於上述熱放射線性樹脂組成物中,在不損害本發明目的之範圍內,亦可配合其他成分。上述其他成分例如有,溶劑、抗靜電劑、保存安定劑、消泡劑、顏料、染料等。In the above thermally radiation-linear resin composition, other components may be blended insofar as the object of the present invention is not impaired. Examples of the other components include a solvent, an antistatic agent, a storage stabilizer, an antifoaming agent, a pigment, a dye, and the like.

上述溶劑例如有,甲醇、乙醇等醇類;四氫呋喃等醚類;乙二醇單甲醚、乙二醇單乙醚、乙二醇單丁醚、乙二醇二甲醚、二乙二醇單甲醚、二乙二醇單乙醚、二乙二醇單甲醚、二乙二醇單乙醚、二乙二醇單丁醚等二醇醚類;甲基2-乙氧基乙醇乙酸酯、乙基2-乙氧基乙醇乙酸酯、丁基2-乙氧基乙醇乙酸酯、丙二醇甲基醚乙酸酯、3-甲氧基丁基-1-乙酸酯等烷撐二烷單烷醚乙酸酯類;甲苯、二甲苯等芳香族烴類;甲乙酮、甲基異丁酮、甲基戊酮、環己酮、4-羥基-4-甲基-2-戊酮等酮類;2-羥基丙酸乙酯、2-羥基-2-甲基丙酸甲酯、2-羥基-2-甲基丙酸乙酯、乙氧基乙酸乙酯、羥基乙酸乙酯、2-羥基-2-甲基丁酸甲酯、3-甲氧基丙酸甲酯、3-甲氧基丙酸乙酯、3-乙氧基丙酸甲酯、3-乙氧基丙酸乙酯、乙酸乙酯、乙酸丁酯、乳酸甲酯、乳酸乙酯等酯類。該等溶劑可單獨使用1種,亦可混合2種以上使用。Examples of the solvent include alcohols such as methanol and ethanol; ethers such as tetrahydrofuran; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, ethylene glycol dimethyl ether, and diethylene glycol monomethyl. Ether, diethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether and other glycol ethers; methyl 2-ethoxyethanol acetate, B Alkenylene dialkyl such as 2-ethoxyethanol acetate, butyl 2-ethoxyethanol acetate, propylene glycol methyl ether acetate, 3-methoxybutyl-1-acetate An alkyl ether acetate; an aromatic hydrocarbon such as toluene or xylene; a ketone such as methyl ethyl ketone, methyl isobutyl ketone, methyl amyl ketone, cyclohexanone or 4-hydroxy-4-methyl-2-pentanone; Ethyl 2-hydroxypropionate, methyl 2-hydroxy-2-methylpropanoate, ethyl 2-hydroxy-2-methylpropionate, ethyl ethoxyacetate, ethyl hydroxyacetate, 2-hydroxy- Methyl 2-methylbutyrate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, acetic acid Ethyl ester, butyl acetate, methyl lactate, lactic acid Ester such as ethyl ester. These solvents may be used alone or in combination of two or more.

將上述熱放射線性樹脂組成物塗佈於基體表面,並以加熱除去溶劑,可形成塗膜。對基體表面塗佈感光性樹脂組成物時可使用旋塗法、輥塗法、浸泡法等習知周知的方法。接著,將該塗膜以加熱板、烤箱進行加熱(預烘烤)。The above-mentioned heat radiation linear resin composition is applied onto the surface of the substrate, and the solvent is removed by heating to form a coating film. When a photosensitive resin composition is applied to the surface of the substrate, a well-known method such as a spin coating method, a roll coating method, or a immersion method can be used. Next, the coating film is heated (prebaked) in a hot plate or an oven.

上述基體不特別限定,例如有各種電子零件或光學零件等之基板,具體而言,例如有形成於THT與透明電極間之透明絕緣膜,以及使用該等之液晶顯示元件、PDP等顯示元件、光學零件或光學元件中之基板等。The substrate is not particularly limited. For example, there are various substrates such as electronic components and optical components. Specifically, for example, there are transparent insulating films formed between THT and transparent electrodes, and display elements such as liquid crystal display elements and PDPs. A substrate or the like in an optical component or an optical component.

之後,將經預烘之塗膜上透過既定圖案之光罩照射紫外線等後,以顯影液顯影,除去不需要的部分後,可形成既定形狀之被膜。顯影液例如有,碳酸鈉、氫氧化鈉、氫氧化鉀等無機鹼類,及四甲基氫氧化銨、四乙基氫氧化銨等有機鹼類等之水溶液。又,亦可於上述鹼水溶液中適當添加甲醇、乙醇、界面活性劑等。顯影方法可使用浸泡法、噴淋法、噴霧法任一種,顯影時間通常為30~240秒,於顯影後以水流沖洗,並乾燥,可形成圖案。Thereafter, the pre-baked coating film is irradiated with ultraviolet rays or the like through a mask of a predetermined pattern, and then developed with a developing solution to remove unnecessary portions, thereby forming a film having a predetermined shape. Examples of the developing solution include inorganic bases such as sodium carbonate, sodium hydroxide, and potassium hydroxide; and aqueous solutions such as an organic base such as tetramethylammonium hydroxide or tetraethylammonium hydroxide. Further, methanol, ethanol, a surfactant, or the like may be appropriately added to the aqueous alkali solution. The developing method may be any one of a soaking method, a spraying method, and a spraying method, and the developing time is usually 30 to 240 seconds. After development, it is washed with a water stream and dried to form a pattern.

之後,將該圖案以加熱板、烘箱加熱(後烘烤)使未反應成分進一步交聯化,並同時完全除去溶劑,可得到既定的被膜圖案。後烘烤條件依各成分種類、配合比例而有不同,通常為180~220℃、如為加熱板則為5~30分鐘,如為烤箱則為30~90分鐘。Thereafter, the pattern is further heated by a heating plate and an oven (post-baking) to further crosslink the unreacted components, and at the same time, the solvent is completely removed, and a predetermined film pattern can be obtained. The post-baking conditions vary depending on the type of the ingredients and the mixing ratio, and are usually 180 to 220 ° C, for example, 5 to 30 minutes for the heating plate, and 30 to 90 minutes for the oven.

總括而言,可得到具有上述熱放射線性樹脂組成物之硬化層的電子零件或光學零件用基材。In summary, an electronic component or a substrate for an optical component having the hardened layer of the above-described thermally radiation-linear resin composition can be obtained.

以下舉實施例進一步詳細說明本發明,但本發明不限定於該等。The present invention will be further described in detail by the following examples, but the invention is not limited thereto.

實施例1Example 1

鹼可溶性含倍半矽氧烷之化合物D-1之合成於附有攪拌機、冷卻管、氮氣導入管及溫度計之燒瓶內加入六氫鄰苯二甲酸2-丙烯醯氧基乙酯6.1g、3-甲基丙烯醯氧丙基三甲氧基矽烷4.7g、甲基丙烯酸芐酯20.0g、2,2’-偶氮二異丁腈1.3g、β-疏基丙酸1.3g、甲苯137g,進行30分鐘氮氣清洗後,將燒瓶置於油浴後,於內溫80℃進行5小時之聚合反應。之後,冷卻至室溫,得到共聚物溶液。接著,於附有攪拌機、冷卻管、滴液漏斗及溫度計之燒瓶內加入所得到之聚合物溶液100g、3-丙烯醯氧丙基三甲氧基矽烷12.9g、甲基三甲氧基矽烷7.1g、異丙醇30g,於內溫70℃花30分鐘滴入由蒸餾水5g、36%鹽酸0.3g及其丙醇5g混合成之水溶液,進行反應3小時。冷卻至室溫後,加入吸附劑秋瓦得500(商品名,以下同)3g,攪拌15分鐘以中和。過濾後濃縮之,得到鹼可溶性含倍半矽氧烷之化合物D-146.4g。所得到樹脂之重量平均分子量(以下稱Mw)為17200。Synthesis of alkali-soluble sesquiterpoxy-containing compound D-1 6.1 g of propylene hexahydrophthalate hexahydrophthalate was added to a flask equipped with a stirrer, a cooling tube, a nitrogen introduction tube and a thermometer. - 4.7 g of methacrylic acid methoxypropyl trimethoxy decane, 20.0 g of benzyl methacrylate, 1.3 g of 2,2'-azobisisobutyronitrile, 1.3 g of β-mercaptopropionic acid, and 137 g of toluene. After nitrogen cleaning for 30 minutes, the flask was placed in an oil bath, and polymerization was carried out at an internal temperature of 80 ° C for 5 hours. Thereafter, it was cooled to room temperature to obtain a copolymer solution. Next, 100 g of the obtained polymer solution, 12.9 g of 3-acryloxypropyltrimethoxydecane, and 7.1 g of methyltrimethoxydecane were placed in a flask equipped with a stirrer, a cooling tube, a dropping funnel, and a thermometer. 30 g of isopropyl alcohol was added dropwise to an aqueous solution of 5 g of distilled water, 0.3 g of 36% hydrochloric acid and 5 g of propanol at an internal temperature of 70 ° C for 30 minutes, and the reaction was carried out for 3 hours. After cooling to room temperature, 3 g of an adsorbent Qiwalai 500 (trade name, the same applies hereinafter) was added, and the mixture was stirred for 15 minutes to neutralize. After filtration and concentration, the compound D-146.4 g of an alkali-soluble sesquiterpoxide was obtained. The weight average molecular weight (hereinafter referred to as Mw) of the obtained resin was 17,200.

實施例2Example 2

鹼可溶性含倍半矽氧烷之化合物D-2之合成於附有攪拌機、冷卻管、氮氣導入管及溫度計之燒瓶內加入六氫鄰苯二甲酸2-丙烯醯氧基乙酯6.1g、3-甲基丙烯醯氧丙基三甲氧基矽烷4.7g、丙烯酸異冰片酯20.0g、2,2’-偶氮二異丁腈1.3g、β-巰基丙酸1.3g、甲苯137g,進行30分鐘氮氣清洗後,將燒瓶置於油浴後,於內溫80℃進行5小時之聚合反應。之後,冷卻至室溫,得到共聚物溶液。接著,於附有攪拌機、冷卻管、滴液漏斗及溫度計之燒瓶內加入所得到之聚合物溶液100g、3-丙烯醯氧丙基三甲氧基矽烷6.5g、甲基三甲氧基矽烷13.5g、異丙醇30g,於內溫70℃花30分鐘滴入由蒸餾水5g、36%鹽酸0.3g及異丙醇5g混合成之水溶液,進行反應3小時。冷卻至室溫後,加入吸附劑秋瓦得500 3g,攪拌15分鐘以中和。過濾後濃縮之,得到鹼可溶性含倍半矽氧烷之化合物D-2 38.0g。所得到樹脂之Mw為15500。Synthesis of alkali-soluble sesquiterpene-containing compound D-2 6.1 g of propylene hexahydrophthalate hexahydrophthalate was added to a flask equipped with a stirrer, a cooling tube, a nitrogen introduction tube and a thermometer. - 4.7 g of methacrylic acid methoxypropyl trimethoxy decane, 20.0 g of isobornyl acrylate, 1.3 g of 2,2'-azobisisobutyronitrile, 1.3 g of β-mercaptopropionic acid, and 137 g of toluene, for 30 minutes After nitrogen purge, the flask was placed in an oil bath, and polymerization was carried out at an internal temperature of 80 ° C for 5 hours. Thereafter, it was cooled to room temperature to obtain a copolymer solution. Next, 100 g of the obtained polymer solution, 6.5 g of 3-acryloxypropyltrimethoxydecane, and 13.5 g of methyltrimethoxydecane were placed in a flask equipped with a stirrer, a cooling tube, a dropping funnel, and a thermometer. 30 g of isopropyl alcohol was added dropwise to an aqueous solution of 5 g of distilled water, 0.3 g of 36% hydrochloric acid and 5 g of isopropyl alcohol at an internal temperature of 70 ° C for 30 minutes, and the reaction was carried out for 3 hours. After cooling to room temperature, 500 3 g of adsorbent Qiwa was added and stirred for 15 minutes to neutralize. After filtration and concentration, 38.0 g of an alkali-soluble sesquiterpoxide-containing compound D-2 was obtained. The Mw of the obtained resin was 15,500.

實施例3Example 3

鹼可溶性含倍半矽氧烷之化合物D-3之合成於附有攪拌機、冷卻管、氮氣導入管及溫度計之燒瓶內加入六氫鄰苯二甲酸2-丙烯醯氧基乙酯6.1g、3-甲基丙烯醯氧丙基三甲氧基矽烷4.5g、甲基丙烯酸環己酯20.0g、β-巰基丙酸1.3g、2,2’-偶氮二異丁腈1.3g、甲苯137g,進行30分鐘氮氣清洗後,將燒瓶置於油浴後,於內溫80℃進行5小時之聚合反應。之後,冷卻至室溫,得到共聚物溶液。接著,於附有攪拌機、冷卻管、滴液漏斗及溫度計之燒瓶內加入所得到之聚合物溶液100g、甲基三甲氧基矽烷1.0g、3-丙烯醯氧丙基三甲氧基矽烷19.0g、異丙醇30g,於內溫70℃花30分鐘滴入由蒸餾水5g、36%鹽酸0.3g及異丙醇5g混合成之水溶液,進行反應3小時。冷卻至室溫後,加入吸附劑秋瓦得500 3g,攪拌15分鐘以中和。過濾後濃縮之,得到鹼可溶性含倍半矽氧烷之化合物D-3 44.0g。所得到樹脂之Mw為16800。Synthesis of alkali-soluble sesquiterpoxy-containing compound D-3 6.1 g of propylene hexahydrophthalate hexahydrophthalate was added to a flask equipped with a stirrer, a cooling tube, a nitrogen introduction tube and a thermometer. - methacrylic acid methoxypropyl trimethoxy decane 4.5 g, cyclohexyl methacrylate 20.0 g, β-mercaptopropionic acid 1.3 g, 2,2'-azobisisobutyronitrile 1.3 g, toluene 137 g, After nitrogen cleaning for 30 minutes, the flask was placed in an oil bath, and polymerization was carried out at an internal temperature of 80 ° C for 5 hours. Thereafter, it was cooled to room temperature to obtain a copolymer solution. Next, 100 g of the obtained polymer solution, 1.0 g of methyltrimethoxydecane, and 19.0 g of 3-propenyloxypropyltrimethoxydecane were placed in a flask equipped with a stirrer, a cooling tube, a dropping funnel, and a thermometer. 30 g of isopropyl alcohol was added dropwise to an aqueous solution of 5 g of distilled water, 0.3 g of 36% hydrochloric acid and 5 g of isopropyl alcohol at an internal temperature of 70 ° C for 30 minutes, and the reaction was carried out for 3 hours. After cooling to room temperature, 500 3 g of adsorbent Qiwa was added and stirred for 15 minutes to neutralize. After filtration and concentration, 44.0 g of an alkali-soluble compound of sesquioxane-containing compound D-3 was obtained. The Mw of the obtained resin was 16,800.

實施例4Example 4

鹼可溶性含倍半矽氧烷之化合物D-4之合成於附有攪拌機、冷卻管、氮氣導入管及溫度計之燒瓶內加入六氫鄰苯二甲酸2-丙烯醯氧基乙酯4.0g、3-甲基丙烯醯氧丙基三甲氧基矽烷4.5g、甲基丙烯酸二環戊酯23.0g、β-巰基丙酸1.3g、2,2’-偶氮二異丁腈1.3g、甲苯137g,進行30分鐘氮氣清洗後,將燒瓶置於油浴,於內溫80℃進行5小時之聚合反應。之後,冷卻至室溫,得到共聚物溶液。接著,於附有攪拌機、冷卻管、滴液漏斗及溫度計之燒瓶內加入所得到之聚合物溶液100g、甲基三甲氧基矽烷7.1g、3-丙烯醯氧丙基三甲氧基矽烷12.9g、異丙醇30g,於內溫70℃花30分鐘滴入由蒸餾水5g、36%鹽酸0.3g及異丙醇5g混合成之水溶液,進行反應3小時。冷卻至室溫後,加入吸附劑秋瓦得500 3g,攪拌15分鐘以中和。過濾後濃縮之,得到鹼可溶性含倍半矽氧烷之化合物D-4 38.0g。所得到樹脂之Mw為15300。Synthesis of alkali-soluble sesquiterpene-containing compound D-4 In a flask equipped with a stirrer, a cooling tube, a nitrogen introduction tube, and a thermometer, propylene hexahydrophthalate 2-propenyloxyethyl ester 4.0 g, 3 was added. - methacrylic acid methoxypropyl trimethoxy decane 4.5 g, dicyclopentanyl methacrylate 23.0 g, β-mercaptopropionic acid 1.3 g, 2,2'-azobisisobutyronitrile 1.3 g, toluene 137 g, After nitrogen purge for 30 minutes, the flask was placed in an oil bath, and polymerization was carried out at an internal temperature of 80 ° C for 5 hours. Thereafter, it was cooled to room temperature to obtain a copolymer solution. Next, 100 g of the obtained polymer solution, 7.1 g of methyltrimethoxydecane, and 12.9 g of 3-propenyloxypropyltrimethoxydecane were placed in a flask equipped with a stirrer, a cooling tube, a dropping funnel, and a thermometer. 30 g of isopropyl alcohol was added dropwise to an aqueous solution of 5 g of distilled water, 0.3 g of 36% hydrochloric acid and 5 g of isopropyl alcohol at an internal temperature of 70 ° C for 30 minutes, and the reaction was carried out for 3 hours. After cooling to room temperature, 500 3 g of adsorbent Qiwa was added and stirred for 15 minutes to neutralize. After filtration and concentration, 38.0 g of an alkali-soluble compound containing sesquiterpoxide was obtained. The Mw of the obtained resin was 15,300.

實施例5Example 5

鹼可溶性含倍半矽氧烷之化合物D-5之合成於附有攪拌機、冷卻管、氮氣導入管及溫度計之燒瓶內加入六氫鄰苯二甲酸2-丙烯醯氧基乙酯9.0g、3-甲基丙烯醯氧丙基三甲氧基矽烷4.7g、甲基丙烯酸第三丁基環己酯18g、β-巰基丙酸1.3g、2,2’-偶氮二異丁腈1.3g、甲苯137g,進行30分鐘氮氣清洗後,將燒瓶置於油浴,於內溫80℃進行5小時之聚合反應。之後,冷卻至室溫,得到共聚物溶液。接著,於附有攪拌機、冷卻管、滴液漏斗及溫度計之燒瓶內加入所得到之聚合物溶液100g、苯基三甲氧基矽烷7.1g、3-丙烯醯氧丙基三甲氧基矽烷12.9g、異丙醇30g,於內溫70℃花30分鐘滴入由蒸餾水5g、36%鹽酸0.3g及異丙醇5g混合成之水溶液,進行反應3小時。冷卻至室溫後,加入吸附劑秋瓦得500 3g,攪拌15分鐘以中和。過濾後濃縮之,得到鹼可溶性含倍半矽氧烷之化合物D-5 38.0g。所得到樹脂之Mw為16600。Synthesis of alkali-soluble compound containing sesquiterpene oxide D-5 9.0 g of hexahydrophthalic acid 2-propenyloxyethyl ester was added to a flask equipped with a stirrer, a cooling tube, a nitrogen introduction tube and a thermometer. - methacrylic acid methoxypropyl trimethoxy decane 4.7 g, butyl butyl cyclohexyl methacrylate 18 g, β-mercaptopropionic acid 1.3 g, 2,2'-azobisisobutyronitrile 1.3 g, toluene After 137 g of nitrogen purge for 30 minutes, the flask was placed in an oil bath, and polymerization was carried out at an internal temperature of 80 ° C for 5 hours. Thereafter, it was cooled to room temperature to obtain a copolymer solution. Next, 100 g of the obtained polymer solution, 7.1 g of phenyltrimethoxydecane, and 12.9 g of 3-propenyloxypropyltrimethoxydecane were placed in a flask equipped with a stirrer, a cooling tube, a dropping funnel, and a thermometer. 30 g of isopropyl alcohol was added dropwise to an aqueous solution of 5 g of distilled water, 0.3 g of 36% hydrochloric acid and 5 g of isopropyl alcohol at an internal temperature of 70 ° C for 30 minutes, and the reaction was carried out for 3 hours. After cooling to room temperature, 500 3 g of adsorbent Qiwa was added and stirred for 15 minutes to neutralize. After filtration, it was concentrated to give 38.0 g of the compound D-5, which was alkali-soluble sesquioxane. The Mw of the obtained resin was 16,600.

實施例6Example 6

將實施例1得到之鹼可溶性含倍半矽氧烷之化合物D-1 100重量份、依魯加秋亞9077重量份、DPHA(六丙烯酸二季戊四醇酯,日本化藥公司製)4重量份,及美加法克172 0.01重量份溶解於丙二醇單甲醚乙酸酯,使固體成分濃度為30重量%。將該溶液以孔徑0.2μm的毫米孔過濾器過濾,得到熱放射線性樹脂組成物。100 parts by weight of the alkali-soluble sesquiterpene-containing compound D-1 obtained in Example 1, 907 parts by weight of Iruga, and 4 parts by weight of DPHA (dipentaerythritol hexaacrylate, manufactured by Nippon Kayaku Co., Ltd.). 0.01 parts by weight of Mecoca 172 was dissolved in propylene glycol monomethyl ether acetate to have a solid concentration of 30% by weight. This solution was filtered through a millimeter-pore filter having a pore size of 0.2 μm to obtain a thermally radiation-linear resin composition.

實施例7Example 7

除將鹼可溶性含倍半矽氧烷之化合物(D-1)改為實施例2得到之鹼可溶性含倍半矽氧烷之化合物(D-2)以外,與實施例6以同樣方式操作,以得到熱放射線性樹脂組成物。The same procedure as in Example 6 was carried out except that the alkali-soluble sesquiterpene-containing compound (D-1) was changed to the alkali-soluble sesquiterpene-containing compound (D-2) obtained in Example 2. To obtain a thermally radioactive linear resin composition.

實施例8Example 8

除將鹼可溶性含倍半矽氧烷之化合物(D-1)改為實施例3得到之鹼可溶性含倍半矽氧烷之化合物(D-3)以外,與實施例6以同樣方式操作,以得到熱放射線性樹脂組成物。The same procedure as in Example 6 was carried out except that the alkali-soluble sesquiterpene-containing compound (D-1) was changed to the alkali-soluble sesquiterpene-containing compound (D-3) obtained in Example 3. To obtain a thermally radioactive linear resin composition.

實施例9Example 9

除將鹼可溶性含倍半矽氧烷之化合物(D-1)改為實施例4得到之鹼可溶性含倍半矽氧烷之化合物(D-4)以外,與實施例6以同樣方式操作,以得到熱放射線性樹脂組成物。The same procedure as in Example 6 was carried out except that the alkali-soluble sesquiterpene-containing compound (D-1) was changed to the alkali-soluble sesquiterpene-containing compound (D-4) obtained in Example 4. To obtain a thermally radioactive linear resin composition.

實施例10Example 10

除將鹼可溶性含倍半矽氧烷之化合物(D-1)改為實施例5得到之鹼可溶性含倍半矽氧烷之化合物(D-5)以外,與實施例6以同樣方式操作,以得到熱放射線性樹脂組成物。The same procedure as in Example 6 was carried out except that the alkali-soluble sesquiterpene-containing compound (D-1) was changed to the alkali-soluble sesquiterpene-containing compound (D-5) obtained in Example 5, To obtain a thermally radioactive linear resin composition.

比較例1Comparative example 1

除將鹼可溶性含倍半矽氧烷之化合物(D-1)改為漆用酚醛環氧基丙烯酸酯C-0011(日本化藥(股)製)以外,與實施例6以同樣方式操作,以得到熱放射線性樹脂組成物。The same procedure as in Example 6 was carried out, except that the alkali-soluble sesquiterpene-containing compound (D-1) was changed to phenolic epoxy acrylate C-0011 (manufactured by Nippon Kayaku Co., Ltd.). To obtain a thermally radioactive linear resin composition.

比較例2Comparative example 2

除將鹼可溶性含倍半矽氧烷之化合物(D-1)改為雙酚A型環氧基丙烯酸酯TCR-1122(日本化藥(股)製)以外,與實施例6以同樣方式操作,以得到熱放射線性樹脂組成物。The same procedure as in Example 6 except that the alkali-soluble sesquiterpene-containing compound (D-1) was changed to bisphenol A-type epoxy acrylate TCR-1122 (manufactured by Nippon Kayaku Co., Ltd.) To obtain a thermally radioactive linear resin composition.

熱放射線性樹脂組成物之評價Evaluation of thermal radiation linear resin composition

對實施例6~10及比較例1~2所得到熱放射線性樹脂組成物以如下項目評價,結果如表1所示。The thermally-radioactive linear resin compositions obtained in Examples 6 to 10 and Comparative Examples 1 and 2 were evaluated as follows, and the results are shown in Table 1.

1.薄膜之圖案化特性將實施例6~10及比較例1~2所得到熱放射線性樹脂組成物使用旋塗機塗佈於玻璃基板上後,於90℃之加熱板上進行120秒的預烘烤,得到膜厚約0.5μm之塗膜。接著,於具有塗膜之玻璃基板上設置具有既定圖案之光罩,使用250W之高壓水銀燈,於波長405nm照射光強度為9.5mW/cm2 之紫外線,使能量為1000mJ/cm2 。接著,使用2.38%四甲基氫氧化銨水溶液,於23℃進行60秒之顯影處理,除去塗膜之未曝光部,得到具有由殘留薄膜構成圖案之基板。評價依據如下基準。玻璃基板使用「康寧7059(康寧公司製)」。1. Patterning characteristics of the film The heat-radiating linear resin compositions obtained in Examples 6 to 10 and Comparative Examples 1 and 2 were applied onto a glass substrate using a spin coater, and then subjected to a hot plate at 90 ° C for 120 seconds. Prebaking was carried out to obtain a coating film having a film thickness of about 0.5 μm. Next, a photomask having a predetermined pattern was placed on a glass substrate having a coating film, and a high-pressure mercury lamp of 250 W was used to irradiate ultraviolet rays having a light intensity of 9.5 mW/cm 2 at a wavelength of 405 nm to have an energy of 1000 mJ/cm 2 . Subsequently, development treatment was carried out at 23 ° C for 60 seconds using a 2.38% aqueous solution of tetramethylammonium hydroxide to remove the unexposed portion of the coating film, thereby obtaining a substrate having a pattern composed of a residual film. The evaluation is based on the following criteria. "Corning 7059 (manufactured by Corning)" was used for the glass substrate.

(圖案形狀評價)◎:加熱前後沒有觀察到變化。○:加熱前後有觀察到些微變化。△:有相當的變化。(Pattern shape evaluation) ◎: No change was observed before and after heating. ○: Some slight changes were observed before and after heating. △: There is a considerable change.

2.光線穿透率對上述預烘烤得到之塗膜,使用日立製分光光度計U-2000測定分光穿透率。評價依據如下基準。2. Light Penetration Rate The coating film obtained by the above prebaking was measured for the spectral transmittance by using a Hitachi spectrophotometer U-2000. The evaluation is based on the following criteria.

○:最低穿透率為95%以上。×:最低穿透率為95%以下。○: The minimum penetration rate is 95% or more. ×: The lowest penetration rate is 95% or less.

3.耐熱性將上述1所得到具有圖案之基板於230℃加熱60分鐘,觀察圖案狀態(形狀、表面狀態),並觀察圖案之熱變形。比較加熱前與加熱後線形圖案之截面形狀。3. Heat resistance The substrate having the pattern obtained in the above 1 was heated at 230 ° C for 60 minutes, and the pattern state (shape, surface state) was observed, and the thermal deformation of the pattern was observed. The cross-sectional shape of the linear pattern before and after heating was compared.

○:加熱前後沒有觀察到變化。×:加熱前後有觀察到變化。○: No change was observed before and after heating. ×: A change was observed before and after heating.

4.耐熱變色性將上述1所得到具有圖案之基板於230℃加熱60分鐘,使用分光光度計(日立製分光光度計U-2000)於400~700nm之波長測定玻璃基板之穿透率。穿透率之變化依下式求出。4. Heat Discoloration Resistance The substrate having the pattern obtained in the above 1 was heated at 230 ° C for 60 minutes, and the transmittance of the glass substrate was measured at a wavelength of 400 to 700 nm using a spectrophotometer (Hitachi spectrophotometer U-2000). The change in the transmittance is determined by the following equation.

穿透率之變化=[(加熱前穿透率-加熱後穿透率]×100(%)○:穿透率之變化低於5%。×:穿透率之變化超過5%。Change in transmittance = [(transmission before heating - transmittance after heating] × 100 (%) ○: change in transmittance is less than 5%. ×: change in transmittance exceeds 5%.

5.鉛筆硬度將上述預烘烤所得到之塗膜於230℃加熱60分鐘,對所得到之硬化膜依據JIS-K-5400之試驗法測定鉛筆硬度。以使用鉛筆硬度試驗機施加9.8N負荷時硬化膜不會損傷之最高硬度定為鉛筆硬度。5. Pencil Hardness The coating film obtained by the above prebaking was heated at 230 ° C for 60 minutes, and the obtained cured film was measured for pencil hardness in accordance with the test method of JIS-K-5400. The highest hardness at which the cured film was not damaged when a load of 9.8 N was applied using a pencil hardness tester was defined as pencil hardness.

6.感度感度係依據灰度(Kodak Photographic StepTablet No.2)以於1000mJ/cm2 硬化之等級表示。數字愈大表示感度較高。6. Sensitivity is expressed in terms of hardening at 1000 mJ/cm 2 according to gradation (Kodak Photographic Step Tablet No. 2). The larger the number, the higher the sensitivity.

7.顯影性以掃描式電子顯微鏡觀察形成於矽晶圓上線寬0.5μm之L/S方形截面,評價基準如下。7. Developability The L/S square cross section formed on the tantalum wafer with a line width of 0.5 μm was observed by a scanning electron microscope, and the evaluation criteria were as follows.

○:圖案間沒有顯影殘留物。△:圖案間有部分顯影殘留物。×:圖案間有很多顯影殘留物。○: There is no development residue between the patterns. △: There is a partial development residue between the patterns. ×: There are many development residues between the patterns.

由實施例6~10可以得知,使用本發明之鹼可溶性含倍半矽氧烷之化合物的熱放射線性樹脂組成物在光線穿透性、耐熱性、圖案化特性、耐熱變色性方面特別良好,並且顯影性、感度方面能較習知技術比較例1及比較例2發揮更好的性能。It is understood from Examples 6 to 10 that the heat-radiating linear resin composition using the alkali-soluble sesquiterpene-containing compound of the present invention is particularly excellent in light transmittance, heat resistance, patterning property, and heat discoloration resistance. Further, in terms of developability and sensitivity, it is possible to exhibit better performance than Comparative Example 1 and Comparative Example 2 of the prior art.

產業上可利用性Industrial availability

本發明之含倍半矽氧烷之化合物不僅透明性、耐熱性良好,並且兼具良好的感度、解析度,適於做為於TFT與透明電極之間所形成的透明絕緣膜等熱放射線性樹脂組成物,也適用於液晶顯示元件及電漿顯示器面板(PDP)等之顯示元件,對於提升顯示元件之性能極為有利。並且,本發明之製造方法藉由於乙烯基單體之自由基共聚後接著進行三烷氧基矽烷之共縮合,可以輕易地對含倍半矽氧烷之化合物賦予鹼可溶性、耐候性、密合性、互溶性、難燃性、光聚合性等各種性質,能合成具有所需機能之含倍半矽氧烷之化合物,是極為有利的。The sesquioxane-containing compound of the present invention is excellent in transparency and heat resistance, and has good sensitivity and resolution, and is suitable as a thermal radiation linearity such as a transparent insulating film formed between a TFT and a transparent electrode. The resin composition is also suitable for display elements such as liquid crystal display elements and plasma display panels (PDPs), and is extremely advantageous for improving the performance of display elements. Further, the production method of the present invention can easily impart alkali solubility, weather resistance, and adhesion to a compound containing sesquiterpene oxide by radical copolymerization of a vinyl monomer followed by co-condensation of a trialkoxysilane. It is extremely advantageous to be able to synthesize a sesquiterpene-containing compound having a desired function, such as properties, miscibility, flame retardancy, photopolymerization and the like.

Claims (14)

一種用於TFT與透明電極間之透明絕緣膜之含倍半矽氧烷之化合物,係使得分子中具有三烷氧基甲矽烷基之(甲基)丙烯酸酯(A)與可具有取代基之(甲基)丙烯酸酯(B)共聚成共聚物(I),再使該共聚物(I)與分子中具有乙烯性碳-碳雙鍵的三烷氧基矽烷化合物(C’)共縮合而製得。 A sesquiterpene-containing compound for a transparent insulating film between a TFT and a transparent electrode, which has a (meth) acrylate (A) having a trialkoxycarbenyl group in the molecule and which may have a substituent The (meth) acrylate (B) is copolymerized into the copolymer (I), and the copolymer (I) is co-condensed with a trialkoxy decane compound (C') having an ethylenic carbon-carbon double bond in the molecule. be made of. 如申請專利範圍第1項之含倍半矽氧烷之化合物,其中(甲基)丙烯酸酯(B),係選自由具有可對含倍半矽氧烷之化合物賦予鹼可溶性之官能基做為取代基之(甲基)丙烯酸酯(b-1)、以及具有可對含倍半矽氧烷之化合物賦予耐熱性及耐候性中至少一種特性之官能基做為取代基之(甲基)丙烯酸酯(b-2)所構成群中至少1種。 A compound containing a sesquiterpene oxide according to claim 1, wherein the (meth) acrylate (B) is selected from the group consisting of a functional group capable of imparting alkali solubility to a compound containing a sesquiterpene oxide. (meth)acrylic acid ester (b), and (meth)acrylic acid having a functional group capable of imparting at least one of heat resistance and weather resistance to a compound containing sesquiterpene oxide as a substituent At least one of the groups consisting of the ester (b-2). 如申請專利範圍第2項之含倍半矽氧烷之化合物,其中,該(甲基)丙烯酸酯(b-1)含有羧基。 A compound containing sesquiterpene oxide according to item 2 of the patent application, wherein the (meth) acrylate (b-1) contains a carboxyl group. 如申請專利範圍第3項之含倍半矽氧烷之化合物,其中該(甲基)丙烯酸酯(b-1),係鄰苯二甲酸2-(甲基)丙烯醯氧基乙酯、六氫鄰苯二甲酸2-(甲基)丙烯醯氧基乙酯、丙烯酸β-羧基乙酯、單丙烯酸ω-羧基聚己內酯、或氧化乙烯變性琥珀酸丙烯酸酯。 The compound containing sesquiterpene oxide according to item 3 of the patent application, wherein the (meth) acrylate (b-1) is 2-(methyl) propylene methoxyethyl phthalate, six 2-(Methyl)propenyloxyethyl hydrogen phthalate, β-carboxyethyl acrylate, ω-carboxypolycaprolactone monoacrylate, or ethylene oxide-modified succinic acid acrylate. 一種含倍半矽氧烷之化合物,係使得分子中具有三烷氧基甲矽烷基之(甲基)丙烯酸酯(A)與可具有取代基之(甲基)丙烯酸酯(B)共聚成共聚物(I),再使該共聚物(I)與分子中具有乙烯性碳-碳雙鍵的三烷氧基矽烷化合物(C’)共縮合而製得; 該(甲基)丙烯酸酯(B),係選自由具有可對含倍半矽氧烷之化合物賦予鹼可溶性之官能基做為取代基之(甲基)丙烯酸酯(b-1)、以及具有可對含倍半矽氧烷之化合物賦予耐熱性及耐候性中至少一種特性之官能基做為取代基之(甲基)丙烯酸酯(b-2)所構成群中至少1種;該(甲基)丙烯酸酯(b-2),係(甲基)丙烯酸二環戊酯、(甲基)丙烯酸二環戊烯氧乙酯、(甲基)丙烯酸異冰片酯、9-甲基丙烯醯氧甲芴、或(甲基)丙烯酸四氫糠酯。 A compound containing a sesquiterpene oxide, which copolymerizes a (meth) acrylate (A) having a trialkoxycarbenyl group in a molecule with a (meth) acrylate (B) which may have a substituent Compound (I), which is obtained by co-condensing the copolymer (I) with a trialkoxy decane compound (C') having an ethylenic carbon-carbon double bond in the molecule; The (meth) acrylate (B) is selected from (meth) acrylate (b-1) having a functional group capable of imparting alkali solubility to a compound containing sesquiterpene oxide as a substituent, and At least one of the group consisting of a (meth) acrylate (b-2) having a functional group which imparts at least one of heat resistance and weather resistance to a compound containing sesquiterpene oxide; Acrylate (b-2), which is dicyclopentyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, isobornyl (meth)acrylate, 9-methylpropene oxide Formamidine, or tetrahydrofurfuryl (meth)acrylate. 如申請專利範圍第1項之含倍半矽氧烷之化合物,其中(甲基)丙烯酸酯(B),係選自由具有可對含倍半矽氧烷之化合物賦予密合性之官能基做為取代基之(甲基)丙烯酸酯(b-3)、具有可對含倍半矽氧烷之化合物賦予互溶性及疏水性中至少一性質之官能基做為取代基之(甲基)丙烯酸酯(b-4)、及具有可對含倍半矽氧烷之化合物賦予難燃性之官能基做為取代基之(甲基)丙烯酸酯(b-5)所構成群中至少1種。 A compound containing a sesquiterpene oxide according to claim 1, wherein the (meth) acrylate (B) is selected from a functional group having an adhesion to a compound containing a sesquiterpene oxide. a (meth)acrylic acid ester (b), a (meth)acrylic acid having a functional group capable of imparting at least one of a miscibility and a hydrophobic property to a compound containing a sesquiterpene oxide as a substituent At least one of the group consisting of the ester (b-4) and the (meth)acrylate (b-5) having a functional group capable of imparting flame retardancy to the compound containing sesquiterpene oxide as a substituent. 如申請專利範圍第1項之含倍半矽氧烷之化合物,其中三烷氧基矽烷化合物(C’),係(甲基)丙烯醯氧三烷氧基矽烷、乙烯基三甲氧基矽烷、或對苯乙烯三甲氧基矽烷。 A compound containing sesquiterpene oxide according to item 1 of the patent application, wherein the trialkoxy decane compound (C') is a (meth) propylene oxime methoxy decane, a vinyl trimethoxy decane, Or p-styrene trimethoxy decane. 如申請專利範圍第1項之含倍半矽氧烷之化合物,其為籠狀構造。 A compound containing sesquiterpene oxide according to item 1 of the patent application, which is a cage structure. 如申請專利範圍第1項之含倍半矽氧烷之化合物,其中,共聚物(I)中(甲基)丙烯酸酯(A)成分之配合量為5~95質量%。 The compound containing a sesquiterpene oxide according to the first aspect of the invention, wherein the amount of the (meth) acrylate (A) component in the copolymer (I) is from 5 to 95% by mass. 如申請專利範圍第1項之含倍半矽氧烷之化合物,其中,共聚物(I)之重量平均分子量為1000~50000。 The compound containing sesquiterpene oxide according to item 1 of the patent application, wherein the copolymer (I) has a weight average molecular weight of from 1,000 to 50,000. 一種熱放射線性樹脂組成物,其特徵在於,呈鹼可溶性且含有申請專利範圍第2項之含倍半矽氧烷之化合物。 A heat radiation linear resin composition characterized by being alkali-soluble and containing a compound containing sesquiterpene oxide of the second aspect of the patent application. 如申請專利範圍第11項之熱放射線性樹脂組成物,其含有光聚合起始劑(E)、交聯劑(F)及界面活性劑(G)。 The heat radiation linear resin composition of claim 11, which comprises a photopolymerization initiator (E), a crosslinking agent (F), and a surfactant (G). 一種電子零件或光學零件基材,其特徵在於,具有申請專利範圍第11項之熱放射線性樹脂組成物的硬化層。 An electronic component or optical component substrate characterized by having a hardened layer of a thermally radiating linear resin composition of claim 11 of the patent application. 一種用於TFT與透明電極間之透明絕緣膜之含倍半矽氧烷之化合物之製造方法,其特徵為:包括下述製程:(1)使得分子中具有三烷氧基甲矽烷基之(甲基)丙烯酸酯(A)與可具有取代基之(甲基)丙烯酸酯(B)進行共聚合,及(2)使得所得到之共聚物與分子中可具有乙烯性碳-碳雙鍵之三烷氧基矽烷化合物(C)進行共縮合。 A method for producing a sesquiterpene-containing compound for a transparent insulating film between a TFT and a transparent electrode, which comprises the following process: (1) having a trialkoxycarbenyl group in the molecule ( The methyl acrylate (A) is copolymerized with the (meth) acrylate (B) which may have a substituent, and (2) the obtained copolymer and the molecule may have an ethyl carbon-carbon double bond. The trialkoxydecane compound (C) is subjected to co-condensation.
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