CA2528797A1 - Rfid transponder structure optimized for in-line label construction - Google Patents
Rfid transponder structure optimized for in-line label construction Download PDFInfo
- Publication number
- CA2528797A1 CA2528797A1 CA 2528797 CA2528797A CA2528797A1 CA 2528797 A1 CA2528797 A1 CA 2528797A1 CA 2528797 CA2528797 CA 2528797 CA 2528797 A CA2528797 A CA 2528797A CA 2528797 A1 CA2528797 A1 CA 2528797A1
- Authority
- CA
- Canada
- Prior art keywords
- adhesive
- conductive pads
- antenna
- pads
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Details Of Aerials (AREA)
Abstract
The invention provides a method of manufacturing RFID transponders for attachment to packages that will be in transit or to packages containing, for example, medicinal preparations, when information respecting the handling of the packages or the timing of removal of the medicinal preparations is required.
The method utilizes a continuous strip of adhesive backed material, such as an adhesive tape supplied on a roll. As the tape is removed from the roll an anti-adhesive material is applied to predetermined areas of the adhesive surface to render such areas non-adhesive. A conductive ink is coated to the non-adhesive areas to create spaced apart antenna pads. An RFID chip strap, carrying an RFID chip, and having corresponding spaced apart conductive pads is applied to the tape with the conductive pads thereof contacting the antenna pads. The strap is secured to the tape through contact with the adhesive surrounding the antenna pads. Completed transponders can be severed from the tape and applied via the adhesive thereon to the package as desired.
The method utilizes a continuous strip of adhesive backed material, such as an adhesive tape supplied on a roll. As the tape is removed from the roll an anti-adhesive material is applied to predetermined areas of the adhesive surface to render such areas non-adhesive. A conductive ink is coated to the non-adhesive areas to create spaced apart antenna pads. An RFID chip strap, carrying an RFID chip, and having corresponding spaced apart conductive pads is applied to the tape with the conductive pads thereof contacting the antenna pads. The strap is secured to the tape through contact with the adhesive surrounding the antenna pads. Completed transponders can be severed from the tape and applied via the adhesive thereon to the package as desired.
Description
RFID TRANSPONDER STRUCTURE OPTIMIZED FOR IN-LINE LABEL CONSTRUCTION
The present invention relates to the manufacture of RFID transponders such as might be used with medicinal packages containing tablets, when compliance monitoring is required, or in other situations in which data pertaining to a shipped article or package is to be collected during transit for later downloading or transmission.
The present invention provides a method for manufacturing such transponders such that they can be readily adhered to a package, as a label, in a condition ready for use therewith.
SUMMARY OF THE INVENTION
In accordance with the present invention RFID transponders are manufactured using a continuous roll of pressure sensitive tape or other such material. The tape is removed from the roll, exposing the adhesive face thereof. A portion of the adhesive surface is coated with an anti-adhesive material and an antenna is printed, using electrically conductive ink, on the tape on top of the anti-adhesive coating, providing a stable foundation for the antenna. Typically, two spaced apart antenna pads will be printed on the tape. An RFID chip strap, carrying the required RFID chip, with suitable electrical connections, is adhered to the antenna pads so that the chip is located between the pads and electrical connection with the antenna pads is achieved through the strap.
For greater adhesion, or to promote curing, the strap and pads can be subjected to ultrasonic vibrations.
The method of the present invention is suited to high speed automated equipment and represents an inexpensive procedure for creating transponders for subsequent assembly to packages or other articles. The completed transponders can be severed from tape carrying a plurality of the transponders and then adhered to the package by way of adhesive on the tape portion thereof surrounding the transponders BRIEF DESCRIPTION OF THE DRAWINGS
Figure 1 is a sketch showing the basic principles of the present invention.
Figure 2 is an enlarged sketch showing the conductive antenna pads on the adhesive tape.
Figure 3 is an enlarged sketch showing the RFID strap in position on the antenna pads.
Figure 4 is a view showing ultrasonic welding of the strap to the pads.
Figure 5 is a sketch showing the RFID chip strap.
Figure 6 shows textured surface of the printing.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
The following sets forth the primary embodiment of the present invention as well as several alternative or complementary aspects of the invention.
1. Pressure sensitive label stock adhesive is used for the strap bonding The transponder (Fig 1) consists of an antenna 4 which is printed on the adhesive side 1 of delaminated label stock 5, such as adhesive tape. The label stock is provided on a roll thereof and stock is progressively removed from the roll as required. If the label stock is provided with a liner, as illustrated, the liner is continuously separated from the adhesive surface of the tape, so as to expose the adhesive surface. An RFID chip strap 3 is then mounted to the antenna 4.
Antenna 4, in the form of a conductive pad, is printed using electrically conductive ink on top of the pressure sensitive adhesive tape after delaminating of the stock liner.
The area of the tape on which the antenna is to be printed is initially covered with a printable anti-adhesive coating which promotes a stable foundation for the conductive ink to be transferred to.
The pressure sensitive adhesive is deactivated by the anti-adhesive coating, so that it no longer performs as an adhesive. The anti-adhesive coating may be applied in line on a printing press as a first colour and the conductive ink is printed as a second colour.
The printed conductive pads 3 and 4 (Fig 2) are antenna areas designed for the RFID
chip strap to be attached thereto. Conductive pads 3 and 4 have multiple adhesion windows 1. Each adhesion window has a central area not covered with any coating or ink, so that the pressure sensitive adhesive from the label stock is exposed to the chip strap coming on top of the pad.
The strap is bonded to the antenna through the adhesion windows and through the area between and around the conductive pads which is not covered with anti-adhesive coating (Fig 3). The strap needs to have an extended width to the sides, so that there is enough area for bonding outside the perimeter of the conductive pads. The special shape of the conductive antenna pads and of the strap will increase the probability of a good electrical connection and strap-to-antenna bonding during registration variations in the in-line process.
When the chip strap (which includes the substrate 6 (Fig 4) and its own printed conductive pads 5) is pushed against the conductive antenna pads (printed on substrate 1 with anti-adhesive layer 3 and conductive ink layer 4), a stable electrical connection is established.
2. Ultrasonic welding is used to establish electrical connection between RFID
chip strap and printed antenna When welding plastics, a temperature rise in the bonding area is produced by the absorption of mechanical vibrations, the reflection of the vibrations in the connecting area, and the friction of the surfaces of the parts. The vibrations are introduced vertically. In the contact area, frictional heat is produced so that material plasticizes locally, forging an insoluble connection between both parts within a very short period of time.
The prerequisite is that both working pieces have a near equivalent melting point.
This process could be used to bond printed conductive pads 5 of the RFID chip strap to printed conductive pads 4 of the RFID antenna (Fig 4). The conductive ink which is used to print antenna pads and chip strap pads has the ability to be bonded ultrasonically.
The pad design and location is very important in ultrasonic welding, so that it will be accomplished in such a way that there is no interference between welding of joints (the joint between the strap pad and antenna pad) which are getting welded.
Ultrasonic welding of the strap to the antenna pads can be used on its own or it can be used in conjunction with the first-described method of adhesive bonding, to improve or speed up adhesive curing. Ultrasonic welding also enhances electrical conductivity at the junction of the conductive pads of the strap and the antenna.
The present invention relates to the manufacture of RFID transponders such as might be used with medicinal packages containing tablets, when compliance monitoring is required, or in other situations in which data pertaining to a shipped article or package is to be collected during transit for later downloading or transmission.
The present invention provides a method for manufacturing such transponders such that they can be readily adhered to a package, as a label, in a condition ready for use therewith.
SUMMARY OF THE INVENTION
In accordance with the present invention RFID transponders are manufactured using a continuous roll of pressure sensitive tape or other such material. The tape is removed from the roll, exposing the adhesive face thereof. A portion of the adhesive surface is coated with an anti-adhesive material and an antenna is printed, using electrically conductive ink, on the tape on top of the anti-adhesive coating, providing a stable foundation for the antenna. Typically, two spaced apart antenna pads will be printed on the tape. An RFID chip strap, carrying the required RFID chip, with suitable electrical connections, is adhered to the antenna pads so that the chip is located between the pads and electrical connection with the antenna pads is achieved through the strap.
For greater adhesion, or to promote curing, the strap and pads can be subjected to ultrasonic vibrations.
The method of the present invention is suited to high speed automated equipment and represents an inexpensive procedure for creating transponders for subsequent assembly to packages or other articles. The completed transponders can be severed from tape carrying a plurality of the transponders and then adhered to the package by way of adhesive on the tape portion thereof surrounding the transponders BRIEF DESCRIPTION OF THE DRAWINGS
Figure 1 is a sketch showing the basic principles of the present invention.
Figure 2 is an enlarged sketch showing the conductive antenna pads on the adhesive tape.
Figure 3 is an enlarged sketch showing the RFID strap in position on the antenna pads.
Figure 4 is a view showing ultrasonic welding of the strap to the pads.
Figure 5 is a sketch showing the RFID chip strap.
Figure 6 shows textured surface of the printing.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
The following sets forth the primary embodiment of the present invention as well as several alternative or complementary aspects of the invention.
1. Pressure sensitive label stock adhesive is used for the strap bonding The transponder (Fig 1) consists of an antenna 4 which is printed on the adhesive side 1 of delaminated label stock 5, such as adhesive tape. The label stock is provided on a roll thereof and stock is progressively removed from the roll as required. If the label stock is provided with a liner, as illustrated, the liner is continuously separated from the adhesive surface of the tape, so as to expose the adhesive surface. An RFID chip strap 3 is then mounted to the antenna 4.
Antenna 4, in the form of a conductive pad, is printed using electrically conductive ink on top of the pressure sensitive adhesive tape after delaminating of the stock liner.
The area of the tape on which the antenna is to be printed is initially covered with a printable anti-adhesive coating which promotes a stable foundation for the conductive ink to be transferred to.
The pressure sensitive adhesive is deactivated by the anti-adhesive coating, so that it no longer performs as an adhesive. The anti-adhesive coating may be applied in line on a printing press as a first colour and the conductive ink is printed as a second colour.
The printed conductive pads 3 and 4 (Fig 2) are antenna areas designed for the RFID
chip strap to be attached thereto. Conductive pads 3 and 4 have multiple adhesion windows 1. Each adhesion window has a central area not covered with any coating or ink, so that the pressure sensitive adhesive from the label stock is exposed to the chip strap coming on top of the pad.
The strap is bonded to the antenna through the adhesion windows and through the area between and around the conductive pads which is not covered with anti-adhesive coating (Fig 3). The strap needs to have an extended width to the sides, so that there is enough area for bonding outside the perimeter of the conductive pads. The special shape of the conductive antenna pads and of the strap will increase the probability of a good electrical connection and strap-to-antenna bonding during registration variations in the in-line process.
When the chip strap (which includes the substrate 6 (Fig 4) and its own printed conductive pads 5) is pushed against the conductive antenna pads (printed on substrate 1 with anti-adhesive layer 3 and conductive ink layer 4), a stable electrical connection is established.
2. Ultrasonic welding is used to establish electrical connection between RFID
chip strap and printed antenna When welding plastics, a temperature rise in the bonding area is produced by the absorption of mechanical vibrations, the reflection of the vibrations in the connecting area, and the friction of the surfaces of the parts. The vibrations are introduced vertically. In the contact area, frictional heat is produced so that material plasticizes locally, forging an insoluble connection between both parts within a very short period of time.
The prerequisite is that both working pieces have a near equivalent melting point.
This process could be used to bond printed conductive pads 5 of the RFID chip strap to printed conductive pads 4 of the RFID antenna (Fig 4). The conductive ink which is used to print antenna pads and chip strap pads has the ability to be bonded ultrasonically.
The pad design and location is very important in ultrasonic welding, so that it will be accomplished in such a way that there is no interference between welding of joints (the joint between the strap pad and antenna pad) which are getting welded.
Ultrasonic welding of the strap to the antenna pads can be used on its own or it can be used in conjunction with the first-described method of adhesive bonding, to improve or speed up adhesive curing. Ultrasonic welding also enhances electrical conductivity at the junction of the conductive pads of the strap and the antenna.
3. Linear array design of antenna with capacitive coupled fingers, one of which has the RFID
chip strap on it In the case of RFID UHF antennas, characteristics such as high gain, beam scanning or steering capability are possible when discrete fingers are combined to form arrays. The center points of the elements (fingers) are adjusted to coincide with the voltage maxima of the transmission line feeder so that each element appears as a small load.
A single finger with strap on it works as an on/off switch for the antenna.
The RFID strap could be attached to a printed antenna array structure without having any electrical connection to any antenna element. Such RFID transponder structure has the advantage of simplified strap attachment in-line with antenna printing.
The bandwidth and coupling parameters could be adjusted by tapering the width of rectangular elements such that it forms a diamond shaped patch.
chip strap on it In the case of RFID UHF antennas, characteristics such as high gain, beam scanning or steering capability are possible when discrete fingers are combined to form arrays. The center points of the elements (fingers) are adjusted to coincide with the voltage maxima of the transmission line feeder so that each element appears as a small load.
A single finger with strap on it works as an on/off switch for the antenna.
The RFID strap could be attached to a printed antenna array structure without having any electrical connection to any antenna element. Such RFID transponder structure has the advantage of simplified strap attachment in-line with antenna printing.
The bandwidth and coupling parameters could be adjusted by tapering the width of rectangular elements such that it forms a diamond shaped patch.
4. Forming of 3D textured surface of antenna during of printing process There is a significant improvement of RFID antenna performance if the antenna surface has 3D textured surface. The sizes and shapes of 3D surface elements need to be tuned to the antenna resonance frequency and bandwidth.
Flexographic and gravure printing processes give all required means to control size and shape of antenna surface texture elements. For example plate screening could be used to control depth and shape of antenna surface texture. Ink viscosity, softness of plate material and of sticky back, as well as printing speed are other variables affecting 3D
antenna surface structure. The antenna could be printed on a textured substrate which has surface parameters tuned to the antenna resonance. See for example Fig. 6.
Printing on a substrate with variable ink absorption of the surface gives the same effect to the textured substrate. Ink absorption could be controlled by a non-absorbing material mask printed as an under layer.
Flexographic and gravure printing processes give all required means to control size and shape of antenna surface texture elements. For example plate screening could be used to control depth and shape of antenna surface texture. Ink viscosity, softness of plate material and of sticky back, as well as printing speed are other variables affecting 3D
antenna surface structure. The antenna could be printed on a textured substrate which has surface parameters tuned to the antenna resonance. See for example Fig. 6.
Printing on a substrate with variable ink absorption of the surface gives the same effect to the textured substrate. Ink absorption could be controlled by a non-absorbing material mask printed as an under layer.
Claims (3)
1. A method of manufacturing RFID transponders comprising the steps of:
providing a roll of continuous label or tape material having an adhesive material coating one surface thereof;
applying an anti-adhesive coating to predetermined areas of said surface so as to deactivate the adhesive in such areas;
printing first spaced-apart conductive pads in said areas using an electrically conductive ink;
permitting said conductive ink to cure; and applying to said first spaced-apart conductive pads a pre-formed RFID chip strap having second electrically conductive pads at spaced-apart locations thereon and supporting an RFID chip between and in electrical contact with said second conductive pads;
said strap being adhered to said label or tape material through contact with said adhesive material at locations adjacent said predetermined areas so as to maintain electrical contact between said first and second conductive pads.
providing a roll of continuous label or tape material having an adhesive material coating one surface thereof;
applying an anti-adhesive coating to predetermined areas of said surface so as to deactivate the adhesive in such areas;
printing first spaced-apart conductive pads in said areas using an electrically conductive ink;
permitting said conductive ink to cure; and applying to said first spaced-apart conductive pads a pre-formed RFID chip strap having second electrically conductive pads at spaced-apart locations thereon and supporting an RFID chip between and in electrical contact with said second conductive pads;
said strap being adhered to said label or tape material through contact with said adhesive material at locations adjacent said predetermined areas so as to maintain electrical contact between said first and second conductive pads.
2. The method of claim 1 including the step of applying ultrasonic energy to said first and second conductive pads to enhance electrical contact therebetween, the conductive ink of said conductive pads being susceptible to ultrasonic welding.
3. The method of claim 1 wherein said first conductive pads are printed so as to have a textured surface for exposure to said second conductive pads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA 2528797 CA2528797A1 (en) | 2005-12-01 | 2005-12-01 | Rfid transponder structure optimized for in-line label construction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA 2528797 CA2528797A1 (en) | 2005-12-01 | 2005-12-01 | Rfid transponder structure optimized for in-line label construction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2528797A1 true CA2528797A1 (en) | 2007-06-01 |
Family
ID=38110527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2528797 Abandoned CA2528797A1 (en) | 2005-12-01 | 2005-12-01 | Rfid transponder structure optimized for in-line label construction |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA2528797A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110308986A1 (en) * | 2009-02-27 | 2011-12-22 | Sam Hwa Dang P And T Co., Ltd | Packaging box with a radio frequency identification tag |
| US8884765B2 (en) | 2004-10-08 | 2014-11-11 | Thin Film Electronics Asa | RF and/or RF identification tag/device having an integrated interposer, and methods for making and using the same |
| EP2026254B1 (en) * | 2007-08-10 | 2015-04-22 | Thin Film Electronics ASA | RF and/or RF identification tag/device having an integrated interposer, and methods for making and using the same |
| WO2016070272A1 (en) * | 2014-11-04 | 2016-05-12 | Intelligent Devices Sezc Inc. | Means for monitoring compliance, facilitating automatic dispensing and childproofing strip packaged medication |
| SE1751620A1 (en) * | 2017-12-21 | 2019-06-22 | Stora Enso Oyj | Method for manufacturing a collar piece comprising an RFID tag |
-
2005
- 2005-12-01 CA CA 2528797 patent/CA2528797A1/en not_active Abandoned
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8884765B2 (en) | 2004-10-08 | 2014-11-11 | Thin Film Electronics Asa | RF and/or RF identification tag/device having an integrated interposer, and methods for making and using the same |
| US9953259B2 (en) | 2004-10-08 | 2018-04-24 | Thin Film Electronics, Asa | RF and/or RF identification tag/device having an integrated interposer, and methods for making and using the same |
| EP2026254B1 (en) * | 2007-08-10 | 2015-04-22 | Thin Film Electronics ASA | RF and/or RF identification tag/device having an integrated interposer, and methods for making and using the same |
| US20110308986A1 (en) * | 2009-02-27 | 2011-12-22 | Sam Hwa Dang P And T Co., Ltd | Packaging box with a radio frequency identification tag |
| WO2016070272A1 (en) * | 2014-11-04 | 2016-05-12 | Intelligent Devices Sezc Inc. | Means for monitoring compliance, facilitating automatic dispensing and childproofing strip packaged medication |
| US10588826B2 (en) | 2014-11-04 | 2020-03-17 | Intelligent Devices Sezc Inc. | Means for monitoring compliance, facilitating automatic dispensing and childproofing strip packaged medications |
| SE1751620A1 (en) * | 2017-12-21 | 2019-06-22 | Stora Enso Oyj | Method for manufacturing a collar piece comprising an RFID tag |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Dead |