KR101820694B1 - Light emitting device package and lighting system including the same - Google Patents

Abstract

An embodiment includes an insulating layer; A first lead frame and a second lead frame disposed on the insulating layer and electrically separated from each other; And a light emitting device electrically connected to the first lead frame and the second lead frame, wherein the second lead frame has a depression in a region where the light emitting device is disposed, and the light emitting device includes at least one open region, Package.

Description

TECHNICAL FIELD [0001] The present invention relates to a light emitting device package and a lighting system including the light emitting device package.

Embodiments relate to a light emitting device package and an illumination system including the same.

BACKGROUND ART Light emitting devices such as a light emitting diode (LED) or a laser diode (LD) using a semiconductor material of Group 3-5 or 2-6 group semiconductors have been developed with thin film growth technology and device materials, Green, blue, and ultraviolet rays. By using fluorescent materials or combining colors, it is possible to realize white light rays with high efficiency. Also, compared to conventional light sources such as fluorescent lamps and incandescent lamps, low power consumption, It has the advantages of response speed, safety, and environmental friendliness.

Therefore, a transmission module of the optical communication means, a light emitting diode backlight replacing a cold cathode fluorescent lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, a white light emitting element capable of replacing a fluorescent lamp or an incandescent lamp Diode lighting, automotive headlights, and traffic lights.

The light emitting element is mounted on the package body to form a light emitting element package. In the light emitting device package, a pair of lead frames are mounted on a package body such as a silicon or PPA resin, and a light emitting element is electrically connected to the lead frame.

The light emitting device package having such a structure is placed on the circuit board through the conductive pad. The light emitting device package is thick and heavy due to the package body, etc., and heat generated in the light emitting device is concentrated to the circuit board through the lead frame. There is a problem of deterioration.

Embodiments of the present invention provide a light emitting device package that is thin, light, and excellent in heat radiation characteristics.

An embodiment includes an insulating layer; A first lead frame and a second lead frame disposed on the insulating layer and electrically separated from each other; And a light emitting device electrically connected to the first lead frame and the second lead frame, wherein the second lead frame has a depression in a region where the light emitting device is disposed, and the light emitting device includes at least one open region, Package.

And a lens positioned on the light emitting element, wherein the lens can be formed wider than the depression.

The light emitting device package may further include a reflective layer disposed on at least one of the first lead frame and the second lead frame.

The insulating layer may be polyimide.

The light emitting device package may further include a heat dissipation layer for supporting the insulation layer.

The insulating layer may not be formed in a region corresponding to the depression.

The second leadframe includes a horizontal portion parallel to the insulating layer, a depression including an inclined portion and a bottom portion, and the inclined portion can connect the horizontal portion and the bottom portion.

The inclined portion may make an obtuse angle with the bottom portion or the horizontal portion.

And the distance from the contact between the inclined portion and the horizontal portion to the insulating layer may be greater than 45 micrometers.

The first lead frame and the second lead frame may have a thickness of 20 to 40 micrometers.

The insulating layer may have a thickness of 65 to 85 micrometers.

The light emitting device package may further include an adhesive layer connecting the insulating layer to the first lead frame and the second lead frame.

The first lead frame and the second lead frame may be disposed at a distance of 25 mu m to 35 mu m.

Another embodiment provides an illumination system comprising the light emitting device package described above.

In the light emitting device package according to the embodiment, the package body made of the package PPA resin or the like is omitted, the light emitting device package is thin and light in thickness, and the circuit board is arranged in the opposite direction to the heat emitting layer.

1 is a sectional view of an embodiment of a light emitting device package,
Fig. 2 is a view showing a part of the second lead frame of Fig. 1,
3 to 8 are views showing an embodiment of a method of manufacturing the light emitting device package of FIG. 1,
9 is an exploded perspective view of an embodiment of a lighting device including a light emitting device package according to embodiments,
10 and 11 are views showing a backlight including the light emitting device package according to the embodiments.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

In the description of the embodiment according to the present invention, in the case of being described as being formed "on or under" of each element, the upper (upper) or lower (lower) or under are all such that two elements are in direct contact with each other or one or more other elements are indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

1 is a cross-sectional view of one embodiment of a light emitting device package, and FIG. 2 is a view showing a portion of a second lead frame of FIG.

The light emitting device package according to the embodiment includes the first through fourth insulating layers 210a through 210d and the first through fourth adhesive layers 215a through 215d on the first through fourth insulating layers 210a through 210d And electrically connected to the first lead frame 220a and the second lead frames 220b and 225 and the first and second lead frames 220a and 220b electrically isolated from each other, A light emitting device 100 disposed opposite to the first to fourth insulating layers 210a to 210d with respect to the lead frames 220a and 220b and a lens 260 surrounding the light emitting device 100 .

The first and second lead frames 220a and 220b may be formed of a conductive material such as copper having a thickness of 20 to 40 micrometers and electrically separated from the first and second lead frames 220a and 220b Can be prevented. If the thicknesses of the first and second lead frames 220a and 220b are too thin, the first and second lead frames 220a and 220b may not be sufficient to support the light emitting device 100. If the first and second lead frames 220a and 220b are too thick,

The first lead frame 220a and the second lead frame 225 may be disposed apart from each other by a distance d of 25 to 35 micrometers.

Although the second lead frames 220b and 225 are shown as being separated from each other in FIG. 1, they are exposed in some regions. That is, FIG. 1 is a cross-sectional view of a region where the third insulating layer 210c is exposed, and therefore, the second lead frames 220b and 225 are divided into two portions. And the exposed region of the second lead frames 220b and 225 may be referred to as an open region.

Hereinafter, the second lead frame in the region where the light emitting device 100 is disposed will be referred to as '225' and will be described in detail with reference to FIG. 2. In the following description, the first lead frame 220a, Quot; 220b " of the second lead frame.

A light emitting device 100 is disposed on the second lead frame 225 and a depression is formed in the second lead frame 225 in a region where the light emitting device 100 is disposed. The depression includes an inclined portion 225b and a bottom portion 225c. The second lead frame 225 may be made of a conductive material since it is manufactured in the same process as the first lead frame 220a.

The second lead frame 225 includes a horizontal portion 225a, an inclined portion 225b, and a bottom portion 225c. The bottom part 225c is an area where the light emitting device 100 is disposed and the horizontal part 225a is disposed in parallel to the first to fourth insulating layers 210a to 210d and the inclined part 225b is a horizontal part 225a and the bottom portion 225c.

The depth h of the bottom portion 225c may be equal to the depth of the first to fourth insulating layers 210a to 210d and may be, for example, 65 to 86 micrometers.

The inclined portion (225b) a horizontal portion (225a) and the angle (θ ₂₎ and, the angle (θ ₁₎ that the inclined portion (225b) forms with the bottom portion (225c) may be an obtuse angle. When the horizontal portion 225a and the bottom portion 225c are horizontal, the angles? ₁ and? ₂ have the same size because they are angles.

The distance from the contact between the inclined portion 225b and the horizontal portion 225c to the insulating layer may be greater than 45 micrometers. If the distance w is too large, the size of the light emitting device package increases and the inclined portion 225b may be formed on the insulating layer 210b or 210c I can not.

The first to fourth insulation layers 210a to 210d are separated into at least two insulation layers, and the second lead frame 220b may be separated by a boundary region. In the region where the first to fourth insulation layers 210a to 210d are not formed, the bottom portion 225c is advantageous to reduce the thickness of the light emitting device package.

The first to fourth insulating layers 210a to 210d are formed integrally, and may be disposed separately as required. Although the first to fourth insulating layers 210a to 210d are illustrated as being separated from each other in the drawing, a part of the first insulating layer to the fourth insulating layer 210a to 210d may be patterned without being completely separated, The lead frame 220a, the second lead frame 220b, and the like may be exposed.

Since the first lead frame 220a and the second lead frame 220b are supported by the second insulating layer 210b in the region where the first lead frame 220a and the second lead frame 220b are separated, 2 insulating layer 210b is exposed, and the second adhesive layer 215b on the second insulating layer 210b may be exposed.

The first to fourth insulating layers 210a to 210d made of polyimide or the like may act as an adhesive layer and the first to fourth adhesive layers 215a to 215d may be separately formed.

The width of the second insulating layer 210b or the second adhesive layer 215b exposed between the first lead frame 210a and the second lead frame 225 is greater than the width of the second lead frame 225, Is equal to the width of the third insulating layer 210c or the third adhesive layer 215c.

If the insulating layer exposed between the first lead frame 210a and the second lead frame 225 and between the second lead frames 225 and 220b is exposed with the same width as described above, The amount of light absorbed by the insulating layer made of polyimide or the like is the same, so that the light distribution in the entire light emitting device package can be increased.

The first to fourth insulating layers 210a to 210d may be formed of an insulating material such as polyimide. The first to fourth insulating layers 210a to 210d may be formed of a material having a high thermal conductivity.

The first and second reflective layers 230a and 230b are formed on the first and second lead frames 220a and 220b and 225. The first and second reflective layers 230a and 230b are formed on the front surface of the light emitting device package So that the brightness can be increased.

Since the light emitted from the light emitting device 100 may be partially absorbed by the exposed polyimide, the luminance of the light emitting device package may be lowered. Therefore, if the exposure width of the polyimide is reduced, the luminance reduction described above can be reduced.

The first and second reflective layers 230a and 230b may be formed of a material having a high reflectivity. For example, silver (Ag) may be coated on the first and second reflective layers 230a and 230b. The light emitting device 100 is bonded to the second lead frame 220b through the adhesive layer 240. The adhesive layer 240 may be a conductive material or a non-conductive material. The light emitting device 100 is electrically connected to the first lead frame 220a and the second lead frame 220b through the first and second wires 250a and 250b.

The first and second wires 250a and 250b are illustrated as being in contact with the first and second reflective layers 230a and 230b but may be in direct contact with the first lead frame 220a and the second lead frame 220b have.

A lens 260 is disposed to surround the light emitting device 100 and the first and second wires 250a and 250b. Although not shown, a resin layer (not shown) may be formed around the light emitting device 100 and the first and second wires 250a and 250b, and the resin layer may include a phosphor to emit light from the light emitting device 100 The wavelength of the emitted light can be changed.

The lens 260 is made of a material having a high light transmittance. For example, the lens 260 may be made of polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene (PE), or resin injection molding.

The lens 260 may be arranged wider than the width of the depression 225c and may be wider than the second lead frame 225 to be wider than the first and second wires 250a and 250b.

Although not shown, the heat dissipation layer may be disposed below the first to fourth insulation layers 210a to 210d, and the heat dissipation layer may be made of a material having high thermal conductivity such as copper (Cu) or aluminum (Al) have. The heat generated from the light emitting device 100 may be discharged downward through the second lead frame 220b.

The first to fourth insulation layers 210a to 210d may be formed to have a thickness of 65 to 85 micrometers. If the thickness is too small, the first and second insulation layers 210a to 210d may not be sufficient for supporting the first and second lead frames 220a, 220b, If the thickness is too large, the thickness of the light emitting device package 200 may increase.

The circuit board can be disposed in the upper direction of the first and second lead frames 220a and 220b and the heat generated in the circuit board can be emitted upward in FIG. The heat can be released smoothly. Further, since the package body is omitted and the circuit board is disposed on the top of the lead frame, the thickness of the light emitting device package can be reduced.

3 to 8 are views showing an embodiment of a method of manufacturing the light emitting device package of FIG.

As shown in FIG. 3, the first to fourth insulating layers 210a to 210d may be formed by patterning the polyimide 210. The polyimide 210 may be punched and processed. The first to fourth insulating layers 210a to 210d may be disposed separately from each other, or may be punched in some areas and connected as a whole.

4, the lead frame material 220 is disposed on the first to fourth insulation layers 201a to 210d by laminating or the like.

The lead frame material 220 is patterned to separate the first and second lead frames 220a and 220b and expose a portion of the second lead frame 220b as shown in FIG. The etching and isolation processes can be performed.

As shown in FIG. 6, the center region of the second lead frame 220b is down-set to form a depression.

7, the first and second reflective layers 230a and 230b may be formed on the first and second lead frames 220a and 220b and the silver (Ag) may be formed by a method such as plating Can be used. As shown in FIG. 1, only a part of the second lead frame is patterned, but the second lead frame is divided into '220b' and '225'.

In FIG. 8, the lens fixing portions 280a and 280b are disposed in the edge regions of the first and second reflective layers 230a and 230b. Each of the lens fixing portions 280a and 280b may be a means for fixing the edge of the lens. If the lens fixing portions 280a and 280b are arranged in a circular shape, the lens fixing portions 280a and 280b may be integrally connected.

Although not shown, the light emitting device may be disposed on the second lead frame 220b, and the light emitting device may be wire-bonded to the first and second lead frames 220a and 220b. The light emitting device package shown in Fig. 1 is completed when the lens or the resin layer is surrounded by the light emitting element and the first and second wires. However, there is a difference in that the lens is fixed to the inner region of the lens fixing portions 280a and 280b.

A plurality of light emitting device packages according to the embodiments may be arranged, and a light guide plate, a prism sheet, a diffusion sheet, and the like may be disposed on the light path of the light emitting device package. The light emitting device package and the optical member can function as a light unit. Still another embodiment may be implemented as a display device, an indicating device, a lighting system including the semiconductor light emitting device or the light emitting device package described in the above embodiments, for example, the lighting system may include a lamp, a streetlight .

Hereinafter, the illumination device and the backlight unit will be described as an embodiment of the illumination system in which the above-described light emitting device package is disposed.

9 is an exploded perspective view of an embodiment of a lighting device including a light emitting device package according to embodiments.

The illumination device according to the embodiment includes a light source 600 for projecting light, a housing 400 in which the light source 600 is embedded, a heat dissipation unit 500 for emitting heat of the light source 600, And a holder 700 for coupling the heat dissipating unit 500 to the housing 400.

The housing 400 includes a socket coupling part 410 coupled to an electric socket and a body part 420 connected to the socket coupling part 410 and having a light source 600 embedded therein. The body 420 may have one air flow hole 430 formed therethrough.

A plurality of air flow openings 430 are provided on the body portion 420 of the housing 400. The air flow openings 430 may be formed of one air flow openings or a plurality of flow openings may be radially arranged Various other arrangements are also possible.

The light source 600 includes a plurality of the light emitting device packages 650 on a circuit board 610. Here, the circuit board 610 may have a shape that can be inserted into the opening of the housing 400, and the light emitting device package 650 has a thin thickness and excellent heat dissipation characteristics as described above.

A holder 700 is provided under the light source. The holder 700 may include a frame and another air flow hole. Although not shown, an optical member may be provided under the light source 100 to diffuse, scatter, or converge light projected from the light emitting device package 150 of the light source 100.

The above-described illumination device has excellent heat dissipation characteristics in the light emitting device package 650 provided therein and has a small volume occupied by the light emitting device package.

10 is a view illustrating a display device including a light emitting device package according to embodiments.

The display device 800 according to the embodiment includes a bottom cover 810, a reflector 820 disposed on the bottom cover 810, a light source module that emits light, An optical sheet including a light guide plate 840 for guiding light emitted from the light source modules 830 and 835 to the front of the display device and prism sheets 850 and 860 disposed in front of the light guide plate 840; An image signal output circuit 872 connected to the display panel 870 and supplying an image signal to the display panel 870; 880 < / RTI > Here, the bottom cover 810, the reflection plate 820, the light source modules 830 and 835, the light guide plate 840, and the optical sheet may form a backlight unit.

The light source module comprises a light emitting device package 835 on a substrate 830. Here, a PCB or the like may be used for the substrate 830, and the light emitting device package 835 has a thin thickness and excellent heat radiation characteristics as described above.

The bottom cover 810 can house components within the display device 800. [ Also, the reflection plate 820 may be formed as a separate component as shown in the drawing, or may be provided on the rear surface of the light guide plate 840 or on the front surface of the bottom cover 810 in a state of being coated with a highly reflective material .

Here, the reflection plate 820 can be made of a material having a high reflectance and can be used in an ultra-thin shape, and polyethylene terephthalate (PET) can be used.

The light guide plate 840 scatters the light emitted from the light source module so that the light is uniformly distributed over the entire screen area of the LCD. Therefore, the light guide plate 840 is made of a material having a good refractive index and transmittance, and is made of a material having good light transmittance. For example, the light guide plate 840 may be formed of a material such as polymethyl methacrylate (PMMA), polycarbonate (PC) PolyEthylene (PE) or resin injection molding. Also, an air guide system in which the light guide plate 840 is omitted and light is transmitted by the air on the reflection plate 820 is also possible.

The first prism sheet 850 may be formed of a light-transmissive and elastic polymeric material on one side of the support film, and the polymer may have a prism layer in which a plurality of three-dimensional structures are repeatedly formed. Here, as shown in the drawings, the plurality of patterns may be provided with a floor and a valley repeatedly as stripes.

In the second prism sheet 860, the direction of the floor and the valley on one side of the supporting film may be perpendicular to the direction of the floor and the valley on one side of the supporting film in the first prism sheet 850. This is for evenly distributing the light transmitted from the light source module and the reflective sheet to the front surface of the display panel 870.

Although not shown, a protective sheet may be provided on each prism sheet, and a protective layer including light diffusing particles and a binder may be provided on both sides of the support film. The prism layer may also be made of a polymer material selected from the group consisting of polyurethane, styrene butadiene copolymer, polyacrylate, polymethacrylate, polymethyl methacrylate, polyethylene terephthalate elastomer, polyisoprene, have.

Although not shown, a diffusion sheet may be disposed between the light guide plate 840 and the first prism sheet 850. The diffusion sheet may be made of polyester and polycarbonate-based materials, and the light incidence angle can be maximized by refracting and scattering light incident from the backlight unit. The diffusion sheet includes a support layer including a light diffusing agent, a first layer formed on the light exit surface (first prism sheet direction) and a light incidence surface (in the direction of the reflection sheet) . ≪ / RTI >

In an embodiment, the diffusion sheet, the first prism sheet 850 and the second prism sheet 860 form an optical sheet, which may be made of other combinations, for example a microlens array, Or a combination of one prism sheet and a microlens array, or the like.

The display panel 870 may include a liquid crystal display (LCD) panel, and may include other types of display devices that require a light source in addition to the liquid crystal display panel 860. In the display panel 870, a liquid crystal is positioned between glass bodies, and a polarizing plate is placed on both glass bodies to utilize the polarization of light. Here, the liquid crystal has an intermediate property between a liquid and a solid, and liquid crystals, which are organic molecules having fluidity like a liquid, are regularly arranged like crystals. The liquid crystal has a structure in which the molecular arrangement is changed by an external electric field And displays an image.

A liquid crystal display panel used in a display device is an active matrix type, and a transistor is used as a switch for controlling a voltage supplied to each pixel. A color filter 880 is provided on the front surface of the display panel 870 so that only red, green, and blue light is transmitted for each pixel of the light projected from the display panel 870, thereby displaying an image.

11 shows a direct-type backlight unit.

In the direct-type backlight unit, a reflection plate 820 is disposed on a bottom cover (not shown), and a light emitting device package 830 is disposed on a reflection plate 820. Light emitted from the light emitting device package 830 travels to the first and second prism sheets 850 and 860 through the diffusion plate 843 and the diffusion sheet 846. The light having passed through the first and second prism sheets 850 and 860 is transmitted to the front of the display device 800 through the panel 870. Since the light emitted from the light emitting device package 830 is directly transmitted to the diffusion plate 843 or the like, the light guide plate may be omitted.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100: light emitting element 210: polyimide
210a to 210d: first to fourth insulating layers 215a to 215d: first to fourth adhesive layers
220: conductive layer material 220a: first lead frame
220b, 225: second lead frame 230a-230b: first and second reflective layers
240: adhesive layer 250a, 250b: first and second wires
260: lens 270: heat dissipating layer
300a to 300c: mask 400: housing
500: heat dissipating unit 600: light source
700: Holder 800: Display device
810: bottom cover 820: reflector
830: circuit board module 840: light guide plate
843: diffusion plate 846: diffusion sheet
850, 860: first and second prism sheets 870:
880: Color filter

Claims (14)

Insulating layer;
A first lead frame and a second lead frame disposed on the insulating layer and electrically separated from each other; And
And a light emitting element electrically connected to the first lead frame and the second lead frame,
The second lead frame has a first lead-
A depression formed in a region where the light emitting device is disposed; And
And at least one first open region for exposing a portion of the insulating layer,
A second open region is formed between the first lead frame and the second lead frame to expose the other portion of the insulating layer,
Wherein widths of the first and second open regions are equal to each other,
Wherein the insulating layer is disposed on a side surface of the light emitting element,
Wherein the insulating layer is polyimide. The method according to claim 1,
A lens positioned on the light emitting element;
A heat dissipation layer for supporting the insulation layer;
An adhesive layer connecting the insulating layer to the first lead frame and the second lead frame; And
Further comprising a reflective layer disposed on at least one of the first lead frame and the second lead frame,
The lens is formed wider than the depression,
The second lead frame includes a depression including a horizontal portion and an inclined portion and a bottom portion parallel to the insulating layer,
Wherein the inclined portion connects the horizontal portion and the bottom portion and forms an obtuse angle with the bottom portion or the horizontal portion,
Wherein a distance from the contact between the inclined portion and the horizontal portion to the insulating layer is greater than 45 micrometers. delete delete delete delete delete delete delete The method according to claim 1,
Wherein the first lead frame and the second lead frame have a thickness of 20 to 40 micrometers,
The insulating layer has a thickness of 65 to 85 micrometers,
Wherein the first lead frame and the second lead frame are disposed at a distance of 25 micrometers to 35 micrometers,
Wherein the insulating layer is not formed in a region corresponding to the depression. delete delete delete An illumination system comprising the light emitting device package according to any one of claims 1, 2 and 10.

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