SG10201606197XA - Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus - Google Patents
Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatusInfo
- Publication number
- SG10201606197XA SG10201606197XA SG10201606197XA SG10201606197XA SG10201606197XA SG 10201606197X A SG10201606197X A SG 10201606197XA SG 10201606197X A SG10201606197X A SG 10201606197XA SG 10201606197X A SG10201606197X A SG 10201606197XA SG 10201606197X A SG10201606197X A SG 10201606197XA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- holding apparatus
- substrate holding
- adsorption
- pressure control
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 6
- 238000000034 method Methods 0.000 title 3
- 238000001179 sorption measurement Methods 0.000 title 2
- 238000005498 polishing Methods 0.000 title 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015161187A JP6353418B2 (en) | 2015-08-18 | 2015-08-18 | Substrate adsorption method, top ring and substrate polishing apparatus |
JP2016097291 | 2016-05-13 | ||
JP2016134881A JP6463303B2 (en) | 2016-05-13 | 2016-07-07 | Elastic film, substrate holding device, substrate polishing device, substrate adsorption determination method and pressure control method in substrate holding device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201606197XA true SG10201606197XA (en) | 2017-03-30 |
Family
ID=58157772
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201606197XA SG10201606197XA (en) | 2015-08-18 | 2016-07-27 | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus |
Country Status (5)
Country | Link |
---|---|
US (2) | US10537975B2 (en) |
KR (1) | KR102134726B1 (en) |
CN (2) | CN106466806B (en) |
SG (1) | SG10201606197XA (en) |
TW (1) | TWI724010B (en) |
Families Citing this family (18)
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TWI628043B (en) * | 2014-03-27 | 2018-07-01 | 日商荏原製作所股份有限公司 | Elastic membrane, substrate holding apparatus, and polishing apparatus |
JP2017037918A (en) * | 2015-08-07 | 2017-02-16 | エスアイアイ・セミコンダクタ株式会社 | Polishing head, cmp polishing device having the same, and method of manufacturing semiconductor integrated circuit using the device |
SG10201606197XA (en) | 2015-08-18 | 2017-03-30 | Ebara Corp | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus |
US20170053822A1 (en) * | 2015-08-23 | 2017-02-23 | Camtek Ltd. | Warped wafers vacuum chuck |
JP6757696B2 (en) * | 2017-04-21 | 2020-09-23 | 株式会社荏原製作所 | A computer-readable recording medium that records a leak inspection method and a program for executing this leak inspection method. |
KR102397545B1 (en) * | 2017-05-02 | 2022-05-12 | 삼성전자주식회사 | Chuck stage particle detection device |
EP3457109B1 (en) * | 2017-07-18 | 2021-09-01 | Ias Inc. | Nozzle for substrate analysis and substrate analysis method |
JP7075814B2 (en) * | 2018-05-21 | 2022-05-26 | 株式会社荏原製作所 | Manufacturing method of substrate holding device, substrate polishing device, elastic member and substrate holding device |
KR20200016175A (en) | 2018-08-06 | 2020-02-14 | 가부시키가이샤 에바라 세이사꾸쇼 | Substrate holding apparatus, substrate adsorption measuring method, substrate polishing apparatus, substrate polishing method, method for removing liquid from top of polishing substrate, elastic membrane for pressing wafer to polishing pad, substrate release method and quantitative gas supply apparatus |
JP7158223B2 (en) * | 2018-09-20 | 2022-10-21 | 株式会社荏原製作所 | Polishing head and polishing equipment |
JP2020051944A (en) * | 2018-09-27 | 2020-04-02 | セイコーエプソン株式会社 | Electronic component conveyance device and electronic component inspection device |
US11152328B2 (en) * | 2018-12-13 | 2021-10-19 | eLux, Inc. | System and method for uniform pressure gang bonding |
JP2021091033A (en) * | 2019-12-10 | 2021-06-17 | キオクシア株式会社 | Polishing device, polishing head, polishing method, and manufacturing method of semiconductor device |
CN113118965B (en) * | 2019-12-31 | 2022-09-30 | 清华大学 | Substrate loading and unloading control method |
CN111863696A (en) * | 2020-08-05 | 2020-10-30 | 西安奕斯伟硅片技术有限公司 | Vacuum chuck, vacuum adsorption device and working method thereof |
JP1692349S (en) | 2020-12-18 | 2021-08-10 | ||
CN113878492A (en) * | 2021-10-08 | 2022-01-04 | 北京烁科精微电子装备有限公司 | Wafer fixing ring and CMP equipment with same |
CN114515995B (en) * | 2022-03-21 | 2023-12-29 | 上海江丰平芯电子科技有限公司 | Wafer polishing head and wafer adsorption method |
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JP5964064B2 (en) | 2012-01-31 | 2016-08-03 | 株式会社荏原製作所 | Substrate holding apparatus, polishing apparatus, and polishing method |
JP5875950B2 (en) | 2012-06-29 | 2016-03-02 | 株式会社荏原製作所 | Substrate holding device and polishing device |
JP5856546B2 (en) | 2012-07-11 | 2016-02-09 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
JP5973841B2 (en) | 2012-08-22 | 2016-08-23 | 日本特殊陶業株式会社 | Gas control apparatus and gas control method for electrostatic chuck |
JP6158637B2 (en) | 2012-08-28 | 2017-07-05 | 株式会社荏原製作所 | Elastic film and substrate holding device |
JP6161999B2 (en) * | 2013-08-27 | 2017-07-12 | 株式会社荏原製作所 | Polishing method and polishing apparatus |
JP2015082586A (en) | 2013-10-23 | 2015-04-27 | 株式会社荏原製作所 | Polish device and polish method |
US9662761B2 (en) | 2013-12-02 | 2017-05-30 | Ebara Corporation | Polishing apparatus |
JP6092086B2 (en) | 2013-12-02 | 2017-03-08 | 株式会社荏原製作所 | Polishing equipment |
JP6463303B2 (en) | 2016-05-13 | 2019-01-30 | 株式会社荏原製作所 | Elastic film, substrate holding device, substrate polishing device, substrate adsorption determination method and pressure control method in substrate holding device |
SG10201606197XA (en) | 2015-08-18 | 2017-03-30 | Ebara Corp | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus |
JP6353418B2 (en) | 2015-08-18 | 2018-07-04 | 株式会社荏原製作所 | Substrate adsorption method, top ring and substrate polishing apparatus |
-
2016
- 2016-07-27 SG SG10201606197XA patent/SG10201606197XA/en unknown
- 2016-08-02 TW TW105124413A patent/TWI724010B/en active
- 2016-08-11 KR KR1020160102483A patent/KR102134726B1/en active IP Right Grant
- 2016-08-11 US US15/234,058 patent/US10537975B2/en active Active
- 2016-08-18 CN CN201610688808.2A patent/CN106466806B/en active Active
- 2016-08-18 CN CN202010673067.7A patent/CN111775043B/en active Active
-
2019
- 2019-11-26 US US16/695,637 patent/US11472000B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN111775043B (en) | 2022-11-11 |
CN106466806B (en) | 2020-08-18 |
TW201707856A (en) | 2017-03-01 |
US10537975B2 (en) | 2020-01-21 |
US20170050289A1 (en) | 2017-02-23 |
CN106466806A (en) | 2017-03-01 |
US20200094372A1 (en) | 2020-03-26 |
TWI724010B (en) | 2021-04-11 |
US11472000B2 (en) | 2022-10-18 |
KR20170021741A (en) | 2017-02-28 |
KR102134726B1 (en) | 2020-07-16 |
CN111775043A (en) | 2020-10-16 |
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