KR920016160A - 개선된 금속 가공용 다이 성형구 - Google Patents

개선된 금속 가공용 다이 성형구 Download PDF

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Publication number
KR920016160A
KR920016160A KR1019920002014A KR920002014A KR920016160A KR 920016160 A KR920016160 A KR 920016160A KR 1019920002014 A KR1019920002014 A KR 1019920002014A KR 920002014 A KR920002014 A KR 920002014A KR 920016160 A KR920016160 A KR 920016160A
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KR
South Korea
Prior art keywords
substrate
coating
predetermined shape
molding tool
processing
Prior art date
Application number
KR1019920002014A
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English (en)
Other versions
KR950009146B1 (ko
Inventor
엔. 마토시안 제스
에이. 위소키 조셉
쥐. 윌슨 로버트
쥐. 야마기시 프레드릭
에프. 린쯔 쥬니어 에드워드
Original Assignee
완다 케이. 덴슨-로우
휴우즈 에어크라프트 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR920016160A publication Critical patent/KR920016160A/ko
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Publication of KR950009146B1 publication Critical patent/KR950009146B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D37/00—Tools as parts of machines covered by this subclass
    • B21D37/20—Making tools by operations not covered by a single other subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D37/00—Tools as parts of machines covered by this subclass
    • B21D37/10—Die sets; Pillar guides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J13/00—Details of machines for forging, pressing, or hammering
    • B21J13/02—Dies or mountings therefor
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1295—Process of deposition of the inorganic material with after-treatment of the deposited inorganic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Metallurgy (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
  • Physical Vapour Deposition (AREA)
  • Shaping Metal By Deep-Drawing, Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

내용 없음

Description

개선된 금속 가공용 다이 성형구
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 성형 공정 도중 암/수 세트의 금속 가공 다이의 개략적인 측면도, 제2도는 실리콘 개질 유기 재료를 코팅시킨 다이 비드의 일부 확대 측면도, 제3도는 이온 주식 처리 완결 후의 제3도와 유사한 측면도.

Claims (10)

  1. 재료 가공용 성형구의 예정된 형상을 가지는 기판을 제공하는 단계, 이 기판을 실리콘 개질 유기 재료 코팅제로 코팅시키는 단계, 및 이 코팅을 실리콘 개질 유기 재료의 적어도 일부를 실리콘 카아바이드 함유 코팅으로 변형시키기에 충분한 횟수 및 에너지의 불활성 가스 원자로 이식시키는 단계로 이루어지는 예정된 형상을 가지는 성형구를 사용하여 가공편을 가공하는 방법.
  2. 제1항에 있어서, 상기 기판이 유기 재료임을 특징으로 하는 방법.
  3. 제1항에 있어서, 상기 기판이 에폭시임을 특징으로 하는 방법.
  4. 제1항에 있어서, 상기 기판이 비철 금속 합금임을 특징으로 하는 방법.
  5. 제1항에 있어서, 상기 기판이 아연 기재 합금임을 특징으로 하는 방법.
  6. 제1항에 있어서, 상기 기판이 필수 성분으로서 알루미늄 약 0 내지 10 중량%, 구리 약 0 내지 20 중량% 및 나머지 아연으로 이루어짐을 특징으로 하는 방법.
  7. 제1항에 있어서, 상기 불활성 가스 원자가 이온화됨을 특징으로 하는 방법.
  8. 재료 가공용 성형구의 예정된 형상을 가지는 기판, 및 상기 기판의 표면 상의 필수 성분으로서 실리콘, 탄소 및 수소 원자와 함께 1:1의 원자비의 실리콘 및 탄소 원자로 이루어지는 코팅으로 이루어지는, 연장된 작용 수명을 가지는 코팅된 재료 가공용 성형구.
  9. 아연 기재 합금으로 형성된 재료 가공용 성형구의 예정된 형상을 가지는 기판을 제공하는 단계, 상기 기판의 표면 상에 질소를 이식하여 기판의 표면을 경화시키는 단계로 이루어지는 예정된 형상의 성형구를 사용하여 가공편을 가공하는 방법.
  10. 제9항에 있어서, 상기 이식 단계 중에 도입된 질소의 양이 ㎤당 약 1017내지 1018이온임을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920002014A 1991-02-12 1992-02-12 개선된 금속 가공용 다이 성형구 및 그 성형구를 이용한 가공편의 가공 방법 KR950009146B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/654,868 US5143747A (en) 1991-02-12 1991-02-12 Die improved tooling for metal working
US654,868 1991-02-12

Publications (2)

Publication Number Publication Date
KR920016160A true KR920016160A (ko) 1992-09-24
KR950009146B1 KR950009146B1 (ko) 1995-08-16

Family

ID=24626570

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920002014A KR950009146B1 (ko) 1991-02-12 1992-02-12 개선된 금속 가공용 다이 성형구 및 그 성형구를 이용한 가공편의 가공 방법

Country Status (8)

Country Link
US (1) US5143747A (ko)
EP (2) EP0694353A2 (ko)
JP (2) JPH0557378A (ko)
KR (1) KR950009146B1 (ko)
CA (1) CA2060952C (ko)
DE (1) DE69218481T2 (ko)
IL (1) IL100911A (ko)
MX (1) MX9200610A (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180008644A (ko) * 2015-05-19 2018-01-24 코닝 인코포레이티드 시트와 캐리어의 결합을 위한 물품 및 방법
US11905201B2 (en) 2015-06-26 2024-02-20 Corning Incorporated Methods and articles including a sheet and a carrier
US11999135B2 (en) 2018-08-20 2024-06-04 Corning Incorporated Temporary bonding using polycationic polymers

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IL100910A (en) * 1991-02-12 1994-10-07 Hughes Aircraft Co Assessment of the degree of wear of objects
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US6025379A (en) * 1996-03-11 2000-02-15 Eli Lilly And Company Methods of treating or preventing interstitial cystitis
FR2797039B1 (fr) 1999-07-27 2001-10-12 Ziepack Echangeur de chaleur en module d'echange s'y rapportant
DE10155233A1 (de) * 2001-11-09 2003-05-22 Volkswagen Ag Werkzeug aus Kunststoff
US9340869B2 (en) * 2008-08-19 2016-05-17 Lintec Corporation Formed article, method for producing the same, electronic device member, and electronic device
CN102245379B (zh) * 2008-12-12 2015-06-24 琳得科株式会社 叠层体、其制造方法、电子设备构件和电子设备
TWI491500B (zh) * 2009-02-16 2015-07-11 Lintec Corp A manufacturing method of a laminated body, a structure for an electronic device, and an electronic device
JP5379530B2 (ja) 2009-03-26 2013-12-25 リンテック株式会社 成形体、その製造方法、電子デバイス用部材および電子デバイス
WO2010134609A1 (ja) 2009-05-22 2010-11-25 リンテック株式会社 成形体、その製造方法、電子デバイス用部材および電子デバイス
JP5697230B2 (ja) 2010-03-31 2015-04-08 リンテック株式会社 成形体、その製造方法、電子デバイス用部材及び電子デバイス
EP2607412A4 (en) 2010-08-20 2014-04-30 Lintec Corp MOLDING, MANUFACTURING METHOD THEREFOR, PART FOR ELECTRONIC DEVICES, AND ELECTRONIC DEVICE
TWI535561B (zh) 2010-09-21 2016-06-01 Lintec Corp A molded body, a manufacturing method thereof, an electronic device element, and an electronic device
TWI457235B (zh) 2010-09-21 2014-10-21 Lintec Corp A gas barrier film, a manufacturing method thereof, an electronic device element, and an electronic device

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180008644A (ko) * 2015-05-19 2018-01-24 코닝 인코포레이티드 시트와 캐리어의 결합을 위한 물품 및 방법
US11905201B2 (en) 2015-06-26 2024-02-20 Corning Incorporated Methods and articles including a sheet and a carrier
US11999135B2 (en) 2018-08-20 2024-06-04 Corning Incorporated Temporary bonding using polycationic polymers

Also Published As

Publication number Publication date
EP0499197A2 (en) 1992-08-19
EP0499197A3 (en) 1993-06-23
DE69218481D1 (de) 1997-04-30
DE69218481T2 (de) 1997-10-09
EP0499197B1 (en) 1997-03-26
KR950009146B1 (ko) 1995-08-16
MX9200610A (es) 1992-08-01
EP0694353A2 (en) 1996-01-31
CA2060952A1 (en) 1992-08-13
IL100911A0 (en) 1992-11-15
CA2060952C (en) 1999-10-05
EP0694353A3 (ko) 1996-03-06
JPH0557378A (ja) 1993-03-09
IL100911A (en) 1996-10-31
US5143747A (en) 1992-09-01
JPH0857560A (ja) 1996-03-05

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