MX2008005694A - Manufacturing method and device for making an in-mold circuit comprising a chip - Google Patents

Abstract

A poly sheet continuously moving in a machine direction is heated to a temperature just below its glass thermal temperature to make the poly malleable. A circuit (e.g., RFID chip, EAS chip, transponder, IC) is placed on the poly sheet and embedded into the poly sheet, preferably with a heat resistant soft (e.g., rubber) roller that presses the circuit into the poly without breaking the circuit. A conductive strip or wire may be applied on or into the poly sheet to align with connection points (e.g., conductive bumps) of the circuit for conductive communication with the circuit. The conductive strip or wire is preferably cut to form gaps that are nonconductive between the cut sections of wire to avoid shorting of the circuit and/or allow the conductive strip or wire to function as an antenna for the circuit, and thus to form a chip strap or tag. The poly sheet thus provides a protective womb or shield for the circuit and wire.

Description

CHIP UNION IN MOLD DESCRIPTION OF THE INVENTION This invention relates to communication devices and, in particular, to the manufacture of frequently used security labels, for example, as Radio Frequency Identification (RFID) circuits. The union of chips is expensive. The two largest components of the cost of RFID tags are currently the integrated circuit and the fixation of that circuit (otherwise known as silicon) to an antenna structure. Although the increasing volume of chips helps reduce the cost of Cl, the union is a mechanical process and does not benefit from the same technological advances or economic scale. Current chip-joining methods do not adequately address costs. A two-stage method of an intermediate chip band achieves a gradual improvement of costs by reallocating costs. However, the bands do not address the problem directly, since the union is still required, but to a smaller label. In addition, the bands add another step to join the band to the antenna structure. Current manufacturers that use standard bonding technology with bands want the bands to be similar to traditional bonding surfaces, as commonly found in circuit card technology, that is, rugged and inflexible. However, such bands are not conducive to easy integration into flexible labels (eg, RFID tags). The standard joining processes are all from known solutions based on band and, therefore, little ideals. A method of fixing the related technique, called Automatic Fluid Mounting (FSA), provides joints that are not strong enough. Because the chips find their own way to the binding receptacles, the chips can not use adhesives or fluidizing, since nothing sticky prevents free movement of the chips into the receptacles. With the automatic fluid assembly process, the connection is made on a tangent, between the chip joining area and the sides of the joint cavity. This union from plane to edge is different and less secure than the traditional joints, which are made from plane to plane. Automatic fluid assembly also imposes restrictions on the type of substrate that can be used. Automatic Fluid Mounting (FSA) does not create the joint, it only places labels on the appropriate carrier for its fixation. The current FSA method that is practiced uses stamped cut polyester and laminates another film over the top of the network with chips in place. Therefore, the posterior network is laser cut, leaving a hole in direct proximity and above the area of the chip joining area. This hole is filled with conductive ink and a trace is completed on the back side perpendicular to the hole that creates a band. The FSA process is slow and uses multiple stages and requires a high degree of accuracy with known technology products currently available. A known wire bonding process is described in U.S. Patent No. 5,708,419 to Isaacson, et al., The contents of which are hereby incorporated by reference in their entirety. Isaacson discusses the union of an Integrated Circuit (Cl) to a flexible or non-rigid substrate that usually can not be subjected to high temperatures, such as the temperature required to perform welding processes. In this bonding process, a chip or dye is fixed to a substrate or carrier with conductive wires. The chip is fixed to the substrate with the front side of the chip facing upwards. The conductive wires are first attached to the chip, then formed into a loop and attached to the substrate. The stages of a typical wire-joining process include: 1. advancing the network to the next binding site; 2. detention; 3. Take a digital photograph of the union site; 4. calculate the junction location; 5. pick up a chip; 6. move the chip to the binding site; 7. use the photo information to adjust the placement to the actual site location; 8. place or deposit the chip; 9. Photograph the chip to locate the joint areas; 10. move the head towards the chip joining area; 11. Press, vibrate and weld the conductive wire to the joint area; 12. remove and move the chip towards the area of attachment of the substrate, drag the thread back to the chip junction 13. press and weld that joint; 14. take out and cut the thread; and 15. repeat steps 10-14 for each connection. On the other hand, the interconnection between the chip and the substrate in a micropastilla packaging is carried out through conductive welding projections that are placed directly on the surface of the chip. The chip with projections is then turned and placed facing downwards, with the projections connecting in an electrical way to the substrate. The micropastilla junction, a current state of the art process, is costly due to the need to match each chip with a tiny, precisely cut cutting attachment site. As the chips become smaller, it becomes even more difficult to cut accurately and prepare the binding site. However, the micro-chip bonding process is a considerable advance over the wire bond. The steps of a typical micropaw binding process include: 1. advancing the network to the next binding site; 2. stop; 3. photograph the binding site; 4. calculate the junction location; 5. collect the chip; 6. move the chip to the binding site; 7. use photo information to adjust placement at the actual site location; 8. place the chip; 9. ultrasonically vibrating the positioning head to weld the chip in place; and 10. retract the placement head. Steps 1 to 8 for each of the above joining processes are substantially the same. The network must be stopped to locate the conductive air gap in the substrate and accurately place the Cl. The processes of the related art require that the network be stopped and measured (for example, when photographing the binding site, containing the binding location, using photograph information to adjust placement at the actual site location), such so that the chip can be placed exactly, as desired, adjacent to the air gap and joined. Re-tracing a trajectory during the joining process takes time, causes vibration and wears out the mechanical couplings. These links also create uncertainty in the absolute position. Rotating or continuous devices are preferred over reciprocating devices, partly because stopping and starting the manufacturing line always delays things and reduces production. It can be helpful to adjust the machining to operate in a process that is continuously advancing under the line at a known travel speed. There is a problem with current technology during chip placement in a dipole. Chips placed under an antenna structure, such as an aluminum band to form a bridge or RFID circuit, easily crack resulting in chip failure. One current solution is to use a non-conductive or fluidizing paste adhesive to fill the cracks caused during chip placement that helps protect the cracked chips from further damage. However, this solution does not solve the problem of chips that crack in the first place. It can be helpful to provide a solution that prevents chip cracking during chip placement. All references cited herein are incorporated herein in their entirety for reference. Preferred embodiments include a method for placing and integrating integrated circuits (ICs). The preferred method uses a continuous stream of ICs (eg chips) placed on a film, sheet or flexible layer based on poly (hereinafter referred to as "poly sheet") while the poly sheet is heated to a temperature less than or close to its vitreous thermal temperature, which is the temperature that melts the sheet of poli. In this state, the poly sheet remains stable, but allows a chip to be integrated into the poly sheet in precise increments. The chips can also be heated so that projections can be made more easily on the poly sheet. The poly sheet keeps the chip in place and a thread is added (or more if required) during the manufacturing process to form a connection to the chip. The wire can be integrated into the poly sheet opposite the chips to form the connection if the conductive areas (eg connection points, conductive projections) of the integrated chips are not exposed. Of course, the products manufactured with this method (for example, chip bands, integrated chips) can be reheated and molded for other plastics. According to an example of the preferred embodiments, the invention includes a manufacturing device for manufacturing an in-mold circuit. The manufacturing device includes a heater and a pressure station. The heater heats a sheet of poly (eg, polyester, polyurethane, polystyrene, etc.) that moves continuously along a machine direction until the poly sheet reaches a malleable condition. The pressure station is adjacent to the heating station and integrates the chip in place on the poly sheet in the heated poly sheet as the chips and the poly sheet move continuously in the direction of the machine. The preferred manufacturing device may also include a tape applicator adjacent to the pressure station which integrates a conductive tape into the poly sheet adjacent to the chips and into conductive communication with conductive areas of the chips as the conductive tape and the Poly foils move continuously along the machine direction to form an integrated conductive tape. The tape applicator may include a separation station that separates the conductor tape in portions of the conductive tape with non-conductive gaps between consecutive portions, and with respective consecutive portions of the conductive tape communicating conductively with respective chips integrated by The pressure station that connect the non-conductive air gap between the conductive portions. Another example of the preferred embodiments of the invention includes a method or means for manufacturing an in-mold circuit. The method includes continuously moving a poly sheet along a machine direction, heating the poly sheet moving continuously to a malleable condition and integrating the chips into the heated poly sheet as the Poly sheet moves continuously in the machine direction. The method for making an in-mold circuit can also include integrating a conductive tape into the poly foil and in conductive communication with the integrated chips as the conductive tape and the poly foil move continuously to form an integrated conductive tape . In addition, the method can also include separating the integrated conductive tape along the machine direction into portions of the conductive tape and forming non-conductive gaps between consecutive portions of the conductive tape with the consecutive portions that can be conductively communicated. with respective integrated chips that join the non-conductive air gaps. The chips can be placed on the top layer of the poly sheet before or after the poly sheet is heated to a malleable condition. Yet another example of the preferred embodiments includes a method for manufacturing an in-mold circuit. The method includes placing a circuit on a first side of a poly sheet and a thread on a second side of the poly sheet opposite the first side, place the circuit, poly and wire sheet between thermal plates, heat the poly sheet to a malleable condition, integrate the circuit on the first side of the heated poly sheet and the wire on the second side of the heated poly sheet , and create a conductive communication between the integrated circuit and the integrated wire to form the in-mold circuit. BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in relation to the following drawings, in which similar reference numerals designate similar elements, and wherein: Figure 1 is a side sectional view of a mold circuit and manufacturing device for chip setting, according to the preferred embodiments of the invention; Figure 2 is a top view of the mold circuit and chip setting method, according to the preferred embodiments; Figure 3 is a side sectional view illustrating an exemplary method for creating a non-conductive air gap; Figure 4 is a side sectional view illustrating another exemplary method for creating a non-conductive air gap; Figure 5 is a side sectional view of a portion of the exemplary method of Figure 4 at a different time; Figure 6 is a side sectional view of an exemplary mold circuit and chip setting method, according to another embodiment of the invention; Figure 7 is a side sectional view of the exemplary method of Figure 6; and Figure 8 is an exemplary result of the exemplary method of Figures 6 and 7. An exemplary embodiment for a chip-in-mold band and method for making a ribbon in a mold are shown in Figures 1 and 2. As can best be seen in the side section view of Figure 1, a manufacturing device 10 for manufacturing an integrated chip band includes a heater 12 and a rotating station 14 having two rollers 16 and 18, which integrates the chips 20 into a poly layer (for example, polymer, polyester, polyurethane, polystyrene, PVC), also referred to as a poly sheet 22, which moves continuously in a direction 24 of the machine. The polymer sheet 22 includes a first layer or side (for example upper side 28) and a second layer or side (for example lower side 32) opposite the first layer or side. In this embodiment, the chips 20 are placed on the polymer sheet 22 before the poly sheet is heated by the heater 12 just below its vitreous thermal temperature. However, the scope of the invention is not limited to this order, since the poly sheet 22 can also be heated just below its vitreous thermal temperature before or while placing the chips 20 on the poly sheet. Although not limited to a particular theory, preferred chips 20 are typically known in the industry as micro-chips and include conductive contact points (e.g., conductive projections 26) that are adapted to communicate conductively with an antenna structure, as will be set forth in greater detail in the following. As best seen in Figure 1, the chips 20 are placed on the poly sheet 22 preferably before the poly is heated by the heater 12. Thus, the chips 20 can be moved or slid around the sheet 22 of poly before the poly gets hot, which also restricts the lateral movement of the chips. To help prevent the placed chips 20 from slipping around the poly sheet 22 before reaching the heater, the chips 20 may otherwise adhere to the poly sheet. For example, the upper side 28 of the poly can be preheated prior to the placement of the chip to hold the chips, or an adhesive, varnish or ink can be added between the chips 20 and the upper side 28 for adhesiveness to hold the chips as can be easily understood by an experienced technician. After the chips are placed on the upper side 28 of the poly sheet 22, it is heated by the heater 12 just below its vitreous thermal temperature. Although not limited to a particular theory, the preferred heater 12 includes an oven 30 which causes the temperature of the poly sheet 22 to increase just below its vitreous thermal temperature (GT), for example, by applying heat, radiation or another energy to the poly sheet. The vitreous thermal temperature of the poly sheet is understood as the temperature at which the poly sheet is melted. In the preferred embodiments of the invention, the poly sheet 22 does not actually melt, but is heated to a temperature close to, but lower than its GT temperature which puts the poly sheet in a malleable condition to absorb the chips 20 that are intended to be inserted, that is, integrated into the poly sheet, but which allows the poly sheet to otherwise maintain its structural integrity, i.e., does not disintegrate. In the exemplary embodiment shown in Figure 1, the furnace 30 heats the poly sheet 22 to a malleable condition from which the chips 20 can be carefully integrated into the poly sheet without damaging the chips. As best seen in Figure 1, the chips 20 are placed on top of the poly sheet 22 and remain thereon as they move through the oven 30. The placed chips 20 and the poly sheet 22 are displaced continuously in the machine direction 24 through the rotary station 14, which includes the roller 16 adjacent the upper side 28 of the poly sheet, and a roller 18 adjacent the lower side 32 of the poly sheet. In Figure 1, the roller 16 rotates counterclockwise, and the second roller 18 rotates clockwise so that the surface of the rollers in contact with the poly sheet 22 rolls with the poly foil in the direction 24 of the machine. In this arrangement, rollers 16 and 18 can assist in advancing the poly sheet 22 in the machine direction, although the invention is not limited thereto. The rollers 16 and 18 are preferably made of a composition (for example rubber, plastic) which is resistant to deformation at the heated temperature of the poly sheet 22 and the chips 20. That is, the rollers 16, 18 are resistant to temperature and maintain their forms and functionality when exposed to the heated temperatures of the poly sheet and the chips. Preferably, the roller 16 is formed of a soft rubber composition that allows the roller to push the chips toward the poly sheet 22 without damaging the chips. The roller 18 provides support to the poly sheet 22 as the chips 20 are integrated into the poly sheet. Accordingly, the furnace 30 and rollers 16, 18 provide integrated mold chips and are protected by the poly sheet 22. Still with reference to Figure 1, the integrated chips 20 are therefore coupled in a conductive manner to a surface structure to form transponders, for example, EAS and RFID tags. Figure 1 shows a preferred method for coupling the integrated chips to an antenna structure with a chip fixing station 34 integrating one or more lines of yarn 40 through the second side 32 of the poly sheet 22 and in conductive communication with the conductive projections 26. The chip fixing station 34 includes rollers 36 and 38 which continuously move the poly sheet 22 along the machine direction 24 and places a wire 40 in conductive communication with the chips 20, as established in greater detail in the following. The chip fixing station 34 also includes a heater 42 (eg furnace) which heats the yarn 40 (e.g. tape, rod, conductive reel) to a temperature which softens the poly sheet 22 with the contact and which allows the roll 30 integrates the yarn into the sheet 22 of malleable poly by pushing the yarn towards the poly sheet. It is understood that this heater 42 is not required if the poly sheet 22 is still in its malleable condition from which it is heated by the furnace 30. If the poly sheet 22 is still in its malleable condition, then it may be that heating of the yarn 40 is not required since the roller 38 can integrate the yarn 40 into the poly sheet 22 as long as the poly sheet can be deformed to accept the yarn. The embodiment shown in Figure 1 includes the heater 42, which heats the yarn 40 to integrate the yarn 40 as also described in detail in US Patent Application No. 11 / 551,995, entitled INTEGRATED WIRE BRIDGE, which has the same inventor as the invention described in the present application and is incorporated herein in its entirety for reference. Still with reference to Figure 1, the chip setting station 34 also includes an alignment unit 44 which aligns the yarn 40 at a predetermined position to help control its lateral and transverse placement on the poly sheet 22. Although not limited to a particular theory, the chip setting station 34 of the manufacturing device 10 also includes a separation station 46 that longitudinally separates the yarn 40 along the machine direction into yarn ribbons 48. with non-conductive gaps 50 between consecutive strands of yarn, as will be described by way of example in greater detail in the following. The non-conductive gaps 50 are formed between the conductive projections 26 of the chips 20 and allow the conductive wire 40 to be used as an antenna for the respective chip 20 which joins the non-conductive gap to form a chip band or label. At some later point the yarn tapes 48 are cut, for example by a cutter 52 to separate the bands or chip labels for subsequent use. In operation, the poly sheet 22 travels in the direction 24 of the machine through the manufacturing device 10. Furnace 30 heats the poly sheet 22 to a malleable condition where it can be deformed by an external force, but does not otherwise lose its structural integrity. The roller 16 integrates the chips 20 on the upper side 28 of the poly sheet 22, and the roller 38 integrates the wire 40 on the lower side 32 for conductive communication with the chips. The rollers 36, 38 are preferably formed of a strong rubber or a metal capable of gripping the poly sheet to advance the sheet continuously. The roller 38 is preferably made of a material or composition that is strong enough to push the yarn 40 toward the poly sheet 22 and is temperature resistant so that it does not deform or otherwise be affected in a manner adverse to the temperature of the heated poly sheet, integrated chips 20 and / or yarn. Thus, as with the rollers 16, 18, the shapes of the rollers 36, 38 are not compromised by the temperature of the chips 20, the poly sheet and the yarn 40 in contact with the rollers, including temperatures high enough to melt or soften the poly sheet and allow its deformation to accept the chips and the yarn. The poly sheet 22 becomes a protective carrier for the chips 20 and the yarn 40, preventing unwanted damage of the integrated products. The alignment unit 44 and the heater 42 (if required) prepare the wire 40 for its exact and consistent placement on the poly sheet 22, preferably against the conductive projections 26 of the chips. In this example, the heating station 42 heats the yarn 40 as is easily understood by an experienced technician, for example by applying heat, radiation or other energy to the yarn and by causing the yarn temperature to rise to a temperature sufficient to melt or softening the poly sheet 22 in contact with the yarn and allowing the poly sheet to deform and accept the yarn when the yarn is pushed towards the poly sheet by the roller 38. The alignment unit 44 includes slots or openings to allow The yarn 40 passes through so that the yarn is aligned, as desired, to be integrated into the poly sheet at a precise location. Preferably, the aligned location of the wire is established to correspond to the conductive projections of the integrated chips. The alignment alignment unit 44 is preferably located adjacent the roller 38, as required, to prevent the yarn 40 from moving from its aligned position before being integrated into the poly sheet 22. It will be understood that the alignment unit 44 is not limited to an independent unit, since it can be attached to either a part of the heater 42 or a part of the roller 38 as long as the alignment unit allows the alignment of the wire that is integrated into the unit. poly foil Still referring to Figure 1, the yarn 40 is shown as originating as a wound reel of conductive tape which is unwound to arrange the yarn towards the poly sheet 22. It is understood that the shape of the yarn origin is not crucial to the invention, since the spool of yarn is only an example of where the yarn comes from. Accordingly, the wire 40 can reach the heating station 42 or the alignment unit 44 from other sources, as can be easily understood by an experienced technician. As is well known in the art, a chip or circuit having multiple conductive contact points fixed to a unitary conductor can cause a short circuit if there is no conductive gap between the contact points of the chip. Accordingly, after the yarn 40 is integrated into the poly sheet 22, the yarn is separated into two ribbons 48. In particular, a separation station 46 cuts the yarn 40 integrated between the conductive projections 26 of the integrated chips 20. as the integrated yarn and chips move continuously with the poly sheet 22 in the direction 24 of the machine. When cutting the wire, the separation station creates non-conductive gaps 50 which inhibit conductive communication between separate, separate wire tapes 48, which allows the tapes to be used as an antenna for the chips. Figure 2 is a partial top view of the manufacturing device 10, according to the preferred embodiments. Although not limited to a particular theory, the exemplary embodiment shown in Figure 2 illustrates how the manufacturing device can simultaneously integrate and fix multiple chip numbers. For example, chips aligned in rows (for example three chips per row) are placed simultaneously on the poly sheet 22 as the sheet moves continuously in the machine direction 24. The poly sheet 22, together with the integrated chips, it is heated just below its vitrea thermal temperature by the oven 30, and the chips 30 are integrated into the poly sheet by the roller 16, as described above. The roller 38 integrates a plurality of lines (for example six) of the conductive wire 40 on the second side 32 of the poly sheet 22 and in conductive communication with the integrated chips 20. The lines of the integrated yarn 40 are shown as dotted lines in Figure 2 since they are integrated into the second surface 32 of the poly sheet 22 opposite the upper side 28 which is directly visible by the top view. The separation station 48 creates the air gaps 50 in the wire 40 integrated with the non-conductive air gaps, as discussed above. In forming the air gaps 50, the separation station 46 also defines the wire tapes 48 which remain in the poly sheet 22 and extend to the conductive projections 26 of the respective integrated chips 20. To help secure the yarn tapes 48 to the integrated chips 20, the tapes can be attached to the conductive projections 26, preferably by compression and heat, as is well known in the art, to form a mechanical bond therebetween.

Although not limited to a particular theory, the exemplary embodiment shown in Figure 2 illustrates a plurality of chips (for example three) placed side by side on the poly sheet and moving simultaneously from one place to another. In other words, the chips 20 in each row move together through the furnace 30, are integrated simultaneously into the polymer sheet 22 by the roller 16, are attached to the yarn lines 40, and so on. The yarn lines 40 (for example six, as shown in Figure 2 with two lines per longitudinal column of chips) are separated by the alignment unit 44 and are integrated simultaneously in parallel by the roller 38 in the sheet 22 of poly as the poly sheet moves continuously in the direction 24 of the machine. As can be seen in Figures 1 and 2, after the yarn lines 40 are integrated by the roller 38, the yarn lines are cut by the separation station 46, which forms non-conductive gaps 50 between strands 48 of yarns. consecutive in each line. The yarn lines also align with the conductive projections 26 of the chips 20 by the alignment unit 44 for conductive communication with the chips by the conductive projections that are attached to the yarn ribbons. It should be noted that the size of the chips 20 and the number of conductive projections 26 of the chips is not crucial to the invention, and are shown only as an example of a preferred embodiment. It is understood that the yarn lines 40 are integrated to allow the yarn to align with the conductive projections 26 with air gaps 50 formed as desired by the separation station 46. For example, a chip 20 having two conductive projections 26 can be attached to consecutive strands 48 of a single line of wire 40. In addition, a chip 20 having four conductive projections 26 can preferably be attached to adjacent strands 40 of wire, separate and originating from two lines of yarn 40, as shown by way of example in Figure 2. In other words, the number of yarn lines integrated in the poly sheet 22 corresponds to the number and configuration of projections 26 conductive chips 20 that intend to be attached to the wire, as can be easily understood by an experienced technician. As noted in the above, the separation station 46 cuts through the integrated wire 40 to form the conductive gaps 40. The wire 40 must be completely removed in the air gap 50 to avoid the risk of the wire short-circuiting the chip subsequently. There are several ways to create the air gap 50. A preferred method is with a laser that literally vaporizes unwanted metal. Lasers are preferred because the laser cutters can perform a precise cut without mechanically touching the network (eg, the poly sheet 22 and the integrated yarn 40). Laser cutters are well known in the art for separating yarn. The separation station 46 can also form a non-conductive air gap 50 in the yarn 40 by using a known method called "incision cut" achieved with one or more cutting blades. Other methods for forming a conductive air gap in the wire 40 are discussed in the following with reference by way of example to Figures 3 and 4. However, it should be noted that either by laser, incisal cutting, the methods discussed in the following or a equivalent method, the cutting section 46 of the preferred embodiments can make this cut without ever reducing the speed of the poly sheet 22. That is, the poly sheet 22 travels continuously during the placement of the chip, dipole fixation and air gap formation, for example, at flexographic printing speeds. In addition, the cut is made within the tolerance allowed by small transponders, including RFID chips, which have a size of, for example, about 100 microns or less. The tolerance allowed to create an air gap between contact points of such a transponder (eg, conductive projections 26 of the chips 20) is less than about 80 microns, and more preferably, less than about 20 to 30 microns. Still another method for cutting the integrated yarn 40 is illustrated in Figure 3. As shown in Figure 3, the separation station 46 includes a roller 60 having a blade 62 extending outwardly from the perimeter of the roller to a 64 sharp edge. The blade 62 is adapted to rotate with the roller 60 and engage with and cut through the integrated yarn 40 as the yarn travels with the poly sheet 22 continuously along the machine direction 24. Preferably, the blade 62 extends from the perimeter of the roller 60 to a length that allows the blade to cut through the wire 40, but not up to the integrated chip 20 opposite the wire, such that the chip is not damaged. In operation, the blade 62 cuts through the wire 40 and into contact with the poly of the poly sheet between the integrated wire and the chip 20, but the blade does not cut and preferably does not touch the chip. The separation station 46 in Figure 3 also includes a roller 66 located on the upper side 28 of the poly sheet 22, opposite the roller 60, and provides a support or backing for the poly sheet as the knife 62 cuts the wire 40 to form the non-conductive air gaps 50. Accordingly, the roller 60 aided by the roller 66 cuts the yarn 40 integrated in the yarn tapes 48. Yet another preferred example of the separation station 46 is shown in Figure 4. In this method, the separation station 46 includes a cutter 70 located adjacent the bottom side 32 of the poly sheet 22. The cutter 70 includes a blade or cutting member adapted to cut the thread 40 that extends below the bottom side 32 of the poly sheet 22 as described in greater detail in the following. Figure 4 also illustrates the roller 16 shown in Figure 1, and a roller 18A. The roller 18A is a rolling member alternative to the roller 18 shown in Figure 1 and is somewhat similar to the roller 18 in its purpose and material. The roller 18A includes an arcuate portion 72 that integrates the yarn 40, as described above for the roller 18. However, the roller 18A also includes a flat portion 74 that does not extend radially toward the periphery of the arcuate portion 72. of roll 18A. In operation, since the roller 18A rotates or rotates in the direction of the rotation arrow 76, the arcuate portion 72 integrates the yarn 40 into the malleable poly sheet 22 by pushing the yarn 40 toward the poly sheet. However, the flat section 74 does not push the yarn towards the poly sheet. In contrast, as can best be seen in Figure 5, the yarn 40 remains below the poly sheet 22 while the flat section 74 of the roller 18A is oriented towards the poly sheet. The yarn 40 that is not integrated remains below the poly sheet 22 as a section 78 of exposed yarn. As the roller 18A continues its rotation, the arcuate portion 72 integrates the yarn 40 again by pushing it towards the malleable poly sheet. This periodic integration of the yarn 40 continues as the roller 18A rotates with the poly sheet 22 moving continuously along the machine direction 24. Referring now to Figure 4, the cutter 70 cuts the sections 78 of exposed wire under the lower side 32 of the poly sheet 22 as the poly sheet advances in the machine direction 24 to create the air gaps 50 not conductive and integrated yarn tapes 48. Alternatively, the exposed thread can be recorded away after alternately integrating the yarn to protect the integrated yarn. Figures 6-8 represent still another embodiment of the invention. Although it is not limited to a particular theory, the embodiment includes a method for providing encapsulated or integrated chip bands, similar to the more preferred modes discussed in the foregoing. In particular, the embodiment exemplified in Figures 6-8 shows a method for providing chip-in-mold webs that is not automated as the methods of the most preferred embodiments. As best seen in the side cut view of Figure 6, a manufacturing device 100 for manufacturing an integrated chip band includes a heater 102 having thermal plates 104 that heat the temperature of the poly sheet 22 'to a temperature just below its vitrea thermal temperature (GT), for example, by applying heat, radiation or other energy to the poly sheet. The poly sheet 22 'can be a roll of polymeric or plastic film (for example, polymer, polyester, polyurethane, polystyrene, PVC), as discussed above, or a sheet thereof since the dimensions of the Poly foils are not crucial for the modality. Preferably, the poly sheet 22 'is digested to at least partially integrate the chips 20 and the yarn 40 and provide structural integrity to the resulting integrated chip band. The thermal plates 104 form a plate-like press on opposite sides of the polymer sheet 22 'and preferably include a non-stick surface (eg Teflon) 106, 108 on respective inner edges, adjacent to the poly sheet. To manufacture the integrated chip strips, for example, the thermal plates 104 are arranged to apply heat and pressure to the chips, yarn 40 and sheet 22 'of poly, with the heat rendering the poly sheet malleable, and the pressure pushing the chips 20 and the yarn towards the poly sheet. As can best be seen in Figure 6 (before pressing) and Figure 7 (after pressing), the thermal plates heat the polymer sheet 22 ', the thermal sheet 104 with the non-stick surface 106 presses the chips 20 to the side 28 of the malleable poly sheet, and the thermal pad 104 with the non-stick surface 108 presses the yarn 40 (or yarn tapes 48) to the bottom side 32 of the malleable poly sheet. Preferably, the conductive projections 26 of the chips are aligned with the wire 40, 48 so that the thermal platens 104 press the conductive projections in contact with the wire and thereby provide conductive communication between the chips and the wire. Figure 8 depicts the resulting poly sheet 22 'which integrates the chips 20 and the yarn 40 in conductive communication after removal of the manufacturing device 100. Although not limited to a particular theory, the removal of the integrated chips 20, yarn 40 and sheet 22 'of poly benefits from the non-stick surfaces 106, 108 since no adhesion of the poly sheet to the thermal plates 104 is mitigated by non-stick surfaces. The yarn 40 can be pre-cut between the conductive projections 26 to form non-conductive air gaps prior to the integration step described above and after the integration step. Preferably, the non-conductive air gaps 50 are formed prior to the integration of the chips and the wire 48, as shown in the right-hand portion of Figure 8, since it is safer to cut the wire without concern of damaging a fixed chip. . The chip band shown in the left side portion of Figure 8 still requires an air gap in the wire between the conductive air gaps of the chip set to prevent chip shorting. Of course, the non-conductive gaps 50 can be provided by the separation station 46 in the manner discussed in the foregoing, or as known to an experienced technician. Although not limited to a particular theory, the preferred embodiments of the invention provide a mold circuit integrated in a continuous moving poly sheet. It has been discovered that connect the conductive projections of the chips to independent wire lines, as shown for example in Figure 2, minimizes the unwanted parasitic capacitance between the chip circuit and its antenna structure, especially on chips fixed to simple antenna bands. The parasitic capacitance becomes more relevant when the chip is used with higher frequencies (for example UHF or higher). When a chip is coupled to an antenna structure, any nearby conductive material is important since it can create unwanted capacitance which decreases the frequency of tuning. The circuit fabricated by the device and method of manufacture described herein provides the additional benefit of minimizing parasitic capacitance by minimizing conductive overlap around the bonding sites between the chip and its antenna structure. In fact, the preferred diameter of the wire 40 is smaller than the diameter of the conductive projections 26 of the chips 20 to further minimize the conductive overlap. Although not limited to a particular theory, the preferred depth of the poly-sheet 22 is approximately 50-75 microns; the preferred depth of the chips is approximately 25-60 microns; and the preferred diameter of the wire 40 is about 15-40 microns. However, it is understood that the measurements of the poly sheet, chips and yarn are not crucial to the invention since other measures can be used and are considered within the scope of the invention. Preferably, the depth of the poly sheet 22 is greater than the depth of the chips and is approximately equal to the chips and the diameter of the yarn. 40 combined. The yarn is preferably not insulated and is formed of a conductive material (for example gold, aluminum, copper). It is understood that the method and apparatus for manufacturing in-mold circuits described herein are exemplary indications of preferred embodiments of the invention, and are provided by way of illustration only. In other words, the concept of the present invention can be easily applied to a variety of preferred embodiments, including those described herein. Although the invention has been described in detail and with reference to specific examples thereof, it will be apparent to one skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope thereof. For example, the poly sheet 22 can be heated with the chips placed on top, or the poly sheet can be heated before the chips are placed. Further, the scope of the invention is not limited to the illustrated spatial orientations, and the inventive apparatus functions for its intended purpose even if it is oriented in an inverted manner or in some other relationship with the orientation of the apparatus described by way of example herein. It is also important to note that the products described in the above can be reheated and molded to other plastics. Without further amplification, the foregoing will fully illustrate the invention that others may readily adapt, upon applying current or future knowledge, to it for use under various service conditions.

Claims (29)

1. CLAIMS 1. A manufacturing device for manufacturing a circuit in a mold, characterized in that it comprises: a heater that heats a poly sheet that moves continuously along a machine direction to a malleable condition; and a pressure station adjacent to the heating station, the pressure station integrates circuits placed on the poly sheet in the heated poly sheet as the circuits and the poly sheet move continuously in the direction of the machine, the circuits have a surface that includes conductive areas and non-conductive areas. The manufacturing device according to claim 1, further characterized in that it comprises a tape applicator adjacent to the pressure station, the tape applicator integrates a conductive tape into the poly sheet adjacent to the surface and in conductive communication with the the conductive areas of the circuit surface as the conductive tape and the poly sheet move continuously along the machine direction to form an integrated conductive tape. 3. The manufacturing device according to claim 2, further characterized in that it comprises a heating station adjacent to the tape applicator, the heating station heats the conductive tape to be integrated in the poly sheet. The manufacturing device according to claim 2, further characterized in that it comprises an alignment unit having spacers that align the conductive tape with the conductive areas of the surface. The manufacturing device according to claim 2, characterized in that the tape applicator includes a separation station that separates the conductive tape into portions of the conductive tape, the separation station forms non-conductive air gaps between consecutive portions of the tape conductive with respective consecutive portions that can be communicated in conductive form with respective integrated circuits, in such a way that the respective integrated circuit joins the respective non-conductive air gap between respective consecutive portions. The manufacturing device according to claim 5, characterized in that the separation station includes a laser that periodically separates the integrated conductive tape adjacent to the non-conductive areas of the surface of the integrated circuits in the poly foil. form the non-conductive air gaps. The manufacturing device according to claim 5, characterized in that the separation station includes a blade that mechanically cuts the integrated conductive tape adjacent to the non-conductive areas of the surface of the integrated circuits in the poly foil. form the non-conductive air gaps. The manufacturing device according to claim 5, characterized in that the separation station includes a cutting station that cuts the integrated conductive tape between consecutive circuits integrated in the poly sheet moving continuously along the address of the machine. The manufacturing device according to claim 8, characterized in that the cutting station includes a rotating station that continuously moves the integrated conductive tape along the machine direction, the rotary station includes a cutting blade the conductive tape. The manufacturing device according to claim 2, characterized in that the belt applicator includes a first roller adjacent to a first side of the continuously moving poly sheet and a second roller adjacent to a second side of the sheet. continuously moving poly sheet, opposite the first side, which pushes the conductive tape towards the poly sheet to integrate the conductive tape. The manufacturing device according to claim 2, characterized in that the belt applicator includes a first roller adjacent to the first side of the continuously moving poly sheet and a second roller adjacent to the second side of the poly sheet moving in a continuous manner, opposite to the first side , which periodically pushes the conductive tape towards the poly sheet to periodically integrate the conductive tape, and a cutter that cuts the conductive tape not integrated into the poly sheet. The manufacturing device according to claim 2, characterized in that the integrated conductive tape includes a pair of conductive wires integrated in the poly sheet substantially in parallel along the machine direction. The manufacturing device according to claim 1, characterized in that the pressure station includes a first roller adjacent to the first side of the continuously moving poly sheet and a second roller adjacent to the second side of the sheet of film. poly moving continuously opposite the first side, the first roller formed of a rubber or poly material having sufficient strength to press the circuits towards the heated poly sheet if it causes damage to the circuits. 14. A manufacturing device for manufacturing a circuit in a mold, characterized in that it comprises: means for continuously moving a poly sheet along a direction of the machine; means for heating the poly sheet moving continuously to a malleable condition; and means for integrating circuits placed on the poly sheet in the heated poly sheet as the circuits and the poly sheet move continuously in the machine direction, the circuits have a surface that includes conductive areas and areas not conductive 15. The manufacturing device according to claim 14, further characterized in that it comprises means for integrating a conductive tape into the poly sheet and in conductive communication with the integrated circuits as the tape and the poly sheet move in shape. continues to form an integrated conductive tape. The manufacturing device according to claim 15, further characterized in that it comprises means for separating the integrated conductive tape along the machine direction into portions of the conductive tape, and for forming non-conductive air gaps between consecutive portions of the conductive tape, the consecutive portions can be communicated in conductive form with a respective integrated circuit joining the non-conductive air gap. The manufacturing device according to claim 16, characterized in that the means for separating the integrated conductive tape along the machine direction include means for periodically cutting the integrated conductive tape adjacent to the integrated circuits to form the non-conductive air gaps. 18. The manufacturing device according to claim 15, further characterized in that it comprises means for heating the conductive tape before integrating the conductive tape into the poly sheet. 19. The manufacturing device according to claim 15, further characterized in that it comprises means for aligning the conductive tape with the conductive areas of the integrated circuits before integrating the conductive tape into the poly sheet. 20. A method for manufacturing a mold circuit, characterized in that it comprises: continuously moving a poly sheet along a machine direction; heating the poly sheet moving continuously to a malleable condition; and integrating circuits placed on the poly sheet in the heated poly sheet as the circuits and the poly sheet move continuously in the machine direction, the circuits have a surface that includes conductive areas and non-conductive areas . 21. The method according to the claim 20, further characterized in that it comprises integrating a conductive tape into the poly sheet and into conductive communication with the integrated circuits as the conductive tape and the poly sheet move continuously to form an integrated conductive tape. 22. The method of compliance with the claim 21, further characterized in that it comprises separating the integrated conductive tape along the machine direction into portions of the conductive tape, and forming non-conductive gaps between consecutive portions of the conductive tape, the consecutive portions can be communicated in a conductive manner with a respective integrated circuit that joins the non-conductive air gap. The method according to claim 22, characterized in that the step of separating the integrated conductive tape along the direction of the machine includes periodically cutting the integrated conductive tape adjacent to the integrated circuits to form the non-conductive air gaps. . 24. The method of compliance with the claim 23, further characterized in that it comprises heating the conductive tape before integrating the conductive tape into the poly sheet. 25. The method according to claim 23, further characterized in that it comprises aligning the conductive tape with the conductive areas of the integrated circuits before integrating the conductive tape into the poly sheet. 26. The method according to claim 20, further characterized in that it comprises placing the circuits on an upper layer of the poly sheet moving continuously before the step of heating the poly sheet moving continuously until a malleable condition. 27. The method of compliance with the claim 26, further characterized in that it comprises heating the upper layer of the poly sheet moving continuously before the step of placing the circuits on the upper layer to maintain the circuits on the poly sheet moving continuously before the step of heating the poly sheet moving continuously to a malleable condition. The method according to claim 26, further characterized in that it comprises applying an adhesive layer on the upper layer of the poly sheet moving continuously before the step of placing the circuits on the upper layer to maintain the circuits on the poly sheet moving continuously before the step of heating the poly sheet moving continuously to a malleable condition. 29. A method for manufacturing an in-mold circuit, characterized in that it comprises: placing a circuit on a first side of a poly sheet and a thread on a second side of the poly sheet opposite the first side; place the circuit, poly and wire sheet between thermal plates; heating the poly sheet to a malleable condition; integrating the circuit on the first side of the heated poly sheet and the yarn on the second side of the heated poly sheet; and create a conductive communication between the integrated circuit and the integrated wire to form an in-mold circuit.