KR101894349B1 - Light emitting device package and lighting system including the same - Google Patents

Light emitting device package and lighting system including the same Download PDF

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Publication number
KR101894349B1
KR101894349B1 KR1020110060540A KR20110060540A KR101894349B1 KR 101894349 B1 KR101894349 B1 KR 101894349B1 KR 1020110060540 A KR1020110060540 A KR 1020110060540A KR 20110060540 A KR20110060540 A KR 20110060540A KR 101894349 B1 KR101894349 B1 KR 101894349B1
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KR
South Korea
Prior art keywords
light emitting
emitting device
lens
groove
region
Prior art date
Application number
KR1020110060540A
Other languages
Korean (ko)
Other versions
KR20130000067A (en
Inventor
이호진
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020110060540A priority Critical patent/KR101894349B1/en
Priority to US13/412,820 priority patent/US8878215B2/en
Priority to JP2012051938A priority patent/JP2013008941A/en
Priority to TW101108092A priority patent/TWI546984B/en
Priority to EP12160221.3A priority patent/EP2538462B1/en
Priority to CN201210100153.4A priority patent/CN102842670B/en
Publication of KR20130000067A publication Critical patent/KR20130000067A/en
Priority to US14/505,362 priority patent/US9705054B2/en
Priority to JP2016224526A priority patent/JP6339161B2/en
Application granted granted Critical
Publication of KR101894349B1 publication Critical patent/KR101894349B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)

Abstract

An embodiment includes a body having a light emitting device mounted thereon; A first lead frame electrically connected to the light emitting element; And a lens on the body, wherein a sealing material is formed in an edge region of a surface where the body and the lens are coupled.

Description

TECHNICAL FIELD [0001] The present invention relates to a light emitting device package and a lighting system including the light emitting device package.

The embodiment relates to a light emitting device package, which improves the durability of the light emitting device package.

BACKGROUND ART Light emitting devices such as a light emitting diode (LED) or a laser diode (LD) using semiconductor materials of Group 3-5 or 2-6 group semiconductors have been developed with thin film growth technology and device materials, Green, blue, and ultraviolet rays. By using fluorescent materials or combining colors, it is possible to realize white light rays with high efficiency. Also, compared to conventional light sources such as fluorescent lamps and incandescent lamps, low power consumption, It has the advantages of response speed, safety, and environmental friendliness.

Therefore, the light emitting diode can be replaced with a transmission module of an optical communication means, a light emitting diode backlight replacing a cold cathode fluorescent lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, White LED lightings, automotive headlights and traffic lights.

In order to adjust the light directing angle of light emitted from the light emitting device package, a light path changing unit such as a lens may be disposed on the body.

The embodiment intends to improve the durability of the light emitting device package.

An embodiment includes a body having a light emitting device mounted thereon; A first lead frame electrically connected to the light emitting element; And a lens on the body, wherein a sealing material is formed in a peripheral region where the body and the lens are coupled.

The sealing material can be applied on the body.

The sealing material may comprise a primer composition.

Grooves may be formed on the body.

The grooves may be wider than the width above.

The groove may have a trapezoidal cross section in the vertical direction.

The groove may have a V-shaped cross section in the horizontal direction.

The groove may be in the form of a bottle having a vertical cross section.

The groove may be in the form of a bottle having a cross-sectional area of the upper portion smaller than that of the lower portion.

The primer composition may be coated on the grooves.

The edge of the lens can be inserted and fixed in the groove.

A dam may be formed on the body in the edge region.

The dam may be formed at least three locations adjacent to the edge of the lens.

The dam may be formed in a circumferential shape adjacent to the edge of the lens.

Another embodiment provides an illumination system comprising the light emitting device package described above.

In the light emitting device package according to the embodiment, penetration of moisture, oxygen, and the like from the outside can be prevented, and durability can be improved.

1 is a view illustrating an embodiment of a light emitting device package,
2 to 7 are views showing the 'A' portion of FIG. 1 in detail,
8 is a view showing another embodiment of the light emitting device package,
9 is an exploded perspective view of an embodiment of a lighting device including a light emitting device package according to embodiments,
FIG. 10 is a view illustrating a display device including a light emitting device package according to embodiments. Referring to FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

In the description of the embodiment according to the present invention, in the case of being described as being formed "on or under" of each element, the upper (upper) or lower (lower) or under are all such that two elements are in direct contact with each other or one or more other elements are indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

1 is a view showing an embodiment of a light emitting device package.

The light emitting device package 200 according to the embodiment includes a body 210, a first lead frame 221 and a second lead frame 222 mounted on the body 210, A light emitting device 100 according to an embodiment in which the light emitting device 100 is electrically connected to the first lead frame 221 and the second lead frame 222, (250).

The body 210 may be formed of a silicon material, a synthetic resin material, or a metal material. When the body 210 is made of a conductive material such as a metal material, an insulating layer is coated on the surface of the body 210 to prevent a short circuit between the first and second lead frames 221 and 222 can do.

The first lead frame 221 and the second lead frame 222 are electrically separated from each other and supply current to the light emitting device 100. The first lead frame 221 and the second lead frame 222 may increase the light efficiency by reflecting the light generated from the light emitting device 100, To the outside.

The light emitting device 100 may be a horizontal light emitting device, a vertical light emitting device, or a flip type light emitting device. The light emitting device 100 may be mounted on the body 210, or may be mounted on the first lead frame 221 or the second lead frame 222 As shown in FIG. The first lead frame 221 and the light emitting device 100 are electrically connected through the conductive adhesive layer 110 and the second lead frame 122 and the light emitting device 100 are electrically connected to the wire 240 Respectively. The light emitting device 100 may be connected to the lead frames 221 and 222 by a flip chip method or a die bonding method in addition to the wire bonding method.

The molding part 250 may surround and protect the light emitting device 100. In addition, the molding part 250 may include a phosphor 260 to change the wavelength of light emitted from the light emitting device 100. The molding part 250 may be formed to cover at least the light emitting device 100 and the wire 240.

The light of the first wavelength range emitted from the light emitting device 100 is excited by the phosphor 260 to be converted into light of the second wavelength range and the light of the second wavelength range is transmitted through the lens 270 The light path can be changed while passing through the light path changing unit of the light path changing unit.

The lens 270 may be emitted from the light emitting device 100 to convert the optical path through the refraction of the wavelength-converted light in the phosphor. In particular, when the light emitting device package is used in the backlight unit, have.

The lens 270 is made of a material having a high light transmittance. For example, the lens 270 may be made of polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene (PE), or resin injection molding.

The lens 270 may be fixed to the upper surface of the body 210, and may be fixed to the body 210 with an adhesive or the like. At this time, a gap may be generated due to a difference in material properties at the interface between the body 210 and the lens 270, and moisture, oxygen, or the like may penetrate into the light emitting device package through the gap.

Therefore, the lens 270 and the body 210 are sealed in the edge region indicated by 'A' in the surface where the body 210 and the lens 270 are coupled, so that foreign substances such as moisture and oxygen do not penetrate from the outside Should be avoided.

FIGS. 2 to 7 are views showing the 'A' portion of FIG. 1 in detail. Hereinafter, the 'A' portion of FIG. 1 will be described in detail with reference to FIGS. 2 to 7. FIG.

2, a groove 281 is formed on the body 210 in a region where the lens 270 and the body 210 are coupled. It is sufficient that the groove 281 is inserted and fixed to a position where the lens 270 and the body 210 are coupled to each other.

In the structure shown in Fig. 3, the groove 282 is arranged so that the lower width W a is wider than the upper width W b . Particularly, in FIG. 3, the cross section of the groove 282 in the vertical direction has a trapezoidal shape.

3, since the edge of the lens 270 is inserted into the groove 282, the coupling between the edge of the lens 270 and the body 210 can be increased. In addition, since the coupling path between the edge of the lens 270 and the body 210 is long, the infiltration path of moisture, oxygen, or the like that can penetrate from the outside becomes long, Can be reduced.

4, the cross-sectional area of the lower portion 283a of the groove 282 may be larger than the upper portion 283b. Therefore, the penetration of the foreign material into the light emitting device package due to the increase of the coupling path .

The upper portion 282b of the groove 282 may have a smaller cross sectional area than the lower portion 282a.

When the lens 270 is made of an injection material such as resin or the like, the lens material can be cured with the lens material completely filled in the lower portion 283a of the groove 283 formed in the body 210 of FIG. And the groove 210 can be increased.

In the embodiment shown in FIG. 5A, a dam 284 is formed on the body 210 in an edge region where the lens 270 and the body 210 are coupled. The dam 284 can prevent moisture, oxygen, or the like from penetrating between the edge of the lens 270 and the body 210 from the outside.

5B, the dam 284 can fix the lens 270 when it is provided at three places on the edge of the lens 270, and when the lens 270 is fixed, a gap is formed between the lens 270 and the body 270 It is possible to prevent penetration of foreign substances.

The dam 284 may be disposed in a circumferential shape surrounding the lens 270, adjacent to the edge of the lens 270, as shown in FIG. 5C. At this time, the dam 284 can act as a blocking layer of external foreign matter in addition to fixing the lens 270.

6, a sealing material 290 is formed on the body 210 in a region where the groove 281 of the body 210 and the lens 270 are coupled. The groove 281 may increase the coupling path between the lens 270 and the body 210 and increase the coupling force between the lens 270 and the body 210. The sealant 290 may completely block the penetration of foreign substances .

The sealing material 290 may be formed not only in the groove 281 structure of FIG. 5 but also in the grooves 282, 283, 285 and the dam 284 shown in FIGS. 2 to 5A and 7. The sealing material 290 is made of a material capable of increasing the bonding force between the body 210 and the lens 270, and may include a primer composition in particular.

That is, the surface of the body 210 may be subjected to a primer treatment to form the sealing material 290. In the primer treatment, the base material 210 and the sealing material 290 ) Can be strengthened.

A polymer material such as acryl, ester or urethane may be used for primer treatment. The polymer material may be coated on the base material and coated to form the sealing material 290. At this time, the primer composition may be formed of a plurality of layers to increase the bonding force between the sealing material 290 and the body 210 and the lens 270.

8 is a view showing another embodiment of the light emitting device package.

The illustrated structure is the same as the light emitting device package shown in FIG. 1, except that the center of the upper surface of the lens 270 is recessed. This shape of the lens 270 is for adjusting the directing angle of the light emitting device package, and may be changed to another shape.

The light emitting device package 200 described above can improve the durability of the device by preventing penetration of moisture or oxygen from the outside in accordance with an increase in the bonding force between the body 210 and the lens 270 and an increase in bonding path and sealing with a primer composition or the like. It is possible to prevent the extension of the life of the light emitting device package and the deterioration of the color tone.

A plurality of light emitting device packages according to embodiments may be arranged on a substrate, and a light guide plate, a prism sheet, a diffusion sheet, and the like may be disposed on the light path of the light emitting device package. Such a light emitting device package, a substrate, and an optical member can function as a light unit. Still another embodiment may be implemented as a display device, an indicating device, a lighting system including the semiconductor light emitting device or the light emitting device package described in the above embodiments, for example, the lighting system may include a lamp, a streetlight .

Hereinafter, the illumination device and the backlight unit will be described as an embodiment of the illumination system in which the above-described light emitting device package is disposed.

9 is a view illustrating an embodiment of a lighting apparatus in which a light emitting device package is disposed.

The illumination device according to the embodiment includes a light source 600 for projecting light, a housing 400 in which the light source 600 is embedded, a heat dissipation unit 500 for emitting heat of the light source 600, And a holder 700 for coupling the heat dissipating unit 500 to the housing 400.

The housing 400 includes a socket coupling part 410 coupled to an electric socket and a body part 420 connected to the socket coupling part 410 and having a light source 600 embedded therein. The body 420 may have one air flow hole 430 formed therethrough.

A plurality of air flow openings 430 are provided on the body portion 420 of the housing 400. The air flow openings 430 may be formed of one air flow openings or a plurality of flow openings may be radially arranged Various other arrangements are also possible.

The light source 600 includes a plurality of the light emitting device packages 650 on a circuit board 610. Here, the circuit board 610 may be inserted into the opening of the housing 400, and may be made of a material having a high thermal conductivity to transmit heat to the heat dissipating unit 500, as described later.

A holder 700 is provided under the light source. The holder 700 may include a frame and another air flow hole. Although not shown, an optical member may be provided under the light source 100 to diffuse, scatter, or converge light projected from the light emitting device package 150 of the light source 100.

The above-described illumination device can improve the durability of the light emitting device package disposed therein, and thus can prolong the life of the illumination device and prevent color degradation.

10 is a view showing an embodiment of a display device in which a light emitting device package is disposed.

The display device 800 according to the present embodiment includes the light source modules 830 and 835, the reflection plate 820 on the bottom cover 820, the light source module 830 disposed on the front of the reflection plate 820, A first prism sheet 850 and a second prism sheet 860 disposed in front of the light guide plate 840 and a second prism sheet 860 disposed between the first prism sheet 850 and the second prism sheet 860. The light guiding plate 840 guides light emitted from the light- A panel 870 disposed in front of the panel 870 and a color filter 880 disposed in the front of the panel 870.

The light source module includes the light emitting device package 835 described above on the circuit board 830. [ Here, the circuit board 830 may be a PCB or the like, and the light emitting device package 835 is the same as that described with reference to FIG.

The bottom cover 810 may house the components in the display device 800. The reflection plate 820 may be formed as a separate component as shown in the drawing or may be formed on the rear surface of the light guide plate 840, It is also possible that the bottom cover 810 is coated with a material having a high reflectivity.

Here, the reflection plate 820 can be made of a material having a high reflectance and can be used in an ultra-thin shape, and polyethylene terephthalate (PET) can be used.

The light guide plate 840 scatters light emitted from the light emitting device package module so that the light is uniformly distributed over the entire screen area of the LCD. Accordingly, the light guide plate 830 is made of a material having a good refractive index and transmittance. The light guide plate 830 may be formed of polymethyl methacrylate (PMMA), polycarbonate (PC), or polyethylene (PE). An air guide system is also available in which the light guide plate is omitted and light is transmitted in a space above the reflective sheet 820.

The first prism sheet 850 is formed on one side of the support film with a transparent and elastic polymeric material, and the polymer may have a prism layer in which a plurality of steric structures are repeatedly formed. As shown in the drawings, the plurality of patterns may be repeatedly provided with a stripe pattern.

In the second prism sheet 860, the edges and the valleys on one surface of the support film may be perpendicular to the edges and the valleys on one surface of the support film in the first prism sheet 850. This is to disperse the light transmitted from the light source module and the reflection sheet evenly in all directions of the panel 870.

In the present embodiment, the first prism sheet 850 and the second prism sheet 860 form an optical sheet, which may be formed of other combinations, for example, a microlens array or a diffusion sheet and a microlens array Or a combination of one prism sheet and a microlens array, or the like.

A liquid crystal display (LCD) panel may be disposed on the panel 870. In addition to the liquid crystal display panel 860, other types of display devices requiring a light source may be provided.

In the panel 870, the liquid crystal is positioned between the glass bodies, and the polarizing plate is placed on both glass bodies to utilize the polarization of light. Here, the liquid crystal has an intermediate property between a liquid and a solid, and liquid crystals, which are organic molecules having fluidity like a liquid, are regularly arranged like crystals. The liquid crystal has a structure in which the molecular arrangement is changed by an external electric field And displays an image.

A liquid crystal display panel used in a display device is an active matrix type, and a transistor is used as a switch for controlling a voltage supplied to each pixel.

A color filter 880 is provided on the front surface of the panel 870 so that light projected from the panel 870 transmits only red, green, and blue light for each pixel.

The above-described display device can improve the durability of the light emitting device package disposed therein, so that it is possible to prolong the life of the display device and prevent color degradation.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100: light emitting element 110: conductive adhesive layer
200: light emitting device package 210: body
221, 222: first and second lead frames 240: wire
250: molding part 260: phosphor layer
270: lenses 281 to 283, 285:
284: Dam 290: Seal material
400: housing 500:
600: light source 700: holder
800: Display device 810: Bottom cover
820: reflector 830: circuit board module
840: light guide plate 850, 860: first and second prism sheets
870: Panel 880: Color filter

Claims (15)

Body;
An insulating layer provided on a surface of the body;
First and second lead frames provided on the body;
A light emitting element provided on the body and electrically connected to the first and second lead frames;
A molding part surrounding the light emitting device, the molding part including a phosphor; And
And a lens disposed on the body,
A groove is formed in an edge region of the upper surface of the body,
Wherein the groove comprises a first region and a second region, the cross-sectional area of the first region being smaller than the cross-sectional area of the second region, the first region being disposed on top of the second region, And a sealing material containing a polymer material is provided on a first area, a second area of the groove, and an upper surface of the body adjacent to the groove,
Wherein the first region includes a first sidewall and a second sidewall, the second region includes a bottom surface, a third sidewall and a fourth sidewall, the first and third sidewalls are disposed in the direction of the light emitting element, The second and fourth side walls are disposed in a direction opposite to the first and third side walls,
The lens completely fills the second area of the groove and the lens contacts the lower area of the second sidewall of the first area of the groove and exposes the surface of the groove in the upper area of the second sidewall
A light emitting device package. The method according to claim 1,
Wherein the polymer material is any one of acrylic, ester and urethane. 3. The method according to claim 1 or 2,
Wherein the sealing material comprises a primer composition. The method of claim 3,
Wherein the primer composition comprises a plurality of layers. delete 3. The method according to claim 1 or 2,
And a wire electrically connecting the light emitting element and the first lead frame, wherein the molding part covers the entire light emitting element and the wire, the upper surface of the molding part is lower than the upper surface of the body, Wherein the upper surface is parallel to the upper surface of the light emitting element, and the upper surface of the lens has a convex shape. delete delete delete delete delete delete delete delete delete
KR1020110060540A 2011-06-22 2011-06-22 Light emitting device package and lighting system including the same KR101894349B1 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
KR1020110060540A KR101894349B1 (en) 2011-06-22 2011-06-22 Light emitting device package and lighting system including the same
US13/412,820 US8878215B2 (en) 2011-06-22 2012-03-06 Light emitting device module
JP2012051938A JP2013008941A (en) 2011-06-22 2012-03-08 Light emitting device module
TW101108092A TWI546984B (en) 2011-06-22 2012-03-09 Light emitting device module
EP12160221.3A EP2538462B1 (en) 2011-06-22 2012-03-19 Light emitting device module
CN201210100153.4A CN102842670B (en) 2011-06-22 2012-04-06 Light emitting device module
US14/505,362 US9705054B2 (en) 2011-06-22 2014-10-02 Light emitting device module
JP2016224526A JP6339161B2 (en) 2011-06-22 2016-11-17 Light emitting device package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110060540A KR101894349B1 (en) 2011-06-22 2011-06-22 Light emitting device package and lighting system including the same

Publications (2)

Publication Number Publication Date
KR20130000067A KR20130000067A (en) 2013-01-02
KR101894349B1 true KR101894349B1 (en) 2018-09-04

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US20230418107A1 (en) * 2020-11-27 2023-12-28 Lg Electronics Inc. Display device

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Publication number Priority date Publication date Assignee Title
KR100964812B1 (en) * 2008-09-29 2010-06-22 주식회사 에피밸리 Semiconductor light emitting device package
KR101111985B1 (en) * 2009-02-17 2012-03-09 주식회사 루멘스 Light emitting device package
KR20110010355A (en) * 2009-07-24 2011-02-01 삼성전기주식회사 A substrate pakage and fabricating method of the same

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