KR20150073976A - Glass laminate and manufacturing method therefor, and support base with silicone resin layer - Google Patents

Abstract

The present invention provides a semiconductor device comprising a support substrate layer, a silicon resin layer, and a glass substrate layer in this order, wherein the peel strength of the interface between the support substrate layer and the silicon resin layer is higher than the peel strength of the interface between the silicon resin layer and the glass substrate A glass laminate, wherein the silicone resin of the silicone resin layer is a crosslinked organopolysiloxane, the silicone resin layer contains a silicone oil, and either one of the silicone resin and the silicone oil of the silicone resin layer has an aromatic group, To a glass laminate substantially free of aromatic groups.

Description

TECHNICAL FIELD [0001] The present invention relates to a glass laminate, a glass laminate, a method of manufacturing the same, and a substrate having a silicon resin layer,

The present invention relates to a glass laminate and a method of manufacturing the same, and more particularly to a glass laminate having a silicone resin layer containing a silicone oil and a method of manufacturing the same.

The present invention also relates to a supporting substrate having a silicon resin layer, and more particularly to a supporting substrate having a silicon resin layer on which a glass substrate is laminated so as to be peelable, and a method of manufacturing the same.

In recent years, thinner and lighter devices (electronic devices) such as a solar cell (PV), a liquid crystal panel (LCD), and an organic EL panel (OLED) have been made thinner and thinner glass substrates used in these devices are being developed. If the strength of the glass substrate is insufficient due to the thinning, the handling property of the glass substrate in the manufacturing process of the device is deteriorated.

Therefore, conventionally, a method of thinning a glass substrate by chemical etching after forming a device member (for example, a thin film transistor) on a glass substrate thicker than the final thickness has been widely adopted.

However, in this method, for example, when the thickness of one glass substrate is reduced to 0.7 mm to 0.2 mm or 0.1 mm, most of the original glass substrate is etched with an etchant, so productivity and efficiency of use of raw materials It is not preferable. Further, in the method of thinning a glass substrate by the chemical etching, when fine scratches are present on the surface of the glass substrate, fine recesses (etch pits) are formed starting from the scratches by the etching treatment to become optical defects There was a case.

In recent years, in order to cope with the above problem, a glass laminate in which a thin plate glass substrate and a reinforcing plate are laminated is prepared, an electronic device member such as a display device is formed on a thin plate glass substrate of a glass laminate, A method of separating a support plate has been proposed (for example, refer to Patent Document 1 or Patent Document 2). The reinforcing plate has a support plate and a silicone resin layer fixed on the support plate, and the silicon resin layer and the thin plate glass substrate are brought into close contact with each other in a peelable manner. The interface between the silicon resin layer of the glass laminate and the thin plate glass substrate is peeled off and the reinforcing plate separated from the thin plate glass substrate is laminated with a new thin plate glass substrate and can be reused as a glass laminate.

Further, in Patent Document 2 (particularly Example 7), a form using a silicone resin layer containing dimethylpolysiloxane as a silicone oil is specifically disclosed.

International Publication No. 2007/018028 International Publication No. 2011/142280

With respect to the glass laminate described in Patent Documents 1 and 2, higher heat resistance has recently been required. As the electronic device member formed on the glass substrate of the glass laminate becomes more sophisticated and complicated, the temperature for forming the electronic device member becomes higher and the time for exposure to the higher temperature is also required to be longer There are a few cases. In addition, the glass substrate to be used is becoming thinner, and handling thereof becomes difficult.

The glass laminate described in Patent Documents 1 and 2 can withstand treatment at 300 ° C for 1 hour in air. However, according to the examination by the present inventors, referring to Patent Documents 1 and 2, when a glass laminate using a thinner glass substrate is subjected to the treatment at 350 DEG C for 1 hour, the glass substrate is peeled from the surface of the silicon resin layer The glass substrate is not peeled off from the surface of the resin layer and a part of the glass substrate is broken or a part of the resin of the resin layer remains on the glass substrate, resulting in a decrease in the productivity of the electronic device.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems and provides a glass laminate capable of easily peeling off a glass substrate while suppressing an increase in peel strength between the glass substrate and the silicone resin layer even after high- .

It is also an object of the present invention to provide a supporting base material with a silicone resin layer used in the production of the glass laminate.

Means for Solving the Problems The present inventors have conducted intensive studies to solve the above problems and have completed the present invention.

That is, a first aspect of the present invention is a method for manufacturing a semiconductor device, comprising the steps of: providing a support substrate layer, a silicon resin layer, and a glass substrate layer in this order; Wherein the silicone resin of the silicone resin layer is a crosslinked product of a crosslinkable organopolysiloxane and the silicone resin layer contains a silicone oil and the silicone resin contained in the silicone resin layer and the silicone oil One of which has an aromatic group and the other of which does not substantially contain an aromatic group.

In the first aspect, it is preferable that the silicone oil has a phenyl group and the content of the phenyl group in the total organic groups bonded to the silicon atom in the silicone oil is 5 to 50 mol%.

In the first aspect, it is preferable that the content of the silicone oil in the silicone resin layer is 6 to 20 parts by mass based on 100 parts by mass of the silicone resin.

In the first aspect, it is preferable that the viscosity of the silicone oil at 25 캜 is 100 to 6000 cP.

In the first aspect, it is preferable that the thickness of the silicone resin layer is 2 to 100 mu m.

In the first aspect, it is preferable that the supporting substrate is a glass plate.

In a second aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: forming a layer containing a crosslinkable organopolysiloxane and a silicone oil on one side of a supporting substrate; crosslinking the crosslinkable organopolysiloxane on the supporting substrate surface to form a silicone resin layer; And a glass substrate is laminated on the surface of the resin layer.

A third aspect of the present invention is a silicon resin layer-attached supporting substrate having a supporting substrate and a silicone resin layer having a releasable surface formed on the supporting substrate surface, wherein the silicone resin of the silicone resin layer is a crosslinked organopolysiloxane , The silicone resin layer comprises a silicone oil, and either the silicone resin or the silicone oil contained in the silicone resin layer has an aromatic group and the other silicone resin layer does not substantially contain an aromatic group.

In the third aspect, the silicone oil has a phenyl group, and the content of the phenyl group in the total organic groups bonded to silicon atoms in the silicone oil is preferably 5 to 50 mol%, more preferably 5 to 30 mol%.

In the third aspect, it is preferable that the content of the silicone oil in the silicone resin layer is 6 to 20 parts by mass based on 100 parts by mass of the silicone resin.

In the third aspect, it is preferable that the viscosity of the silicone oil at 25 캜 is 100 to 6000 cP.

According to the present invention, it is possible to provide a glass laminate capable of easily peeling off a glass substrate while suppressing an increase in peel strength between the glass substrate and the silicone resin layer even after high-temperature heat treatment conditions, and a method for manufacturing the same.

Further, according to the present invention, it is also possible to provide a silicon resin layer-adhered support substrate used in the production of the glass laminate.

1 is a schematic cross-sectional view of one embodiment of a glass laminate according to the present invention.
2 (A) to 2 (D) are schematic cross-sectional views showing one embodiment of a manufacturing method of a glass substrate with a member according to the present invention, in the order of steps.

 Hereinafter, the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiments, and various modifications and substitutions may be made to the following embodiments without departing from the scope of the present invention. Can be added.

The glass laminate of the present invention has a layer of a supporting substrate, a layer of a silicone resin and a layer of a glass substrate in this order. That is, a silicon resin layer is provided between the layer of the supporting substrate and the layer of the glass substrate, and thus the silicon resin layer is in contact with the layer of the supporting substrate on one side and the layer of the glass substrate on the other side.

One of the characteristic features of the glass laminate of the present invention is that the silicone resin layer contains silicone oil and only either one of the silicone resin and silicone oil of the silicone resin layer has an aromatic group and the other has substantially no aromatic group . The incorporation of an aromatic group into either the silicone resin or the silicone oil lowers the compatibility of both. As a result, the silicone oil tends to bleed out on the surface of the silicone resin layer in a short time, and even if the time from the formation of the silicone resin layer to the lamination of the glass substrate is short, a silicone resin layer showing good releasability to the glass substrate is easily obtained As a result, even after the high-temperature heating, the increase in the peeling strength between the glass substrate and the silicon resin layer can be suppressed. Further, when a predetermined silicone oil is used as described later, the transparency of the surface of the silicone resin layer is further ensured, and the transparency of the surface of the glass substrate peeled is also excellent.

Further, since the silicone resin layer of the present invention exhibits good releasability, even if the thickness of the glass substrate is made thin, it is difficult to break the glass substrate at the time of peeling after high temperature heating.

1 is a schematic cross-sectional view of an example of a glass laminate according to the present invention.

As shown in Fig. 1, the glass laminate 10 is a laminate in which a layer of the supporting substrate 12, a layer of the glass substrate 16, and a silicon resin layer 14 are present therebetween. One side of the silicon resin layer 14 is in contact with the layer of the supporting substrate 12 and the other side of the silicon resin layer 14 is in contact with the first main surface 16a of the glass substrate 16. [ In other words, the silicon resin layer 14 is in contact with the first main surface 16a of the glass substrate 16.

The two-layer portion including the layer of the supporting substrate 12 and the silicon resin layer 14 reinforces the glass substrate 16 in the member forming process for manufacturing the electronic device member such as the liquid crystal panel. The two-layer portion including the layer of the supporting substrate 12 and the silicon resin layer 14 previously prepared for the production of the glass laminate 10 is referred to as the supporting substrate 18 with the silicone resin layer.

This glass laminate 10 is used until the member forming process described later. That is, this glass laminate 10 is used on the surface of the second main surface 16b of the glass substrate 16 until a member for an electronic device such as a liquid crystal display device is formed. Thereafter, the glass laminate on which the electronic device member is formed is separated into the supporting base material 18 with the silicone resin layer and the glass substrate with the member, and the supporting base material 18 with the silicone resin layer is not a part constituting the electronic device Do not. The supporting base material 18 with the silicone resin layer can be laminated with the new glass substrate 16 and reused as a new glass laminate 10. [

The interface between the supporting substrate 12 and the silicone resin layer 14 has a peeling strength x and a stress in the peeling direction exceeding the peeling strength x is applied to the interface between the supporting substrate 12 and the silicon resin layer 14 The interface between the supporting substrate 12 and the silicone resin layer 14 is peeled off. The interface between the silicon resin layer 14 and the glass substrate 16 has a peel strength y and a stress in the peeling direction exceeding the peel strength y is exerted on the interface between the silicon resin layer 14 and the glass substrate 16 The interface between the silicon resin layer 14 and the glass substrate 16 is peeled off.

 In the glass laminate 10 (also referred to as a laminate with electronic device members described later), the peel strength x is higher than the peel strength y. The glass laminate 10 of the present invention can be obtained by forming the silicon resin layer 14 and the glass substrate 16 together with the glass substrate 16 by applying stress to the glass laminate 10 in the direction in which the supporting substrate 12 and the glass substrate 16 are separated from each other. ) To separate the glass substrate 16 and the silicon resin layer-adhered supporting substrate 18.

The peel strength (x) is preferably sufficiently high as compared with the peel strength (y). Raising the peel strength x means that the adhesion force of the silicone resin layer 14 to the support substrate 12 can be increased and a relatively high adhesion force to the glass substrate 16 can be maintained after the heat treatment .

In order to increase the adhesion of the silicone resin layer 14 to the supporting substrate 12, it is preferable that the silicone resin layer 14 is formed by crosslinking and curing the crosslinkable organopolysiloxane on the supporting substrate 12 as described later. The silicone resin layer 14 bonded to the supporting substrate 12 with high bonding force can be formed by the adhesive force at the time of crosslinking curing.

On the other hand, the bonding force of the crosslinkable organopolysiloxane to the cured glass substrate 16 after crosslinking curing is generally lower than the bonding force generated at the time of crosslinking curing. The crosslinkable organopolysiloxane is crosslinked and cured on the supporting substrate 12 to form the silicone resin layer 14 and thereafter the glass substrate 16 is laminated on the surface of the silicone resin layer 14 to form a glass laminate 10).

Hereinafter, each layer (supporting substrate 12, glass substrate 16, and silicone resin layer 14) constituting the glass laminate 10 will be described in detail, and then the glass laminate and the glass with members A method of manufacturing a substrate will be described in detail.

[Supporting substrate]

The supporting substrate 12 supports and reinforces the glass substrate 16 and is capable of deforming and deforming the glass substrate 16 at the time of manufacturing the electronic device member in the member forming process (the process for manufacturing the electronic device member) It prevents scratches, breakage, and the like.

As the supporting substrate 12, for example, a metal plate such as a glass plate, a plastic plate, an SUS plate, or the like is used. It is preferable that the supporting substrate 12 is formed of a material having a small difference in coefficient of linear expansion from the glass substrate 16 and is formed of the same material as that of the glass substrate 16 And the supporting substrate 12 is preferably a glass plate. In particular, the supporting substrate 12 is preferably a glass plate containing the same glass material as the glass substrate 16.

The thickness of the supporting substrate 12 may be thicker than that of the glass substrate 16, or it may be thin. The thickness of the supporting substrate 12 is preferably selected based on the thickness of the glass substrate 16, the thickness of the silicon resin layer 14, and the thickness of the glass laminate 10. [ For example, the present member forming process is designed to process a substrate having a thickness of 0.5 mm. When the sum of the thickness of the glass substrate 16 and the thickness of the silicon resin layer 14 is 0.1 mm, The thickness is 0.4 mm. The thickness of the supporting substrate 12 is usually 0.2 to 5.0 mm.

When the supporting substrate 12 is a glass plate, the thickness of the glass plate is preferably 0.08 mm or more for ease of handling and difficulty in breaking. It is preferable that the thickness of the glass plate is 1.0 mm or less for the reason that the rigidity required to bend properly and not break when peeling off after formation of the electronic device member is desired.

The difference in average coefficient of linear expansion between the support substrate 12 and the glass substrate 16 at 25 to 300 占 폚 is preferably 500 占^10-7 / 占 폚 or less, more preferably 300 占^10-7 / 占 폚 or less , More preferably 200 x 10 < ^-7 > / DEG C or less. If the car is excessively large, there is a possibility that the glass laminate 10 is significantly bent and the supporting substrate 12 and the glass substrate 16 are peeled off during the heating and cooling in the member forming step. When the material of the supporting substrate 12 is the same as the material of the glass substrate 16, occurrence of such a problem can be suppressed.

[Glass Substrate]

The glass substrate 16 is provided with the electronic device member on the second main surface 16b on the side opposite to the side of the silicon resin layer 14 with the first main surface 16a contacting with the silicon resin layer 14. [

The type of the glass substrate 16 may be a general one, and examples thereof include glass substrates for display devices such as LCDs and OLEDs. The glass substrate 16 is excellent in chemical resistance and moisture permeability, and has a low heat shrinkage rate. The coefficient of thermal expansion specified in JIS R 3102 (revised in 1995) is used as an index of the heat shrinkage ratio.

If the coefficient of linear expansion of the glass substrate 16 is large, the member forming process often involves heat treatment, and thus various problems are likely to occur. For example, when the TFT is formed on the glass substrate 16, if the glass substrate 16 on which the TFT is formed under heating is cooled, the positional deviation of the TFT may be excessive due to heat shrinkage of the glass substrate 16. [

The glass substrate 16 is obtained by melting a glass raw material and molding the molten glass into a plate. Such a forming method may be a general one, and for example, a float method, a fusion method, a slot down-draw method, a fur co-ling method, a lub bus method, and the like are used. In particular, the glass substrate 16 having a small thickness can be obtained by heating the glass molded into a plate shape at a moldable temperature, thinning it by means of drawing or the like (lead-down method).

The kind of glass of the glass substrate 16 is not particularly limited, but is preferably an alkali-free borosilicate glass, borosilicate glass, soda lime glass, high silica glass, or other oxide-based glass mainly containing silicon oxide. As the oxide-based glass, glass having a silicon oxide content of 40 to 90 mass% in terms of an oxide is preferable.

As the glass for the glass substrate 16, glass suitable for the kind of the electronic device member and its manufacturing process is adopted. For example, a glass substrate for a liquid crystal panel includes a glass (alkali-free glass) substantially free from an alkali metal component in that the elution of the alkali metal component tends to affect the liquid crystal (note that the alkali- . Thus, the glass of the glass substrate 16 is appropriately selected based on the kind of the applied device and the manufacturing process thereof.

The thickness of the glass substrate 16 is preferably 0.3 mm or less, more preferably 0.15 mm or less, and still more preferably 0.10 mm or less from the viewpoints of reducing the thickness and / or weight of the glass substrate 16. [ When the thickness is 0.3 mm or less, it is possible to impart good flexibility to the glass substrate 16. When the thickness is 0.15 mm or less, the glass substrate 16 can be rolled up.

The thickness of the glass substrate 16 is preferably 0.03 mm or more for ease of manufacture of the glass substrate 16 and ease of handling of the glass substrate 16. [

Further, the glass substrate 16 may include two or more layers, and in this case, the materials for forming the respective layers may be the same type or different materials. In this case, " the thickness of the glass substrate 16 " means the total thickness of all the layers.

[Silicone resin layer]

The silicon resin layer 14 prevents the positional deviation of the glass substrate 16 until the operation of separating the glass substrate 16 and the supporting substrate 12 is performed, Thereby preventing damage to the semiconductor device. A surface 14a of the silicon resin layer 14 which is in contact with the glass substrate 16 (the first main surface of the silicon resin layer) is in close contact with the first main surface 16a of the glass substrate 16 in a peelable manner. The peeling strength y of the interface between the silicon resin layer 14 and the supporting substrate 12 is set so that the peeling strength y of the interface between the silicon resin layer 14 and the supporting substrate 12 (X) of the interface between the substrate and the substrate.

That is, when separating the glass substrate 16 and the supporting substrate 12, the glass substrate 16 is separated from the interface between the first main surface 16a of the glass substrate 16 and the silicone resin layer 14, It is difficult to peel off from the interface of the layer 14. Therefore, the silicon resin layer 14 is in close contact with the first main surface 16a of the glass substrate 16, but has a surface characteristic capable of easily separating the glass substrate 16. That is, the silicon resin layer 14 is bonded to the first main surface 16a of the glass substrate 16 with a certain degree of bonding force to prevent displacement of the glass substrate 16, and the glass substrate 16 The glass substrate 16 is bonded to the glass substrate 16 with a bonding force so that the glass substrate 16 can easily be peeled off. In the present invention, the property that the surface of the silicone resin layer 14 can easily be peeled off is referred to as peelability. On the other hand, the first main surface of the supporting substrate 12 and the silicon resin layer 14 are bonded with a bonding force that is relatively difficult to peel off.

The bonding force of the interface between the silicon resin layer 14 and the glass substrate 16 is formed by forming the electronic device member on the surface (the second main surface 16b) of the glass substrate 16 of the glass laminate 10 (I.e., the peel strength (x) or the peel strength (y) may be changed). However, even after forming the member for electronic devices, the peel strength (y) is lower than the peel strength (x).

It is considered that the layer of the silicone resin layer 14 and the glass substrate 16 are bonded by the bonding force resulting from the weak adhesive force or the Van der Waals force. In the case where the glass substrate 16 is laminated on the surface of the silicon resin layer 14 after the silicon resin layer 14 is formed, if the silicone resin of the silicone resin layer 14 is sufficiently crosslinked so as not to exhibit the adhesive force, It is believed that they are bonded by bonding force. However, the silicone resin of the silicone resin layer 14 often has a weak adhesive strength to some extent. Even when the adhesive property is very low, when the electronic device member is formed on the laminate after the production of the glass laminate 10, the silicone resin of the silicone resin layer 14 is heated on the glass substrate 16 surface And it is considered that the bonding force between the silicon resin layer 14 and the layer of the glass substrate 16 is increased.

 The bonding strength between the surface of the silicon resin layer 14 before lamination and the first main surface 16a of the glass substrate 16 before lamination may be weakened as the case may be. The bonding strength between the interface of the silicon resin layer 14 and the layer of the glass substrate 16 can be weakened and the peeling strength y can be lowered by performing non-adhesive treatment or the like on the surface to be laminated and then laminating it.

Further, the silicone resin layer 14 is bonded to the surface of the supporting substrate 12 with a strong bonding force such as an adhesive force or an adhesive force. For example, as described above, the cross-linking organopolysiloxane is crosslinked and cured at the surface of the support substrate 12, whereby the silicone resin, which is a cross-linked product, is adhered to the surface of the support substrate 12 to obtain a high bonding force. The surface of the supporting substrate 12 and the surface of the silicon resin layer 14 are subjected to a treatment (for example, a treatment using a coupling agent) that generates a strong bonding force between the surface of the supporting substrate 12 and the silicone resin layer 14, Can be increased.

The reason why the silicone resin layer 14 and the layer of the supporting substrate 12 are bonded with a high bonding force means that the peel strength x of the interface is high.

The thickness of the silicone resin layer 14 is not particularly limited, but is preferably 2 to 100 占 퐉, more preferably 3 to 50 占 퐉, and further preferably 7 to 20 占 퐉. When the thickness of the silicon resin layer 14 is within this range, the occurrence of distortion defects in the glass substrate 16 can be suppressed even when bubbles or foreign matter intervene between the silicon resin layer 14 and the glass substrate 16 . If the thickness of the silicone resin layer 14 is excessively large, it is not economical because the time and materials are required to be formed, and the heat resistance may be lowered. If the thickness of the silicon resin layer 14 is too small, the adhesion between the silicon resin layer 14 and the glass substrate 16 may be deteriorated.

Further, the silicon resin layer 14 may include two or more layers. In this case, the " thickness of the silicone resin layer 14 " means the total thickness of all the layers.

When the silicone resin layer 14 includes two or more layers, the resin forming each layer may include another crosslinked silicone resin.

The silicone resin contained in the silicone resin layer 14 is a crosslinked organopolysiloxane, and the silicone resin forms a three-dimensional mesh structure.

The kind of the crosslinkable organopolysiloxane is not particularly limited and the structure thereof is not particularly limited as long as it is crosslinked and cured via a predetermined crosslinking reaction to form a crosslinked product (cured product) constituting the silicone resin. You need it. The type of crosslinking is not particularly limited, and a known type can be appropriately adopted depending on the type of crosslinkable group contained in the crosslinkable organopolysiloxane. For example, a hydrosilylation reaction, a condensation reaction or a heat treatment, a high energy ray treatment, or a radical reaction with a radical polymerization initiator.

More specifically, when the crosslinkable organopolysiloxane has a radical reactive group such as an alkenyl group or an alkynyl group, the crosslinking organopolysiloxane is crosslinked by a reaction between the radical reactive groups via the radical reaction to form a cured product (crosslinked silicone resin).

Further, when the crosslinkable organopolysiloxane has a silanol group, the silanol groups are crosslinked by the condensation reaction to form a cured product.

The organopolysiloxane having a hydrogen atom (hydrosilyl group) bonded to a silicon atom and an organopolysiloxane having an alkenyl group (e.g., vinyl group) bonded to a silicon atom (i.e., an organoalkenyl polysiloxane) in which the crosslinkable organopolysiloxane is bonded to a silicon atom (I.e., organohydrogenpolysiloxane), it is crosslinked by a hydrosilylation reaction in the presence of a hydrosilylation catalyst (for example, a platinum catalyst) to form a cured product.

Among them, an organopolysiloxane having an alkenyl group at both terminals and / or side chains of a crosslinkable organopolysiloxane (hereinafter referred to as " organopolysiloxane " Organopolysiloxane A ") and an organopolysiloxane having a hydrosilyl group at both ends and / or side chains (hereinafter referred to as organopolysiloxane B suitably).

Examples of the alkenyl group include, but are not limited to, a vinyl group (ethynyl group), an allyl group (2-propenyl group), a butenyl group, a pentenyl group and a hexynyl group. Among them, A vinyl group is preferable.

Examples of the group other than the alkenyl group contained in the organopolysiloxane A and the group other than the hydrosilyl group contained in the organopolysiloxane B include an alkyl group (particularly an alkyl group having 4 or less carbon atoms).

Although the position of the alkenyl group in the organopolysiloxane A is not particularly limited, when the organopolysiloxane A is linear, the alkenyl group may be present in any of the M units and D units shown below, May be present on both sides of the D unit. It is preferable that at least in the M unit in terms of the curing rate, it is preferable that the M units exist on both sides of the two M units.

The M unit and the D unit are examples of basic constituent units of the organopolysiloxane, and the M unit is a monofunctional siloxane unit in which three organic groups are combined, and a D unit is a bifunctional siloxane unit in which two organic groups are combined. In the siloxane unit, the siloxane bond is regarded as a bond in which two silicon atoms are bonded through one oxygen atom, and therefore the oxygen atom per one silicon atom in the siloxane bond is regarded as 1/2, and O < _{1/2 &} .

The number of alkenyl groups in the organopolysiloxane A is not particularly limited, but is preferably 1 to 3, and more preferably 2 in one molecule.

Although the position of the hydrosilyl group in the organopolysiloxane B is not particularly limited, when the organopolysiloxane A is linear, the hydrosilyl group may be present either in the M unit or the D unit, and the M unit and the D unit Or the like. It is preferable that the curing agent exists at least in the D unit in terms of the curing rate.

The number of hydrosilyl groups in the organopolysiloxane B is not particularly limited, but it is preferably at least three, and more preferably three, in one molecule.

Although the mixing ratio of the organopolysiloxane A and the organopolysiloxane B is not particularly limited, the molar ratio (hydrogen atom / alkenyl group) of the hydrogen atoms bonded to the silicon atom in the organopolysiloxane B and the total alkenyl groups in the organopolysiloxane A is 0.7 to 1.05. ≪ / RTI > Among them, it is preferable to adjust the mixing ratio to be 0.8 to 1.0.

As the hydrosilylation catalyst, it is preferable to use a platinum group metal catalyst. As the platinum group metal catalyst, a catalyst such as a platinum group, a palladium group or a rhodium group can be used, and it is particularly preferable to use it as a platinum catalyst from the viewpoints of economical efficiency and reactivity. As the platinum group metal catalyst, known catalysts can be used. Specific examples thereof include chloroplatinic acid, platinum tetrachloride, an alcohol compound of chloroplatinic acid, an aldehyde compound, or an olefin complex of platinum, an alkenylsiloxane complex, a carbonyl complex, etc., such as platinum fine powder, platinum black, platinic chloride, platinic chloride, .

The hydrosilylation catalyst is used in an amount of preferably 0.1 to 20 parts by mass, more preferably 1 to 10 parts by mass per 100 parts by mass of the total mass of the organopolysiloxane A and the organopolysiloxane B.

The weight-average molecular weight of the crosslinkable organopolysiloxane is not particularly limited, but it is excellent in handleability, excellent in film-forming property, and further inhibited from decomposition of the silicone resin under high-temperature treatment conditions, so that GPC (gel permeation chromatography) The weight average molecular weight in terms of polystyrene measured by the measurement is preferably 1,000 to 5,000,000, more preferably 2,000 to 3,000,000.

The viscosity of the crosslinkable organopolysiloxane is preferably 10 to 5000 mPa · s, and more preferably 15 to 3000 mPa · s. In addition, unless otherwise noted, the values of viscosity described herein are values measured at 25 占 폚.

Examples of commercially available trade name or type number of the crosslinkable organopolysiloxane include KNS-320A, KS-847 (all manufactured by Shin-Etsu Silicone Co., Ltd.) and TPR6700 (Momentive Performance Material A combination of vinyl silicone " 8500 " (manufactured by Arakawa Chemical Industries, Ltd.) and methylhydrogenpolysiloxane " 12031 " (manufactured by Arakawa Kagaku Kogyo Co., (Manufactured by Arakawa Chemical Industries, Ltd.) and methylhydrogenpolysiloxane " 12031 " (manufactured by Arakawa Chemical Industries, Ltd.) And the like.

The silicone resin layer 14 includes silicone oil. Silicone oil is a non-crosslinkable (non-reactive) organopolysiloxane which does not react with the crosslinkable organopolysiloxane unlike the crosslinkable organopolysiloxane.

Examples of the silicone oil include, but are not limited to, straight silicone oils such as dimethylpolysiloxane, methylphenylpolysiloxane and diphenylpolysiloxane, and modified silicone oils obtained by introducing polyether groups, halogen groups, or the like into the side chains or terminals of straight silicone oil.

KF-50, KF-53, KF-50, KF-53, and KF-53 as a silicone oil having an aromatic group (for example, phenyl group) are commercially available, KF-54 (manufactured by Shin-Etsu Chemical Co., Ltd.) and SH550 (manufactured by Dow Corning Toray Co., Ltd.).

Examples of the silicone oil not having an aromatic group include SH200 (manufactured by Toray Dow Corning) and KNS-330 (manufactured by Shin-Etsu Chemical Co., Ltd.).

The viscosity of the silicone oil is not particularly limited. However, the viscosity of the silicone oil is not particularly limited, but the viscosity of the silicone resin layer 14 can be easily bleed out and the releasability of the glass substrate 16 is more excellent and the transparency of the peeled glass substrate 16 is excellent To 6000 cP, more preferably 100 to 3000 cP, and even more preferably 125 to 1000 cP.

The content of the silicone oil in the silicone resin layer 14 is not particularly limited. However, from the viewpoint of the excellent releasability of the glass substrate 16 and the better transparency of the glass substrate that has been peeled off, To 20 parts by mass, more preferably from 6 to 15 parts by mass, still more preferably from 8 to 15 parts by mass.

Either the silicone resin constituting the silicone resin layer 14 or the silicone oil contained in the silicone resin layer 14 described above has an aromatic group and the other has substantially no aromatic group. In other words, only either one of the silicone resin and the silicone oil has an aromatic group. As described above, in such a form, the compatibility of the silicone resin with the silicone oil is not good. As a result, the silicone oil tends to bleed out to the surface of the silicone resin layer 14, and the peeling of the glass substrate 16 It becomes easier to do.

The fact that the silicone resin or the silicone oil does not substantially contain an aromatic group means that an aromatic group may be present so far as it does not affect the effect of the present invention. More specifically, It is intended that the content of aromatic groups in the combined organic groups is less than 1 mol%.

The silicone resin or silicone oil having an aromatic group is intended to include an aromatic group at a content higher than the above content.

The type of the aromatic group is not particularly limited, and a monovalent aromatic group (for example, an aromatic hydrocarbon group or an aromatic heterocyclic group) and the like can be given. Of these, an aromatic hydrocarbon group is preferable in view of easy production of a silicone resin or a silicone oil, and a phenyl group is particularly preferable.

More specifically, when the silicone oil has an aromatic group, the silicone resin has substantially no aromatic group (Form A), the silicone resin has an aromatic group, and the silicone oil has substantially no aromatic group (Form B) There are two patterns. Among these, the case of the form A is preferable in that the production of the silicone resin layer 14 is easier and the releasability of the glass substrate 16 is better.

In the case of Form A, it is preferable that the aromatic group contained in the silicone oil is a phenyl group. Among them, the releasability of the glass substrate 16 after the high-temperature heat treatment is more excellent and the transparency of the separated glass substrate 16 is more excellent , The content of the aromatic group (particularly phenyl group) in the total organic groups bonded to the silicon atom in the silicone oil is preferably 5 to 50 mol%, more preferably 5 to 30 mol%, and most preferably 10 to 30 mol% More preferable.

In the case of form A, the bonding position of the aromatic group in the silicone oil is not particularly limited, and both ends and / or side chains may be mentioned. Examples of the group other than the phenyl group contained in the silicone oil include an alkyl group (e.g., a methyl group, an ethyl group, a propyl group, etc.).

On the other hand, in the case of Form B, it is preferable that the aromatic group contained in the silicone resin is a phenyl group, and in particular, from the viewpoint that the releasability of the glass substrate 16 after high- The content of the aromatic group (particularly phenyl group) is preferably 5 to 90 mol%, more preferably 30 to 90 mol%. In the case of Form B, examples of the group other than the phenyl group contained in the silicone resin include alkyl groups (e.g., methyl group, ethyl group, and propyl group).

As the silicone oil having an aromatic group, methylphenyl silicone oil is preferably used, for example, in view of excellent compatibility with the silicone resin.

Examples of the silicone resin having an aromatic group include silicone resins obtained by crosslinking a crosslinkable organopolysiloxane having a phenyl group.

[Glass laminate and manufacturing method thereof]

The glass laminate 10 of the present invention is a laminate having the supporting substrate 12, the glass substrate 16, and the silicon resin layer 14 therebetween as described above.

The method for producing the glass laminate 10 of the present invention is not particularly limited. However, in order to obtain a laminate having a peel strength (x) higher than the peel strength (y), a predetermined cross- A method of crosslinking and curing the polysiloxane to form the silicone resin layer 14 is preferred. That is, a layer containing a crosslinkable organopolysiloxane and a silicone oil is formed on the surface of the supporting substrate 12, and a crosslinkable organopolysiloxane is crosslinked on the surface of the supporting substrate 12 to form a silicone resin layer 14 And then the glass substrate 16 is laminated on the silicone resin surface of the silicon resin layer 14 to produce the glass laminate 10. [

When the crosslinkable organopolysiloxane is cured on the surface of the supporting substrate 12, the crosslinking organopolysiloxane is bonded by the interaction with the surface of the supporting substrate 12 during the curing reaction, and the peeling strength of the surface of the silicone resin and the supporting substrate 12 is increased do. Therefore, even when the glass substrate 16 and the supporting substrate 12 include the same material, the peeling strength between the silicon resin layer 14 and the both can be made different.

 Hereinafter, a layer containing a crosslinkable organopolysiloxane and a silicone oil is formed on the surface of the supporting substrate 12, and the crosslinkable organopolysiloxane is crosslinked on the surface of the supporting substrate 12 to form the silicone resin layer 14 The resin layer forming step and the step of laminating the glass substrate 16 on the silicone resin surface of the silicone resin layer 14 to form the glass laminate 10 will be referred to as a lamination step and the procedure of each step will be described in detail .

(Resin layer forming step)

 In the resin layer forming step, a layer containing a crosslinkable organopolysiloxane and a silicone oil is formed on the surface of the supporting substrate 12, and the crosslinkable organopolysiloxane is crosslinked on the surface of the supporting substrate 12 to form the silicone resin layer 14, .

In order to form a layer containing a crosslinkable organopolysiloxane and a silicone oil on the supporting substrate 12, a coating composition in which a crosslinkable organopolysiloxane and a silicone oil are dissolved in a solvent is used, 12) to form a layer of a solution, and then the solvent is removed to form a layer containing a crosslinkable organopolysiloxane and a silicone oil. The thickness of the layer containing the crosslinkable organopolysiloxane and the silicone oil can be controlled by adjusting the concentration of the crosslinkable organopolysiloxane and the silicone oil in the composition.

The solvent is not particularly limited as long as it is a solvent capable of easily dissolving the crosslinkable organopolysiloxane and the silicone oil under the working environment and capable of easily removing volatilization. Specific examples thereof include butyl acetate, heptane, 2-heptanone, 1-methoxy-2-propanol acetate, toluene, xylene, THF, chloroform and the like.

The method of applying the composition containing the crosslinkable organopolysiloxane and the silicone oil on the surface of the support substrate 12 is not particularly limited and a known method can be used. For example, a spray coat method, a die coat method, a spin coat method, a dip coat method, a roll coat method, a bar coat method, a screen printing method, and a gravure coat method.

Thereafter, a drying treatment for removing the solvent may be carried out if necessary. The method of the drying treatment is not particularly limited, and examples thereof include a method of removing the solvent under reduced pressure or a method of heating at a temperature at which curing of the crosslinkable organopolysiloxane does not proceed.

Subsequently, the crosslinkable organopolysiloxane on the supporting substrate 12 is crosslinked to form the silicone resin layer 14. [ More specifically, as shown in Fig. 2A, the silicon resin layer 14 is formed on the surface of at least one surface of the supporting substrate 12 in this step.

As the method of curing (crosslinking), an optimum method is appropriately selected according to the crosslinking type of the crosslinkable organopolysiloxane as described above, and examples thereof include a heat treatment and an exposure treatment. In particular, when a crosslinkable organopolysiloxane is crosslinked by a hydrosilylation reaction, a condensation reaction or a radical reaction, a silicone resin having excellent adhesion to the glass substrate 16 and heat resistance can be obtained, (14).

Hereinafter, the form of thermosetting will be described in detail.

The temperature condition for thermally curing the crosslinkable organopolysiloxane is not particularly limited within the range in which the heat resistance of the silicone resin layer 14 is improved and the peeling strength y after lamination with the glass substrate 16 can be controlled as described above However, it is preferably 150 to 300 占 폚, more preferably 180 to 250 占 폚. The heating time is usually 10 to 120 minutes, and more preferably 30 to 60 minutes. When the temperature is too low, the heat resistance and the flatness of the silicon resin layer 14 are deteriorated. On the other hand, if the temperature is too high, the peeling strength y becomes too low and both the glass substrate 16 and the silicone resin layer 14 May be weakened.

Further, the crosslinkable organopolysiloxane may be cured by pre-curing (pre-curing) followed by post-curing (final curing). Precured silicone resin layer 14 having better heat resistance can be obtained. Precure is preferably performed following removal of the solvent. In this case, the step of forming the layer containing the crosslinkable organopolysiloxane and the silicone oil by removing the solvent from the layer and the step of performing the pre-cure are not particularly distinguished.

(Lamination step)

In the laminating step, the glass substrate 16 is laminated on the silicon resin surface of the silicon resin layer 14 obtained in the resin layer forming step, and the layer of the supporting substrate 12, the silicon resin layer 14, Of the glass laminate 10 in this order. More specifically, as shown in Fig. 2 (B), the surface (the first main surface of the silicone resin layer) 14a of the silicon resin layer 14 opposite to the supporting substrate 12 side, The silicon resin layer 14 and the glass substrate 16 are laminated with the first main surface 16a of the glass substrate 16 having the second main surface 16a and the second main surface 16b as a lamination surface, ).

A method of laminating the glass substrate 16 on the silicon resin layer 14 is not particularly limited, and a known method can be adopted.

For example, a method of superimposing the glass substrate 16 on the surface of the silicon resin layer 14 under an atmospheric pressure environment. If necessary, the glass substrate 16 may be placed on the surface of the silicon resin layer 14, and then the glass substrate 16 may be pressed onto the silicon resin layer 14 using a roll or press. The bubbles mixed in between the silicone resin layer 14 and the glass substrate 16 are relatively easily removed by pressing by roll or press.

The vacuum lamination method or the vacuum press method is more preferable because it suppresses mixing of bubbles and secures good adhesion. There is an advantage that bubbles do not grow due to heating even when minute bubbles remain due to squeezing under vacuum, and it is difficult to lead to distortion defects of the glass substrate 16.

When the glass substrate 16 is laminated, it is preferable to thoroughly clean the surface of the glass substrate 16 which contacts the silicon resin layer 14, and to laminate in an environment with high cleanliness. The higher the cleanliness, the better the flatness of the glass substrate 16 is.

After the glass substrate 16 is laminated, a pre-annealing treatment (heat treatment) may be performed if necessary. The adhesion to the silicon resin layer 14 of the laminated glass substrate 16 is improved and the appropriate peeling strength y can be obtained by performing the pre-annealing process, The positional deviation of the member is less likely to occur, and the productivity of the electronic device is improved.

Optimum conditions are appropriately selected according to the type of the silicon resin layer 14 to be used, but the peel strength (y) between the glass substrate 16 and the silicon resin layer 14 is more suitable It is preferable to carry out heat treatment at 300 占 폚 or higher (preferably 300 to 400 占 폚) for 5 minutes or longer (preferably 5 to 30 minutes).

The formation of the silicone resin layer 14 is not limited to the above method.

For example, when the support base material 12 having a higher adhesion to the surface of the silicone resin than the glass substrate 16 is used, a crosslinkable organopolysiloxane is cured on any releasable surface to produce a film of silicone resin, The film can be laminated at the same time with the glass substrate 16 and the supporting substrate 12 interposed therebetween.

When the adhesion of the crosslinkable organopolysiloxane by curing is sufficiently low with respect to the glass substrate 16 and the adhesiveness thereof is sufficiently high with respect to the supporting substrate 12, the glass substrate 16 and the supporting substrate 12 The silicone resin layer 14 can be formed by curing the crosslinkable organopolysiloxane.

Even in the case where the supporting substrate 12 includes the same glass material as the glass substrate 16, a treatment for increasing the adhesiveness of the surface of the supporting substrate 12 is carried out to improve the peeling strength to the silicon resin layer 14 . For example, a chemical method (primer treatment) such as a silane coupling agent, a physical method of increasing the surface activation period such as a flame (flame treatment), and an increase in surface roughness such as a sand blast treatment, And a mechanical treatment method for increasing the mechanical strength.

(Glass laminate)

The glass laminate 10 of the present invention can be used for various purposes, for example, for the purpose of producing electronic components such as display panel, PV, thin-film secondary battery, semiconductor wafer with a circuit formed on the surface, etc. . Further, in the intended use, the glass laminate 10 is often exposed (for example, 1 hour or more) at a high temperature condition (for example, 350 ° C or more).

Here, the panel for a display device includes an LCD, an OLED, an electronic paper, a plasma display panel, a field emission panel, a quantum dot LED panel, a MEMS (Micro Electro Mechanical Systems) shutter panel and the like.

[Member-attached glass substrate and its manufacturing method]

In the present invention, a member-attached glass substrate (a glass substrate with a member for an electronic device) including a glass substrate and a member for an electronic device is produced by using the above-described laminate.

The production method of the glass substrate with the member is not particularly limited, but the electronic device member is formed on the glass substrate in the glass laminate so as to produce an electronic device laminate, It is preferable that the glass substrate side surface of the silicon resin layer is peeled off from the member-mounting laminate for electronic devices to separate the glass substrate with the member and the supporting substrate with the silicon resin layer.

Hereinafter, the step of forming the electronic device member on the glass substrate in the glass laminate to produce the laminate of electronic device member laminate is referred to as a member forming step, a step of forming a glass substrate side surface of the silicon resin layer The step of separating the glass substrate with the member and the supporting substrate with the silicon resin layer is referred to as a separation step.

Hereinafter, materials and procedures used in each step will be described in detail.

(Member forming process)

The member forming step is a step of forming an electronic device member on the glass substrate 16 in the glass laminate 10 obtained in the laminating step. More specifically, as shown in Fig. 2C, the electronic device member 20 is formed on the second main surface 16b (exposed surface) of the glass substrate 16, (22).

First, the electronic device member 20 used in this process will be described in detail and the procedure of the subsequent process will be described in detail.

(Member for electronic device (functional element))

The member 20 for the electronic device is a member formed on the glass substrate 16 in the glass laminate 10 and constituting at least a part of the electronic device. More specifically, the member 20 for an electronic device may be a member used for a display device panel, a solar cell, a thin-film secondary battery, or an electronic component such as a semiconductor wafer on which a circuit is formed (for example, Member for a battery, member for a thin film secondary battery, circuit for an electronic part).

For example, as a member for a solar cell, a transparent electrode such as tin oxide of a positive electrode in a silicon type, a silicon layer and a metal of a negative electrode which are represented by p layer / i layer / n layer, and the like, , A quantum dot type, and the like.

Examples of the member for a thin film secondary battery include a transparent electrode such as a metal or a metal oxide of a positive electrode and a negative electrode in a lithium ion type, a lithium compound in an electrolyte layer, a metal in a current collecting layer, a resin as a sealing layer, Various kinds of members corresponding to a small size, a polymer type, a ceramics electrolyte type, and the like.

As a circuit for an electronic component, a metal of a conductive part, a silicon oxide of an insulating part, silicon nitride, or the like can be cited in CCD or CMOS, and various sensors such as a pressure sensor and an acceleration sensor, a rigid printed board, a flexible printed board, Various members corresponding to substrates and the like.

(Process procedure)

The method of manufacturing the above-described electronic device-mounting member laminate 22 is not particularly limited, and the method of manufacturing the electronic device-mounting member laminate 22 may be appropriately selected depending on the type of constituent members of the electronic device member, And the member 20 for an electronic device is formed on the surface of the second main surface 16b.

The electronic device member 20 is not limited to all of the members finally formed on the second main surface 16b of the glass substrate 16 (hereinafter, referred to as "Quot; partial member "). The glass substrate with a partial member peeled off from the silicon resin layer 14 may be replaced with a glass substrate with an entire member (corresponding to an electronic device described later) in the subsequent steps.

Further, another electronic device member may be formed on the peeling surface (first main surface 16a) of the glass substrate with the entire member peeled off from the silicon resin layer 14. [ Alternatively, the electronic device may be manufactured by assembling the whole-member-attached laminate and thereafter peeling the supporting substrate 12 from the laminate with the whole member. Further, it is also possible to manufacture a glass substrate with a member having two glass substrates by assembling the two glass substrates together by using two sheets of the whole member-stacked laminate, and then peeling the two sheets of support substrates 12 from the stack of all the members .

For example, in the case of manufacturing an OLED, for example, the surface of the glass laminate 10 opposite to the side of the silicon resin layer 14 of the glass substrate 16 (the second main surface 16b of the glass substrate 16) A hole transporting layer, a light emitting layer, an electron transporting layer, or the like is deposited on a surface on which a transparent electrode is formed, or a back electrode is formed on the surface on which a transparent electrode is formed, Sealing with a plate, or the like. Specific examples of such layer formation and treatment include film forming treatment, vapor deposition treatment, and adhesion treatment of a sealing plate.

In the case of manufacturing a TFT-LCD, for example, a TFT-LCD can be manufactured by a general film-forming method such as a CVD method and a sputtering method using a resist solution on a second main surface 16b of the glass substrate 16 of the glass laminate 10 A TFT forming step of forming a thin film transistor (TFT) by patterning a metal film and a metal oxide film formed on the second main surface 16b of the glass substrate 16 of the glass laminate 10, And a bonding step of laminating the CF stacked body obtained in the CF stacking step and the TFT stacked body obtained in the TFT forming step, and the like.

In the TFT forming step and the CF forming step, TFTs or CFs are formed on the second main surface 16b of the glass substrate 16 by well-known photolithography or etching techniques. At this time, a resist solution is used as the coating liquid for pattern formation.

Further, the second main surface 16b of the glass substrate 16 may be cleaned before forming the TFT or CF, if necessary. As the cleaning method, well-known dry cleaning or wet cleaning can be used.

In the bonding step, the thin film transistor forming surface of the TFT-attached laminate and the color filter forming surface of the CF-adhered laminate are bonded to each other by using an encapsulant (for example, ultraviolet curable encapsulant for cell formation). Thereafter, the liquid crystal material is injected into the cells formed by the laminate of the TFT-attached laminate and the CF laminate. As a method of injecting the liquid crystal material, for example, there are a reduced pressure injection method and a dropping injection method.

(Separation step)

2 (D), the interface between the silicon resin layer 14 and the glass substrate 16 is peeled off from the laminate 22 for electronic device member assembly obtained in the member forming step An electronic device member 20 and a glass substrate 16 which are separated from each other by a glass substrate 16 (member-attached glass substrate) on which the electronic device member 20 is laminated and a supporting substrate 12, (24).

If the electronic device member 20 on the glass substrate 16 at the time of peeling is a part of the formation of all necessary constituent members, the remaining constituent members may be formed on the glass substrate 16 after the detachment.

The method of peeling the glass substrate 16 and the supporting substrate 12 is not particularly limited. Concretely, for example, a sharp blade-like shape is inserted into the interface between the glass substrate 16 and the silicone resin layer 14, and a mixed fluid of water and compressed air is sprayed after a moment of peeling is given . Preferably, the supporting member 12 of the member mounting laminate 22 for an electronic device is arranged on the upper side so that the side of the electronic device member 20 is on the lower side, (In the case where the supporting base material is laminated on both surfaces thereof), the blade is first infiltrated into the interface between the glass substrate 16 and the silicone resin layer 14 in this state. Thereafter, the support substrate 12 side is adsorbed by a plurality of vacuum adsorption pads, and the vacuum adsorption pads are raised in order from the vicinity of the point where the blade is inserted. An air layer is formed on the interface between the silicone resin layer 14 and the glass substrate 16 and on the cohesive failure surface of the silicone resin layer 14 and the air layer spreads over the entire surface of the interface or the cohesive failure surface, ) Can easily be peeled off.

Further, the supporting substrate 12 can be laminated with a new glass substrate to produce the glass laminate 10 of the present invention.

When the member-attached glass substrate 24 is separated from the electronic-device-unit-member laminate 22, the pieces of the silicone resin layer 14 are separated from the glass substrate 24 with the members by controlling the injection and humidity by the ionizer. It is possible to further suppress the electrostatic adsorption on the substrate.

The above-described method of manufacturing the member-attached glass substrate 24 is suitable for manufacturing a small-sized display device used in a mobile terminal such as a cellular phone or a PDA. The display device is mainly an LCD or an OLED, and the LCD includes TN type, STN type, FE type, TFT type, MIM type, IPS type, VA type and the like. It can basically be applied to any of passive drive type and active drive type display devices.

As the member-attached glass substrate 24 manufactured by the above-described method, a panel for a display device having a glass substrate and a display device member, a solar cell having a glass substrate and a member for a solar cell, a thin film 2 having a glass substrate and a member for a thin- A secondary battery, an electronic component having a glass substrate and a member for an electronic device, and the like. The display panel includes a liquid crystal panel, an organic EL panel, a plasma display panel, a field emission panel, and the like.

<Examples>

Hereinafter, the present invention will be described in detail by way of examples and the like, but the present invention is not limited to these examples.

The following Examples 1 to 5 and Comparative Examples 1 and 2, a glass plate containing an alkali-free borosilicate glass as a glass substrate (length 200mm, width 200mm, thickness 0.2mm, the linear expansion coefficient 38 × 10 ^-7 / ℃, Asahi Glass Trade name &quot; AN100 &quot;) was used. As the supporting substrate, a glass plate (240 mm in length, 240 mm in width, 0.5 mm in plate thickness, and a linear expansion coefficient of 38 x 10 &lt; ^-7 &gt; / ° C, trade name "AN100" manufactured by Asahi Glass Co., Ltd.) containing glass-

&Lt; Example 1 >

First, the supporting substrate having a plate thickness of 0.5 mm was cleaned by pure washing, followed by UV cleaning.

Subsequently, an organoalkenylpolysiloxane (vinyl silicone, manufactured by Arakawa Chemical Industries, Ltd., 8500) having a vinyl group at both terminals and methylhydrogenpolysiloxane having a hydrosilyl group in the molecule (manufactured by Arakawa Chemical Industries, Ltd., 12031) Respectively. The molar ratio of the total vinyl groups in the organoalkenyl polysiloxane to the hydrogen atoms bonded to the silicon atoms in the methylhydrogenpolysiloxane was 1: 1. A platinum catalyst (CAT 12070 manufactured by Arakawa Chemical Industries, Ltd.) was added in an amount of 5 parts by weight based on 100 parts by weight of the resin. Further, methylphenyl silicone oil (KF-50, manufactured by Shin-Etsu Chemical Co., Ltd., viscosity 100 cP) and heptane were added to prepare a solution containing a crosslinkable organopolysiloxane. This solution was applied on the first main surface of the supporting substrate with a spin coater (rotation speed: 300 rpm, 15 seconds) to form a layer containing uncured crosslinkable organopolysiloxane and silicone oil on the supporting substrate Amount 20 g / m ² ).

The methylphenyl silicone oil was used in an amount of 8 parts by mass based on 100 parts by mass of the total mass of the organoalkenyl polysiloxane and the methylhydrogen polysiloxane. The amount of heptane used was 100 parts by mass based on 100 parts by mass of the total mass of the organoalkenyl polysiloxane and the methylhydrogen polysiloxane. The phenyl group content in the methylphenyl silicone oil was 5 mol% based on the total organic groups bonded to silicon atoms in the silicone oil.

Then, it was heated and cured in air at 230 캜 for 10 minutes to form a silicon resin layer having a thickness of 10 탆 on the first main surface of the supporting substrate. Further, in this embodiment, the silicone resin of the silicone resin layer does not have an aromatic group, and the methylphenyl silicone oil as the silicone oil has an aromatic group (phenyl group). Further, the silicone resin layer was transparent.

Thereafter, the glass substrate and the silicone resin layer side of the supporting substrate were bonded together by a vacuum press at room temperature to obtain a glass laminate A.

In the obtained glass laminate A, the supporting substrate and the glass substrate were in close contact with each other without generating air bubbles in the silicone resin layer, no distorted defects were observed, and smoothness was good.

Subsequently, the glass laminate A was heat-treated at 350 ° C for 60 minutes in a nitrogen atmosphere, and then cooled to room temperature. As a result, it was found that changes in appearance such as separation of the support substrate of the glass laminate A and the glass substrate, Was not recognized.

Then, a stainless steel blade having a thickness of 0.1 mm was inserted into the interface between the glass substrate and the supporting silicon resin layer at the corner of one of the four places of the glass laminate A to form the instrument part for peeling, The vacuum adsorption pad was adsorbed to the surface of the glass substrate and the external surface of the glass substrate and the supporting substrate were separated from each other without breaking. Here, the insertion of the blade was carried out while spraying an antistatic fluid from the ionizer (manufactured by KYENS) to the interface. Specifically, the vacuum adsorption pad was pulled up while spraying the antistatic fluid continuously from the ionizer toward the formed gap.

The silicon resin layer is separated from the glass substrate together with the supporting substrate, and the peeling strength (x) between the supporting substrate layer and the silicon resin layer at the interface between the supporting substrate layer and the glass substrate is determined by the peeling strength (y) . In addition, the surface of the peeled glass substrate was transparent.

&Lt; Example 2 >

Except that methylphenyl silicone oil (KF-50, manufactured by Shin-Etsu Chemical Co., Ltd., viscosity 3000 cp) was used in place of methylphenyl silicone oil (KF-50 manufactured by Shin-Etsu Chemical Co., Ltd., viscosity 100 cP) Whereby a glass laminate B was obtained.

The phenyl group content in the methylphenyl silicone oil used was 5 mol% based on the total organic groups bonded to silicon atoms in the silicone oil.

Further, the appearance of the silicone resin layer was transparent even after the preparation, and was transparent even after the glass substrate was laminated thereon.

In the obtained glass laminate B, the supporting substrate and the glass substrate were in close contact with each other without generating air bubbles in the silicone resin layer, no distorted defects were observed, and smoothness was good.

Subsequently, the glass laminate B was subjected to the same heat treatment as in Example 1, and no change in appearance such as separation of the supporting substrate of the glass laminate B from the glass substrate and foaming or whitening of the silicone resin layer was observed.

Then, the glass laminate B was separated from the supporting substrate and the glass substrate by the same method as in Example 1. As a result, the glass substrate and the supporting substrate were separated without breakage. Further, the silicone resin layer was separated from the glass substrate together with the supporting substrate. From the results, it was confirmed that the peel strength (x) between the support substrate layer and the silicon resin layer interface was higher than the peel strength (y) between the silicon resin layer and the glass substrate interface. In addition, the surface of the peeled glass substrate was transparent.

&Lt; Example 3 >

Except that methylphenyl silicone oil (KF-54, viscosity 400 cp, manufactured by Shin-Etsu Chemical Co., Ltd.) was used instead of methylphenyl silicone oil (KF-50 manufactured by Shin-Etsu Chemical Co., Ltd., viscosity 100 cP) To obtain a glass laminate C.

The phenyl group content in the methylphenyl silicone oil used was 25 mol% based on the total organic groups bonded to silicon atoms in the silicone oil.

Further, the appearance of the silicone resin layer was slightly opaque immediately after the production, and after the glass substrate was laminated thereon, the appearance became transparent.

In the obtained glass laminate C, the supporting substrate and the glass substrate were in close contact with each other without generating air bubbles in the silicone resin layer, and had no distorted defects and had good smoothness.

Subsequently, the glass laminate C was subjected to the same heat treatment as in Example 1. As a result, no change in appearance such as separation of the supporting substrate of the glass laminate C from the glass substrate and foaming or whitening of the silicone resin layer was observed.

Then, the glass laminate C was separated from the glass substrate and the supporting substrate by the same method as in Example 1. As a result, the glass substrate and the supporting substrate were separated without breakage. Further, the silicone resin layer was separated from the glass substrate together with the supporting substrate. From the results, it was confirmed that the peel strength (x) between the support substrate layer and the silicon resin layer interface was higher than the peel strength (y) between the silicon resin layer and the glass substrate interface. In addition, the surface of the peeled glass substrate was slightly opaque.

<Example 4>

Except that methylphenyl silicone oil (SH550, viscosity 125 cp) was used in place of methylphenyl silicone oil (KF-50 manufactured by Shin-Etsu Chemical Co., Ltd., viscosity 100 cP) .

The phenyl group content in the methylphenyl silicone oil used was 25 mol% based on the total organic groups bonded to the silicon atoms in the silicone oil.

Further, the appearance of the silicone resin layer was slightly opaque immediately after the production, and after the glass substrate was laminated thereon, the appearance became transparent.

In the obtained glass laminate D, the supporting substrate and the glass substrate were in close contact with each other without generating bubbles in the silicone resin layer, no distorted defects were observed, and smoothness was good.

Subsequently, the glass laminate E was subjected to the same heat treatment as in Example 1. As a result, no change in appearance such as separation of the supporting substrate of the glass laminate D from the glass substrate and foaming or whitening of the silicone resin layer was observed.

Then, the glass laminate D was separated from the supporting substrate and the glass substrate by the same method as in Example 1. As a result, the glass substrate and the supporting substrate were separated without breakage. Further, the silicone resin layer was separated from the glass substrate together with the supporting substrate. From the results, it was confirmed that the peel strength (x) between the support substrate layer and the silicon resin layer interface was higher than the peel strength (y) between the silicon resin layer and the glass substrate interface. In addition, the surface of the peeled glass substrate was slightly opaque.

&Lt; Example 5 >

Except that methylphenyl silicone oil (TSF433, viscosity 450 cp, manufactured by Momentive Performance Materials Japan KK) was used instead of methylphenyl silicone oil (KF-50 manufactured by Shin-Etsu Chemical Co., Ltd., viscosity 100 cP) To obtain a glass laminate E.

The phenyl group content in the methylphenyl silicone oil used was 25 mol% based on the total organic groups bonded to silicon atoms in the silicone oil.

Further, the appearance of the silicone resin layer was slightly opaque immediately after the production, and after the glass substrate was laminated thereon, the appearance became transparent.

In the obtained glass laminate E, the supporting substrate and the glass substrate were in close contact with each other without generating air bubbles in the silicone resin layer, and no distorted defects were observed, and the smoothness was good.

Subsequently, the glass laminate E was subjected to the same heat treatment as in Example 1. As a result, no change in appearance such as separation of the supporting substrate of the glass laminate E from the glass substrate and foaming or whitening of the silicone resin layer was observed.

Then, the glass laminate E was separated from the supporting substrate and the glass substrate by the same method as in Example 1. As a result, the glass substrate and the supporting substrate were separated without breakage. Further, the silicone resin layer was separated from the glass substrate together with the supporting substrate. From the results, it was confirmed that the peel strength (x) between the support substrate layer and the silicon resin layer interface was higher than the peel strength (y) between the silicon resin layer and the glass substrate interface. In addition, the surface of the peeled glass substrate was slightly opaque.

The viscosity and the phenyl group content of the silicone oil used in Examples 1 to 5 are summarized below.

&Lt; Comparative Example 1 &

A glass laminate X was obtained in the same manner as in Example 1 except that methylphenyl silicone oil (KF-50, manufactured by Shin-Etsu Chemical Co., Ltd., viscosity 100 cP) was not used.

As a result of separating the glass substrate from the glass substrate by the same method as in Example 1, the obtained glass laminate X was difficult to peel off the silicon resin layer and the glass substrate, and the glass substrate was sometimes broken.

&Lt; Comparative Example 2 &

Except that 0.5 part by weight of methyl silicone oil (SH200, manufactured by Toray Dow Corning Co., Ltd., viscosity 200 cP) was used in place of methylphenyl silicone oil (KF-50, viscosity 100 cP manufactured by Shin-Etsu Chemical Co., Ltd.) S y was obtained. This embodiment corresponds to the embodiment 7 of the prior art (WO2011 / 142280 pamphlet), and neither the silicone resin nor the silicone oil contains an aromatic group.

The resultant glass laminate Y was subjected to separation of the supporting substrate and the glass substrate by the same method as in Example 1. As a result, the silicone resin layer and the glass substrate were difficult to peel off and the glass substrate was sometimes broken.

In Examples 1 to 5, even after the high-temperature heat treatment was performed, the glass substrate having a small thickness could be easily peeled off. In Examples 1 and 2, the surface (peeled surface) of the peeled glass substrate was transparent, whereas in Examples 3 to 5, the surface was slightly whitish. This is presumably because, in Examples 3 to 5, part of the silicone oil surface-bleeding out of the silicone resin layer was transferred onto the glass substrate. From these results, it was confirmed that the cleanliness of the surface of the peeled glass substrate was better in the case of the silicone oil used in Examples 1 and 2.

On the other hand, in Comparative Example 1 in which no silicone oil was used and in Comparative Example 2 in which no aromatic group was contained in both the silicone resin and silicone oil, the peelability was bad.

&Lt; Example 6 >

In this example, an OLED is manufactured using the glass laminate A obtained in Example 1.

First, a film of silicon nitride, silicon oxide, and amorphous silicon is formed in this order on the second main surface of the glass substrate in the glass laminate A by the plasma CVD method. Subsequently, boron at a low concentration is implanted into the amorphous silicon layer by an ion doping apparatus, and subjected to heat treatment at 450 캜 for 60 minutes in a nitrogen atmosphere to carry out a dehydrogenation treatment. Then, the amorphous silicon layer is crystallized by a laser annealing apparatus. Then, low-concentration phosphorus is injected into the amorphous silicon layer from an etching and ion doping apparatus using a photolithography method to form N-type and P-type TFT areas. Subsequently, a silicon oxide film is formed on the second main surface side of the glass substrate by a plasma CVD method to form a gate insulating film, and then molybdenum is formed by a sputtering method, and a gate electrode is formed by etching using a photolithography method. Subsequently, boron and phosphorus at a high concentration are implanted into desired areas of N type and P type, respectively, by photolithography and ion doping apparatus to form a source area and a drain area. Subsequently, an interlayer insulating film is formed on the second main surface side of the glass substrate by the plasma CVD method by the silicon oxide film formation, and a TFT electrode is formed by the sputtering method by aluminum film formation and etching by photolithography. Subsequently, a heat treatment is performed in a hydrogen atmosphere at 450 DEG C for 60 minutes to perform a hydrogenation treatment, and then a passivation layer is formed by film formation of nitrogen silicon by a plasma CVD method. Subsequently, an ultraviolet curing resin is applied to the second main surface side of the glass substrate, and a planarization layer and a contact hole are formed by photolithography. Subsequently, indium tin oxide is formed by a sputtering method, and a pixel electrode is formed by etching using a photolithography method.

Subsequently, 4,4 ', 4 "-tris (3-methylphenylphenylamino) triphenylamine was used as a hole injecting layer on the second main surface side of the glass substrate by the vapor deposition method and bis [(N-naphthyl) (4-methoxyphenyl) -N-phenyl] aminostyryl] naphthalene-2-carboxylate was added to 8-quinolinol aluminum complex (Alq ₃ ) Alq ₃ was deposited in this order as an electron transporting layer. Next, aluminum was deposited by sputtering, and an aluminum film was formed by etching using photolithography Next, another glass substrate is bonded and sealed with an ultraviolet curable adhesive layer on the second main surface side of the glass substrate, and the organic EL structure is formed on the glass substrate by the above procedure. A glass laminate A having an organic EL structure on a glass substrate (hereinafter referred to as panel A) Of an electronic device mounting member for the laminated body (the supporting substrate attached to the display panel).

Subsequently, a stainless steel blade having a thickness of 0.1 mm was inserted into the interface between the glass substrate and the silicone resin layer at the corner of the panel A after the sealing member side of the panel A was vacuum-adsorbed on the surface of the plate, Giving the occasion of exfoliation. After the surface of the support substrate of the panel A is adsorbed by the vacuum adsorption pad, the adsorption pad is raised. Here, the insertion of the blade is carried out while spraying an antistatic fluid on the interface from an ionizer (manufactured by KYENS). Subsequently, the vacuum adsorption pad is pulled up while ejecting the antistatic fluid from the ionizer toward the formed gap. As a result, only the glass substrate having the organic EL structure formed on the surface thereof can be left, and the supporting substrate with the silicon resin layer can be peeled off.

Subsequently, the cleavage surface of the glass substrate separated in the same manner as in Example 1 was cleaned, and the separated glass substrate was cut using a laser cutter or a scribe-break method, and after dividing into a plurality of cells, And a counter substrate are assembled, and a module forming process is performed to fabricate an OLED. The characteristics of the OLED thus obtained do not occur.

&Lt; Example 7 >

In this example, an LCD is manufactured using the glass laminate A obtained in Example 1.

First, two glass laminate A are prepared, and a film of silicon nitride, silicon oxide, and amorphous silicon is formed in this order on the second main surface of the glass substrate in one glass laminate A1 by the plasma CVD method. Subsequently, boron at a low concentration is implanted into the amorphous silicon layer by an ion doping apparatus, and subjected to heat treatment at 450 캜 for 60 minutes in a nitrogen atmosphere to carry out a dehydrogenation treatment. Then, the amorphous silicon layer is crystallized by a laser annealing apparatus. Then, low-concentration phosphorus is injected into the amorphous silicon layer from an etching and ion doping apparatus using a photolithography method to form N-type and P-type TFT areas. Subsequently, a silicon oxide film is formed on the second main surface side of the glass substrate by a plasma CVD method to form a gate insulating film, and then molybdenum is formed by a sputtering method, and a gate electrode is formed by etching using a photolithography method. Subsequently, boron and phosphorus at a high concentration are implanted into desired areas of N type and P type, respectively, by photolithography and ion doping apparatus to form a source area and a drain area. Subsequently, an interlayer insulating film is formed on the second main surface side of the glass substrate by the plasma CVD method by the silicon oxide film formation, and a TFT electrode is formed by the sputtering method by aluminum film formation and etching by photolithography. Subsequently, a heat treatment is performed in a hydrogen atmosphere at 450 DEG C for 60 minutes to perform a hydrogenation treatment, and then a passivation layer is formed by film formation of nitrogen silicon by a plasma CVD method. Subsequently, an ultraviolet curing resin is applied to the second main surface side of the glass substrate, and a planarization layer and a contact hole are formed by photolithography. Subsequently, indium tin oxide is formed by a sputtering method, and a pixel electrode is formed by etching using a photolithography method.

Subsequently, the other glass laminate A2 is heat-treated at 450 DEG C for 60 minutes in an atmospheric atmosphere. Then, chromium is deposited on the second main surface of the glass substrate in the glass laminate A by the sputtering method, and the light shielding layer is formed by etching by photolithography. Next, a color resist is applied to the second main surface side of the glass substrate by a die coating method, and a color filter layer is formed by photolithography and thermal curing. Subsequently, indium tin oxide is formed by a sputtering method, and an opposite electrode is formed. Subsequently, an ultraviolet curable resin liquid is applied to the second main surface side of the glass substrate by a die coating method, and a columnar spacer is formed by photolithography and thermal curing. Then, a polyimide resin solution is applied by a roll coating method, an orientation layer is formed by thermal curing, and rubbing is performed.

Subsequently, the sealing resin liquid was drawn in a frame shape by the dispenser method, liquid crystal was dropped by the dispenser method in the frame, and then the glass laminate A1 on which the pixel electrodes were formed was used to form two glass laminate A The second main surface side of the glass substrate is bonded to each other, and an LCD panel is obtained by ultraviolet curing and thermosetting.

Subsequently, a second main surface of the glass laminate A1 was vacuum-adsorbed on a surface plate, a stainless steel blade having a thickness of 0.1 mm was inserted into the interface between the glass substrate and the silicone resin layer at the corner of the glass laminate A2, Giving an opportunity for peeling of the main surface and the peelable surface of the silicon resin layer. Here, the insertion of the blade is carried out while spraying an antistatic fluid on the interface from an ionizer (manufactured by KYENS). Subsequently, the vacuum adsorption pad is pulled up while ejecting the antistatic fluid from the ionizer toward the formed gap. Then, after the second main surface of the supporting substrate of the glass laminate A2 is adsorbed by the vacuum adsorption pad, the adsorption pad is raised. As a result, it is possible to peel off the supporting substrate with the silicon resin layer leaving only the empty cell of the LCD on which the supporting substrate of the glass laminate A1 is adhered on the surface of the plate.

Subsequently, a second main surface of the glass substrate on which the color filter was formed on the first main surface was vacuum-adsorbed on the surface plate, a stainless steel blade having a thickness of 0.1 mm was inserted into the interface between the glass substrate and the silicone resin layer at the corner of the glass laminate A1, Thereby giving a moment of peeling between the first main surface of the glass substrate and the peelable surface of the silicon resin layer. Then, after the second main surface of the supporting substrate of the glass laminate A1 is adsorbed by the vacuum adsorption pad, the adsorption pad is raised. As a result, the supporting substrate on which the silicon resin layer is fixed can be peeled off while leaving only the LCD cell on the surface of the substrate. Thus, a plurality of LCD cells constituted by a glass substrate having a thickness of 0.1 mm are obtained.

And then divided into cells of a plurality of LCDs by the subsequent cutting step. A process of adhering a polarizing plate to each completed LCD cell is performed, and then a module forming process is performed to obtain an LCD. The LCD thus obtained does not cause any problems.

&Lt; Example 8 >

In this example, an OLED is manufactured using the glass laminate A obtained in Example 1.

First, molybdenum is deposited on the second main surface of the glass substrate in the glass laminate A by the sputtering method, and the gate electrode is formed by etching by photolithography. Subsequently, a silicon nitride film is formed again on the second main surface side of the glass substrate by the plasma CVD method to form a gate insulating film. Subsequently, indium gallium zinc oxide is formed by a sputtering method and is etched by photolithography, . Subsequently, silicon nitride is deposited again on the second main surface side of the glass substrate by the plasma CVD method to form a channel protection layer, and subsequently, molybdenum is deposited by sputtering and is etched by photolithography to form a source electrode and a drain electrode . Subsequently, heat treatment is performed at 450 캜 for 60 minutes in the atmosphere. Subsequently, a silicon nitride film is formed on the second main surface side of the glass substrate by a plasma CVD method to form a passivation layer. Subsequently, indium tin oxide is formed by a sputtering method, and a pixel electrode is formed by etching using a photolithography method do.

Subsequently, 4,4 ', 4 "-tris (3-methylphenylphenylamino) triphenylamine was used as a hole injecting layer on the second main surface side of the glass substrate by the vapor deposition method and bis [(N-naphthyl) (4-methoxyphenyl) -N-phenyl] aminostyryl] naphthalene-2-carboxylate was added to 8-quinolinol aluminum complex (Alq ₃ ) Alq ₃ was deposited in this order as an electron transporting layer. Next, aluminum was deposited by sputtering, and an aluminum film was formed by etching using photolithography Next, another glass substrate is bonded and sealed on the second main surface side of the glass substrate with an ultraviolet curable adhesive layer interposed therebetween. The organic EL structure is formed on the glass substrate by the above procedure. A glass laminate A having an organic EL structure on a glass substrate (hereinafter referred to as panel A) An electronic device mounting member for the laminated body (the supporting substrate attached to the display panel).

Subsequently, a stainless steel blade having a thickness of 0.1 mm was inserted into the interface between the glass substrate and the silicone resin layer at the corner of the panel A after the sealing member side of the panel A was vacuum-adsorbed on the surface of the plate, Giving the occasion of exfoliation. After the surface of the supporting substrate of the panel A is adsorbed on the vacuum adsorption pad, the adsorption pad is raised. Here, the insertion of the blade is carried out while spraying an antistatic fluid on the interface from an ionizer (manufactured by KYENS). Subsequently, the vacuum adsorption pad is pulled up while ejecting the antistatic fluid from the ionizer toward the formed gap. As a result, only the glass substrate having the organic EL structure formed on the surface thereof can be left, and the supporting substrate with the silicon resin layer can be peeled off.

Subsequently, the cleavage surface of the glass substrate separated in the same manner as in Example 1 was cleaned, and the separated glass substrate was cut using a laser cutter or a scribe-break method, and after dividing into a plurality of cells, And a counter substrate are assembled, and a module forming process is performed to fabricate an OLED. The characteristics of the OLED thus obtained do not occur.

This application is based on Japanese Patent Application No. 2012-230092 filed on October 17, 2012, the contents of which are incorporated herein by reference.

10: Glass laminate
12: support substrate
14: Silicone resin layer
14a: a first main surface of the silicone resin layer
16: glass substrate
16a: a first main surface of the glass substrate
16b: a second main surface of the glass substrate
18: Supporting substrate with silicone resin layer
20: Member for electronic device
22: member attachment laminate for electronic device
24: Glass substrate with member

Claims (12)

Wherein the support substrate layer, the silicon resin layer, and the glass substrate layer are provided in this order, and the peel strength of the interface between the support substrate layer and the silicon resin layer is higher than the peel strength of the interface between the silicon resin layer and the glass substrate As a high glass laminate,
Wherein the silicone resin of the silicone resin layer is a crosslinked organopolysiloxane,
Wherein the silicone resin layer comprises a silicone oil,
Wherein either one of the silicone resin and the silicone oil contained in the silicone resin layer has an aromatic group and the other does not substantially contain an aromatic group. The method of claim 1, wherein the silicone oil has a phenyl group,
Wherein the content of the phenyl group in the total organic groups bonded to silicon atoms in the silicone oil is 5 to 50 mol%. The glass laminate according to claim 1 or 2, wherein the content of the silicone oil in the silicone resin layer is 6 to 20 parts by mass relative to 100 parts by mass of the silicone resin. The glass laminate according to any one of claims 1 to 3, wherein the silicone oil has a viscosity at 25 캜 of 100 to 6000 cP. The glass laminate according to any one of claims 1 to 4, wherein the thickness of the silicon resin layer is 2 to 100 占 퐉. The glass laminate according to any one of claims 1 to 5, wherein the supporting substrate is a glass plate. A step of forming a layer containing a crosslinkable organopolysiloxane and a silicone oil on one side of the supporting substrate, crosslinking the crosslinkable organopolysiloxane on the supporting substrate surface to form a silicone resin layer, And the glass substrate is laminated on the glass substrate. [Claim 7] The method according to any one of claims 1 to 6, 1. A silicon-resin-layer-attached supporting substrate having a supporting substrate and a silicone resin layer having a releasable surface formed on the supporting substrate surface,
Wherein the silicone resin of the silicone resin layer is a crosslinked organopolysiloxane,
Wherein the silicone resin layer comprises a silicone oil,
Wherein the silicone resin contained in the silicone resin layer and either one of the silicone oil have an aromatic group and the other does not substantially contain an aromatic group. 9. The method of claim 8, wherein the silicone oil has a phenyl group,
Wherein the content of the phenyl group in the total organic group bonded to the silicon atom in the silicone oil is 5 to 50 mol%. The supporting substrate according to claim 9, wherein the content of the phenyl group in the total organic groups bonded to silicon atoms in the silicone oil is 5 to 30 mol%. 11. The support substrate according to any one of claims 8 to 10, wherein the content of the silicone oil in the silicone resin layer is 6 to 20 parts by mass based on 100 parts by mass of the silicone resin. 12. The silicone resin layer-supporting substrate according to any one of claims 8 to 11, wherein the silicone oil has a viscosity at 25 DEG C of 100 to 6000 cP.

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