KR102468101B1 - Device mounting apparatus - Google Patents

Abstract

An object of the present invention is to provide an element mounting apparatus capable of accurately measuring the distance from a transfer tool to an element without fear of damaging the element or the transfer tool.
An element mounting apparatus 1 according to an embodiment includes a contact sensor unit 54 installed on a transfer head 53 and measuring a distance to a reference substrate P and a distance to a reference substrate Q; A plurality of rows and columns of elements T are picked up from a supply substrate R which is detachably installed on the head 53 and supported on the supply table 3, and the picked up elements T are placed on the mounting substrate S. The transfer tool 6 to be placed, the first non-contact sensor 71 that measures the distance to the reference substrate P and the distance to the element T on the supply substrate R in a non-contact manner, and the reference substrate Q 2nd non-contact sensor 72 that measures the distance to and the distance to the mounting substrate S in a non-contact manner, and the distance to the opposing transfer head 53 and the distance to the opposing transfer tool 6 in a non-contact manner A third non-contact sensor 73 for measuring is provided.

Description

Device mounting device {DEVICE MOUNTING APPARATUS}

The present invention relates to an element mounting device.

BACKGROUND ART An element mounting apparatus for mounting elements such as semiconductor elements, resistors and capacitors on a substrate having circuit patterns is widespread. An element mounting device has an element transfer unit that reciprocates between a supply substrate on which elements are stocked and a mounting substrate on which elements are mounted. The transfer unit picks up the elements one by one from the supply substrate, holds and transports the elements to the mounting substrate, and places the elements on the mounting substrate. A bonding material such as ACF (Anisotropic Conductive Film), ACP (Anisotropic Conductive Paste), NCF (Non Conductive Film), NCP (Non Conductive Paste), or homogeneous eutectic solder is formed on the mounting board, and this bonding Through the material, the element is mounted on the mounting substrate.

In recent years, miniaturization of devices has progressed at a very rapid pace. Devices with a side size of 200 μm or less, such as 50 μm or 10 μm, have also been proposed. These elements are, for example, 50 µm or 10 µm mini LEDs or micro LEDs, and are arranged in an array form (matrix form) as each RGB pixel on a display substrate for display, and also arranged on a lighting substrate as a light emitting body of a backlight. . In the case of mounting LEDs as pixels on a display board, if the display board supports 4K, it is necessary to mount at least 8 million or more LEDs in one color of RGB on the display board. there was.

Then, a plan to improve production efficiency is proposed by picking up elements of multiple rows and multiple columns at once and mounting them on a mounting board. The transfer unit includes a transfer tool holding elements in multiple rows and columns, and with this transfer tool, elements in multiple rows and columns are collectively picked up and mounted collectively. According to this element mounting device, the number of reciprocations of the transfer unit can be reduced to the number of times obtained by dividing the total number of elements on the supply substrate by the number of elements that can be held by the transfer unit at one time.

As a method of holding an element by a transfer tool, adsorption such as vacuum adsorption or electrostatic adsorption is used. In any case, the holding part of multiple rows and multiple columns is arrange|positioned at the transfer tool. When vacuum adsorption is employed, the holding portion is a suction hole. Each suction hole is connected to a pneumatic circuit having an ejector or the like, and negative pressure is generated in each suction hole. The conveying unit pulls the elements to the suction hole of the transfer tool with negative pressure, picks up the elements from the supply substrate at once, transports them to the substrate, and releases the negative pressure by breaking the vacuum or releasing the atmosphere to place the elements on the mounting substrate. Place and mount. When electrostatic adsorption is employed, the holding portion is a mesa-like structure. A plurality of mesa-type structures are formed on the base substrate, and electrodes and dielectric layers are formed on the mesa-type structures. The electrostatic power generation unit having this mesa structure serves as a local adsorption point for the element, and the element is collectively attracted to each electrostatic power generation unit by the electrostatic force generated by the application of the voltage. Then, the application of the voltage is released to arrange and mount the element on the mounting substrate.

In element pick-up, if the moving distance of the transfer tool to pick up the element is insufficient, the transfer tool cannot sufficiently adsorb the element and fails to pick up the element, and if the transfer tool moves excessively, the transfer tool is excessively There is a possibility that the element or the transfer tool may be damaged. Further, in arranging the elements on the mounting substrate, if the moving distance of the transfer tool holding the elements with respect to the mounting substrate is insufficient, the transfer tool cannot sufficiently press the elements onto the mounting substrate, and the element placement fails, and transfer If the tool moves excessively, the transfer tool may excessively push the element and the element or the transfer tool may be damaged. For this reason, it is necessary to accurately measure the distance from the transfer tool to the element to be picked up or the distance to the mounting substrate.

As a method of measuring these distances, there are a non-contact method using a non-contact sensor and a contact method using a contact sensor. When a non-contact method is employed, the non-contact sensor is, for example, a laser displacement meter, and irradiates a laser beam to an element and measures the distance from the reflected light to the element. When the contact method is employed, the element and the transfer tool are brought into contact, and the amount of movement of the transfer tool up to the point of time when the contact sensor detects the contact is measured.

[Patent Document 1] Japanese Unexamined Patent Publication No. 2015-230946

In the contact method, distance measurement involves contact between a transfer tool and an element. Therefore, in order to perform measurement with high precision, in order to avoid elastic deformation of the transfer tool at the time of contact, it is suitable that the transfer tool is formed of a hard member such as metal, ceramic, or silicon.

However, when a hard member such as metal, ceramic, or silicon is used for the transfer tool, the stress applied to the element or the transfer tool due to contact is high because the element is small, and the element or the transfer tool may be damaged. On the other hand, when a soft member such as resin is used for the transfer tool, the transfer tool elastically deforms upon contact with the element, so the accuracy of the measured distance from the transfer tool to the element is lost.

In the non-contact method using a non-contact sensor, when a distance is to be measured, it is necessary to bring the transfer tool into contact with a reference surface or the like in advance to associate the vertical position of the transfer tool with the measured value of the non-contact sensor. At this time, since it involves the contact of the transfer tool, there is also the possibility of the same problem as the contact method.

The present invention has been made to solve the above problems, and its object is to provide an element mounting apparatus capable of accurately measuring the distance from a transfer tool to an element without fear of damaging the element or the transfer tool.

An element mounting apparatus of the present invention comprises: a reference substrate or a supply board having an upper surface on which a supply substrate on which elements are arranged in an array is supported; and a reference substrate or a mounting substrate on which the elements arranged in an array are disposed. between a mounting table having a second side supported thereon, and moving in a direction in which the supply table and the mounting table are aligned, from a first predetermined position spaced apart in an opposite direction from the other side of the supply table to the supply table, and a transfer head that moves from a second predetermined position spaced apart from the other side of the mounting table in an opposite direction to the mounting table; and the reference installed on the transfer head and supported by the supply table or the mounting table. By detecting contact with the substrate, the distance from the first predetermined position to the reference substrate supported on the supply table and the distance from the second predetermined position to the reference substrate supported on the mounting table are determined. A contact sensor unit for measuring is provided.

Further, the element mounting apparatus of the present invention is detachably installed in the transfer head, picks up elements in a plurality of rows and columns from the supply substrate supported on the supply table, and transfers the picked up elements to the mounting substrate. A distance from a tool and a third predetermined position spaced apart in an opposite direction from the other side of the supply table to the reference substrate supported on the supply table and a distance to an element on the supply substrate supported on the supply table A first non-contact sensor for non-contact measurement, and a distance from a fourth predetermined position spaced apart in an opposite direction from the other half of the mounting table to the reference substrate supported by the mounting table and the mounting table supported by the mounting table. A second non-contact sensor that measures the distance to the substrate in a non-contact manner, and a second non-contact sensor that is installed between the supply table and the mounting table and measures the distance to the opposing transfer head and the distance to the opposing transfer tool in a non-contact manner. 3 non-contact sensors and a control unit for controlling movement of the transfer head based on distances measured by the contact sensor unit, the first non-contact sensor, the second non-contact sensor, and the third non-contact sensor.

According to the present invention, it is possible to provide an element mounting apparatus capable of accurately measuring the distance from a transfer tool to an element without fear of damaging the element or the transfer tool.

1 is a schematic diagram showing the configuration of an element mounting device according to an embodiment.
Fig. 2 is a schematic diagram showing the configuration of a transfer head and a transfer tool.
3 is a functional block diagram of a control unit according to an embodiment.
4 is a flowchart showing an example of an operation for measuring each distance according to the embodiment.
5 is a schematic diagram showing measurement of the distance to a reference substrate supported by a supply table or mounting table by a contact sensor unit.
Fig. 6 is a schematic diagram showing measurement of the distance to a reference substrate supported on a supply table or mounting table and a distance to a transfer head by a non-contact sensor.
Fig. 7 is a schematic diagram showing measurement of the distance to an element on a supply substrate supported by a supply table, the distance to a mounting substrate supported by a mounting table, and the distance to a transfer tool by a non-contact sensor.
8 is a flowchart showing an example of an operation of the element mounting device according to the embodiment.
9 is a schematic diagram showing the configuration of an element mounting device according to another embodiment.

[Embodiment]

[composition]

(Schematic composition)

1 is a schematic diagram showing the configuration of an element mounting device 1 according to an embodiment. As shown in FIG. 1 , a supply substrate R and a mounting substrate S are carried into the element mounting apparatus 1 . The supply substrate R is a rectangular element supply body in which elements T are arranged and stocked in an array (matrix) form. The element T is a part used in an electronic circuit, and includes chips such as MEMS, semiconductor elements, resistors and capacitors, and semiconductor elements include transistors, diodes, discrete semiconductors such as LEDs and thyristors, and ICs and LSIs. integrated circuits are included. LEDs include so-called mini-LEDs and micro-LEDs. Particularly, the element T includes so-called minute parts having a side of 200 μm or less. The mounting substrate S is formed on which circuit patterns are formed, and is, for example, a backlight lighting substrate on which mini LEDs are arranged, and a display substrate on which RGB micro LEDs are arranged as pixels.

This element mounting device 1 includes a supply table 3 for supporting a supply substrate R, a mounting table 4 for supporting a mounting substrate S, and an element T from the supply substrate R. It is provided with a transfer part 5 that is transferred to the mounting substrate S. In this element mounting device 1, a position-fixed pick-up position 21 and mounting position 22 are set, and the transfer part 5 moves the element T from the supply substrate R at the pick-up position 21. ) is picked up, and in the mounting position 22, the element T is placed and mounted on the mounting substrate S. That is, the pick-up position 21 is a position where the transfer unit 5 picks up the element T, and the mounting position 22 is a position where the transfer unit 5 places the picked-up element.

The supply table 3 is movable in a two-dimensional direction (horizontal direction in this embodiment) parallel to the other side. The supply table 3 moves a plurality of rows and a plurality of columns of elements T to be picked up among the elements T arranged in an array (matrix) on the supply substrate R to be positioned at the pick-up position 21. let it The mounting base 4 is movable in a two-dimensional direction parallel to the other side. Among the circuit patterns on the mounting board S, the mounting table 4 moves the position of the circuit pattern on which the elements T of multiple rows and multiple columns are mounted by the transfer unit 5 so as to be positioned at the mounting position 22. . The transfer unit 5 collectively picks up the elements T in multiple rows and columns from the supply substrate R, and transfers the picked up elements T to the mounting substrate S at once. In the element mounting apparatus 1, the transfer unit 5 is operated a plurality of times to transfer the elements T of a plurality of rows and a plurality of columns to the mounting substrate S a plurality of times, so that the elements T are arrayed (matrix). type), a device mounting board is prepared.

In addition, the replaced element T is finally electrically and/or mechanically bonded to the mounting substrate S. On the mounting substrate S, for example, a bonding material such as ACF, ACP, NCF, NCP, or homogeneous eutectic solder is formed in advance, and elements T disposed on the bonding material are held on the bonding material. The bonding material as described above has tackiness or adhesiveness, whereby the element T is held and the element T is mounted on the mounting substrate S. In addition, by heating, cooling, pressing, etc., alloy bonding, conductive particle bonding, resin curing, bump pressure bonding, etc., the mounting substrate S and the element T are electrically and/or mechanically connected, and the bonding material is cured. The mounting substrate S and the element T are finally bonded. This final bonding may be performed on the transfer unit 5 or the mounting table 4 of the element mounting device 1, or may be performed by another device inside or outside the element mounting device 1. Regardless of the presence or absence of the final bonding process, the element T is transferred to the mounting substrate S and placed thereon, and the element T held is mounted.

The supply table 3 supports the reference substrate P before supporting the supply substrate R. The mounting table 4 supports the reference board Q before supporting the mounting board S (see Fig. 5). The reference substrates P and Q are made of, for example, glass and are dummy substrates for detecting contact with the transfer unit 5 by means of a contact sensor unit 54 installed on the transfer unit 5 described later.

The contact sensor unit 54 detects the contact of the transfer unit 5 with the reference substrates P and Q, and when the transfer unit 5 picks up the element T from the supply substrate R, the supply table ( The amount of movement moving in the vertical direction with respect to the other side of the mounting table 4, when transferring the element T picked up by the transfer unit 5 to the mounting board S, Measure the amount of movement in advance. When the measurement by the contact sensor unit 54 and the non-contact sensors 71 to 73 to be described later is finished, the reference substrates P and Q are removed from the element mounting device 1, and the supply substrate R and The mounting substrate S is carried into the element mounting device 1 .

(detailed configuration)

The supply table 3 has a flat upper surface (placement surface), and the supply substrate R is supported on the upper surface. The mounting table 4 has a flat lower surface (placement surface), and the mounting substrate S is supported on the lower surface. The upper half of these supply base 3 and mounting base 4 is respectively supported by linear motion mechanisms 31 and 41 including two orthogonal axes, and is movable in a two-dimensional direction parallel to the upper half. The linear acting mechanisms 31 and 41 include, for example, a linear guide and a ball screw, and the other half of the supply table 3 and the mounting table 4 are supported by sliders of the linear acting mechanisms 31 and 41, respectively. .

The supply table 3 changes the pick-up area 32 located at the pick-up position 21 by parallel movement in the two-dimensional direction by the linear mechanism 31 . The pickup area 32 is a position on the supply substrate R, and elements T in multiple rows and multiple columns in this area are collectively picked up by the transfer tool 6 . That is, the pickup area 32 is a range set as a unit of a range in which elements T of multiple rows and multiple columns to be picked up are present. In other words, as shown by broken lines on the supply substrate R in FIG. 1, a virtual area of the same size as the region in which the element group exists, which surrounds the element group including the elements T in multiple rows and multiple columns, is present. is a hostile area. Accordingly, a plurality of pick-up areas 32 exist in matrix form according to the arrangement of the elements T on the supply substrate R, and are located at the pick-up position 21 for each pick-up by the transfer unit 5 .

The mounting table 4 changes the mounting area 42 located at the mounting position 22 by parallel movement in the two-dimensional direction by the linear mechanism 41 . The mounting region 42 is a position on the mounting substrate S, and is a range where elements T in multiple rows and multiple columns are collectively mounted by the transfer tool 6 . In other words, as shown by a broken line on the mounting board S in FIG. 1 , a virtual area of the same size as the region in which the element group is arranged surrounds the element group including the element T in multiple rows and multiple columns. is a hostile area. The mounting region 42 is set on the mounting substrate S in a matrix arrangement according to the arrangement of elements T mounted on the mounting region 42 . Then, each mounting area 42 is positioned at the mounting position 22 for each mounting by the transfer unit 5 .

The conveyance part 5 is supported by the linear motion mechanism 51 via the elevating mechanism 52, and is movable to the pick-up position 21 and the mounting position 22. The linear mechanism 51 is, for example, a linear guide and a ball screw, and is installed between the pick-up position 21 and the mounting position 22, and the surface of the supply board R on which the elements T are arranged and the mounting board S ) extends toward the surface where the mounting region 42 is arranged. The elevating mechanism 52 is, for example, a linear guide and a ball screw, is supported by a slider of the linear motion mechanism 51, and comes into contact with and separates from the supply substrate R and the mounting substrate S (in this embodiment, horizontal It extends in a vertical direction intersecting perpendicularly to the direction, that is, a vertical direction). The conveyance part 5 is supported by the slider of this lifting mechanism 52.

The transfer unit 5 includes a transfer head 53 . As shown in FIG. 2 , the surface of the transfer head 53 facing the supply table 3 and the mounting table 4 is a contact surface 531 . The transfer tool 6 is detachably attached to this contact surface 531 . In the contact surface 531, a suction hole communicating with a holding portion 62 that is a suction hole of a transfer tool 6 described later is formed. By generating a negative pressure in the suction hole, the element T can be adsorbed and held by the transfer tool 6.

The transfer tool 6 is formed of a member having elasticity and has a holding surface 61 . The holding surface 61 is an end face of the transfer tool 6 facing the supply substrate R at the pickup position 21 and facing the mounting substrate S at the mounting position 22 . The holding part 62 is arrange|positioned on this holding surface 61. The holding portions 62 are arranged in a plurality of rows and a plurality of columns, and one holding portion 62 holds one element T. The holding portion 62 is, for example, a suction hole having a smaller diameter than the side length of the element T, and adsorbs and holds the element T by vacuum adsorption. Each holding portion 62 attracts the element T by generating negative pressure in the suction hole of the communicating contact surface 531, and holds the element T while the negative pressure is generated, such as vacuum breaking or atmospheric release. The element T is isolated by the release of the negative pressure. In addition, the number of rows and columns of the holding section 62 and the number of rows and columns of the elements T arranged in an array on the supply substrate R may coincide even if they do not coincide. Here, the number of rows and columns of the holding section 62 and the number of rows and columns of the elements T arranged in an array on the supply substrate R do not match, and the number of rows and columns of the holding section 62 is supplied. The number of rows and columns of the elements T arranged in an array on the substrate R is smaller than the number of columns. The arrangement interval of the holding part 62 coincides with the arrangement interval of the elements T aligned on the supply substrate R.

In addition, the transfer head 53 is used to measure the moving distance of the transfer unit 5 according to the pick-up and arrangement of the element T, which is performed before carrying in the supply substrate R and the mounting substrate S. At this time, the reference substrates P and Q are supported by the supply table 3 and the mounting table 4, respectively. That is, the transfer head 53 faces its contact surface 531 toward the reference substrate P supported on the supply table 3 or the reference substrate Q supported on the mounting table 4 . The contact surface 531 includes a hard member such as metal or ceramic, and is also a surface that contacts the other side of the reference substrate P or the other side of the reference substrate Q by the movement of the transfer unit 5 .

The transfer head 53 is provided with a contact sensor unit 54 (see Fig. 1). The contact of the contact surface 531 with the reference substrates P and Q is detected by the contact sensor unit 54 provided in the transfer head 53. The contact sensor unit 54 includes, for example, a contact sensor and an encoder. The contact sensor is, for example, a gap sensor such as an eddy current sensor. The contact sensor detects the relative movement of the transfer head 53 on the transfer unit 5, which occurs when the contact surface 531 of the transfer head 53 contacts the reference substrates P and Q. The encoder detects the movement amount of the transfer head 53.

The contact sensor unit 54 determines the transfer head based on the contact information detected by the contact sensor and the movement amount information of the contact surface 531 by the encoder until it comes into contact with the reference substrate P or Q. The distance A from the initial position (predetermined position) of 53 to the reference substrate P and the distance B to the reference substrate Q are measured. In addition, the controller 8 described later sets a predetermined position (initial position) at which the contact surface 531 starts approaching in the vertical direction with respect to the reference substrate P or the other side of the reference substrate Q, in a first preset It is stored as a predetermined position (X1) or a second predetermined position (X2). In other words, the first predetermined position X1 is a position where the contact surface 531 is spaced apart from the supply table 3 in the vertical direction (opposite direction) and faces the other side of the supply table 3, and the second predetermined position X1 is The predetermined position (X2) is a position where the contact surface 531 is spaced apart from the mounting table 4 in the vertical direction (opposite direction) and faces the other side of the mounting table 4 (see FIG. 5). That is, the distance from the first predetermined position X1 to the reference substrate P is the distance A, and the distance from the second predetermined position X2 to the reference substrate Q is the distance B. is detected In addition, in this embodiment, the 1st predetermined position X1 and the 2nd predetermined position X2 are made into the same height position.

Returning to Fig. 1, the element mounting apparatus 1 includes three non-contact sensors 71, 72, and 73. The non-contact sensors 71 to 73 are, for example, laser displacement meters that irradiate a target to be detected with a laser beam and measure the distance to the target. 6 and 7, the non-contact sensor 71 (first non-contact sensor) measures the distance C to the reference substrate P supported on the supply table 3 and the A distance (F) to an element (T) of a plurality of rows and a plurality of columns to be picked up is measured. The non-contact sensor 72 (second non-contact sensor) measures the distance E to the reference substrate Q supported by the mounting table 4 and the distance H to the mounting substrate S. The non-contact sensor 73 (third non-contact sensor) is the distance D to the contact surface 531 of the transfer head 53 installed on the transfer unit 5 and the distance to the holding surface 61 of the transfer tool 6 (G) is measured. The starting point of the distances C to H measured by the noncontact sensors 71 to 73 is, for example, the position of the light source of the noncontact sensors 71 to 73, but any position of the noncontact sensors 71 to 73 if it can be set. may be good

The non-contact sensors 71 and 72 can move integrally with the transfer unit 5 . That is, the non-contact sensors 71 and 72 are supported by the linear motion mechanism 51 via the elevating mechanism 52 so that their relative positions with the transfer unit 5 remain unchanged. For example, as shown in FIG. 1, it is mounted on the transfer head 53 of the transfer unit 5 by a bracket (not shown). That is, the non-contact sensors 71 and 72 are movable to the pick-up position 21 and the mounting position 22 . Therefore, the non-contact sensors 71 and 72 can measure each distance at the pickup position 21 and the mounting position 22 . In addition, the non-contact sensors 71 and 72 have a distance range that can be measured appropriately depending on the type of sensor. In such a case, the distance to the measuring target can be adjusted by the lifting mechanism 52, and it can be set within the range of the distance which can be measured appropriately.

When the non-contact sensor 71 measures the distance C to the reference substrate P on the supply table 3 and the distance F to the plurality of elements T on the supply substrate R, the pick-up position In (21), laser irradiation is performed. In the case of measuring the distance F, an element T as a target of laser irradiation is previously set in the controller 8 described later, and, for example, a predetermined pick-up area on the supply substrate R, which is a pick-up target ( 32) is an element T located at the center of elements T in multiple rows and multiple columns. In addition, when measuring the distance C, it does not necessarily need to be the pick-up position 21, and any position may be used as long as the distance to the other half of the reference substrate P can be measured.

In addition, the non-contact sensor 72 measures the distance E to the reference substrate Q on the mounting table 4 and the distance H to the mounting substrate S, at the mounting position 22, the laser beam Do your research. The target position of the laser irradiation is previously set in the controller 8 described later, and can be, for example, the center position of a predetermined mounting area 42 on the mounting substrate S. In addition, when measuring the distance E, it does not necessarily need to be the mounting position 22, and it may be any position as long as the distance to the other half of the reference board Q can be measured.

The non-contact sensor 73 is installed between the supply table 3 and the mounting table 4 right below the transport path of the transport unit 5 . The contact surface 531 of the transfer head 53 or the holding surface 61 of the transfer tool 6 is stopped at a position opposite to the non-contact sensor 73, and the contact surface 531 of the non-contact sensor 73 is Alternatively, laser irradiation is performed on the holding surface 61, and the distance D to the contact surface 531 and the distance G to the holding surface 61 are measured.

The element mounting apparatus 1 further includes a control unit 8 that controls each configuration. The controller 8 is, for example, a computer or microcomputer having a CPU, ROM, RAM, and a signal transmission circuit that controls each component of the element mounting device 1, and includes a supply table 3, a mounting table 4, and a transfer unit. It is connected to the drive source of (5) and each sensor.

3 is a functional block diagram of the control unit 8. As shown in FIG. 3 , the control unit 8 includes a storage unit 81, a calculation unit 82, a determination unit 83, and a movement control unit 84. The storage unit 81 is a recording medium such as HDD or SSD. In the storage unit 81, data and programs necessary for system operation are stored in advance, and data necessary for system operation are stored in advance. More specifically, the storage unit 81 stores the data received from each sensor and the values calculated by the operation unit 82 based on these information, the first predetermined position X1 and the second predetermined position. (X2), the position of the element T to be the target of laser irradiation that can be set by the user, and the like are stored. The control unit 8 controls the movement amount information of the transfer head 53 measured by the contact sensor unit 54 installed in the transfer head 53, that is, the distance from the first predetermined position to the reference substrate P (A). ), the distance B from the second predetermined position to the reference substrate Q is received. The storage unit 81 of the control unit 8 stores the received distance A and distance B. Further, the control unit 8 receives the information of the distances C to H from the non-contact sensors 71 to 73, and the storage unit 81 of the control unit 8 stores the received information of the distances C to H. remember The calculation unit 82 calculates the amount of movement of the transfer unit 5 according to the pick-up and arrangement by performing calculations on these distances A to H.

These distances (A to H) are each of the reference substrates P and Q, the supply substrate R, and the mounting substrate S, as well as any one of the contact surface 531 or the holding surface 61, respectively. It may be measured in position. In addition, with regard to the other half of the reference substrates P, Q, supply substrate R, and mounting substrate S, among the pick-up areas and mounting areas that can be assumed to have a plurality of supply substrates R and mounting substrates S, respectively, , may be measured in any region. Moreover, you may measure in a some area|region. If a more precise measurement result is required, at a plurality of locations of each distance, each of the reference substrates P, Q, the supply substrate R, and the mounting substrate S, the contact surface 531 or the holding surface 61, respectively. The measured values may be transmitted to the control unit 8, and an average of the values measured by the calculation unit 82 of the control unit 8 at the plurality of locations may be used as the distances A to H. For example, the distance F is determined by measuring distances F1 to F4 from elements T located at four corners among elements T of multiple rows and multiple columns in a predetermined pick-up area 32, and measuring the distances F1 to F4, respectively. =(F1+F2+F3+F4)/4 may be used. Calculation of the average value of each distance is performed by the calculation unit 82 of the control unit 8.

The determination unit 83 determines whether each measured value is appropriate (normal or not) for each distance A to H. For each measured value of the distance, a predetermined threshold is set, and based on this predetermined threshold, whether or not each measured value is appropriate is determined. When it is determined that it is not appropriate, the measurement is performed again or notified. Each threshold value is appropriately determined within a range required by a measured value to be determined. Also, each predetermined threshold value is stored in the storage unit 81.

For example, in the case of the distances A and B, a threshold value such as ±5% of a value calculated for each distance in design may be provided. The determination unit 83 determines that the measured distance is appropriate when it is within this threshold value range. Outside of this threshold range, the predetermined reference position is out of alignment, the contact sensor unit 54 is not normal, foreign matter adheres to the contact surface, or the reference substrates P and Q are not horizontally arranged. It can be judged as an abnormality, such as that the other side of the supply table 3 or the mounting table 4 is not horizontal.

For example, in the case of the distances C and F, a predetermined threshold value is set for the difference between the distance C and the distance F, and the determination unit 83 determines the distance C based on the threshold value. Alternatively, it may be determined that any one of the distances F is not an appropriate measurement. For example, the reference substrate P and the supply substrate R are not arranged horizontally, the irradiation position of the laser is shifted, the element T is insufficient, the element T is overturned, etc. It can be determined that the element T is not correctly positioned at the irradiation position (pickup position 21) or the like.

Also, similarly to the distances E and H, the difference between the distance E and the distance H can determine an abnormality such as the reference board Q or the mounting board S not being horizontally arranged. have.

For example, in the case of the distances D and G, a predetermined threshold value is set for the difference between the distance D and the distance G, and the determination unit 83 determines the distance D based on the threshold value. Alternatively, it may be determined that any one of the distances G is not an appropriate measurement. For example, an abnormality such as the transfer tool 6 not being properly attached can be judged.

In addition, when the distance F is obtained as an average of a plurality of distances F1 to F4, for example, the determination unit 83 calculates the distances F1 to F4 measured by the non-contact sensor 71 prior to the calculation. It is possible to determine whether the element group including the measured element T is suitable for mounting by determining whether or not the difference in ? exceeds a predetermined threshold value. The difference between the distances F1 to F4 is, for example, the difference between the maximum value and the minimum value among the distances F1 to F4 or the difference between the maximum value or minimum value among the distances F1 to F4 and the average value of the distances F1 to F4. Elements T arranged in an array (matrix) on the supply substrate R have variations in thickness, for example, due to errors in manufacturing, and there are cases in which they protrude beyond the permissible range or are recessed. . If the distance F is obtained with such an element T as a target of laser irradiation, an error may occur in the moving amount of the transfer unit 5 according to the pickup of the elements T in multiple rows or multiple columns, or the pickup may fail. . Therefore, a predetermined threshold value is set, and based on this predetermined threshold value, the determination unit 83 determines whether the element group including the element T to be laser irradiated is suitable for mounting. That is, when there is an element T that protrudes beyond the permissible range due to a manufacturing error or the like or is depressed thinly, the determination unit 83 determines that the element group including the element T is a transfer tool ( It is determined that it is inappropriate for pick-up by 6) and can be excluded from the pick-up target. That is, the element group can be excluded from the object to be mounted. In addition, this predetermined threshold value is memorize|stored in the storage part 81. In addition, it is preferable that the plurality of elements T for measuring the distances F1 to F4 be evenly dispersed rather than concentrated in a part of the element group (pickup area 32).

Here, in the case where a group of elements (pickup area 32) determined to be unsuitable is excluded from the pick-up target, the positional information of the pick-up area 32 is stored in the storage unit 81, and when the element T is transferred In this case, the pickup area 32 may be controlled to pass the pickup position 21 as it is.

The movement control unit 84 controls the movement of each component of the element mounting apparatus 1, that is, the supply table 3, the mounting table 4, and the transfer unit 5. This control is based on data and programs necessary for the operation of the system previously stored in the storage unit 81, calculation results of the calculation unit 82, judgment results of the determination unit 83, etc., but, for example, from an input device (not shown). It may be based on an input user's command.

[movement]

As described above, the transfer unit 5 picks up the device T from the supply board R, transfers it to the mounting board S, and arranges the device T on the mounting board S to mount the device.

First, the distance to be moved from the initial position for pickup to the supply substrate R and the distance to be moved to the mounting substrate S for placement are calculated. Pickup and placement of the elements T are performed based on the calculated respective distances.

(Calculation of the distance to be moved by the transfer unit)

4 is a flowchart showing an example of an operation for measuring each distance according to the present embodiment. As a premise for explaining this operation, it is assumed that the reference substrate P is disposed on the other side of the supply table 3 and the reference substrate Q is disposed on the other side of the mounting table 4 in advance. In addition, it is assumed that the transfer tool 6 is not installed in the transfer head 53 of the transfer unit 5 .

As shown in (a) of FIG. 5, first, the transfer unit 5 is moved to a first predetermined position X1 above the supply stand 3. Next, the transfer unit 5 is moved from the first predetermined position X1 toward the reference substrate P, and the contact of the transfer unit 5 with the other side of the reference substrate P is detected and stopped. Specifically, the contact surface 531 of the transfer head 53 provided in the transfer unit 5 is moved to the first predetermined position X1 by the linear motion mechanism 51, and the first predetermined position ( The contact surface 531 located at X1) is moved toward the other side of the reference substrate P. When the contact surface 531 contacts the other side of the reference substrate P, the contact sensor provided in the contact sensor unit 54 of the transfer head 53 detects the contact of the contact surface 531, and the transfer head 53 Stop. The encoder of the contact sensor unit 54 measures the movement amount from the first predetermined position X1 at this time, and the control unit 8 receives this movement amount information. The storage unit 81 of the control unit 8 stores this movement amount as the distance A (step S01). In other words, the distance A is the distance the transfer head 53 moves from the first predetermined position X1 to the other half of the reference substrate P.

As shown in (b) of FIG. 5, the distance B, which is the distance from the second predetermined position X2 to the other side of the reference board Q supported on the mounting table 4, is also the distance A is measured in the same way as First, the transfer unit 5 is moved to a second predetermined position X2 above the mount table 4 . Next, the transfer unit 5 is moved from the second predetermined position X2 toward the reference substrate Q, and the contact of the transfer unit 5 with the other side of the reference substrate Q is detected and stopped. Specifically, the contact surface 531 of the transfer head 53 provided in the transfer unit 5 is moved to the second predetermined position X2 by the linear motion mechanism 51, and the second predetermined position ( The contact surface 531 located at X2) is moved toward the other side of the reference substrate Q. When the contact surface 531 contacts the other side of the reference substrate Q, the contact sensor provided in the contact sensor unit 54 of the transfer head 53 detects the contact of the contact surface 531, and the transfer head 53 Stop. The encoder of the contact sensor unit 54 measures the movement amount from the second predetermined position X2 at this time, and the control unit 8 receives this movement amount information. The storage unit 81 of the control unit 8 stores this movement amount as the distance B (step S02). In other words, the distance B is the distance traveled by the transfer head 53 from the second predetermined position X2 to the other half of the reference substrate Q.

Subsequently, as shown in FIG. 6, using the non-contact sensors 71 and 72, from the non-contact sensor 71 to the other half of the reference substrate P, and from the non-contact sensor 72 to the other half of the reference substrate Q Measure the distance to The control unit 8 receives this measurement information from the non-contact sensors 71 and 72, and the storage unit 81 of the control unit 8 stores the respective distances as distances C and E (step S03). . Further, using the non-contact sensor 73, the distance from the non-contact sensor 73 to the contact surface 531 of the transfer head 53 is measured. Further, when measuring the distance to the contact surface 531, the contact surface 531 is positioned at a position facing the non-contact sensor 73 by the linear mechanism 51. The control unit 8 receives this measurement information from the non-contact sensor 73, and the storage unit 81 of the control unit 8 stores this distance as the distance D (step S04). In addition, since the non-contact sensors 71 and 72 are supported by the linear mechanism 51 of the transfer unit 5 via the lifting mechanism 52, the distance to the other half of the reference substrates P and Q described above is Measurement can be performed at preset height positions (third predetermined position and fourth predetermined position) that are set in advance. In the present embodiment, for example, the third predetermined position is the same height as the first predetermined position X1, and the fourth predetermined position is equal to the second predetermined position X2. They are positioned at the same height. In addition, the height position of the transfer head 53 when measuring the distance to the contact surface 531 with the non-contact sensor 73 can also be performed by setting the height position of the contact surface 531 to a preset height position. In this embodiment, it is set so that it may become the 1st predetermined position X1, for example.

When the measurement of the distances A to E is completed, the reference substrates P and Q are removed from the supply table 3 and the mounting table 4, and the supply substrate R and the mounting substrate S are carried in instead. do. Further, the transfer tool 6 is installed on the side of the contact surface 531 of the transfer head 53 (step S05).

Subsequently, as shown in FIG. 7, by using the non-contact sensors 71 and 72, the distance from the non-contact sensor 71 to the element T on the supply board R, and the distance from the non-contact sensor 72 to the mounting board Measure the distance to the other half of (S). In addition, when measuring the distance to the element T on the supply board R and the distance to the other half of the mounting board S, the non-contact sensors 71 and 72 are set to the pick-up position by the linear mechanism 51, respectively. (21), located at the mounting position (22). As described above, among the elements T on the supply substrate R, the element T to be laser irradiated by the non-contact sensor 71 is selected as set in the storage unit 81 of the control unit 8. do. For example, the element T located at the center of the elements T of multiple rows and multiple columns to be picked up becomes an object of laser irradiation by the non-contact sensor 71 . The control unit 8 receives this measurement information from the non-contact sensor 71, and the storage unit 81 of the control unit 8 stores this distance as the distance F (step S06). Further, the control unit 8 receives measurement information of the distance from the non-contact sensor 72 to the lower half of the mounting board S, and the storage unit 81 of the control unit 8 converts this distance to the distance H It is stored as (step S07). Here, the measurement of the distance to the element T on the supply substrate R and the distance to the other half of the mounting substrate S by the non-contact sensors 71 and 72 is the measurement of the above-mentioned reference substrates P and Q. Similar to the measurement of the distance to the other half, it can be done at a third predetermined position and a fourth predetermined position spaced in opposite directions from each half.

In step S06, for example, when the distance F is measured for a plurality of elements T within the predetermined pick-up area 32, the determination unit 83 of the control unit 8 determines a plurality of measured values. The difference between the maximum value and the minimum value of the distances F, or the difference between this maximum value or minimum value and the average value of the plurality of distances F may be compared with a predetermined threshold value stored in the storage unit 81. The determination unit 83 determines, when the difference in distance F exceeds a predetermined threshold value, elements T of multiple rows and multiple columns including the element T (an element group, that is, pickup area 32). In order to exclude from the pick-up target, the element group can be stored in the storage unit 81 as an inappropriate element group. In this case, the measurement of the distance F may be changed to an element group different from the element group described above. Then, the non-contact sensor 71 may measure the distance to the element T located in the changed element group and compare it with the threshold value again. In addition, if the difference in distance F exceeds the threshold value even after repeating the preset number of times, an abnormality may be notified and interrupted.

Further, the distance to the holding surface 61 of the transfer tool 6 is measured using the non-contact sensor 73 . In addition, when measuring the distance to the holding surface 61, the holding surface 61 is moving to the position facing the non-contact sensor 73 by the linear motion mechanism 51. The control part 8 receives this measurement information from the non-contact sensor 73, and the storage part 81 of the control part 8 memorizes this distance as distance G (step S08). Here, the measurement of the distance to the holding surface 61 by the non-contact sensor 73 is when the contact surface 531 of the transfer head 53 measures a preset height position, for example, the distance to the contact surface 531. It is set so that it becomes the same height position as

Finally, the calculation unit 82 of the control unit 8 calculates the amount of movement of the transfer unit 5 according to the pick-up and placement of the element T from the holding surface 61 of the transfer tool 6 to the supply substrate R. The distance L to the element T and the distance M from the holding surface 61 of the transfer tool 6 to the mounting substrate S are calculated. The distances L and M are calculated from the distances A to H stored in the storage unit 81 by the following equations (1) and (2), respectively (step S09).

(Equation 1)

L=A-(C-F)-(D-G)... (One)

(Formula 2)

M=B-(E-H)-(D-G)... (2)

As described above, the control unit 8 calculates the amount of movement of the transfer unit 5 according to the pick-up and arrangement of the element T based on the measurement data from each sensor.

Equation (1) subtracts the difference between the distances C and F measured by the non-contact sensor and the difference between distances D and G from the distance A measured by the contact sensor unit. In other words, the distance from the first predetermined position X1 at which the contact surface 531 of the transfer head 53 starts approaching movement in the vertical direction with respect to the other side of the supply table 3 to the reference substrate P As a reference, the distance from the other side of the reference substrate P to the surface of the element T on the supply substrate R is subtracted, and also the distance from the contact surface 531 to the holding surface 61 of the transfer tool 6 By subtracting , the distance L from the holding surface 61 of the transfer tool 6 to the element T on the supply substrate R is calculated. By using the distance A measured by the non-contact sensor based on the distance A measured by the contact sensor unit, the transfer unit 5 according to the pick-up of the element T without contacting the transfer tool 6 and the element T The movement amount of can be accurately calculated.

Equation (2) subtracts the difference between the distances E and H and the distances D and G measured by the non-contact sensor from the distance B measured by the contact sensor unit. In other words, the distance from the second predetermined position X2 at which the contact surface 531 of the transfer head 53 starts approaching movement in the vertical direction with respect to the other side of the mounting table 4 to the reference substrate Q is As a reference, by subtracting the distance from the other half of the reference substrate Q to the other half of the mounting substrate S, and also subtracting the distance from the contact surface 531 to the holding surface 61 of the transfer tool 6, the transfer The distance M from the holding surface 61 of the tool 6 to the mounting substrate S is calculated. By using the distance measured by the non-contact sensor based on the distance B measured by the contact sensor unit, the transfer unit 5 according to the arrangement of the elements T without contacting the transfer tool 6 and the mounting substrate S ) can be accurately calculated.

(Mounting of elements)

8 is a flowchart showing an example of an operation of the element mounting device according to the present embodiment. As a premise for explaining this operation, it is assumed that the supply substrate R is disposed on the other side of the supply table 3 and the mounting substrate S is disposed on the other side of the mounting table 4 in advance. In addition, it is assumed that the transfer tool 6 is installed in the transfer head 53 of the transfer unit 5 .

First, the supply table 3 is moved on a two-dimensional plane by the linear mechanism 31 and stopped so that the center of the predetermined pick-up area 32 is positioned at the pick-up position 21 . Further, the mounting base 4 is moved on a two-dimensional plane by the linear mechanism 41 and stopped so that the center of the predetermined mounting region 42 is positioned at the mounting position 22 (step S11).

Next, the conveying unit 5 is moved to the pick-up position 21, and elements T in a plurality of rows and columns in the pick-up area 32 are collectively picked up by the transfer tool 6. Specifically, the transfer unit 5 is moved to the pick-up position 21 by the linear motion mechanism 51, and then the transfer head 53 is removed from the first predetermined position X1 on the pick-up position 21. It is moved (lowered) only by the distance L calculated by the calculation part 82 by the lifting mechanism 52 (step S12). As a result, the holding surface 61 of the transfer tool 6 comes into contact with each element T, and the holding surface 61 of the transfer tool 6 adsorbs and holds each element T by negative pressure.

Then, in a state where the element group including the elements T in multiple rows and multiple columns is held by the holding surface 61, the transfer unit 5 is moved in a direction away from the supply table 3 by the lifting mechanism 52. , and is transferred to the mounting position 22 by the linear motion mechanism 51 (step S13).

Finally, the transfer tool 6 is moved (lowered) by the distance M calculated by the calculation unit 82 by the lifting mechanism 52 from the second predetermined position X2 on the mounting position 22. (Step S14). As a result, the element T held on the holding surface 61 of the transfer tool 6 is brought into contact with the mounting substrate S and placed in the mounting region 42 . Here, the distance M calculated by the above formula (2) does not consider the thickness of the element T held on the transfer tool 6. That is, it is not a value obtained by subtracting the thickness of the element T from the distance B. However, since the transfer tool 6 of this embodiment is formed of an elastic member, the thickness of the element T of about several tens of μm can be absorbed by its elastic deformation, and the element T is not damaged. there is nothing to do In addition, if it is necessary to consider the thickness of the element T, the thickness of the element T may be subtracted from the distance M.

In this way, the element mounting device 1 picks up, transfers, and places the element group including the elements T in multiple rows and multiple columns from the supply substrate R from the supply substrate R in steps S11 to S14, and placing them on the mounting substrate S. is repeated until there are no more rows or columns of elements T to be picked up from the supply substrate R.

[effect]

(1) The element mounting apparatus 1 of the present embodiment comprises a supply table 3 having a base plate on which a reference substrate P or a supply substrate R on which elements T are arranged in an array are supported; A mounting table 4 having a side surface on which a reference board Q or a mounting board S on which the elements T arranged in an array are disposed is supported, a supply table 3 and a mounting table 4 Between the supply table 3 from the first predetermined position X1 that moves in the lined up direction and is spaced apart in the opposite direction from the other side of the supply table 3, and in the opposite direction from the other side of the mounting table 4 A transfer head 53 that moves between the second predetermined position X2 spaced apart from the mounting table 4 and is installed on the transfer head 53, and the supply table 3 or the mounting table 4 ) by detecting contact with the reference substrates P and Q supported on the base, the distance from the first predetermined position X1 to the reference substrate P supported on the supply table 3 and the second predetermined position A contact sensor unit 54 for measuring the distance from the position X2 to the reference substrate Q supported by the mounting table 4 is provided.

In addition, the element mounting device 1 of the present embodiment is detachably attached to the transfer head 53 and picks up elements T in multiple rows and multiple columns from the supply substrate R supported on the supply table 3. And, from the transfer tool 6 for disposing the picked-up element T on the mounting substrate S, and the third predetermined position spaced apart in the opposite direction from the other side of the supply table 3, the supply table 3 A first non-contact sensor 71 for non-contactly measuring the distance to the reference substrate P supported on the supply table 3 and the distance to the element T on the supply substrate R supported on the supply table 3, and a mounting table ( Distance from the fourth predetermined position spaced apart in the opposite direction from the other side of 4) to the reference substrate Q supported on the mounting table 4 and to the mounting substrate S supported on the mounting table 4 The second non-contact sensor 72 for non-contact measuring the distance to the transfer head 53 installed between the supply table 3 and the mounting table 4 and facing each other and the transfer tool 6 facing each other. The third non-contact sensor 73, the contact sensor unit 54, the first non-contact sensor 71, the second non-contact sensor 72, and the third non-contact sensor 73 measure the distance of A control unit 8 for controlling the movement of the transfer head 53 based on the distance is provided.

In this way, in the element mounting apparatus 1 of the present embodiment, the contact sensor unit 54 measures the measurement values of the non-contact sensors 71 and 72 without directly bringing the transfer tool 6 into contact with the element T. Since it can be associated with one distance, there is no fear of damaging the transfer tool 6 or the element T by the stress generated at the time of contact. As a result, the element T can be more accurately mounted on the mounting substrate S, and damage to the transfer tool 6 or the element T can be avoided, so the yield can be improved.

(2) The distance to the element T to be picked up on the supply substrate R can be an average value of each distance to a plurality of predetermined elements T among the elements T in a plurality of rows and a plurality of columns. As a result, since the distance to the element T can be measured more accurately, the amount of movement of the transfer unit 5 based on the measured distance is also accurate, enabling reliable pick-up.

(3) The control unit 8 of the present embodiment compares the distances to a plurality of predetermined elements T measured by the first non-contact sensor 71, and determines whether the difference in distance exceeds a predetermined threshold value. , and the control unit 8 determines that the difference in distance exceeds a predetermined threshold value when the determination unit 83 determines that the difference in distance exceeds a predetermined threshold value. The supply table 3 and the transfer head 53 are controlled to pick up other elements T except for the elements T determined to be the same. Thereby, among the elements T on the supply substrate R, protruding elements due to manufacturing defects, for example, are not picked up, so pickup failure can be avoided and yield can be improved.

[Other Embodiments]

The present invention is not limited to the above embodiment, but also includes other embodiments shown below. Moreover, this invention also includes the form which combined all or any one of the said embodiment and the following other embodiment. In addition, various omissions, substitutions, and changes can be made to these embodiments without departing from the scope of the invention, and the modifications are also included in the present invention.

(1) In the above embodiment, after measurement of each distance by the non-contact sensors 71 to 73, mounting of the element T by the transfer unit 5 was performed, but the movement by the linear mechanism 51 is Some may be performed at the same time by utilizing the linkage between the movement of (5) and the movement of the non-contact sensors 71 and 72. In this case, the measurement timings of the distance F and the distance H are different from those of the above embodiment.

Without mounting the transfer tool 6 on the transfer head 53, the reference substrate P is placed on the supply table 3 and the reference substrate Q is placed on the mounting table 4. In that state, after measuring the distances A and B by the contact sensor unit 54, the distances C, D and E are measured by the non-contact sensors 71 to 73. Subsequently, the transfer tool 6 is mounted on the transfer head 53, the supply substrate R is placed on the supply table 3, and the mounting substrate S is placed on the mounting table 4. From that state, move to the mounting operation. Laser irradiation of the element T of the non-contact sensor 71 is performed during the movement of the transfer unit 5 to the pick-up position 21, and the distance F is measured. That is, the non-contact sensor 71 moves integrally with the transfer head 53 . Therefore, when the transfer head 53 moves to the pick-up position 21, the non-contact sensor 71 passes above the pick-up area 32 to be picked up this time located at the pick-up position 21. At this time, when the non-contact sensor 71 is positioned at a third predetermined position and moved, the distance F to the element T located on the moving trajectory of the non-contact sensor 71 can be measured. When the calculation unit 82 calculates the distance L, which is the amount of movement by the lifting mechanism 52, until the transfer head 53 reaches the pick-up position 21, the lifting mechanism 52 continues to transfer the transfer unit ( 5) can be moved to the element T on the supply substrate R.

Laser irradiation of the mounting substrate S of the non-contact sensor 72 is performed during the movement of the transfer unit 5 to the mounting position 22, and the distance H is measured. That is, the non-contact sensor 72 moves integrally with the transfer head 53 . Therefore, when the transfer head 53 moves to the mounting position 22, the non-contact sensor 72 passes through the mounting position 22 upward. At this time, when the non-contact sensor 72 is positioned at the fourth predetermined position and moved, the distance H to the mounting substrate S located on the movement trajectory of the non-contact sensor 72 can be measured.

(2) In the above embodiment, in calculating the amount of movement of the transfer unit 5 according to the arrangement of the elements T, the contact surface 531 of the transfer head 53 and the holding surface 61 of the transfer tool 6 Although the difference was used, the difference between the element T on the contact surface 531 of the transfer head 53 and the holding surface 61 of the transfer tool 6 may be used. In this case, the distance G is measured by the non-contact sensor 73 when the element T is transferred. That is, in the course of moving the transfer unit 5 (transfer tool 6) that has picked up the element T to the mounting position 22, the transfer tool 6 passes over the non-contact sensor 73. At that time, the contact surface 531 of the transfer head 53 is positioned at a predetermined height position, and the predetermined element T of the group of elements held in the transfer tool 6 is placed directly above the non-contact sensor 73. Stop it, or move it to pass directly above it. Then, the distance to the element T positioned directly above or the element T passing directly above is measured by the non-contact sensor 73 to obtain the distance G. At this time, the number of elements T to be measured may be one or plural. Element groups held by the transfer tool 6 are aligned along the moving direction by the linear motion mechanism 51 . Therefore, if measurement is performed by the non-contact sensor 73 while moving the transfer tool 6, the distance to a plurality of elements T passing right above the non-contact sensor 73 can be continuously measured. have. In the case where a plurality of elements T are to be measured, the average value of each measurement distance may be taken as the distance G.

In the above embodiment, the thickness of the element T is not considered in the distance M, but by using the difference between the element T on the contact surface 531 and the holding surface 61 of the transfer tool 6, the element A more accurate arrangement can be made considering the thickness of (T). As a result, even when the transfer tool 6 is a hard material that is difficult to elastically deform and it is difficult to absorb the thickness of the element T by elastic deformation, the element T can be disposed without being damaged.

In addition, the distance L is calculated using the difference between the contact surface 531 of the transfer head 53 and the holding surface 61 of the transfer tool 6, and the contact surface 531 of the transfer head 53 and the transfer tool 6 are calculated. The distance M may be calculated using the difference between the elements T on the holding surface 61 in (6). That is, based on the height position of the holding surface 61 of the transfer tool 6 in pickup and the height position of the lower surface of the element T held by the transfer tool 6 in placement, measurement in pickup and placement is performed. , each can be performed at a more accurate height position.

(3) For each predetermined area on the reference substrates P and Q, for example, for each area corresponding to the pickup area 32 or the mounting area 42, or for each predetermined area on the supply substrate R, for example, The distances A to C and E, F, and H may be individually obtained for each pick-up area 32 and for each predetermined area on the mounting substrate S, for example, for each mounting area 42 . In particular, the distance F may first be measured for all pick-up areas on the supply substrate R, and the area to be excluded may be determined by judgment by the determination unit 83.

(4) In the above embodiment, the first predetermined position (X1) and the second predetermined position (X2) are set to be the same height position, and the third predetermined position and the fourth predetermined position are also set at a different height. Although it was set as the same height position as the 1st predetermined position and the 2nd predetermined position X2, it is not limited to this, Each different height position may be sufficient. That is, each predetermined position may be a different height position or the same height position, as long as the predetermined position is not changed for each measurement of the distance.

(5) In the above embodiment, the distance was first measured in a state in which the reference substrates P and Q were disposed and in a state in which the transfer tool 6 was not mounted. However, the measurement of the distances A, B, C, and E may be performed only at the first time when the element mounting device 1 is operated, and is performed every time the supply substrate R and the mounting substrate S are exchanged according to the exchange. also good At this time, the measurement according to the substrate exchange may be performed only by the distances C and E. The distance D may be set for each replacement of the transfer tool 6 . In addition, it is preferable to measure the distance G every time the transfer tool 6 is exchanged. It is also preferable to calculate the distances L and M again when each distance is remeasured.

(6) In the above embodiment, the non-contact sensor 71 measures the distance at the pickup position 21 and the non-contact sensor 72 measures the distance at the mounting position 22, but the non-contact sensor ( 71) and the non-contact sensor 72 may be one sensor. One non-contact sensor 71 (72) may measure each distance of the pick-up position 21 and the mounting position 22 by moving integrally or separately with the transfer part 5.

(7) In the above embodiment, the non-contact sensors 71 and 72 are moved integrally with the conveying unit 5, but are not limited to this, and may be movable independently of the conveying part 5, or may be in a fixed arrangement. good night. For example, as shown in FIG. 9 , the non-contact sensor 71 may be fixedly placed on the pick-up position 21 . In addition, the non-contact sensor 72 can be fixedly placed on the mounting position 22 . In addition, either one can be fixedly arranged, and either can be mounted on the conveying part 5. It is only necessary to compare distance A and distance C by measurement of non-contact sensor 71 and compare distance B and distance D by measurement of non-contact sensor 72, and when measuring If only the height position of is determined, the attachment positions and members of the non-contact sensors 71 and 72 can be appropriately determined.

(8) In the above embodiment, the reference substrate P was used, but the other half of the supply table 3 may be used instead of the reference substrate P. Also, although the reference board Q was used, the other half of the mounting base 4 may be used instead of the reference board Q. By replacing the reference substrates P and Q in the above embodiment with the supply table 3 and the mounting table 4, respectively, the same implementation can be performed. In this case, it is possible to eliminate the need to install or exclude each of the reference substrates P and Q.

(9) In the above embodiment, the contact surface 531 of the transfer head 53 is used to measure the distances A and B, but the transfer tool 6 includes a hard member, and the reference substrate P, If you do not mind touching Q), you may use the transfer tool 6. Also in this case, the distances A and B can be measured as in the case of using the contact surface 531 . In addition, since the measured values of the non-contact sensors 71 and 72 can be associated with the distance measured by the contact sensor unit 54 without direct contact with the element T or the mounting substrate S, the There is no fear of damaging the element T by stress. As a result, since the element T can be more accurately mounted on the mounting substrate S and damage to the element T can be avoided, the yield can be improved.

In this case, it is not necessary to measure the distance D and the distance G, and the non-contact sensor 73 for that purpose can also be made unnecessary. Since the difference between the distance D and the distance G is included in the distances A and B, considering (D-G) in equations (1) and (2) as zero, the distance L , just calculate the distance (M). That is, it can be calculated as L=A-(C-F) and M=B-(E-H).

(10) In the above embodiment, suction adsorption has been described as the transfer tool 6, but the same can be applied to electrostatic adsorption, and the same effect can be obtained.

Also, an adhesive material can be used as the transfer tool 6 . When the element T is stocked on the supply substrate R, there are times when an adhesive material is used to maintain it. In this case, in order to pick up the element T with the transfer tool 6, a holding force greater than the sticking force of the stock is required. In the case of suction adsorption, a holding force higher than the atmospheric pressure cannot be obtained, and the necessary holding force may not be obtained. In addition, in the case of electrostatic adsorption, a large voltage can be applied to obtain an electrostatic force that provides a required holding power, but electrostatic destruction may occur depending on the element T.

In the adhesive material, it is possible to easily obtain the adhesive force that becomes the required holding force. In addition, it does not require a complicated structure or control for suction or electrostatic power generation. In addition, the adhesive material is soft and it is difficult to damage the element T. In this way, when an adhesive material is used as the transfer tool 6, the element T can be surely picked up from the supply substrate R with a simple configuration without damaging the element T.

However, when the adhesive material is attached to the transfer head 53 as the transfer tool 6, the height position cannot be measured by the contact method in that state. In order to measure the height position, if the adhesive material is brought into contact with the reference substrate, the element T, or the mounting substrate, the transfer tool 6 and the target are adhered in that state, and the measurement state cannot be canceled. Therefore, it is necessary to measure the height position without mounting the transfer tool 6 containing the adhesive material. Also in this case, the exact height position can be measured by performing the measurement in the above embodiment, and the same effect can be obtained.

1: element mounting device 21: pickup position
22: mounting position 3: supply stand
31: linear mechanism 32: pick-up area
4: mounting table 41: linear mechanism
42: mounting area 5: transfer part
51: linear mechanism 52: lifting mechanism
53: transfer head 531: contact surface
54: contact sensor unit 6: transfer tool
61: holding surface 62: holding part
71 to 73: non-contact sensor 8: control unit
81: storage unit 82: calculation unit
83: determination unit 84: movement control unit
A to H, L, M: distance P, Q: reference board
R: supply board S: mounting board
T: element X1: first predetermined position
X2: second predetermined position

Claims (4)

a supply table having a surface on which a reference substrate or a supply substrate on which elements are arranged in an array is supported;
a mounting table having a second surface on which a reference substrate or a mounting substrate on which elements arranged in an array are arranged is supported;
Moves in a direction in which the supply table and the mounting table are aligned, and is spaced from a first predetermined position spaced apart from the other half of the supply table in the opposite direction to the supply table, and from the other half of the mounting table in the opposite direction. a transfer head that moves from a second predetermined position to the mounting table;
The distance from the first predetermined position to the upper surface of the reference substrate supported on the supply table by detecting contact with the reference substrate installed on the transfer head and supported on the supply table or the mounting table; and a contact sensor unit for measuring a distance from the second predetermined position to an upper surface of the reference substrate supported by the mounting table;
a transfer tool detachably installed on the transfer head, picking up elements in a plurality of rows and columns from the supply substrate supported on the supply stand, and placing the picked-up elements on the mounting substrate;
A distance from a third predetermined position spaced apart in the opposite direction from the other side of the supply stand to an upper surface of the reference substrate supported on the supply table and a distance to an upper surface of an element on the supply substrate supported on the supply table. A first non-contact sensor for non-contact measurement;
A distance from a fourth predetermined position spaced apart in an opposite direction from the other side of the mounting table to an upper surface of the reference substrate supported on the mounting table and a distance to an upper surface of the mounting substrate supported on the mounting table without contact A second non-contact sensor for measuring with
It is installed between the supply table and the mounting table, and the distance to the contact surface facing the supply table and the mounting table of the transfer head facing each other and the holding face of the supply substrate and the mounting substrate of the transfer tool facing each other A third non-contact sensor for measuring the distance to the surface in a non-contact manner;
A movement amount of the transfer head is calculated based on the distances measured by the contact sensor unit, the first non-contact sensor, the second non-contact sensor, and the third non-contact sensor, and the movement of the transfer head is controlled by the calculated movement amount. control unit that controls
Including, element mounting device. The device mounting apparatus according to claim 1, wherein the distance to the upper surface of the element on the supply substrate is an average value of each distance to the upper surface of a plurality of predetermined elements among the elements in the plurality of rows and columns. The method of claim 2, wherein the control unit compares the distances to the upper surfaces of the plurality of predetermined elements measured by the first non-contact sensor, and the difference between the distances to the upper surfaces of the plurality of predetermined elements is a predetermined threshold. Further comprising a determination unit for determining whether the value exceeds the value,
When the determination unit determines that the difference in distance exceeds a predetermined threshold, the control unit selects elements from other element groups except for the element group including the element for which it is determined that the difference in distance exceeds a predetermined threshold. and controlling the supply table and the transfer head to pick up. The method according to any one of claims 1 to 3, wherein the distance from the first predetermined position measured by the contact sensor unit to the upper surface of the reference substrate supported by the supply table is A,
A distance from the second predetermined position measured by the contact sensor unit to the upper surface of the reference substrate supported by the mounting table B;
C the distance to the upper surface of the reference substrate supported on the supply table measured by the first non-contact sensor;
The distance from the transfer head measured by the third non-contact sensor to the contact surface facing the supply table and the mounting table is D;
The distance to the upper surface of the reference board supported on the mounting table measured by the second non-contact sensor is E,
The distance to the upper surface of the element on the supply substrate measured by the first non-contact sensor is F,
The distance to the holding surface facing the supply substrate and the mounting substrate of the transfer tool measured by the third non-contact sensor is G,
The distance to the upper surface of the mounting board measured by the second non-contact sensor is H
And a calculation unit for calculating the distances L and M by the following formulas (1) and (2) based on A to H;
Moving the transfer head from the first predetermined position toward the supply table based on the distance L, and moving the transfer head from the second predetermined position based on the distance M to the mounting. Movement controller that moves toward the table
Equation (1): L=A-(CF)-(DG)
Equation (2): M=B-(EH)-(DG)
Further comprising a, element mounting device.

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