MX2008005216A - Wire embedded bridge - Google Patents

Abstract

A wire embedded bridge made by the apparatus and method disclosed by example herein may be commonly used for the formation of an RFID circuit or chip strap (42) . The process uses flexible polyester and/or other films as a base component of the bridge. A wire (24) is heated (22) and embedded into the poly sheet (18) at precise locations in a continuous process, for example, with the poly continuously moving in a machine direction (20) . The locations of the wire make chip placement onto the wire track reliable and inexpensive, preferably using heat and pressure to bond the chips (38) with the embedded wire and form a protected RFID circuit.

Description

INTEGRATED WIRE BRIDGE DESCRIPTION OF THE INVENTION This invention relates to safety labels, and in particular, to the manufacture of conductive bands frequently used, for example, for the integration of RFID circuits. The union of chips is expensive. The two largest components of the cost of RFID tags are currently the integrated circuit and the fixation of that circuit (otherwise known as silicon) to an antenna structure. Although the increasing volume of chips helps reduce the cost of Cl, the union is a mechanical process and does not benefit from the same technological advances or economic scale. Current chip-joining methods do not adequately address costs. A two-stage method of an intermediate chip band achieves a gradual improvement of costs by reallocating costs. However, the bands do not address the problem directly, since the union is still required, but to a smaller label. In addition, the bands add another step to join the band to the antenna structure. Current manufacturers that use standard bonding technology with bands, want the bands to be similar to traditional bonding surfaces, as they are commonly found in circuit card technology, that is, resistant and inflexible. However, such bands are not conducive to easy integration into flexible labels (eg, RFID tags). The standard joining processes are all from known solutions based on band and, therefore, little ideals. A method of fixing the related technique, called Automatic Fluid Mounting (FSA), provides insufficiently robust joints. Because the chips find their own way to the binding receptacles, the chips can not use adhesives or fluidizing, since nothing sticky prevents free movement of the chips into the receptacles. With the automatic fluid assembly process, the connection is made on a tangent, between the chip joining area and the sides of the joint cavity. This union from plane to edge is different and less secure than the traditional joints, which are made from plane to plane. Automatic fluid assembly also imposes restrictions on the type of substrate that can be used. Automatic Fluid Mounting (FSA) does not create the joint, it only places labels on the appropriate carrier for its fixation. The current FSA method that is practiced uses stamped cut polyester and laminates another film over the top of the network with chips in place. Therefore, the posterior network is laser cut, leaving a hole in direct proximity and above the area of the junction area of chip. This hole is filled with conductive ink and a trace is completed on the back side perpendicular to the hole that creates a band. The FSA process is slow and uses multiple stages and requires a high degree of accuracy with known technology products currently available. A known wire bonding process is described in U.S. Patent No. 5,708,419 to Isaacson, et al., The contents of which are hereby incorporated by reference in their entirety. Isaacson discusses the binding of a Cl to a flexible or non-rigid substrate that usually can not be subjected to high temperatures, such as the temperature required to perform welding processes. In this bonding process, a chip or dye is fixed to a substrate or carrier with conductive wires. The chip is fixed to the substrate with the front side of the chip facing upwards. The wires are first attached to the chip, then form a loop and join the substrate. The stages of a typical wire-joining process include: 1. advancing the network to the next binding site; 2. detention; 3. Take a digital photograph of the union site; 4. compute the junction location; 5. pick up a chip; 6. move the chip to the binding site; 7. use the photo information to adjust the placement to the actual site location; 8. place or deposit the chip; 9. Photograph the chip to locate the joint areas; 10. move the head towards the chip joining area; 11. Press, vibrate and weld the wire to the joint area; 12. Remove and move the chip towards the substrate joining area, drag the thread back to the chip junction 13. Press and weld that joint; 14. take out and cut the thread; and 15. repeat steps 10-14 for each connection. On the other hand, the interconnection between the chip and the substrate in a micropastilla packaging is carried out through conductive connection areas or welding protrusions that are placed directly on the surface of the chip. The chip with protrusions is then turned and placed facing downward, with the protuberances connecting electrically to the substrate. The micropastilla junction, a current state of the art process, is expensive due to the need to match each chip with a cutting joint site accurately, tiny. As the chips become smaller, it becomes even more difficult to cut accurately and prepare the binding site. However, the micro-chip bonding process is a considerable advance over the wire bond. The steps of a typical micropacking process include: 1. advancing the network to the next binding site; 2. detention; 3. photograph the binding site; 4. compute the junction location; 5. collect the chip; 6. move the chip to the binding site; 7. use photo information to adjust placement at the actual site location; 8. place the chip; 9. ultrasonically vibrating the positioning head to weld the chip in place; and 10. retract the placement head. Steps 1 to 8 for each of the above joining processes are substantially the same. The network must stop to locate the conductive air gap in the substrate and accurately place the Cl. The processes of the related art require that the network be stopped and measured (for example, when photographing the binding site, containing the binding location, using photograph information for adjust the placement at the actual site location), so that the chip can be placed exactly, as desired, adjacent to the air gap and joined. Re-tracing a trajectory during the joining process takes time, causes vibration and wears out the mechanical couplings. These links also create uncertainty in the absolute position. Rotating or continuous devices are preferred over alternating devices, in part because stopping and starting the manufacturing line always delays things and reduces production. It can be helpful to adjust the machining to operate in a process that is continuously advancing under the line at a known travel speed. When the chips are placed under an antenna structure, such as an aluminum band to form a bridge, near and overlapping conductive materials, they can create an undesired capacitance, especially at UHF or higher frequencies. Therefore, it may be helpful to minimize the conductive overlap for the binding sites between the chips and the bands, especially for use of higher frequencies, since the higher the overlap, the greater the unwanted capacitance and the lower the frequency of tuning. All references cited herein are incorporated in their entirety in the present for reference. Preferred embodiments include an integrated wire band and manufacturing method for the creation of the band that can be used, for example, in the formation of an RFID circuit, or for the formation of a simple dipole antenna for an RFID circuit . The preferred method uses a flexible film with poly base as a base component of the band. A yarn is integrated into the poly in precise locations through the use of heat and alignment aids. The integrated location of the wire allows the exact placement of the chip on the guide that is safe and cheap. According to one of the preferred modalities, the invention includes a manufacturing device for manufacturing an integrated yarn band. The manufacturing device includes a first rotary station, a heating station and a separation station. The first rotary station continuously displaces a sheet of poly (eg, polyester, polyurethane, polystyrene, polypropylene, polyethylene, polyacrylate, copolymers, tripolymers and films thereof, etc.) along a machine direction. The heating station is adjacent to the first rotary station and heats a conductive strip as it advances towards the first rotary station. The first The rotary station integrates the conductive strip heated in the poly sheet as the conductive strip and the poly sheet move around the first rotating station to form an integrated conductive strip. The separation station separates the integrated conductive strip into portions of the conductive strip to form non-conducting air gaps between consecutive portions of the conductive strip. The respective consecutive portions of the conductive strip can be conductively communicated with a respective circuit joining the respective non-conductive air gap between the respective consecutive portions and can form an antenna for the circuit. The preferred manufacturing device may also include an alignment unit adjacent to the first rotary station that aligns the conductive strip with the poly sheet before the conductive strip is integrated into the poly sheet. In addition, the preferred manufacturing device can include a chip fixing station that places circuits over the non-conducting air gaps formed by the separation station. The chip-fixing station can also join the circuits placed to the respective portions of the conductor strip to form a bridge (for example, by using a thermal compression process). The conductive strip may include one or more lines of threads. Another preferred embodiment of the invention includes a method for manufacturing an integrated yarn band. The method includes continuously moving a poly sheet along a machine direction, heating a conductive strip by continuously moving it towards the poly sheet, integrating the heated conductive strip into the poly sheet as the strip conductive and the poly sheet are continuously moved to form an integrated conductive strip, separate the integrated conductive strip into portions of the conductive strip, and form non-conductive air gaps between consecutive portions of the conductive strip. In addition, the preferred method may include aligning the heated conductive strip with the poly sheet before integrating the heated conductive strip into the poly sheet. The preferred method also includes placing respective circuits over the non-conducting air gaps and joining the respective circuits to the consecutive portions adjacent the non-conducting gaps to form a bridge. According to yet another preferred embodiment, the invention includes an integrated wire band having a poly sheet and a pair of conductive wires. The poly sheet (for example polystyrene, polyethylene, polyester) is adapted to move continuously along a machine direction of a rotary manufacturing device. The pair of conducting wires are integrated into the poly sheet substantially in parallel along the length of the machine direction, with each pair of wires separated along the machine direction in portions of the pair of wires. The consecutive portions of the pair of wires pass longitudinally along the machine direction by a non-conductive air gap and can be conductively connected to a respective circuit joining the non-conductive air gap. The preferred integrated wire band may also include the respective circuit conductively coupled to respective consecutive portions of the pair of wires and conductively bonding the non-conductive air gap between the respective consecutive portions. BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in relation to the following drawings, in which similar reference numerals designate similar elements, and wherein: Figure 1 is a sectional side view of a chip fixing manufacturing device in mold, according to the preferred embodiments of the invention; Figure 2 is a top view of an integrated wire and chip setting method, according to the preferred embodiments; Figure 2A is a perspective view of a chip band (omitted poly sheet) made in accordance with the method of Figure 2; Figure 3 is an exploded side view partially in section of a chip band, according to the preferred embodiments; Figure 4 is a sectional view of the chip band shown in Figure 3; Figure 5 is a side sectional view illustrating a first preferred method for creating a non-conductive air gap at a first time; Figure 6 is a side sectional view illustrating the first preferred method for creating a non-conductive air gap in a second time; Figure 7 is a side sectional view illustrating a second preferred method for creating a non-conductive air gap; Figure 8 is a partially sectioned side view illustrating a third preferred method for creating a non-conductive air gap at a first time; Figure 9 is a side sectional view illustrating the third preferred method for creating a non-conductive air gap in a second time; According to the preferred embodiments of the invention, a heated yarn (for example aluminum, gold, silver, copper and / or combinations thereof) is integrated into a poly (for example polystyrene, polyethylene, polyester, polypropylene, polyethylene, polyacrylate, copolymers, tripolymers and films thereof) in precise locations for alignment with subsequently placed chips and for their conductive communication with the yarn. The yarn has dimensional stability and is preferably in the area of 2 mils in diameter, or commonly known as American Wire Gauge (AWG) from 40 to 50. In a preferred embodiment, two independent yarn lines are integrated into the poly and they are separated in a transverse manner to be aligned with connection points (eg, conductive contact protuberances) of a chip placed subsequently. The integrated yarn is cut and separated longitudinally to form air gaps that are non-conductive between the separated yarns. The non-conductive air gaps in the wire preferably are formed to be used as an antenna for a coupled chip and / or to avoid a short circuit that may otherwise occur if the chip (eg, RFID chip, transponder) is placed adjacent to the air gap and conductive communication with separate portions of the integrated wire. An exemplary preferred embodiment for an integrated yarn band and method for manufacturing an integrated yarn band is shown in Figures 1-4. As best seen in Figure 1, a manufacturing device 10 for manufacturing an integrated yarn band includes a rotary station 12 having two rollers 14 and 16 that continuously move a poly sheet 18 along a direction 20 of the machine. The manufacturing device 10 also includes a heating station 22 that heats the conductive strip (e.g. wire 24, rod, spool) to a temperature that softens the poly sheet 18 and allows the roller 14 to integrate the conductive strip into the sheet 18 malleable poly by pushing the conductive strip towards the poly sheet. In particular, the heated yarn 24 deforms the poly sheet 18 at its intersection, which allows the roller 14 to push the yarn towards the poly sheet, thereby integrating the yarn. Preferably, the manufacturing device 10 includes an alignment unit 26 that aligns the yarn 24 in a predetermined position to help control its lateral or transverse placement on the poly sheet 19. Although not limited to a particular theory, the manufacturing device 10 also includes a separation station 28 that longitudinally separates the yarn along the machine direction into strips 30 of yarn with non-conductive gaps 32 between strips of yarn. consecutive threads, as will be described in greater detail in the following. The non-conductive gaps 32 can be subsequently joined by a chip to form a chip band, as will also be described in greater detail in the following.

Referring still to Figure 1, the poly sheet 18 moves in a machine direction along the manufacturing device 10. Although not limited to a particular theory, the poly sheet 18 preferably travels continuously along the manufacturing device 10 with the help of rollers, such as the roller 16 and the roller 14 (also referred to as the roller). 14 of integration). The rollers are preferably formed of a resilient rubber or metal capable of gripping the poly sheet to advance the sheet continuously. The integration roller 14 is preferably made of a material or composition that is strong enough to push the yarn 24 toward the poly sheet 18 and is temperature resistant such that it does not deform or otherwise be affected adversely by the temperature of the heated yarn. Therefore, the shapes of the integration roller 14 and the roller 16 are not compromised by the temperature of the heated wire 24, which is high enough to melt or soften the poly sheet 18 and allow it to be deformed to accept the yarn. The poly sheet 18 becomes a protective carrier for the yarn 24, and thus prevents unwanted damage of the yarn after it is integrated into the "poly sheet", the heating station 22 and the alignment unit 26. prepare the thread for its exact placement and consisting of the sheet 18 of poly. The heating station 22 heats the yarn 24 as is easily understood by an experienced technician, for example by applying heat, radiation or other energy to the yarn and by causing the yarn temperature to rise to a temperature sufficient to melt or soften the sheet 18 and allow the poly sheet to accept the yarn when the yarn is pushed towards the poly sheet by the integration roller 14. The alignment unit 26 includes slots (eg, spacers, openings 27) that allow the wire 24 to pass through the alignment unit in the slots or openings, such that the wire 24 aligned, as desired, is Integrate into the poly sheet at a precise location. Preferably, the aligned location of the wire 24 is established corresponding to the connection areas 40 (eg, contact points, conductive protuberances) of circuits that can be fixed to the thread in a subsequent time. Although not limited to a particular theory, the alignment unit 26 is preferably located between the heating station 22 and the integration roller 14 and is located near the integration roller, as needed, to prevent the wire 26 from move from their aligned position before integrating into the poly sheet 18. However, it will be understood that the location of the alignment unit 26 is not limited thereto, since the alignment unit can be attached to the station 22 of heating or can be part of the rotary station 12 as long as the alignment unit 26 allows the alignment of the yarn that is integrated in the poly sheet 18. Still referring to Figure 1, the yarn 24 is shown as a coiled conductive strip that is unwound to arrange the yarn towards the poly sheet 18. It is understood that the shape of the origin of the yarns is not crucial to the invention, since the spool of yarn is only an example of where the yarn 24 preferably comes from. Accordingly, the yarn 24 can reach the heating station 22 in other ways, as can be easily understood by an experienced technician. After the yarn 24 is integrated into the poly sheet 18, the yarn is cut into strips 30 of yarns. In particular, a separation station 28 cuts the integrated wire 24 as it travels with the poly sheet 18 at certain intervals to provide strips 30 of sufficient length for its intended use (eg, antenna, connector, chip, etc.). band, bridge). Preferably, the separation station 28 also separates the wire bands 30, leaving an air gap in conductivity between consecutive wire bands. Although not limited to a particular theory, there are several methods to form the non-conductive air gaps between the consecutive wire bands, with the preferred methods described in greater detail in the following. As is well known in the art, a chip or circuit having multiple conductive connection zones fixed to a single conductive strip can cause a short circuit if there is no conductive air gap in the strip between the connection areas of the chip. Accordingly, in a preferred embodiment, non-conductive gaps 32 are formed between consecutive strips of thread. The air gaps are large enough to avoid direct conductive communication between strips 30 of consecutive threads, but small enough to allow the attachment of a chip or circuit to the consecutive strips of wire over the air gaps, for example, as shown in FIG. Figures 1-3. The wire strips 30 can then be used as an antenna for the chip. In operation, the rollers 14 and 16 are pushed continuously and move the poly sheet 18 along the machine direction 20. The wire 24 preferably moves continuously from its coiled start location 34 to the poly sheet 18 and is then integrated, along the machine direction 20, with the poly sheet 18. The heater 22 heats the yarn 24 to a temperature that melts or softens the poly sheet 18 which contacts the heated yarn. As one skilled in the art can easily understand, the Preferred temperatures for the heated yarn can be determined, at least in part, by the material of the poly sheet, the size of the yarn and the speed of the poly sheet 18 through the rolls 14, 16. The speed is limited only in the capacity to maintain the tension in the networks and control the formation of the product. In cases where the chips should not be set in line to the wire 24, someone can assume an operating network speed of approximately 91.44 to 121.92 meters (300 to 400 feet) per minute. It is likely that this ratio will not be reached when the chips are set in line, as described in greater detail in the following, but the speed of the poly sheet 18 through the rolls is still several times faster than that of the film. Current technology. The current production standard that most manufacturers try to reach is approximately 20,000 units (for example, chip bands) per hour. This is equal to a network speed ratio of 0.61 to 0.914 meters (2 to 3 feet) per minute for a chip of 0.102 centimeters (0.040 inches) according to current technology. The yarn 24 is configured to be integrated into a precise transverse location of the poly sheet 18 by the alignment unit 26. When the heated and aligned wire 24 reaches the integration roller 14, the heated wire is pushed through a first side 78 of the sheet 18 of poly by the roller 14. The roller 16 is located on a second side 76 of the poly sheet 18, opposite the integration roller 14, to support the poly sheet against the yarn that is pushed towards the poly sheet by the integration roller. The integration roller 14 pushes the yarn 24 towards the softened poly sheet 18, preferably to a depth where an exposed portion of the integrated yarn is substantially coplanar together with the first side 78 of the poly sheet. An example of the preferred depth of the yarn 24 integrated into the poly sheet is shown in Figure 4, which is discussed in more detail in the following. After the heated yarn 24 is integrated into the poly sheet 18, the yarn and the poly sheet continue along the direction 20 of the machine in a continuous movement. The poly sheet 18 and the integrated yarn 24 moving in a continuous manner advance through the separation station 28, which separates the yarn into strips 30 of yarn. Then, for fixing the chip, the poly sheet 18 and the wire strips 30 continue through a chip fixing station 36, which fixes a chip 38 to strips 30 of consecutive threads to form a conductive bridge over a air gap 32 not respective driver. The chips 38 are attached to the consecutive thread strips 30 in a known manner, such as a micro-chip process in which the chips 38 they have conductive connecting zones 40 (for example, contact points, conductive protrusions) placed on the strands of strands, and the placed chip 38 is compressed and heated to join the connecting zones 40 to the integrated strand 24 and create a band 42 of chip, as shown for example in Figures 1-4. Figure 2 is a partial top view of the sheet 18 of poly, yarn 24, integration roll 14 and chips 38 of the preferred embodiment shown in Figure 1. Although not limited to a particular theory, the exemplary embodiment shown in FIG. Figure 2 illustrates two lines of yarn 24 remote from one another and integrated side by side in the poly sheet 18. The two lines of yarn 24 are simultaneously integrated substantially in parallel by the integration roller 14 into the poly sheet 18 as the poly sheet continuously moves in the direction 20 of the machine. As can be seen in Figures 1 and 2, after the heated wire lines 24 are integrated by the integration roller 14, both lines of the wire 24 are cut by the separation station 28, which forms gaps 32 between strips 30 of consecutive threads in each line. The chip fixing station 36 then places the chips 38 over the air gaps 32 for their conductive communication with the wire strips 30 through the connection areas 40 which are fixed to the wire strips.

It should be noted that the size of the chips 38 and the number of connection zones 40 of the chips are not crucial to the invention, and are shown only as an example of the preferred embodiment. It is understood that the size of the chips 38 and the number or location of the connection zones 40 are configured to allow the connection areas to be aligned with the conductive strip or strips of the wire 24 over a corresponding air gap between the strips 30 of wire that they are fixed to the connection areas of the chip 38. For example, a chip 38 having two connection zones 40 can be attached to the consecutive thread strips 30 of a single line of wire 24. In addition, a chip 38 having four preferably connecting areas 40 can be attached to the separate consecutive thread strips 30 and which originate from two lines of the yarn 24, as shown in Figure 2. In other words, the number of yarn lines integrated in the The poly sheet 18 should correspond to the number and configuration of the connection areas in the chips 38 that are to be fixed to the wire 24, as can be easily understood by an experienced technician. In addition, the wire preferably does not exceed the connection area on the chip. The chip fixing station 36 (Figure 1) places the chips 38 or circuits on separate wire strips 30 by non-conducting air gaps 32 to form chip strips 42 having an integrated wire bridge. He integrated yarn bridge of the preferred embodiments includes consecutive yarn strips 30 integrated and formed in the poly sheet 18 in a continuous process. The integrated wire bridge is configured to be attached to a chip 38 or circuit to form a chip band with its threads integrated into the poly sheet for protection. The integrated wire bridge can also form a dipole antenna that can be used with the chips 38. Preferably, the chips 38 are also pressed firmly into the poly sheet 18 to fill the underside of the chip to add stability to the band and to the chip since it is allowed to flex in downstream processes and during the final use of the product. Examples of chip strips and / or integrated wire bridges are shown in Figures 2A-4, according to the preferred embodiment. For example, Figure 3 is an exploded side view partially in section of an exemplary chip band 42 shown in Figure 1. In Figure 3, the poly sheet 18 encapsulates the yarn 30 and therefore the yarn is on a similar level in the plane that the poly sheet. Preferably there is no air gap in the poly sheet 18, since it does not melt or cut; preferably only the thread is cut. As can be seen in Figure 3, the chip 38 is placed on an air gap 32 between strips 30 of wire consecutive, in such a way that the connection zones 40 of the chips are in conductive contact with the wire strips. In this way, the chip 38 joins that air gap 32, and is conductively coupled to the wire strips 30. Figure 4 is a side sectional view of the chip band 42 shown in Figure 3. Thus, Figure 4 shows the wire strips 30 integrated in the poly sheet 18 and coupled to the chip connection areas 40. 38. To assist in securing the fixation of the chip 38 to the integrated yarn strips 30, the chip may be attached to the yarn preferably using compression and heat, as is well known in micro-chip bonding technology. Such a process provides both a conductive and mechanical bond for improved safety and reliability. Figure 2A is a perspective view of a chip band (with the omitted poly sheet 18) that is provided by the manufacturing device 10 and the process described in relation to Figures 1, 2, 3 and 4. As shown in FIG. can better observe in Figures 2 and 2A, the yarn strips are separated in transverse fashion by the alignment unit 26 at a predetermined distance for alignment with the connection zones 40 of the chips 38. Although not limited to a theory in particular, the connection zones 40 of the chips 38 (for example micro-chip) are shown in Figures 2A-4 shifted inwards from the periphery of a chip. However, the connection zones 40 can be located at other locations on the chip (for example at the periphery, adjacent to the periphery) and the alignment unit 26 can displace the wire strips 24 to align with the locations of the connection zones. , for example, by increasing or decreasing the distance between the yarn lines. As seen in the above, the manufacturing device 10 includes a separation station 28 that cuts the yarn 24 into strips 30 of yarn and separates the yarn strips with a non-conductive air gap 32. The air gap 32 is formed between consecutive strips of thread 30 and the poly fills the air gap, as needed, to avoid electrical problems, for example short circuit of a chip coupled to consecutive strips of wire during use. The air gaps 32 can be formed by numerous methods and the invention is not limited to any method. Some exemplary methods for creating non-conductive air gaps are described in the following in relation to Figures 5-9. Figures 5 and 6 illustrate a first preferred method for creating non-conducting air gaps 32 between consecutive strips of yarn. In this embodiment, the separation station 28 includes a cutting station having rollers 44 and 46, and an air gap formation station having rollers 48, 50, 52 and 54. All rollers 44, 46, 48, 50, 52 and 54 are at least in partial contact with the integrated yarns 24 and / or the poly sheet 18 and rotating in such a way that the rollers help to advance the integrated poly yarn / sheet in the address 20 of the machine. For example, the view shown in Figures 5 and 6, rollers 44, 48 and 52 rotate counterclockwise, as indicated by rotation arrow 56, and rollers 46, 50 and 54 rotate. clockwise, as indicated by arrow 58 of rotation. Although not limited to a particular theory, and unless otherwise indicated in the following, the rollers are preferably formed of rubber, plastic or metal that allows the rollers to roll with and / or push the integrated wire and sheet of poly in the direction 20 of the machine. With reference still to Figures 5 and 6, the roller 44 includes a mechanical cutter, for example a blade 60 extending outwardly from the perimeter of the roller to a sharp edge 62. The blade 60 is adapted to rotate with the roller 44 and engage with and cut through the integrated yarn 24 as the yarn travels with the poly sheet 18 continuously along the direction 20 of the machine. Preferably, the blade extends from the periphery of the roller 44 to a length that allows the blade to cut through the wire 24, but not through the poly sheet 18 surrounding the wire, such as way that the integrity of the poly sheet does not compromise. The roller 46 is located on the side or surface 76 of the poly sheet 18, opposite the roller 44, and provides a support or backing for the poly sheet as the knife 60 cuts the yarn 24. Therefore, the roller 44 aided by the roller 46 cuts the yarn 24 integrated in the yarn strips 30. As noted above, the air gap formation station of the separation station includes the rollers 48, 50, 52 and 54. The rollers 48, 50 are located on opposite sides of the integrated poly yarn / sheet, and are adapted to grip and advance the integrated thread and the poly sheet continuously at a consistent speed. In particular, the roller 48 grasps at least the integrated thread 24 and preferably the first side 78 of the poly sheet 18 adjacent the roller 48, and the roller 50 grasps the second side 76 of the poly sheet adjacent to the roller 50. The roller 54 is substantially similar to the rollers 46 and 50 in that the roller 54 remains in contact with and pushes the second side 76 of the poly sheet adjacent the roller 54 at a speed consistent with the machine direction 20. However, the roller 52 rotates faster than the roller 48, in such a way that its surface travels faster than the speed of the belt of the poly sheet 18. In other words, rollers 48 and 50 are essentially a point of mechanical clamping that drives the network for example the poly sheet 18) at a particular speed corresponding to that of the cutting roller 44. However, the roller 52 is a servo control roller that overloads and acts to stretch the net slightly at the location where the wire 24 was cut, when holding the net and, due to the higher speed, pulling the web 18 poly forward is faster than the anterior clamping point of the rollers 56 and 58. The roller 52 includes a grip member 64 that extends radially outwardly from the periphery of the roller 52 preferably as a groove extending longitudinally. along the length of the roller. Preferably, the gripping member 64 is the only portion of the roller 52 that comes into contact with the first side 78 or surface of the poly sheet 18 and the integrated yarn strips 30. In other words, in this preferred method, the roller 52 grasps the yarn strips 30 with the gripping member 64; otherwise, the roller 52 does not touch the yarn or poly sheet. With the roller 52 rotating at a faster speed than that of the other rollers, and in particular that of the roller 48, the gripping member 64 contacts and grips the first side 78 of the poly sheet 18 and the yarn strips 30 integrated, and pulls the yarn and the first side 78 at a faster speed than the next yarn strip 30 moving at the continuous speed of the rollers 48 and 50.

The straps by means of the grip member 64 displace the thread strip 30 of the next thread strip still in contact with the roller 48. The gap creates a non-conductive gap 32 between the strands 30 of thread between the rolls 48 and 52. As this process continues, the gripping member 64 separates each strip 30 of cut yarn from the next yarn strip by grasping and moving the respective yarn strip at a step faster than the next yarn strip step , creating an air gap 32 between the consecutive thread strips 30, integrated in the poly sheet 18. Figure 5 shows a cut 66 in the integrated yarn 24 made by the knife 60. At this time, to, the yarn strip 68 is not fixed to the yarn 24 since the cut 66 has separated the two. At the subsequent time, tx, as exemplified in Figure 6, the roller 44 continues to rotate, causing the blade 60 to cut through the integrated yarn 24 and form a cut 70 and a yarn strip 72. Referring still to Figure 6, the roller 52 continues its rotation, causing the grip member 64 to grip and pull the yarn strip 68 away from the yarn strip 72, creating a non-conductive air gap 32 therebetween. This process continues to create non-conducting air gaps between the consecutive thread strips 30 advancing in the direction 20 of the machine.

It should be noted that all of the rollers described herein illustrate an example of a rotary station in its entirety or in part. That is, the rotating station may include at least one of the rollers (e.g., roller 44, roller 48, roller 52), a pair of rollers arranged opposite each other on the poly sheet 18 (e.g. pair of rollers 44 and 46, the pair of rollers 48 and 50, the pair of rollers 52 and 54), or any equivalent element, as understood by an experienced technician, that affects the poly and / or yarn sheet 24 of continuous displacement, as described herein by way of example by the rollers. A second preferred example of the separation station 28 is exemplified in Figure 7. In particular, the separation station 28 illustrated in Figure 7 includes a laser device 74 that periodically emits an intense monochromatic light beam in the wire 24 that is it moves continuously, integrated in the poly sheet 18. This laser beam separates the yarn to create non-conductive air gaps 32 between consecutive strips 30 of yarn. That is, the laser device 74 emits a laser beam that cuts through the wire 24 to form the wire strips 30, and which separates the wire exposed to the laser to create the non-conductive air gaps 32. Still another preferred example of system 28 of separation is shown in Figures 8 and 9. In this method, the separation station 28 includes a cutting station 80 located adjacent the first side 78 of the poly sheet 18, and a support member, for example a roller 82 located on the second side 76 of the poly sheet, opposite the cutting station 80. The cutting station 80 includes a blade, laser or cutting member adapted to cut the wire 24 which extends above the first side 78 of the poly sheet 18, as described in greater detail in the following. Figure 8 also illustrates the roller 16 shown in Figure 1 and a roller 14A. The roller 14A is an alternative rolling member to the roller 14 shown in Figure 1 and is somewhat similar to the roller 14 in its purpose and material. The roller 14A includes an arcuate portion 86 that integrates the yarn 24, as described above for the roller 14. However, the roller 14A also includes a flat portion 84 that does not extend radially toward the periphery of the arcuate portion 86 of roller 14A. In operation, since the roller 14A rotates in the direction of the rotation arrow 88, the arcuate portion 86 integrates the heated wire 24 into the poly sheet 18 by pushing the yarn toward the poly sheet. However, the flat section does not push the thread towards the poly sheet. In contrast, as can best be seen in Figure 9, the wire 24 remains on top of the poly sheet while the flat section 84 of the roller 14A is oriented towards the poly sheet 18. The yarn 24 that is not integrated remains on top of the poly sheet 18 as exposed sections 90 of yarn. As the roller 14A continues to rotate, the arcuate portion 86 again integrates the yarn 24 adjacent to the currently section 90 of downstream yarn by pushing it toward the poly sheet. With reference to Figure 8, the cutting station 80 cuts the yarn sections 90 exposed on top of the first side 78 of the poly sheet 18 as the poly sheet advances in the machine direction 20 to create the air gaps 32. non-conductors and integrated thread strips 30. Alternatively, the section 90 of exposed yarn can be recorded away from the integrated yarn strips 30, preventing the yarn that is fully integrated from being recorded. Although not limited to a particular theory, the cutting station 80 preferably includes a blade, laser or other cutting member located adjacent the first side 78 of the poly sheet 18 to cut the exposed wire sections 90, as understood easily by an experienced technician. It has been found that the edges of the yarn strips 30 that have been cut by the cutting station 80 are preferably left turned upwardly of the poly sheet 18 for secure attachment with the connection areas 40 of a chip placed on it. subsequent form. Although it is not limited to a particular theory, Preferred embodiments of the invention provide yarn strips at least partly integrated into a poly sheet in a continuous movement. It has been found that connecting the chip connection zones to independent wire lines, as shown for example in Figure 2A, minimizes unwanted parasitic capacitance between the chip circuit and its antenna structure, especially on chips. fixed to simple antenna bands. The parasitic capacitance becomes more relevant when the chip is used with higher frequencies (for example UHF or higher). When a chip is coupled to an antenna structure, any nearby conductive material matters because it can create unwanted capacitance which decreases the frequency of tuning. Accordingly, in the preferred embodiments, the wire does not extend beyond the respective connection area on the chip. The chip band 42 manufactured by the device and manufacturing method described herein provides an additional benefit of minimizing parasitic capacitance by minimizing conductive overlap around the bonding sites between the chip and the antenna structure . In fact, the preferred diameter of the wire 24 is smaller than the diameter of the connection zones 40 of the chip 38 to further minimize the conductive overlap. Although not limited to a particular theory, the preferred depth of the poly sheet 18 is 50 to 75 microns and the preferred diameter of the wire 24 is 25 to 50 microns. However, it is understood that the measurements of the poly sheet and the yarn are not crucial to the invention, since other measures can be used and are considered within the scope of the invention. Preferably, the depth of the poly sheet 18 is greater than the diameter of the wire 24, which preferably is not insulated and is formed of a conductive material (eg, gold, aluminum, copper). It is understood that the method and apparatus for fixing the chip in the mold, and the integrated thread band described and shown are exemplary indications of preferred embodiments of the invention, and are provided by way of illustration only. In other words, the concept of the present invention can be easily applied to a variety of preferred embodiments, including those described herein. Although the invention has been described in detail and with reference to specific examples thereof, it will be apparent to one skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope thereof. For example, the gripping member 64 shown in Figures 5 and 6 may be at least one protrusion extending, instead of a groove, with each protrusion aligned with a line of wire 24 for moving the yarn strips 30 forward at a speed faster than the bolt speed of the poly sheet 18 and creating the non-conductive air gaps 32. Without further extension, the foregoing will fully illustrate the invention that others may readily adapt, upon applying current or future knowledge, to it for use under various service conditions.

Claims (28)

1. CLAIMS 1. A manufacturing device for manufacturing an integrated yarn band, characterized in that it comprises: a first rotary station that continuously moves a poly sheet along a machine direction; a heating station that heats a conductive strip that travels continuously to the first rotary station, the first rotary station integrates the heated conductive strip into the poly sheet as the conductive strip and the poly sheet move in shape continues along the machine direction to form an integrated conductive strip; and a separation station separating the conductive strip along the machine direction in portions of the conductive strip, the separation station forms non-conductive air gaps between consecutive portions of the conductive strip with respective consecutive portions that conductively communicate with each other. a respective circuit joining the respective non-conductive air gap between the respective consecutive portions. The manufacturing device according to claim 1, further characterized in that it comprises an alignment unit adjacent to the first rotary station, the alignment unit includes grooves that align the heated conductive strip with the poly sheet. 3. The manufacturing device according to claim 2, characterized in that the alignment unit is located between the heating station and the first rotary station. 4. The manufacturing device according to claim 2, characterized in that the heating station includes the alignment unit. 5. The manufacturing device according to claim 2, characterized in that the first rotary station includes the alignment unit. The manufacturing device according to claim 1, further characterized in that it comprises a chip fixing station which places respective circuits on the non-conductive gaps formed by the separation station and joins the respective circuits to the consecutive portions of the strip conductive The manufacturing device according to claim 1, characterized in that the separation station includes a laser that periodically separates the conductive strip integrated in the poly sheet that moves continuously along the direction of the machine to form non-conductive air gaps. 8. The manufacturing device in accordance with claim 1, characterized in that the separation station includes a cutting station and an air gap formation station, the cutting station cuts the conductive strip integrated in the poly sheet moving continuously along the direction of the machine in the portions of the conductive strip, the air gap formation station separates consecutive portions of the conductive strip to form the non-conductive air gaps. The manufacturing device according to claim 8, characterized in that the cutting station includes a second rotary station that continuously moves the integrated conductor strip along the machine direction, the second rotary station includes a knife that cuts the conductive strip. The manufacturing device according to claim 8, characterized in that the air gap formation station includes a second rotary station and a third rotary station, the second rotary station that grasps the integrated conductive strip that moves continuously as length of the machine direction at a first speed, the third rotary station includes a rapid advance member that periodically pushes the portions of the integrated conductive strip that travels continuously along the machine direction to a second speed different from the first speed to form the non-conductive air gap. The manufacturing device according to claim 1, characterized in that the first rotating station includes a first roller adjacent to a first side of the continuously moving poly sheet that pushes the heated conductive strip toward the poly sheet to integrate the conductive strip, and a second roller adjacent to a second side of the poly sheet that moves continuously, opposite the first side. The manufacturing device according to claim 11, characterized in that the first roller periodically pushes the heated conductive strip towards the poly sheet to periodically integrate the conductive strip, and the separation station includes a cutting cutter. the conductive strip not integrated in the poly sheet to form the portions of the conductive strip and the non-conductive air gaps. The manufacturing device according to claim 12, characterized in that the cutter includes a blade. The manufacturing device according to claim 1, characterized in that the integrated conductor strip is a pair of conductor wires integrated in the poly sheet substantially in parallel along the machine direction. 15. A manufacturing device for manufacturing an integrated yarn band, characterized in that it comprises: means for continuously moving a poly sheet along a machine direction; means for heating a conductive strip traveling continuously to the poly sheet; means for integrating the heated conductive strip into the poly sheet as the conductive strip and the poly sheet move continuously to form an integrated conductive strip. means for separating the integrated conductive strip along the machine direction in portions of the conductive strip; and means for forming non-conducting air gaps between consecutive portions of the conductive strip, the consecutive portions can be conductively communicated with a respective circuit joining the non-conductive air gap. 16. The manufacturing device according to claim 15, further characterized in that it comprises means for aligning the heated conductive gap with the poly sheet before integrating the heated conductive strip into the poly sheet. 17. The manufacturing device according to claim 15, further characterized in that comprises means for placing respective circuits on the non-conducting air gaps and means for joining the respective circuits to the consecutive portions adjacent to the non-conducting gaps. The manufacturing device according to claim 15, characterized in that the means for separating the conductive strip include means for periodically separating the conductive strip integrated in the poly sheet moving continuously along the direction of the machine to form non-conductive air gaps. The manufacturing device according to claim 15, characterized in that the means for separating the conductive strip includes means for gripping the integrated conductive strip that moves continuously along the machine direction at a first speed, and means for periodically pushing the portions of the integrated conductive strip that travels continuously along the machine direction at a second speed greater than the first speed to form the non-conductive air gap. The manufacturing device according to claim 15, characterized in that the means for integrating the heated conductive strip into the poly sheet include means for periodically pushing the strip conductive heated to the poly sheet to periodically integrate the conductive strip, and the means for separating the integrated conductive strip includes means for cutting the conductive strip that is not integrated into the poly sheet to form the portions of the conductive strip, the cutting of the conductive strip also forms the non-conducting air gaps. 21. A method for manufacturing an integrated yarn band, characterized in that it comprises: continuously moving a poly sheet along a direction of the machine; heating a conductive strip that moves continuously to the poly sheet; integrating the heated conductive strip into the poly sheet as the conductive strip and the poly sheet move continuously to form an integrated conductive strip; separating the integrated conductive strip along the machine direction in portions of the conductive strip; and forming non-conducting air gaps between consecutive portions of the conductive strip, the consecutive portions can be conductively communicated with a respective circuit joining the non-conductive air gap. 22. The method of compliance with the claim 21, further characterized in that it comprises aligning the heated conductive strip with the poly sheet before integrating the heated conductive strip into the poly sheet. 23. The method according to claim 21, further characterized in that it comprises placing respective circuits on the non-conductive gaps and joining the respective circuits to the consecutive portions adjacent to the non-conducting gaps. 24. The method according to claim 21, characterized in that the step of separating the conductive strip includes periodically separating the conductive strip integrated in the poly sheet that moves continuously along the machine direction to form non-conductive air gaps. 25. The method of compliance with the claim 21, characterized in that the step of separating the conductive strip includes grasping the integrated conductive strip that moves continuously along the machine direction at a first speed, and periodically pushing the portions of the integrated conductive strip that it travels continuously along the machine direction at a second speed greater than the first speed to form the non-conductive air gap. 26. The method according to claim 21, characterized in that the step of integrating the strip conductive heated in the poly sheet includes periodically pushing the heated conductive strip towards the poly sheet to periodically integrate the conductive strip, and the step of separating the integrated conductive strip includes cutting the conductive strip that is not integrated into the poly sheet to form the portions of the conductive strip, the cutting of the conductive strip also forms the non-conductive air gaps. 27. An integrated yarn band, characterized in that it comprises: a poly sheet adapted to move continuously along a machine direction of a rotary manufacturing device; and a pair of wires integrated in the poly sheet substantially in parallel along the machine direction, each of the pair of wires separated along the machine direction in portions of the pair of wires, consecutive portions of the pair of conductive wires remote along the machine direction by a non-conductive air gap and which can be conductively communicated with a respective circuit joining the non-conductive air gap. 28. The integrated wire band according to claim 27, further characterized in that it comprises the respective circuit conductively coupled to portions consecutive portions of the pair of conductive wires and which conductively connect the non-conductive air gap between the respective consecutive portions.